Ga-, In-, Tl- Or Group Va Metal-base Component Patents (Class 428/642)
  • Patent number: 9540705
    Abstract: The present invention resides in a method of manufacturing a bearing ring (101) for a rolling element bearing, wherein the bearing ring comprises a bearing race (102) made of a bearing grade steel and an overmolded part (106) that is preferably made of a lightweight metal such as aluminum or a thermoplastic material such as polyamide. According to the invention, the method comprises a step of hardening at least a raceway surface (103) of the bearing race prior to a step of joining the overmolded part (106) to the bearing race (102) in a molding process. In a further development, the method comprises a step of temperature control, to ensure that the temperature of the raceway surface (103) is kept below a predetermined value during the molding process.
    Type: Grant
    Filed: March 19, 2009
    Date of Patent: January 10, 2017
    Assignee: AKTIEBOLAGET SKF
    Inventors: Cornelius Petrus Antonius Vissers, Hendrikus Jan Kapaan, Johannes Franciscus Van De Sanden, Jacobus Zwarts
  • Patent number: 9217468
    Abstract: A slide member is provided with a base material and an overlay provided over the base material. The overlay includes a plurality of regions in a thickness direction including a region located in sliding-surface side that slides with the counter element and a region located in a base-material side. A material forming the overlay includes a plurality of crystal planes. Orientation index of at least one of the crystal planes differs in the region located in the sliding-surface side and the region located in the base-material side of the overlay.
    Type: Grant
    Filed: February 10, 2012
    Date of Patent: December 22, 2015
    Assignee: DAIDO METAL COMPANY LTD.
    Inventors: Hiroyuki Asakura, Mikihito Yasui, Shigeya Haneda, Satoshi Takayanagi, Tatsuo Yamada
  • Publication number: 20150147924
    Abstract: The present invention provides metallic materials for electronic components, having low degree of whisker formation, low adhesive wear property and high durability, and connector terminals, connectors and electronic components using such metallic materials.
    Type: Application
    Filed: June 27, 2013
    Publication date: May 28, 2015
    Applicant: JX Nippon Mining & Metals Corporation
    Inventors: Yoshitaka Shibuya, Kazuhiko Fukamachi, Atsushi Kodama
  • Publication number: 20150140357
    Abstract: A contact layer for an electrical contact is disclosed having bismuth and being tin-free.
    Type: Application
    Filed: January 30, 2015
    Publication date: May 21, 2015
    Applicant: TYCO ELECTRONICS AMP GMBH
    Inventors: Helge Schmidt, Stefan Thoss
  • Patent number: 9023487
    Abstract: Provided by the present invention is a laminated structure with good use efficiency, in which diffusion of tin from an indium-tin solder material to an indium target is favorably suppressed, and a method for producing the same. The laminated structure has a backing plate, an indium-tin solder material, and an indium target laminated in this order, and the concentration of tin in the 2.5 to 3.0 mm thickness range of the indium target from the indium-tin solder material side surface is 5 wtppm or less.
    Type: Grant
    Filed: July 25, 2012
    Date of Patent: May 5, 2015
    Assignee: JX Nippon Mining & Metals Corporation
    Inventors: Yousuke Endo, Masaru Sakamoto
  • Publication number: 20150047879
    Abstract: The present invention provides a metallic material for electronic components having a low degree of whisker formation and a high durability, and connector terminals, connectors and electronic components using the metallic material. The metallic material for electronic components includes: a base material; on the base material, an lower layer constituted with one or two or more selected from the group consisting of Ni, Cr, Mn, Fe, Co and Cu; on the lower layer, an upper layer constituted with an alloy composed of one or both of Sn and In (constituent elements A) and one or two or more of Ag, Au, Pt, Pd, Ru, Rh, Os and Ir (constituent elements B), wherein the thickness of the lower layer is 0.05 ?m or more; the thickness of the upper layer is 0.005 ?m or more and 0.
