Abstract: Techniques disclosed herein relate to holographic optical materials and elements. An example of a holographic recording material includes matrix monomers characterized by a first refractive index and configured to polymerize to form a polymer matrix, writing monomers dispersed in the matrix monomers and characterized by a second refractive index different from the first refractive index, and a photocatalyst for controlled radical polymerization of the writing monomers. The writing monomers are configured to polymerize upon exposed to recording light. The photocatalyst is dispersed in the matrix monomers. The photocatalyst includes, for example, a transition metal photocatalyst or a metal-free organic photocatalyst, such as a photocatalyst for atom transfer radical polymerization or a transition metal photocatalyst for addition fragmentation chain transfer polymerization.

Abstract: Embodiments provided herewith are directed to self-assembled methods of preparing a patterned surface for sequencing applications including, for example, a patterned flow cell or a patterned surface for digital fluidic devices. The methods utilize photolithography to create a patterned surface with a plurality of microscale or nanoscale contours, separated by hydrophobic interstitial regions, without the need of oxygen plasma treatment during the photolithography process. In addition, the methods avoid the use of any chemical or mechanical polishing steps after the deposition of a gel material to the contours.

Abstract: A positive-type photosensitive resin composition comprises a (a) polybenzoxazole precursor, a (b) crosslinking agent, a (c) photosensitive agent, and a (d) solvent, wherein the (a) component comprises a structural unit represented by Formula (1) below, and the (b) component is a compound represented by Formula (2) below. In Formula (1), U is a bivalent organic group, a single bond, —O—, or —SO2—, V is a group comprising an aliphatic structure, and the carbon number in the aliphatic structure is 1 to 30. In Formula (2), R1 is independently a hydrogen atom or a group represented by —CH2—O—R2. At least one of the plurality of R1s is a group represented by —CH2—O—R2. R2 is independently a hydrogen atom or an alkyl group having 1 to 6 carbon atoms.

Abstract: A positive-type photosensitive resin composition comprises a (a) polybenzoxazole precursor, a (b) crosslinking agent, a (c) photosensitive agent, and a (d) solvent, wherein the (a) polybenzoxazole precursor comprises a structure represented by Formula (1) below, and the (c) photosensitive agent is a compound comprising a structure represented by Formula (2) below. In Formula (1), U is a bivalent organic group, a single bond, —O—, or —SO2—, V is a group comprising an aliphatic structure, and the carbon number in the aliphatic structure is 1 to 30.

Abstract: A combination structure includes a hybrid nanostructure array and a light-absorbing layer adjacent to the hybrid nanostructure array. The hybrid nanostructure array includes a plurality of hybrid nanostructures, each hybrid nanostructure includes a stack of a first nanostructure and a second nanostructure. The first nanostructure includes a first material. The second nanostructure includes a second material. The second material has a refractive index that is higher than a refractive index of the first material. The light-absorbing layer includes a near-infrared absorbing material configured to absorb light of at least a portion of a near-infrared wavelength spectrum.

Abstract: A photoresist composition comprising: a resin which has a structural unit represented by formula (I): wherein R1 represents a hydrogen atom, a halogen atom, or a C1 to C6 alkyl group which optionally has a halogen atom, and R2 represents a C1 to C42 hydrocarbon group which optionally has a substituent; an alkali-soluble resin; an acid generator; and a solvent.

Abstract: A layered structure including a luminescent layer including a quantum dot polymer composite pattern; an inorganic layer disposed on the luminescent layer, the inorganic layer including a metal oxide, a metal nitride, a metal oxynitride, a metal sulfide, or a combination thereof; and an organic layer being disposed between the luminescent layer and the inorganic layer, the organic layer including an organic polymer, a method of producing the same, and a liquid crystal display including the same. The quantum dot polymer composite pattern includes a repeating section including a polymer matrix; and a plurality of quantum dots (e.g., dispersed) in the polymer matrix, the repeating unit including a first section configured to emit light of a first light, and wherein the inorganic layer is disposed on at least a portion of a surface of the repeating section.

Abstract: A panel device includes a panel unit, a light source, and a light-blocking layer. The panel device includes a light attenuation layer, or a tinted layer, to blacken the panel unit. The light attenuation layer is located between the light source and the light-blocking layer, specifically, on the rear surface of the light-blocking layer.

