Abstract: A technique capable of reducing the possibility of generation of a Cu—Sb compound in an overlay and the possibility of delamination between layers. A sliding member includes: an overlay including an alloy plating film of Bi and Sb; a lining including an Al alloy; a first intermediate layer including Cu as a main component, and laminated on the lining; and a second intermediate layer including Ag as a main component, and connecting the first intermediate layer and the overlay.

Abstract: An anode for a lithium secondary battery includes an anode current collector, and an anode active material layer formed on at least one surface of the anode current collector. The anode active material layer includes a carbon-based active material, a first silicon-based active material doped with magnesium and a second silicon-based active material not doped with magnesium. A content of the first silicon-based active material is in a range from 2 wt % to 20 wt % based on a total weight of the anode active material layer.

Abstract: A bonding structure formed on a substrate includes an indium layer and a passivating nickel plating formed on the indium layer. The nickel plating serves to prevent a reaction involving the indium layer.

Abstract: The present invention resides in a method of manufacturing a bearing ring (101) for a rolling element bearing, wherein the bearing ring comprises a bearing race (102) made of a bearing grade steel and an overmolded part (106) that is preferably made of a lightweight metal such as aluminum or a thermoplastic material such as polyamide. According to the invention, the method comprises a step of hardening at least a raceway surface (103) of the bearing race prior to a step of joining the overmolded part (106) to the bearing race (102) in a molding process. In a further development, the method comprises a step of temperature control, to ensure that the temperature of the raceway surface (103) is kept below a predetermined value during the molding process.

Abstract: A slide member is provided with a base material and an overlay provided over the base material. The overlay includes a plurality of regions in a thickness direction including a region located in sliding-surface side that slides with the counter element and a region located in a base-material side. A material forming the overlay includes a plurality of crystal planes. Orientation index of at least one of the crystal planes differs in the region located in the sliding-surface side and the region located in the base-material side of the overlay.

Abstract: The present invention provides metallic materials for electronic components, having low degree of whisker formation, low adhesive wear property and high durability, and connector terminals, connectors and electronic components using such metallic materials.

Abstract: A contact layer for an electrical contact is disclosed having bismuth and being tin-free.

Abstract: Provided by the present invention is a laminated structure with good use efficiency, in which diffusion of tin from an indium-tin solder material to an indium target is favorably suppressed, and a method for producing the same. The laminated structure has a backing plate, an indium-tin solder material, and an indium target laminated in this order, and the concentration of tin in the 2.5 to 3.0 mm thickness range of the indium target from the indium-tin solder material side surface is 5 wtppm or less.

Abstract: The present invention provides a metallic material for electronic components having a low degree of whisker formation and a high durability, and connector terminals, connectors and electronic components using the metallic material. The metallic material for electronic components includes: a base material; on the base material, an lower layer constituted with one or two or more selected from the group consisting of Ni, Cr, Mn, Fe, Co and Cu; on the lower layer, an upper layer constituted with an alloy composed of one or both of Sn and In (constituent elements A) and one or two or more of Ag, Au, Pt, Pd, Ru, Rh, Os and Ir (constituent elements B), wherein the thickness of the lower layer is 0.05 ?m or more; the thickness of the upper layer is 0.005 ?m or more and 0.

Abstract: The present invention provides a monolithic integrated lattice mismatched crystal template and a preparation method thereof by using low-viscosity material, the preparation method for the crystal template includes: providing a first crystal layer with a first lattice constant; growing a buffer layer on the first crystal layer; below the melting point of the buffer layer, growing a second crystal layer and a template layer by sequentially performing the growth process of a second crystal layer and the growth process of a first template layer on the buffer layer, or growing a template layer by directly performing a first template layer growth process on the buffer layer; melting and converting the buffer layer to an amorphous state, performing a second template layer growth process on the template layer grown by the first template layer growth process at the growth temperature above the glass transition temperature of the buffer layer, sequentially growing a template layer until the lattice of the template laye

Abstract: There are provided a metal material for electronic component which has low insertability/extractability, low whisker formability, and high durability, and a method for manufacturing the metal material. The metal material 10 for electronic components has a base material 11, an A layer 14 constituting a surface layer on the base material 11 and formed of Sn, In or an alloy thereof, and a B layer 13 constituting a middle layer provided between the base material 11 and the A layer 14 and formed of Ag, Au, Pt, Pd, Ru, Rh, Os, Ir or an alloy thereof, wherein the surface layer (A layer) 14 has a thickness of 0.002 to 0.2 ?m, and the middle layer (B layer) 13 has a thickness of 0.001 to 0.3 ?m.

