Synthetic Resin Patents (Class 428/626)
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Patent number: 6783866Abstract: The invention relates to polymer ceramic composite materials with a virtually zero shrinkage compared to the original model after concluding partial pyrolysis and with a comparable thermal expansion behavior (preferably in an application range of 400° C. or less) to metal construction materials, in particular gray cast iron or steel, which are obtainable by methods described below; corresponding composite constructions and molded parts; and methods for producing and using these materials, composite constructions and molded parts. The polymer ceramic composite materials can for instance be used instead of or in contact with steel or gray cast iron temperature-proof molded parts, predominantly in mechanical engineering, without postmachining after the creative forming.Type: GrantFiled: July 5, 2002Date of Patent: August 31, 2004Assignee: Rauschert GmbHInventors: Peter Greil, Andreas Basteck, Steffen Walter
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Publication number: 20040161593Abstract: The present invention relates to a double-sided copper-clad laminate for forming a capacitor layer, formed by adhering electrodeposited copper foils on the both sides of a dielectric layer of a thickness of 10 &mgr;m or less, and the object of the present invention is to secure good voltage resistant proprieties.Type: ApplicationFiled: February 17, 2004Publication date: August 19, 2004Inventors: Kazuhiro Yamazaki, Takashi Syoujiguchi
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Patent number: 6777108Abstract: To control peel strength at an organic release interface between a carrier foil and a copper-microparticle layer which constitute an electrodeposited copper foil with carrier. In the present invention, (1) a barrier copper layer is formed on the release interface layer and copper microparticles are formed on the barrier layer; (2) the anti-corrosion treatment is carried out by use of a plating bath containing a single metallic component or a plurality of metallic components for forming an alloy, the plating bath(s) having a deposition potential less negative than −900 mV (vs. AgCl/Ag reference electrode); and (3) methods (1) and (2) are combined.Type: GrantFiled: May 18, 2001Date of Patent: August 17, 2004Assignee: Mitsui Mining & Smelting Co., Ltd.Inventors: Shin-ichi Obata, Makoto Dobashi
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Patent number: 6770381Abstract: A sliding bearing for an internal combustion engine including a copper-based bearing alloy including silver and tin upon which an overlay is applied. The overlay comprises resin and MoS2, and the adherence of the overlay to the alloy is enhanced by a roughened alloy surface formed of grooves extending in the sliding direction.Type: GrantFiled: November 9, 1999Date of Patent: August 3, 2004Assignee: Taiho Kogyo Co., Ltd.Inventors: Hiroshi Kanayama, Shinya Kawakami, Takashi Tomikawa, Soji Kamiya
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Patent number: 6770376Abstract: An article is coated with a multi-layer coating having the appearance of nickel. The coating comprises a polymeric layer on the surface of said article and vapor deposited on the polymeric layer a refractory metal nitride or refractory metal alloy nitride where the nitrogen content of said nitride is from about 6 to about 45 atomic percent.Type: GrantFiled: December 21, 2000Date of Patent: August 3, 2004Assignee: Vapor Technologies, Inc.Inventor: Guocun Chen
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Patent number: 6770380Abstract: A laminate for use in production of printed circuit boards comprising a metal layer having a first side and a second side; a metallic substrate, one side of the metallic substrate being attached to the first side of the metal foil; an adhesive substrate formed of a polymeric material having a first surface and a second surface, the first surface being attached to the second side of the copper foil, the adhesive substrate being at least partially uncured; and a releasable protective film along the second surface of the adhesive substrate.Type: GrantFiled: August 11, 1998Date of Patent: August 3, 2004Assignee: Nikko Materials USA, Inc.Inventors: R. Richard Steiner, Shiuh-Kao Chiang
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Publication number: 20040146767Abstract: A separator for fuel cells which has a gold covering layer on the surface of a metal plate and is formed by plastic working, wherein the relationship (R+D)/R≦=1.025 (50 &mgr;m≦R≦1000 &mgr;m) is satisfied assuming the minimum bending radius R at a plastic worked portion is R (&mgr;m), and the thickness of the gold covering layer is D (&mgr;m). According to the separator for fuel cells, exfoliation or cracking is prevented in the gold covering layer after plastic working, whereby corrosion resistance and durability can be remarkably improved.Type: ApplicationFiled: November 7, 2003Publication date: July 29, 2004Inventors: Teruyuki Ohtani, Makoto Tsuji, Masao Utsunomiya
