Abstract: A wafer holding unit includes a disk-shaped ceramic substrate having a wafer mounting surface on an upper surface of the substrate, an RF electrode, for example, embedded within the substrate, a metal terminal inserted from a lower surface of the substrate, and a connecting terminal which electrically connects the RF electrode and the metal terminal with each other. The connecting terminal is constituted by a ceramic member and a metal layer. The ceramic member is made of the same material as the substrate and preferably has a truncated conical shape. The metal layer covers a surface of the ceramic member. An upper end of the metal layer is connected to the RF electrode, while a lower end of the metal layer is connected to the metal terminal with a metal member interposed therebetween.

Abstract: A wiring board is disclosed. The wiring board includes a substrate including a first element, a diffusion layer in contact with the substrate and including a first metal element, and a first metal film in contact with the diffusion layer and including a second metal element. The diffusion layer has at least a region including the first element and the first metal element and a region including the first metal element and the second metal element. A concentration of the second metal element in the diffusion layer may decrease as it approaches the substrate in a depth direction. A concentration of the first element in the diffusion layer may decrease as it approaches the first metal film in the depth direction.

Abstract: The present disclosure is drawn to covers for electronic devices. In one example, a cover for an electronic device can include an aluminum or aluminum alloy cover frame having an opening. A magnesium or magnesium alloy cover panel supported by the aluminum or aluminum alloy cover frame within or over the opening. A protective coating can be over a surface of the aluminum or aluminum alloy cover frame and a surface of the magnesium or magnesium alloy cover panel. A chamfered edge can include a chamfer at an edge of the aluminum or aluminum alloy cover frame. The chamfer can expose the aluminum or aluminum alloy cover frame beneath the protective coating, and the chamfer at the same time does not expose the magnesium or magnesium alloy cover panel.

Abstract: Embodiments of the present disclosure generally relate to protective coatings on an aerospace component and methods for depositing the protective coatings. In one or more embodiments, a method for depositing a coating on an aerospace component includes depositing one or more layers on a surface of the aerospace component using an atomic layer deposition or chemical vapor deposition process, and performing a partial oxidation and annealing process to convert the one or more layers to a coalesced layer having a preferred phase crystalline assembly. During oxidation cycles, an aluminum depleted region is formed at the surface of the aerospace component, and an aluminum oxide region is formed between the aluminum depleted region and the coalesced layer. The coalesced layer forms a protective coating, which decreases the rate of aluminum depletion from the aerospace component and the rate of new aluminum oxide scale formation.

Abstract: A thermal barrier coated component, such as a turbine blade formed from a superalloy substrate, includes a thermal barrier coating applied onto the substrate. A metallic bond coat layer is on the substrate and includes rare-earth luminescent dopants. A ceramic top coat layer is on the bond coat layer. A temperature sensing thermally grown oxide (TGO) layer is formed at the interface of the bond coat layer and ceramic top coat layer. The temperature sensing TGO layer includes grown rare-earth luminescent ions migrated from the metallic bond coat layer in an amount sufficient to enable luminescence sensing of the TGO layer for real-time phosphor thermometry temperature measurements at the TGO layer.

Abstract: A multicomponent alloy coating is provided. The multicomponent alloy coating includes a hard layer and a plurality of nickel-based particles dispersed in the hard layer. The composition of the multicomponent alloy coating is represented by the following formula (I): AldCoeCrgFehNiiSijCkOm??formula (I), wherein 1<d<2, 0.5<e<0.8, 2<g<3.2, 0.05<h<0.3, 2<i<3, j=1, k?0, m?0, and iron is present in the amount of less than 3 wt % of the composition of the multicomponent alloy coating.

Abstract: A plasma processing device member according to the disclosure includes a base material and a film formed of a rare-earth element oxide, or a rare-earth element fluoride, or a rare-earth element oxyfluoride, or a rare-earth element nitride, the film being disposed on at least part of the base material. The film includes a surface to be exposed to plasma, the surface having an arithmetic mean roughness Ra of 0.01 ?m or more and 0.1 ?m or less, the surface being provided with a plurality of pores, and a value obtained by subtracting an average equivalent circle diameter of the pores from an average distance between centroids of adjacent pores is 28 ?m or more and 48 ?m or less. A plasma processing device according to the disclosure includes the plasma processing device member described above.

Abstract: The present specification relates to a conductive structure, a method of manufacturing the same, and an electrode including the conductive structure.

