Abstract: A high density wiring system to transmit radio frequency (RF) signals to superconducting qubits disposed within a dilution refrigerator is disclosed. The high density wiring system comprises a plurality of flexible layers, with conductive layers disposed between adjacent pairs of flexible layers. The conductive layers may be constructed using phosphor bronze. The wiring system that is disposed at the lower temperature stages of the dilution refrigerator may be coated with a superconducting material. The wiring system is useful for superconducting quantum computers and cryogenic sensors, as well as cryogenic infrastructure.

Abstract: An object of the present invention is to provide an Sn—Bi—Cu—Ni solder alloy or the like which has a low melting point, excellent ductility, and high tensile strength, and in which if soldering is performed on a Cu electrode subjected to electroless Ni plating treatment, a solder joint formed through this soldering exhibits high shear strength. In addition, another object of the present invention is to provide an Sn—Bi—Cu—Ni solder alloy in which a solder joint formed through soldering exhibits high shear strength even for a Cu electrode which has not been subjected to plating treatment. Furthermore, still another object of the present invention is to provide, in addition to the above-described objects, a solder alloy or the like of which yellowish discoloration can be suppressed and in which change in viscosity of a solder paste over time can be suppressed. The solder alloy has an alloy composition consisting of, by mass %, 31% to 59% of Bi, 0.3% to 1.0% of Cu, 0.01% to 0.06% of Ni, 0.0040% to 0.

Abstract: An RF charging system for implantable medical devices. The RF charging system includes a radio frequency (RF) signal, a first antenna configured to transmit the RF signal, a second antenna configured to receive the RF signal transmitted by the first antenna, tune characteristics of the RF signal, and improve power transfer with impedance matching circuitry, an RF to direct current (DC) converter configured to convert the RF signal of the second antenna into a DC signal, and a battery management circuit configured to receive the DC signal and provide voltage to a battery.

Abstract: The invention relates to a sliding bearing (1) comprising a support element (2) on which at least one additional functional layer (3) is arranged which consists of a silver-based alloy with silver as the main constituent of the alloy. The functional layer (3) contains, in addition to silver, at least one element from a group including gallium, manganese, nickel, copper, zinc, germanium, indium, tin, antimony and aluminum, wherein the total content of said elements is between 0.01 wt. % and 70 wt. % and the remainder is formed by silver containing production-related impurities, with the proviso that the proportion of each of the elements gallium, manganese, nickel, zinc, germanium and antimony in the binary silver-based alloys is a maximum of 49 wt. %, the proportion of indium being not more than 10 wt. %, the proportion of tin or copper content in the functional layer embodied as a sliding being not more than 10 wt. % and 14 wt. % respectively.

Abstract: The embodiments described herein relate to anodic films and methods for forming anodic films. The methods described can be used to form anodic films that have a white appearance. Methods involve positioning reflective particles on or within a substrate prior to or during an anodizing process. The reflective particles are positioned within the metal oxide of the resultant anodic film but substantially outside the pores of the anodic film. The reflective particles scatter incident light giving the resultant anodic film a white appearance.

Abstract: A coating is provided to a conductor, and has a layered structure of a palladium layer. The palladium layer has a crystal plane whose orientation rate is 65% or more.

Abstract: A method of forming an electrode includes casting a molten metal in a mould to form an electrode with a header portion and a blade portion. The blade portion of the electrode is then rolled after it has been cast. The blade portion may be rolled into at least two different thicknesses. In one embodiment the metal is lead or lead alloy and the method relates to the forming of a lead or lead alloy anode.

Abstract: Methods of coating a magnesium substrate are provided along with coated magnesium substrates. A low melting point material is cold sprayed onto a region of the magnesium substrate. A corrosion resistant material or a zinc material is cold sprayed over at least a portion of the low melting point material to form a coated magnesium substrate. The coated magnesium substrate is then heated.

Abstract: The present invention is hybrid liquid metal-solder thermal interface. In one embodiment, a thermal interface for coupling a heat generating device to a heat sink includes a first metal interface layer, a second metal interface layer, and an isolation layer positioned between the first metal interface layer and the second metal interface layer, where at least one of the first metal interface layer and the second metal interface layer comprises a liquid metal.