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Publication number: 20040137239Abstract: The disclosure relates to a process for applying a multilayer protective coating to a substrate having an electrically conductive surface, comprising: (a) a first method of forming a silicate layer upon said electrically conductive surface, said first method comprising contacting at least a portion of said surface with a first medium comprising at least one silicate and having a basic pH and wherein said first medium is substantially free of chromates, to form a silicate layer, and (b) a second method of electrolytically applying a synthetic resin layer upon the surface of said silicate layer, said second method comprising contacting at least a portion of said surface of said silicate layer with a second medium comprising a resinous ingredient, applying an electric current to said second medium wherein said surface is employed as an electrode, to form a synthetic resin layer. The multilayer protective coating exhibits excellent corrosion and adhesion properties and is environmentally acceptable.Type: ApplicationFiled: November 14, 2003Publication date: July 15, 2004Inventors: Klaus-Peter Klos, Holger Manfred Grolmes
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Patent number: 6762223Abstract: The present invention relates to printing plate coating compositions comprising: (a) a carbon pigment dispersible in water; (b) at least one polymer comprising at least one ionomeric polymer subunit; and (c) at least one high molecular weight thickening agent which shows pseudoplastic behavior. The printing plate precursor of this invention is prepared by coating a printing plate substrate with the coating composition.Type: GrantFiled: October 31, 2001Date of Patent: July 13, 2004Assignee: Kodak Polychrome Graphics LLCInventors: Paul R. West, Nicki R. Miller, Jeffrey W. Leon
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Publication number: 20040128824Abstract: A resin fixture that is inserted into a stator for an electric motor for a pump for the purpose of insulating the stator with resin. The resin fixture includes a rubber cover that is inflated. The fixture thereby prevents the stator bore from filling with resin.Type: ApplicationFiled: January 7, 2003Publication date: July 8, 2004Applicant: William Franklin Hackett, Jr.Inventor: William F. Hackett
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Patent number: 6759140Abstract: An injection-molded plastic part having a first thermoplastic component and a second thermoplastic component. Areas consisting of the first thermoplastic component are present at least on one surface of the injection-molded plastic part next to areas of the second thermoplastic component. The first thermoplastic component is an LCP and the second thermoplastic component is a syndiotactic polystyrene.Type: GrantFiled: October 1, 2001Date of Patent: July 6, 2004Assignee: W. C. Heraeus GmbH & Co. KGInventors: Hans-Heiner Bittrich, Stefan Claus, Frank Krüger, Jan Wahode, Volker Zippmann
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Publication number: 20040126611Abstract: The invention relates to method for applying a sealing coating on a metal wire and to a metal wire coated with a sealing coating. The sealing coating is giving the metal wire an improved corrosion resistance. The sealing coating may further comprise one or more coloring pigments.Type: ApplicationFiled: October 9, 2003Publication date: July 1, 2004Inventors: Danny Gonnissen, Nico Fourneau
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Patent number: 6753094Abstract: The invention relates to a composite sheet material for brazing, the composite sheet material having a structure comprising an aluminium or aluminium alloy substrate on at least one side coupled to a layer comprising a polyolefin/acrylic acid copolymer as a carrier filled with brazing flux material, and optionally also with a metal powder, in an amount sufficient to achieve brazing. The invention further relates to a method of manufacturing composite sheet material for brazing, which method comprises the steps (a) mixing the polyolefin/acrylic acid copolymer with the brazing flux material and/or metal powder, and (b) applying to at least one surface of the metal substrate a mixture of said copolymer filled with the brazing flux material and/or metal powder, in an amount sufficient to achieve subsequent brazing.Type: GrantFiled: January 24, 2002Date of Patent: June 22, 2004Assignee: Corus Aluminium Walzprodukte GmbHInventor: Adrianus Jacobus Wittebrood
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Publication number: 20040115465Abstract: The invention relates to a composite material comprising a metallic support layer a porous carrier layer applied thereto and a PTFE based slide layer that is used as the sliding surface for a sliding partner. The sliding surface material forming the sliding surface also fills out the pores of the carrier layer and comprises at least 60% PTFE by volume and 10-25% zinc sulfide by volume. The sliding surface material further comprises 2-7% PFA by volume and 3-7% PPSO2 volume.Type: ApplicationFiled: October 14, 2003Publication date: June 17, 2004Inventors: Wolfgang Bickle, Werner Schubert, Thomas Storch
