Registration Or Layout Process Other Than Color Proofing Patents (Class 430/22)
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Patent number: 12242202Abstract: The present disclosure provides a method for overlay error correction. The method includes: obtaining an overlay error based on a lower-layer pattern and an upper-layer pattern of a wafer, wherein the lower-layer pattern is obtained by first fabrication equipment through which the wafer passes, and the upper-layer pattern is obtained by exposure equipment; generating a corrected overlay error based on the overlay error and fabrication processes performed on the wafer after the first fabrication equipment and prior to the exposure equipment; and adjusting the exposure equipment based on the corrected overlay error.Type: GrantFiled: January 4, 2022Date of Patent: March 4, 2025Assignee: NANYA TECHNOLOGY CORPORATIONInventor: Shih-Yuan Ma
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Patent number: 12242187Abstract: A method and system for supplying control signals to two or more force actuators wherein each of the two or more force actuators having a defined force value. The method includes sending a first set of control signals to each of the actuators to ramp forces supplied to reach the defined force value at a same initial defined value time and sending a second set of control signals to each of the actuators to reduce the forces supplied starting at a same final defined value time to individual set point values, and wherein each of the two of more force actuators reach their individual set point values at a same set point time.Type: GrantFiled: October 5, 2023Date of Patent: March 4, 2025Assignee: Canon Kabushiki KaishaInventors: Jeffrey Dean Klein, Steven T. Jenkins, Atsushi Kusaka
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Patent number: 12243761Abstract: An apparatus, method, and system for identifying and obtaining information related to a substrate support and/or a pre-heat ring in a process chamber via imaging and image processing. In an embodiment, a substrate support is provided. The substrate support generally includes a top surface configured to receive a substrate in a process chamber and a marking feature disposed on the top surface of the substrate support, the marking feature configured to be detectable by an imaging apparatus coupled to the process chamber to provide information related to the substrate support via imaging when the substrate support is disposed within the process chamber.Type: GrantFiled: October 27, 2022Date of Patent: March 4, 2025Assignee: Applied Materials, Inc.Inventors: Martin Jeffrey Salinas, Zhepeng Cong, Hui Chen, Xinning Luan, Ashur J. Atanos
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Patent number: 12235590Abstract: A non-transitory computer-readable storage medium that records a data structure for storing data controlling an operation of an overlay measurement device that measures an error between a first overlay mark and a second overlay mark formed on different layers of a wafer. The data include: information of a recipe that is input to allow the overlay measurement device to measure characteristics of a wafer through a manager program installed in a user terminal, and unique information of the overlay measurement device. The overlay measurement device includes: a light source, an aperture that changes a beam from the light source to be suitable for photographing the first overlay mark or the second overlay mark, a detector that acquires an image of the first overlay mark and an image of the second overlay mark, a transceiver, and a processor electrically connected to the transceiver.Type: GrantFiled: February 6, 2024Date of Patent: February 25, 2025Assignee: AUROS TECHNOLOGY, INC.Inventors: Sol-Lee Hwang, Dong-Won Jung, Hee-Chul Lim, Hyun-Kyoo Shon, Min-Ho Lee
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Patent number: 12172344Abstract: A stamp replication device for producing stamps for the production of at least one of microstructured and nanostructured components has a platform, a cover that is positionable on the platform and a holding device for a stamp carrier, wherein the holding device is provided on the cover or on the platform and includes a carrier as well as a microstructured vacuum surface on the carrier for holding the stamp carrier. In addition, a method for producing a holding device for a stamp replication device as well as a method for producing a stamp are specified.Type: GrantFiled: May 11, 2020Date of Patent: December 24, 2024Assignee: SUSS MICROTEC LITHOGRAPHY GMBHInventors: Uwe Vogler, Fabian Kloiber, Georg Fink, Christian May, Ghazahleh Jalali
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Patent number: 12169365Abstract: A non-transitory computer-readable storage medium that records a data computer-readable storage medium that records a data structure for storing data controlling an operation of an overlay measurement device that measures an error between a first overlay mark and a second overlay mark formed on different layers of a wafer. The data include information of a recipe that is input to allow the overlay measurement device to measure characteristics of a wafer through a manager program installed in a user terminal, and unique information of the overlay measurement device.Type: GrantFiled: February 6, 2024Date of Patent: December 17, 2024Assignee: AUROS TECHNOLOGY, INC.Inventors: Sol-Lee Hwang, Dong-Won Jung, Hee-Chul Lim, Hyun-Kyoo Shon, Min-Ho Lee
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Patent number: 12169364Abstract: A non-transitory computer-readable storage medium that records a data structure for storing data controlling an operation of an overlay measurement device that measures an error between a first overlay mark and a second overlay mark formed on different layers of a wafer. The data include information of a recipe that is input to allow the overlay measurement device to measure characteristics of a wafer through a manager program installed in a user terminal, and unique information of the overlay measurement device.Type: GrantFiled: February 6, 2024Date of Patent: December 17, 2024Assignee: AUROS TECHNOLOGY, INC.Inventors: Sol-Lee Hwang, Dong-Won Jung, Hee-Chul Lim, Hyun-Kyoo Shon, Min-Ho Lee