Abstract: Fine-grained (average grain size 1 nm to 1,000 nm) metallic coatings optionally containing solid particulates dispersed therein are disclosed. The fine-grained metallic materials are significantly harder and stronger than conventional coatings of the same chemical composition due to Hall-Petch strengthening and have low linear coefficients of thermal expansion (CTEs). The invention provides means for matching the CTE of the fine-grained metallic coating to the one of the substrate by adjusting the composition of the alloy and/or by varying the chemistry and volume fraction of particulates embedded in the coating. The fine-grained metallic coatings are particularly suited for strong and lightweight articles, precision molds, sporting goods, automotive parts and components exposed to thermal cycling. The low CTEs and the ability to match the CTEs of the fine-grained metallic coatings with the CTEs of the substrate minimize dimensional changes during thermal cycling and prevent premature failure.

Abstract: Disclosed herein is a carrier for manufacturing a substrate, including: an insulation layer including a first metal layer formed on one side or both sides thereof; a second metal layer formed on one side of the first metal layer; and a third metal layer formed on one side of the second metal layer, wherein the second metal layer has a lower melting point than the first metal layer or the third metal layer. The carrier is advantageous in that a build up layer can be separated from a carrier by heating, so that a routing process is not required, with the result that the size of a substrate does not change when the build up layer is separated from the carrier, thereby reusing the carrier and maintaining the compatibility between the substrate and manufacturing facilities.

Abstract: Disclosed herein is a carrier for manufacturing a substrate, including: two insulation layers, each being provided on one side thereof with a first metal layer and on the other side thereof with a second metal layer; and a third metal layer having a lower melting point than the first metal layer and formed between the two first metal layers respectively formed on the two insulation layers such that the two first metal layers are attached to each other. The carrier is advantageous in that the carrier can be separated by heating the third metal layer, so that the size of a substrate does not change at the time of separating the carrier, thereby maintaining the compatibility between a substrate and manufacturing facilities.

Abstract: A method of forming an electrode includes casting a molten metal in a mould to form an electrode with a header portion and a blade portion. The blade portion of the electrode is then rolled after it has been cast. The blade portion may be rolled into at least two different thicknesses. In one embodiment the metal is lead or lead alloy and the method relates to the forming of a lead or lead alloy anode.

Abstract: A media for storing information comprises a substrate, a conductive layer formed over the substrate, and a ferroelectric layer epitaxially formed on the conductive layer. The ferroelectric layer includes an a-lattice constant that is substantially matched to an a-lattice constant of the conductive layer and an average c-lattice constant that is longer than an average c-lattice constant of a bulk-grown ferroelectric layer.

Abstract: A bonding pad structure for a semiconductor device includes a first lower metal layer beneath a second upper metal layer in a bonding region of the device. The lower metal layer is formed such that the metal of the lower metal layer is absent from the bonding region. As a result, if damage occurs to the structure during procedures such as probing or bonding at the bonding region, the lower metal is not exposed to the environment. Oxidation of the lower metal layer by exposure to the environment is prevented, thus improving reliability of the device.

Abstract: According to one aspect of the invention, a structure and method for providing improved thermal conductivity of a thermal interface material (TIM) made of phase changed polymer matrix and a fusible filler material is disclosed. The TIM may also have a non-fusible filler material and a percentage of a non-phase change polymer added to the phase change polymer matrix. The TIM, used to mate and conduct heat between two or more components, can be highly filled systems in a polymeric matrix where the fillers are thermally more conductive than the polymer matrix.

Abstract: A multilayer sliding bearing includes a rigid metal backing having a metal bearing liner attached thereto. The metal bearing liner includes a metal bearing liner layer which is attached to the bearing surface of the metal backing layer and at least one metal overplate layer deposited over an outer surface of the metal bearing liner layer. The metal bearing liner layer has a layer of hard particles embedded in an outer surface thereof which is adjacent to the inner surface of the at least one metal overplate layer. The bearing may also include a barrier layer interposed between the metal bearing liner layer and the metal over plate layer to inhibit diffusion therebetween and/or promote adhesion of the metal over plate layer to the metal bearing liner layer. The invention may also include a thin metal protective coating layer over the outer surface of the bearing liner and backing layer.