    Type: Application
    Filed: January 25, 2013
    Publication date: February 19, 2015
    Inventors: Yoshitaka Shibuya, Kazuhiko Fukamachi, Atsushi Kodama
  • Publication number: 20150024223
    Abstract: The present invention provides a monolithic integrated lattice mismatched crystal template and a preparation method thereof by using low-viscosity material, the preparation method for the crystal template includes: providing a first crystal layer with a first lattice constant; growing a buffer layer on the first crystal layer; below the melting point of the buffer layer, growing a second crystal layer and a template layer by sequentially performing the growth process of a second crystal layer and the growth process of a first template layer on the buffer layer, or growing a template layer by directly performing a first template layer growth process on the buffer layer; melting and converting the buffer layer to an amorphous state, performing a second template layer growth process on the template layer grown by the first template layer growth process at the growth temperature above the glass transition temperature of the buffer layer, sequentially growing a template layer until the lattice of the template laye
    Type: Application
    Filed: April 6, 2012
    Publication date: January 22, 2015
    Applicant: SHANGHAI INSTITUTE OF MICROSYSTEM AND INFORMATION TECHNOLOGY, CHINESE ACADEMY
    Inventor: Shumin Wang
  • Publication number: 20140329107
    Abstract: There are provided a metal material for electronic component which has low insertability/extractability, low whisker formability, and high durability, and a method for manufacturing the metal material. The metal material 10 for electronic components has a base material 11, an A layer 14 constituting a surface layer on the base material 11 and formed of Sn, In or an alloy thereof, and a B layer 13 constituting a middle layer provided between the base material 11 and the A layer 14 and formed of Ag, Au, Pt, Pd, Ru, Rh, Os, Ir or an alloy thereof, wherein the surface layer (A layer) 14 has a thickness of 0.002 to 0.2 ?m, and the middle layer (B layer) 13 has a thickness of 0.001 to 0.3 ?m.
    Type: Application
    Filed: September 10, 2012
    Publication date: November 6, 2014
    Applicant: JX NIPPON MINING & METALS CORPORATION
    Inventors: Yoshitaka Shibuya, Kazuhiko Fukamachi, Atsushi Kodama
  • Publication number: 20140246483
    Abstract: An aluminium alloy sheet product or extruded product for fluxless brazing, including an aluminium alloy core having on at least one face an aluminium filler clad layer containing 4% to 15% of Si, the filler clad layer having an inner-surface and an outer-surface, the inner-surface is facing the aluminium alloy core and the outer-surface is facing a coating layer of 2 to 45 mg/sq.m of Bi or of a Bi-based alloy. Furthermore, a method of brazing a brazed assembly incorporating at least one member made from the brazing sheet material.
    Type: Application
    Filed: November 9, 2012
    Publication date: September 4, 2014
    Applicant: ALERIS ROLLED PRODUCTS GERMANY GMBH
    Inventors: Adrianus Jacobus Wittebrood, Steven Kirkham, Achim Bürger, Klaus Vieregge
  • Patent number: 8679642
    Abstract: A first material with a known maximum temperature of operation is coated with a second material on at least one surface of the first material. The coating has a melting temperature that is greater than the maximum temperature of operation of the first material. The coating is heated to its melting temperature until the coating flows into any cracks in the first material's surface.
    Type: Grant
    Filed: September 26, 2013
    Date of Patent: March 25, 2014
    Assignee: The United States of America as represented by the Administrator of the National Aeronautics and Space Administration
    Inventors: Stephen W. Smith, John A. Newman, Robert S. Piascik, Edward H. Glaessgen
  • Patent number: 8647752
    Abstract: A thermal interface material (TIM) assembly is provided for use in conducting heat away from heat generating components. The TIM assembly generally includes a substrate, a metal alloy coupled to at least one side surface of the substrate, and a coating material covering at least part of the substrate and at least part of the metal alloy. The substrate may include a metal foil, a heat dissipating unit, a heat generating component, etc. The metal alloy may include a low melting metal alloy coupled to the substrate to form multiple bumps along the substrate in a pattern. The pattern may be generic such that the TIM assembly may be used with multiple different heat generating components to effectively conduct heat away from the multiple different heat generating components, or it may correspond to particular locations on a heat generating component away from which heat is to be conducted.
    Type: Grant
    Filed: June 16, 2010
    Date of Patent: February 11, 2014
    Assignee: Laird Technologies, Inc.
    Inventors: Jason L Strader, Richard F Hill
  • Publication number: 20130316189
    Abstract: A slide member is provided with a base material and an overlay provided over the base material. The overlay includes a plurality of regions in a thickness direction including a region located in sliding-surface side that slides with the counter element and a region located in a base-material side. A material forming the overlay includes a plurality of crystal planes. Orientation index of at least one of the crystal planes differs in the region located in the sliding-surface side and the region located in the base-material side of the overlay.
    Type: Application
    Filed: February 10, 2012
    Publication date: November 28, 2013
    Applicant: DAIDO METAL COMPANY LTD.
