Including Resin Or Synthetic Polymer Patents (Class 430/18)
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Publication number: 20140199617Abstract: A pattern-forming method includes in this order: step (1) of forming a film with an electron beam-sensitive or extreme ultraviolet radiation-sensitive resin composition that contains (A) a resin having an acid-decomposable repeating unit and capable of decreasing a solubility of the resin (A) in a developer containing an organic solvent by an action of an acid and (B) a low molecular weight compound capable of generating an acid upon irradiation with an electron beam or extreme ultraviolet radiation and decomposing by an action of an acid to decrease a solubility of the low molecular weight compound (B) in an organic solvent; step (2) of exposing the film with an electron beam or extreme ultraviolet radiation; and step (4) of developing the film with a developer containing an organic solvent after the exposing to form a negative pattern.Type: ApplicationFiled: March 27, 2014Publication date: July 17, 2014Applicant: FUJIFILM CORPORATIONInventors: Hideaki TSUBAKI, Hiroo TAKIZAWA, Takeshi KAWABATA
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Publication number: 20140193749Abstract: A pattern-forming method includes in this order: step (1) of forming a film with an electron beam-sensitive or extreme ultraviolet radiation-sensitive resin composition that contains (A) a resin having an acid-decomposable repeating unit and capable of decreasing a solubility of the resin (A) in a developer containing an organic solvent by an action of an acid, (B) a compound capable of generating an acid upon irradiation with an electron beam or extreme ultraviolet radiation and (C) a solvent; step (2) of exposing the film with an electron beam or extreme ultraviolet radiation; and step (4) of forming a negative pattern by development of the film with a developer containing an organic solvent after the exposing of the film, wherein a content of the compound (B) is 21% by mass to 70% by mass on the basis of all solids content of the composition.Type: ApplicationFiled: March 13, 2014Publication date: July 10, 2014Applicant: FUJIFILM CORPORATIONInventors: Hiroo TAKIZAWA, Hideaki TSUBAKI, Shuji HIRANO
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Patent number: 8771907Abstract: According to one embodiment, a positive photosensitive resin composition includes a resin containing a specified acrylic acid besed-structural unit which generates a carboxyl group when its dissociative group is dissociated, which resin is insoluble in alkali or sparingly soluble in alkali but when its acid-dissociative group is dissociated, becomes soluble in alkali, a resin containing a structural unit derived from a radical-polymerizable monomer containing an epoxy group, a compound containing two or more epoxy groups in its molecule, provided that the resin containing the structural unit derived from a radical-polymerizable monomer containing an epoxy group is not included in this compound, and a compound that when exposed to actinic rays of 300 nm or longer wavelength, generates an acid.Type: GrantFiled: September 27, 2010Date of Patent: July 8, 2014Assignee: FUJIFILM CorporationInventor: Satoshi Takita
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Publication number: 20140178808Abstract: A photosensitive resin composition having excellent storage stability which can form a high precision pattern upon a low amount of exposure; a method of forming a pattern including a polysiloxane coating with the photosensitive resin composition; and an electronic component including a pattern including a polysiloxane coating formed with the photosensitive resin composition. A compound which generates an imidazole compound having a predetermined structure by light is added to a photosensitive resin composition including one or more hydrolyzable silane compounds, hydrolysates of the hydrolyzable silane compounds and condensates thereof and a photo-base generator or a photo-acid generator.Type: ApplicationFiled: December 26, 2013Publication date: June 26, 2014Applicant: Tokyo Ohka Kogyo Co., Ltd.Inventors: Dai Shiota, Mayumi Kuroko, Tatsuro Ishikawa
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Patent number: 8758977Abstract: A negative-type photosensitive resin composition which is good in sensitivity and resolution, a pattern forming method by the use thereof wherein a pattern which can be developed in an alkali aqueous solution, is excellent in sensitivity, resolution and heat resistance and has a good shape is obtained, and highly reliable electronic parts are provided. The negative-type photosensitive rein composition includes (a) a polymer that has a phenolic hydroxyl group at a terminal and is soluble in the alkali aqueous solution, (b) a compound that generates an acid by irradiating active light, and (c) a compound that can be crosslinked or polymerized by an action of the acid.Type: GrantFiled: January 13, 2011Date of Patent: June 24, 2014Assignee: Hitachi Chemical DuPont MicroSystems, Ltd.Inventor: Tomonori Minegishi