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Publication number: 20040110024Abstract: An electro-conductive metal plated polyimide substrate is composed of an aromatic polyimide substrate, a subbing metal layer of Mo—Ni alloy (in which a weight ratio of Mo to Ni is 75/25 to 99/1, and a plated electro-conductive film.Type: ApplicationFiled: November 19, 2003Publication date: June 10, 2004Applicant: Ube Industries, Ltd.Inventors: Shozo Katsuki, Hidenori Mii
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Publication number: 20040106001Abstract: A thin film hydrogen getter and EMI shielding are provided for protecting GaAs circuitry sealed in an hermetic package. The thin film getter comprises a multilayer metal film that is deposited by vacuum evaporation techniques onto a conductive metal, such as aluminum or copper, that serves as the EMI shielding. The conductive layer is first formed on an interior surface. The multilayer hydrogen getter film comprises (1) a titanium film and (2) a palladium film that is deposited on the titanium film. Both the titanium and the palladium are deposited during the same coating process run, thereby preventing the titanium from being oxidized. The palladium continues to prevent the titanium from being oxidized once the getter is exposed to the atmosphere. However, hydrogen is easily able to diffuse through the palladium into the titanium where it is chemically bound up, since palladium is highly permeable to hydrogen.Type: ApplicationFiled: November 25, 2003Publication date: June 3, 2004Inventors: Alan L. Kovacs, Matthew H. Peter, Kurt S. Ketola, Jacques F. Linder
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Publication number: 20040101709Abstract: An article is coated with a multi-layer coating having a bronze color. The coating comprises a polymeric basecoat layer, and a color and protective stack layer comprised of layers of carbon-rich refractory metal or refractory metal alloy carbonitride alternating with layers of nitrogen-rich refractory metal or refractory metal alloy carbonitride.Type: ApplicationFiled: November 27, 2002Publication date: May 27, 2004Inventor: Guocun Chen
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Patent number: 6740425Abstract: A method for forming copper-resin composite materials is disclosed. This method affixes a palladium or palladium-tin catalyst onto resin substrate, and then subjects the catalyst-containing resin to an electroless copper plating bath without performing a catalyst acceleration treatment step.Type: GrantFiled: August 21, 2002Date of Patent: May 25, 2004Assignee: Shipley Company, L.L.C.Inventors: Masaru Seita, Hideki Tsuchida, Masaaki Imanari, Yoshihiro Sugita
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Patent number: 6737174Abstract: The present invention discloses a sucker rod with high resistance to corrosion, to be used preferably in oil wells. Said sucker rod comprises a core of carbon steel, whether alloyed or not, whose surface is coated by a copper base alloy. Said alloy comprises a 50 to 99.9% copper rate. A process for manufacturing said sucker rod is included.Type: GrantFiled: November 10, 1999Date of Patent: May 18, 2004Assignees: YPF S.A., Siderca S.A.I.C.Inventors: Gustavo Luis Bianchi, Lelio Alberto Gawantka Da Silva
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Publication number: 20040091735Abstract: The invention relates to an evaporator plate for a refrigerating machine, comprising coolant channels which are arranged between two sheet metal pieces, one placed on top of the other, as well as a method for producing evaporator plates. In order to be able to produce such evaporator plates in large numbers with few rejects and with a reduction in energy required when compared to conventional production methods, it is proposed according to the invention that the sheet metal pieces which constitute the evaporator plate not be joined by means of a soldering process or a hot-rolling process (pressure welding) as has been the case up to now, but instead, that they be joined by means of an adhesive.Type: ApplicationFiled: December 10, 2003Publication date: May 13, 2004Inventor: Frieder Flamm
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Patent number: 6733886Abstract: A laminate is made by adhering at least one metal layer selected from the group consisting of copper and a copper alloy to a resin layer. A coating film of an azole-copper complex compound formed by a contact with an aqueous solution containing an azole compound in an range from 0.1 mass % to 15 mass % and an organic acid in a range from 1 mass % to 80 mass % is formed on the metal layer surface, and the metal layer adheres to the resin layer via the coating film of the azole-copper complex compound. Thereby, the present invention provides a laminate with improved adhesion between a surface of copper or a copper alloy and resin in a multilayered printed circuit board, and also a method of manufacturing the laminate.Type: GrantFiled: April 23, 2002Date of Patent: May 11, 2004Assignee: MEC Company Ltd.Inventors: Mutsuyuki Kawaguchi, Jun Hisada, Toshiko Nakagawa