    Inventors: Hiroyuki Asakura, Mikihito Yasui, Shigeya Haneda, Satoshi Takayanagi, Tatsuo Yamada
  • Patent number: 8586194
    Abstract: Magnetic materials and methods exhibit large magnetic-field-induced deformation/strain (MFIS) through the magnetic-field-induced motion of crystallographic interfaces. The preferred materials are porous, polycrystalline composite structures of nodes connected by struts wherein the struts may be monocrystalline or polycrystalline. The materials are preferably made from magnetic shape memory alloy, including polycrystalline Ni—Mn—Ga, formed into an open-pore foam, for example, by space-holder technique. Removal of constraints that interfere with MFIS has been accomplished by introducing pores with sizes similar to grains, resulting in MFIS values of 0.12% in polycrystalline Ni—Mn—Ga foams, close to the best commercial magnetostrictive materials. Further removal of constraints has been accomplished by introducing pores smaller than the grain size, dramatically increasing MFIS to 2.0-8.7%.
    Type: Grant
    Filed: July 20, 2010
    Date of Patent: November 19, 2013
    Assignees: Boise State University, Northwestern University
    Inventors: Peter Mullner, Markus Chmielus, Cassie Witherspoon, David C. Dunand, Xuexi Zhang, Yuttanant Boonyongmaneerat
  • Publication number: 20130252020
    Abstract: The invention is an apparatus and method for forming highly uniform layers of metal on a substrate by electro-deposition. The substrate is electroplated in a bath composed of a quiescent (i.e., no external agitation) electrolyte solution using an effective constant current density carefully selected to match the chemical composition of the electrolyte.
    Type: Application
    Filed: December 6, 2011
    Publication date: September 26, 2013
    Inventor: George Hradil
  • Patent number: 8492005
    Abstract: In joining a magnesium alloy material 1 (first material) and a steel material (second material), a zinc-plated steel plate 2 plated with zinc (metal C) is used as a steel material, Al (metal D) is added to the magnesium alloy material 1. Next, eutectic melting of Mg and Zn is caused so as to remove a product produced by the eutectic melting with an oxide film 1f and impurities from a joint interface. Moreover, an Al—Mg system intermetallic compound such as Al3Mg2 and an Fe—Al system intermetallic compound such as FeAl3 are produced, whereby regenerated surfaces of both materials 1 and 2 are joined via a compound layer 3 containing those intermetallic compounds.
    Type: Grant
    Filed: January 16, 2009
    Date of Patent: July 23, 2013
    Assignee: Nissan Motor Co., Ltd.
    Inventors: Shigeyuki Nakagawa, Kenji Miyamoto, Minoru Kasukawa, Masao Aihara, Sadao Yanagida, Akio Hirose
  • Publication number: 20130143069
    Abstract: Provided by the present invention is a laminated structure with good use efficiency, in which diffusion of tin from an indium-tin solder material to an indium target is favorably suppressed, and a method for producing the same. The laminated structure has a backing plate, an indium-tin solder material, and an indium target laminated in this order, and the concentration of tin in the 2.5 to 3.0 mm thickness range of the indium target from the indium-tin solder material side surface is 5 wtppm or less.
    Type: Application
    Filed: July 25, 2012
    Publication date: June 6, 2013
    Applicant: JX NIPPON MINING & METALS CORPORATION
    Inventors: Yousuke Endo, Masaru Sakamoto
  • Patent number: 8394509
    Abstract: Object is to provide a surface-treated copper foil free from chromium in the surface-treatment layer and excellent in peel strength of a circuit and chemical resistance against to degradation of the peel strength after processing into a printed wiring board. To achieve the object, the surface-treated copper foil having a surface-treatment layer on a bonding surface of a copper foil for manufacturing a copper-clad laminate by laminating it to an insulating resin substrate has the surface-treatment layer formed by depositing a metal component having high melting point not lower than 1400° C. by dry process film formation method to the bonding surface of the copper foil after the cleaning treatment and further depositing a carbon component to the surface.
    Type: Grant
    Filed: June 26, 2009
    Date of Patent: March 12, 2013
    Assignee: Mitsui Mining & Smelting Co., Ltd.
    Inventors: Seiji Nagatani, Hiroshi Watanabe, Kazufumi Izumida
  • Patent number: 8388815
    Abstract: A coated article includes a substrate, a catalyst layer, a bonding layer and a hydrophobic layer. The catalyst layer made of tin is formed on the substrate. The bonding layer is formed on the catalyst layer, including titanium, tin, stannic oxide and titanium dioxide. The hydrophobic layer made of silicon-nitrogen is formed on the bonding layer.
    Type: Grant
    Filed: June 7, 2011
    Date of Patent: March 5, 2013
    Assignees: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.
