Radiation Sensitive Composition Comprising Ethylenically Unsaturated Compound Patents (Class 430/281.1)
  • Patent number: 11124477
    Abstract: A novel sulfonium compound has formula (A). A positive resist composition comprising a polymer and a quencher containing the sulfonium compound is improved in resolution and LER during pattern formation and has storage stability. In formula (A), R1, R2, R3, and R4 are independently a C1-C20 monovalent hydrocarbon group, p is an integer of 0-5, q is an integer of 0-5, and r is an integer of 0-4.
    Type: Grant
    Filed: September 4, 2019
    Date of Patent: September 21, 2021
    Assignee: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Naoya Inoue, Masaki Ohashi, Daisuke Domon, Keiichi Masunaga, Masaaki Kotake
  • Patent number: 11069730
    Abstract: The present technology relates to a solid-state imaging apparatus capable of suppressing occurrence of color mixing, a method for manufacturing the solid-state imaging apparatus, and an electronic device. The solid-state imaging apparatus includes a plurality of pixels arranged in a pixel region. Each of the pixels has: a first optical filter layer disposed on a photoelectric conversion unit; a second optical filter layer disposed on the first optical filter layer; and a separation wall separating at least a part of the first optical filter layer for each of the pixels. Either the first optical filter layer or the second optical filter layer in at least one of the pixels is formed by an infrared cut filter, while the other is formed by a color filter. The present technology can be applied to a CMOS image sensor including a visible light pixel.
    Type: Grant
    Filed: August 31, 2017
    Date of Patent: July 20, 2021
    Assignee: Sony Semiconductor Solutions Corporation
    Inventors: Sintaro Nakajiki, Yukihiro Sayama
  • Patent number: 11054743
    Abstract: This invention discloses a fluorene polyfunctional photoinitiator as represented by general formula (I), a photosensitive resin composition containing the same, the preparation of the same, and uses of the two. This compound has the advantages of simple synthesis, low cost, and good solubility, and has good application effects in photocurable compositions. Compared with conventional small molecule photoinitiators, it is not only excellent in photoinitiation activity, but also has the advantages such as low mobility, low odor, and yellowing resistance. The composition has high photosensitivity and good developability, high resolution, and excellent adaptation to a substrate, and is very suitable for producing a black matrix having high light-shielding property, a high-precision and high quality color filter and a liquid crystal display device, and can also be used in optical spacers and ribs, photoresist, wet film, dry film and so on.
    Type: Grant
    Filed: September 28, 2016
    Date of Patent: July 6, 2021
    Assignees: CHANGZHOU TRONLY ADVANCED ELECTRONIC MATERIALS CO., LTD., CHANGZHOU TRONLY NEW ELECTRONIC MATERIALS CO., LTD.
    Inventor: Xiaochun Qian
  • Patent number: 11042094
    Abstract: An object of the present invention is to provide a treatment liquid for patterning a resist film and a pattern forming method, each of which can simultaneously suppress the occurrence of pattern collapse in a resist L/S pattern and the occurrence of omission failure in a resist C/H pattern. The treatment liquid of the present invention is a treatment liquid for patterning a resist film, which is used for subjecting a resist film obtained from an actinic ray-sensitive or radiation-sensitive resin composition to at least one of development or washing, and contains an organic solvent, in which the treatment liquid contains a first organic solvent having a relative dielectric constant of 4.0 or less and a second organic solvent having a relative dielectric constant of 6.0 or more.
    Type: Grant
    Filed: March 28, 2018
    Date of Patent: June 22, 2021
    Assignee: FUJIFILM Corporation
    Inventors: Shuji Hirano, Hideaki Tsubaki, Toru Tsuchihashi, Wataru Nihashi, Kei Yamamoto
  • Patent number: 11036135
    Abstract: Provided are: a curable composition having excellent photolithographic properties and resin elution properties; a cured product of the curable composition; and a curing method of the curable composition. The curable composition is characterized by including: (A) at least one selected from the group consisting of a water-soluble polyfunctional (meth)acrylates and water-soluble polyfunctional (meth)acrylamides; and (B) a photosensitive group-containing water-soluble polymer. The water-soluble polyfunctional (meth)acrylates are preferably compounds represented by Formula (I) below, and the water-soluble polyfunctional (meth)acrylamides are preferably compounds represented by Formula (II) below.
    Type: Grant
    Filed: November 21, 2017
    Date of Patent: June 15, 2021
    Assignee: ADEKA CORPORATION
    Inventors: Kenji Hara, Masatomi Irisawa
  • Patent number: 11016385
    Abstract: The disclosure provides a photosensitive adhesive composition including 10 parts by weight to 90 parts by weight of a monomer having a vinyl ether functional group, 10 parts by weight to 90 parts by weight of a tertiary amine polymer, and 0.5 parts by weight to 10 parts by weight of a photoacid initiator. The weight-average molecular weight of the tertiary amine polymer is between 2000 and 20000. The disclosure also provides a photosensitive conductive adhesive composition and an electronic device containing the photosensitive conductive adhesive composition.
