Abstract: A metal structure is supported by a concrete foundation with a ground ring nearby. A telecommunication module configured to operate with a 5G wireless standard is mounted on top of the metal structure and separated from the metal structure by an insulating barrier. The ground ring has at least three monopole grounding wires. A grounding cable connects the telecommunication module to the ground ring. A base transfer station cabinet is offsite from the metal structure and includes a plurality of cabinet ground conductor wires connecting to the ground ring. A hybrid cable, comprising a supply cable and a return cable, connects the base transfer station cabinet to the telecommunication module. Any stray current from the telecommunication module is directed away from the metal structure by the insulating barrier, and the stray current is directed to the ground ring through the grounding cable.

Abstract: A structure includes a copper or copper alloy plating layer, in which Kirkendall void formation is suppressed. The copper or copper alloy plating layer is formed by electroplating at a prescribed first cathode current density by using a copper or copper alloy electroplating bath and then completing the electroplating after the first cathode current density is changed to a lower second cathode current density. The first cathode current density is a single cathode current density in the electroplating at this current density or an average cathode current density in the electroplating by combining plural cathode current densities. The first cathode current density is at lowest 5 A/dm2. A layer formed by changing the first cathode current density to the second cathode current density is a surface layer part of the copper or copper alloy plating layer, which can have a thickness of 0.05 ?m to 15 ?m.

Abstract: A terminal material for a connector provided with a base material in which at least a surface layer is made of copper or copper alloy, a nickel-plating layer made of nickel or nickel alloy and formed on a surface of the base material, a silver-nickel alloy plating layer made of silver-nickel alloy and formed on at least a part of the nickel-plating layer, and a silver-plating layer made of silver and formed on the silver-nickel alloy plating layer; the silver-nickel alloy plating layer has a film thickness 0.05 µm or more and less than 0.50 µm and a nickel content 0.03 at% or more and 1.00 at% or less.

Abstract: A tin-plated copper terminal material in which on a substrate made of copper or copper alloy, a nickel-or-nickel-alloy layer, a copper-tin alloy layer, and a tin layer are laminated in this order; in this material, the tin layer has an average thickness 0.2 ?m to 1.2 ?m inclusive; the copper-tin alloy layer is a compound alloy layer in which Cu6Sn5 is a main ingredient and part of copper in the Cu6Sn5 is substituted with nickel, and an average crystal grain size is 0.2 ?m to 1.5 ?m inclusive; part of the copper-tin alloy layer appears on a surface of the tin layer and tin solidification parts exist like islands; and the tin solidification parts have an average diameter 10 ?m to 1000 ?m inclusive in a direction along the surface of the tin layer and an area ratio to the surface of the tin layer 1% to 90% inclusive.

Abstract: In a terminal material with a silver coating film including a silver layer on a surface, a terminal and a terminal material having high reliability are easily manufactured with low cost without a heat treatment. A base material formed of copper or a copper alloy; and nickel layer, an intermediate layer, and a silver layer laminated on the base material in this order are included, the nickel layer has a thickness of 0.05 ?m to 5.00 ?m and is formed of nickel or a nickel alloy, the intermediate layer has a thickness of 0.02 ?m to 1.00 ?m and is an alloy layer containing silver (Ag) and a substance X, and the substance X includes one or more kinds of tin, bismuth, gallium, indium, and germanium.

Abstract: A multilayer ceramic electronic component includes multilayer ceramic electronic component bodies which each include a multilayer body and first and second outer electrodes provided on both end surfaces of the multilayer body. The multilayer ceramic electronic component also includes a first metal terminal connected to the first outer electrodes and a second metal terminal connected to the second outer electrodes. Each multilayer ceramic electronic component body includes a dimension in a lamination direction that is less than a dimension in a width direction, and is positioned so that one of the first and second side surfaces faces a mounting surface. The first and second metal terminals extend between the first and second outer electrodes of the multilayer ceramic electronic component bodies. The multilayer bodies, first and second outer electrodes, and at least portions of the first and second metal terminals are covered by a cover material.