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Publication number: 20140170538Abstract: There is provided a compound represented by Formula (1), and a coloring composition including the compound: wherein, in Formula (1), R0 to R3 each independently represent a hydrogen atom or a substituent, and R0 and R1, R0 and L, or R1 and L may be combined with each other to form a ring, L represents a single bond or a divalent linking group, D represents a residue in which n hydrogen atoms are removed from a compound represented by Formula (2), n represents an integer of 1 or more, provided that when n represents an integer of 2 or more, a plurality of R0's to R3's and L's may be the same or different, the compound represented by Formula (1) has at least one ionic hydrophilic group, and in Formula (2), R4 to R24 each independently represent a hydrogen atom or a substituent.Type: ApplicationFiled: February 25, 2014Publication date: June 19, 2014Applicant: FUJIFILM CorpoartionInventor: Yoshihiko FUJIE
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Patent number: 8748060Abstract: A coating including an oligomer is disclosed, the oligomer being the reaction product of an epoxy silane, a multifunctional (meth)acrylate; and a polymerizable fluorochemical. The polymerizable fluorochemical can be fluorinated (meth)acrylate or a polymerizable fluorinated urethane. Phototools having a layer of the coating on a substrate can be made. A method of making a printed assembly such as a printed circuit board is also disclosed.Type: GrantFiled: September 14, 2010Date of Patent: June 10, 2014Assignee: 3M Innovative Properties CompanyInventor: Zai-Ming Qiu
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Publication number: 20140147776Abstract: Provided is an alkali-developable photocurable/thermosetting resin composition from which a cured coating film that has excellent thermal shock resistance and exhibits excellent PCT resistance, HAST resistance and electroless gold plating resistance, which are important as a solder resist for semiconductor packages, can be formed. The alkali-developable photocurable/thermosetting resin composition is characterized by comprising (A) a carboxyl group-containing photosensitive resin, (B) a photopolymerization initiator, (C) a block copolymer and (D) a thermosetting component.Type: ApplicationFiled: June 15, 2012Publication date: May 29, 2014Applicant: TAIYO INK MFG. CO., LTD.Inventors: Nobuhito Ito, Masao Arima
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Patent number: 8735029Abstract: Disclosed are a positive photosensitive resin composition including (A) an alkali soluble resin including a polybenzoxazole precursor, a polyimide precursor, or a combination thereof, (B) a photosensitive diazoquinone compound, (C) a compound represented by the following Chemical Formula 1, and (D) a solvent, and a display device and an organic light emitting device using the same. The Chemical Formula 1 is the same as defined in the detailed description.Type: GrantFiled: September 5, 2012Date of Patent: May 27, 2014Assignee: Cheil Industries Inc.Inventors: Eun-Kyung Yoon, Eun-Ha Hwang, Jong-Hwa Lee, Ji-Yun Kwon, Dae-Yun Kim, Sang-Kyeon Kim, Sang-Kyun Kim, Sang-Soo Kim, Kun-Bae Noh, Jun-Ho Lee, Jin-Young Lee, Hyun-Yong Cho, Chung-Beom Hong
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Publication number: 20140141360Abstract: A pattern forming method, includes: (i) a step of forming a film from an actinic ray-sensitive or radiation-sensitive resin composition containing (P) a resin having (a1) a repeating unit represented by the following formula (I) or (II) as defined in the specification in an amount of 20 mol % or more based on all repeating units in the resin (P) and (B) a compound capable of generating an acid upon irradiation with an actinic ray or radiation; (ii) a step of exposing the film, so as to form an exposed film; and (iii) a step of developing the exposed film by using a developer containing an organic solvent to form a negative pattern.Type: ApplicationFiled: January 27, 2014Publication date: May 22, 2014Applicant: FUJIFILM CorporationInventors: Shuhei YAMAGUCHI, Hidenori TAKAHASHI, Michihiro SHIRAKAWA, Fumihiro YOSHINO
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Publication number: 20140120462Abstract: A photosensitive resin composition including: (a) a polybenzoxazole precursor; (b) a photosensitizer; (c) a solvent; (d) a cross-linking agent; and (e) a heterocyclic compound including a hydroxyl group, an alkoxy group or a carboxyl group within a molecule.Type: ApplicationFiled: June 13, 2012Publication date: May 1, 2014Applicant: Hitachi Chemical DuPont Microsystems, Ltd.Inventors: Tomonori Minegishi, Shigeki Katogi
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Patent number: 8709552Abstract: The resin composition of the present invention is a resin composition characterized by including (a) a polyimide, a polybenzoxazole, a polyimide precursor or a polybenzoxazole precursor, (b) 1,5-dihydroxynaphthalene, 1,6-dihydroxynaphthalene, 1,7-dihydroxynaphthalene, or 2,3-dihydroxynaphthalene, and (c) a thermal cross-linking agent having a specific structure. By the use of the resin composition of the present invention, it is possible to reduce the transmittance in the visible region of a cured film while maintaining the transmittance of a resin film before curing.Type: GrantFiled: January 15, 2010Date of Patent: April 29, 2014Assignee: Toray Industries, Inc.Inventors: Kazuto Miyoshi, Mika Koshino, Masao Tomikawa