Abstract: There is provided a hot-stamped body including: a steel base metal; and a metallic layer formed on a surface of the steel base metal, wherein the metallic layer includes: an interface layer that contains, in mass %, Al: 30.0 to 36.0%, has a thickness of 100 nm to 15 ?m, and is located in an interface between the metallic layer and the steel base metal; and a principal layer that includes coexisting Zn phases and insular FeAl2 phases, is located on the interface layer, and has a thickness of 1 ?m to 40 ?m. This hot-stamped body is excellent in fatigue properties, corrosion resistance, and chipping resistance.

Abstract: A sensor assembly includes a wear sensor and a seal member. The wear sensor has an encapsulation body with a wear face, a sacrificial conductor embedded within the encapsulation body and spaced apart from the wear face, and a monitoring lead extending into the encapsulation body and connected to the sacrificial conductor. The wear sensor is fixed relative to the seal member and the encapsulation body has a wear coefficient that is greater than a wear coefficient of the seal member. Bearing arrangements and methods of monitoring seal wear in bearing arrangements are also described.

Abstract: A component includes a film containing polycrystalline yttrium oxide. In an X-ray diffraction pattern of the film, a ratio Im/Ic of a maximum intensity Im of a peak attributed to monoclinic yttrium oxide to a maximum intensity Ic of a peak attributed to cubic yttrium oxide satisfies an expression: 0?Im/Ic?0.002.

Abstract: The invention relates to a method for manufacturing a part (1) comprising a nickel-based monocrystalline superalloy substrate (2). This method is characterised in that it comprises the steps that consist of: manufacturing a nickel-based monocrystalline superalloy substrate (2); forming a coating (3) on said substrate (2), comprising at least one layer (30) of a first type comprising aluminum and platinum, at least one layer (31) of a second type comprising aluminium, silicon, platinum and a layer (32) of a third type comprising nickel, aluminium, silicon and platinum, said layer (32) of the third type being the outermost layer of the stack of coating layers (3); and forming a layer (4) of silicon-doped alumina on said layer (32) of the third type.

Abstract: Semiconductor layers useable for minimizing or preventing the growth of metal whiskers, as well as devices and methods utilizing the same and kits for making the same, are described. The semiconductor layers may be nickel oxide layers. In some embodiments, an electronic device may include a substrate, a first metal layer on the substrate, a semiconductor layer comprising NiO on the first metal layer, and a second metal layer on the semiconductor layer. In some embodiments, an electronic device may include a substrate, a semiconductor layer comprising NiO directly on the substrate, and a metal layer directly on the semiconductor layer. A method for making an electronic device may include depositing a semiconductor layer comprising NiO on a substrate, and depositing a metal layer on the semiconductor layer, where the semiconductor layer substantially prevents the growth of whiskers on the metal layer.

Abstract: Provided is a fuel distribution pipe connected to a fuel pipe and distributes and supplies fuel to a plurality of fuel injection devices, comprising: a tubular base material forming a body of the fuel distribution pipe; and a plating layer formed on a surface of the base material, wherein the base material includes a sealing surface formed on an inner peripheral surface thereof and comes into press-contact with the fuel pipe, and wherein a thickness of the plating layer on the sealing surface is thinner than that of the plating layer on an outer peripheral surface of the fuel distribution pipe.

Abstract: A steel sheet including an inner layer and a hard layer at one or both surfaces of the inner layer wherein the hard layer and the inner layer have predetermined compositions, each hard layer has a thickness of 20 ?m or more and ? of the total sheet thickness or less, the hard layer has an average micro-Vickers hardness of 400 HV or more and less than 700 HV, the hard layer has an N amount of 0.02% or less, the inner layer has an average micro-Vickers hardness of 80 HV or more and less than 400 HV, the inner layer has a carbide volume ratio of less than 2.00%, and the hard layer has a nanohardness standard deviation of 2.00 or less is provided.

Abstract: A gas turbine engine includes a rotor that has a rim, blades extending radially outwards from the rim, a hub extending radially inwards from the rim, an arm extending axially from the rim, the arm having a radially outer surface, and a coating disposed on the radially outer surface. The coating is zirconia-toughened alumina in which the alumina is a matrix with grains of the zirconia dispersed there through. The grains of zirconia are predominantly a tetragonal crystal structure.

Abstract: A method for forming a sheet structure includes providing a tool having a formation surface corresponding to a shape of the sheet structure. The method also includes depositing at least one layer of material on the formation surface using a cold-spray deposition technique. The method also includes removing the at least one layer of material from the formation surface to create the sheet structure.

