Abstract: Metal bond abrasive articles and methods of making metal bond abrasive articles via a focused beam are disclosed. In an aspect, a metal bond abrasive article includes a metallic binder material having abrasive particles retained therein, where the abrasive particles have at least one coating disposed thereon. The coating includes a metal, a metal oxide, a metal carbide, a metal nitride, a metalloid, or combinations thereof, and the at least one coating has an average thickness of 0.5 micrometers or greater. The metal bond abrasive article includes a number of layers directly bonded to each other. Metal bond abrasive articles prepared by the method can include abrasive articles having arcuate or tortuous cooling channels, abrasive segments, abrasive wheels, and rotary dental tools.

Abstract: A method of making a semiconductor including soldering a conductor to an aluminum metallization is disclosed. In one example, the method includes substituting an aluminum oxide layer on the aluminum metallization by a substitute metal oxide layer or a substitute metal alloy oxide layer. Then, substitute metal oxides in the substitute metal oxide layer or the substitute metal alloy oxide layer are at least partly reduced. The conductor is soldered to the aluminum metallization using a solder material.

Abstract: The invention relates to a method for producing a sliding bearing composite material (10), having a support layer (14), in particular made of steel, a bearing metal layer (18) made of a lead-free aluminum base alloy containing magnesium, and a running layer (22), wherein the aluminum base alloy ultimately comprises 0.5-5.5% by weight magnesium, optionally one or more alloy components from the group comprising zinc, copper, silicon, iron, manganese, chromium, titanium, zirconium, vanadium, nickel, cobalt, cerium, and alloy components resulting from impurities, the sum of the latter not exceeding 1% by weight, and the remainder being aluminum, wherein the aluminum base alloy is copper-free or contains at most 3% by weight copper, the total content of zinc, copper, and nickel does not exceed 8% by weight, and the total content of all alloy components does not exceed 12% by weight.

Abstract: The invention relates to a sliding bearing element (1) with a running layer (4) made from a first tin-based alloy and an additional layer (5) made from an additional tin-based alloy, said alloys containing at least one element from a group comprising Cu, Ni, Ag, Sb, As, Pb, Bi, Te, Tl and/or non-metal particles. The first tin-based alloy has a strength index FI of at least 5 and at most 25, and the additional tin-based alloy has a strength index FI of at least 0.3 and at most 3.

Abstract: A slide bearing including a rotating friction partner, a counterpart and a lubrication film between the friction partner and the counterpart, wherein the friction partner or the counterpart is coated with a hard material.

Abstract: A plated steel sheet for cans with excellent secondary adhesion of an organic film and high corrosion resistance is provided, that is, a plated steel sheet for cans, which is a plated steel sheet having a alloy tin layer and a metallic tin layer in sequence from the steel sheet side, wherein a chemical conversion layer comprising tin oxide in an amount of 0.3 to 5.0 mC/cm2 in terms of electricity necessary for reduction and tin phosphate in an amount of 0.5 to 5.0 mg/m2 in terms of P is provided on the metallic tin layer and zirconium(IV) oxide in an amount of 0.2 to 5 mg/m2 in terms of Zr is provided on the chemical conversion layer. A production method thereof is also provided.

Abstract: A coated article includes a substrate, a catalyst layer, a bonding layer and a hydrophobic layer. The catalyst layer made of tin is formed on the substrate. The bonding layer is formed on the catalyst layer, including titanium, tin, stannic oxide and titanium dioxide. The hydrophobic layer made of silicon-nitrogen is formed on the bonding layer.

Abstract: A chlorine, fluorine and lithium co-doped transparent conductive film is provided, including chlorine, fluorine and lithium co-doped tin oxides, wherein the chlorine, fluorine and lithium co-doped tin oxides have a chlorine ion doping concentration not greater than 5 atom %, a fluorine ion doping concentration not greater than 5 atom %, and a lithium ion doping concentration not greater than 5 atom %.