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Patent number: 8703367Abstract: A positive photosensitive resin composition includes: (A) a polybenzoxazole precursor; (B) a photosensitive diazoquinone compound; (C) a silane compound; (D) a polyamic acid ester compound; and (E) a solvent. The positive photosensitive resin composition can reduce film shrinkage, can have high sensitivity, high resolution, and excellent residue removal properties, and can provide good pattern shapes.Type: GrantFiled: March 28, 2011Date of Patent: April 22, 2014Assignee: Cheil Industries Inc.Inventors: Hyun-Yong Cho, Doo-Young Jung, Yong-Sik Yoo, Ji-Young Jeong, Jong-Hwa Lee, Min-Kook Chung, Kil-Sung Lee, Myoung-Hwan Cha
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Patent number: 8697320Abstract: Disclosed are a novel phenol compound comprising a compound represented by Chemical Formula 1, a compound represented by Chemical Formula 2, or a combination thereof, and a positive photosensitive resin composition including the same.Type: GrantFiled: September 23, 2011Date of Patent: April 15, 2014Assignees: Cheil Industries Inc., Samsung Electronics Co., Ltd.Inventors: Ji-Young Jeong, Min-Kook Chung, Hyun-Yong Cho, Yong-Sik Yoo, Jeong-Woo Lee, Jong-Hwa Lee, Hwan-Sung Cheon, Soo-Young Kim, Young-Ho Kim, Jae-Hyun Kim, Su-Min Park
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Publication number: 20140099573Abstract: The present invention provides photosensitive compositions and methods of patterning a polymeric image on a substrate, said methods comprising; (a) depositing a layer of photosensitive composition of any one of claims 15 to 22 on the substrate; and (b) irradiating a portion of the layer of photosensitive composition with a light comprising a wavelength in a range of from about 220 to about 440 nm. The invention also relates to methods of metathesizing an unsaturated organic precursor comprising irradiating Fischer-type carbene ruthenium catalysts with at least one wavelength of light in the presence of at least one unsaturated organic precursor so as to metathesize at least one alkene or one alkyne bond.Type: ApplicationFiled: October 3, 2013Publication date: April 10, 2014Applicant: CALIFORNIA INSTITUTE OF TECHNOLOGYInventors: RAYMOND WEITEKAMP, ROBERT H. GRUBBS
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Publication number: 20140087294Abstract: In a chemically amplified positive resist composition comprising (A) a base resin, (B) a photoacid generator, (C) a thermal crosslinker, and (D) an organic solvent, the base resin is a specific polymer and the crosslinker is a siloxane compound. A coating of the composition is readily developable in aqueous alkaline solution. On heat treatment, it forms a cured resist pattern film of satisfactory profile.Type: ApplicationFiled: September 23, 2013Publication date: March 27, 2014Applicant: SHIN-ETSU CHEMICAL CO., LTD.Inventors: Masashi Iio, Katsuya Takemura, Takashi Miyazaki, Hideyoshi Yanagisawa
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Publication number: 20140080043Abstract: The present application relates to a siloxane-based compound, a photosensitive composition including the same, and a photosensitive material.Type: ApplicationFiled: January 25, 2013Publication date: March 20, 2014Inventors: Keon Woo Lee, Sang Kyu Kwak, Changsoon Lee, Hyehyeon Kim, Saehee Kim
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Publication number: 20140065526Abstract: The present invention relates to a positive photosensitive resin composition and a method for forming patterns by using the same. The positive photosensitive resin composition includes a novolac resin (A), an ortho-naphthoquinone diazide sulfonic acid ester (B), a dye (C) and a solvent (D). The novolac resin (A) further includes hydroxy-type novolac resin (A-1), which is synthesized by condensing hydroxylbenzaldehyde compound with aromatic hydroxyl compound. The dye (C) includes at least one (C-1) selected from the group consisting of diazo dye, anthraquinone dye and chromium (III, Cr3+) azo dye, as well as triarylmethane dye (C-2). Since the positive photosensitive resin composition can form colorfully fine patterns on metal circuits, and such patterns are not decolored after being etched, thereby beneficially blocking the reflected light of the metal circuits.Type: ApplicationFiled: August 20, 2013Publication date: March 6, 2014Applicant: CHI MEI CORPORATIONInventors: Kai-Min CHEN, Chun-An SHIH
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Publication number: 20140051017Abstract: The present invention relates to a photosensitive resin composition, which comprises an alkali-soluble resin (A), a compound (B) containing vinyl unsaturated group(s), a photoinitiator (C), ortho-naphthoquinone diazide sulfonic acid ester (D), a thermal initiator (E) and a solvent (F). The photosensitive resin composition added with the ortho-naphthoquinone diazide sulfonic acid ester (D) and the thermal initiator (E) can have excellent resolution and development adherence. Moreover, the present invention further provides a spacer or a protective film formed by the aforementioned photosensitive resin composition, as well as a liquid crystal display device (LCD) including the aforementioned spacer or protective film.Type: ApplicationFiled: August 1, 2013Publication date: February 20, 2014Applicant: CHI MEI CORPORATIONInventors: I-Chun HSIEH, Hao-Wei LIAO