Abstract: The invention relates to a composition for electrolytic nickel plating. In order to provide an improved composition, it is proposed that it comprises one or a plurality of nickel ion sources and a mono-, di- or tri-hydroxybenzene compound, preferably a hydroquinone compound or the salts thereof or mixtures thereof.

Abstract: Provided is a tin-plated copper terminal material, a terminal formed from the terminal material, and an electric-wire terminal structure using the terminal: the terminal material has a substrate of copper or a copper alloy; an intermediate zinc layer of a zinc alloy that is formed on the substrate and has a thickness of 0.10 ?m to 5.00 ?m; and a tin layer of tin or a tin alloy that is formed on the intermediate zinc layer and in which the length proportion occupied by low-angle grain boundaries is 2% to 30% with respect to the total length of all crystal grain boundaries; wherein galvanic corrosion is effectively suppressed.

Abstract: The present invention discloses a copper alloy, which includes: 5 wt % to 15 wt % of Zn, 0.2 wt % to 2.5 wt % of Sn, 0.1 wt % to 2.0 wt % of Ni, 0.01 wt % to 0.3 wt % of P, 0 to 0.3 wt % of Mg, 0 to 0.5 wt % of Fe, and a balance of Cu and inevitable impurities. Preferably, it is controlled that 1.0 wt %?Ni+Sn?3.5 wt %, the weight ratio of Ni to Sn is 0.08 to 10; the weight ratio of Ni to P is 2 to 15, Ni and P form a NiP compound in a matrix. During the crystal orientation analysis using EBSD measurement, the area in a Brass orientation {011}<211> at a derivation angle of less than 15° accounts for 10% to 25%. The yield strength 600 MPa, the electrical conductivity is ?25% IACS, and the bending machinability is excellent because the value R/t in a GW direction is ?1 and the value R/t in a BW direction is ?2.

Abstract: A bearing member 1 is provided with a coating layer 3 on an inner circumferential surface of a shaft hole 1A into which a shaft body 2 is to be fitted. The coating layer 3 is composed of a metal base material 3A and a heat conductive material 3B that is dispersed in the base material 3A and that has a thermal conductivity relatively higher than that of the base material 3A. The heat conductive material 3B has lengths Lb and Lc in directions B and C along a surface of the coating layer 3, longer than a length La in a thickness direction A of the coating layer 3, whereby thermal conductive characteristics in the directions B and C along the inner circumferential surface of the shaft hole 1A are enhanced. Thus, heat dissipation is improved, whereby temperature rise due to sliding contact with the shaft body 2 is suppressed, and seizure resistance is improved.

Abstract: Provided is an electrical contact material that can suppress an increase in contact resistance even if contact pressure with a counterpart material is small. An electrical contact material that includes a base material made of metal, a metal layer provided on a surface of the base material, and an oxide layer provided on a surface of the metal layer. The metal layer is made of metal that contains zinc, copper, and tin, the oxide layer is made of an oxide that contains zinc, copper, and tin, and beneath the oxide layer, a ratio of the atomic concentration of copper to the atomic concentration of tin is less than 1.4.

Abstract: A terminal material for a connector terminal, using a copper or copper alloy substrate is crimped to an end of wire formed from an aluminum wire material; and a terminal using this terminal material: a zinc layer 4 that is formed of zinc or a zinc alloy and a tin layer 5 that is formed of tin or a tin alloy are sequentially laminated in this order on a substrate 2 that is formed of copper or a copper alloy: with respect to the zinc layer and the tin layer, the adhesion amount of tin contained in the whole layers is from 0.5 mg/cm2 to 7.0 mg/cm2 (inclusive) and the adhesion amount of zinc contained in the whole layers is from 0.07 mg/cm2 to 2.0 mg/cm2 (inclusive), and the content percentage of zinc in the vicinity of the surface is from 0.2% by mass to 10.0% by mass (inclusive).

