Abstract: The objects of the present invention are to provide a coloring composition that is less likely to remain on a pattern of other colors as residues and can inhibit occurrence of coating defects, a colored pattern, a color filter, a method of producing a color filter, a pattern forming method, a solid-state imaging device, and an image display device, each using the same. In order to achieve the above objects, the present invention provides a coloring composition containing a resin (A) having a dye structure, in which in a peak area of the total molecular weight distribution of the resin (A) measured by gel permeation chromatography, a proportion of a peak area of a component having a molecular weight of 20,000 or more is 10% or less.

Abstract: A negative-working lithographic printing plate precursor is used for making lithographic printing plates from infrared radiation imaging. The precursor comprises free radical chemistry and a specific infrared radiation absorber that is a cyanine dye and defined by Formula (1a) described in the disclosure. This particular infrared radiation absorber provides both IR sensitivity and print out after imaging.

Abstract: A pattern forming method, includes: (i) a step of forming a film from an actinic ray-sensitive or radiation-sensitive resin composition containing (P) a resin having (a1) a repeating unit represented by the following formula (I) or (II) as defined in the specification in an amount of 20 mol % or more based on all repeating units in the resin (P) and (B) a compound capable of generating an acid upon irradiation with an actinic ray or radiation; (ii) a step of exposing the film, so as to form an exposed film; and (iii) a step of developing the exposed film by using a developer containing an organic solvent to form a negative pattern.

Abstract: A method of forming an image having multiple phases is disclosed herein. The method includes forming exposed and unexposed areas, the exposed areas comprising a first polymer network exhibiting first and second phases that are chemically connected and have different refractive indices, the first phase being continuous, and the second phase comprising a plurality of structures dispersed within the first phase, and the unexposed areas comprising a second polymer network comprising third and fourth phases that are chemically connected and have different refractive indices, the third phase being continuous, and the fourth phase comprising a plurality of structures dispersed within the third phase. The first and second polymer networks are chemically connected, and morphology formed by the first and second phases is different than that formed by the third and fourth phases.

Abstract: There is provided a dry film resist sheet, including: a base film; a first dry film resist layer formed on the base film, the first dry film resist layer containing a binder polymer, a multi-functional monomer, and a photoinitiator; and a second dry film resist layer formed on the first dry film resist layer, the second dry film resist layer containing a binder polymer, a multi-functional monomer, a photoinitiator, and a thermal initiator.

Abstract: The present invention provides a composition for forming a bottom anti-reflective coating, and also provides a photoresist pattern formation method employing that composition. The composition gives a bottom anti-reflective coating used in a lithographic process for manufacturing semiconductor devices, and the coating can be developed with a developing solution for photoresist. The composition contains a solvent, a polymer having a condensed polycyclic aromatic group, and a compound having a maleimide derivative or a maleic anhydride derivative. The composition may further contain a photo acid generator or a crosslinking agent.

Abstract: There are disclosed sulfonic acid precursor compositions, as are methods of using these compositions in, for example, photolithography.

Abstract: A pattern forming method comprises (i) a step of forming a film by using an actinic ray-sensitive or radiation-sensitive resin composition containing: (A) a resin containing a repeating unit having a group capable of decomposing by the action of an acid to produce a polar group, (B) a compound capable of generating an acid upon irradiation with an actinic ray or radiation, and (C) a solvent, (ii) a step of exposing the film, and (iii) a step of developing the exposed film by using an organic solvent-containing developer to form a negative pattern, wherein the content of a repeating unit represented by the following formula (I) is less than 20 mol % based on all repeating units in the resin (A) and the resin (A) contains a repeating unit having a non-phenolic aromatic group other than the repeating unit represented by the specific formula.

Abstract: The invention pertains to an isocyanate-modified photosensitive polyimide. The photosensitive polyimide of the invention possesses excellent heat resistance, chemical resistance and flexibility, and can be used in a liquid photo resist composition or dry film photo resist composition, or used in a solder resist, coverlay film, or printed wiring board.