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Patent number: 8652712Abstract: A photoacid generator P+ A? comprises (a) an antenna group P+ comprising atoms with high EUV photoabsorption cross-sections according to FIG. 1 and A? anions; or (b) an antenna group P+ and A? comprising anions with low photoabsorption cross-sections for EUV; or (c) an antenna group P+, comprising atoms with high EUV photoabsorption cross-sections according to FIG. 1 and A? comprising anions with low photoabsorption cross-sections for EUV. Novel compounds comprise DTFPIO PFBuS, and DTBPIO CN5.Type: GrantFiled: February 25, 2011Date of Patent: February 18, 2014Assignee: International Business Machines CorporationInventor: Martin Glodde
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Patent number: 8652755Abstract: A positive photosensitive resin composition that forms an image for a liquid crystal display device and an organic EL display device, for example. The resin is made of a cured film that is highly water repellent and highly oleophobic on the surface. The resin has insulating properties, retains an excellent image and causes no reflow, for example, when being cured to form a film having excellent reworkability. A positive photosensitive resin composition comprising component (A), component (B), component (C) and component (D); Component (A) is an acrylic polymer containing an acid dissociable group, an aliphatic hydroxy group, and an N-substituted maleimide group; Component (B) is an acrylic polymer containing an acid dissociable group and a blocked isocyanate group; Component (C) is an acrylic polymer containing an acid dissociable group, an aliphatic hydroxy group, a C3-10 fluoroalkyl group, and a silyl ether group, and Component (D) is a photoacid generator.Type: GrantFiled: February 1, 2011Date of Patent: February 18, 2014Assignee: Nissan Chemical Industries, Ltd.Inventors: Tadashi Hatanaka, Megumi Uchiyama
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Patent number: 8642234Abstract: A carboxyl group-containing photosensitive resin is obtained by reacting an ?,?-ethylenically unsaturated group-containing monocarboxylic acid (c) with a phenolic compound (a) containing the structure represented by the following general formula (I) and having at least two phenolic hydroxyl groups in its molecule, wherein part or the whole of the phenolic hydroxyl groups being modified into an oxyalkyl group, and further reacting a polybasic acid anhydride (d) with the resultant reaction product; wherein R1 represents either one of a hydrocarbon radical of 1 to 11 carbon atoms, a SO2 group, an oxygen atom and sulfur atom, R2 represents a hydrocarbon radical of 1 to 11 carbon atoms, “a” represents an integer of 0 to 3, “n” represents an integer of 1 to 2, and “m” represents an integer of 1 to 10.Type: GrantFiled: September 13, 2011Date of Patent: February 4, 2014Assignees: Taiyo Holdings Co., Ltd., Showa Denko K.K.Inventors: Nobuhito Ito, Masao Arima, Syouji Nishiguchi, Kouji Ogawa, Masayuki Kobayashi, Atsushi Sakamoto
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Publication number: 20140030643Abstract: Provided is an actinic-ray- or radiation-sensitive resin composition including a resin (P) containing an acid-decomposable repeating unit (A), which resin when acted on by an acid, increases its solubility in an alkali developer, a compound (Q) that when exposed to actinic rays or radiation, generates an acid, and a compound (R) expressed by general formula (1) or (2) below.Type: ApplicationFiled: September 27, 2013Publication date: January 30, 2014Applicant: FUJIFILM CorporationInventors: Toshiya TAKAHASHI, Hiroo TAKIZAWA, Hideaki TSUBAKI, Shuji HIRANO, Tomotaka TSUCHIMURA
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Patent number: 8637226Abstract: A method of forming an image having multiple phases is disclosed herein. The method includes forming exposed and unexposed areas, the exposed areas comprising a first polymer network exhibiting first and second phases that are chemically connected and have different refractive indices, the first phase being continuous, and the second phase comprising a plurality of structures dispersed within the first phase, and the unexposed areas comprising a second polymer network comprising third and fourth phases that are chemically connected and have different refractive indices, the third phase being continuous, and the fourth phase comprising a plurality of structures dispersed within the third phase. The first and second polymer networks are chemically connected, and morphology formed by the first and second phases is different than that formed by the third and fourth phases.Type: GrantFiled: February 8, 2012Date of Patent: January 28, 2014Assignee: 3M Innovative Properties CompanyInventors: Mieczyslaw H. Mazurek, Raymond P. Johnston, John E. Potts, Marc D. Radcliffe, Kevin R. Schaffer, Audrey A. Sherman, Wendi J. Winkler