Abstract: On a base member made of copper or a copper alloy, a zinc-nickel alloy layer including zinc and nickel, and a tin layer made of tin alloy are laminated in this order: the zinc-nickel alloy layer has a thickness of 0.1-5 ?m inclusive and has a nickel content of 5-50 mass % inclusive, the tin layer has a zinc concentration of 0.6-15 mass % inclusive, and, under an oxide layer which is the outermost layer, a metal zinc layer, having a zinc concentration of 5-40 at % inclusive and a thickness of 1-10 nm inclusive in SiO2 conversion, is formed on the tin layer.

Abstract: A tin-plated product contains: a substrate 10 of copper or a copper alloy; an underlying layer 12 of nickel which is formed on the surface of the substrate 10; and an outermost layer 14 containing tin, the outermost layer 14 being formed on the surface of the underlying layer 12, the outermost layer 14 being composed of a copper-tin alloy layer 14a of a large number of crystal grains of a copper-tin alloy, tin layers 14b of tin having an average thickness of 0.01 to 0.20 micrometers, and a plurality of copper-nickel-tin alloy layers 14c of a copper-nickel-tin alloy, each of the tin layers 14b being formed in a corresponding one of recessed portions between adjacent two of the crystal grains of the copper-tin alloy on the outermost surface of the copper-tin alloy layer, the copper-nickel-tin alloy layers 14c being arranged on the side of the underlying layer 12 in the copper-tin alloy layer 14a so as to be apart from each other.

Abstract: There are provided a tin-plated product which has a zinc plating layer on the surface thereof and which has good corrosion resistance and good adhesion of the zinc plating even if the connecting portion of a terminal of the tin-plated product to an electric wire of aluminum or an aluminum alloy is not processed during press fitting such as swaging (or caulking) when the tin-plated product is used as the material of the terminal which is to be connected to the electric wire by press fitting, and a method for producing the same.

Abstract: A terminal material for connectors, which is obtained by sequentially laminating on a substrate that is formed of copper or a copper alloy, a nickel or nickel alloy layer, a copper-tin alloy layer and a tin layer in this order, and: the tin layer has an average thickness of from 0.2 ?m to 1.2 ?m (inclusive); the copper-tin alloy layer is a compound alloy layer that is mainly composed of Cu6Sn5, with some of the copper in the Cu6Sn5 being substituted by nickel, and has an average crystal grain diameter of from 0.2 ?m to 1.5 ?m (inclusive); a part of the copper-tin alloy layer is exposed from the surface of the tin layer, with the exposure area ratio being from 1% to 60% (inclusive); the nickel or nickel alloy layer has an average thickness of from 0.05 ?m to 1.0 ?m (inclusive) and an average crystal grain diameter of from 0.01 ?m to 0.5 ?m (inclusive).

Abstract: Provided are a plated material having excellent abrasion resistance, electrical conductivity, sliding performance, and low friction, in which a plating layer does not undergo embrittlement properly; and a method for producing the plated material. The method includes a first step of at least partially removing a reflow tin plating layer from a metallic base material having the reflow layer on at least a part thereof and a reactive layer provided at the interface between the reflow layer and the base material; a second step of at least partially subjecting a region in which the reflow tin plating layer has been removed to a nickel plating treatment; a third step of at least partially subjecting the nickel plating layer to a silver strike plating treatment; and a fourth step of at least partially subjecting a region of the silver strike plating to a silver plating treatment.

Abstract: Disclosed herein is a sheet strip including a copper alloy sheet strip, as a base material, and the surface coating layer containing a Ni layer, a Cu—Sn alloy layer and a Sn layer formed on a surface of the copper alloy sheet strip. The copper alloy sheet strip has a structure in which precipitates are dispersed in a copper alloy matrix. The Cu—Sn alloy layer is partially exposed on the outermost surface of the surface coating layer, and a surface exposed area ratio thereof is in a range of 3 to 75%. The Cu—Sn alloy layer contains 1) a ? layer, or 2) a ? phase and a ? phase, the ? phase existing between the Ni layer and the ? phase.