Abstract: A method of forming a high quality epitaxial indium phosphide layer on a silicon substrate and a semiconductor device formed by the same method are described. In one aspect, a lead-based perovskite buffer is formed on a silicon substrate, and an epitaxial indium phosphide layer is formed on the lead-based perovskite buffer. In accordance with this approach, relatively large (e.g., up to 300 millimeters in diameter) high quality indium phosphide films may be produced with the relatively high mechanical stability provided by silicon substrates. In this way, intrinsic problems associated with prior approaches that involve growth of high quality indium phosphide thin films on indium phosphide substrates, which are characterized by small wafer size, brittleness and high cost, may be avoided.

Abstract: The present invention relates to a method of bonding a conductive adhesive and an electrode together, which is capable of obtaining electrical bonding between a conductive electrode and an electrode. In this method, a conductive adhesive containing a conductive filler and an organic binder is coated on an electrode having a layer formed thereon by plating a low-melting-point material, and then heated to cure the organic binder and melt the plated layer on the electrode. As a result, the conductive filler contained in the adhesive enters the plated layer to obtain strong bonding between the plated layer and the conductive filler.

Abstract: The method of protectively coating metallic uranium which comprises dipping the metallic uranium in a molten alloy comprising about 20-75% of copper and about 80-25% of tin, dipping the coated uranium promptly into molten tin, withdrawing it from the molten tin and removing excess molten metal, thereupon dipping it into a molten metal bath comprising aluminum until it is coated with this metal, then promptly withdrawing it from the bath.

Abstract: A method of pretreating a copper surface for protecting the surface from oxidation, by immersing the surface in a solution containing organic solderabilty preservatives, such as BenzoTriAzole, with the addition of a zinc salt. The method is particularly useful in the manufacturing of electronic Printed Circuit Boards for protecting the copper surfaces during the solder processes when the PCB undergoes high temperature. The addition of the zinc salts also gives the additional advantage of increasing the solderabilty properties of the copper surface (i.e. wettability and adhesion).

Abstract: The present invention provides a current collector for a battery which comprises a lead or lead alloy substrate and a thin cladding of tin, batteries utilizing such a current collector and methods for manufacturing such batteries. Preferably the tin cladding is composed of substantially pure tin and the concentration of the tin cladding relative to the weight of the current collector (i.e., the combined weight of the substrate and cladding) is less than 4% by weight. The tin cladding forms a noncontinuous layer over the outer surface of the substrate such that there are interspersed regions of lead and tin at the current collector surface. Batteries utilizing such current collectors exhibit marked improvement in performance compared to similar cells composed of tin alloys. In particular, batteries using current collectors of the present design offer superior cycle life and shelf life performance.

Abstract: In order to improve the wear resistance of the swash plate of a swash-plate type compressor, on which plate copper alloy is flame-sprayed, a composite material, which consists of copper or first copper alloy (for example Cu—Pb alloy) including at least unmelted phase and aluminum or first aluminum alloy (for example Al—Si alloy) including at least melted phase, is flame sprayed on the sliding surface with a shoe.

Abstract: The invention relates to a ball limiting metallurgy stack for an electrical device that contains a tin diffusion barrier and thermo-mechanical buffer layer disposed upon a refractory metal first layer. The multi-diffusion barrier layer stack resists tin migration toward the upper metallization of the device.

Abstract: A sliding bearing, which comprises a lining and a bismuth or bismuth-alloy overlay having improved compatibility and fatigue resistance is provided. The overlay is characterized by the following orientation. The relative ratio of the X-ray diffraction intensity I[hkl] of the bismuth or bismuth-alloy overlay defined below satisfies the following conditions (a) and (b): (a) the relative ratio of the X-ray diffraction intensity I[hkl] of planes other than the {012} planes is from 0.2 to 5 times as high as the ratio of the X-ray diffraction intensity I[012], namely, 0.2I[012]≦I[hkl]≦5I[012] (b) the relative ratio of the X-ray diffraction intensity I[hkl] of three or more planes other than {012} planes ranges from 0.5 to 2 times as high as the ratio of the X-ray diffraction intensity I[012], namely, 0.5I[012]≦2I[012].