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Patent number: 12159473Abstract: Provided are a device for analyzing a large-area sample based on an image, a device for analyzing a sample based on an image by using a difference in medium characteristic, and a method for measuring and analyzing a sample by using the same. The device for analyzing a large-area sample includes a first sensor array including sensors disposed while being spaced apart from each other in a first direction, a second sensor array including sensors disposed while being spaced apart from each other in the first direction, and spaced apart from the first sensor array in a second direction, and a control unit that obtains image data for a cell included in the sample by using sensing data of the sensor on the sample, in which the sample is interposed between the first sensor array and the second sensor array.Type: GrantFiled: March 1, 2023Date of Patent: December 3, 2024Assignee: SOL INC.Inventors: Jong Muk Lee, Hee Chan Shin, Seong Won Kwon, Ki Ho Jang
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Patent number: 12135498Abstract: Methods, a non-transitory computer-readable storage medium, devices, and a system in relation to training a convolutional neural network for deriving corrected digital pattern descriptions from digital pattern descriptions for use in a process for producing photomasks are disclosed. A reinforcement learning agent is trained to derive corrected digital pattern descriptions from respective digital pattern descriptions. The training is based on a first plurality of generated digital pattern descriptions and an obtained physical model using which predicted binary patterns of photomasks can be derived that would result from inputting digital pattern descriptions to the process for producing photomasks. A second plurality of digital pattern descriptions is then generated, and corresponding corrected digital pattern descriptions are generated using the trained reinforcement learning agent, thereby generating training data.Type: GrantFiled: September 9, 2021Date of Patent: November 5, 2024Assignee: Mycronic ABInventors: Robert Eklund, Gleb Lobov, Romain Roux
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Patent number: 12072374Abstract: A detection pad structure in a semiconductor device may include a lower wiring on a substrate, an upper wiring on the lower wiring, and a first pad pattern on the upper wiring. The upper wiring may be connected to the lower wiring and include metal patterns and via contacts on the metal patterns that are stacked in a plurality of layers. The first pad pattern may be connected to the upper wiring. A semiconductor device may include an actual upper wiring including actual metal patterns and actual via contacts stacked in a plurality of layers. At least one of the metal patterns of each layer in the upper wiring may have a minimum line width and a minimum space of the metal patterns of each layer in the actual upper wiring. Metal patterns and via contacts of each layer in the upper wiring may be regularly and repeatedly arranged.Type: GrantFiled: December 2, 2021Date of Patent: August 27, 2024Assignee: Samsung Electronics Co., Ltd.Inventors: Jihoon Chang, Yeonjin Lee, Minjung Choi, Jimin Choi
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Patent number: 12044977Abstract: Examples of a multiple-mask multiple-exposure lithographic technique and suitable masks are provided herein. In some examples, a photomask includes a die area and a stitching region disposed adjacent to the die area and along a boundary of the photomask. The stitching region includes a mask feature for forming an integrated circuit feature and an alignment mark for in-chip overlay measurement.Type: GrantFiled: July 26, 2023Date of Patent: July 23, 2024Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Peter Yu, Chih-Tung Hsu, Kevin Wang, Chih-Chia Hu, Roger Chen
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Patent number: 11988969Abstract: The present application relates to a dispatch method for a production line in a semiconductor process, a storage medium and a semiconductor device. The dispatch method for a production line in a semiconductor process can acquire an overlay error reference curve of a product lot to be exposed in equipment and set an overlay error range according to the overlay error reference curve. At the end of exposure, an overlay error for the product lot to be exposed can be acquired, and it can be determined whether the overlay error falls into the overlay error range. If the overlay error for the product lot to be exposed does not fall into the overlay error range, the product lot to be exposed can be continuously machined by this equipment.Type: GrantFiled: May 26, 2021Date of Patent: May 21, 2024Assignee: Changxin Memory Technologies, Inc.Inventor: Chin-Chang Huang
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Patent number: 11971664Abstract: Process control methods, metrology targets and production systems are provided for reducing or eliminating process overlay errors. Metrology targets have pair(s) of periodic structures with different segmentations, e.g., no segmentation in one periodic structure and device-like segmentation in the other periodic structure of the pair. Process control methods derive metrology measurements from the periodic structures at the previous layer directly following the production thereof, and prior to production of the periodic structures at the current layer, and use the derived measurements to adjust lithography stage(s) that is part of production of the current layer. Production system integrate lithography tool(s) and metrology tool(s) into a production feedback loop that enables layer-by-layer process adjustments.Type: GrantFiled: July 30, 2018Date of Patent: April 30, 2024Assignee: KLA-TENCOR CORPORATIONInventors: Liran Yerushalmi, Roie Volkovich
