Abstract: An inductor component includes a component body having a mounting surface and a top surface and provided therein with a spiral inductor wiring line advancing in the extending direction of a winding center axis. The inductor wiring line is connected to a first external electrode at a first end, and connected to a second external electrode at a second end. The component body includes: a first inclined surface connected to a first end of the mounting surface on a first side in a length direction and inclined toward the top surface as separating from the first end; and a second inclined surface connected to a second end of the mounting surface on a second side in the length direction and inclined toward the top surface as separating from the second end. The winding center axis extends in a direction parallel to the mounting surface and perpendicular to the length direction.

Abstract: The invention relates to a container housing a composition comprising tetrafluoropropene. The container is made from metal and includes an inner surface, said inner surface being in contact with the composition and being at least partially covered with a coating containing zinc. Advantageously, the aforementioned composition comprises at least 15 wt.-% tetrafluoropropene relative to the total weight of the composition.

Abstract: A method for bonding components is disclosed. The method may comprise positioning an interlayer between a metallic component and a metal-plated non-metallic component at a bond region, heating the bond region to a bonding temperature to produce a liquid at the bond region, and maintaining the bond region at the bonding temperature until the liquid has solidified to form a bond between the metallic component and the metal-plated non-metallic component at the bond region. A method for providing a part having a customized coating is also disclosed. The method may comprise applying a metallic coating on a surface of a metallic substrate, and bonding the metallic coating to the metallic substrate by a transient liquid phase bonding process to provide the part having the customized coating.

Abstract: An inductor component includes a component body having a mounting surface and a top surface and provided therein with a spiral inductor wiring line advancing in the extending direction of a winding center axis. The inductor wiring line is connected to a first external electrode at a first end, and connected to a second external electrode at a second end. The component body includes: a first inclined surface connected to a first end of the mounting surface on a first side in a length direction and inclined toward the top surface as separating from the first end; and a second inclined surface connected to a second end of the mounting surface on a second side in the length direction and inclined toward the top surface as separating from the second end. The winding center axis extends in a direction parallel to the mounting surface and perpendicular to the length direction.

Abstract: A coil component according to one or more embodiments includes a base body having first to sixth surfaces, and a coil conductor including a winding portion that extends around a coil axis intersecting the first and second surfaces. The winding portion includes first, second, third, and fourth portions facing the third, fourth, fifth, and sixth surfaces, respectively when viewed from a direction of the coil axis. The radii of curvature of the first and second portions are both smaller than the radii of curvature of the third and fourth portions. When viewed from the direction of the coil axis, a distance between the first portion and the third surface is larger than a distance between the third portion and the fifth surface.

Abstract: A metal paste that includes a metal component and a flux. The metal component includes a first metal powder and a second metal powder. The first metal powder is Sn. The second metal powder is a CuNi alloy. The metal paste is heated for a time t1 to a temperature T1 where the first metal powder is melted. Next, the metal paste is heated for a time t2 longer than the time t1 at a temperature T2 lower than the temperature T1 to produce an intermetallic compound from the first metal Sn and the second metal CuNi alloy.

Abstract: An inductor component includes first and second inductor wiring lines, a first vertical wiring line, a second vertical wiring line, and a third vertical wiring line, wherein the first vertical wiring line and the second vertical wiring line are connected to the first end portion and the second end portion of the first inductor wiring line, respectively, and the third vertical wiring line and the second vertical wiring line are connected to the first end portion and the second end portion of the second inductor wiring line, respectively.

Abstract: A subelement (1) for an Nb3Sn-containing superconductor wire includes an Sn-containing core (2), an inner matrix (5) which includes Cu and surrounds the Sn-containing core (2), a region (7) of mutually abutting Nb-containing rod elements (8, 30), which surrounds the inner matrix (5), where the Nb-containing rod elements (8, 30) are each configured with an Nb-containing core filament (9; 31) and a Cu-containing filament casing (10), an outer matrix (6) which includes Cu and surrounds the region (7) of Nb-containing rod elements (8, 30). The Sn-containing core (2) has a core tube (3) into which an Sn-containing powder (4) has been introduced, the Sn-containing powder (4) being in a compacted state. This provides a subelement for an Nb3Sn-containing superconductor wire which cost-effectively yields an improved superconducting current carrying capacity.