Abstract: A method of stabilizing a fluorine-containing acid amplifier.

Abstract: A positive-working lithographic printing plate precursor has an outermost imageable layer that is present at a dry coverage weight of at least 0.7 g/m2 and up to and including 1.6 g/m2 and comprises a primary polymeric binder comprising recurring units of a hydroxyaryl acetal or a hydroxyaryl ester, or recurring units of both a hydroxyaryl acetal and a hydroxyaryl ester. The outermost imageable layer also contains an alkali-soluble secondary vinyl polymer that is not a primary polymeric binder and a non-polymeric polyhydric phenol. These precursors comprise an infrared radiation absorber to make them sensitive and imageable using infrared radiation. After imaging, the precursors can be processed (developed) using an relatively low pH developer such as a silicate- or metasilicate-free developer.

Abstract: Disclosed are a photosensitive composition containing an aqueous dispersion and having excellent storage stability, and a photosensitive lithographic printing plate material using the photosensitive composition and being capable of being developed using water, which is advantageous not only in that the photosensitive lithographic printing plate material exhibits high sensitivity and high image quality as well as excellent storage stability, but also in that even when the printing plate material is repeatedly subjected to developing treatment using water, the generation of sludge derived from the photosensitive composition in the developer repeatedly used is suppressed, achieving excellent developing properties.

Abstract: Provided are N-acyl-?-lactam derivatives represented by the following general formula, from which a photoresist composition capable of controlling an acid diffusion length to be short is obtained; a polymer obtained by polymerizing the N-acyl-?-lactam derivative represented by the following general formula as one of starting materials; and a photoresist composition containing the polymer, where the structural variables are as defined herein.

Abstract: A lithographic printing plate precursor includes: a support; and an image-recording layer containing (A) a polymerization initiator, (B) a sensitizing dye and (C) a polymerizable compound, and the image-recording layer or an undercoat layer which is optionally provided between the support and the image-recording layer comprises (D) a polymer compound comprising (a1) a repeating unit having a side chain having a structure represented by the following formula (a1-1) and (a2) a repeating unit having a side chain having at least one structure of the formulae (a2-1), (a2-2), (a2-3), (a2-4), (a2-5) and (a2-6) as defined herein.

Abstract: The present invention relates to a polymer compound including a dye, and a curable resin composition including the same. The polymer compound including the dye according to the present invention may exhibit characteristics such as excellent heat resistance, solubility, coating uniformity, chemical resistance and the like by introducing a single molecule type dye into a side chain of a polymer binder to be modified into a polymer form and applying the modified polymer to a curable composition.

Abstract: A photosensitive resin composition which is excellent in resolution, low in cost, and usable in a wide range of structures of polymer precursors each of which is reacted into a final product by a basic substance or by heating in the presence of a basic substance. The photosensitive resin composition includes a base generator which has a specific structure and generates a base by exposure to electromagnetic radiation and heating, and a polymer precursor which is reacted into a final product by the base generator and by a basic substance or by heating in the presence of a basic substance.

Abstract: A positive-working lithographic printing plate precursor is disclosed which comprises on a support having a hydrophilic surface or which is provided with a hydrophilic layer a heat and/or light-sensitive coating including an infrared absorbing agent, a compound including a blocked isocyanate group and an alkali soluble resin comprising a monomeric unit including a Lewis base moiety.

Abstract: A radiation-sensitive resin composition includes a compound represented by a formula (1), and a polymer that includes a structural unit having an acid-labile group. R1 and R4 each independently represent a hydrogen atom, or the like. R2 and R3 each independently represent a hydrogen atom or the like. X1 and X2 each independently represent a hydrogen atom, or the like, or X1 and X2 taken together represent —S—, —O—, —SO2—, or the like. A represents an ethanediyl group, wherein at least one hydrogen atom included in X1, X2 and A is substituted by —Y—SO3?M+. Y represents an alkanediyl group having 1 to 10 carbon atoms, or the like. M+ represents a monovalent onium cation. In the case where —Y—SO3?M+ is present in a plurality of number, a plurality of Ys are each identical or different and a plurality of M+s are each identical or different.