Abstract: A copper alloy sheet strip with a surface coating layer, including: a copper alloy sheet strip, as a base material, including copper, 1.0 to 4.5% by mass of Ni and/or Co and 0.2 to 1.0% by mass of Si, based on the total amount of the copper alloy sheet strip; and a surface coating layer including a Ni layer, a Cu—Sn alloy layer and a Sn layer formed on a surface of the copper alloy sheet strip in this order. A Cu—Sn alloy layer is partially exposed on an outermost surface of the surface coating layer such that a surface exposed area ratio is from 3 to 75%. A surface roughness of the surface coating layer is 0.15 ?m or more in at least one direction, and 3.0 ?m or less in all directions.

Abstract: A terminal pair including a first terminal provided with a first contact portion and a second terminal provided with a second contact portion. The first contact portion includes a composite covering layer having a Sn—Pd based alloy phase and a Sn phase, and has a surface including the Sn—Pd based alloy phase and the Sn phase. The second contact portion includes a Cu—Sn alloy layer and a Sn layer covering part of the Cu—Sn alloy layer, and has a surface including a Cu—Sn alloy region corresponding to an exposed portion of the Cu—Sn alloy layer and a Sn region corresponding to an exposed portion of the Sn layer. A coefficient of friction for sliding movement between the first contact portion and the second contact portion is lower than a coefficient of friction for sliding movement between the two first contact portions and between the two second contact portions.

Abstract: There is provided a titanium-copper alloy in which the adhesion strength with solder can be increased. The titanium-copper alloy comprises a base material and a plating layer provided on a surface of the base material, wherein the base material contains 1.5 to 5.0% by mass of Ti with a balance consisting of copper and unavoidable impurities, and the plating layer is selected from the group consisting of a Ni plating layer, a Co plating layer, and a Co—Ni alloy plating layer.

Abstract: A method of pre-placing a reaction material onto a surface of a metal workpiece substrate involves the use of oscillating wire arc welding. The method involves depositing and adhering the reaction material from a consumable electrode rod. In doing so, the reaction material can be deposited at any time before the metal workpiece substrate is ready for joining by reaction metallurgical joining, and the size and shape of the reaction material deposit can be more easily controlled.

Abstract: An electric contact material for a connector includes a base material made of a metal material; an alloy layer that is formed on the base material and made of an alloy containing at least three elements including Sn and Cu as well as at least one metal selected from Zn, Co, Ni, and Pd; and a conductive coating layer formed on the surface of the alloy layer. The alloy layer contains an intermetallic compound obtained by replacing some of the Cu atoms in Cu6Sn5 with at least one metal selected from Zn, Co, Ni, and Pd. It is preferable that the content of at least one metal selected from Zn, Co, Ni, and Pd in the alloy layer is in a range of 1 to 50 atom % when the total content of the metal and Cu is regarded as 100 atom %.

Abstract: A piston for an internal combustion engine may include a surface in a region on a crankshaft side. The piston may include a thermally conductive coating disposed on the surface via thermal spraying.

Abstract: An electroconductive material includes a Cu or Cu alloy base member, a Cu—Sn alloy coating layer, and a Sn coating layer. The Cu—Sn alloy coating layer has a Cu content of 20 to 70 atomic %, and an average thickness of 0.2 to 3.0 ?m. The Sn coating layer has an average thickness of 0.2 to 5.0 ?m. A surface of the electroconductive material has an arithmetic average roughness Ra of at least 0.15 ?m in at least one direction along the surface and 3.0 ?m or less in all directions along the surface. The Cu—Sn alloy coating layer is partially exposed at the surface of the electroconductive material. An area ratio of the Cu—Sn alloy coating layer exposed at the surface of the electroconductive material is 3 to 75%. An average crystal grain size on a surface of the Cu—Sn alloy coating layer is less than 2 ?m.