Abstract: Provided is a siloxane resin composition having excellent adhesion and fine patterning properties. The siloxane resin composition contains: a siloxane resin (A) including a structure represented by general formula (1), a structure represented by general formula (2), and a structure represented by general formula (3); a compound (B) having an unsaturated double bond; a photopolymerization initiator (C); and a solvent (D).

Abstract: A topcoat layer that has a defined surface structure on an outer surface thereof once the topcoat layer is laminated to a substrate. The surface structure of the topcoat layer provides a matte surface finish to the underlying substrate. Any attempt to alter the substrate or the topcoat layer will result in disruption or destruction of the surface structure of the topcoat layer making such tampering evident. Replication of the surface structure of the topcoat layer by a counterfeiter is also difficult without the appropriate equipment.

Abstract: Embodiments in accordance with the present invention encompass a two component composition containing in one component a latent organo-ruthenium carbide catalyst, and in another component a photoactive acid generator or a thermally active acid generator, and either of the components containing a mixture of photoactive compound along with one or more monomers which undergo ring open metathesis polymerization (ROMP) when said components are mixed together and exposed to a suitable radiation (or heat) to form a three-dimensional (3D) object. The three-dimensional objects so formed exhibits improved mechanical properties, particularly, high heat distortion temperature, impact strength, elongation to break, among others. Accordingly, compositions of this invention are useful as 3D inkjet materials for forming high impact strength objects of various sizes with microscale features lower than 100 microns, among various other uses.

Abstract: A composition for resist underlayer film formation contains: a compound having a partial structure represented by the following formula (1); and a solvent. In the formula (1): X represents a group represented by formula (i), (ii), (iii) or (iv). In the formula (i): R1 and R2 each independently represent a hydrogen atom, a substituted or unsubstituted monovalent aliphatic hydrocarbon group having 1 to 20 carbon atoms, or a substituted or unsubstituted aralkyl group having 7 to 20 carbon atoms provided that at least one of R1 and R2 represents the substituted or unsubstituted monovalent aliphatic hydrocarbon group having 1 to 20 carbon atoms or the substituted or unsubstituted aralkyl group having 7 to 20 carbon atoms; or R1 and R2 taken together represent a part of a ring structure having 3 to 20 ring atoms together with the carbon atom to which R1 and R2 bond.

Abstract: The present invention provides a resin composition having a high sensitivity and serving to produce a cured film with a low water absorption rate.

Abstract: An alkaline battery, and a component cathode including a solid ionically conducting polymer material.

Abstract: An inkjet method for producing a solder mask in the manufacture of a Printed Circuit Board uses a solder mask inkjet ink containing a polymerizable adhesion promoter and a phenolic compound including at least two phenolic groups. A high quality solder mask withstanding the high thermal stress during the soldering process while maintaining excellent physical properties is produced.

Abstract: An onium salt of arenesulfonic acid having a bridged ring-containing group generates a bulky acid having an appropriate strength and controlled diffusion. When a positive resist composition comprising the onium salt and a base polymer is processed by lithography, a pattern of rectangular profile having high resolution and reduced LER is formed.

Abstract: To provide a laminate which enables pattern formation with excellent opening shape even in the case where a chemically amplified negative type resist material is used, and a pattern forming method in which the laminate is used. The laminate includes a chemically amplified negative type resist layer, and a basic resin coat layer thereon that contains 0.001 to 10% by weight of a basic compound having a molecular weight of up to 10,000.

Abstract: Water-based coating compositions or paint having improved gloss retention, including a latex or water-dispersible polymer, a UV-VIS absorber comprising a substituted benzophenone capable of being a free radical generator, a hindered amine light stabilizer, and optionally a low-VOC coalescent provided in a preferably desired amount. A composition comprising a blend a UV-VIS absorber comprising a substituted benzophenone capable of being a free radical generator, a hindered amine light stabilizer, and a low-VOC coalescent, providing a thermally-stable coalescent that can be used in a paint formulation for gloss retention. Gloss retention of paints containing the UV-VIS absorber and hindered amine light stabilizer being markedly improved over paints that do not have both components present.

Abstract: Provided is a positive photosensitive resin composition having high sensitivity, high definition, and high adhesiveness and being capable of maintaining blackness and high light-blocking properties, even after a high-temperature curing step, e.g., at 250° C. This positive photosensitive resin composition contains: a binder resin (A); a quinonediazide compound (B); and at least one type of black dye (C) selected from black dyes specified by the color indexes of solvent black 27-47. The black dye (C) is ideally specified by the color index of solvent black 27, 29, or 34. This composition is capable of being suitably used in positive radiation lithography and can be used to form organic EL element partitions and insulating films.