Abstract: The present disclosure provides a sensitive material. The sensitive material includes a polymer that turns soluble to a base solution in response to reaction with acid; a plurality of photo-base generators (PBGs) that decompose to form base in response to radiation energy; and a thermal sensitive component that generates acid in response to thermal energy.

Abstract: The present invention relates to a polyimide photosensitive resin composition that is capable of being developed by an alkali aqueous solution, and a dry film that is produced by the same, and more particularly to a photosensitive resin composition which comprises a) a polyamic acid, b) two or more (meth)acrylate—based compounds that include one or more double bonds between carbons, c) a photopolymerization initiator, d) a phosphorus—based flame retardant, and e) an organic solvent, and a dry film that is produced by the same.

Abstract: A positive-working multi-layer lithographic printing plate precursor has an inner imageable layer disposed over a substrate. This inner imageable layer comprises one or more first polymeric binders that are present in a total amount of at least 50 weight % and up to and including 97 weight %, based on total inner imageable layer dry weight. The precursor also has an ink-receptive outer imageable layer disposed over the inner imageable layer and this ink-receptive outer imageable layer comprises one or more second polymeric binders that are different than the first polymeric binder. Each of the one or more first polymeric binders has a weight average molecular weight of at least 200,000 and can also have a polydispersity of at least 4.

Abstract: The invention includes a novel light-activated polymerizable composition, wherein reversible crosslinks may be converted into irreversible crosslinks using a fully controllable physical and/or chemical process. The invention further includes methods of photofixing a light sensitive material or patterning an article comprising a light sensitive material.

Abstract: A flexographic printing plate precursor can be imaged and developed to provide a flexographic relief image. This flexographic printing plate precursor includes a radiation curable layer in which a flexographic relief image can be formed. It also includes a transparent release layer disposed on the radiation sensitive layer, which release layer consists essentially of a miscible mixture of a polyamide in an amount of at least 20 and up to and including 80 weight % and a natural or synthetic rubber latex in an amount of at least 20 and up to and including 80 weight %. The transparent release layer has a peel force in relation to an imaged film comprising a mask image of at least 50 and up to and including 200 g/inch. This precursor can be used in optical contact with the imaged film to form a relief image using curing radiation through the mask image.

Abstract: Lithographic printing plate precursors can have an imageable layer that includes a polymeric binder having an acid number of at least 30 mg KOH/g of polymer to and including 150 mg KOH/g of polymer, at least 3 weight % of recurring units derived from one or more N-alkoxymethyl (alkyl)acrylamides or alkoxymethyl (alkyl)acrylates, at least 2 weight % of recurring units having pendant 1H-tetrazole groups, and at least 10 weight % of recurring units having pendant cyano groups. The use of such polymeric binders provides good bakeability and chemical solvent resistance, especially for positive-working precursors.

Abstract: The present invention provides a photosensitive resin composition comprising 100 parts by mass of a polyurethane prepolymer having an ethylenically unsaturated group, 10 to 150 parts by mass of an ethylenically unsaturated compound, and 0.01 to 10 parts by mass of a photopolymerization initiator, wherein the ethylenically unsaturated compound comprises 0.1 to 10 parts by mass of a polyfunctional ethylenically unsaturated compound having 6 or more (meth)acryloyl groups in a molecule thereof with respect to 100 parts by mass of the polyurethane prepolymer.

Abstract: A positive type resist composition for use in liquid immersion exposure comprises: (A) a resin having a monocyclic or polycyclic cycloaliphatic hydrocarbon structure, the resin increasing its solubility in an alkali developer by an action of acid; (B) a compound generating acid upon irradiation with one of an actinic ray and a radiation; (C) an alkali soluble compound having an alkyl group of 5 or more carbon atoms; and (D) a solvent.

Abstract: An actinic ray- or radiation-sensitive resin composition according to the present invention comprises a sulfonic acid-generating compound that is decomposed by an action of an acid to generate a sulfonic acid having a volume of 240 ?3 or more and a compound that generates the acid when exposed to actinic rays or radiation.