Abstract: A method includes providing an electronic assembly, where the electronic assembly has at least one electrical connection that includes at least a surface that is substantially pure tin metal and the pure tin metal has tin whiskers formed thereon and the pure tin metal has a thickness. The method includes exposing the tin metal to at least one mitigating agent selected to interact with the tin metal to oxidize the tin whiskers and mechanically removing substantially all the oxidized tin whiskers from the electronic assembly. The electronic assembly is exposed to the mitigating agent under appropriate conditions to oxidize the tin whiskers.

Abstract: The invention discloses a soldering structure and process of making the same. The soldering structure comprises: a solder, a Sn—Co—Fe intermetallic compound having a thickness less than 10 ?m and a diffusion barrier layer. The process of making the soldering structure is to react the solder containing Sn with an alloy consisting of 85˜95 wt % of Co and 5˜15 wt % of Fe at the temperature between 250 and 300° C.

Abstract: A metallic material for an electrical electronic includes a CU—Sun alloy layer (2) provided on a conductive base (1). A Cu concentration of the Cu—Sn alloy layer gradually decreases from the base side to the surface (3) side.

Abstract: The present invention relates to a tin whisker mitigation material using thin film metallic glass underlayer, which is a thin film metallic glass (TFMG) formed between a metal substrate and a tin layer. Particularly, the TFMG can be a Zr46Ti26Ni28 underlayer or a Zr51.7Cu32.3Al9Ni underlayer, capable of blocking off the interaction occurring in the interface of a copper layer (the metal substrate) and the tin layer, so as to carry out the inhibition of tin whisker growth. Moreover, a variety of experiment data are proposed for proving that the TFMG of the Zr46Ti26Ni28 or the Zr51.7Cu32.3Al9Ni can indeed be used to replace the conventionally used thick tin layer for being the underlayer between the copper layer (the metal substrate) and the tin layer, and then effectively inhibit the interaction occurring in the Cu/Sn interface and the growth of tin whisker by low manufacturing cost way.

Abstract: Provided is a terminal, including: a ground metal part made of a first metallic material; an intermediate layer made of a second metallic material having a smaller value of standard electrode potential than that of the first metallic material, and plated thin on at least a part of a surface of the ground metal part; and a surface layer made of a third metallic material having a smaller value of standard electrode potential than that of the second metallic material, and plated thin on at least a part of a surface of the intermediate layer.

Abstract: The present invention provides metallic materials for electronic components, having low degree of whisker formation, low adhesive wear property and high durability, and connector terminals, connectors and electronic components using such metallic materials.

Abstract: Tin-plated copper-alloy terminal material including a base material made of Cu alloy; a Sn-based surface layer formed on a surface of the base material and having an average thickness of 0.2 ?m or larger and 0.6 ?m or smaller; a Cu—Sn alloy layer generated between the Sn-based surface layer and the base material; and a Ni-based coating layer, formed of Ni or Ni—Sn alloy having a coating thickness of 0.005 ?m or larger and 0.05 ?m or smaller, in which an oil-sump depth Rvk of the Cu—Sn alloy layer measured when the Cu—Sn alloy layer is appeared on a surface by fusing and removing the Sn-based surface layer is 0.2 ?m or larger; a part of the Cu—Sn alloy layer is exposed from the Sn-based surface layer; the Ni-based coating layer is formed on the exposed Cu—Sn alloy layer; and dynamic friction coefficient of the surface is 0.3 or less.