    Inventors: Hsin-Pei Chang, Wen-Rong Chen, Huann-Wu Chiang, Cheng-Shi Chen, Jia Huang
  • Publication number: 20130029177
    Abstract: Methods of coating a magnesium substrate are provided along with coated magnesium substrates. A low melting point material is cold sprayed onto a region of the magnesium substrate. A corrosion resistant material or a zinc material is cold sprayed over at least a portion of the low melting point material to form a coated magnesium substrate. The coated magnesium substrate is then heated.
    Type: Application
    Filed: July 27, 2011
    Publication date: January 31, 2013
    Applicant: GM Global Technology Operations LLC
    Inventor: Guangling Song
  • Publication number: 20120270065
    Abstract: The present invention provides a multi-layered structure, where contamination of impurities into indium target is excellently prevented, and manufacturing method thereof. The multi-layered structure comprises: a backing plate, an impurity diffusion prevention layer, comprising thin film consisting of one or more metals selected from Fe, W, Ta, Te, Nb, Mo, S and Si, formed on the backing plate, and an indium target, formed on the impurity diffusion prevention layer.
    Type: Application
    Filed: May 12, 2011
    Publication date: October 25, 2012
    Inventors: Takamasa Maekawa, Toshiya Kurihara, Takashi Kosho
  • Patent number: 8273465
    Abstract: A slide member including a base material; and an overlay that is formed over the base material and that consists of Ag or Ag alloy including crystal planes (hk1) represented by Miller indices; wherein a relative X-ray diffraction intensity of crystal plane (200) to a sum of X-ray diffraction intensities of crystal planes (200), (111), (220), (311), and (222) of the overlay ranges between 1%?(200)/{(200)+(111)+(220)+(311)+(222)}?20% and the relative X-ray diffraction intensity of the crystal plane (200) to the X-ray diffraction intensity of the crystal plane (111) ranges between 1%?(200)/(111)?30%.
    Type: Grant
    Filed: March 24, 2010
    Date of Patent: September 25, 2012
    Assignee: Daido Metal Company Ltd.
    Inventors: Manabu Izumida, Hideo Tsuji
  • Patent number: 8227090
    Abstract: A bonding material that has a melting temperature of 270° C. or higher and that does not contain lead is inexpensively provided. An electronic element and an electrode of an electronic component are bonded using a bonding material containing an alloy that contains Bi as the main component and that contains 0.2 to 0.8 wt % Cu and 0.02 to 0.2 wt % Ge.
    Type: Grant
    Filed: May 18, 2007
    Date of Patent: July 24, 2012
    Assignee: Panasonic Corporation
    Inventors: Akio Furusawa, Kenichiro Suetsugu, Shigeki Sakaguchi, Kimiaki Nakaya
  • Patent number: 8216692
    Abstract: A slide member including a base material; an intermediate layer consisting of Ag or Ag-based alloy and an additive element of a first quantity formed over the base material; and an overlay comprising Bi or Bi-based alloy and the additive element of a second quantity formed over the intermediate layer, wherein the additive element consists of a low melting point metal, the first quantity being five times or greater than the second quantity.
    Type: Grant
    Filed: April 15, 2010
    Date of Patent: July 10, 2012
    Assignee: Daido Metal Company Ltd.
    Inventors: Mikihito Yasui, Hideo Tsuji, Hiroyuki Asakura
  • Publication number: 20120063103
    Abstract: The thermal interface material including a thermally conductive metal a thermally conductive metal having a first surface and an opposing second surface, a diffusion barrier plate coupled to the first surface of the thermally conductive metal and the second surface of the thermally conductive metal, and a thermal resistance reducing layer coupled to the diffusion barrier plate.
    Type: Application
    Filed: September 10, 2010
    Publication date: March 15, 2012
    Inventor: Graham Charles Kirk
  • Publication number: 20120028073
    Abstract: A process for electroplating high adhesion copper layer on a surface of a highly oxidizable metal in an invariable container, and products produced by this process are provided.
    Type: Application
    Filed: February 11, 2010
    Publication date: February 2, 2012
    Applicant: Technion Research & Development Foundation Ltd.
    Inventors: Yair Ein-Eli, Nina Sezin, David Starosvetsky
  • Patent number: 8097377
    Abstract: A bi-polar plate is provided for a fuel cell stack. The bi-polar plate has improved surface wettability. The bi-polar plate includes a body including at least approximately ninety percent by weight of a metal and defining at least one flow channel. At least about 0.05 percent and up to 100 percent by weight of silicon is disposed on a surface of the at least one flow channel to form a high energy surface to form a high energy surface for the bi-polar plate. This can be achieved by adding from 0.5 to 10 weight % silicon to the steel. The percent of silicon is pre-determined based on a desired wettability of the high energy surface of the at least one flow channel.