Abstract: A metal alloy solder ball comprising a first metal and a second metal, the first metal having a sputtering yield greater than the second metal. The solder ball comprises a bulk portion having a bulk ratio of the first metal to the second metal, an outer surface, and a surface gradient having a depth and a gradient ratio of the first metal to the second metal that is less than the bulk ratio. The gradient ratio increases along the surface gradient depth from a minimum at the outer surface. The solder ball may be formed by the process of exposing the ball to energized ions of a sputtering gas for an effective amount of time to form the surface gradient.

Abstract: The bonding material for an electronic component comprises a metal material and fine resin particles dispersed in the metal material. Such a material may form an electrical “bump” for the component.

Abstract: A paste is described for capping electrodes with an oxide free metal layer incorporating a solvent, an unzippable polymer and particles. The electrode could be an interconnect such as a C4 bump. A method for forming a coating and for testing integrated circuit chips is also described. The invention overcomes the problem of interconnecting Pb containing electrodes that are covered with an insulating oxide on integrated circuit chips by coating the Pb containing electrode with Au to provide an oxide free surface for testing and interconnection.

Abstract: A process for altering surface properties of a mass of metal alloy solder comprising a first metal and a second metal. The process comprises exposing the mass to energized ions to preferentially sputter atoms of the first metal to form a surface layer ratio of first metal to second metal atoms that is less than the bulk ratio. The solder may be located on the surface of a substrate, wherein the process may further comprise masking the substrate to shield all but a selected area from the ion beam. The sputtering gas may comprises a reactive gas such as oxygen and the substrate may be an organic substrate. The process may further comprise simultaneously exposing the organic substrate to energized ions of the reactive gas to roughen the organic substrate surface.

Abstract: A solder material 10 suitable for fluxless soldering attachment of a component 12 to a substrate 14 in a microelectronic assembly 16 such as a hybrid package comprises a core 18 and a gold layer 20 on the core. The core can comprise an alloy of tin and lead. The core preferably consists essentially of at least about 30 wt. % tin and the balance lead, so that it melts at temperatures of less than about 250° C. The gold layer is preferably applied to the core using an electroless plating process that forms a highly uniform gold layer. The solder material provides a joint between the component and the substrate comprising less than about 3 wt. % gold.

Abstract: An article comprising a metal circuit and/or a heat-radiating metal plate formed on a ceramic substrate, wherein the metal circuit and/or the heat-radiating metal plate comprise either (1) the following first metal-second metal bonded product, wherein the first metal and the second metal are different, or (2) the following first metal-third metal-second metal bonded product, and wherein in (1) and (2), the first metal is bonded to the ceramic substrate; first metal: a metal selected from the group consisting of aluminum (Al), lead (Pb), platinum (Pt) and an alloy containing at least one of these metal components; second metal: a metal selected from the group consisting of copper (Cu), silver (Ag), gold (Au), aluminum (Al) and an alloy containing at least one of these metal components; and third metal: a metal selected from the group consisting of titanium (Ti), nickel (Ni), zirconium (Zr), molybdenum (Mo), tungsten (W) and an alloy containing at least one of these metal components.

Abstract: This invention relates to a solder structure which provides enhanced fatigue life properties when used to bond substrates particularly at the second level such as BGA and CGA interconnections. The solder structure is preferably a sphere or column and has a metal layer wettable by solder and the structure is used to make solder connections in electronic components such as joining an electronic module such as a chip connected to a MLC which module is connected to a circuit board. The solder structure preferably has an overcoat of solder on the metal layer to provide a passivation coating to the metal layer to keep it clean from oxidation and corrosion and also provide a wettable surface for attachment of the solder structure to solder on the pads of the substrate being bonded.

Abstract: In a phase-change recording medium, a recording medium is provided with a barrier layer including Ge--N, Ge--N--O between a recording layer and a dielectric protective layer in order to prevent a chemical reaction and an atom diffusion between the recording layer and the dielectric protective layer. A barrier material can be also applied to the protective layer itself. Thereby, it is possible to considerably suppress a reduction of a reflectivity and a reduction of a signal amplitude due to the repeat of recording and erasing, such reductions being observed in a conventional phase-change optical information recording medium, and thereby the number of overwriting times can be increased.