Abstract: A tin-plated copper-alloy terminal material wherein: a Sn-based surface layer formed on a surface of a substrate made of Cu alloy, and a Cu—Sn alloy layer/a Ni—Sn alloy layer/a Ni or Ni alloy layer are formed in sequence from the Sn-based surface layer between the Sn-based surface layer and the substrate; the Cu—Sn alloy layer is a compound-alloy layer containing Cu6Sn5 as a main component and a part of Cu in the Cu6Sn5 is displaced by Ni; the Ni—Sn alloy layer is a compound-alloy layer containing Ni3Sn4 as a main component and a part of Ni in the Ni3Sn4 is displaced by Cu; an arithmetic average roughness Ra of the Cu—Sn alloy layer is 0.3 ?m or more in at least one direction and arithmetic average roughness Ra in all directions is 1.0 ?m or less; an oil-sump depth Rvk of the Cu—Sn alloy layer is 0.5 ?m or more.

Abstract: The present invention provides a metallic material for electronic components having a low degree of whisker formation and a high durability, and connector terminals, connectors and electronic components using the metallic material. The metallic material for electronic components includes: a base material; on the base material, an lower layer constituted with one or two or more selected from the group consisting of Ni, Cr, Mn, Fe, Co and Cu; on the lower layer, an upper layer constituted with an alloy composed of one or both of Sn and In (constituent elements A) and one or two or more of Ag, Au, Pt, Pd, Ru, Rh, Os and Ir (constituent elements B), wherein the thickness of the lower layer is 0.05 ?m or more; the thickness of the upper layer is 0.005 ?m or more and 0.

Abstract: A mating-type connecting part can be obtained by stamping and surface-roughening a copper sheet into a predetermined shape with depressions as a plurality of parallel lines. The copper sheet then has a roughness of from 0.5 ?m to 4.0 ?m parallel to a sliding direction upon connection, a mean projection-depression interval of from 0.01 mm to 0.3 mm in that direction, a skewness less than 0, and a protrusion peak portion height of 1 ?m or less. The copper sheet is then plated with Cu and Sn, followed by reflowing. The result is a connecting part having a Sn surface coating layer group as a plurality of parallel lines, and a Cu-Sn alloy coating layer adjacent to each side of each Sn surface coating layer.

Abstract: A copper sheet is adjusted to have arithmetic mean roughness Ra of from 0.5 ?m to 4.0 ?m in a direction parallel to a sliding direction upon connection, mean projection-depression interval of from 0.01 mm to 0.3 mm in the direction, skewness of less than 0, and protrusion peak portion height of 1 ?m or less. A Sn surface coating layer group X as a plurality of parallel lines is included, and a Cu—Sn alloy coating layer is adjacent to each side of each Sn coating layer. Maximum height roughness is 10 ?m or less in a direction of part insertion. The sheet is surface-roughened by pressing when stamped, thereby forming depressions as a plurality of parallel lines in its surface. The sheet is then plated with Cu and Sn, followed by reflowing.

Abstract: Tin-plated copper-alloy material for terminal having: a substrate made of Cu or Cu alloy; an Sn-based surface layer formed on a surface of the substrate; and a Cu—Ni—Sn alloy layer including Ni formed between the Sn-based surface layer and the substrate, in which the Cu—Ni—Sn alloy layer is made of: fine Cu—Ni—Sn alloy particles; and coarse Cu—Ni—Sn alloy particles, an average thickness of the Sn-based surface layer is not less than 0.2 ?m and not more than 0.6 ?m, an area ratio of the Cu—Ni—Sn alloy layer exposed at a surface of the Sn-based surface layer is not less than 10% and not more than 40%, and a coefficient of kinetic friction of the tin-plated copper-alloy material for terminal is not more than 0.3.

Abstract: The present disclosure generally relates to the field of tin electroplating. More specifically, the present disclosure relates to methods for mitigating tin whisker formation on tin-plated films and tin-plated surfaces by doping the tin with germanium.