    Type: Grant
    Filed: January 27, 2006
    Date of Patent: January 17, 2012
    Inventors: Keith E. Newman, Mahmoud H. Abd Elhamid, Charles H. Olk, Thomas A. Trabold, Gayatri Vyas
  • Publication number: 20110314718
    Abstract: Firearms and firearm components are constructed from bonded multi-metallic base materials comprising at least two dissimilar metallic materials having different properties, such as weight, density, wear resistance, durability, hardness, and the like, bonded to one another. The components are fabricated such that the metallic material having higher impact- and wear-resistance is positioned at areas that experience impact, or that include bearing points, wear points, and interfaces with other components, while a lighter weight metallic material is positioned at component locations that don't have rigorous material property requirements. The bonded multi-metallic materials may be explosively bonded multi-metallic materials.
    Type: Application
    Filed: June 25, 2010
    Publication date: December 29, 2011
    Applicant: PACIFIC AEROSPACE & ELECTRONICS, INC.
    Inventor: Nelson Clare SETTLES
  • Patent number: 8033152
    Abstract: A metallic article with improved fatigue performance and resistance to corrosive attack and stress corrosion cracking is produced by treating a first area of a metallic article with a first surface treatment that induces a specified amount of cold work. A second, sacrificial area of the metallic article in electrical communication with the first area is treated with a second surface treatment that induces an amount of cold work higher than that of the first surface treatment. Due to the differences in cold work resulting from the different surface treatments, the second area of the metallic article is less noble than the first area and is therefore more susceptible to corrosive attack. As a result, the second sacrificial area will preferentially corrode leaving the first area protected from corrosive attack. Compressive residual stresses induced in the surface of the metallic article through the surface treatments improve the fatigue performance and resistance to stress corrosion cracking.
    Type: Grant
    Filed: June 10, 2010
    Date of Patent: October 11, 2011
    Assignee: Surface Technology Holdings, Ltd.
    Inventor: Paul S. Prevey III
  • Publication number: 20110240279
    Abstract: The present invention is hybrid liquid metal-solder thermal interface. In one embodiment, a thermal interface for coupling a heat generating device to a heat sink includes a first metal interface layer, a second metal interface layer, and an isolation layer positioned between the first metal interface layer and the second metal interface layer, where at least one of the first metal interface layer and the second metal interface layer comprises a liquid metal.
    Type: Application
    Filed: March 30, 2010
    Publication date: October 6, 2011
    Applicant: International Business Machines Corporation
    Inventors: BRUCE K. Furman, Paul A. Lauro, Yves C. Martin, Robert L. Sandstrom, Da-Yuan Shih, Theodore G. Van Kessel
  • Publication number: 20110151274
    Abstract: A method for forming a nickel aluminide based coating on a metallic substrate includes providing a first source for providing a significant portion of the aluminum content for a coating precursor and a separate nickel alloy source for providing substantially all the nickel and additional alloying elements for the coating precursor. Cathodic arc (ion plasma) deposition techniques may be utilized to provide the coating precursor on a metallic substrate. The coating precursor may be provided in discrete layers, or from a co-deposition process. Subsequent processing or heat treatment forms the nickel aluminide based coating from the coating precursor.
    Type: Application
    Filed: June 30, 2010
    Publication date: June 23, 2011
    Inventors: Brian Thomas Hazel, Don Mark Lipkin, Michael Howard Rucker, Rudolfo Viguie
  • Patent number: 7964290
    Abstract: A magnetic materials construct and a method to produce the construct are disclosed. The construct exhibits large magnetic-field-induced deformation through the magnetic-field-induced motion of crystallographic interfaces. The construct is a porous, polycrystalline composite structure of nodes connected by struts wherein the struts may be monocrystalline or polycrystalline. If the struts are polycrystalline, they have a “bamboo” microstructure wherein the grain boundaries traverse the entire width of the strut. The material from which the construct is made is preferably a magnetic shape memory alloy, including polycrystalline Ni—Mn—Ga. The construct is preferably an open-pore foam. The foam is preferably produced with a space-holder technique. Space holders may be dissolvable ceramics and salts including NaAlO2.