Abstract: An inductor component includes a main body formed in a flat-plate shape and including a magnetic layer; an inductor wiring line disposed on a plane inside the main body; a first vertical wiring line that extends, from a pad portion which is an end portion of the inductor wiring line, in a first direction to pass through the inside of the main body, and is exposed on a first principal surface side of the main body; a second vertical wiring line that extends, from the pad portion of the inductor wiring line, in a second direction to pass through the inside of the main body, and is exposed on a second principal surface side of the main body; and an insulation layer of a non-magnetic body. The first vertical wiring line includes a via conductor and a columnar wiring line. The second vertical wiring line includes a columnar wiring line.

Abstract: A coil component according to one or more embodiments includes a base body having first to sixth surfaces, and a coil conductor including a winding portion that extends around a coil axis intersecting the first and second surfaces. The winding portion includes first, second, third, and fourth portions facing the third, fourth, fifth, and sixth surfaces, respectively when viewed from a direction of the coil axis. The radii of curvature of the first and second portions are both smaller than the radii of curvature of the third and fourth portions. When viewed from the direction of the coil axis, the distance between the first portion and the third surface and the distance between the second portion and the fourth surface are both larger than the distance between the third portion and the fifth surface and the distance between the fourth portion and the sixth surface.

Abstract: A system and method for treating a cavity comprises arranging a niobium structure in a coating chamber, the coating chamber being arranged inside a furnace, coating the niobium structure with tin thereby forming an Nb3Sn layer on the niobium structure, and doping the Nb3Sn layer with nitrogen, thereby forming a nitrogen doped Nb3Sn layer on the niobium structure.

Abstract: A lead-free silver-free solder alloy may comprise tin, copper, bismuth, cobalt, and antimony. Alternatively, the alloy may comprise gallium in lieu of cobalt. The alloy may further comprise nickel, germanium, or both. The copper may be present in an amount from about 0.5% to 0.9% by weight of the solder. The bismuth may be present in an amount from about 1.0% to about 3.5% by weight of the solder. The cobalt may be present in an amount from about 0.02% to about 0.08% by weight of the solder. Where gallium is used in lieu of cobalt, the gallium may be present in an amount from about 0.2% to about 0.8% by weight of the solder. The antimony may be present in an amount between about 0.0% to about 0.09% by weight of the solder. The balance of the solder is tin.

Abstract: An electrical contact material (10) having: a conductive substrate (1) formed from copper or a copper alloy; a first intermediate layer (2) provided on the conductive substrate (1); a second intermediate layer (3) provided on the first intermediate layer (2); and an outermost layer (4) formed from tin or a tin alloy and provided on the second intermediate layer (3), wherein the first intermediate layer (2) is constructed as one layer of grains extending from the conductive substrate (1) side to the second intermediate layer (3) side, and wherein, in the first intermediate layer (2), the density of grain boundaries (5b) extending in a direction in which the angle formed by the grain boundary in interest and the interface between the conductive substrate and the first intermediate layer is 45° or greater, is 4 ?m/?m2 or less; a method of producing the same; and a terminal.

Abstract: A solder ball according to the present invention contains 0.2 to 2.2% by mass of Zn, and a balance of Sn, and has a spherical diameter of 0.1 to 120 ?m and a yellowness (b*) in an L*a*b* color system of 2.70 or more and 9.52 or less. An oxide film is formed by performing aging treatment. By producing a solder ball having a yellowness of 2.70 or more and 9.52 or less, it is possible to suppress the growth of a Cu3Sn layer and/or a Cu—Zn(—Sn) layer during joining.

Abstract: It is aimed to provide a press-fit terminal connection structure in which a board connecting portion of a press-fit terminal is press-fit into a through hole provided in a printed circuit board and which can combine the suppression of scraping of a surface layer and a reduction of a necessary load when the press-fit terminal is inserted into and withdrawn from the through hole and an improvement of a holding force for keeping the press-fit terminal inserted in the through hole. In the press-fit terminal connection structure, the press-fit terminal includes, at least on a surface of the contact point portion, an alloy containing layer mainly containing tin and palladium, and the through hole includes a tin layer on an outermost surface of an inner peripheral surface including at least the contact point portion.