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Publication number: 20140011126Abstract: Provided is a silphenylene-containing photocurable composition including: (A) a specific silphenylene having both terminals modified with alicyclic epoxy groups, and (C) a photoacid generator that generates acid upon irradiation with light having a wavelength of 240 to 500 nm. Also provided is a pattern formation method including: (i) forming a film of the photocurable composition on a substrate, (ii) exposing the film through a photomask with light having a wavelength of 240 to 500 nm, and if necessary, performing heating following the exposure, and (iii) developing the film in a developing liquid, and if necessary, performing post-curing at a temperature within a range from 120 to 300° C. following the developing. Further provided is an optical semiconductor element obtained by performing pattern formation using the method.Type: ApplicationFiled: September 6, 2013Publication date: January 9, 2014Applicant: Shin-Etsu Chemical Co., Ltd.Inventors: Shohei Tagami, Takato Sakurai, Hideto Kato
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Publication number: 20130323631Abstract: A photo-curable resin composition comprising an epoxy-containing polymer, a photoacid generator in the form of an onium salt having tetrakis(pentafluorophenyl)borate anion, a solvent, and optionally an epoxy resin crosslinker forms a coating which serves as a protective film for the protection of electric/electronic parts.Type: ApplicationFiled: May 31, 2013Publication date: December 5, 2013Inventors: Satoshi ASAI, Kyoko SOGA, Hideto KATO
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Patent number: 8530119Abstract: A positive photosensitive resin composition includes (A) a polybenzoxazole precursor resin, (B) a photosensitive diazoquinone compound, (C) a hindered phenol antioxidant shown by the following general formula (1), and (D) a phenol compound shown by the following general formula (2). Formula (1) is: wherein R1 represents a hydrogen atom or an organic group having 1 to 4 carbon atoms, a is an integer from 1 to 3, and b is an integer from 1 to 3. Formula (2) is: wherein R2 represents a methylene group or a single bond, c is an integer from 1 to 3, and d is an integer from 1 to 3. A protective film, an interlayer insulating film, and a semiconductor device and a display element using the same are also disclosed.Type: GrantFiled: May 20, 2009Date of Patent: September 10, 2013Assignee: Sumitomo Bakelite Co., Ltd.Inventors: Takashi Hirano, Toshio Banba, Shusaku Okamyo, Hiroaki Makabe
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Patent number: 8530118Abstract: Methods of fabricating optical elements that are encapsulated in monolithic matrices. The present invention is based, at least in one aspect, upon the concept of using multiphoton, multi-step photocuring to fabricate encapsulated optical element(s) within a body of a photopolymerizable composition. Imagewise, multiphoton polymerization techniques are used to form the optical element. The body surrounding the optical element is also photohardened by blanket irradiation and/or thermal curing to help form an encapsulating structure. In addition, the composition also incorporates one or more other, non-diffusing binder components that may be thermosetting or thermoplastic. The end result is an encapsulated structure with good hardness, durability, dimensional stability, resilience, and toughness.Type: GrantFiled: August 21, 2009Date of Patent: September 10, 2013Assignee: 3M Innovative Properties CompanyInventors: Robert J. DeVoe, Catherine A. Leatherdale, Jeffrey M. Florczak, Patrick R. Fleming, John E. Potts
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Patent number: 8501375Abstract: Disclosed is a positive photosensitive resin composition that includes (A) a polybenzoxazole precursor including a repeating unit represented by the following Chemical Formula 1; (B) a photosensitive diazoquinone compound; (C) a silane compound; (D) a phenol compound; and (E) a solvent. In the above Chemical Formula 1, each substituent is the same as defined in the specification.Type: GrantFiled: September 23, 2011Date of Patent: August 6, 2013Assignee: Cheil Industries Inc.Inventors: Hyun-Yong Cho, Min-Kook Chung, Ji-Young Jeong, Jong-Hwa Lee, Yong-Sik Yoo, Jeong-Woo Lee, Hwan-Sung Cheon, Soo-Young Kim, Young-Ho Kim, Jae-Hyun Kim, Su-Min Park
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Patent number: 8486604Abstract: The present invention provides a positive-type radiation-sensitive composition containing (A) a siloxane polymer, and (B) a quinone diazide compound, in which the content of aryl groups relative to Si atoms in the siloxane polymer (A) is greater than 60% by mole and no greater than 95% by mole.Type: GrantFiled: June 29, 2010Date of Patent: July 16, 2013Assignee: JSR CorporationInventors: Masaaki Hanamura, Daigo Ichinohe, Hideaki Takase
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Patent number: 8481244Abstract: A photo-curable resin composition comprising an epoxy-containing silphenylene or silicone polymer with a Mw of 3,000-500,000 forms a coating which is useful as a protective film for electric/electronic parts.Type: GrantFiled: September 24, 2010Date of Patent: July 9, 2013Assignee: Shin-Etsu Chemical Co., Ltd.Inventors: Takanobu Takeda, Hideto Kato