Abstract: A connector terminal which can achieve high mechanical connection strength and stabilized low electrical connection resistance when it is crimped to an aluminum electric wire, and in addition, can suppress electrical contact resistance low when it is fitted to a mating connector terminal is provided. In a connector terminal (1A) having an electrical contact section (10) which is brought into contact and conducted with a mating connector terminal by fitting to the mating connector terminal, and a conductor crimping section (12) which is crimped to the conductor of an electric wire, a metal material which constitutes the terminal uses aluminum or an aluminum alloy as a base material (100), a Zn layer (101) having a thickness in the range from 0.1 ?m to 2.0 ?m by electroless plating and a Cu layer (102) having a thickness in the range from 0.5 ?m to 1.0 ?m by electrolytic plating are formed in sequence on the surface of the base material (100), and an Sn layer (105) having a thickness in the range from 0.

Abstract: The present invention relates to a tin whisker mitigation material using thin film metallic glass underlayer, which is a thin film metallic glass (TFMG) formed between a metal substrate and a tin layer. Particularly, the TFMG can be a Zr46Ti26Ni28 underlayer or a Zr51.7Cu32.3Al9Ni underlayer, capable of blocking off the interaction occurring in the interface of a copper layer (the metal substrate) and the tin layer, so as to carry out the inhibition of tin whisker growth. Moreover, a variety of experiment data are proposed for proving that the TFMG of the Zr46Ti26Ni28 or the Zr51.7Cu32.3Al9Ni can indeed be used to replace the conventionally used thick tin layer for being the underlayer between the copper layer (the metal substrate) and the tin layer, and then effectively inhibit the interaction occurring in the Cu/Sn interface and the growth of tin whisker by low manufacturing cost way.

Abstract: The invention relates, in particular, to a composite wire which according to the invention has a structure having a core made of steel or a steel alloy and a copper alloy layer surrounding the core.

Abstract: There are provided a metal material for electronic component which has low insertability/extractability, low whisker formability, and high durability, and a method for manufacturing the metal material. The metal material 10 for electronic components has a base material 11, an A layer 14 constituting a surface layer on the base material 11 and formed of Sn, In or an alloy thereof, and a B layer 13 constituting a middle layer provided between the base material 11 and the A layer 14 and formed of Ag, Au, Pt, Pd, Ru, Rh, Os, Ir or an alloy thereof, wherein the surface layer (A layer) 14 has a thickness of 0.002 to 0.2 ?m, and the middle layer (B layer) 13 has a thickness of 0.001 to 0.3 ?m.

Abstract: It is an object to provide a surface-treated steel sheet which contains no Cr, which is excellent in wet resin adhesion, and which can be used as an alternative to a conventional tin-free steel sheet and to provide a resin-coated steel sheet produced by coating the surface-treated steel sheet with resin. A surface-treated steel sheet including an adhesive layer which is disposed on at least one surface of the steel sheet and which contains Ti and at least one selected from the group consisting of Co, Fe, Ni, V, Cu, Mn, and Zn, the ratio of the total amount of Co, Fe, Ni, V, Cu, Mn, and Zn to the amount of Ti contained therein being 0.01 to ten on a mass basis, and a method for producing the surface-treated steel sheet.

Abstract: A reflow Sn plated material, comprising: a substrate consisting of Cu or a Cu base alloy, and a reflow Sn layer formed on the surface of the substrate, wherein an orientation index of a (101) plane on the surface of the reflow Sn layer is from 2.0 or more to 5.0 or less.

Abstract: Plated contacts and processes of manufacturing plated contacts are disclosed. The processes include providing a metallic substrate, applying tin-containing plating over the metallic substrate, applying corrosion-prevention plating over the first tin-containing plating, applying a second tin-containing plating over the first corrosion-prevention plating, applying a second corrosion-prevention plating over the second tin-containing plating, and applying a gold plating over the second corrosion-prevention plating to form the plated contact. One or both of the first corrosion-prevention plating and the second corrosion-prevention plating includes nickel, a nickel-based alloy, copper, a copper containing alloy, or a combination thereof.