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Publication number: 20040086741Abstract: The present invention provides a method of temporarily adhering a stack of sheets together to facilitate drilling a hole through the stack of sheets. The method includes using a temporary adhesive that prevents burring while drilling a hole through the stack.Type: ApplicationFiled: October 23, 2003Publication date: May 6, 2004Inventors: Robert M. Japp, Gregory A. Kevern, Francis S. Poch
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Publication number: 20040072011Abstract: An electroless brass plating method for applying an uniform and thick metallic layer on metallic, ceramic or plastic pieces, which does not depend on the piece geometry nor on its electric characteristics and by which global costs are reduced approximately 50% thanks to the use of a zinc compound as source of zinc atoms, which is less expensive than zinc cyanide.Type: ApplicationFiled: October 10, 2002Publication date: April 15, 2004Applicant: Centro de Investigaciq Materiales Avanzados, S.C.Inventors: Carlos Dominguez-Rios, Alfredo Aguilar-Elguezabal, Myriam Moreno-Lopez, Silvia Miranda-Navarro
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Patent number: 6720078Abstract: The present invention aims at provision of an organic composite galvanized steel sheet having its characteristics such as corrosion resistance and workability improved. Thus, the present invention provides an organic composite galvanized steel sheet that is formed by sequentially depositing on a surface of a steel sheet a galvanization layer, a zinc phosphate layer containing Mg, and an organic layer, and is characterized in that a value of Mg/P (weight ratio) in the zinc phosphate layer is 0.15 or larger and an amount of Mg contained in the zinc phosphate layer is 20 mg/m2 or more. Preferably, the zinc phosphate layer contains one or two or more of Ni, Mn, Co, Fe, Cu, Al, and Ca. In one preferred embodiment, the organic layer is formed as a composite layer containing an organic resin and one or two kinds or more of powder or colloid selected from SiO2, Al2O3, MgO, Fe2O3, Fe3O4, ZrO2, TiO2, and SnO2.Type: GrantFiled: September 23, 2002Date of Patent: April 13, 2004Assignee: Nippon Steel CorporationInventors: Kiyokazu Isizuka, Hidetoshi Shindou, Teruaki Yamada, Kimitaka Hayashi, Ikuo Kikuchi
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Publication number: 20040062944Abstract: A data storage medium includes a haze-prevention layer between a heat-resistant thermoplastic substrate and a reflective metal layer. The haze-prevention layer includes a metal having a tensile modulus of at least about 15×106 pounds per square inch. The data storage medium resists hazing of the reflective layer at elevated temperatures.Type: ApplicationFiled: August 7, 2003Publication date: April 1, 2004Inventors: Keith M. Borst, Robert R. Gallucci, Charles D. Iacovangelo, Donald G. LeGrand
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Publication number: 20040058187Abstract: Disclosed-herein is a highly weather resistant colored steel plate which comprises a steel plate as a substrate, a zinc- or zinc alloy-plated layer formed on the steel plate, a layer formed on the zinc- or zinc alloy-plated layer and pretreated with chromate or non-chromate, and a highly weather resistant film formed on the chromate or non-chromate layer, wherein the highly weather resistant film includes a polyester-based primer coated onto the chromate or non-chromate layer and a polyester top coat coated onto the polyester-based primer, the top coat being produced from a mixture of a main resin obtained by reacting an oil-free polyester-modified resin and a polyisocyanate compound, a melamine resin as a crosslinking agent, and other additives.Type: ApplicationFiled: September 12, 2003Publication date: March 25, 2004Applicant: UNION STEEL MANUFACTURING CO., LTD.Inventors: Jang Hyun Choi, Sung Su Jun, Woon Young Lee, Sung Kwon An
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Patent number: 6709769Abstract: A method is described for the manufacture of a Copper-Aluminium-Copper component (C-A-C “sandwich”) which can be used in the production of multilayer printed circuit boards, obtained by means of joining two external sheets of copper to one internal sheet of aluminium by means of a process of electro-mechanical joining, which does not require the use of additional material (such as, for example, an adhesive) and guarantees a consistently high level of quality. The joining process, normally continuous, is based on the use of a sonotrode to effect ultrasonic welding, wherein a single ultrasonic weld provides two joining zones between the two external copper sheets and the one internal aluminium sheet. According to a further embodiment, the component is manufactured with at least one layer of resin deposited externally on one of the external faces of the two copper sheets, which are not into contact with the internal aluminium sheet.Type: GrantFiled: March 14, 2001Date of Patent: March 23, 2004Assignee: Zincocelere S.p.A.Inventor: Giuseppe Pedretti