Abstract: A magneto-optical disk and a superdensity disk, which comprises: a common integral substrate having grooves and pits formed on its both sides: and a film structure on each side of the integral substrate. They are manufactured by preparing two stampers; simultaneously forming grooves and pits on both sides of an integral substrate, by use of said two stampers mounted on a respectively fixed mold and a moving mold; and forming identical film structure on each side of said integral substrate by depositing materials from targets suspended to both sides of said integral substrate. The disks are superior in mechanical properties and reliability. As for reliability, the present MOD is prepared without using a bonding process, which overcomes the problem of adhesive out-flow.

Abstract: A method of introducing an anti-tarnish agent into the matrix of a tin coating to reduce oxidation and/or yellowing of the tin coating. The agent is preferably zinc, indium or phosphorous and can be deposited in a molten form to alloy with the existing tin coating. Alternatively, the existing tin coating may be exposed to a chemical bath including the agent and later heated to reflow the tin coating and agent thereby incorporating the agent into the matrix of the tin coating.

Abstract: In accordance with the present invention, a glass substrate of a disk for recording information, containing oxides of rare earth elements and fine particles dispersed therein, and a disk for recording information and a disk apparatus for recording information using the glass substrate of the disk are provided. The glass substrate of the disk for recording information having preferable mechanical characteristics, as well as superior chemical stability, thermal stability, flatness, and transparency is provided, and a disk for recording information and a disk apparatus for recording information using the glass substrate of the disk are provided.

Abstract: A glass substrate for a magnetic disk of the present invention is one in which a laser beam is irradiated on a main surface thereby forming a large number of protrusions thereon to form texture thereon, each of said protrusions being formed by a protruded portion having a convex shape, said glass having a composition in which 0.2 to 3 wt % of an oxide of a transition metal is contained and an absorption coefficient with respect to a wavelength of a light at 266 nm being within a range of 0.03 to 2 .mu.m.sup.-1, and by setting the absorption coefficient of the glass with respect to a wavelength of a light at 266 nm within a range of 0.03 to 2 .mu.m.sup.-1 and irradiating a laser beam having a wavelength in a range of ultraviolet rays selectively on the main surface of a glass substrate at predetermined intervals, texture comprising a large number of protrusions formed by protruded portions each having a small diameter and a convex shape is formed.

Abstract: A method for soldering electronic components capable of withstanding high temperature applications. A solder having a composition in the range between 83 and 87% lead, between 8.5 and 11.5% antimony, and the balance of tin provides superior results. The solder uniquely provides a sufficiently low melting point to enable mass flow without destruction of plastic package parts, and a sufficiently high melting point to achieve 200 degrees C. operation. Good mechanical strength is achieved while providing sufficient creep to permit differential expansion between components and a printed wiring board. A heavy solder layer is coated on a printed wiring board and is oxidized to generate a thin solderable layer. Manufacture of the circuit board can be performed with conventional techniques such as wave soldering, hand soldering, solder printing, solder dispensing, and solder pre-forms.

Abstract: A disk substrate fabricated front an inner substrate having a specific stiffness greater than about 7.6 Mpsi/gm/cc and an encapsulating layer deposited over the inner substrate. The inner substrate may include materials such as alumina, silicon carbide, beryllium, boron carbide, aluminum, and mixtures thereof. The encapsulating layer may be made from aluminum, magnesium, copper, zinc, and mixtures thereof. The disk substrate may additionally comprise a finishing layer deposited on the encapsulating layer fabricate from a material such as nickel or an alloy thereof.

Abstract: In accordance with the present invention, a glass substrate of a disk for recording information, containing oxides of rare earth elements and fine particles dispersed therein, and a disk for recording information and a disk apparatus for recording information using the glass substrate of the disk are provided. The glass substrate of the disk for recording information having preferable mechanical characteristics, as well as superior chemical stability, thermal stability, flatness, and transparency is provided, and a disk for recording information and a disk apparatus for recording information using the glass substrate of the disk are provided.