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Patent number: 11960214Abstract: There are provided a computer-readable storage medium and an overlay measurement device therefor that records a data structure for storing data controlling an operation of an overlay measurement device. In a computer-readable storage medium that records a data structure for storing data controlling an operation of an overlay measurement device in one embodiment, the data includes information of a recipe that is input to allow the overlay measurement device to measure characteristics of a wafer through a manager program installed in a user terminal, and unique information of the overlay measurement device.Type: GrantFiled: May 3, 2023Date of Patent: April 16, 2024Assignee: AUROS TECHNOLOGY, INC.Inventors: Sol-Lee Hwang, Dong-Won Jung, Hee-Chul Lim, Hyun-Kyoo Shon, Min-Ho Lee
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Patent number: 11947266Abstract: A method for determining a correction relating to a performance metric of a semiconductor manufacturing process, the method including: obtaining a set of pre-process metrology data; processing the set of pre-process metrology data by decomposing the pre-process metrology data into one or more components which: a) correlate to the performance metric; or b) are at least partially correctable by a control process which is part of the semiconductor manufacturing process; and applying a trained model to the processed set of pre-process metrology data to determine the correction for the semiconductor manufacturing process.Type: GrantFiled: November 14, 2019Date of Patent: April 2, 2024Assignee: ASML NETHERLANDS B.V.Inventors: Nicolaas Petrus Marcus Brantjes, Matthijs Cox, Boris Menchtchikov, Cyrus Emil Tabery, Youping Zhang, Yi Zou, Chenxi Lin, Yana Cheng, Simon Philip Spencer Hastings, Maxim Philippe Frederic Genin
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Patent number: 11880142Abstract: A self-calibrating overlay metrology system may receive device overlay data for a device targets on a sample from an overlay metrology tool, determine preliminary device overlay measurements for the device targets including device-scale features using an overlay recipe with the device overlay data as inputs, receive assist overlay data for one or more assist targets on the sample including device-scale features from the overlay metrology tool, where at least one of the one or more assist targets has a programmed overlay offset of a selected value along a particular measurement direction, determine self-calibrating assist overlay measurements for the one or more assist targets based on the assist overlay data, where the self-calibrating assist overlay measurements are linearly proportional to overlay on the sample, and generate corrected overlay measurements for the device targets by adjusting the preliminary device overlay measurements based on the self-calibrating assist overlay measurements.Type: GrantFiled: March 7, 2023Date of Patent: January 23, 2024Assignee: KLA CorporationInventors: Stilian Pandev, Min-Yeong Moon, Andrei V. Shchegrov, Jonathan Madsen, Dimitry Sanko, Liran Yerushalmi, Alexander Kuznetsov, Mahendra Dubey
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Patent number: 11860549Abstract: A method for determining a correction for control of at least one manufacturing apparatus used in a manufacturing process for providing structures to a region on a substrate, the region including a plurality of sub-regions. The method includes obtaining measurement data relating to a process parameter of the manufacturing process for the region; and determining a correction for the manufacturing apparatus based on the measurement data. The correction is configured to maintain the process parameter within a specified range across a boundary between two of the sub-regions and/or to better correct the process parameter across the boundary between two of the sub-regions with respect to within the remainder of the region.Type: GrantFiled: May 1, 2019Date of Patent: January 2, 2024Assignee: ASML NETHERLANDS B.V.Inventors: Wolter Siemons, Daan Maurits Slotboom, Erik Peter De Kort
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Patent number: 11815811Abstract: A method and system for supplying control signals to two or more force actuators wherein each of the two or more force actuators having a defined force value. The method includes sending a first set of control signals to each of the actuators to ramp forces supplied to reach the defined force value at a same initial defined value time and sending a second set of control signals to each of the actuators to reduce the forces supplied starting at a same final defined value time to individual set point values, and wherein each of the two of more force actuators reach their individual set point values at a same set point time.Type: GrantFiled: March 23, 2021Date of Patent: November 14, 2023Assignee: Canon Kabushiki KaishaInventors: Jeffrey Dean Klein, Steven T. Jenkins, Atsushi Kusaka
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Patent number: 11733606Abstract: A method for assigning features into at least first features and second features, the first features being for at least one first patterning device configured for use in a lithographic process to form corresponding first structures on a substrate and the second features being for at least one second patterning device configured for use in a lithographic process to form corresponding second structures on a substrate, wherein the method including assigning the features into the first features and the second features based on a patterning characteristic of the features.Type: GrantFiled: April 29, 2019Date of Patent: August 22, 2023Assignee: ASML NETHERLANDS B.V.Inventors: Thomas Theeuwes, Koenraad Van Ingen Schenau, Pieter Joseph Marie Wöltgens