Abstract: An electroconductive material includes a Cu or Cu alloy base member, a Cu—Sn alloy coating layer, and a Sn coating layer. The Cu—Sn alloy coating layer has a Cu content of 20 to 70 atomic %, and an average thickness of 0.2 to 3.0 ?m. The Sn coating layer has an average thickness of 0.2 to 5.0 ?m. A surface of the electroconductive material has an arithmetic average roughness Ra of at least 0.15 ?m in at least one direction along the surface and 3.0 ?m or less in all directions along the surface. The Cu—Sn alloy coating layer is partially exposed at the surface of the electroconductive material. An area ratio of the Cu—Sn alloy coating layer exposed at the surface of the electroconductive material is 3 to 75%. An average crystal grain size on a surface of the Cu—Sn alloy coating layer is less than 2 ?m.

Abstract: Tin-plated copper-alloy terminal material in which Sn-based surface layer is formed on a surface of a substrate made of Cu alloy, and a Cu—Sn alloy layer is formed between the Sn-based surface layer and the substrate; the Cu—Sn alloy layer contains Cu6Sn5 as major proportion and has a compound in which a part of Cu in the Cu6Sn5 is substituted by Ni and Si in the vicinity of a boundary face at the substrate side; an arithmetic average roughness Ra of the Cu—Sn alloy layer is 0.3 ?m or more in at least one direction and an arithmetic average roughness Ra in all direction is 1.0 ?m or less; an oil-sump depth Rvk of the Cu—Sn alloy layer is 0.5 ?m or more; and an average thickness of the Sn-based surface layer is 0.4 ?m or more and 1.0 ?m or less and dynamic friction coefficient is 0.3 or less.

Abstract: A copper substrate for use as a contact having Sn plating, nickel plating and Au plating overlying the substrate. A combination of Sn plating is applied over a copper substrate; nickel plating is applied over the Sn plating; and Au plating is applied over the nickel plating to form a stack. The stack is then processed by a vapor phase Sn reflow step that results in the formation of intermetallics and eliminates stannous oxide layers that may otherwise form on the tin layer. The intermetallic layers provide excellent corrosion resistance, and serve as diffusion barriers to prevent the further migration of either Ni atoms or Cu atoms into the Sn, and Sn atoms outwardly into either the Ni or the Cu. Regardless of the thickness, the interfaces are substantially free of oxides, in particular tin oxide, and not prone to delamination.

Abstract: Tin-plated copper-alloy material for terminal in which: a Sn-based surface layer is formed on a surface of a substrate made of Cu alloy, and a Cu—Sn alloy layer is formed between the Sn-based surface layer and the substrate; the Cu—Sn alloy layer is an alloy layer containing Cu6Sn5 as a major proportion and having a compound in which a part of Cu in the Cu6Sn5 is substituted by Ni and Si in the vicinity of a boundary face at the substrate side; an average thickness of the Sn-based surface layer is 0.2 ?m or more and 0.6 ?m or less; an oil-sump depth Rvk of the Cu—Sn alloy layer is 0.2 ?m or more; an area rate of the Cu—Sn alloy layer exposed at a surface of the Sn-based surface layer is 10% or more and 40% or less; and dynamic friction coefficient is 0.3 or less.

Abstract: A connector terminal, fabricated from a metallic material for connector which material has a tin or tin alloy layer, formed on a copper or copper alloy base material, wherein the thickness of the tin or tin alloy layer at a contact site on the surface of the terminal is smaller than the thickness of the tin or tin alloy layer in the areas other than the contact site, and a copper-tin alloy layer is formed as an under layer of the tin or tin alloy layer at the contact site; and a connector terminal, fabricated from a metallic material for connector which material has a copper or copper alloy base material, wherein a copper-tin alloy layer is formed in a spot shape at a contact site on the surface of the terminal, and a tin or tin alloy layer is formed in the remaining areas on the surface.