Abstract: A connective medium is provided for use in ball grid assemblies for detachable connections between electronic devices and circuit boards. The medium includes novel, discrete spheres defining an inner metallic, spherical core and one or more outer, electrically conductive concentric, hard and non-deformable metallic layers of nickel, copper or alloys thereof and a coating of silver or gold thereon.

Abstract: An erasable phase change recording medium includes a transparent substrate, a recording layer of a phase change material provided on the substrate, and a protection layer provided to protect the recording layer on the substrate. Tracks are formed with alternate grooves and lands on the substrate of the recording medium and data is recorded to at least one of the grooves and the lands. The recording medium is configured to have a track pitch between 0.6 .mu.m and 0.8 .mu.m and a groove depth between 0.11.L and 0.18.L where L is a wavelength of a laser beam.

Abstract: A method for pretreating a solder surface for fluxless soldering is disclosed. The method uses a noble fluorine gas to remove surface oxides from solder surfaces, without the use of external stimulation. A noble fluorine gas is suffused across the solder surface to reduce or eliminate or chemically convert the surface oxides. The process can take place at atmospheric pressure and room temperature. A simple belt driven transport may be used to move the parts past a nozzle which emits the vapor in a system similar to a conventional solder reflow machine.

Abstract: An optical tape including an optical recording layer for permitting information to be optically recorded thereon and a light-reflective magnetic layer. The light-reflective magnetic layer which reflects light projected onto the recording layer, also permits magnetic recording or magneto-optical recording to be performed thereon, thereby increasing a storage capacity of the optical tape remarkably. Further, the optical tape is provided with a layer to form guiding grooves for tracking control. The layer to form guiding grooves is made up of ultraviolet-hardening resin, photo-resist, or a photochromic material. For example, in the case of using ultraviolet-hardening resin, after a guiding groove pattern has been exposed by projecting an ultraviolet ray on a layer made up of ultraviolet-hardening resin, the exposed areas harden to form areas corresponding to guiding grooves between those exposed areas.

Abstract: The present invention provides a magneto-optical medium and a reproducing device for the medium. In the magneto-optical medium, a mark in a magneto-optical recording area is so formed as to correspond to one of "1" and "0" of data to be recorded, and in a pre-formatted recording area, a pit in formed so that an edge of said pit corresponds to one of "1" and "0" of the data to be recorded. Therefore, when the magneto-optical recording area and the pre-formatted recording area have substantially the same linear recording density, only one pit exists in the spot area of a reproducing beam. As a result, an excellent characteristics can be obtained due to a superresolution effect.

Abstract: A white decorative member comprising: a substrate; a primary plate layer having a thickness of at least 1 .mu.m and covering the substrate, which is composed of Cu (alloy); an Sn--Cu--Pd alloy plate layer having a thickness of at least 0.2 .mu.m and covering the primary plate layer, which comprises 10 to 20% by weight of Sn, 10 to 80% by weight of Cu and 10 to 50% by weight of Pd as essential components; and a finishing plate layer having a thickness of 0.2 to 5 .mu.m, which is composed of at least one element selected from the group consisting of Pd, Rh and Pt. The decorative member of the present invention does not contain any Ni component, so that, when worn, it does not induce Ni allergy. Moreover, the decorative member which may have white, gold, black or multicolor being a combination of the above colors can be produced at lowered cost.

Abstract: A rewritable optical recording disk has a substrate with an increased thickness that is greater than or equal to approximately 1.5 mm and less than or equal to approximately 2.5 mm. The increased thickness of the substrate enhances the flatness of the recording disk relative to a recording plane. In particular, the increased thickness reduces process-induced surface variations such as warpage and tilt, and provides the disk with increased stiffness to resist deflection during use. The enhanced flatness enables data to be recorded on the disk in a consistent manner with greater spatial densities using techniques such as near-field, air-incident recording. The resulting disk thereby yields greater spatial density and data storage capacity.

