Abstract: An alkali development-type solder resist includes (A) a carboxyl group-containing photosensitive resin obtained by reacting (a) a compound having two or more cyclic ether or thioether groups in the molecule with (b) an unsaturated monocarboxylic acid, reacting the product with (c) a polybasic acid anhydride, reacting the resulting resin with (d) a compound having a cyclic ether group and an ethylenic unsaturated group in the molecule, and reacting the product additionally with (c) a polybasic acid anhydride, (B) an oxime ester-based photopolymerization initiator containing a specific oxime ester group, (C) a compound having two or more ethylenic unsaturated groups in the molecule, and (D) a thermosetting component, wherein the dry film obtained by applying the composition has an absorbance of 0.3 to 1.2 per 25 ?m of the film thickness at a wavelength of 350 to 375 nm.

Abstract: To provide a fluorinated polymer which enables to reduce the amount of residual ink on partition walls and to form an ink layer having high uniformity in film thickness, and a negative photosensitive composition. A fluorinated polymer which is a copolymer made of at least two monomers each having an ethylenic double bond, and which has a side chain having a C20 or lower alkyl group in which at least one of its hydrogen atoms is substituted by a fluorine atom (provided that the alkyl group may contain an etheric oxygen atom between carbon atoms) and a side chain having at least two ethylenic double bonds per side chain.

Abstract: Sulfonate salts have the formula: HOCH2CH2CF2CF2SO3?M+ wherein M+ is a Li, Na, K, ammonium or tetramethylammonium ion. Onium salts, oxime sulfonates and sulfonyloxyimides derived from these salts are effective photoacid generators in chemically amplified resist compositions.

Abstract: A method for manufacturing a solid-state image capturing apparatus including a pixel array constituted of a plurality of pixels, is provided, where each of the plurality of pixels includes a photoelectric conversion section, the method comprising the steps of: forming an impurity diffusion area in a surface area of a semiconductor substrate; and forming a plurality of different impurity diffusion areas in the surface area of the semiconductor substrate, other than the impurity diffusion area constituting the photoelectric conversion section.

Abstract: Provided are a mask pattern including a silicon-containing self-assembled molecular layer, a method of forming the same, and a method of fabricating a semiconductor device. The mask pattern includes a resist pattern formed on a semiconductor substrate and the self-assembled molecular layer formed on the resist pattern. The self-assembled molecular layer has a silica network formed by a sol-gel reaction. To form the mask pattern, first, the resist pattern is formed with openings on an underlayer covering the substrate to expose the underlayer to a first width. Then, the self-assembled molecular layer is selectively formed only on a surface of the resist pattern to expose the underlayer to a second width smaller than the first width. The underlayer is etched by using the resist pattern and the self-assembled molecular layer as an etching mask to obtain a fine pattern.

Abstract: Negative-working imageable elements have a hydrophilic substrate and a single thermally-sensitive imageable layer. This layer can include an infrared radiation absorbing compound and polymeric particles that coalesce upon thermal imaging. These coalesceable polymeric particles comprise a thermoplastic polymer and a colorant to provide improved visible contrast between exposed and non-exposed regions in the imaged element, such as lithographic printing plates.

Abstract: A positive-type photosensitive resin composition comprises (A) an alkali-soluble resin having at least a polybenzoxazole precursor structure, (B) a sensitizer, and (C) a cyclic compound having an alcoholic hydroxyl group. A protecting layer and an insulating layer include a cured layer which is a cured product of the positive-type photosensitive resin composition. A semiconductor device and a display device include the cured layer. According to the present invention, a highly reliable positive-type photosensitive resin composition can be obtained even when cured at a low temperature.

Abstract: A composition for the organic hard mask includes a polyamic acid compound, and a method for forming a pattern is used in a manufacturing process of semiconductor devices by coating the composition for organic hard mask film on an underlying layer, and depositing a second hard mask film with a silicon nitride SiON film thereon to form a double hard mask film having an excellent etching selectivity, thereby obtaining a uniform pattern.