    Type: Grant
    Filed: September 2, 2008
    Date of Patent: June 21, 2011
    Assignees: Boise State University, Northwestern University
    Inventors: Peter Mullner, Markus Chmielus, David C. Dunand, Yuttanant Boonyongmaneerat
  • Publication number: 20110138621
    Abstract: Disclosed herein is a carrier for manufacturing a substrate, including: an insulation layer including a first metal layer formed on one side or both sides thereof; a second metal layer formed on one side of the first metal layer; and a third metal layer formed on one side of the second metal layer, wherein the second metal layer has a lower melting point than the first metal layer or the third metal layer. The carrier is advantageous in that a build up layer can be separated from a carrier by heating, so that a routing process is not required, with the result that the size of a substrate does not change when the build up layer is separated from the carrier, thereby reusing the carrier and maintaining the compatibility between the substrate and manufacturing facilities.
    Type: Application
    Filed: March 9, 2010
    Publication date: June 16, 2011
    Inventors: Seong Min CHO, Keung Jin SOHN, Tae Kyun BAE, Hyun Jung HONG, Kyung Ah LEE, Chang Gun OH
  • Publication number: 20110139858
    Abstract: Disclosed herein is a carrier for manufacturing a substrate, including: two insulation layers, each being provided on one side thereof with a first metal layer and on the other side thereof with a second metal layer; and a third metal layer having a lower melting point than the first metal layer and formed between the two first metal layers respectively formed on the two insulation layers such that the two first metal layers are attached to each other. The carrier is advantageous in that the carrier can be separated by heating the third metal layer, so that the size of a substrate does not change at the time of separating the carrier, thereby maintaining the compatibility between a substrate and manufacturing facilities.
    Type: Application
    Filed: March 10, 2010
    Publication date: June 16, 2011
    Inventors: Seong Min Cho, Keung Jin Sohn, Chang Gun Oh, Hyun Jung Hong, Tae Kyun Bae
  • Patent number: 7951463
    Abstract: In an Al composite material collapsible in the presence of moisture, the external surface of small pieces or powder constructed from a single or a plurality of crystalline grains of Al or an Al alloy is covered with a film of a low melting point metal or alloy selected from the group consisting of In, Sn, combinations of In and Sn, and alloys thereof. The content of the foregoing low melting point metal or alloy ranges from 0.1 to 20% by mass on the basis of the total mass of the composite material. A component member for a film-forming chamber is also provided, which is provided with a water-collapsible Al film on the surface thereof. Film-forming operations are continued over a long period of time using the component member for a film-forming chamber provided with the water-collapsible Al film and then film-forming materials can be recovered from the component member on which the film-forming materials are deposited in a substantial thickness.
    Type: Grant
    Filed: March 4, 2005
    Date of Patent: May 31, 2011
    Assignee: Ulvac, Inc.
    Inventors: Akisuke Hirata, Shinji Isoda, Yutaka Kadowaki, Katsuhiko Mushiake
  • Patent number: 7939180
    Abstract: A resin product (e.g., a millimeter-wave radar device cover) comprises a plate-like resin substrate, a base film formed on the resin substrate, and a metallic gloss film having a discontinuous structure formed on the base film, a top coat, a block coat, or the like being formed as a protective film on the metal film. The metal film contains a first film having a discontinuous structure obtainable by vacuum deposition of a first metal, a modified surface obtainable by modification of the surface of the first film by bringing the surface into contact with air, and a second film having a discontinuous structure obtainable by vacuum deposition of a second metal on the modified surface.
    Type: Grant
    Filed: November 21, 2006
    Date of Patent: May 10, 2011
    Assignee: Toyoda Gosei Co., Ltd.
    Inventors: Tetsuya Fujii, Chiharu Totani, Hiroshi Watarai, Takayasu Ido
  • Publication number: 20110073484
    Abstract: This invention provides a metal material with a bismuth coating being enables the subsequent coating to be accomplished at a high throwing power, and has excellent corrosion resistance, coating adhesion, and, being able to be produced with reduced damage to the environment, the metal material having a surface and a bismuth-containing layer deposited on at least a part of the surface of the metal material, wherein a percentage of bismuth atoms in number of atoms in the surface layer of the metal material with a bismuth coating is at least 10%.
    Type: Application
    Filed: May 20, 2009
    Publication date: March 31, 2011
    Inventors: Ryosuke Kawagoshi, Hitoshi Ishii
  • Publication number: 20110033728
    Abstract: A first material with a known maximum temperature of operation is coated with a second material on at least one surface of the first material. The coating has a melting temperature that is greater than the maximum temperature of operation of the first material. The coating is heated to its melting temperature until the coating flows into any cracks in the first material's surface.