Abstract: A method for producing a steel substrate coated with a chromium metal-chromium oxide (Cr—CrOx) coating layer in a continuous high speed plating line, operating at a line speed (v1) of at least 100 m·min?1, wherein one or both sides of the electrically conductive substrate in the form of a strip, moving through the line, is coated with a chromium metal-chromium oxide (Cr—CrOx) coating layer from a single electrolyte by using a plating process. A coated steel substrate and a packaging made thereof.

Abstract: Surface treated copper foils for use in high speed circuits on the order of 100 MHz or greater contain a reverse treated layer of copper nodules on the drum side of the electrolytically deposited copper foil to form a lamination side to be laminated to a dielectric material to form a copper clad laminate. Methods of forming the surface treated copper foil, and printed circuit boards (PCB) from the copper clad laminates are also described. The surface treated copper foils, copper clad laminates and PCBs can be incorporated into various electronic devices in which high speed signals are employed, including personal computers, mobile communications, including cellular telephones and wearables, self-driving vehicles, including cars and trucks, and aviation devices, including manned and unmanned vehicles, including airplanes, drones, missiles and space equipment including satellites, spacecraft, space stations and extra-terrestrial habitats and vehicles.

Abstract: Disclosed is a steel composition for hot stamping that comprises carbon (C) in an amount of about 0.22 to about 0.25 wt %, silicon (Si) in an amount of about 0.2 to about 0.3 wt %, manganese (Mn) in an amount of about 1.2 to about 1.4 wt %, titanium (Ti) in an amount of about 0.02 to about 0.05 wt %, chromium (Cr) in an amount of about 0.11 to about 0.2 wt %, boron (B) in an amount of about 0.005 to about 0.01 wt %, zinc (Zr) in an amount of about 0.005 to about 0.02 wt %, niobium (Nb) in an amount of about 0.01 to about 0.05 wt %, tungsten (W) in an amount of about 0.1 to about 0.5 wt %, iron (Fe) constituting the remaining balance of the steel composition, all the wt % based on the total amount of the steel composition.

Abstract: The substrate for a printed circuit board according to an embodiment of the present invention includes a base film having insulating properties, and a metal layer stacked on at least one surface of the base film, in which the base film includes a portion where a transition metal in group 10 of the periodic table is present. The transition metal in group 10 is preferably nickel or palladium. The portion where the transition metal in group 10 is present preferably includes a region having an average thickness of 500 nm and extending from an interface with the metal layer.

Abstract: A coated high-temperature component including a cobalt coating that has a higher carbon content is provided. A layer composed of a cobalt-based alloy is applied which is known as or is similar to substrate material, to the region of the component which is subject to the wear, wherein the component preferably comprises a nickel-based alloy as substrate material, the carbon content of which is lower than that of the cobalt-based alloy. At the high operating temperatures, carbon diffuses from the coating into the base material; this is normally undesirable, but here leads to a higher carbide proportion in the substrate and therefore to a higher hardness and therefore to an increased wear resistance.

Abstract: An assembly including a ceramic body. The assembly comprises a tungsten coupling attached to the ceramic body with a first joint that forms a first helium tight seal between the ceramic body and the tungsten coupling and where the first helium tight seal maintains its integrity at a temperature over 400° C. The assembly includes a metal body attached to the tungsten coupling with a second joint that forms a second helium tight seal between the metal body and the tungsten coupling and where the second helium tight seal maintains its integrity at a temperature over 400° C. A method. A mixture. A coupling.

Abstract: A multilayer component includes a main body and an external contact. The external contact has a connection element and a contact layer. The contact layer electrically conductively connects the main body to the connection element. A connection between the main body and the connection element is produced by sintering of the contact layer.

Abstract: A method of transferring a thin layer from a first substrate to a second substrate with different coefficients of thermal expansion, including: providing at least one intermediate layer which temperature is increased by induction when an electromagnetic field is applied to it, more than a temperature increase in the first and second substrates; making contact between the first substrate and the second substrate, with the at least one intermediate layer interposed between them; fracturing the first substrate at a weakened zone making use of supply of thermal energy at the weakened zone made by applying an electromagnetic field to a heterostructure formed by making contact between the first substrate and the second substrate, the application generating local induction heating in the intermediate layer that induces a temperature gradient with a local value at the weakened zone activating the fracture mechanism.