Abstract: Disclosed is a photosensitive novolac resin including a structural unit represented by the following Chemical Formula 1 and structural unit represented by the following Chemical Formula 2, wherein R11, R12, R13, and R14 in Chemical Formulae 1 and 2 are the same as defined in the detailed description, a positive photosensitive resin composition including the same, a photosensitive resin film fabricated using the same, and a semiconductor device including the photosensitive resin composition.

Abstract: Disclosed is an organic antireflective film composition which includes a monomer containing two or more thiol groups and a monomer containing two or more vinyl groups, as crosslinking agents. When the organic antireflective film composition is used, an antireflective film formed from the composition can be rapidly etched in an ultrafine pattern forming process, and the curing rate can be increased, while the etching rate is increased, without using an acid generator and a curing agent or by using the agents only in small amounts.

Abstract: Disclosed are a positive photosensitive resin composition including (A) an alkali soluble resin including a polybenzoxazole precursor, a polyimide precursor, or a combination thereof, (B) a photosensitive diazoquinone compound, (C) a compound represented by the following Chemical Formula 1, and (D) a solvent, and a display device and an organic light emitting device using the same. The Chemical Formula 1 is the same as defined in the detailed description.

Abstract: The present invention provides a compound represented by the formula (C1): wherein Rc2 represents a C6-C10 aromatic hydrocarbon group having at least one nitro group and Rc1 represents a group represented by the formula (1): wherein Rc4 represents a hydrogen atom etc., Rc5 represents a C1-C30 divalent hydrocarbon group, and Rc3 represents a group represented by the formula (3-1), (3-2) or (3-3): wherein Rc6, Rc7, Rc8, Rc9, Rc10, Rc11, Rc12, Rc13 and Rc14 each independently represent a C1-C30 hydrocarbon group, and a photoresist composition comprising a resin, an acid generator and the compound represented by the formula (C1).

Abstract: A compound synthesis method includes bonding a first compound to a substrate to form a first film. A second film is formed on the first film using an acid-transfer composition including (A) a polymer that includes a structural unit shown by a following formula (1) and a structural unit shown by a following formula (2), (B) a photoacid generator shown by a following formula (3), and (C) a sensitizer shown by a following formula (4). The second film is exposed to remove the protecting group from the first compound under an exposed area of the second film. An acid generated in the exposed area of the second film is transferred to the first film. The second film after being exposed is removed. A second compound is bonded to the first compound from which the protecting group has been removed.

Abstract: Disclosed is a positive photosensitive resin composition that includes (A) an alkali soluble resin prepared by a phosphorous-containing diamine represented by the following Chemical Formula 1, (B) a photosensitive diazoquinone compound, and (C) a solvent. A photosensitive resin film prepared using the same and a semiconductor device including the photosensitive resin film are also disclosed. In Chemical Formula 1, each substituent is the same as defined in the detailed description.

Abstract: Disclosed are a pigment dispersion composition including a pyridone azo-based compound including a monomer represented by the following Chemical Formula 1, a polymer including a repeating unit represented by the following Chemical Formula 2, or a combination thereof, wherein each substituents of Chemical Formulae 1 and 2 are the same as defined the detailed description, (B) a pigment, (C) a binder resin, (D) a dispersing agent, and (E) a solvent; a photosensitive resin composition including the same; and a color filter including the same.

Abstract: The present invention provides a composition for forming a bottom anti-reflective coating, and also provides a photoresist pattern formation method employing that composition. The composition gives a bottom anti-reflective coating used in a lithographic process for manufacturing semiconductor devices, and the coating can be developed with a developing solution for photoresist. The composition contains a solvent, a polymer having a condensed polycyclic aromatic group, and a compound having a maleimide derivative or a maleic anhydride derivative. The composition may further contain a photo acid generator or a crosslinking agent.

