Abstract: The present invention relates to a photocurable adhesive composition and the use of the same. Specifically, said photocurable adhesive composition mainly comprises, based on 100 parts by weight of the adhesive composition, component A: from 70 to 99 parts by weight of one or more polymers carrying (meth)acryloxyl group; component B: from 0 to 30 parts by weight, preferably from 0 to 25 parts by weight of one or more (meth)acrylates monomers; component C: from 0.5 to 10 parts by weight of at least one UV absorber; and component D: from 0 to 5 parts by weight of antioxidant. The present invention also relates to the use of the adhesive composition mentioned above in the production of an ITO substrate for temporarily bonding a substrate and a temporary carrier and going through a high temperature processing, for example, at a temperature of ?160° C., preferably, from 160° C. to 260° C., more preferably from 240° C. to 250° C.

Abstract: A positive-type photosensitive siloxane composition which comprises (I) two or more polysiloxanes that differ in the rate of dissolution in aqueous tetramethylammonium hydroxide (TMAH) solutions, (II) a polysiloxane that gives a film which after prebaking has a rate of dissolution in 2.38 wt-% aqueous TMAH solution of 50-1,000 ?/sec and that has a group soluble in aqueous TMAH solution, other than silanol, (III) a diazonaphthoquinone derivative, and (IV) a solvent.

Abstract: Provided is a photosensitive resin composition which comprises: (A-1) a resin containing a structure represented by general formula (1); and (B) a photo-acid generating agent. In general formula (1), X, R1 to R7, m1 to m4, n1, n2, Y and W are each as defined in the description.

Abstract: There is provided a pattern forming method comprising (1) a step of forming a film by using an actinic ray-sensitive or radiation-sensitive resin composition containing (A) a resin containing an acid-decomposable repeating unit and being capable of decreasing the solubility for an organic solvent-containing developer by the action of an acid, (B) a compound capable of generating an acid upon irradiation with an actinic ray or radiation, (C) a compound capable of decomposing by the action of an acid to generate an acid, and (D) a solvent; (2) a step of exposing the film by using an actinic ray or radiation, and (4) a step of developing the exposed film by using an organic solvent-containing developer to form a negative pattern.

Abstract: It is an object of the present invention to improve the curability of a resin composition and a photosensitive composition suitably employed to form e.g., a surface protecting film and an interlaminar insulating film of e.g., an electronic part, while reducing the internal stress remaining in a substrate when the composition is used to form a cured film on the substrate. The photosensitive composition includes a resin (A) having a phenolic hydroxyl group, a crosslinking agent (B1) having at least two oxazoline groups and a crosslinking agent (B2) having at least two groups represented by —CH2OR (wherein R is a hydrogen atom, an alkyl group having 1 to 10 carbon atoms or an acetyl group) and a photosensitive acid-generating agent (C).

Abstract: An embossing apparatus comprises an embossing die comprising a printed relief pattern, and a resilient surface for pressing media against the embossing die to emboss features corresponding to the printed relief pattern on the media, in which the printed relief pattern comprises a number of layers of a deposited material, and in which a number of layers of the deposited material closest to the top of the printed relief pattern comprises a deposited material with a relatively lower coefficient of adhesion than layers of the deposited material disposed under the deposited material closest to the top of the printed relief pattern. A printed relief pattern for embossing media comprises a number of preliminary layers, the preliminary layers comprising a first material, and a number of terminal layers, the terminal layers comprising a second material, in which the second material has a lower adhesive coefficient than the first material.

Abstract: Metallic thermal emitters consisting of two layers of differently structured nickel gratings on a homogeneous nickel layer are fabricated by soft lithography and studied for polarized thermal radiation. A thermal emitter in combination with a sub-wavelength grating shows a high extinction ratio, with a maximum value close to 5, in a wide mid-infrared range from 3.2 to 7.8 ?m, as well as high emissivity up to 0.65 at a wavelength of 3.7 ?m. All measurements show good agreement with theoretical predictions. Numerical simulations reveal that a high electric field exists within the localized air space surrounded by the gratings and the intensified electric-field is only observed for the polarizations perpendicular to the top sub-wavelength grating. This result suggests how the emissivity of a metal can be selectively enhanced at a certain range of wavelengths for a given polarization.