Abstract: A method of manufacturing an electrode substrate for a transparent light emitting device display that includes laminating copper foil on a transparent base material; forming a copper foil pattern by etching the copper foil; forming a transparent photosensitive resin composition layer on a front surface of the transparent base material and the copper foil pattern; and exposing at least a part of the copper foil pattern by removing at least a part of the transparent photosensitive resin composition layer provided on the copper foil pattern.

Abstract: The present invention provides a curable composition excellent in curability and capable of forming, through light irradiation, a cured product excellent in light resistance, heat resistance, and transparency.

Abstract: A resist composition which contains a resin (A1) which has a structural unit having a sulfonyl group, a structural unit represented by formula (II) and a structural unit having an acid-labile group, and an acid generator: wherein R1 represents a hydrogen atom, a halogen atom or a C1 to C6 alkyl group that may have a halogen atom, L1 represents a single bond or *-L2-CO—O-(L3-CO—O)g— where * represents a binding position to an oxygen atom, L2 and L3 independently represent a C1 to C12 divalent hydrocarbon group, “g” represents 0 or 1, and R3 represents a C1 to C12 liner or branched alkyl group except for a tertiary alkyl group.

Abstract: Provided herein are processes for the generation of composite polymer materials utilizing a single resin. The processes utilize diffusion between a region undergoing a polymerization reaction preferentially polymerizing one monomer component and an unreactive region. Diffusion and subsequent/concurrent polymerization results in a higher concentration of the more reactive monomer component in the reacting region and a higher concentration of the less reactive monomer components in the unreactive region. The unreactive region may be later polymerized. In embodiments, photopolymerization is used and the regions are generated by a mask or other mechanism to pattern the light.

Abstract: A pattern article comprising a copolymer having polymerized units derived from a cleavable crosslinking monomer, to which a pattern is imparted by the release of incipient acid from a thermal acid generator or photoacid generator. The selective release of the acid provides a pattern of high crosslink density and low crosslink density as result of the incipient acid cleaving a portion of the crosslinks.

Abstract: The present application electromagnetic signal filtering. More specifically, the application teaches a system and method for affixing a frequency selective surface to an existing antenna radome, such that unwanted signals are attenuated before reaching an antenna structure within the antenna radome.

Abstract: According to various embodiments, systems, methods, and computer program products for click-chemistry compatible structures, additive manufacturing resins for forming the same, and method of formation of such structures and resins, as well as techniques for functionalizing click-chemistry compatible structures are disclosed. The inventive structures generally include a plurality of photo polymerized molecules structurally arranged according to a three-dimensional pattern, while surfaces of the structure are functionalized with one or more click-chemistry compatible molecules each having one or more click-chemistry compatible functional groups. The structures may be formed from single- or dual-component resins, each having unique synthetic pathways. The resulting structures may be functionalized for utility in a wide range of applications by leveraging click chemistry to further functionalize the structure with organic additives also compatible with click-chemistry reaction schemes.

Abstract: A photosensitive polyimide resin composition is provided. The resin composition comprises an infrared absorber, an epoxy, a photosensitive polyimide and a photo initiator. The infrared absorber includes pigment and has an amount of weight accounting for 5-40% of total solid weight of the photosensitive polyimide resin composition. The epoxy has an amount of weight accounting for 5-40% of total solid weight of the photosensitive polyimide resin composition. The photosensitive polyimide has the structure of formula (1): wherein m, n are independently 1 to 600; X is a tetravalent organic group, and the main chain of X includes alicyclic structure; Y is a divalent organic group, and the main chain of Y includes siloxane structure; Z is a divalent organic group, and the side chain of Z includes phenolic hydroxyl group or carboxyl group. The photosensitive polyimide has an amount of weight accounting for 30-90% of total solid weight of the photosensitive polyimide resin composition.