    Type: Application
    Filed: August 4, 2010
    Publication date: February 10, 2011
    Applicants: Space Administration
    Inventors: Stephen W. Smith, John A. Newman, Robert S. Piascik, Edward H. Glaesgen
  • Publication number: 20110012497
    Abstract: There is provided a plating structure obtained by heat-treating a silver-plated structure obtained by forming a tin-plated layer, an indium-plated layer, or a zinc-plated layer, having a thickness of 0.001 to 0.1 ?m, on a surface of the silver-plated layer formed on a surface of a plating base. There is also provided a coating method for obtaining the plating structure which comprises the step of melting a particle deposit spottedly deposited at 2×10?6 to 8×10?6 g/cm2 such that the spot-deposited particles have gaps therebetween as viewed above and the particles each having an average diameter of 20 to 80 nm do not pile up in a direction perpendicular to the surface of the silver layer to obtain a film.
    Type: Application
    Filed: July 13, 2010
    Publication date: January 20, 2011
    Applicant: KYOWA ELECTRIC WIRE CO., LTD.
    Inventors: Yoshinori Sumiya, Kinya Sugie
  • Patent number: 7862902
    Abstract: The invention describes a multi-layered bearing with a supporting metal layer, optionally a bearing metal layer disposed on top of it, an anti-friction layer on top of the latter as well as a wearing layer on top of it. The wearing layer is made from bismuth or a bismuth alloy and the anti-friction layer is made from a copper-bismuth or silver-bismuth alloy or silver.
    Type: Grant
    Filed: June 8, 2007
    Date of Patent: January 4, 2011
    Assignees: Miba Gleitlager GmbH, KS Gleitlager GmbH
    Inventor: Jakob Zidar
  • Patent number: 7842399
    Abstract: A sliding bearing element is characterized in that a bearing material that is bonded to the backing is disposed at least at the edges of the backing in form of wires in the circumferential direction and that a soft material is located at least in a space between said wires. At least one intermediate wire can be disposed between the two edge wires generally running in the circumferential direction. The method comprises the following processing steps: providing a strip of steel or any other material having the required degree of strength which forms the backing of the bearing to be produced, bonding at least one wire at each of the two edges of the backing strip, whereat disposing the wires in such a manner that said wires run in circumferential direction generally, and filling out the spaces between the wires with soft material.
    Type: Grant
    Filed: February 10, 2005
    Date of Patent: November 30, 2010
    Assignee: Federal-Mogul Wiesbaden GmbH & Co. KG
    Inventor: George Pratt
  • Publication number: 20100266869
    Abstract: A slide member including a base material; an intermediate layer consisting of Ag or Ag-based alloy and an additive element of a first quantity formed over the base material; and an overlay comprising Bi or Bi-based alloy and the additive element of a second quantity formed over the intermediate layer, wherein the additive element consists of a low melting point metal, the first quantity being five times or greater than the second quantity.
    Type: Application
    Filed: April 15, 2010
    Publication date: October 21, 2010
    Applicant: DAIDO METAL COMPANY LTD.
    Inventors: Mikihito YASUI, Hideo Tsuji, Hiroyuki Asakura
  • Publication number: 20100206612
    Abstract: One aspect is a coil including a laminate having metal layers. The coil is configured for the electrical connection of stimulation electrodes. One of the metal layers exhibits good electrical conductivity and another metal layer great mechanical strength.
    Type: Application
    Filed: February 18, 2010
    Publication date: August 19, 2010
    Applicant: W. C. HERAEUS GMBH
    Inventor: Herwig Schiefer
  • Publication number: 20100183895
    Abstract: An optical disc having at least two metal-containing layers with different compositions and partially overlapping areal extents in the plane of the disc and method of forming the disc are described. The optical disc with dual metallization exhibits visually distinct regions suitable for use for identification purposes.
    Type: Application
    Filed: August 20, 2008
    Publication date: July 22, 2010
    Inventors: Justin John Cunningham, Ibsen Lourenco, Holger Hofmann
  • Patent number: 7722963
    Abstract: The present invention provides a metallic coating having a sheen and having a discontinuous structure at high productivity and low cost by using sputtering. A resin product includes a resin base material, and a metallic coating having a sheen and a discontinuous structure that is deposited on the resin base material so as to include a portion in which a high-formation metal that relatively readily forms a discontinuous structure when using vacuum vapor deposition is sputtered, and thereafter, a low-formation metal that does not relatively readily form a discontinuous structure when using vacuum vapor deposition is sputtered. The high-formation metal and the low-formation metal are selected from at least two species of metals whose crystal structures are identical and whose lattice constant difference is within 10%.