Abstract: A donor mask includes a base substrate, a light-to-heat conversion layer disposed on the base substrate and including a first upper surface portion and a second upper surface portion, and a reflection layer interposed between the base substrate and the light-to-heat conversion layer and including through holes corresponding to the first upper surface portion and the second upper surface portion. The first upper surface portion includes a first upper surface and a second upper surface connected to the first upper surface and inclined at an angle other than 90 degrees with respect to the first upper surface.

Abstract: A silicone structure-bearing polymer comprising recurring units derived from a bis(4-hydroxy-3-allylphenyl) derivative and having a Mw of 3,000-500,000 is provided. A chemically amplified negative resist composition comprising the polymer overcomes the stripping problem that a coating is stripped from metal wirings of Cu or Al, electrodes, and SiN substrates.

Abstract: A positive type resist composition for use in liquid immersion exposure comprises: (A) a resin having a monocyclic or polycyclic cycloaliphatic hydrocarbon structure, the resin increasing its solubility in an alkali developer by an action of acid; (B) a compound generating acid upon irradiation with one of an actinic ray and a radiation; (C) an alkali soluble compound having an alkyl group of 5 or more carbon atoms; and (D) a solvent.

Abstract: An alkaline development-type curable resin composition having an excellent strength against tearing, breaking, distortion and torsion, and excellent toughness, a cured product of the curable resin composition, a printed circuit board having the cured product, and a process for manufacturing the cured product are disclosed. A curable resin composition is obtained, which contains (A) a thermoplastic resin, (B) a thermosetting component, (C) an alkali-soluble component, and at least one of (D-1) a photopolymerization initiator and (D-2) a photo-base generator, the thermoplastic resin (A) having two or more glass transition points including two glass transition points Tgx and Tgy, which satisfy Tgx>30° C. and Tgy<0° C. and the thermosetting component (B) having a glass transition point Tgz, which satisfies Tgz?Tgy+20° C. Moreover, a cured product of the curable resin composition, a printed circuit board having the cured product, and a process for manufacturing the cured product are obtained.

Abstract: A photosensitive negative resin composition containing a resin (a) having at least three cyclohexene oxide skeletons in its molecule, an onium salt (b) composed of a cation moiety structure represented by the formula b1 defined in the description and an anion moiety structure represented by the formula b2 defined in the description, a silane compound (c) and an organic solvent (d). A fine structure using the resin composition, a production process of the fine structure and a liquid ejection head.

Abstract: Disclosed is a positive photosensitive resin composition that includes (A) an alkali soluble resin selected from a polybenzoxazole precursor, a polyimide precursor, and a combination thereof, (B) a photosensitive diazoquinone compound, (C) a phenol compound, (D) an organic dye and (E) a solvent, wherein the organic dye (D) includes at least one red dye having an absorption wavelength of 590 to 700 nm, at least one yellow dye having an absorption wavelength of 550 to 590 nm, and at least one blue dye having an absorption wavelength of 450 to 500 nm.

Abstract: A polyimide precursor composition includes a polyimide precursor including a repeating unit represented by the following Formula (1), a solvent, and acidic carbon black having a pH of 5.0 or less, wherein R1 represents a tetravalent organic group, R2 represents a divalent organic group, each of R3 and R4 independently represents a monovalent organic group or hydrogen, and R3 and R4 are not hydrogen at the same time.

Abstract: A multilayer film is provided. The multilayer film includes a barrier layer and an adhesive layer underlying the barrier layer. The adhesive layer contains a block copolymer that can phase separate into two or more different domains. The multilayer film has good gas and moisture barrier properties and is highly flexible. Therefore, the multilayer film can be effectively used in manufacturing encapsulation structures for electronic devices. In addition, the multilayer film is suitable for use as a substrate for a device. Further provided are a method for producing the multilayer film and an encapsulation structure including the multilayer film.

Abstract: A conveying roller for a horizontal continuous substrate treatment plant, has a roller body with two ends and two end caps having a receiving opening. Each end of the roller body is arranged in a receiving opening of an end cap. The end cap has two end cap parts which can be releasably connected to one another and which jointly form the receiving opening. The receiving opening is larger than the outside diameter of the end of the roller body. At least two elastic rings which center the roller body in the receiving opening are arranged on the end of the roller body.