Abstract: An objective of the present invention is to achieve both prevention of scum generation in an open area and improvement in sensitivity in patterning process of the positive photosensitive resin composition. This objective can be achieved by a positive photosensitive resin composition comprising an alkali-soluble resin (A) containing an ingredient having a molecular weight of 80,000 or more in 0.5% or less and a photosensitizing agent (B), wherein the amount of said photosensitizing agent (B) is 10 parts by weight or more and 40 parts by weight or less to 100 parts by weight of said alkali-soluble resin (A).

Abstract: A radiation sensitive resin composition for forming a protective film, comprising: [A] a copolymer of (a1) an unsaturated carboxylic acid and/or an unsaturated carboxylic anhydride, (a2) an epoxy group-containing unsaturated compound and (a3) an unsaturated compound different from the components (a1) and (a2); [B] a monofunctional polymerizable unsaturated compound having a molecular weight of 180 or more and a carboxyl group; [C] a polyfunctional polymerizable unsaturated compound; and [D] a photopolymerization initiator, a method of forming a protective film from the above composition and a protective film formed from the above composition. The composition can provide a cured film having high flatness, has high developability and heat resistance, is advantageously used to form a protective film for liquid crystal display devices and solid-state image sensing devices, and has high storage stability as a composition.

Abstract: A photo acid generator (PAG) or an acid is used to reduce resist scumming and footing. Diffusion of acid from photoresist into neighbors causes a decreased acid level, and thus causes resist scumming. An increased acid layer beneath the resist prevents acid diffusion. In one embodiment, the increased acid layer is a layer of spun-on acid or PAG dissolved in aqueous solution. In another embodiment, the increased acid layer is a hard mask material with a PAG or an acid mixed into the material. The high acid content inhibits the diffusion of acid from the photoresist into neighboring layers, and thus substantially reduces photoresist scumming and footing.

Abstract: A conductive photolithographic film and method of forming a device using the conductive photolithographic film. The method includes depositing a conductive photolithographic film on a top surface of a substrate; and patterning the conductive photolithographic film to create a desired circuit pattern using a lithographic process. The conductive photolithographic film comprising about 50% to about 60% of a mixture of epoxy acrylate, a thermal curing agent, and a conductive polymer; about 20% to about 30% of a lithographic reactive component; about 10% to about 15% of a photo-active material; and about 3% to about 5% of additives that enhance conductivity of the conductive photolithographic polymer.

Abstract: To provide a photosensitive resin composition in which a hardened film obtained from the photosensitive resin composition has properties comparable to those of a film hardened at a high temperature, a method for manufacturing a patterned hardened film using the photosensitive resin composition, and an electronic part. The photosensitive resin composition includes (a) a polybenzoxazole precursor having a repeating unit represented by a general formula (I): wherein U and V represent a divalent organic group, and at least one of U and V is a group containing an aliphatic chain structure having 1 to 30 carbon atoms; (b) a photosensitizer; (c) a solvent; and (d) a crosslinking agent capable of causing crosslinking or polymerization by heating.

Abstract: The invention pertains to a photo-sensitive composition which comprises a photochemical initiator, a polyacid or a salt thereof, and a poly(3,4-alkylenedioxythiophene) wherein the alkylene moiety is —(CH2)n-, n being an integer from 1 to 3, or 1,2-cyclo-hexylene, which may optionally be substituted, characterized in that the photochemical initiator is a water-soluble polymer comprising at least two azide or diazonium groups. Preferably, the water-soluble polymer is chemically stable at pH 6 or less, more preferably at pH 2 or less.

Abstract: A positive photosensitive resin composition excellent in sensitivity and resolution, characterized by comprising 100 parts by mass of (A) a hydroxypolyamide comprising repeating units represented by the general formula (1), 1 to 50 parts by mass of (B) a photoacid generator, 5 to 20 parts by mass of (C) a carboxylic acid compound having 6 to 18 carbon atoms as represented by the general formula (2), and 0.01 to 70 parts by mass of (D) an alcohol having 4 to 14 carbon atoms as represented by the general formula (3).