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Patent number: 11726408Abstract: Examples of a multiple-mask multiple-exposure lithographic technique and suitable masks are provided herein. In some examples, a photomask includes a die area and a stitching region disposed adjacent to the die area and along a boundary of the photomask. The stitching region includes a mask feature for forming an integrated circuit feature and an alignment mark for in-chip overlay measurement.Type: GrantFiled: July 27, 2022Date of Patent: August 15, 2023Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Peter Yu, Chih-Tung Hsu, Kevin Wang, Chih-Chia Hu, Roger Chen
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Patent number: 11686999Abstract: The invention relates a method for producing a radiation-emitting component including a step A, in which a laser having an optical resonator and an output mirror is provided, wherein during the intended operation, laser radiation exits the optical resonator via the output mirror. In a step B), a photoresist layer is applied to the output mirror. In a step C), an optical structure is generated from the photoresist layer by means of a 3D lithography method, wherein the optical structure is designed to influence the beam path of the laser radiation by refraction and/or reflection.Type: GrantFiled: November 29, 2018Date of Patent: June 27, 2023Assignee: OSRAM OLED GMBHInventor: Alexander Schlehahn
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Patent number: 11650445Abstract: Provided are a method for manufacturing a transparent panel formed with a wall member having high accuracy, a uniform height from a surface to adhere to an optical member, and smoothness. This method comprises: a step of preparing a transparent panel 4 for an optical device 1 to be bonded to an optical member 2; a step of forming a mask layer 15 so as to form an opening 6 along a periphery of an outer shape of the transparent panel 4; a step of applying a curable resin material 7 to the opening 6 and the mask layer 15; a step of pressing a flat plate 10 against the curable resin material 7; a step of curing the resin composition 7 to form a cured resin layer 11; a step of detaching the flat plate 10; and a step of removing the mask layer 15 together with the cured resin layer 11 formed on the mask layer 15 to obtain a wall member 12 along the periphery of the outer shape of the transparent panel 4.Type: GrantFiled: September 11, 2018Date of Patent: May 16, 2023Assignee: DEXERIALS CORPORATIONInventor: Yoshikazu Nagasawa
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Patent number: 11602697Abstract: Disclosed herein are system, method, and computer program product embodiments for assessing performance of a player of a game. An embodiment operates by monitoring for an input from the player of the game, receiving the input from the player of the game, and determining a characteristic of the game resulting from the input from the player. Based on the input from the player, a performance of the player is assessed. The performance of the player relating to one or more metrics of the game is monitored, and is assessed by comparing the input from the player during the period of time to an optimal input during the period of time in the game.Type: GrantFiled: September 4, 2018Date of Patent: March 14, 2023Assignee: State Space Labs Inc.Inventors: Jason R. Fuller, David J. Heeger, Wayne E. Mackey
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Patent number: 11567419Abstract: In a beam irradiation apparatus in which a movable body holds an object, a mark detection system detects a first mark on the movable body while moving the movable body in a first direction and changing an irradiation position of a measurement beam in the first direction, the mark detection system detects a second mark while moving the movable body in the first direction and changing the irradiation position of the measurement beam in the first direction, a controller controls a position of the movable body in a second direction intersecting the first direction during a time period between the detection of the first mark and the detection of the second mark, and the controller controls the movement of the movable body to adjust a positional relation between the object on the movable body and a processing beam, based on results of the detection of the first and second marks.Type: GrantFiled: April 16, 2021Date of Patent: January 31, 2023Assignee: NIKON CORPORATIONInventor: Akihiro Ueda
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Patent number: 11521882Abstract: An optical system may include a light source to provide a beam of light. The optical system may include a reflector to receive and redirect the beam of light. The optical system may include a light gate having an opening to permit the beam of light, from the reflector, to travel through the opening. The optical system may include a light sensor to receive a portion of the beam of light after the beam of light travels through the opening, and convert the portion of the beam of light to a signal. The optical system may include a processing device to determine whether a notch of a wafer is in an allowable position based on the signal.Type: GrantFiled: August 20, 2020Date of Patent: December 6, 2022Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Kai-An Chuang, Kuang-Wei Hsueh, Shih-Huan Chen, Yung-Shu Kao
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Patent number: 11507231Abstract: A display device may include a display panel, an input sensing unit, and an alignment structure. The display panel may include a sealing member. The input sensing unit may be disposed on the display panel. The input sensing unit may include first-type sensor electrodes directly contacting a face of a first insulator of the display device, a first-type connector electrically connecting the first-type sensor electrodes, second-type sensor electrodes directly contacting the face of the first insulator of the display device, and a second-type connector electrically connecting the second-type sensor electrodes. The alignment structure may overlap the sealing member and may include a transparent member that directly contacts the face of the first insulator of the display device.Type: GrantFiled: October 15, 2020Date of Patent: November 22, 2022Inventors: Jong Seon Park, Hwan Hee Jeong