Abstract: A liquid electrophotographic ink is disclosed. The liquid electrophotographic ink includes a carrier liquid, a polymer resin, and a pearlescent pigment particle.

Abstract: According to one embodiment, there is provided a method of forming a pattern, including forming a thermally crosslinkable molecule layer including a thermally crosslinkable molecule on a substrate, forming a photosensitive composition layer including a photosensitive composition on the thermally crosslinkable molecule layer, chemically binding the thermally crosslinkable molecule to the photosensitive composition by heating, selectively irradiating the photosensitive composition layer with energy rays, forming a block copolymer layer including a block copolymer on the photosensitive composition layer, and forming a microphase-separated structure in the block copolymer layer.

Abstract: Provided is a method for producing core-shell structured resin particles, comprising the steps of: providing a dispersion liquid of hydrophobic resin particles in which the hydrophobic resin particles are dispersed into an aqueous medium containing an anionic surfactant A and an anionic surfactant B; providing a dispersion liquid of resin microparticles in which resin microparticles are dispersed into an aqueous medium; mixing the dispersion liquid of hydrophobic resin particles and the dispersion liquid of resin microparticles; adhering the resin microparticles to surfaces of the hydrophobic resin particles by adding a water soluble metal salt to a mixture resulting from above step, wherein the surfactant A and the surfactant B satisfy the specific conditions.

Abstract: There is provided a pattern forming method comprising (1) a step of forming a film by using an actinic ray-sensitive or radiation-sensitive resin composition containing (P) a resin having a repeating unit represented by the specific formula, (2) a step of exposing the film by using an actinic ray or radiation, and (3) a step of developing the exposed film by using an organic solvent-containing developer to form a negative pattern, wherein the content of the repeating unit represented by the specific formula is 25 mol % or more based on all repeating units in the resin (P).

Abstract: Disclosed is a positive photosensitive resin composition that includes (A) an alkali soluble resin prepared by a phosphorous-containing diamine represented by the following Chemical Formula 1, (B) a photosensitive diazoquinone compound, and (C) a solvent. A photosensitive resin film prepared using the same and a semiconductor device including the photosensitive resin film are also disclosed. In Chemical Formula 1, each substituent is the same as defined in the detailed description.

Abstract: A conductive metal pattern is formed in a polymeric layer that has a polymer that comprises (1) pendant groups that are capable of providing pendant sulfonic acid groups upon exposure of the reactive polymer to radiation, and (2) pendant groups that are capable of reacting in the presence of the sulfonic acid groups to provide crosslinking. The polymeric layer is patternwise exposed to form non-exposed regions and exposed regions, which are contacted with a reducing agent to incorporate reducing agent therein. These exposed regions are then contacted with electroless seed metal ions to oxidize the reducing agent to form corresponding electroless seed metal nuclei that can be then electrolessly plated with a conductive metal.

Abstract: There is provided an actinic ray-sensitive or radiation-sensitive resin composition comprising: (A) a resin containing a repeating unit represented by the first specific formula and a repeating unit represented by the second specific formula, wherein the content of the repeating unit represented by the first specific formula is 35 mol % or more based on all repeating units in the resin (A), a resist film formed using the actinic ray-sensitive or radiation-sensitive resin composition.

Abstract: There is provided an actinic ray-sensitive or radiation-sensitive resin composition comprising (P) a resin having (a) a repeating unit represented by the specific formula; a resist film formed using the actinic ray-sensitive or radiation-sensitive resin composition; a pattern forming method comprising (i) a step of forming a film by using the actinic ray-sensitive or radiation-sensitive resin composition, (ii) a step of exposing the film, and (iii) a step of developing the exposed film by using a developer to form a pattern; a method for manufacturing an electronic device, comprising the pattern forming method; and an electronic device manufactured by the manufacturing method of an electronic device.

Abstract: There is provided an actinic ray-sensitive or radiation-sensitive resin composition comprising (P) a resin containing a repeating unit represented by the specific formula (1) and a repeating unit represented by the specific formula (A); a resist film formed using the actinic ray-sensitive or radiation-sensitive resin composition; a pattern forming method comprising (i) a step of forming a film from the actinic ray-sensitive or radiation-sensitive resin composition, (ii) a step of exposing the film, and (iii) a step of developing the exposed film by using a developer to form a pattern; a method for manufacturing an electronic device, comprising the pattern forming method, and an electronic device manufactured by the manufacturing method of an electronic device.