Abstract: A positive-type photosensitive resin composition that exhibits excellent adhesion to a substrate after a humidification treatment includes (A) an alkali-soluble resin, (B) a photosensitive diazoquinone compound, and (C-1) a silicon compound shown by the following formula (1), wherein R1 and R2 represent alkyl groups having 1 to 10 carbon atoms, R3 represents an organic group, and R4 represents an alkylene group having 1 to 10 carbon atoms, and i represents an integer from 0 to 2.

Abstract: A liquid developer for electrography, comprising toner particles dispersed in a liquid carrier, wherein the toner particles include a pigment, a thermoplastic resin, and an organic filler, which organic filler is reactive with groups of the thermoplastic resin and incompatible with the liquid carrier.

Abstract: It is a main object of the present invention to provide a wettability variable substrate provided with a wettability variable layer which is free from any cloud and is superior in adhesion to a substrate, transparency and liquid repellency.

Abstract: A photosensitive resin composition includes (a) a polymer mainly composed of a repeating unit represented by the following general formula (I); (b) a dissolution accelerator for a developing solution; and (c) a solvent: wherein R1 is a trivalent or tetravalent organic group, R2 is a bivalent organic group, R is a monovalent organic group having a carbon-carbon unsaturated double bond or a group represented by O?M+ (M+ represents a hydrogen ion or a cation composed of hydrogen and a compound having the carbon-carbon unsaturated double bond) in which the compound having the carbon-carbon unsaturated double bond is ionically bonded, at least one carbon-carbon unsaturated double bond is contained in all repeating units, m is an integer of 2 or more, and n is 1 or 2.

Abstract: A polyimide compound has a low coefficient of linear thermal expansion comparable to the coefficient of linear thermal expansion of a conductor to be covered by the polyimide. The polyimide compound is less susceptible to contraction caused by dehydration process. The compound is obtained by the reaction of a highly linear acid dianhydride with a highly linear diamine and has a high imidization rate. Having a low coefficient of linear thermal expansion comparable to the conductor to be covered by the polyimide, the polyimide compound of the present invention is less susceptible to contraction that occurs during polyimide formation. The polyimide compound is suitable for making curl-free flexible wiring boards.

Abstract: A photosensitive resin composition includes (a) a resin comprising a repeating unit represented by a following formula (1); (b) a photosensitive agent; (c) a thermo-acid generator; and (d) a compound having at least one of an alkoxymethyl group and an acyloxymethyl group, wherein R1 represents a divalent to octavalent organic group containing 2 or more carbon atoms, R2 represents a divalent to hexavalent organic group containing 2 or more carbon atoms, each of R0 and R3 independently represents a hydrogen atom or an organic group containing 1 to 20 carbon atoms, m represents an integer of 0 to 2, and each of p and q represents an integer of 0 to 4, provided that p+q>0.

Abstract: Lithographic printing plate precursor comprising (a) a lithographic substrate with a hydrophilic surface and (b) a radiation-sensitive coating on the hydrophilic surface comprising (i) one or more types of monomers and/or oligomers and/or polymers, each comprising at least one ethylenically unsaturated group accessible to a free radical polymerization, (ii) at least one sensitizer, and at least one coinitiator capable of forming free radicals together with the sensitizer (ii); characterized in that the at least one sensitizer is an oligomeric or polymeric compound comprising the following structural unit (Formula (I)), wherein ?1 is an aromatic or heteroaromatic unit or a combination of the two so that a conjugated n-system is present between the two groups Z in structure (I), each Z independently represents a heteroatom, each R1 and R2 is independently selected from a halogen atom, an alkyl, aryl, alkylaryl or aralkyl group, a group —NR3R4 and a group —OR5, each R3, R4 and R5 is independently selected from a

Abstract: According to the present invention, there is provided: a photosensitive resin composition comprising a polyamide resin having a specific structure, a photosensitive agent, and a compound having at least two sulfonate ester groups; a production method for a cured relief pattern using the photosensitive resin composition; and a semiconductor device containing the cured relief pattern formed according to the production method.