Abstract: A semiconductor chip manufacturing method includes preparing a semiconductor wafer including a front surface on which a bump is exposed, a rear surface located at a side opposite to the front surface, a plurality of element regions in each of which the bump is formed, and a dividing region defining each of the element regions, forming a mask which covers the bump and has an opening exposing the dividing region on the surface of the semiconductor wafer by spraying liquid which contains raw material of the mask along the bump by a spray coating method, and singulating the semiconductor wafer by exposing the surface of the semiconductor wafer to first plasma and etching the dividing region, which is exposed to the opening, until the rear surface is reached in a state where the bump is covered by the mask.

Abstract: A photosensitive resin composition contains (a) a polyimide which has, at a terminal of the main chain, at least one group selected from the group consisting of a carboxyl group, a phenolic hydroxyl group, a sulfonic acid group and a thiol group, (b) a monomer, (c) a thermally crosslinkable compound, (d) a photopolymerization initiator and (e) a polymerization inhibitor, wherein the polymerization inhibitor (e) is a compound obtained by adding at least one hydroxyl group, alkoxy group, aryloxy group or aralkyloxy group to a naphthalene skeleton or an anthracene skeleton of a compound having a naphthalene skeleton or an anthracene skeleton.

Abstract: The present invention relates to a method for the preparation of dies for moulds for the production of tiles with three dimensional texture.

Abstract: A composite filament includes a core particle comprising a styrene/acrylate polymer resin, and a shell comprising a styrene/acrylate ionomer resin, wherein the styrene/acrylate ionomer resin comprises a metal ion acrylate monomer, and methods of making thereof. Various articles can be manufactured from such composite filaments.

Abstract: A photosensitive polyimide resin composition is provided. The resin composition comprises an infrared absorber, an epoxy, a photosensitive polyimide and a photo initiator. The infrared absorber includes pigment and has an amount of weight accounting for 5-40% of total solid weight of the photosensitive polyimide resin composition. The epoxy has an amount of weight accounting for 5-40% of total solid weight of the photosensitive polyimide resin composition. The photosensitive polyimide has the structure of formula (1): wherein m, n are independently 1 to 600; X is a tetravalent organic group, and the main chain of X includes alicyclic structure; Y is a divalent organic group, and the main chain of Y includes siloxane structure; Z is a divalent organic group, and the side chain of Z includes phenolic hydroxyl group or carboxyl group. The photosensitive polyimide has an amount of weight accounting for 30-90% of total solid weight of the photosensitive polyimide resin composition.

Abstract: An endless intermediate transfer belt includes a substrate layer, and a surface layer to be disposed on the substrate layer. The surface layer is configured by a polymerized cured product of a radical polymerizable composition including a radical polymerizable monomer having a radical polymerizable functional group, an oxime ester-based photopolymerization initiator having a carbazole structure, and a metal oxide particle subjected to surface treatment. The radical polymerizable functional group corresponds to one or both of an acryloyl group and a methacryloyl group. The metal oxide particle subjected to surface treatment includes a metal oxide particle, and a substance for support, to be supported on a surface of the metal oxide particle.

Abstract: The purpose of the present invention is to provide a photosensitive resin composition for thin film transistors, a cured film of which generates an extremely small amount of an outgas, and which is capable of forming an insulating layer for thin film transistors having excellent drive performance. In order to achieve the above-described purpose, the present invention has the configuration described below. Namely, a photosensitive resin composition for thin film transistors, which contains (A) an alkali-soluble resin having an amide group and/or an imide group, (B) a photosensitive compound and (C) organic solvents, and wherein the content of an organic solvent having nitrogen atoms in the organic solvents (C) is 1% by mass or less relative to the total mass of the organic solvents.

Abstract: The present invention is a block copolymer composition comprising an aromatic vinyl-isoprene-aromatic vinyl triblock copolymer (A) and an aromatic vinyl-isoprene diblock copolymer (B), (i) a ratio (MwDa/MwDb) of a weight average molecular weight MwDa of a polyisoprene block in the triblock copolymer (A) to a weight average molecular weight MwDb of a polyisoprene block in the diblock copolymer (B) being 0.5 or more to less than 1, (ii) a ratio of an aromatic vinyl monomer unit in all polymer components of the block copolymer composition being 10 to 30 mass %, and (iii) the block copolymer composition having a breaking strength of less than 8 MPa and an elongation at break of less than 1,100%; a pressure-sensitive adhesive composition comprising the block copolymer composition and a tackifying resin; and a pressure-sensitive adhesive sheet comprising a pressure-sensitive adhesive layer that comprises the pressure-sensitive adhesive composition.