Abstract: A disk with an Ag reflective layer, a recording layer including elements Sb and Te, and a dielectric layer including S provided between the reflective layer and the recording layer has the problems of corrosion of the Ag reflective layer, decline of the signal quality due to insufficient heat releasing ability, and exfoliation between the layers. (1) A phase-change optical disk includes, on a transparent substrate, a recording layer in which an optically detectable reversible change between an amorphous phase and a crystalline phase can be caused by irradiation with an energy beam, a reflective layer, and a dielectric layer arranged between the recording layer and the reflective layer, wherein the main component of the dielectric layer is an oxide or a nitrooxide of Ta.

Abstract: There is provided an optical recording medium having a phase-change recording layer formed based on a drastically new concept of making the content of Mn still higher than the prior art while using Sb as a main component. The optical recording medium has a recording layer composed of a plurality of elements, and the recording layer contains Sb, and also has an Mn content of more than 20 atomic % but not more than 40 atomic %, on condition that the total amount of all the elements composing the recording layer is 100 atomic %.

Abstract: According to one aspect of the invention, a structure and method for providing improved thermal conductivity of a thermal interface material (TIM) made of phase changed polymer matrix and a fusible filler material is disclosed. The TIM may also have a non-fusible filler material and a percentage of a non-phase change polymer added to the phase change polymer matrix. The TIM, used to mate and conduct heat between two or more components, can be highly filled systems in a polymeric matrix where the fillers are thermally more conductive than the polymer matrix.

Abstract: The present invention describes a method including providing a component, the component having a bond pad; forming a passivation layer over the component; forming a via in the passivation layer to uncover the bond pad; and forming an under bump metallurgy (UBM) over the passivation layer, in the via, and over the bond pad, in which the UBM includes an alloy of Aluminum and Magnesium. The present invention also describes an under bump metallurgy (UBM) that includes a lower layer, the lower layer including an alloy of Aluminum and Magnesium; and an upper layer located over the lower layer.

Abstract: An R-T-B magnet (R is at least one kind of rare-earth elements including Y, and T is Fe or Fe and Co) has an electrolytic copper-plating film where the ratio [I(200)/I(111)] of the X-ray diffraction peak intensity I(200) from the (200) plane to the X-ray diffraction peak intensity I(111) from the (111) plane is 0.1-0.45 in the X-ray diffraction by CuKal rays. This electrolytic copper-plating film is formed by an electrolytic copper-plating method using an electrolytic copper-plating solution which contains 20-150 g/L of copper sulphate and 30-250 g/L of chelating agent and contains no agent for reducing copper ions and has a pH adjusted to 10.5-13.5.

Abstract: To provide a plating method, which enables wide industrial use of the redox system electroless plating method having excellent characteristics, and a plating bath precursor which is preferable for the plating method. The plating method comprises a process oxidizing first metal ions of a redox system of a plating bath from a lower oxidation state to a high oxidation state, and second metal ions of said redox system are reduced and deposited onto the surface of an object to be plated, wherein a process is provided in which by supplying the electrical current to the plating bath, the first metal ions are reduced from said lower oxidation state to thereby activate the plating bath. The plating bath precursor is formed stabilizing the plating bath so that reduction and deposition of the second metal ions substantially do not occur in order to improve its storing performance.

Abstract: A phase-change optical recording medium capable of implementing record and readout operations of information data through reversible phase transition between amorphous and crystalline states induced by light beam irradiation in a recording layer included in the recording medium, including at least a transparent substrate and contiguous layers formed on the substrate in order as follows, a lower dielectric protective layer, the recording layer, an upper dielectric protective layer, and a reflective/heat dissipating layer, in which the upper dielectric protective layer essentially consists of a mixture of ZrO2 and SiO2, having a composition of (ZrO2)100-x (SiO2)x, where 0<x<60 (mole %).

Abstract: Structure incorporating lead is fabricated from specially prepared components such that mobility of the lead is impeded when the structure is exposed to an unprotected environment such as weathering outdoors or saltwater. In a preferred embodiment, a bullet or bullet core is swaged from a number of bunched electroplated fine lead or lead-alloy wires placed in a die. The lead or lead-alloy wires may be fabricated from lead or lead-alloy wool. The lead alloy may comprise zinc and antimony. The electroplating process plates zinc on the fine wires and may plate a zinc alloy such as zinc-aluminum. The plated surface may be coated with a corrosion resistant coating such as molybdenum phosphate. In addition to bullets and bullet cores, fishing weights, lead shielding, counterweights, ballast, and other lead containing structure may be fabricated or treated using methods and materials of the present invention.