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Patent number: 6706412Abstract: A hybrid film, comprising a first polymer film having a plasma-treated surface and a second polymer film having first and second surfaces, with the first surface of the second polymer film being disposed along the first plasma-treated surface of the first polymer film, has superior thermal and mechanical properties that improve performance in a number of applications, including food packaging, thin film metallized and foil capacitors, metal evaporated magnetic tapes, flexible electrical cables, and decorative and optically variable films. One or more metal layers may be deposited on either the plasma-treated surface of the substrate and/or the radiation-cured acrylate polymer. A ceramic layer may be deposited on the radiation-cured acrylate polymer to provide an oxygen and moisture barrier film.Type: GrantFiled: February 21, 2001Date of Patent: March 16, 2004Assignee: Sigma Laboratories of ArizonaInventor: Angelo Yializis
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Publication number: 20040043243Abstract: A friction material has a first layer of a base material and a second layer of at least one type of friction modifying particle having substantially symmetrical geometric shapes on a top surface of the base material. The second layer has an average thickness of about 30 to about 200 microns and the surface area coverage of about 80 to about 100% such that the top layer has a fluid permeability lower than the first layer.Type: ApplicationFiled: September 4, 2002Publication date: March 4, 2004Inventors: Yih-Fang Chen, Robert C. Lam, Feng Dong, Bulent Chavdar
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Publication number: 20040043242Abstract: A copper foil for chip-on-film use, a plasma display panel, or a high-frequency printed circuit board obtained by rolling copper foil to smooth the surface to give a surface area of not more than 1.30 times an ideal smooth surface, the smoothed copper foil having deposited on it fine roughening particles of Cu or alloy particles of Cu and Mo or alloy particles comprising Cu and at least one element selected among a group of Ni, Co, Fe, and Cr or a mixture of this alloy particles and oxide of at least one element selected among a group of V, Mo, and W.Type: ApplicationFiled: August 29, 2003Publication date: March 4, 2004Applicant: FURUKAWA CIRCUIT FOIL CO., LTD.Inventors: Tadao Nakaoka, Akitoshi Suzuki, Hideo Otsuka, Hisao Kimijima
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Publication number: 20040038068Abstract: A multi-layer coating including a polymeric basecoat layer wherein the polymer of the basecoat layer is cured at subatmospheric pressure.Type: ApplicationFiled: August 26, 2002Publication date: February 26, 2004Inventors: John G. Finch, Joseph A. Elmer, Daniel E. Ford, Patrick A. Sullivan, Robert C. Bishop
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Patent number: 6696163Abstract: A process for providing a metal-seeded liquid crystal polymer comprising the steps of providing a liquid crystal polymer substrate to be treated by applying an aqueous solution comprising an alkali metal hydroxide and a solubilizer as an etchant composition for the liquid crystal polymer substrate. Further treatment of the etched liquid crystal polymer substrate involves depositing an adherent metal layer on the etched liquid crystal polymer substrate. An adherent metal layer may be deposited using either electroless metal plating or vacuum deposition of metal such as by sputtering. When using electroless metal plating, a tin(II) solution applied to the liquid crystal polymer provides a treated liquid crystal polymer substrate to which the application of a palladium(II) solution provides the metal-seeded liquid crystal polymer. The etchant composition comprises a solution in water of from 35 wt. % to 55 wt. % of an alkali metal salt, and from 10 wt. % to 35 wt.Type: GrantFiled: March 7, 2002Date of Patent: February 24, 2004Assignee: 3M Innovative Properties CompanyInventor: Rui Yang
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Patent number: 6696174Abstract: A method for making a repair to a repair site of a structure made from at least a first tube and a second tube which are joined together with welds. The method includes cleaning and preparing the at least first tube and second tube tubes at the repair site for bonding with composite repair materials. Next, fiber-reinforced polymer composite repair materials are applied to the repair site. These composite materials include at least one elongate, composite tendon strip which is placed on the at least a first tube and a second tube such that the composite tendon strip bridges at least the first tube and a second tube, and a composite strip which is wrapped around and overlays the tendon strip with additional composite strips. The invention also provides a metal structure reinforced with a composite material repair site according to the method.Type: GrantFiled: March 22, 2002Date of Patent: February 24, 2004Assignee: Air Logistics CorporationInventors: Lawrence D. Cercone, John W. Wegner, Franz Worth, Steve R. Bazinet