Abstract: The invention provides a relief printing plate precursor for laser engraving, comprising a relief forming layer, the relief forming layer comprising a resin composition for laser engraving, and the resin composition for laser engraving comprising a binder polymer (A) that is insoluble in water and soluble in an alcohol having 1 to 4 carbon atoms. The invention further provides a method for manufacturing a relief printing plate having crosslinking components of the relief forming layer and laser engraving the relief forming layer, and a relief printing plate formed thereby.

Abstract: The invention provides metal compositions, including silver compositions, and thermal imaging donors prepared with the compositions. The donors are useful for thermal transfer patterning of a metal layers and optionally, a corresponding proximate portion of an additional transfer layer onto a thermal imaging receiver. The compositions are useful for dry fabrication of electronic devices. Also provided are patterned multilayer compositions comprising one or more base film(s), and one or more patterned metal layers, including EMI shields and touchpad sensors.

Abstract: A positive photosensitive resin composition containing 100 parts by weight of a polyimide precursor (A) having a constituent unit represented by the formula (1), 15 to 25 parts by weight of a crosslinking agent (B) represented by the formula (2), and 2 to 5 parts by weight of a photosensitizer (C) generating acid upon irradiation of an actinic ray: wherein m is an integer of 1 or greater, and R is an aromatic group or an aliphatic group having a valency of 1 or higher. The positive photosensitive resin composition can be developed by using an aqueous solution of alkali metal carbonate, is capable of forming micropatterns, and has excellent thermal resistance and the like. A method for forming a positive pattern, and uses thereof are also provided.

Abstract: A cationic photopolymerizable epoxy resin composition includes an epoxy resin, a cationic photopolymerization initiator, an inhibitor of cationic polymerization and a compound that has a fluoroalkyl group and also has a substituent at its terminal, with the substituent being allowed to cross-link react with the epoxy group of the epoxy resin. The cationic photopolymerizable epoxy resin composition further includes a thermal cationic polymerization catalyst.

Abstract: This invention relates to a novel polymer compound, and a process for preparing the same and a radical polymerizable, curable composition using the same. The polymer of the invention has in the side chain thereof a structure represented by the formula (1): wherein R1 each independently represents at least one or more organic residue selected from the group consisting of an alkylene group, a branched alkylene group, a cycloalkylene group, an aralkylene group and an arylene group, R2 each independently represents at least one or more organic residue selected from the group consisting of an alkylene group, a branched alkylene group, an alkenylene group, a branched alkenylene group, a cycloalkylene group, a cycloalkenylene group and an arylene group, and n represents an integer of 0 to 20.

Abstract: An oxetane-containing compound, a photoresist composition including the same, a method of preparing patterns using the photoresist composition, and an inkjet print head including polymerization products of the oxetane-containing compound.

Abstract: Phosphono-substituted siloxanes suitable as interlayer material in lithographic substrates and for post-treating developed lithographic printing plates, obtainable by reacting (a) a first organosilicon compound of the general formula (I) and (b) a second organosilicon compound of the general formula (II).

Abstract: Some embodiments in accordance with the present invention relate to norbornene-type polymers and to photosensitive dielectric resin compositions formed therefrom. Other embodiments relate to films formed from such compositions and to devices, such as electrical, electronic and optoelectronic devices, that encompass such films.

Abstract: Disclosed is a composition which comprises a polymer containing at least some monomer repeat units with photosensitivity-imparting substituents which enable crosslinking or chain extension of the polymer upon exposure to actinic radiation, said polymer being of the formula wherein x is an integer of 0 or 1, A is one of several specified groups, such as B is one of several specified groups, such as or mixtures thereof, and n is an integer representing the number of repeating monomer units, wherein said photosensitivity-imparting substitutents are allyl ether groups, epoxy groups, or mixtures thereof. Also disclosed is a process for preparing a thermal ink jet printhead containing the aforementioned polymers and processes for preparing the aforementioned polymers.

Abstract: A method of manufacturing a semiconductor device, including the steps of forming one or more insulation films over a substrate, said one or more insulation films including an insulation film at a top thereof, coating the insulation film with a substrate processing agent, providing resist onto the insulation film coated with the substrate processing agent, lithographically forming a pattern of the resist, and dry-etching the insulation film by using the resist as a mask, wherein the substrate processing agent contains at least a solvent and an acid generating agent.