Abstract: A polymer solder hybrid (PSH) thermal interface material (TIM). The PSH TIM includes a solder with a low melt temperature and a filler with a high melt temperature. Upon initiation of reflow, the filler diffuses into the solder to form a new filler-solder alloy having an increased melting point and added robustness.

Abstract: There is provided a multi-layer sliding material, comprising a back metal layer, a bearing alloy layer bonded onto the back metal layer, and a coating layer bonded onto the bearing alloy layer, said coating layer being made of an alloy consisting of 20 to 80 mass % Pb, at least one optional element not more than 10 mass % in total selected from the group consisting of In, Sb, Sn and Ag, and the balance Cu and incidental impurities. The material may further comprise a conforming layer made of an alloy containing not less than 80 mass % Pb.

Abstract: The method of protectively coating metallic uranium which comprises dipping the metallic uranium in a molten alloy comprising about 20-75% of copper and about 80-25% of tin, dipping the coated uranium promptly into molten tin, withdrawing it from the molten tin and removing excess molten metal, thereupon dipping it into a molten metal bath comprising aluminum until it is coated with this metal, then promptly withdrawing it from the bath.

Abstract: Disclosed is a sliding member having a bearing alloy layer and a composite plating film provided on the bearing alloy layer. The composite plating film is made of a lead alloy containing 0.1 to 10 mass percent in total of copper and 0.3 to 25 volume percent in total of co-deposited inorganic particles. The outermost surface layer of the composite plating film, which has a thickness proportion of 10 to 40% to the entire thickness of the composite plating film, does not contain inorganic particles and copper. The lower layer of the composite plating film contains Cu and inorganic particles, such as Si3N4, dispersed therein.

Abstract: The invention relates to a ball limiting metallurgy stack for an electrical device that contains a tin diffusion barrier and thermo-mechanical buffer layer disposed upon a refractory metal first layer. The multi-diffusion barrier layer stack resists tin migration toward the upper metallization of the device.

Abstract: A tin-lead solder alloy containing copper and/or nickel and optionally silver, palladium, platinum and/or gold as its alloying constituents. The solder alloy consists essentially of, by weight, about 5% to about 70% tin, up to about 4% silver palladium, platinum and/or gold, about 0.5% to about 10% copper and/or nickel, the balance lead and incidental impurities. The presence of copper and/or nickel in the alloy has the beneficial effect of inhibiting the dissolution and leaching of silver from a silver-containing thick-film, such as a conductor or solder pad, into the molten solder alloy during reflow. In addition, solder joints formed of the solder alloy form a diffusion barrier layer of intermetallic compounds that inhibit solid-state interdiffusion between silver from a silver-containing thick-film and tin from the solder joint.

Abstract: A ferroelectric Pb5Ge3O11 (PGO) thin film is provided with a metal organic vapor deposition (MOCVD) process and RTP (Rapid Thermal Process) annealing techniques. The PGO film is substantially crystallization with c-axis orientation at temperature between 450 and 650° C. The PGO film has an average grain size of about 0.5 microns, with a deviation in grain size uniformity of less than 10%. Good ferroelectric properties are obtained for a 150 nm thick film with Ir electrodes. The films also show fatigue-free characteristics: no fatigue was observed up to 1×109 switching cycles. The leakage currents increase with increasing applied voltage, and are about 3.6×10−7 A/cm2 at 100 kV/cm. The dielectric constant shows a behavior similar to most ferroelectric materials, with a maximum dielectric constant of about 45. These high quality MOCVD Pb5Ge3O11 films can be used for high density single transistor ferroelectric memory applications because of the homogeneity of the PGO film grain size.

Abstract: Disclosed is a sliding member having a bearing alloy layer and a composite plating film provided on the bearing alloy layer. The composite plating film is made of a lead alloy containing 0.1 to 10 mass percent in total of copper and 0.3 to 25 volume percent in total of co-deposited inorganic particles. The outermost surface layer of the composite plating film, which has a thickness proportion of 10 to 40% to the entire thickness of the composite plating film, does not contain inorganic particles and copper. The lower layer of the composite plating film contains Cu and inorganic particles, such as Si3N4, dispersed therein.