Abstract: An aluminium alloy sheet product or extruded product for fluxless brazing, including an aluminium alloy core having on at least one face an aluminium filler clad layer containing 4% to 15% of Si, the filler clad layer having an inner-surface and an outer-surface, the inner-surface is facing the aluminium alloy core and the outer-surface is facing a coating layer of 2 to 45 mg/sq.m of Bi or of a Bi-based alloy. Furthermore, a method of brazing a brazed assembly incorporating at least one member made from the brazing sheet material.

Abstract: A first material with a known maximum temperature of operation is coated with a second material on at least one surface of the first material. The coating has a melting temperature that is greater than the maximum temperature of operation of the first material. The coating is heated to its melting temperature until the coating flows into any cracks in the first material's surface.

Abstract: A thermal interface material (TIM) assembly is provided for use in conducting heat away from heat generating components. The TIM assembly generally includes a substrate, a metal alloy coupled to at least one side surface of the substrate, and a coating material covering at least part of the substrate and at least part of the metal alloy. The substrate may include a metal foil, a heat dissipating unit, a heat generating component, etc. The metal alloy may include a low melting metal alloy coupled to the substrate to form multiple bumps along the substrate in a pattern. The pattern may be generic such that the TIM assembly may be used with multiple different heat generating components to effectively conduct heat away from the multiple different heat generating components, or it may correspond to particular locations on a heat generating component away from which heat is to be conducted.

Abstract: A slide member is provided with a base material and an overlay provided over the base material. The overlay includes a plurality of regions in a thickness direction including a region located in sliding-surface side that slides with the counter element and a region located in a base-material side. A material forming the overlay includes a plurality of crystal planes. Orientation index of at least one of the crystal planes differs in the region located in the sliding-surface side and the region located in the base-material side of the overlay.

Abstract: Magnetic materials and methods exhibit large magnetic-field-induced deformation/strain (MFIS) through the magnetic-field-induced motion of crystallographic interfaces. The preferred materials are porous, polycrystalline composite structures of nodes connected by struts wherein the struts may be monocrystalline or polycrystalline. The materials are preferably made from magnetic shape memory alloy, including polycrystalline Ni—Mn—Ga, formed into an open-pore foam, for example, by space-holder technique. Removal of constraints that interfere with MFIS has been accomplished by introducing pores with sizes similar to grains, resulting in MFIS values of 0.12% in polycrystalline Ni—Mn—Ga foams, close to the best commercial magnetostrictive materials. Further removal of constraints has been accomplished by introducing pores smaller than the grain size, dramatically increasing MFIS to 2.0-8.7%.

Abstract: The invention is an apparatus and method for forming highly uniform layers of metal on a substrate by electro-deposition. The substrate is electroplated in a bath composed of a quiescent (i.e., no external agitation) electrolyte solution using an effective constant current density carefully selected to match the chemical composition of the electrolyte.

Abstract: In joining a magnesium alloy material 1 (first material) and a steel material (second material), a zinc-plated steel plate 2 plated with zinc (metal C) is used as a steel material, Al (metal D) is added to the magnesium alloy material 1. Next, eutectic melting of Mg and Zn is caused so as to remove a product produced by the eutectic melting with an oxide film 1f and impurities from a joint interface. Moreover, an Al—Mg system intermetallic compound such as Al3Mg2 and an Fe—Al system intermetallic compound such as FeAl3 are produced, whereby regenerated surfaces of both materials 1 and 2 are joined via a compound layer 3 containing those intermetallic compounds.

Abstract: Provided by the present invention is a laminated structure with good use efficiency, in which diffusion of tin from an indium-tin solder material to an indium target is favorably suppressed, and a method for producing the same. The laminated structure has a backing plate, an indium-tin solder material, and an indium target laminated in this order, and the concentration of tin in the 2.5 to 3.0 mm thickness range of the indium target from the indium-tin solder material side surface is 5 wtppm or less.

Abstract: Object is to provide a surface-treated copper foil free from chromium in the surface-treatment layer and excellent in peel strength of a circuit and chemical resistance against to degradation of the peel strength after processing into a printed wiring board. To achieve the object, the surface-treated copper foil having a surface-treatment layer on a bonding surface of a copper foil for manufacturing a copper-clad laminate by laminating it to an insulating resin substrate has the surface-treatment layer formed by depositing a metal component having high melting point not lower than 1400° C. by dry process film formation method to the bonding surface of the copper foil after the cleaning treatment and further depositing a carbon component to the surface.