Abstract: A chemically amplified negative resist composition is provided comprising (A) a resin having a crosslinking group, (B) a crosslinker, (C) a photoacid generator capable of generating an acid upon exposure to light of wavelength 190-500 nm, (D) a solvent, and (E) an isocyanuric acid. The resist composition overcomes the stripping problem that the film is stripped from metal wirings of Cu or Al, electrodes, and SiN substrates.

Abstract: A photosensitive resin composition including: (a) a polyamide acid; (b) a compound (b1) having 4 or more of a methylol group, a methoxymethyl group and the both thereof, or a compound (b2) represented by the following formula (2); and (c) a photopolymerization initiator.

Abstract: Disclosed are a positive photosensitive resin composition that includes (A) a polybenzoxazole precursor including a first polybenzoxazole precursor including a repeating unit represented by the following Chemical Formula 1 and a repeating unit represented by the following Chemical Formula 2, and having a thermally polymerizable functional group at at least one of the terminal end; (B) a dissolution controlling agent including a novolac resin including a repeating unit represented by the following Chemical Formula 4; (C) a photosensitive diazoquinone compound; (D) a silane compound; (E) an acid generator; and (F) a solvent, a photosensitive resin film prepared using the same, and a semiconductor device including the photosensitive resin film.

Abstract: A silicon compound according to the present invention is represented by the general formula (1). This silicon compound can be easily synthesized by using a hydrolysable silicon compound such as alkoxysilane and has, in its molecule, a hydrolysable group e.g. alkoxy group and a photoacid generating group capable of being dissociated to generate an acid by irradiation with a high-energy ray. R1nAmSiB4-(n+m)??(1) where R1 is each independently a hydrogen atom, a C1-C20 straight or C3-C20 branched or cyclic hydrocarbon group; a carbon atom of the hydrocarbon group may be replaced by an oxygen atom; and the hydrocarbon group may contain a fluorine atom; A is an acid decomposable group; B is a hydrolysable group; n is an integer of 0 to 2; m is an integer of 1 to 3; and n+m is an integer of 1 to 3.

Abstract: The present invention provides a photoresist composition comprising a compound represented by formula (I): wherein R1, R2, R4, R5, R7, R8, R10 and R11 independently represent a hydrogen atom, a C1-C20 aliphatic hydrocarbon group, or the like, R3; R6, R9 and R12 independently represent a group of formula (II): , and a salt represented by the formula (B1).

Abstract: A resist composition including a base component (A) which exhibits changed solubility in a developing solution under action of acid and an acid-generator component (B) which generates acid upon exposure, the base component (A) containing a polymeric compound (A1) having a structural unit (a5) represented by general formula (a5-0) shown below (R1 represents a sulfur atom or an oxygen atom; R2 represents a single bond or a divalent linking group; and Y represents an aromatic hydrocarbon group or an aliphatic hydrocarbon group having a polycyclic group, provided that the aromatic hydrocarbon group or the aliphatic hydrocarbon may have a carbon atom or a hydrogen atom thereof substituted with a substituent.

Abstract: A method for preparing a photosensitive resin composition including at least (A) an alkali-soluble resin, (B) a photoacid generator, (C) a surfactant and (D) an organic solvent includes a step of obtaining a dispersion liquid which contains (C) the surfactant and (D) the organic solvent, and does not contain (A) the alkali-soluble resin and (B) the photoacid generator, and a step of adding (A) the alkali-soluble resin and (B) the photoacid generator to the dispersion liquid.

Abstract: A negative-working lithographic printing plate precursor is designed for improved printout or contrast between exposed and non-exposed regions in its imageable layer. The imaged precursor can be developed on-press. The improvement in printout is achieved by using a combination of at least two infrared radiation absorbing cyanine dyes. At least one of these cyanine dyes comprises a methine chain substituent that comprises a group represented by Structure (I): wherein Q1 and Q2 are hydrogen atoms or the same or different monovalent substituents, or Q1 and Q2 together provide carbon or heteroatoms to form a substituted or unsubstituted unsaturated ring. At least one other infrared radiation absorbing cyanine dyes does not comprise a group represented by Structure (I).