Abstract: A superconducting cable includes a core part, in which the core part includes a former including a plurality of copper wires, a superconducting conductor layer including a plurality of superconducting wires connected in parallel to each other, an insulating layer, and a superconducting shield layer including a plurality of superconducting wires are sequentially arranged. A conducting layer formed of a metal having a current-carrying property at room temperature is provided on opposite surfaces of each of the superconducting wires of the superconducting conductor layer to reinforce mechanical rigidity of each of superconducting wires of the superconducting conductor layer, and the former has a cross-sectional area which is smaller than that of a former of a superconducting cable in which the conducting layer is not added to superconducting wires and which is designed on an assumption that all fault current flows to the former.

Abstract: A method for producing a catalyst using an additive layer method includes: (i) forming a layer of a powdered catalyst or catalyst support material, (ii) binding or fusing the powder in said layer according to a predetermined pattern, (iii) repeating (i) and (ii) layer upon layer to form a shaped unit, and (iv) optionally applying a catalytic material to said shaped unit.

Abstract: A ceramic composition of matter includes a solvent material and a solute material. The solvent material comprises zirconia or hafnia, or a mixture thereof, which is stabilized with a stabilizing oxide. The solute material comprises a metal oxide of the formula, XaOb, where X is a metallic element, O is oxygen, and “a” and “b” are stoichiometric coefficients. The difference in density between the solvent material and the solute material is less than about 30%.

Abstract: The present invention is directed to a process for tin coating a metallic substrate, and a process for hardening a tin layer and wire having a tin coating The invention relates in particular to a process for tin coating a wire. In the process, firstly a tin layer is applied, and a metal layer made of a metal different to tin is applied thereto. Then, the layers are subjected to a diffusion annealing operation.

Abstract: The present invention relates to a process for corrosion protection of an iron-containing substrate wherein a first zinc-nickel alloy layer, a second zinc-nickel alloy layer and a black passivate layer are deposited onto the substrate. The nickel concentration in the second zinc-nickel alloy layer is higher than the nickel concentration in the first zinc-nickel alloy layer. The substrate surface obtained is homogenously black with an appealing decorative appearance and both resistance against white rust and red rust are improved.

Abstract: A process for forming a fluorocarbon polymer film on a substrate is disclosed. A self-assembled monolayer (SAM) containing an initiator for living polymerization such as controlled radical polymerization is formed on the surface of the substrate followed by living polymerization such as controlled radical polymerization of a polymerizable fluorocarbon monomer component.

Abstract: An article and method of forming the article are disclosed. The article includes a substrate, an overlay bond coat deposited over the substrate and a topcoat deposited over the bond coat. The bond coat of the article includes a plasma affected region proximate to an interface between the bond coat and the topcoat, and the plasma affected region includes an elongated intergranular phase. The method of depositing includes adjusting the plasma spray conditions so as to form the plasma affected region proximate to an interface between the bond coat and the topcoat, and elongated intergranular phases in the plasma affected regions.

Abstract: An article may include a superalloy substrate and a calcia-magnesia-alumina-silicate (CMAS)-resistant thermal barrier coating (TBC) layer overlying the superalloy substrate. In some embodiments, the CMAS-resistant TBC layer includes between about 50 wt. % and about 90 wt. % of a TBC composition and between about 10 wt. % and about 50 wt. % of a CMAS-resistant composition. In some examples, the TBC composition includes at least one of yttria-stabilized zirconia, yttria-stabilized hafnia, zirconia stabilized with at least three rare earth oxides, or hafnia stabilized with at least three rare earth oxides. In some examples, the CMAS-resistant composition includes alumina, silica, and an oxide of at least one of Sc, Y, La, Ce, Pr, Nd, Pm, Sm, Eu, Gd, Yb, Dy, Ho, Er, Tm, Tb, or Lu.

Abstract: An insulating film-coated metal foil having on one or both surfaces thereof an organic-inorganic hybrid layer containing dimethylsiloxane and a metalloxane comprising a metal other than Si. Relative to the concentration [Si]1/4t of the Si at a depth of ¼t from the surface of the organic-inorganic hybrid layer in the thickness direction of the hybrid layer, the concentration [Si]3/4t of the Si at a depth of ¾t from the surface of the organic-inorganic hybrid layer in the thickness direction of the hybrid layer satisfies [Si]1/4t<[Si]3/4t, and ([Si]3/4t?[Si]1/4t)/[Si]3/4t is 0.02-0.23. Provided is a metal foil that can be used in solar cell substrates, flexible circuit substrates, etc., that exhibits surface flatness, pliability, insulating properties and thermal resistance properties, and that has a layer having a surface which is not susceptible to scratching by processes in which substrates are handled, such as conveyance and transshipment.