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Publication number: 20040033384Abstract: A device or an enclosed area that can cause or is sensitive to electromagnetic interference (EMI) is shielded by at least partially surrounding the device or the area with a visible light-transmissive film comprising a flexible support, an extensible visible light-transmissive metal or metal alloy layer and a visible light-transmissive crosslinked polymeric protective layer, and connecting at least one grounding electrode to the metal or metal alloy layer. The film has reduced susceptibility to fracture or corrosion compared to commercially available EMI shielding films.Type: ApplicationFiled: August 17, 2002Publication date: February 19, 2004Inventors: Arnold William Funkenbusch, Clark Ivan Bright, Robert James Fleming
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Publication number: 20040028937Abstract: A stainless steel article which has a transparent and uniform resin coating thereon, which can utilize the surface appearance of the stainless steel used as a substrate, which shows a high adhesive strength between the resin coating and stainless steel as a ground, which can be easily produced with a small number of steps, and which is particularly useful as an automotive exterior article. The stainless steel article comprises a stainless steel substrate and a transparent resin film with which at least one surface of the substrate is coated, the resin film comprising a transparent synthetic resin base and a transparent heat-sensitive adhesive layer formed on the synthetic resin base on the side of the stainless steel substrate, and the resin film being bonded to the stainless steel substrate through a silane coupling agent.Type: ApplicationFiled: July 28, 2003Publication date: February 12, 2004Applicant: 3M Innovative Properties CompanyInventor: Ken Egashira
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Publication number: 20040023058Abstract: A frame structure for a T/R tile module configured to transmit and receive electromagnetic radiation over a predetermined portion of the electromagnetic spectrum is provided. The frame component comprises at least one frame component formed as a single piece from a synthetic resin dielectric material. The frame component is configured to support a plurality of electrical connectors, and has a thin film coating configured to provide a ground connection and electromagnetic shield when the frame structure is incorporated into a transmit/receive module. A portion of the frame component is configured to interface with a portion of a T/R module when the frame component is incorporated into the T/R module, and the synthetic resin dielectric material provides the frame component with a range of compressibility that enables the frame component to provide the module with an effective ground connection over that range of compressibility.Type: ApplicationFiled: August 1, 2002Publication date: February 5, 2004Inventors: Alan L. Kovacs, Matthew H. Peter, Kurt S. Ketola, Jacques F. Linder
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Patent number: 6686052Abstract: A cooling plate provided with a cooling medium passage therein is formed by integrally joining a plurality of metal plates each having a cooling medium passage forming groove on a joining surface thereof. An anodic oxide film is formed on at least the cooling medium passage forming groove on the joining surface, and the plurality of metal plates are integrally joined each other by a friction agitation joining method. This enhances corrosion resistance of the cooling medium passage, resulting in an improved durability and extended life, which enables uniform cooling performance.Type: GrantFiled: June 20, 2002Date of Patent: February 3, 2004Assignee: Showa Denko, K.K.Inventors: Shigetoshi Jogan, Kiyoshi Tada
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Patent number: 6686058Abstract: On the outer surface of a metal pipe 10 there is formed a zinc plating layer 20 having a predetermined thickness by electroplating method. A coating layer 30 predominantly composed of a chromium compound and a phosphoric acid compound is formed by dipping the metal pipe 10 with layers up to the zincplating layer 20 formed thereon in a coating liquid containing chromium (a source of chromium) and at least one substance selected from the group consisting of oxyacid of phosphorus, oxysalt of phosphorus, anhydride of oxyacid of phosphorus, and anhydride of oxysalt of phosphorus. A fluorocarbon resin layer 40 is formed by coating, with polyvinyl fluoride, the metal pipe 10 with layers up to the coating layer 30 formed thereon and baking at a predetermined temperature for a predetermined time.Type: GrantFiled: October 4, 2002Date of Patent: February 3, 2004Assignee: Maruyasu Industries Co., Ltd.Inventor: Yuichiro Yoshida
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Patent number: 6677053Abstract: A surface-treated steel sheet includes a steel sheet, an Al—Zn-base alloy plating layer formed on the steel sheet, a chemical conversion film provided on the alloy plating layer, and a concentric layer of a Cr compound that is formed on the alloy plating layer of the chemical conversion film. The surface-treated steel sheet may include a steel sheet, an zinc-base plating layer formed on the steel sheet, and a film that contains chromium and calcium and that is formed on the zinc-base plating layer.Type: GrantFiled: December 17, 2001Date of Patent: January 13, 2004Assignee: NKK CorporationInventors: Takafumi Yamaji, Kenji Morita, Akira Matsuzaki, Masaaki Yamashita, Etsuo Hamada