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Patent number: 11500300Abstract: In a beam irradiation apparatus in which a movable body holds an object, a mark detection system detects a first mark on the movable body while moving the movable body in a first direction and changing an irradiation position of a measurement beam in the first direction, the mark detection system detects a second mark while moving the movable body in the first direction and changing the irradiation position of the measurement beam in the first direction, a controller controls a position of the movable body in a second direction intersecting the first direction during a time period between the detection of the first mark and the detection of the second mark, and the controller controls the movement of the movable body to adjust a positional relation between the object on the movable body and a processing beam, based on results of the detection of the first and second marks.Type: GrantFiled: April 16, 2021Date of Patent: November 15, 2022Assignee: NIKON CORPORATIONInventor: Akihiro Ueda
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Patent number: 11482517Abstract: An integrated circuit process includes the following steps. A substrate including a first area and a second area is provided. A plurality of line patterns cover the substrate of the first area, and a sacrificial line pattern covers the substrate of the second area, wherein these line patterns separate from and are orthogonal to the sacrificial line pattern. The present invention also provides an integrated circuit formed by said process. A substrate includes a first area and a second area; a plurality of line patterns cover the substrate of the first area; a slot pattern is in the substrate of the second area, wherein these line patterns are orthogonal to the slot pattern. Additionally, a plurality of line patterns cover the substrate; a sacrificial line pattern is at ends of the line patterns, wherein these line patterns separate from and are orthogonal to the sacrificial line pattern.Type: GrantFiled: May 16, 2018Date of Patent: October 25, 2022Assignee: UNITED MICROELECTRONICS CORP.Inventors: En-Chiuan Liou, Chih-Wei Yang, Kuei-Chun Hung
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Patent number: 11456222Abstract: An overlay correction method may include obtaining a first central line of a lower pattern on a substrate, forming a photoresist pattern on the lower pattern, obtaining an ADI overlay value corresponding to a first distance between a second central line of an upper flat surface of the lower pattern and a third central line of the photoresist pattern, obtaining an asymmetrical overlay value corresponding to a second distance between the first and second central lines, form an upper pattern using the photoresist pattern, obtaining an ACI overlay value corresponding to a third distance between the first central line and a fourth central line of the upper pattern, subtracting the ADI overlay value from the ACI overlay value to obtain a first overlay skew value, and adding the asymmetrical overlay value to the first overlay skew value to obtain a second overlay skew value.Type: GrantFiled: May 28, 2020Date of Patent: September 27, 2022Assignee: Samsung Electronics Co., Ltd.Inventors: Woo-Yong Jung, Jinsun Kim, Seungyoon Lee, Jeongjin Lee, Chan Hwang
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Patent number: 11429029Abstract: A method includes projecting an illumination beam of radiation onto a metrology target on a substrate, detecting radiation reflected from the metrology target on the substrate, and determining a characteristic of a feature on the substrate based on the detected radiation, wherein a polarization state of the detected radiation is controllably selected to optimize a quality of the detected radiation.Type: GrantFiled: October 27, 2020Date of Patent: August 30, 2022Assignee: ASML NETHERLANDS B.V.Inventors: Maurits Van Der Schaar, Patrick Warnaar, Youping Zhang, Arie Jeffrey Den Boef, Feng Xiao, Martin Ebert
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Patent number: 11422479Abstract: Systems and methods described herein relate to the manufacture of optical elements and optical systems. An example method includes overlaying a first mask on a photoresist material and a substrate, and causing a light source to illuminate the photoresist material through the first mask during a first exposure so as to define a first feature. During the first exposure, the light source is positioned at a non-normal angle with respect to a plane parallel to the substrate. The method includes developing the photoresist material so as to retain an elongate portion of the photoresist material on the substrate. A first end of the elongate portion includes an angled portion that is sloped at an angle with respect to a long axis of the elongate portion. The method also includes depositing a reflective material through a second mask onto the angled portion.Type: GrantFiled: March 1, 2021Date of Patent: August 23, 2022Assignee: Waymo LLCInventors: Bernard Fidric, Pierre-Yves Droz, David Hutchison
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Patent number: 11414739Abstract: A mask frame assembly, including: a hollow frame, which is provided with a hollow area; and a first howling stick, disposed across the hollow area of the hollow frame in a first direction; wherein the mask frame assembly is configured to support a fine metal mask plate which includes a mask pattern area and an invalid mask area surrounding the mask pattern area; in a state of the fine metal mask plate being supported by the mask frame assembly, opposite ends of the fine metal mask plate are fixed on the hollow frame in a second direction; the mask pattern area of the fine metal mask plate is disposed in the hollow area of the hollow frame; and a projection of the first howling stick on the fine metal mask plate is in the invalid mask area. An evaporation device is also disclosed.Type: GrantFiled: December 6, 2017Date of Patent: August 16, 2022Assignees: BOE TECHNOLOGY GROUP CO., LTD., ORDOS YUANSHENG OPTOELECTRONICS CO., LTD.Inventors: Zhiming Lin, Zhen Wang, Jian Zhang