    Type: Grant
    Filed: December 19, 2018
    Date of Patent: May 25, 2021
    Assignee: Industrial Technology Research Institute
    Inventors: Yi-Chi Yang, Shou-Yi Ho, Kuo-Chan Chiou
  • Patent number: 11009829
    Abstract: The disclosure belongs to the technical field of photopolymer materials, and more particularly relates to a dual image storage material as well as a preparation method and application thereof. The dual image storage material is obtained by selective photoreaction of 1 to 50 parts by weight of an organic fluorescent material, 7 to 50 parts by weight of liquid crystal, 0.2 to 10 parts by weight of a photoinitiator and 33 to 67 parts by weight of photopolymerizable monomers. The obtained dual image storage material can present a high-brightness holographic pattern under sunlight and a fluorescent pattern under ultraviolet light in the same spatial position. The presented holographic and fluorescent patterns may be the same or different. The obtained dual image storage material can be used in the field of optical anti-counterfeiting, optical information storage, displays or the like.
    Type: Grant
    Filed: July 12, 2019
    Date of Patent: May 18, 2021
    Assignee: HUAZHONG UNIVERSITY OF SCIENCE AND TECHNOLOGY
    Inventors: Haiyan Peng, Ye Zhao, Xiaolin Xie, Xingping Zhou, Xiaoyu Zhao
  • Patent number: 10990006
    Abstract: A photosensitive composition including: a plurality of quantum dots, wherein the quantum dot includes an organic ligand bound to a surface of the quantum dot; a photoinitiator; a binder including a carboxylic acid group; a photopolymerizable monomer having a carbon-carbon double bond; and a solvent, wherein the photoinitiator includes a first photoinitiator including an oxime compound and a second photoinitiator including at least one selected from a phosphine oxide compound and an amino ketone compound.
    Type: Grant
    Filed: December 12, 2016
    Date of Patent: April 27, 2021
    Assignees: SAMSUNG ELECTRONICS CO., LTD., SAMSUNG SDI CO., LTD., SAMSUNG DISPLAY CO., LTD.
    Inventors: Shang Hyeun Park, Hojeong Paek, Jonggi Kim, Nayoun Won, Shin Ae Jun
  • Patent number: 10962884
    Abstract: An object of the present invention is to provide a treatment liquid for patterning a resist film and a pattern forming method, each of which can simultaneously suppress the occurrence of pattern collapse in a resist L/S pattern and the occurrence of omission failure in a resist C/H pattern. The treatment liquid of the present invention is a treatment liquid for patterning a resist film, which is used for subjecting a resist film obtained from an actinic ray-sensitive or radiation-sensitive resin composition to at least one of development or washing, and contains an organic solvent, in which the treatment liquid contains a first organic solvent having an SP value of 16.3 MPa1/2 or less and a second organic solvent having an SP value of 17.1 MPa1/2 or more.
    Type: Grant
    Filed: March 28, 2018
    Date of Patent: March 30, 2021
    Assignee: FUJIFILM Corporation
    Inventors: Hideaki Tsubaki, Toru Tsuchihashi, Wataru Nihashi, Kei Yamamoto
  • Patent number: 10921710
    Abstract: A polymer comprising units having a highly fused homoadamantane skeleton at side chain end bonded to the polymer backbone via a linking group has an appropriate solvent solubility and is capable of suppressing acid diffusion. A resist composition comprising the polymer and a specific photoacid generator exhibits a good DOF margin, CD uniformity, and a minimal CD change during PPD, and is quite effective in precise micropatterning.
    Type: Grant
    Filed: July 27, 2018
    Date of Patent: February 16, 2021
    Assignee: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Teppei Adachi, Ryosuke Taniguchi, Kazuhiro Katayama
  • Patent number: 10921708
    Abstract: Provided are a radiation-sensitive resin composition having good sensitivity and excellent temporal stability of the sensitivity, a cured film, a pattern forming method, a solid-state imaging device, and an image display device. The radiation-sensitive resin composition includes a resin, a polymerizable compound having an ethylenically unsaturated bond, a photopolymerization initiator, an organic solvent, and water, in which the photopolymerization initiator includes an oxime ester compound having at least one group selected from a branched alkyl group and a cyclic alkyl group, and the content of water is 0.1% to 2% by mass with respect to the mass of the radiation-sensitive resin composition.
    Type: Grant
    Filed: May 25, 2018
    Date of Patent: February 16, 2021
    Assignee: FUJIFILM Corporation
    Inventors: Yuki Nara, Kaoru Aoyagi
  • Patent number: 10908502
    Abstract: A resist composition including a resin component having a structural unit derived from a compound represented by formula (a0-1), in which W represents a polymerizable group-containing group; Ra01 represents an alkyl group or an aromatic heterocyclic group containing an oxygen atom or a sulfur atom; in the case where Ra01 is an aromatic heterocyclic group containing an oxygen atom or a sulfur atom, Ra02 is a group which forms an aliphatic cyclic group containing an electron-withdrawing group, together with the tertiary carbon atom (*C) to which Ra01 is bonded; and when Ra01 is an alkyl group, Ra02 is a group in which an aliphatic cyclic group containing an electron-withdrawing group forms a condensed ring together with an aromatic heterocyclic group containing an oxygen atom or a sulfur atom.