Abstract: The present specification provides a photosensitive resin composition comprising an alkali-soluble binder, a crosslinkable compound, a photopolymerization initiator, a solvent, a coloring agent and an epoxy adhesion promoter. The photosensitive resin composition has excellent insulating properties and light-shielding properties and shows excellent chemical resistance in an etching process and a stripping process. Thus, the photosensitive resin composition can be formed into a thin bezel layer having a gradual taper, and thus can provide an integrated touch sensor that makes it possible to prevent short circuits from occurring in metal wiring and minimize any decrease in resistance resulting from high-temperature processing.

Abstract: Systems and methods are provided for forming features through photolithography. A polymer layer is formed over a substrate. The polymer layer is patterned to form a first feature and a second feature, the first feature and the second feature being separated at a first distance. A rinse material is applied to the polymer layer including the first feature and the second feature. The rinse material is removed from the polymer layer including the first feature and the second feature to cause the first feature and the second feature to come into contact with each other. A third feature is formed based on the first feature and the second feature being in contact with each other.

Abstract: A conductive pattern is formed in a polymeric layer that has (a) a reactive polymer comprising pendant tertiary alkyl ester groups, (b) a compound that provides an acid upon exposure to radiation, and (c) a crosslinking agent. The polymeric layer is patternwise exposed to radiation to provide a polymeric layer comprising non-exposed regions and exposed regions comprising a polymer comprising carboxylic acid groups. The exposed regions are contacted with electroless seed metal ions to form a pattern of electroless seed metal ions. This pattern of electroless seed metal ions can be contacted with a non-reducing reagent that reacts with the electroless seed metal ions to form an electroless seed metal compound that has a pKsp of less than 40. This bound electroless seed metal compound is then electrolessly plated with a suitable conductive metal.

Abstract: Disclosed is a positive photosensitive resin composition that includes (A) an alkali soluble resin; (B) a novolac resin including a repeating unit represented by Chemical Formula 6; (C) a photosensitive diazoquinone compound; (D) a silane compound; and (E) a solvent, a photosensitive resin film prepared by using the positive photosensitive resin composition, and a semiconductor device including the photosensitive resin film.

Abstract: The present invention relates to methods of metathesizing olefins using catalysts previously considered to be practically inactive. The present invention further relates to novel photosensitive compositions, their use as photoresists, and methods related to patterning polymer layers on substrates. Further, modifications to the compositions and method provide for an unprecedented functionalization of the compositions, useful for example in the preparation of sensors, drug delivery systems, and tissue scaffolds. The novel compositions and associated methods also provide for the opportunity to prepare 3-dimensional objects which provide new access to critically dimensioned devices, including for example photonic devices.

Abstract: In a chemically amplified positive resist composition comprising (A) a base resin, (B) a photoacid generator, (C) a thermal crosslinker, and (D) an organic solvent, the base resin is a specific polymer and the crosslinker is a siloxane compound. A coating of the composition is readily developable in aqueous alkaline solution. On heat treatment, it forms a cured resist pattern film of satisfactory profile.

Abstract: The pattern forming method of the present invention includes: (i) forming a film including an actinic ray-sensitive or radiation-sensitive resin composition containing a compound (A) represented by General Formula (I) shown below; a resin (P) capable of decreasing solubility with respect to a developer including organic solvent by the action of an acid; and a compound (B) capable of generating an acid by irradiation of actinic rays or radiation; (ii) irradiating the film with actinic rays or radiation; (iii) developing the film irradiated with the actinic rays or radiation using a developer including an organic solvent. [Chem.

Abstract: A photo-curable resin composition comprising an epoxy-containing polymer, a photoacid generator in the form of an onium salt having tetrakis(pentafluorophenyl)borate anion, a solvent, and optionally an epoxy resin crosslinker forms a coating which serves as a protective film for the protection of electric/electronic parts.