Abstract: A flexible circuit board includes a base film formed by a metallic material, a first protective film formed on a first surface of the base film, and a circuit pattern adhered to the first protective film through an adhesive film. Projections and recesses for heat release are formed on a second surface that is a surface on the opposite side of the first surface of the base film.

Abstract: A flexible circuit board includes a base film formed by a metallic material, a first protective film formed on a first surface of the base film, and a circuit pattern adhered to the first protective film through an adhesive film. Projections and recesses for heat release are formed on a second surface that is a surface on the opposite side of the first surface of the base film.

Abstract: A hot-pressed member includes a steel sheet, a Ni-diffusion region present in a surface layer of the steel sheet, and an intermetallic compound layer and a ZnO layer which are provided in order on the Ni-diffusion region, the intermetallic compound layer corresponding to a ? phase present in a phase equilibrium diagram of a Zn—Ni alloy, wherein a spontaneous immersion potential indicated in a 0.5 M NaCl aqueous air-saturated solution at 25° C.±5° C. is ?600 to ?360 mV based on a standard hydrogen electrode.

Abstract: An article and method of forming the article are disclosed. The article includes a substrate, an overlay bond coat deposited over the substrate and a topcoat deposited over the bond coat. The bond coat of the article includes a plasma affected region proximate to an interface between the bond coat and the topcoat, and the plasma affected region includes an elongated intergranular phase. The method of depositing includes adjusting the plasma spray conditions so as to form the plasma affected region proximate to an interface between the bond coat and the topcoat, and elongated intergranular phases in the plasma affected regions.

Abstract: Provided are a heat-absorbing material having high heat resistance and high wavelength selectivity, and a process for producing the same. The heat-absorbing material includes: a heat-resistant metal having the substantially same periodic structure in the light incidence plane as the wavelength of sunlight having a specific wavelength in the wavelength regions of visible light and near-infrared rays; and a cermet formed on the light incidence plane of the heat-resistant metal. Thus, there can be achieved desirable absorption and radiation characteristics being such that absorption is performed in the visible light region meanwhile reflection is performed in the infrared region. Furthermore, the cermet does not need complicated film-formation control, and therefore, the high heat resistance can be maintained.

Abstract: In order to provide a steel sheet for hot pressing from which a hot-pressed part excellent in perforation corrosion resistance is obtainable and a method of manufacturing a hot-pressed part using the steel sheet for hot pressing, provided is a steel sheet for hot pressing having, sequentially on a surface of a base steel sheet: a plating layer I containing 60% by mass or more of Ni and the remainder consisting of Zn and inevitable impurities, a coating mass thereof being 0.01 to 5 g/m2; and a plating layer II containing 10 to 25% by mass of Ni and the remainder consisting of Zn and inevitable impurities, a coating mass thereof being 10 to 90 g/m2.

Abstract: This invention relates generally to an article that includes a base substrate, an intermediate layer including at least one element or compound selected from titanium, chromium, indium, zirconium, tungsten, and titanium nitride on the base substrate, and a hydrophobic coating on the base substrate, wherein the hydrophobic coating includes a rare earth element material (e.g., a rare earth oxide, a rare earth carbide, a rare earth nitride, a rare earth fluoride, and/or a rare earth boride). An exposed surface of the hydrophobic coating has a dynamic contact angle with water of at least about 90 degrees. A method of manufacturing the article includes providing the base substrate and forming an intermediate layer coating on the base substrate (e.g., through sintering or sputtering) and then forming a hydrophobic coating on the intermediate layer (e.g., through sintering or sputtering).

Abstract: A substrate processing chamber component comprising a chamber component structure having an yttrium-aluminum coating. The yttrium-aluminum coating comprises a compositional gradient through a thickness of the coating.

Abstract: One or more embodiments relates to an MCrAlY bond coat comprising an MCrAlY layer in contact with a Y—Al2O3 layer. The MCrAlY layer is comprised of a ?-M solid solution, a ?-MAl intermetallic phase, and Y-type intermetallics. The Y—Al2O3 layer is comprised of Yttrium atoms coordinated with oxygen atoms comprising the Al2O3 lattice. Both the MCrAlY layer and the Y—Al2O3 layer have a substantial absence of Y—Al oxides, providing advantage in the maintainability of the Yttrium reservoir within the MCrAlY bulk. The MCrAlY bond coat may be fabricated through application of a Y2O3 paste to an MCrAlY material, followed by heating in a non-oxidizing environment.