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Publication number: 20130171549Abstract: A monomer has the Formula I: wherein R1, R2, and R3 are each independently a C1-30 monovalent organic group, and R1, R2, and R3 are each independently unsubstituted or include a halogen, nitrile, ether, ester, ketone, alcohol, or a combination comprising at least one of the foregoing functional groups; R4 includes H, F, C1-4 alkyl, or C1-4 fluoroalkyl; A is a single bond or a divalent linker group, wherein A is unsubstituted or substituted to include a halogen, nitrile, ether, ester, ketone, alcohol, or a combination comprising at least one of the foregoing functional groups; m and n are each independently an integer of 1 to 8; and x is 0 to 2n+2, and y is 0 to 2m+2.Type: ApplicationFiled: December 21, 2012Publication date: July 4, 2013Applicant: ROHM AND HAAS ELECTRONIC MATERIALS LLCInventor: Rohm and Haas Electronic Materials LLC
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Patent number: 8455173Abstract: A photosensitive insulating resin composition includes (A) an alkali-soluble resin that contains (a1) a structural unit derived from a crosslinkable monomer and (a2) a structural unit having a phenolic hydroxyl group, (B) a crosslinking agent, (C) a photosensitive compound, and (D) a solvent.Type: GrantFiled: January 28, 2010Date of Patent: June 4, 2013Assignee: JSR CorporationInventors: Hirofumi Sasaki, Atsushi Itou
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Patent number: 8440383Abstract: Thermal imaging donors are useful for thermal transfer patterning of a metal layer and optionally, a corresponding proximate portion of an additional transfer layer onto a thermal imaging receiver. The compositions are useful for dry fabrication of electronic devices. Also provided are patterned multilayer compositions comprising one or more base film(s), and one or more patterned metal layers. These include electromagnetic interference shields and touchpad sensors.Type: GrantFiled: January 26, 2011Date of Patent: May 14, 2013Assignee: E I du Pont de Nemours and CompanyInventors: Richard Kevin Bailey, Graciela Beatriz Blanchet, Jonathan V. Caspar, John Catron, Jr., Reid John Chesterfield, Thomas C. Felder, Feng Gao, Lynda Kaye Johnson, Roupen Leon Keusseyan, Dalen E. Keys, Irina Malajovich, Jeffrey Scott Meth, Geoffrey Nunes, Gerard O'Neil, Rinaldo Soria Schiffino, Nancy G. Tassi
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Patent number: 8367283Abstract: The positive photosensitive resin composition of the present invention has a polyamide resin and a photosensitive agent, wherein the polyamide resin has a specific structure. The cured film of the present invention has a cured product of the positive photosensitive resin composition. The protecting film and insulating film of the present invention has the cured film each. The semiconductor device and display device of the present invention has the cured film each.Type: GrantFiled: July 16, 2009Date of Patent: February 5, 2013Assignee: Sumitomo Bakelite Company, Ltd.Inventor: Miki Terayama
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Patent number: 8309280Abstract: A positive-type photosensitive resin composition includes (A) a polyamide resin that includes a structural unit shown by the following formula (1) and a structural unit shown by the following formula (2), and (B) a photosensitive compound, the polyamide resin (A) having a weight average molecular weight (Mw) of 5000 to 80,000, and a cured film obtained by curing the positive-type photosensitive resin composition at 250° C. having a tensile modulus of elasticity of 2.0 to 4.0 GPa and a tensile elongation of 10 to 100%. According to the present invention, a positive-type photosensitive resin composition that can be cured at a low temperature and a highly reliable semiconductor device including a cured film of the positive-type photosensitive resin composition can be provided.Type: GrantFiled: August 8, 2008Date of Patent: November 13, 2012Assignee: Sumitomo Bakelite Co., Ltd.Inventor: Toshio Banba
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Patent number: 8304149Abstract: A photosensitive polymer composition, having (a) a polymer selected from polyimide precursors and polyimides having an acid group protected by a protecting group and having no amino group (—NH2) at the end; and (b) a compound that generates an acid when exposed to light and capable of deprotecting the protecting group from the acid group, is employed to form layers of a semiconductor device.Type: GrantFiled: December 7, 2010Date of Patent: November 6, 2012Assignees: Hitachi Chemical Dupont Microsystems Ltd., Hitachi Chemical Dupont Microsystems L.L.C.Inventors: Masataka Nunomura, Masayuki Ooe, Hajime Nakano, Yoshiko Tsumaru, Takumi Ueno
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Low temperature curable photosensitive resin composition and dry film manufactured by using the same