Abstract: A method of iteratively screening a sample of electrolytic capacitors having a predetermined rated voltage is provided. The method can include measuring a first leakage current of a first set of capacitors, calculating a first mean leakage current therefrom, and removing capacitors from the first set having a first leakage current equal to or above a first predetermined value, thereby forming a second set of capacitors. The second set can be subjected to a burn in heat treatment where a test voltage can be applied, then a second leakage current of the second set of capacitors can be measured and a second mean leakage current can be calculated. Capacitors having a second leakage current equal to or above a second predetermined value can be removed from the second set, forming a third set of capacitors. Because of such iterative screening, the capacitors in the third set have low failure rates.

Abstract: A metal pattern structure having a positioning layer thereon is provided. The positioning layer is located within a predetermined region of the metal pattern structure and located directly on the surface of a metal layer of the metal pattern structure.

Abstract: It is an object of the invention to provide a magnesium welding wire excellent in surface cleanliness and a method for manufacturing the same. A welding wire according to the invention can be manufactured by drawing a base material such as an extruded material made of pure magnesium or a magnesium-based alloy and, after then, by shaving the surface of the thus drawn wire. Execution of the shaving operation makes it possible not only to effectively remove a lubricant and a coating used in the drawing operation but also to effectively remove an oxide generated during the drawing operation. Thanks to this, the thus obtained welding wire is excellent in surface cleanliness. As a lubricant to be used in the drawing operation, preferably, there may be used an oil lubricant or a wet-type lubricant which can be removed easily by a cleaning operation or by a grease removing treatment.

Abstract: Provided by the present invention is a laminated structure with good use efficiency, in which diffusion of tin from an indium-tin solder material to an indium target is favorably suppressed, and a method for producing the same. The laminated structure has a backing plate, an indium-tin solder material, and an indium target laminated in this order, and the concentration of tin in the 2.5 to 3.0 mm thickness range of the indium target from the indium-tin solder material side surface is 5 wtppm or less.

Abstract: A solder joint manufactured of an alloy essentially composed of 0.01-7.6 wt % Cu, 0.001-6 wt % Ni, and the remaining of Sn. Each of Cu and Ni has a maximum concentration range. The lower limit of the range of Ni is 0.01 wt % and preferably 0.03 wt %. The upper limit of the range of Ni is 0.3 wt % and preferably 0.1 wt %. The lower limit of the range of Cu is 0.1 wt % and preferably 0.2 wt %. The upper limit of the range of Cu is 7 wt % and preferably 0.92 wt %. The invention includes the solder joint essentially having these compositions.

Abstract: A method for producing a Cu—Sn layer and an Sn-based surface layer are formed in this order on the surface of a Cu-based substrate through an Ni-based base layer, and the Cu—Sn layer is composed of a Cu3Sn layer arranged on the Ni-based base layer and a Cu6Sn5 layer arranged on the Cu3Sn layer; the Cu—Sn layer obtained by bonding the Cu3Sn layer and the Cu6Sn5 layer is provided with recessed and projected portions on the surface which is in contact with the Sn-based surface layer; thicknesses of the recessed portions are set to 0.05 ?m to 1.5 ?m, the area coverage of the Cu3Sn layer with respect to the Ni-based base layer is 60% or higher, and the ratio of the thicknesses of the projected portions to the thicknesses of the recessed portions in the Cu—Sn layer is 1.2 to 5.

Abstract: The present invention provides a metallic material for electronic components having a low degree of whisker formation and a high durability, and connector terminals, connectors and electronic components using the metallic material. The metallic material for electronic components includes: a base material; on the base material, an lower layer constituted with one or two or more selected from the group consisting of Ni, Cr, Mn, Fe, Co and Cu; on the lower layer, an upper layer constituted with an alloy composed of one or both of Sn and In (constituent elements A) and one or two or more of Ag, Au, Pt, Pd, Ru, Rh, Os and Ir (constituent elements B), wherein the thickness of the lower layer is 0.05 ?m or more; the thickness of the upper layer is 0.005 ?m or more and 0.

Abstract: Tin-plated copper-alloy material for terminal having: a substrate made of Cu or Cu alloy; an Sn-based surface layer formed on a surface of the substrate; and a Cu—Ni—Sn alloy layer including Ni formed between the Sn-based surface layer and the substrate, in which the Cu—Ni—Sn alloy layer is made of: fine Cu—Ni—Sn alloy particles; and coarse Cu—Ni—Sn alloy particles, an average thickness of the Sn-based surface layer is not less than 0.2 ?m and not more than 0.6 ?m, an area ratio of the Cu—Ni—Sn alloy layer exposed at a surface of the Sn-based surface layer is not less than 10% and not more than 40%, and a coefficient of kinetic friction of the tin-plated copper-alloy material for terminal is not more than 0.3.