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Patent number: 6677055Abstract: A tape structure and method of fabricating the tape structure. The method includes plating a metal such as silver, bismuth, gold, magnesium, nickel, or palladium over leads so that recess cavities and whiskers on the leads are greatly reduced.Type: GrantFiled: June 21, 2002Date of Patent: January 13, 2004Assignee: Kingtron Electronics Co., Ltd.Inventors: Chin-Fu Chung, Chih-Kung Huang
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Patent number: 6673471Abstract: A component for use in manufacturing articles such as printed circuit boards, the component comprising: a sheet of copper foil which, in a finished printed circuit board, constitutes a functional element; a substrate sheet of aluminum which constitutes a discardable element, and a protective coating layer on a surface of said substrate, one surface of the copper sheet and the coating layer on said substrate aluminum sheet being essentially uncontaminated and engageable with each other at an interface, and the uncontaminated surfaces of the sheets being manufactured together to define a substantially uncontaminated central zone inwardly of the edges of the sheets and unjoined at the interface.Type: GrantFiled: February 23, 2001Date of Patent: January 6, 2004Assignee: Nikko Materials USA, Inc.Inventor: R. Richard Steiner
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Patent number: 6673468Abstract: The invention concerns a composite material in band or slab form made of two cover plates (1, 2), made of steel, which can be resistance welded together via electrically conductive bodies (4), and an intermediate layer (3) made of a filler material in which the bodies (4) are embedded, with the bodies (4), which are implemented as curved slugs, lying pressed flat between the cover plates (1, 2). This type of composite material is produced in that the filler material (3′) for the intermediate layer (3) is applied as a paste to a band (1′) serving as the first cover plate (1) as it passes by and the curved slugs (4′) are, after being laid on the filler material (3′), pressed into it at least until contact is made via a band (2′) supplied as the second cover plate (2) in a welding gap (8) formed by two roller electrodes (6,7) of a resistance welding device and the slugs are largely pressed flat with the bands (1′, 2′) during welding.Type: GrantFiled: December 3, 2001Date of Patent: January 6, 2004Assignee: Thyssen Krupp Stahl AGInventors: Friedrich Behr, Hans-Dieter Gall, Cetin Nazikkol
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Publication number: 20030232214Abstract: A method is provided for making vehicle trim components that have a layer(s) including chromium (Cr), in metallic, oxide, nitride, and/or carbide form. In certain embodiments, a Cr inclusive gas is used in conjunction with a vapor deposition apparatus (e.g., PECVD apparatus) in order to form a Cr inclusive layer on a substrate. In certain example embodiments, the substrate may be provided with a conductive layer thereon, and may be electrically biased in the deposition chamber. The Cr inclusive layer may be at least partially amorphous in certain example embodiments.Type: ApplicationFiled: June 18, 2002Publication date: December 18, 2003Inventor: Vijayen S. Veerasamy
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Patent number: 6652988Abstract: An article is coated with a multi-layer decorative and protective coating. The coating contains a polymeric basecoat layer containing (i) an epoxy urethane resin or (ii) the reaction products of a polyamine and an epoxy urethane resin. Over the polymeric basecoat layer is a vapor deposited chromium, chromium compound, refractory metal compound or refractory metal alloy compound decorative and protective layer.Type: GrantFiled: December 21, 2000Date of Patent: November 25, 2003Assignee: Masco CorporationInventors: Dimitris Katsamberis, John G. Finch, Joseph A. Elmer, Patrick A. Sullivan
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Patent number: 6649282Abstract: A tin-plating or aluminum-plating surface treated steel material with excellent corrosion resistance containing an intermetallic compound composed of one or more Group IIa (alkaline earth metal) elements and one or more Group IVb elements in a tin-based plating layer or aluminum-based plating layer on the surface of a steel material. For a tin-based plating layer, the long diameter of the intermetallic compound massive bodies is 1 82 m or greater and the short diameter/long diameter ratio is at least 0.4. For an aluminum-based plating layer, the long diameter of the intermetallic compound massive bodies is 10 &mgr;m or greater and the short diameter/long diameter ratio is at least 0.4.Type: GrantFiled: December 26, 2001Date of Patent: November 18, 2003Assignee: Nippon Steel CorporationInventors: Shinichi Yamaguchi, Jun Maki, Teruaki Izaki, Masao Kurosaki, Hisaaki Sato, Hidetoshi Shindo, Seiji Sugiyama