    Type: Grant
    Filed: November 16, 2006
    Date of Patent: May 25, 2010
    Assignees: Toyoda Gosei Co., Ltd., Shinko Nameplate Co., Ltd.
    Inventors: Takayasu Ido, Hiroshi Watarai, Chiharu Totani, Tetsuya Fujii, Mitsuo Yoshida
  • Publication number: 20100055493
    Abstract: Phase change memory materials and more particularly GeAs telluride materials useful for phase change memory applications, for example, optical and electronic data storage are described.
    Type: Application
    Filed: July 15, 2009
    Publication date: March 4, 2010
    Inventors: Bruce Gardiner Aitken, Charlene Marie Smith
  • Publication number: 20100045282
    Abstract: Relating to a thin film lamination and a thin film magnetic sensor using the thin film lamination and a method for manufacturing the thin film lamination that realizes a thin film conducting layer having high electron mobility and sheet resistance as an InAsSb operating layer. A thin film lamination is provided which is characterized by having an AlxIn1-xSb mixed crystal layer formed on a substrate, and an InAsxSb1-x (0<x?1) thin film conducting layer directly formed on the AlxIn1-xSb layer, in which the AlxIn1-xSb mixed crystal layer is a layer that exhibits higher resistance than the InAsxSb1-x thin film conducting layer or exhibits insulation or p-type conductivity, and its band gap is greater than the InAsxSb1-x thin film conducting layer, and the a lattice mismatch is +1.3% to ?0.8%.
    Type: Application
    Filed: November 29, 2007
    Publication date: February 25, 2010
    Inventors: Ichiro Shibasaki, Hirotaka Geka, Atsushi Okamoto
  • Publication number: 20100028713
    Abstract: A method of processing an article includes mechanically working an article having a metallic layer disposed on a titanium substrate and establishing a residual stress region that extends through the metallic layer and at least partially into the titanium substrate.
    Type: Application
    Filed: July 29, 2008
    Publication date: February 4, 2010
    Inventors: Aaron T. Nardi, Blair A. Smith, Timothy R. Boysen
  • Patent number: 7655280
    Abstract: A extreme low resistivity light attenuation anti-reflection coating structure includes a substrate, a coating module, and a composed protection coating layer. The coating module is formed on a front surface of the substrate. The coating module is composed of a plurality of Ti-based oxide coating layers and a plurality of metal coating layers that are alternately stacked with each other. The composed protection coating layer is formed on the coating module.
    Type: Grant
    Filed: October 5, 2007
    Date of Patent: February 2, 2010
    Assignee: Innovation & Infinity Global Corp.
    Inventors: Cheng-Chieh Chang, Shiu-Feng Liu, Pi-Jui Kuo
  • Patent number: 7651784
    Abstract: The invention describes a sliding element, in particular a sliding bearing, with a support element and a sliding layer, between which a bearing metal layer is arranged, wherein the sliding layer is made from bismuth or a bismuth alloy, and wherein the crystallites of the bismuth or the bismuth alloy in the sliding layer adopt a preferred direction with respect to their orientation, expressed by the Miller index of the lattice plane (012), wherein the X-ray diffraction intensity of the lattice plane (012) is the greatest compared to the X-ray diffraction intensities of other lattice planes. The X-ray diffraction intensity of the lattice plane with the second-largest X-ray diffraction intensity is a maximum of 10% of the X-ray diffraction intensity of the lattice plane (012).
    Type: Grant
    Filed: March 27, 2007
    Date of Patent: January 26, 2010
    Assignee: Miba Gleitlager GmbH
    Inventor: Thomas Rumpf
  • Patent number: 7629058
    Abstract: A sliding member has a coating layer deposited on a base material through an intermediate layer, wherein the intermediate layer is formed of a lead-free metal, and the coating layer is formed of Bi or a lead-free Bi alloy; and wherein a grain in the intermediate layer becomes gradually large toward a coating layer side from a base material side, and a grain in the coating layer forms a columnar grain of which the major axis directs toward the surface of the coating layer from the intermediate layer side. Thus formed configuration improves a bonding strength between the base material and the coating layer owing to the intermediate layer, and has the grain of the coating layer formed into a desirable shape for bearing a load from an opposite material to improve fatigue resistance.
    Type: Grant
    Filed: March 23, 2006
    Date of Patent: December 8, 2009
    Assignee: Daiso Metal Company, Ltd.
    Inventors: Satoshi Takayanagi, Toshiaki Kawachi, Masahito Fujita