Abstract: The present invention relates to a tin whisker mitigation material using thin film metallic glass underlayer, which is a thin film metallic glass (TFMG) formed between a metal substrate and a tin layer. Particularly, the TFMG can be a Zr46Ti26Ni28 underlayer or a Zr51.7Cu32.3Al9Ni underlayer, capable of blocking off the interaction occurring in the interface of a copper layer (the metal substrate) and the tin layer, so as to carry out the inhibition of tin whisker growth. Moreover, a variety of experiment data are proposed for proving that the TFMG of the Zr46Ti26Ni28 or the Zr51.7Cu32.3Al9Ni can indeed be used to replace the conventionally used thick tin layer for being the underlayer between the copper layer (the metal substrate) and the tin layer, and then effectively inhibit the interaction occurring in the Cu/Sn interface and the growth of tin whisker by low manufacturing cost way.

Abstract: There are provided a metal material for electronic component which has low insertability/extractability, low whisker formability, and high durability, and a method for manufacturing the metal material. The metal material 10 for electronic components has a base material 11, an A layer 14 constituting a surface layer on the base material 11 and formed of Sn, In or an alloy thereof, and a B layer 13 constituting a middle layer provided between the base material 11 and the A layer 14 and formed of Ag, Au, Pt, Pd, Ru, Rh, Os, Ir or an alloy thereof, wherein the surface layer (A layer) 14 has a thickness of 0.002 to 0.2 ?m, and the middle layer (B layer) 13 has a thickness of 0.001 to 0.3 ?m.

Abstract: The object of the present invention is to provide an electroconductive layer that retains bondability to a resin layer certainly and is further a layer from which a copper-tin alloy layer is easily removed in a subsequent step, a laminate using this layer, and producing processes thereof. The electroconductive layer of the present invention is an electroconductive layer which is to be bonded to a resin layer, and which contains a copper layer and a copper-tin alloy layer laminated over the copper layer, wherein the copper-tin alloy layer has a thickness of 0.001 to 0.020 ?m.

Abstract: A semiconductor device includes a first semiconductor chip, a first connection structure disposed on a first side of the first semiconductor chip, a second semiconductor chip disposed on a second side of the first semiconductor chip, and a second connection structure disposed between the first and second semiconductor chips, wherein a number of the second connection structures is less than a number of the first connection structures.

Abstract: A core material for an aluminum alloy clad material contains Si in a content of 0.3% to 1.5% (hereinafter “%” means “percent by mass”), Mn in a content of 0.3% t 2.0%, Cu in a content of 0.3% to 1.5%, Ti in a content of 0.01% to 0.5%, and B in a content of 0.001% to 0.1%, with the remainder including Al and inevitable impurities. The core material and an aluminum alloy clad material using the same ensure sufficient corrosion resistance and give a product having an extended life.

Abstract: The present invention relates generally to a coated jewelry article or a coated component of a jewelry article, comprising a jewelry article or a component of a jewelry article, a first metallic coating, and a second metallic coating.

Abstract: The present invention relates generally to jewelry articles comprising a substrate and a metallic, external coating.

Abstract: A method for producing a Cu—Sn layer and an Sn-based surface layer are formed in this order on the surface of a Cu-based substrate through an Ni-based base layer, and the Cu—Sn layer is composed of a Cu3Sn layer arranged on the Ni-based base layer and a Cu6Sn5 layer arranged on the Cu3Sn layer; the Cu—Sn layer obtained by bonding the Cu3Sn layer and the Cu6Sn5 layer is provided with recessed and projected portions on the surface which is in contact with the Sn-based surface layer; thicknesses of the recessed portions are set to 0.05 ?m to 1.5 ?m, the area coverage of the Cu3Sn layer with respect to the Ni-based base layer is 60% or higher, and the ratio of the thicknesses of the projected portions to the thicknesses of the recessed portions in the Cu—Sn layer is 1.2 to 5.

Abstract: A plated steel sheet for cans with excellent secondary adhesion of an organic film and high corrosion resistance is provided, that is, a plated steel sheet for cans, which is a plated steel sheet having a alloy tin layer and a metallic tin layer in sequence from the steel sheet side, wherein a chemical conversion layer comprising tin oxide in an amount of 0.3 to 5.0 mC/cm2 in terms of electricity necessary for reduction and tin phosphate in an amount of 0.5 to 5.0 mg/m2 in terms of P is provided on the metallic tin layer and zirconium(IV) oxide in an amount of 0.2 to 5 mg/m2 in terms of Zr is provided on the chemical conversion layer. A production method thereof is also provided.