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Patent number: 6649279Abstract: A metallized multilayer film structure includes a core layer of a film-forming polyolefin having a first side and a second side. A metal receiving skin layer may be disposed on the first side of the core layer. A metal layer may be deposited on the surface of the metal receiving skin layer opposite the core layer. A topcoat layer may be disposed on the surface of the metal layer opposite the metal receiving skin layer. A polymer skin layer may be disposed on the second side of the core layer. The film structure may optionally include one or more tie layers. The film structure may also optionally include a primer layer interposed between the topcoat layer and the metal layer. The present metallized multilayer film structure may be suitable for use as a monoweb to package product as opposed to being used in a lamination. The film structure exhibits superior scratch resistance and resistance to other types of damage. The film structure may be directly surface printed and then used to directly package product.Type: GrantFiled: May 30, 2001Date of Patent: November 18, 2003Assignee: ExxonMobil Oil CorporationInventors: Robert A. Migliorini, Larry A. Parr, William M. Mallory, Wayne Robert Osgood, Jr.
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Publication number: 20030207145Abstract: An improved method for adhering a solid polymer component to a substrate is provided. An intermediate polymer adhesion promoting coating of metal oxide is applied to the substrate which enhances the adhesion of the subsequently applied solid polymer component to the substrate.Type: ApplicationFiled: May 2, 2003Publication date: November 6, 2003Inventors: Charles W. Anderson, William F. Czages
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Publication number: 20030206376Abstract: An example of a method for forming a multi-layer structure which may be used for supporting a transducer includes providing a support layer and forming a etch stop layer from a refractory metal on the support layer. A first electrically conducting layer of copper may be formed on the etch stop layer. A dielectric layer may be provided on the first electrically conducting layer. A second electrically conducting layer of copper may be provided on the dielectric layer. The dielectric layer is positioned between the first electrically conducting layer and the second electrically conducting layer. The second electrically conducting layer may be etched to form a plurality of separate electrically conducting lines.Type: ApplicationFiled: May 1, 2002Publication date: November 6, 2003Applicant: International Business Machines CorporationInventors: A. David Erpelding, Klaas Berend Klaassen
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Patent number: 6641928Abstract: An adhesive for semiconductor chips contains a first resin component which is polymerizable, a first hardener for inducing a self-polymerization reaction of the first resin component and a second hardener which is addition-polymerized with the first resin component. When the adhesive is applied on a wiring board and a semiconductor chip is applied thereon and heat is applied, the second hardener is addition-polymerized with the backbone of the three-dimensional network formed by the self-polymerization reaction of the first resin component. The first temperature at which the addition polymerization zone becomes a rubbery structure is lower than the second temperature at which the backbone becomes a rubbery structure, so that the elastic modulus loss sharply increases at the first temperature to reduce the stress between the semiconductor chip and the wiring board.Type: GrantFiled: October 5, 2001Date of Patent: November 4, 2003Assignee: Sony Chemicals Corp.Inventors: Motohide Takeichi, Misao Konishi, Junji Shinozaki, Yasushi Akutsu
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Patent number: RE38508Abstract: A structural panel has one or more face sheets bonded by adhesive layers to a core body having two outer plastic liner sheets fusion-bonded to linear ends of inner plastic truss elements spaced apart with open spaces therebetween extending in a plane direction of the plastic liner sheets. The sheet-to-sheet adhesive bonding provides a high-strength laminate bonding that is very resistant to delamination, simple and inexpensive, and can be carried out by a preferred continuous sheet bonding technique. The all-plastic core body is highly resistant to moisture attack, and the open spaces between truss elements provide flexibility to accommodate thermal expansion and contraction. The truss construction of the core body provides high compressive and shear strength, while minimizing the amount of material required to be used. In one preferred embodiment, two metal face sheets are used, and the core body has plastic liner sheets fusion-bonded to a corrugated plastic core sheet.Type: GrantFiled: August 20, 2001Date of Patent: April 27, 2004Assignee: Laminators IncorporatedInventor: John T. Wright