Abstract: There is provided a multi-layer sliding material, comprising a back metal layer, a bearing alloy layer bonded onto the back metal layer, and a coating layer bonded onto the bearing alloy layer, said coating layer being made of an alloy consisting of 20 to 80 mass % Pb, at least one optional element not more than 10 mass % in total selected from the group consisting of In, Sb, Sn and Ag, and the balance Cu and incidental impurities. The material may further comprise a conforming layer made of an alloy containing not less than 80 mass % Pb.

Abstract: A thermal interface material is described for thermal coupling of an electronic component to a thermally conductive member. The thermal interface material includes a viscoelastic polymer matrix material, fusible solder particles in the matrix material, and filler particles in the matrix material. The solder particles have a melting temperature below a selected temperature (e.g. 157° C. for indium) and the filler particles have a melting temperature substantially above the selected temperature (e.g. 961° C. for silver). The filler particles keep the thermal interface material intact under adverse thermal and stress conditions.

Abstract: A lead alloy coating for a positive grid of a lead acid battery is provided. The lead alloy coating includes a tin content of at least about 0.1%, but not more than about 3%; and a residual lead content. The lead alloy coating optionally includes a calcium content of at least about 0.01%, but not more than about 0.1%, with or without a silver content of at least about 0.01%, but not more than about 0.1%. Alternatively, the lead alloy coating optionally includes a barium content of at least about 0.01%, but not more than about 0.1%, with or without a silver content of at least about 0.01%, but not more than about 0.1%.

Abstract: Lead alloy strip material (4, 6, 8) is roll bonded on one or both opposite face surfaces of a core strip material (2). The core material can be commercially pure titanium, austenitic stainless steel, low carbon steel, copper, aluminum, alloys thereof or other suitable metal that has sufficient ductility and that can provide desired attributes of stiffness and corrosion resistance to the composite. The lead alloy material is strengthened by the addition of less than approximately 1% of calcium or antimony and the core material is softened by fully annealing it prior to bonding. The several strips are reduced in thickness, preferably in approximately the same proportion, by at least 40% in the bonding pass to create a solid phase bond among the strips. The bonded composite is then rolled to final gauge and, for selected applications, is corrugated and cut to form panels (20, 22, 24) and etched to form pockets (8b) for pasting of active materials such as lead oxide for battery plates.

Abstract: A printed circuit board including electrical circuitry formed on an outer surface of the printed circuit board, the circuitry comprising copper or a copper alloy; a final finish on the circuitry, the final finish including a coating of tin on the copper or copper alloy circuitry; and an alloy cap layer on the tin coating, the alloy cap layer comprising at least two immersion-platable metals. The immersion platable metals in the alloy cap layer may be at least two metals selected from tin, silver, bismuth, copper, nickel, lead, zinc, indium, palladium, platinum, gold, cadmium, ruthenium and cobalt. The circuitry remains whisker free and solderable.

Abstract: This invention relates to a solder member for external connection joined to a connection terminal formed on a surface of a printed wiring board corresponding to a conductor pattern and having an electroless Ni/Au plated layer, wherein the solder member is a ball-shaped solder containing finely powdered copper and has an excellent joint strength to the connection terminal.

Abstract: A process for the production of sliding elements in which an overlay of lead-tin-copper is applied by electroplating to the prefabricated semi-finished product, and in which a ternary, fluoroborate-free electroplating bath is used without brighteners and with the addition of non-ionic wetting agents and free alkyl sulfonic acid. After the deposition of the galvanic overlay a heat treatment is carried out in the temperature range of 150° C. to 200° C. for between 1 and 100 hours. The multilayer material for sliding elements comprises at least a backing and an overlay of 12 to 16 wt. % tin and 7 to 11 wt. % copper, the rest being lead. The overlay comprises 15 to 25 wt. % particles of intermetallic compound Cu6Sn5.