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Patent number: 11392742Abstract: Implementations of the present disclosure provide coloring methods that sort and pre-color nodes of G0-linked networks in a multiple-patterning technology (MPT)-compliant layout design by coordinate. In one embodiment, a method includes identifying target networks in a circuit layout, each target network having two or more linked nodes representing circuit patterns, and each target network being presented in an imaginary X-Y coordinate plane, assigning a first feature to a first node in each target network, the first node is determined using a coordinate-based method, and assigning the first feature and a second feature to remaining nodes in each target network in an alternating manner so that any two immediately adjacent linked nodes in each target network have different features.Type: GrantFiled: October 5, 2020Date of Patent: July 19, 2022Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Chia-Ping Chiang, Ming-Hui Chih, Chih-Wei Hsu, Ping-Chieh Wu, Ya-Ting Chang, Tsung-Yu Wang, Wen-Li Cheng, Hui En Yin, Wen-Chun Huang, Ru-Gun Liu, Tsai-Sheng Gau
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Patent number: 11392045Abstract: A method for manufacturing a structure on a substrate includes projecting an image of a reference pattern onto a substrate having a first patterned layer, the first patterned layer including first alignment marks and first overlay measurement marks, and the reference pattern including second alignment marks and second overlay measurement marks, aligning, based on the first alignment marks and the second alignment marks, the first patterned layer to the image of the reference pattern, obtaining a pre-overlay mapping of the first overlay measurement marks and the second overlay measurement marks, and determining compensation data indicative of information of the pre-overlay mapping of the first overlay measurement marks and the second overlay measurement marks.Type: GrantFiled: December 7, 2020Date of Patent: July 19, 2022Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Wen-Yun Wang, Hua-Tai Lin, Chia-Chu Liu
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Patent number: 11360378Abstract: A display panel includes a method of fabricating an array substrate. The method includes forming a metal layer (1) on a substrate, and patterning the metal layer (1) using a phase shift mask to form a pattern of metal wiring. The phase shift mask includes a substrate and a wiring light shielding portion (02) on the substrate (01). The wiring light shielding portion (02) includes a light shielding region (021) and a phase shift region (022). In a direction perpendicular to the extending direction of the wiring light shielding portion (02) a width of the light shielding region (021) is larger than a width of the pattern of the metal wiring formed by the wiring light shielding portion (02).Type: GrantFiled: November 1, 2018Date of Patent: June 14, 2022Assignees: BEIJING BOE DISPLAY TECHNOLOGY CO., LTD., BOE TECHNOLOGY GROUP CO., LTD.Inventors: Xiaoxiang Zhang, Mingxuan Liu, Huibin Guo, Wenqing Xu, Xiaolong Li, Zumou Wu, Yongzhi Song
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Patent number: 11287752Abstract: A lithographic apparatus comprising a projection system configured to project a patterned radiation beam to form an exposure area on a substrate, a cooling apparatus located in use above the substrate adjacent to the exposure area, the cooling apparatus being configured to remove heat from the substrate during use, a plasma vessel located below the cooling apparatus with its opening facing towards the cooling apparatus, and a gas supply for supplying gas to the plasma vessel and an aperture for receipt of a radiation beam. In use, supplied gas and a received radiation beam react to form a plasma within the plasma vessel that is directed towards a surface of the cooling apparatus which faces the opening of the plasma vessel.Type: GrantFiled: June 7, 2018Date of Patent: March 29, 2022Assignee: ASML Netherlands B.V.Inventors: Adrianus Hendrik Koevoets, Cornelis Adrianus De Meijere, Willem Michiel De Rapper, Sjoerd Nicolaas Lambertus Donders, Jan Groenewold, Alain Louis Claude Leroux, Maxim Aleksandrovich Nasalevich, Andrey Nikipelov, Johannes Adrianus Cornelis Maria Pijnenburg, Jacobus Cornelis Gerardus Van Der Sanden
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Patent number: 11244827Abstract: The present disclosure provides a method for manufacturing a semiconductor structure. The method includes forming a photo-sensitive layer on a first surface of a semiconductor substrate. The photo-sensitive layer has a top surface. The method also includes obtaining a first profile of the first surface of the semiconductor substrate, and obtaining a second profile of the top surface of the photo-sensitive layer. The method also includes calculating a vertical displacement profile of the semiconductor substrate according to the first profile and the second profile. An apparatus for manufacturing a semiconductor structure is also disclosed.Type: GrantFiled: June 19, 2019Date of Patent: February 8, 2022Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.Inventors: Yung-Yao Lee, Wen-Chih Wang
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Patent number: 11231657Abstract: A lithographic apparatus comprising a projection system configured to project a patterned radiation beam to form an exposure area on a substrate, a cooling apparatus located in use above the substrate adjacent to the exposure area, the cooling apparatus being configured to remove heat from the substrate during use, a plasma vessel located below the cooling apparatus with its opening facing towards the cooling apparatus, and a gas supply for supplying gas to the plasma vessel and an aperture for receipt of a radiation beam. In use, supplied gas and a received radiation beam react to form a plasma within the plasma vessel that is directed towards a surface of the cooling apparatus which faces the opening of the plasma vessel.Type: GrantFiled: June 7, 2018Date of Patent: January 25, 2022Assignee: ASML Netherlands B.V.Inventors: Adrianus Hendrik Koevoets, Cornelis Adrianus De Meijere, Willem Michiel De Rapper, Sjoerd Nicolaas Lambertus Donders, Jan Groenewold, Alain Louis Claude Leroux, Maxim Aleksandrovich Nasalevich, Andrey Nikipelov, Johannes Adrianus Cornelis Maria Pijnenburg, Jacobus Cornelis Gerardus Van Der Sanden