Abstract: A self assembly step for the manufacture of an electronic component comprising, e.g., a semiconductor chip or semiconductor array or wafer comprises forming a diblock copolymer film placed on a random copolymer film substrate operatively associated with the electronic component and the diblock copolymer film wherein the surface energy of the random copolymer film is tailored by use of a photolithographic process prior to the self assembly step. By prior deterministic control over regional surface properties of the random copolymer film, domains of the diblock copolymer film form only in predefined areas. This approach offers simplified processing and a precise control of regions where domain formation occurs. Selective removal of some of the domains allows for further processing of the electronic component.

Abstract: This invention relates to a negative-working photosensitive resin composition that can be developed in an alkaline developer. This photosensitive resin composition comprises: (a) a polyimide having at least one group selected from the group consisting of a carboxyl group, a phenolic hydroxyl group, a sulfonic acid group, and a thiol group at the terminus of the polymer main chain; (b) a compound having a polymerizable functional group comprising unsaturated double and/or triple bonds; and (c) a photopolymerization initiator.

Abstract: The invention is a radiation curable liquid resin that can be used to make a clear and colorless, three-dimensional article by a stereolithography process. The clear and colorless three-dimensional articles have a clarity and transmittance of greater than about 67% as measured by UV-Visible spectrophotometer in the 400-500 nm range; and a lack of color as measured by a b* value of between about minus 0.5 (?0.5) and about positive 2.5 (+2.5) in the CIELAB color space using a spectrophotometer in the visible wavelengths of 400-750 nm.

Abstract: Photochromic monomers and methods for preparing these photochromic monomers, photochromic polymers based on these photochromic monomers and methods for preparing these photochromic polymers, as well as the use of these photochromic polymers in a polymer binder as a two-photon recording medium for an optical 3D memory and photoswitches of optical signals are disclosed. The materials exhibit thermally irreversible photochromic transformations and other properties enabling the use of the photochromic polymers in an optical two-photon read/write memory.

Abstract: Provided is a positive photosensitive resin composition which is advantageous not only in excellent sensitivity, resolution and adhesion, but also in excellent heat resistance even when the composition is cured by a low-temperature process at equal to or lower than 280° C., as well as low water absorption and capability to give a pattern with favorable configuration. The positive photosensitive resin composition contains: (a) alkaline aqueous solution-soluble polyamide having a polyoxazole precursor structure; (b) an o-quinonediazide compound; and (c) a latent acid generator which generates acid upon heating. The composition optionally further contains (d) a compound having a phenolic hydroxyl group or (e) a solvent.

Abstract: Disclosed is a hydroxy polyamide represented by the following general formula (1) and having a 5-amino isophthalic acid derivative structure in the main chain structure. (1) (In the formula, m and n represent integers, X represents at least one tetravalent organic group, Y represents at least one divalent organic group having a 5-amino isophthalic acid derivative structure, and Z represents at least one divalent organic group).

Abstract: A photosensitive resin composition comprising: (a) at least one polybenzoxazole precursor polymer; (b) at least one compound having Structure VI ?wherein, V is CH or N, Y is O or NR3 wherein R3 is H, CH3 or C2H5, R1 and R2 each independently are H, C1-C4 alkyl group, C1-C4 alkoxy group, cyclopentyl or cyclohexyl, or alternatively, R1 and R2 can be fused to produce a substituted or unsubstituted benzene ring; and (c) at least one solvent; wherein the amount of the compound of Structure VI present in the composition is effective to inhibit residue from forming when the composition is coated on a substrate and the coated substrate is subsequently processed to form an image on the substrate, and with the proviso that if the polybenzoxazole precursor polymer solely consists of polybenzoxazole precursor polymers that do not contain a photoactive moiety in the polymer, then (d) at least one photoactive compound is also present in the composition.

Abstract: A bottom antireflective coating for photolithography at 157 nm or less, where the bottom antireflective coating includes a crosslinkable polymer which contains cinnamic acid derivatives.