Abstract: A diffusion-soldered joint and a method for making diffusion-soldered joints includes a particularly actively diffusing, low-melting-point intermediate layer, applied in the molten state, introduced in the form of a solder carrier between at least two joint components. The solder carrier includes a metal foil that is equipped on both sides with solder layers, wherein the solder layers may include multiple layers.

Abstract: A metal lid for use in hermetic sealing of a semiconductor package comprises a lid body comprising a metal plate having a solder layer secured to the entire surface of the metal lid by cladding. The lid is placed in position on a substrate and can seal the resulting package by heating to melt the solder layer. The lid can be readily mass-produced and can seal the package with high seal reliability and without deposition of solder balls on the inner wall of the package.

Abstract: The bonding material for an electronic component comprises a metal material and fine resin particles dispersed in the metal material. Such a material may form an electrical “bump” for the component.

Abstract: There is described an electrodeposited alloy layer, in particular an overlay (2) of a plain bearing, comprising a layered alloy having at least one alloying element in addition to a base metal (3), in whose matrix containing the alloying element in a finely crystalline form inorganic particles with a diameter smaller than 2 &mgr;m are incorporated finely divided. To ensure the finely crystalline structure of the alloying element deposited in the alloy matrix, it is proposed that the inorganic particles used as nucleating agents with a diameter of 0.01 to 1 &mgr;m should have a crystal form at least substantially corresponding to the form of crystallization of the alloying element.

Abstract: A paste is described for capping electrodes with an oxide free metal layer incorporating a solvent, an unzippable polymer and particles. The electrode could be an interconnect such as a C4 bump. A method for forming a coating and for testing integrated circuit chips is also described. The invention overcomes the problem of interconnecting Pb containing electrodes that are covered with an insulating oxide on integrated circuit chips by coating the Pb containing electrode with Au to provide an oxide free surface for testing and interconnection.

Abstract: A process for altering surface properties of a mass of metal alloy solder comprising a first metal and a second metal. The process comprises exposing the mass to energized ions to preferentially sputter atoms of the first metal to form a surface layer ratio of first metal to second metal atoms that is less than the bulk ratio. The solder may be located on the surface of a substrate, wherein the process may further comprise masking the substrate to shield all but a selected area from the ion beam. The sputtering gas may comprises a reactive gas such as oxygen and the substrate may be an organic substrate. The process may further comprise simultaneously exposing the organic substrate to energized ions of the reactive gas to roughen the organic substrate surface.

Abstract: An article comprising a metal circuit and/or a heat-radiating metal plate formed on a ceramic substrate, wherein the metal circuit and/or the heat-radiating metal plate comprise either (1) the following first metal-second metal bonded product, wherein the first metal and the second metal are different, or (2) the following first metal-third metal-second metal bonded product, and wherein in (1) and (2), the first metal is bonded to the ceramic substrate; first metal: a metal selected from the group consisting of aluminum (Al), lead (Pb), platinum (Pt) and an alloy containing at least one of these metal components; second metal: a metal selected from the group consisting of copper (Cu), silver (Ag), gold (Au), aluminum (Al) and an alloy containing at least one of these metal components; and third metal: a metal selected from the group consisting of titanium (Ti), nickel (Ni), zirconium (Zr), molybdenum (Mo), tungsten (W) and an alloy containing at least one of these metal components.

Abstract: In a magnetic recording medium such as a floppy disk, a fatty acid ester compound having at least one side chain group with a molecular weight of 70 or more is added as a lubricant to a non-magnetic under layer or a magnetic recording layer in order to prevent migration of a lubricant to a liner.

Abstract: Focusing and tracking can be stably performed using an optical information recording medium in which a high reflectivity and a large reflective change amount can be attained, and the reflectivity change amounts of the lands and grooves are set equal to each other by forming, between a transparent substrate and a first protective layer, an interference layer containing at least one material selected from the group consisting of Au, Ag, Cu, Si, and Ge. Even if information is recorded on the lands and the grooves, it can be recorded/reproduced without any crosstalk from an adjacent track.

Abstract: A phase-change optical disc that is adapted to weaken a self-sharpening effect and to be driven by a pulse width modulation system. In the disc, a dielectric layer formed on the surface of a recording layer and a heat flow control layer is sequentially disposed. The heat flow control layer is formed to include a material having a high heat conductivity and a material having a low heat conductivity.