Patent number: 8288656Abstract: The present invention provides a photosensitive resin composition comprising: a polyamic acid including a specific repeating unit; a heterocyclic amine compound; a (metha)acrylate-based compound including one or more double bonds between carbons; a photoinitiator; and an organic solvent, and a dry film prepared therefrom. The photosensitive resin composition can be cured at a low temperature to offer process safety and work convenience, and has excellent bending resistance, soldering heat resistance, and a property of filling the pattern, as well as excellent heat resistance and mechanical properties.Type: GrantFiled: August 27, 2010Date of Patent: October 16, 2012Assignee: LG Chem, Ltd.Inventors: Kwang-Joo Lee, Joo-Eun Ko, Byung-Nam Kim, Heon-Sik Song, You-Jin Kyung, Hee-Jung Kim -
Patent number: 8278030Abstract: An object of the present invention is to provide a sulfonium salt that has sufficient photosensitivity by active energy rays, such as visible light, ultraviolet rays, electron beams, and X-rays. The present invention is a sulfonium salt represented by formula (1). It is noted that R1 is a group represented by formula (2); R2 and R3 each represent an aryl group having 6 to 30 carbon atoms, a heterocyclic hydrocarbon group having 4 to 30 carbon atoms, an alkyl group having 1 to 30 carbon atoms, an alkenyl group having 2 to 30 carbon atoms, or an alkynyl group having 2 to 30 carbon atoms; X? represents a monovalent polyatomic anion; R4 to R6 each represent an alkyl group, or the like; k represents an integer of 0 to 4; m represents an integer of 0 to 3; n represents an integer of 0 to 4; and A represents a group represented by —S—, —O—, —SO—, —SO2—, or —CO—.Type: GrantFiled: April 27, 2009Date of Patent: October 2, 2012Assignee: San-Apro LimitedInventors: Issei Suzuki, Hideki Kimura
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Patent number: 8268201Abstract: A color filter and a liquid crystal display device with the color filter that includes a substrate; and a color layer formed on the substrate and constituting color pixels of a plurality of colors, wherein the color layer is formed through a curing of a color composition comprising at least acrylic resin and a coloring agent, wherein the acrylic resin contains a copolymer formed of a first vinyl monomer having a benzyl group and a second vinyl monomer having a carboxyl group, the first vinyl monomer having a function of regulating a retardation of a color layer, the copolymer having a weight average molecular weight of 3000 to 11000 and an acid value of solid matter falling within the range of 30 to 85.Type: GrantFiled: April 29, 2011Date of Patent: September 18, 2012Assignees: Toppan Printing Co., Ltd., DIC CorporationInventors: Mie Shimizu, Koichi Minato, Masaharu Takahashi
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Patent number: 8262946Abstract: Disclosed is a color composition for a color filter, which includes at least acrylic resin and a coloring agent. The acrylic resin contains a copolymer formed of a first vinyl monomer having a benzyl group and a second vinyl monomer having a carboxyl group, the copolymer having a weight average molecular weight of 3,000 to 11,000, and an acid value of solid matter of the copolymer being confined to 30 to 85.Type: GrantFiled: May 13, 2010Date of Patent: September 11, 2012Assignees: Toppan Printing Co., Ltd., DIC CorportionInventors: Mie Shimizu, Koichi Minato, Masaharu Takahashi
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Publication number: 20120219891Abstract: Provided is a resist composition including a resin (A) containing any of repeating units (a) of general formulae (I-a) and (I-b) below and any of repeating units (b) of general formula (II) below but containing substantially no repeating unit in which an alcoholic hydroxyl group is introduced, and any of compounds (B) of general formulae (III-a) and (III-b) below.Type: ApplicationFiled: February 27, 2012Publication date: August 30, 2012Applicant: FUJIFILM CORPORATIONInventors: Kana FUJII, Hidenori TAKAHASHI, Fumiyuki NISHIYAMA
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Publication number: 20120156598Abstract: There is provided a photosensitive resin composition for a microlens. A photosensitive resin composition for a microlens, comprising a component (A), a component (B) and a component (C), wherein the component (A) is a polymer having a maleimide structural unit of Formula (1), the component (B) is a cross-linking agent, and the component (C) is a photosensitizing agent.Type: ApplicationFiled: June 21, 2010Publication date: June 21, 2012Applicant: NISSAN CHEMICAL INDUSTRIES, LTD.Inventors: Takahiro Kishioka, Takahiro Sakaguchi
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Patent number: 8203125Abstract: A LTHC layer for use in radiation induced thermal transfer includes a modified pigment.Type: GrantFiled: June 26, 2008Date of Patent: June 19, 2012Assignee: Cabot CorporationInventors: Anne K. Shim, Joseph B. Carroll