Abstract: A writable compact disk has a plastic substrate, a recording layer, a reflecting layer, and a protective overcoat, the reflecting layer is comprised of a silver-palladium alloy, a silver-copper alloy, or a silver-palladium-copper alloy. By maintaining the palladium component of the alloy less that 15 at. % and the copper component of the alloy less than 30 at. %, the reflectance of the reflecting layer can be similar to the typical gold reflecting layer while jitter and NORP levels can be reduced for illumination power levels exceeding the power normally used to write on the recording layer.

Abstract: A magneto-optical recording medium includes a reproducing layer which has in-plane magnetization at room temperature and has perpendicular magnetization at an elevated temperature of not less than a critical temperature, a recording layer made of a perpendicular magnetization film for recording information, an intermediate layer made of a non-magnetic film formed between the reproducing layer and the recording layer, and an in-plane magnetization layer adjacent to the reproducing layer, in which magnetization is reduced at a temperature in a vicinity of the critical temperature. According to the described magneto-optical recording medium, since information recorded in a recording magnetic domain of a portion having the in-plane magnetization is masked, even in the case where adjacent recording bits fall within a diameter of a spot of a converged light beam, each recording bit can be reproduced separately, thereby obtaining a quality reproduced signal.

Abstract: A magneto-optical recording medium according to the present invention comprises a recording layer in which information is to be recorded; and a reproducing layer to and from which information recorded in the recording layer is to be transferred and read out. The magneto-optical recording medium is arranged such that, at room temperature, the width of a stable magnetic domain of the reproducing layer is wider than the width of the recorded magnetic domain formed in the recording layer at the time when information has been recorded therein, and that, at temperature exceeding a predetermined value, the relationship between these widths is reversed. Accordingly, upon irradiation of a light beam, there is transferred and reproduced, to and from the reproducing layer, the magnetic domain of only that portion of the recording layer corresponding to the center portion of the light beam where the temperature of the reproducing layer exceeds the predetermined value.

Abstract: A high quality magneto-optical disk which has the protective coating being excellent in the lubricity, the property of sliding and a long-term reliability includes a UV-ray resin composition comprising photo polymerizable prepolymer, photo polymerization initiator and organic compound having a side chain of fluoroalkyl group or unsaturated aliphatic alkyl group in the end of each molecule. The UV-ray setting resin comprising photo polymerization prepolymer at 30-80 parts by weight; photo polymerization initiator at 10-40 parts by weight; and organic polysiloxane at 0.1-10 parts by weight per 100 parts by weight of (meth-)acrylic ester is applied to approximately 10 .mu.m on the reflection layer 14 by the spincoat method and irradiating the UV-ray (illuminance: 600 mW/cm.sup.2, quantity of light: 800 mJ/cm.sup.2) at room temperature, thus forming the protective coating.

Abstract: In a semiconductor assembly with a solder material layer and a method for soldering the semiconductor assembly, a silicon semiconductor body with a diffusion barrier layer is provided with a solder material layer, preferably a tin layer. The semiconductor body is then applied to a metal carrier plate and is directly soldered to the carrier plate by heating to temperatures to above 250.degree. C., i.e. without further additions.

Abstract: A glass substrate for a magnetic disk of the present invention is one in which a laser beam is irradiated on a magnetic recording surface side thereby forming a large number of protrusions thereon to form texture thereon, each of the protrusions having a convex shape, an optical absorption coefficient of a glass with respect to a wavelength of a laser beam at 266 nm being within a range of 20 to 2000 mm.sup.-1, the glass having a composition by weight of:silicon oxide (SiO.sub.2): 58 to 66%,aluminum oxide (Al.sub.2 O.sub.3): 13 to 19%,lithium oxide (Li.sub.2 O): 3 to 4.5%,sodium oxide (Na.sub.2 O): 6 to 13%,potassium oxide (K.sub.2 O); 0 to 5%,R.sub.2 O: 9 to 18% (provided R.sub.2 O=Li.sub.2 O+NaO+K.sub.2 O),magnesium oxide (MgO): 0 to 3.5%,calcium oxide (CaO): 1 to 7%;strontium oxide (SrO): 0 to 2%;barium oxide (BaO): 0 to 2%,RO: 2 to 10% (provided RO=MgO+CaO+SrO+BaO), andiron oxide (Fe.sub.2 O.sub.3): 0.05 to 2%,titanium oxide (TiO.sub.2): 0 to 2%,cerium oxide(CeO.sub.