Abstract: A coated article includes a substrate, a catalyst layer, a bonding layer and a hydrophobic layer. The catalyst layer made of tin is formed on the substrate. The bonding layer is formed on the catalyst layer, including titanium, tin, stannic oxide and titanium dioxide. The hydrophobic layer made of silicon-nitrogen is formed on the bonding layer.

Abstract: Methods of coating a magnesium substrate are provided along with coated magnesium substrates. A low melting point material is cold sprayed onto a region of the magnesium substrate. A corrosion resistant material or a zinc material is cold sprayed over at least a portion of the low melting point material to form a coated magnesium substrate. The coated magnesium substrate is then heated.

Abstract: The present invention provides a multi-layered structure, where contamination of impurities into indium target is excellently prevented, and manufacturing method thereof. The multi-layered structure comprises: a backing plate, an impurity diffusion prevention layer, comprising thin film consisting of one or more metals selected from Fe, W, Ta, Te, Nb, Mo, S and Si, formed on the backing plate, and an indium target, formed on the impurity diffusion prevention layer.

Abstract: A slide member including a base material; and an overlay that is formed over the base material and that consists of Ag or Ag alloy including crystal planes (hk1) represented by Miller indices; wherein a relative X-ray diffraction intensity of crystal plane (200) to a sum of X-ray diffraction intensities of crystal planes (200), (111), (220), (311), and (222) of the overlay ranges between 1%?(200)/{(200)+(111)+(220)+(311)+(222)}?20% and the relative X-ray diffraction intensity of the crystal plane (200) to the X-ray diffraction intensity of the crystal plane (111) ranges between 1%?(200)/(111)?30%.

Abstract: A bonding material that has a melting temperature of 270° C. or higher and that does not contain lead is inexpensively provided. An electronic element and an electrode of an electronic component are bonded using a bonding material containing an alloy that contains Bi as the main component and that contains 0.2 to 0.8 wt % Cu and 0.02 to 0.2 wt % Ge.

Abstract: A slide member including a base material; an intermediate layer consisting of Ag or Ag-based alloy and an additive element of a first quantity formed over the base material; and an overlay comprising Bi or Bi-based alloy and the additive element of a second quantity formed over the intermediate layer, wherein the additive element consists of a low melting point metal, the first quantity being five times or greater than the second quantity.

Abstract: The thermal interface material including a thermally conductive metal a thermally conductive metal having a first surface and an opposing second surface, a diffusion barrier plate coupled to the first surface of the thermally conductive metal and the second surface of the thermally conductive metal, and a thermal resistance reducing layer coupled to the diffusion barrier plate.

Abstract: A process for electroplating high adhesion copper layer on a surface of a highly oxidizable metal in an invariable container, and products produced by this process are provided.

Abstract: A bi-polar plate is provided for a fuel cell stack. The bi-polar plate has improved surface wettability. The bi-polar plate includes a body including at least approximately ninety percent by weight of a metal and defining at least one flow channel. At least about 0.05 percent and up to 100 percent by weight of silicon is disposed on a surface of the at least one flow channel to form a high energy surface to form a high energy surface for the bi-polar plate. This can be achieved by adding from 0.5 to 10 weight % silicon to the steel. The percent of silicon is pre-determined based on a desired wettability of the high energy surface of the at least one flow channel.

Abstract: Firearms and firearm components are constructed from bonded multi-metallic base materials comprising at least two dissimilar metallic materials having different properties, such as weight, density, wear resistance, durability, hardness, and the like, bonded to one another. The components are fabricated such that the metallic material having higher impact- and wear-resistance is positioned at areas that experience impact, or that include bearing points, wear points, and interfaces with other components, while a lighter weight metallic material is positioned at component locations that don't have rigorous material property requirements. The bonded multi-metallic materials may be explosively bonded multi-metallic materials.

Abstract: A metallic article with improved fatigue performance and resistance to corrosive attack and stress corrosion cracking is produced by treating a first area of a metallic article with a first surface treatment that induces a specified amount of cold work. A second, sacrificial area of the metallic article in electrical communication with the first area is treated with a second surface treatment that induces an amount of cold work higher than that of the first surface treatment. Due to the differences in cold work resulting from the different surface treatments, the second area of the metallic article is less noble than the first area and is therefore more susceptible to corrosive attack. As a result, the second sacrificial area will preferentially corrode leaving the first area protected from corrosive attack. Compressive residual stresses induced in the surface of the metallic article through the surface treatments improve the fatigue performance and resistance to stress corrosion cracking.