Abstract: The present disclosure provides an organic electroluminescent compound represented by the formula (I): wherein R1, R2, R3 and R4 each independently represents a substituted or unsubstituted (C6-C30) aryl group, a substituted or unsubstituted 3- to 30-membered heteroaryl group, —NR5R6, —SiR7R8R9, —SR10, —OR11, a cyano group, a nitro group, or a hydroxyl group. The present disclosure further provides an organic electroluminescent device comprising the organic electroluminescent compound represented by the formula (I).

Abstract: A composite powder includes a core particle comprising a styrene/acrylate polymer resin, and a shell comprising a styrene/acrylate ionomer resin, wherein the styrene/acrylate ionomer resin comprises a metal ion acrylate monomer, and methods of making thereof. Various articles can be manufactured from such composite powders.

Abstract: Provided are: a curable composition that shows good adhesion on a printed wiring board, particularly a flexible substrate or the like, and has a high hardness; a resist coating film of the curable composition; and a printed wiring board having a resist pattern of the resist coating film. The curable composition comprises: (A) a photobase generator; (B-1) an epoxy group-containing (meth)acrylate compound or (B-2) a carboxyl group-containing (meth)acrylate compound; (C) a photopolymerization initiator; and (D-1) a thermosetting component (excluding the (B-1) epoxy group-containing (meth)acrylate compound) or (D-2) a thermosetting component (excluding the (B-2) carboxyl group-containing (meth)acrylate compound).

Abstract: The invention provides a compound for forming an organic film having a partial structure represented by the following formula (vii-2), wherein R1 represents a linear, branched or cyclic monovalent hydrocarbon group having 1 to 20 carbon atoms, and a methylene group constituting R1 may be substituted by an oxygen atom; a+b is 1, 2 or 3; c and d are each independently 0, 1 or 2; x represents 0 or 1, when x=0, then a=c=0; L7 represents a linear, branched or cyclic divalent organic group having 1 to 20 carbon atoms, L8? represents the partial structure represented by the following formula (i), 0?o<1, 0<p?1 and o+p=1, wherein the ring structures Ar3 represent a substituted or unsubstituted benzene ring or naphthalene ring; R0 represents a hydrogen atom or a linear, branched or cyclic monovalent organic group having 1 to 30 carbon atoms; and L0 represents a divalent organic group.

Abstract: The present invention is a photo-curable resin composition containing (A) a silicone polymer compound having repeating units shown by the formulae (1) and (2), (B) a photosensitive acid generator capable of generating an acid by decomposition with light having a wavelength of 190 to 500 nm, (C) one or more compounds selected from an amino condensate modified with formaldehyde or formaldehyde-alcohol, a phenol compound having on average two or more methylol groups or alkoxymethylol groups per molecule, and a polyhydric phenol compound whose phenolic hydroxyl group is substituted with a glycidoxy group, and (D) one or more compounds selected from polyhydric phenols having 3 or more hydroxyl groups. As a result, there is provided a photo-curable resin composition that can facilitate thick and fine patterning when the composition is used in patterning.

Abstract: A conformable coating composition comprising a crystalline copolymer, and use thereof in barrier coating is described.

Abstract: An ultraviolet curing type coating resin composition having all of respective beneficial features of excellent state in chemical resistance, under high temperature, against human skin protection creams containing a mixture of alkyl esters of benzoic acid, trademark), excellent state in gas barrier property against metal-corrosive gases as represented by sulfur-containing gases, and excellent state in flexibility that accommodates three-dimensional shape forming processing is demanded, includes an ultraviolet curing type coating resin composition containing an unsaturated-group-containing acrylic resin, with a weight average molecular weight of 5000 to 70000, a number of (meth)acrylate functional groups per molecule of 12 to 40, a hydroxyl value of 2 to 200 mgKOH/g, and with a glass transition temperature of 20 to 90° C., a volatile organic solvent, and a photopolymerization initiator.

Abstract: Compositions and methods herein include negative tone developer compatible photoresist compositions and methods of using such compositions. This includes a positive tone photoresist that can be developed using negative tone developers in that unexposed portions of the positive tone photoresist are dissolvable by one or more negative tone developer solvents. One embodiment includes a negative tone developer compatible photoresist with little or no etch resistance. Non-resistive photoresist materials as described herein can include one or more radiation-sensitive attributes (for example, the photoresist can be patterned, de-protected, solubility shifted, interact with photo chemistries, and respond to exposure doses), except that these materials have effectively no etch resistance. Such compositions can be effectively free from components, functional groups, or additives that provide or increase etch resistivity to a wet or dry etch process.