Abstract: A glass substrate for magnetic disks, obtained by chemical strengthening treatment of a glass consisting essentially of from 50 to 65 wt % of SiO.sub.2, from 5 to 15 wt % of Al.sub.2 O.sub.3, from 2 to 7 wt % of Na.sub.2 O, from 4 to 9 wt % of K.sub.2 O, from 7 to 14 wt % of Na.sub.2 O+K.sub.2 O, from 12 to 25 wt % of MgO+CaO+SrO+BaO, and from 1 to 6 wt % of ZrO.sub.2.

Abstract: A multilayer optical information medium provided with structure in which first and second substrates respectively provided with two to four layers of planar information areas are respectively arranged outside wherein the thickness of the above-described first and second substrates is set in the range of 0.52 to 0.65 mm. The above-described planar information area consists of embossed pits provided, for example on the surface of respective substrates or on the surface of a layer formed by transparent material and a semi-reflective layer provided on the embossed pits. A planar information area arranged in the farthest position from respective substrates is provided with a reflective layer in place of the above-described semi-reflective layer. The planar information area arranged in the farthest position from respective substrates may be constituted by a recording layer and a reflective layer provided on the recording layer.

Abstract: A component of aluminum nitride metallized with a metallizing paste containing: (i) a pulverulent glass of the MnO--Al.sub.2 O.sub.3 --SiO.sub.2 system as an adhesion promotor having a mean particle size of 2-15 .mu.m; (ii) a refractory metal powder having a mean particle size of 1-4 .mu.m; and (iii) an organic resin dissolved in a suitable solvent and/or a screen printing oil is disclosed. The metallizing paste preferably has a viscosity of 50-100 Pa.multidot.s when applied by screen printing, and a viscosity of <5 Pa.multidot.s when applied by dipping. The component of aluminum nitride metallized with the metallizing paste has at least one metal layer deposited on the metallizing paste, and the at least one metal layer applied has a bonding strength given by mean pull-off values of .gtoreq.3.5 kN/cm.sup.2.

Abstract: A decorative glass sheet simulating a multi-pane, camed window or door, and a method for forming the same. The decorative glass sheet includes a glass panel having an outer surface. At least one groove is formed through the outer surface and into the glass panel. Each groove includes a first wall extending from a first peripheral edge to a groove bottom apex and a second wall extending from the apex to a second peripheral edge. The second wall has a width greater than a width of the first wall. At least one decorative caming strip is adhered to the outer surface of the glass panel and is disposed adjacent and along the first peripheral edge of the at least one groove.

Abstract: A low particulating circuit board for a disc drive flex assembly, and a method for forming the same, are disclosed. The circuit board comprises a conductive metal substrate which has sufficient thickness to provide mechanical support and backplane suppression for the circuit board and to efficiently sink heat generated by preamplifier circuitry housed by the circuit board. The substrate has dielectric layers formed on the top and bottom surfaces thereof, the dielectric layers comprising an epoxy interleaved with nonparticulating fibers, such as tetrafluorethylene (TFE) fibers. Traces and pads are provided on the dielectric layers to provide the necessary electrical connections for the preamplifier circuitry. A plurality of circuit boards are formed from a panel and subsequently cut therefrom. Particulate generation is minimized through the use of the metal substrate, as well as recession of the substrate and the solder masks to reduce the amount of material cut during the cutting operation.

Abstract: A Beryllium disk drive substrate is prepared using a Beryllium metal having a starting modulus of elasticity (stiffness) of about 4.2 times that of Aluminum, in which the beryllium is separated into circular disks and processed by a sequence of lapping, heat-treating under pressure, cooling under pressure and polishing steps which retains the desirable metallurgical characteristics of the starting metal and provides sufficiently high quality surface finish, thermal conductivity and low mass density, to enable improved rotational speeds, acceleration/deceleration rates and information packing density for demanding disk drive applications.