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Patent number: 11195293Abstract: An information processing device extracts an image of a marker from a photographed image, and obtains a position of a representative point of the marker in a three-dimensional space. Meanwhile, a position and an attitude corresponding to a time of photographing the image are estimated on the basis of an output value of a sensor included in a target object. A weight given to positional information of each marker is determined by using a target object model on the basis of the estimation, and positional information of the target object is calculated. Further, final positional information is obtained by synthesizing estimated positional information at a predetermined ratio, and the final positional information is output and fed back for a next estimation.Type: GrantFiled: July 13, 2018Date of Patent: December 7, 2021Assignee: Sony Interactive Entertainment Inc.Inventor: Masaki Uchida
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Patent number: 11181831Abstract: A method of manufacturing a semiconductor device includes forming a plurality of overlay molds on a semiconductor structure by developing a photoresist material layer of the semiconductor structure, the semiconductor structure including a first layer having a plurality of overlay marks, the plurality of overlay molds at least partially overlapping at least some of the plurality of overlay marks; and measuring one or more overlays by radiating a light having a wavelength band onto the semiconductor structure, each of the one or more overlays indicating an amount of consistency of the first layer and a second layer of the semiconductor structure, the wavelength band being set based on the plurality of overlay marks and the plurality of overlay molds, the second layer being between the first layer and the photoresist material layer.Type: GrantFiled: September 3, 2019Date of Patent: November 23, 2021Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Kyoung-hwan Lee, Young-ho Kwon, Souk Kim, Young-hoon Sohn, Yu-sin Yang
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Patent number: 11158509Abstract: A method for semiconductor manufacturing includes providing a substrate, forming a patterning layer over the substrate, and patterning the patterning layer to form a hole in the patterning layer. The method also includes applying a first directional etching to two inner sidewalls of the hole to expand the hole along a first direction and applying a second directional etching to another two inner sidewalls of the hole to expand the hole along a second direction that is different from the first direction.Type: GrantFiled: May 19, 2020Date of Patent: October 26, 2021Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Yu-Tien Shen, Chi-Cheng Hung, Chin-Hsiang Lin, Chien-Wei Wang, Ching-Yu Chang, Chih-Yuan Ting, Kuei-Shun Chen, Ru-Gun Liu, Wei-Liang Lin, Ya Hui Chang, Yuan-Hsiang Lung, Yen-Ming Chen, Yung-Sung Yen
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Patent number: 11150563Abstract: A technique of measuring a parameter of a patterning process is disclosed. In one arrangement, a target, formed by the patterning process, is illuminated. A sub-order diffraction component of radiation scattered from the target is detected and used to determine the parameter of the patterning process.Type: GrantFiled: December 10, 2019Date of Patent: October 19, 2021Assignee: ASML Netherlands B.V.Inventors: Sergei Sokolov, Sergey Tarabrin, Su-Ting Cheng, Armand Eugene Albert Koolen, Markus Franciscus Antonius Eurlings, Koenraad Remi André Maria Schreel
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Patent number: 11137684Abstract: A method of performing a lithography process includes receiving a lithography mask and performing overlay measurement. The lithography mask includes a substrate that contains a low thermal expansion material (LTEM); a reflective structure over a first side of the substrate; an absorber layer over the reflective structure and containing one or more first overlay marks; and a conductive layer over a second side of the substrate and containing one or more second overlay marks. The second side is opposite the first side. The overlay measurement includes using the one or more first overlay marks in an extreme ultraviolet (EUV) lithography process or using the one or more second overlay marks in a non-EUV lithography process.Type: GrantFiled: December 18, 2019Date of Patent: October 5, 2021Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Yun-Yue Lin, Hsin-Chang Lee, Chia-Jen Chen, Chih-Cheng Lin, Anthony Yen, Chin-Hsiang Lin
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Patent number: 11079684Abstract: A measurement apparatus and method for determining a substrate grid describing a deformation of a substrate prior to exposure of the substrate in a lithographic apparatus configured to fabricate one or more features on the substrate. Position data for a plurality of first features and/or a plurality of second features on the substrate is obtained. Asymmetry data for at least a feature of the plurality of first features and/or the plurality of second features is obtained. The substrate grid based on the position data and the asymmetry data is determined. The substrate grid and asymmetry data are passed to the lithographic apparatus for controlling at least part of an exposure process to fabricate one or more features on the substrate.Type: GrantFiled: December 21, 2018Date of Patent: August 3, 2021Assignee: ASML Netherlands B.V.Inventors: Franciscus Godefridus Casper Bijnen, Edo Maria Hulsebos, Henricus Johannes Lambertus Megens, Robert John Socha, Youping Zhang