Abstract: The present invention is hybrid liquid metal-solder thermal interface. In one embodiment, a thermal interface for coupling a heat generating device to a heat sink includes a first metal interface layer, a second metal interface layer, and an isolation layer positioned between the first metal interface layer and the second metal interface layer, where at least one of the first metal interface layer and the second metal interface layer comprises a liquid metal.

Abstract: A method for forming a nickel aluminide based coating on a metallic substrate includes providing a first source for providing a significant portion of the aluminum content for a coating precursor and a separate nickel alloy source for providing substantially all the nickel and additional alloying elements for the coating precursor. Cathodic arc (ion plasma) deposition techniques may be utilized to provide the coating precursor on a metallic substrate. The coating precursor may be provided in discrete layers, or from a co-deposition process. Subsequent processing or heat treatment forms the nickel aluminide based coating from the coating precursor.

Abstract: A magnetic materials construct and a method to produce the construct are disclosed. The construct exhibits large magnetic-field-induced deformation through the magnetic-field-induced motion of crystallographic interfaces. The construct is a porous, polycrystalline composite structure of nodes connected by struts wherein the struts may be monocrystalline or polycrystalline. If the struts are polycrystalline, they have a “bamboo” microstructure wherein the grain boundaries traverse the entire width of the strut. The material from which the construct is made is preferably a magnetic shape memory alloy, including polycrystalline Ni—Mn—Ga. The construct is preferably an open-pore foam. The foam is preferably produced with a space-holder technique. Space holders may be dissolvable ceramics and salts including NaAlO2.

Abstract: Disclosed herein is a carrier for manufacturing a substrate, including: two insulation layers, each being provided on one side thereof with a first metal layer and on the other side thereof with a second metal layer; and a third metal layer having a lower melting point than the first metal layer and formed between the two first metal layers respectively formed on the two insulation layers such that the two first metal layers are attached to each other. The carrier is advantageous in that the carrier can be separated by heating the third metal layer, so that the size of a substrate does not change at the time of separating the carrier, thereby maintaining the compatibility between a substrate and manufacturing facilities.

Abstract: Disclosed herein is a carrier for manufacturing a substrate, including: an insulation layer including a first metal layer formed on one side or both sides thereof; a second metal layer formed on one side of the first metal layer; and a third metal layer formed on one side of the second metal layer, wherein the second metal layer has a lower melting point than the first metal layer or the third metal layer. The carrier is advantageous in that a build up layer can be separated from a carrier by heating, so that a routing process is not required, with the result that the size of a substrate does not change when the build up layer is separated from the carrier, thereby reusing the carrier and maintaining the compatibility between the substrate and manufacturing facilities.

Abstract: In an Al composite material collapsible in the presence of moisture, the external surface of small pieces or powder constructed from a single or a plurality of crystalline grains of Al or an Al alloy is covered with a film of a low melting point metal or alloy selected from the group consisting of In, Sn, combinations of In and Sn, and alloys thereof. The content of the foregoing low melting point metal or alloy ranges from 0.1 to 20% by mass on the basis of the total mass of the composite material. A component member for a film-forming chamber is also provided, which is provided with a water-collapsible Al film on the surface thereof. Film-forming operations are continued over a long period of time using the component member for a film-forming chamber provided with the water-collapsible Al film and then film-forming materials can be recovered from the component member on which the film-forming materials are deposited in a substantial thickness.

Abstract: A resin product (e.g., a millimeter-wave radar device cover) comprises a plate-like resin substrate, a base film formed on the resin substrate, and a metallic gloss film having a discontinuous structure formed on the base film, a top coat, a block coat, or the like being formed as a protective film on the metal film. The metal film contains a first film having a discontinuous structure obtainable by vacuum deposition of a first metal, a modified surface obtainable by modification of the surface of the first film by bringing the surface into contact with air, and a second film having a discontinuous structure obtainable by vacuum deposition of a second metal on the modified surface.

Abstract: This invention provides a metal material with a bismuth coating being enables the subsequent coating to be accomplished at a high throwing power, and has excellent corrosion resistance, coating adhesion, and, being able to be produced with reduced damage to the environment, the metal material having a surface and a bismuth-containing layer deposited on at least a part of the surface of the metal material, wherein a percentage of bismuth atoms in number of atoms in the surface layer of the metal material with a bismuth coating is at least 10%.