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Patent number: 8168372Abstract: Novel, developer-soluble, hard mask compositions and methods of using those compositions to form microelectronic structures are provided. The composition comprises the compound a compound for controlling development rate, and a crosslinking agent in a solvent system. The methods involve applying the composition to a substrate and curing the composition. An imaging layer is applied to the composition, followed by light exposure and developing, during which the light-exposed portions of the imaging layer are removed, along with portions of the hard mask composition adjacent said light-exposed portions. The size of the hard mask composition structures are controlled by the development rate, and they yield feature sizes that are a fraction of the imaging layer feature sizes, to give a pattern that can ultimately be transferred to the substrate.Type: GrantFiled: September 20, 2007Date of Patent: May 1, 2012Assignee: Brewer Science Inc.Inventor: Sam X. Sun
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Patent number: 8168371Abstract: It is an object of the present invention to provide a positive photosensitive resin composition capable of easily forming an image having high water repellency and high oil repellency on a surface of a cured film thereof even after a treatment with oxygen plasma or the like, and also having an insulating property with high precision and high throughput; and a cured film suitable for a film material of various displays obtained using the positive photosensitive resin composition.Type: GrantFiled: January 18, 2008Date of Patent: May 1, 2012Assignee: Nissan Chemical Industries, Ltd.Inventor: Tadashi Hatanaka
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Patent number: 8163463Abstract: A photoresist composition including an oxetane-containing compound represented by Formula 1 or 2, an oxirane-containing compound represented by Formula 3 or 4, a photoinitiator, and a solvent, a method of forming a pattern using the photoresist composition, and an inkjet print head including a polymerization product of the photoresist composition. The photoresist composition provides a polymerization product which resists formation of cracks due to an inner stress, and has excellent heat tolerance, excellent chemical resistance, excellent adhesiveness, and excellent durability.Type: GrantFiled: February 29, 2008Date of Patent: April 24, 2012Assignee: Samsung Electronics Co., Ltd.Inventors: Jin-baek Kim, Byung-ha Park, Kyu-sik Kim, Young-ung Ha, Su-min Kim
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Patent number: 8133644Abstract: A method of forming an image having multiple phases is disclosed herein. The method includes forming exposed and unexposed areas, the exposed areas comprising a first polymer network exhibiting first and second phases that are chemically connected and have different refractive indices, the first phase being continuous, and the second phase comprising a plurality of structures dispersed within the first phase, and the unexposed areas comprising a second polymer network comprising third and fourth phases that are chemically connected and have different refractive indices, the third phase being continuous, and the fourth phase comprising a plurality of structures dispersed within the third phase. The first and second polymer networks are chemically connected, and morphology formed by the first and second phases is different than that formed by the third and fourth phases.Type: GrantFiled: October 31, 2007Date of Patent: March 13, 2012Assignee: 3M Innovative Properties CompanyInventors: Mieczyslaw H. Mazurek, Raymond P. Johnston, John E. Potts, Marc D. Radcliffe, Kevin R. Schaffer, Audrey A. Sherman, Wendi J. Winkler
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Patent number: 8097386Abstract: A positive-type photosensitive resin composition for electronic materials having good film adhesiveness and sensitivity without causing a corrosion reaction to copper and copper alloys in metal wirings, a method for producing patterns and electronic parts are provided. The positive-type photosensitive resin composition includes (A) a polybenzoxazole precursor having a structure represented by the following general formula (I): wherein X represents a bivalent organic group, Y represents a tetravalent organic group, R1 represents a hydrogen atom or a monovalent organic group, and m represents an integer of 2 to 500 which represents a repeating unit number of the polymer, (B) a solvent, (C) a tetrazole derivative and (D) a compound which generates an acid by light.Type: GrantFiled: August 14, 2006Date of Patent: January 17, 2012Assignee: Hitachi Chemical DuPont Microsystems, Ltd.Inventors: Hajime Nakano, Noriyuki Yamazaki, Yoshiko Futagawa, Yoshika Satou, Dai Kawasaki, Takumi Ueno
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Patent number: 8053167Abstract: Curable compositions have high sensitivity and excellent developability, and further have good storage properties as required. The compositions include a hydroxythiol compound represented by Formula (1) below and a compound with an ethylenically unsaturated double bond: wherein R1 and R2 are each independently a hydrogen atom, a C1-10 alkyl group or an aromatic ring; X is an aliphatic group, an aromatic ring-containing group or a heterocyclic ring-containing group; Y is an ester bond; k and l are each an integer ranging from 1 to 20; m is an integer of 0, 1 or 2; and n is 0 or 1.Type: GrantFiled: November 15, 2007Date of Patent: November 8, 2011Assignee: Showa Denko K.K.Inventors: Katsumi Murofushi, Haruhiko Ikeda, Hideo Miyata, Yotaro Hattori