Abstract: A first material with a known maximum temperature of operation is coated with a second material on at least one surface of the first material. The coating has a melting temperature that is greater than the maximum temperature of operation of the first material. The coating is heated to its melting temperature until the coating flows into any cracks in the first material's surface.

Abstract: The present invention is directed to a process for tin coating a metallic substrate, and a process for hardening a tin layer and wire having a tin coating The invention relates in particular to a process for tin coating a wire. In the process, firstly a tin layer is applied, and a metal layer made of a metal different to tin is applied thereto. Then, the layers are subjected to a diffusion annealing operation.

Abstract: A solder includes Sn (tin), Bi (bismuth) and Zn (zinc), wherein the solder has a Zn content of 0.01% by weight to 0.1% by weight.

Abstract: A co-evaporation alloy material includes a first evaporation material and a second evaporation material, the first evaporation material being completely covered by the second evaporation material. The second evaporation material is a metal or metal alloy different from the first evaporation material. The melting point of the first evaporation material is lower than the melting point of second evaporation material. An evaporation coating method using the co-evaporation alloy material is also provided.

Abstract: A copper sheet is adjusted to have arithmetic mean roughness Ra of from 0.5 ?m to 4.0 ?m in a direction parallel to a sliding direction upon connection, mean projection-depression interval of from 0.01 mm to 0.3 mm in the direction, skewness of less than 0, and protrusion peak portion height of 1 ?m or less. A Sn surface coating layer group X as a plurality of parallel lines is included, and a Cu—Sn alloy coating layer is adjacent to each side of each Sn coating layer. Maximum height roughness is 10 ?m or less in a direction of part insertion. The sheet is surface-roughened by pressing when stamped, thereby forming depressions as a plurality of parallel lines in its surface. The sheet is then plated with Cu and Sn, followed by reflowing.

Abstract: A transparent conductive thin film comprises at least one stack layer of Ag—Ag3Sn—SnOx, or at least one stack layer of Ag—Ag4Sn—SnOx.

Abstract: An inexpensive bonding method is provided to bond materials constituted of an aluminum-based metal to each other at a low temperature and a low pressure while inhibiting deformation, without requiring the use of a flux and minimizing the influence on the base materials and the periphery. Also provided are various bonded parts obtained by the bonding method. An insert material comprising Zn as an element that undergoes a eutectic reaction with Al is interposed between two materials constituted of an aluminum-based metal. The two materials are heated, while being pressed against each other, to a temperature at which the eutectic reaction takes place, thereby generating, at the bonding interface between the two materials, a melt due to the eutectic reaction with some of the Al contained in the base materials and discharging the Al oxide films from the bonding interface together with the melt. Thus, the two materials are bonded.

Abstract: A semiconductor component including a first layer (10) of a semiconductor material as a substrate, a second layer (12) running on said first layer (10), and at least two intermediate layers (14, 16) made of the materials of the first and second layers running between the first and second layer, where the first intermediate layer (16) facing the second layer (12) may contain a eutectic mixture (18) made of the materials of the first and second layers. The invention is also directed to an electroconductive contact (15, 15a, 15b) forming an electroconductive connection to the first layer and originating at or running through the second layer, as well as to a method for producing the metal-semiconductor contact.

Abstract: The invention relates to a layered composite material for sliding elements, comprising a base layer, applied to the surface of a sliding element, made of an alloy comprising copper or aluminum and a sliding layer situated over said layer, wherein the sliding layer comprises 90.99.6 wt % of tin or tin alloy having a tin ratio of greater than 60 wt % and 0.2-6 wt % solid lubricant particles having a Mohs hardness of ?3 and a particle size of ?10 ?m. The invention further relates to the production of said layered composite material and to use thereof for sliding bearings.