Abstract: A first material with a known maximum temperature of operation is coated with a second material on at least one surface of the first material. The coating has a melting temperature that is greater than the maximum temperature of operation of the first material. The coating is heated to its melting temperature until the coating flows into any cracks in the first material's surface.

Abstract: There is provided a plating structure obtained by heat-treating a silver-plated structure obtained by forming a tin-plated layer, an indium-plated layer, or a zinc-plated layer, having a thickness of 0.001 to 0.1 ?m, on a surface of the silver-plated layer formed on a surface of a plating base. There is also provided a coating method for obtaining the plating structure which comprises the step of melting a particle deposit spottedly deposited at 2×10?6 to 8×10?6 g/cm2 such that the spot-deposited particles have gaps therebetween as viewed above and the particles each having an average diameter of 20 to 80 nm do not pile up in a direction perpendicular to the surface of the silver layer to obtain a film.

Abstract: The invention describes a multi-layered bearing with a supporting metal layer, optionally a bearing metal layer disposed on top of it, an anti-friction layer on top of the latter as well as a wearing layer on top of it. The wearing layer is made from bismuth or a bismuth alloy and the anti-friction layer is made from a copper-bismuth or silver-bismuth alloy or silver.

Abstract: A sliding bearing element is characterized in that a bearing material that is bonded to the backing is disposed at least at the edges of the backing in form of wires in the circumferential direction and that a soft material is located at least in a space between said wires. At least one intermediate wire can be disposed between the two edge wires generally running in the circumferential direction. The method comprises the following processing steps: providing a strip of steel or any other material having the required degree of strength which forms the backing of the bearing to be produced, bonding at least one wire at each of the two edges of the backing strip, whereat disposing the wires in such a manner that said wires run in circumferential direction generally, and filling out the spaces between the wires with soft material.

Abstract: A slide member including a base material; an intermediate layer consisting of Ag or Ag-based alloy and an additive element of a first quantity formed over the base material; and an overlay comprising Bi or Bi-based alloy and the additive element of a second quantity formed over the intermediate layer, wherein the additive element consists of a low melting point metal, the first quantity being five times or greater than the second quantity.

Abstract: One aspect is a coil including a laminate having metal layers. The coil is configured for the electrical connection of stimulation electrodes. One of the metal layers exhibits good electrical conductivity and another metal layer great mechanical strength.

Abstract: An optical disc having at least two metal-containing layers with different compositions and partially overlapping areal extents in the plane of the disc and method of forming the disc are described. The optical disc with dual metallization exhibits visually distinct regions suitable for use for identification purposes.

Abstract: The present invention provides a metallic coating having a sheen and having a discontinuous structure at high productivity and low cost by using sputtering. A resin product includes a resin base material, and a metallic coating having a sheen and a discontinuous structure that is deposited on the resin base material so as to include a portion in which a high-formation metal that relatively readily forms a discontinuous structure when using vacuum vapor deposition is sputtered, and thereafter, a low-formation metal that does not relatively readily form a discontinuous structure when using vacuum vapor deposition is sputtered. The high-formation metal and the low-formation metal are selected from at least two species of metals whose crystal structures are identical and whose lattice constant difference is within 10%.

Abstract: Phase change memory materials and more particularly GeAs telluride materials useful for phase change memory applications, for example, optical and electronic data storage are described.

Abstract: Relating to a thin film lamination and a thin film magnetic sensor using the thin film lamination and a method for manufacturing the thin film lamination that realizes a thin film conducting layer having high electron mobility and sheet resistance as an InAsSb operating layer. A thin film lamination is provided which is characterized by having an AlxIn1-xSb mixed crystal layer formed on a substrate, and an InAsxSb1-x (0<x?1) thin film conducting layer directly formed on the AlxIn1-xSb layer, in which the AlxIn1-xSb mixed crystal layer is a layer that exhibits higher resistance than the InAsxSb1-x thin film conducting layer or exhibits insulation or p-type conductivity, and its band gap is greater than the InAsxSb1-x thin film conducting layer, and the a lattice mismatch is +1.3% to ?0.8%.

Abstract: A method of processing an article includes mechanically working an article having a metallic layer disposed on a titanium substrate and establishing a residual stress region that extends through the metallic layer and at least partially into the titanium substrate.