Abstract: Antihalation compositions and methods for reducing the reflection of exposure radiation of a photoresist overcoated said compositions. The antihalation compositions of the invention comprise a resin binder and material capable of causing a thermally induced crosslinking reaction of the resin binder.

Abstract: A photosensitive resin composition that excels in sensitivity to actinic energy rays (photosensitivity), is hardenable within a short period of time and can form pattern through development with a diluted aqueous alkali solution and that gives a cured film through thermal curing in the postcuring step, the cured film having satisfactory flexibility and being suitable to a solder mask ink of high insulation excelling in adherence and resistances of gold plating, electroless gold plating and tin plating; and a curing product thereof.

Abstract: The invention provides a polyamide resin having a structure represented by the formula (1), wherein about 0.1 mol % to about 30 mol % of the total amount of Y in the formula (1) has a structure represented by the formula (2), further a positive-working photosensitive resin composition comprising a diazoquinone compound, a method for producing a pattern-formed resin film using the composition, a semiconductor device and a display device using the composition, and a method for producing the semiconductor device and the display device: wherein, X is an organic group of 2 to 4 valences; Y is an organic group of 2 to 6 valences; R1 is a hydroxyl group or —O—R3 wherein m is an integer of 0 to 2; R2 is a hydroxyl group, a carboxyl group, —O—R3 or —COO—R3 wherein n is an integer of 0 to 4; R3 is an organic group having 1 to 15 carbon atoms; wherein, each of R4 and R5 is a divalent organic group; each of R6 and R7 is a monovalent organic group; n is an integer of 0 to 20.

Abstract: A positive-working photosensitive resin composition containing an alkali soluble resin (A), a diazoquinone compound (B) and a compound (C) which contains a —CH2OH group but not a phenolic hydroxyl group, a method for producing a pattern-formed resin film using the composition, a semiconductor device and a display device using the composition, and a method for producing the semiconductor device and the display device.

Abstract: A photosensitive resin composition includes an alkali-soluble resin, a quinone diazide, a surfactant, and a solvent. The solvent includes a diethylene glycol dialkyl ether that includes an alkyl group including one to five carbon atoms, an ethyl 3-ethoxy propionate, an alkyl acetate that includes an alkyl group including three to eight carbon atoms, and an alkyl lactate that includes an alkyl group including one to six carbon atoms. The composition may be used to make high-quality display panels with uniformly-coated insulating layers.

Abstract: Disclosed is a positive photosensitive insulating resin composition including: (A) an alkali soluble resin, (B) a compound having a quinonediazide group, and (C) an epoxy resin having a softening point of not lower than 30° C.; and a cured product which is obtained by curing the composition. The cured product obtained by curing the composition is excellent in resolution, electrical insulation, thermal shock resistance and adhesion, and exhibits reduced deformation after post-baking.

Abstract: A composition for photosensitive flexographic plates which is capable of forming a sheet having a smooth surface and excellent antiflowing properties and less apt to have trouble caused by sticking and which further has excellent thin-line reproducibility; a block copolymer composition for photosensitive flexographic plates which is suitable for use in the composition; and a flexographic plate obtained by exposing the composition to light. Also provided are: a block copolymer composition containing a three-branched aromatic vinyl/conjugated diene block copolymer obtained with a specific coupling agent; and a composition for photosensitive flexographic plates which comprises an ethylenic compound and a photopolymerization initiator.

Abstract: This disclosure relates to a photosensitive composition useful in preparing water-developable, relief printing plates and other photosensitive articles. The compositions comprise an unsaturated polyurethane pre-polymer, which is the reaction product of at least one polyether diol, at least one aliphatic diisocyanate, at least one hydroxyl-functionalized mono-, di- and tri-(meth)acrylate, and a particular photoinitiator. The resulting photosensitive resin compositions have reduced rates and levels of yellowing if subjected to additional UV-light or sunlight after processing.

Abstract: A scratch-off document and a method for producing a scratch off document are disclosed. The scratch-off document may include: a base material; a first toner layer affixed to the base material, wherein the first toner layer comprises a content to be masked; an optional barrier layer; and a second toner layer removably affixed to the barrier layer, so that the second toner layer may be removed when scratched using a hard object.