Abstract: Lithographic printing plate precursors can have an imageable layer that includes a polymeric binder having an acid number of at least 30 mg KOH/g of polymer to and including 150 mg KOH/g of polymer, at least 3 weight % of recurring units derived from one or more N-alkoxymethyl (alkyl)acrylamides or alkoxymethyl (alkyl)acrylates, at least 2 weight % of recurring units having pendant 1H-tetrazole groups, and at least 10 weight % of recurring units having pendant cyano groups. The use of such polymeric binders provides good bakeability and chemical solvent resistance, especially for positive-working precursors.

Abstract: The invention pertains to an isocyanate-modified photosensitive polyimide. The photosensitive polyimide of the invention possesses excellent heat resistance, chemical resistance and flexibility, and can be used in a liquid photo resist composition or dry film photo resist composition, or used in a solder resist, coverlay film, or printed wiring board.

Abstract: A positive resist composition comprising a polymer having carboxyl groups substituted with an acid labile group having formula (1) exhibits a high contrast of alkaline dissolution rate before and after exposure, a high resolution, a reduced acid diffusion rate, and forms a pattern with good profile, minimal edge roughness, and etch resistance. In formula (1), R1 and R2 each are alkyl, aryl, or alkenyl, which may contain oxygen or sulfur, R3 is fluorine or trifluoromethyl, and m is an integer of 1 to 5.

Abstract: Disclosed is a negative chemical amplification resist composition including (A) a polymer compound having a repeating unit (P) represented by the following formula (I) which is stable in acids and alkalis, and a repeating unit (Q) having a phenolic hydroxyl group; (B) a compound capable of generating an acid when irradiated with actinic rays or a radiation; and (C) a cross-linking agent: in which, in the formula (I), R1 represents a hydrogen atom or a methyl group; L1 represents an oxygen atom or —NH—; L2 represents a single bond or an alkylene group; and A represents a polycyclic hydrocarbon group.

Abstract: Disclosed is a photosensitive resin composition which does not contain any halogenated compound or any antimony compound that has a high risk of putting a load on the environment, which exerts good flame retardancy after being cured, and which particularly meets the recent exacting requirements with respect to bending resistance and insulation reliability. Specifically disclosed is a photosensitive resin composition comprising: (A) a (meth)acrylate compound represented by the general formula (1); (B) a polyimide precursor; and (C) a photopolymerization initiator [in the formula, R1 represents a hydrogen atom or a methyl group; R2 represents a hydrogen atom or a univalent organic group; n and m independently represent an integer of 1 to 5; p represents an integer of 0 to 6; q and r independently represent an integer of 0 to 4; and s represent an integer of 0 to 6, provided that the sum of p, q, r and s is 6, and the sum total of p and s may range from 3 to 6 and is preferably 6].

Abstract: Provided are a photosensitive resin composition which is excellent in a moisture and heat resistance and provides a cured product thereof with a high elastic modulus at high temperature and which is excellent as well in a hollow structure holding property and a photosensitive film prepared by using the same, a forming method for a rib pattern, a hollow structure and a forming method for the same and an electronic component. In an electronic component having a hollow structure, a photosensitive resin composition is used as a rib material or a cover material for forming the hollow structure described above, and it is characterized by using a photosensitive resin composition containing (A) a photopolymerizable compound having at least one ethylenically unsaturated group and (B) a photopolymerization initiator and a photosensitive film obtained from the above photosensitive resin composition.

Abstract: The pattern forming method of the invention includes (i) forming a film using an actinic ray-sensitive or radiation-sensitive resin composition containing a resin (P) having a repeating unit (a) represented by the following general formula (I), a compound (B) capable of generating an organic acid upon irradiation with actinic rays or radiation, and a nitrogen-containing organic compound (NA) having a group capable of leaving by the action of an acid, (ii) exposing the film, and (iii) developing the film after the exposure using a developer including an organic solvent to form a negative type pattern, in the general formula (I), R0 represents a hydrogen atom or a methyl group, and each of R1, R2, and R3 independently represents a linear or branched alkyl group.