Abstract: Phosphorus-based coatings having a plurality of phosphate moieties, a plurality of phosphonate moieties, or both, covalently bonded to an oxide surface of an implantable substrate exhibiting one or more of the following characteristics: (a) the surface phosphorus-containing group density of the coated regions of the substrate is at least about 0.1 nmol/cm2; (b) the phosphorus-based coating has a thickness of less than about 10 nm; or (c) the surface phosphorus-containing group density of the coated regions of the substrate is equal to or greater than the surface hydroxyl group density of the oxide surface of the substrate. Implantable devices embodying the coated substrates are also disclosed.

Abstract: According to the present invention, a steel sheet for a container excellent in corrosion resistance, adhesion, and weldability is provided, which includes a steel sheet; a Ni plating layer which is formed on a surface of the steel sheet in an amount of plating deposition containing a Ni amount of 0.3 to 3 g/m2 and contains Co in the range of 0.1 to 100 ppm; and a chromate coating layer which is formed on a surface of the Ni plating layer in an amount of coating deposition containing a converted Cr amount of 1 to 40 mg/m2.

Abstract: A hot stamped high strength part which is excellent in post painting anticorrosion property, which hot stamped high strength part has an alloy plating layer including an Al—Fe intermetallic compound phase on the surface of the steel sheet. The alloy plating layer is comprised from phases of a plurality of intermetallic compounds, a mean linear intercept length of crystal grains of a phase containing Al: 40 to 65 mass % among the phases of the plurality of intermetallic compounds is 3 to 20 ?m, an average value of thickness of the Al—Fe alloy plating layer is 10 to 50 ?m, and a ratio of the average value of thickness to the standard deviation of thickness of the Al—Fe alloy plating layer satisfies the following relationship: 0<standard deviation of thickness/average value of thickness?0.15.

Abstract: The present invention provides a carrier-attached copper foil, wherein an ultrathin copper foil is not peeled from the carrier prior to the lamination to an insulating substrate, but can be peeled from the carrier after the lamination to the insulating substrate. A carrier-attached copper foil comprising a copper foil carrier, an intermediate layer laminated on the copper foil carrier, and an ultrathin copper layer laminated on the intermediate layer, wherein the intermediate foil is configured with a Ni layer in contact with an interface of the copper foil carrier and a Cr layer in contact with an interface of the ultrathin copper layer, said Ni layer containing 1,000-40,000 ?g/dm2 of Ni and said Cr layer containing 10-100 ?g/dm2 of Cr is provided.

Abstract: A black-plated steel sheet has a Zn-plating layer containing molten Al and Mg, containing Al in the amount of 1.0-22.0 mass %, containing Mg in the amount of 1.3-10.0 mass %, and having a Zn black oxide distributed in a lamella pattern in the plating layer. The Zn black oxide is a Zn oxide derived from a Zn2Mg phase. The brightness of the surface of the Zn-plating layer containing the molten Al and Mg has an L* value of 60 or less.

Abstract: This relates to a coated substrate for packaging applications including a recrystallisation annealed single reduced steel substrate or a double reduced steel substrate subjected to recrystallisation annealing between the first and second cold rolling treatment, wherein one or both sides of the substrate is coated with an iron-tin alloy layer which contains at least 80 weight percent (wt. %) of FeSn (50 at. % iron and 50 at. % tin) and wherein the iron-tin alloy layer or layers are provided with a chromium metal-chromium oxide coating layer produced by a trivalent chromium electroplating process, and wherein the thickness of the chromium metal-chromium oxide coating layer corresponds to at least 20 mg Cr/m2 and a process for producing the coated substrate.

Abstract: A steel sheet used to manufacture a container, wherein the steel sheet includes a chromate film layer or a film layer including Zr on the Ni plating layer, the Ni plating layer includes one or more of a hydroxyl Ni and a Ni oxide, an adhesion amount of the Ni plating layer in terms of an amount of Ni is 0.3 g/m2 or more, a concentration of oxygen atoms of the Ni plating layer due to the hydroxyl Ni and the Ni oxide is 1 to 10 atomic %, an adhesion amount of the chromate film layer in terms of the amount of Cr is 1 to 40 g/m2, and an adhesion amount of the film layer including Zr in terms of an amount of Zr is 1 to 40 g/m2 or more.