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Patent number: 11043239Abstract: A laser beam is directed through a transmissive axicon telescope or a reflective axicon telescope such as in a magneto-optic Kerr effect metrology system. With the transmissive axicon telescope, a Gaussian beam profile is directed through a first axicon lens and a second axicon lens. The first axicon lens and second axicon lens transfer the Gaussian beam profile of the laser beam to a hollowed laser ring. The laser beam with a hollowed laser ring can be directed through a Schwarzschild reflective objective. With the reflective axicon telescope, the laser beam is directed through two conical mirrors that are fully reflective. One of the conical mirrors defines a central hole that the laser beam passes through.Type: GrantFiled: March 17, 2020Date of Patent: June 22, 2021Assignee: KLA CorporationInventors: Jun Wang, Yaolei Zheng, Chunxia Li, Changfei Yan, Lansheng Dong, Yang Zhou, Hai-Yang You, Haijing Peng, Jianou Shi, Rui Ni, Shankar Krishnan, David Y. Wang, Walter H. Johnson
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Patent number: 11022896Abstract: Corrections are calculated for use in controlling a lithographic apparatus. Using a metrology apparatus a performance parameter is measured at sampling locations across one or more substrates to which a lithographic process has previously been applied. A process model is fitted to the measured performance parameter, and an up-sampled estimate is provided for process-induced effects across the substrate. Corrections are calculated for use in controlling the lithographic apparatus, using an actuation model and based at least in part on the fitted process model. For locations where measurement data is available, this is added to the estimate to replace the process model values. Thus, calculation of actuation corrections is based on a modified estimate which is a combination of values estimated by the process model and partly on real measurement data.Type: GrantFiled: February 22, 2017Date of Patent: June 1, 2021Assignee: ASML Netherlands B.V.Inventors: Emil Peter Schmitt-Weaver, Amir Bin Ismail, Kaustuve Bhattacharyya, Paul Derwin
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Patent number: 11003100Abstract: In a beam irradiation apparatus in which a movable body holds an object, a mark detection system detects a first mark on the movable body while moving the movable body in a first direction and changing an irradiation position of a measurement beam in the first direction, the mark detection system detects a second mark while moving the movable body in the first direction and changing the irradiation position of the measurement beam in the first direction, a controller controls a position of the movable body in a second direction intersecting the first direction during a time period between the detection of the first mark and the detection of the second mark, and the controller controls the movement of the movable body to adjust a positional relation between the object on the movable body and a processing beam, based on results of the detection of the first and second marks.Type: GrantFiled: November 29, 2019Date of Patent: May 11, 2021Assignee: NIKON CORPORATIONInventor: Akihiro Ueda
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Patent number: 10994368Abstract: There is provided a wafer for examination that is a wafer for examination with which energy distribution in a region of a light condensing spot of a laser beam with which irradiation is carried out from the upper surface side of a wafer is checked, and is a wafer for examination in which a first metal layer and a second metal layer different in specific heat or a melting point are formed over an upper surface of a wafer. In an examination method of energy distribution, the energy distribution of the laser beam is checked based on a processing mark formed in the first and second metal layers of the wafer for examination.Type: GrantFiled: August 21, 2018Date of Patent: May 4, 2021Assignee: DISCO CORPORATIONInventor: Seiichi Sai
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Patent number: 10990022Abstract: A metrology system may include a controller coupled to a metrology tool. The controller may receive a metrology target design including at least a first feature formed by exposing a first exposure field on a sample with a lithography tool, and at least a second feature formed by exposing a second exposure field on the sample with the lithography tool, where the second exposure field overlaps the first exposure field at a location of a metrology target on the sample. The controller may further receive metrology data associated with the metrology target fabricated according to the metrology target design, determine one or more fabrication errors during fabrication of the metrology target based on the metrology data, and generate correctables to adjust one or more fabrication parameters of the lithography tool in one or more subsequent lithography steps based on the one or more fabrication errors.Type: GrantFiled: November 8, 2019Date of Patent: April 27, 2021Assignee: KLA CorporationInventors: Enna Leshinsky-Altshuller, Inna Tarshish-Shapir, Mark Ghinovker, Diana Shaphirov, Guy Ben Dov, Roie Volkovich, Chris Steely
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Patent number: 10991657Abstract: A method for fabricating a semiconductor device is provided. The method includes obtaining a pattern density of an integrated circuit (IC) design layout; adjusting a density of an alignment mark pattern of the IC design layout according to the pattern density; and patterning a material layer according to the IC design layout after adjusting the density of the alignment mark pattern.Type: GrantFiled: August 27, 2018Date of Patent: April 27, 2021Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Chiu-Hsiang Chen, Shih-Chun Huang, Yung-Sung Yen, Ru-Gun Liu