Abstract: Compounds of the Formula (I), (II) and (III) wherein Aris is for example phenylene, biphenylene or naphthylene, all of which are unsubstituted or substituted by C1-C4-alkyl, C2-C4-alkenyl, CN, OR11, SR11, CH2OR11, COOR12, CONR12R13 or halogen; R1, R2, R7 and R8 independently of one another other are hydrogen or C1-C6-alkyl; R3 and R5 together and R4 and R6 together form a C2-C6-alkylene bridge which is unsubstituted or substituted by one or more C1-C4-alkyl; R11 is hydrogen or C1-C6-alkyl; R12 and R13 independently of one another for example are hydrogen, phenyl, C1-C18-alkyl, C1-C18-alkyl which is interrupted by one or more O; n is 1-10; X is O, S or NR10; A and A1 are suitable linking groups; are suitable as photolatent bases.

Abstract: Example implementations may relate to shifting a curing location during a three-dimensional (3D) printing procedure. A system may control components of a 3D printer to form a first layer of the 3D structure from resin in a first area of a resin container. The components may include: (i) a base plate and (ii) light source(s) operable to emit radiation that cures resin. After formation of the first layer, the system may move the resin container with respect to the base plate such that a second layer of the 3D structure can be formed in a second area of the resin container. The second area and the first area may be at least partially non-overlapping. The system may then control the components of the 3D printer to form the second layer of the 3D structure from resin in the second area of the resin container.

Abstract: A yield in a separation process is improved. A separation apparatus which enables easy separation in a large-area substrate is provided. The separation apparatus has a function of dividing a process member into a first member and a second member and includes a support body supply unit, a support body hold unit, a transfer mechanism, a direction changing mechanism, and a structure body. The structure body bonds a support body to a surface of the first member. When at least part of the process member is located between the direction changing mechanism and the structure body or the pressure applying mechanism, the shortest distance between the direction changing mechanism and a first plane including the surface of the first member is longer than the shortest distance between the first plane and the structure body or the pressure applying mechanism.

Abstract: Disclosed are porous substrate and a coating layer positioned on one side or both sides of the porous substrate, wherein the coating layer includes a filler (A) having an average particle diameter of about 0.3 ?m to about 2 ?m; and a binder (B) including an organic polymer and an inorganic particle, an organic particle, or a combination thereof, wherein an average particle diameter of each of the inorganic particle and the organic particle is about 5 nm to about 200 nm, and a rechargeable lithium battery including the separator.

Abstract: A solder mask ink composition is disclosed. The solder mask ink composition includes an epoxy resin; a solvent in an amount of at least 20% by weight relative to the total weight of the solder mask ink composition; and optionally a non-ionic surfactant. The ink composition has a viscosity that is less than 1000 cps at a shear rate of 10 s?1 and greater than 30 cps at a shear rate of 495 s?1 and a temperature of 25° C.

Abstract: The present invention relates to a photocurable adhesive composition and the use of the same. Specifically, said photocurable adhesive composition mainly comprises, based on 100 parts by weight of the adhesive composition, component A: from 70 to 99 parts by weight of one or more polymers carrying (meth)acryloxyl group; component B: from 0 to 30 parts by weight, preferably from 0 to 25 parts by weight of one or more (meth)acrylates monomers; component C: from 0.5 to 10 parts by weight of at least one UV absorber; and component D: from 0 to 5 parts by weight of antioxidant. The present invention also relates to the use of the adhesive composition mentioned above in the production of an ITO substrate for temporarily bonding a substrate and a temporary carrier and going through a high temperature processing, for example, at a temperature of ?160° C., preferably, from 160° C. to 260° C., more preferably from 240° C. to 250° C.

Abstract: A positive-type photosensitive siloxane composition which comprises (I) two or more polysiloxanes that differ in the rate of dissolution in aqueous tetramethylammonium hydroxide (TMAH) solutions, (II) a polysiloxane that gives a film which after prebaking has a rate of dissolution in 2.38 wt-% aqueous TMAH solution of 50-1,000 ?/sec and that has a group soluble in aqueous TMAH solution, other than silanol, (III) a diazonaphthoquinone derivative, and (IV) a solvent.