Abstract: A conductive pattern is formed using a reactive polymer comprising pendant tertiary alkyl ester groups, a compound that provides an acid upon exposure to radiation, and a crosslinking agent. A polymeric layer is patternwise exposed to form first exposed regions with a polymer comprising carboxylic acid groups that are contacted with electroless seed metal ions, and then contacted with a halide to form corresponding electroless seed metal halide. Another exposure converts electroless seed metal halide to electroless seed metal nuclei and forms second exposed regions. A reducing agent is used to develop the electroless seed metal nuclei in the second exposed regions, or to develop the electroless seed metal halide in the first exposed regions. Fixing is used to remove any remaining electroless seed metal halide. The electroless seed metal nuclei are then electrolessly plated in various exposed regions.

Abstract: Provided are a photosensitive resin composition which is excellent in a moisture and heat resistance and provides a cured product thereof with a high elastic modulus at high temperature and which is excellent as well in a hollow structure holding property and a photosensitive film prepared by using the same, a forming method for a rib pattern, a hollow structure and a forming method for the same and an electronic component. In an electronic component having a hollow structure, a photosensitive resin composition is used as a rib material or a cover material for forming the hollow structure described above, and it is characterized by using a photosensitive resin composition containing (A) a photopolymerizable compound having at least one ethylenically unsaturated group and (B) a photopolymerization initiator and a photosensitive film obtained from the above photosensitive resin composition.

Abstract: There is provided a pattern forming method including: (a) forming a film by an actinic ray-sensitive or radiation-sensitive resin composition containing (A) to (C), (A) a resin capable of increasing polarity by the action of an acid to decrease solubility in a developer containing an organic solvent, (B) a compound capable of generating acid upon irradiation with an actinic ray or radiation, and (C) a salt having a conjugate base structure of an acid having a pKa of ?2 or more in a molecule thereof and substantially not capable of decomposing by an actinic ray or radiation, (b) exposing the film, and (c) developing the exposed film using a developer containing an organic solvent to form a negative pattern.

Abstract: According to one embodiment, an actinic-ray- or radiation-sensitive resin composition includes compound (A) that when exposed to actinic rays or radiation, generates acids and resin (B) that when acted on by an acid, is decomposed to thereby increase its solubility in an alkali developer. Compound (A) is expressed by general formula (I) below. Resin (B) contains at least one of repeating units of general formula (1) below.

Abstract: An object of the present invention is to obtain a white curable composition that can yield a highly reflective cured coating film without requiring a complicated step and show good dispersion even without being subjected to an extended dispersion treatment. Provided is a white curable composition for a printed circuit board comprising: (A) a white pigment; (B) a (meth)acrylate compound having a hydroxyl group; (C) a photopolymerization initiator; and (D) a wetting dispersant. The above-described (A) white pigment is preferably titanium oxide. Further, it is also preferred that the above-described titanium oxide be a rutile-type titanium oxide and have a maximum particle size of 1 ?m or smaller.

Abstract: There is provided a photosensitive resin composition for a microlens. A photosensitive resin composition for a microlens, comprising a component (A), a component (B) and a component (C), wherein the component (A) is a polymer having a maleimide structural unit of Formula (1), the component (B) is a cross-linking agent, and the component (C) is a photosensitizing agent.

Abstract: A positive photosensitive siloxane composition comprising at least three types of following polysiloxanes (A), (B) and (C) obtained by hydrolyzing and condensing a silane compound represented by general formula (1) R1nSi (OR2)4-n, a diazonaphthoquinone derivative, and a solvent: a polysiloxane (A) such that if pre-baked the film thereof will be soluble in a 5 weight % TMAH aqueous solution and the solution rate of said film will be 1,000 ?/sec or less; a polysiloxane (B) such that if pre-baked the solution rate of the film thereof will be 4,000 ?/sec or more relative to a 2.38 weight % TMAH aqueous solution; and a polysiloxane (C) such that if pre-baked the solution rate of the film thereof will be between 200 and 3,000 ?/sec relative to a 2.38 weight % TMAH aqueous solution.

Abstract: A fluorescing yellow polymeric toner particle comprises one or more non-fluorescing yellow colorants, and one or more fluorescing yellow colorants having one or more emission peak wavelengths of at least 480 nm and up to and including 600 nm. These fluorescing yellow polymeric toner particles can be used to provide multicolor toner images with increased yellow color gamut on various printed receiver materials.