Abstract: The invention relates to an electronic component with Sn rich deposit layer on the part for electric connection, wherein the Sn rich deposit layer is a fine grained Sn rich deposit layer composed of grains with smaller size in the direction perpendicular to the deposit surface than in the direction parallel to the deposit surface. It also relates to a process for plating an electronic component, so as to form a Sn rich deposit layer on the part for electric connection, comprising the steps of: adjusting the composition of tin plating solution in which starter additive and brighter additive are included; moving the electronic component through the tin plating solution, so as to form a fine grained Sn rich deposit layer on the part for electric connection. As compared with the prior art, the invention can validly inhibit the whisker growth with low cost and reliable property.

Abstract: An active solder is revealed. The active solder includes an active material and a metal substrate. There are two kinds of active materials, titanium together with rare earth elements and magnesium. The metal substrate is composed of a main component and an additive. The main component is tin-zinc alloy and the additive is selected from bismuth, indium, silver, copper or their combinations. The active solder enables targets and backing plates to be joined with each other directly in the atmosphere. The target is ceramic or aluminum with low wetting properties. The bonding temperature of the active solder ranges from 150° C. to 200° C. so that the problem of thermal stress can be avoided.

Abstract: A bonded body of electrically conductive materials including a bonding interface structure in which paired bonded members (10, 20) made respectively of electrically conductive materials are surface-bonded to each other. The bonding interface structure has at least: a diffusion bonding region in which the electrically conductive materials are mutually diffused; and a plastic flow bonding region which has a pressure bonded and recrystallized structure through plastic flow of the electrically conductive materials.

Abstract: A material composite has at least one region of copper or a copper alloy, at least one region of a predominantly graphitic material, and at least one boundary region between them. The boundary region has one or more carbides from the group of the IVb, Vb, VIb transition metals and one or more elements of the group consisting of Si, B, Al, Ge, Mn, Sn. In a preferred implementation of the invention, the composite is produced with a back-casting process.

Abstract: The disclosed junction material, manufacturing method thereof, and manufacturing method of junction structure utilize lead-free materials and ensure a high reliability of the junction between a semiconductor element and a frame or substrate, or, between a metal plate and another metal plate. For junctions between a semiconductor element and a frame or substrate, by using as the JUNCTION MATERIAL a laminate material comprising a Zn-based metallic layer (101), Al-based metallic layers (102a, 102b) on both sides thereof, and X-based metallic layers (103a, 103b) (X=Cu, Au, Ag or Sn) on the outside of both the Al-based metallic layers (102a, 102b), even in an oxygen-rich environment, the superficial X-based metallic layers protect the Zn and Al from oxidation until said junction material melts, preserving the wettability and bondability of said junction material as solder and securing the high reliability of the junction.

Abstract: An electroconductive material for a connection component have a base member made of a copper alloy plate, a Ni coating layer, a Cu—Sn alloy coating layer, and a Sn coating layer. A surface of the material is subjected to reflow treatment. The base member surface is roughened. The Cu—Sn alloy coating layer is partially exposed from the outside surface of the Sn coating layer. Regions of the Cu—Sn alloy coating layer exposed to the outside surface of the Sn coating layer have random microstructures distributed irregularly between portions of the Sn coating layer and streak microstructures extending in parallel to a rolled direction of the base member. The streak microstructures having a length of 50 ?m or more and a width of 10 ?m or less are contained in a number of 35 or more per 1 mm2.

Abstract: A coated article includes a substrate, a first magnesium-tin alloy layer, a tin layer, a second magnesium-tin alloy layer, a magnesium layer and a magnesium-nitrogen layer. The substrate is made of magnesium or a magnesium alloy. The substrate made of magnesium or magnesium alloy. The first magnesium-tin alloy layer formed on the substrate. The tin layer formed on the first magnesium-tin alloy layer. The second magnesium-tin alloy layer formed on the tin layer. The magnesium layer formed on the second magnesium-tin alloy layer. The magnesium-nitrogen layer formed on the magnesium layer.

Abstract: Plated steel sheet comprised of steel sheet having a tin alloy layer on it, which is characterized by (i) having free tin distributed on the tin alloy layer in a 5 to 97% area rate and further (ii) having a chemically treated layer having phosphate in an amount of 1.0 to 5.0 mg/m2 in terms of P and tin oxide in an amount of 0.3 to 4.0 mC/cm2 in terms of electricity necessary for reduction, formed on the tin alloy layer and free tin.

Abstract: A fastening mechanism includes a basic body made from a base metal, onto which at least one corrosion-resistant layer is applied. A further layer is applied at least partially onto the at least one corrosion-resistant layer. The further layer has a lower coefficient of friction than the at least one corrosion-resistant layer.