Abstract: There is provided an actinic ray-sensitive or radiation-sensitive resin composition comprising (P) a resin having a repeating unit (A) represented by the specific formula (I) capable of generating an acid on the side chain of the resin upon irradiation with an actinic ray or radiation, and a resist film formed with the actinic ray-sensitive or radiation-sensitive resin composition, and a pattern forming method comprising: exposing the resist film, and developing the exposed resist film, and a method for manufacturing a semiconductor device, containing the pattern forming method, and a semiconductor device manufactured by the manufacturing method of the semiconductor device.

Abstract: Provided is a toner that has a plurality of toner particles. Each toner particle can include a binder resin core and a shell disposed about the binder resin core. The binder resin core can include at least one binder resin. The shell can include a plurality of metal nanoparticles. The binder resin core can be prepared by forming an aggregate of the binder resin in which metallic nanoparticles are not present.

Abstract: Provided is an alkaline developable photosensitive resin composition which does not contain crude particles, has excellent storage stability, can avoid the deterioration of working environments, and contains few substances toxic to human bodies. The alkaline developable photosensitive resin composition is characterized by comprising (A) a resin containing a carboxyl group, (B) a photopolymerization initiator, (C) a compound having at least two ethylenically unsaturated groups per molecule, and (D) a dibasic acid ester.

Abstract: Disclosed herein are various amine treated maleic anhydride containing polymers and compositions thereof, which are useful for forming self-imageable films. In some embodiments, such polymers encompass norbornene-type repeating units and maleic anhydride-type repeating units where at least some of such maleic anhydride-type repeating units are either ring-opened or have been transformed into maleimide repeat units. The films formed from such copolymer compositions provide self imageable, low-k, thermally stable layers for use in microelectronic and optoelectronic devices.

Abstract: There is provided a pattern forming method comprising (i) a step of forming a film by an actinic ray-sensitive or radiation-sensitive resin composition; (ii) a step of exposing the film; and (iii) a step of performing development by using a developer containing an organic solvent to form a negative pattern, wherein the actinic ray-sensitive or radiation-sensitive resin composition contains (A) a resin capable of increasing the polarity by an action of an acid to decrease the solubility in a developer containing an organic solvent, (B) a compound capable of generating an acid upon irradiation with an actinic ray or radiation, (C) a solvent, and (D) a resin having a repeating unit having a fluorine atom and not having a CF3 partial structure.

Abstract: Disclosed herein are various amine treated maleic anhydride containing polymers and compositions thereof, which are useful for forming self-imageable films. In some embodiments, such polymers encompass norbornene-type repeating units containing pendent silyl groups and maleic anhydride-type repeating units where at least some of such maleic anhydride-type repeating units are either ring-opened or have been transformed into maleimide repeat units. The films formed from such copolymer compositions provide self imageable, low-k, thermally stable layers for use in microelectronic and optoelectronic devices.

Abstract: The present invention relates to a photosensitive resin composition, which comprises an alkali-soluble resin (A), a compound (B) containing vinyl unsaturated group(s), a photoinitiator (C), ortho-naphthoquinone diazide sulfonic acid ester (D), a thermal initiator (E) and a solvent (F). The photosensitive resin composition added with the ortho-naphthoquinone diazide sulfonic acid ester (D) and the thermal initiator (E) can have excellent resolution and development adherence. Moreover, the present invention further provides a spacer or a protective film formed by the aforementioned photosensitive resin composition, as well as a liquid crystal display device (LCD) including the aforementioned spacer or protective film.

Abstract: The present invention relates to a positive photosensitive resin composition and a method for forming a pattern by using the same. The positive photosensitive resin composition includes a novolac resin (A), a polysiloxane (B), an ortho-naphthoquinone diazide sulfonic acid ester (C) and a solvent (D). The novolac resin (A) includes a xylenol-type novolac resin (A-1). The xylenol-type novolac resin (A-1) is synthesized by polycondensing an aldehyde compound with a xylenol compound.

Abstract: A chemical amplification resist composition according to the present invention includes (A) a compound including a triarylsulfonium cation having one or more fluorine atoms and capable of generating an acid with a volume of 240 ?3 or higher by irradiation of active rays or radiation; and (B) a compound including a phenolic hydroxyl group.