    Type: Grant
    Filed: October 1, 2018
    Date of Patent: February 2, 2021
    Assignee: Tokyo Ohka Kogyo Co., Ltd.
    Inventors: Masatoshi Arai, Takuya Ikeda, Koshi Onishi
  • Patent number: 10859914
    Abstract: A method for producing an electronic device includes the pattern forming method, and an actinic ray-sensitive or radiation-sensitive resin composition for organic solvent development. Specifically, provided is a pattern forming method, including a film forming step of forming a film by an actinic ray-sensitive or radiation-sensitive resin composition, an exposure step of irradiating the film, and a development step of developing the film using a developer containing an organic solvent, in which the composition contains a resin containing a repeating unit having an Si atom and a repeating unit having an acid-decomposable group and a compound capable of generating an acid upon irradiation with actinic rays or radiation, the content of Si atoms in the resin is 1.0 to 30 mass %, and the content of the resin in the total solid content of the composition is 20 mass % or more.
    Type: Grant
    Filed: July 24, 2017
    Date of Patent: December 8, 2020
    Assignee: FUJIFILM Corporation
    Inventors: Naoya Hatakeyama, Akiyoshi Goto, Michihiro Shirakawa, Keita Kato, Keiyu Ou
  • Patent number: 10781276
    Abstract: An object of the present invention is to provide a polymer used for a resist composition having high absorption efficiency for a particle beam or an electromagnetic wave, and excellence in sensitivity, resolution and pattern performance characteristics, and provide a resist composition containing the polymer and a method of manufacturing a device using thereof. The polymer comprises: a unit A; and a unit B, wherein the unit A has an onium salt structure and generates a first radical by irradiation with a particle beam or an electromagnetic wave, the unit B has a radical generating structure containing at least one multiple bond which is between a carbon atom and a carbon atom or between a carbon atom and a heteroatom, and generates a second radical by irradiation with a particle beam or an electromagnetic wave, and the multiple bond is not one contained in a benzenoid aromatic.
    Type: Grant
    Filed: September 29, 2016
    Date of Patent: September 22, 2020
    Assignee: TOYO GOSEI CO., LTD.
    Inventors: Satoshi Enomoto, Takumi Yoshino
  • Patent number: 10759890
    Abstract: Provided are: a curable composition that has excellent flexibility and shows excellent adhesion to both a plastic substrate and a conductor layer; a coating film of the curable composition; and a printed circuit board comprising a pattern-cured coating film obtained from the coating film. The present invention relates to: a curable composition for a printed circuit board, which is characterized by comprising (A) a block copolymer, (B) a hydroxyl group-containing (meth)acrylate compound and (C) a photopolymerization initiator; a coating film obtained by photo-curing the curable composition; and a printed circuit board comprising a resist pattern formed from the coating film.
    Type: Grant
    Filed: September 30, 2014
    Date of Patent: September 1, 2020
    Assignee: TAIYO INK MFG. CO., LTD.
    Inventors: Masayuki Shimura, Yoshiyuki Furuta, Masao Yumoto
  • Patent number: 10754064
    Abstract: Problem to Be Solved: to provide a chromophore having a far superior nonlinear optical activity to conventional chromophores and to provide a nonlinear optical element comprising said chromophore. Solution: a chromophore comprising a donor structure D, a ?-conjugated bridge structure B, and an acceptor structure A, the donor structure D comprising an aryl group substituted with a substituted oxy group; and a nonlinear optical element comprising said chromophore.
    Type: Grant
    Filed: April 3, 2018
    Date of Patent: August 25, 2020
    Assignees: NATIONAL INSTITUTE OF INFORMATION AND COMMUNICATIONS TECHNOLOGY, SUMITOMO ELECTRIC INDUSTRIES, LTD., KYUSHU UNIVERSITY, NATIONAL UNIVERSITY CORPORATION
    Inventors: Akira Otomo, Isao Aoki, Hideki Miki, Hidehisa Tazawa, Shiyoshi Yokoyama
  • Patent number: 10731103
    Abstract: An oleaginous nanoparticle dispersion of nanoparticles having a core of an organic base material immobilized within a surfactant layer, the use thereof as a low ash, or ash-free source of TBN in lubricating oil compositions, and lubricating oil compositions formulated with such oleaginous nanoparticle dispersions.
    Type: Grant
    Filed: December 11, 2017
    Date of Patent: August 4, 2020
    Assignee: Infineum International Limited
    Inventors: Jacob Emert, Rachel Tundel, Peter Wright, Sandip Agarwal, Xinhua Li, Joseph McLellan, Patrick Reust
  • Patent number: 10725379
    Abstract: A resin composition including the following components (a) and (b). (a) A polyimide precursor having a structural unit represented by the following general formula (1); and (b) a compound represented by the following general formula (2): wherein in the formula R1 is a tetravalent organic group, R2 is a divalent organic group and R3 and R4 are independently a hydrogen atom, an alkyl group, a cycloalkyl group or a monovalent organic group having a carbon-carbon unsaturated double bond.
    Type: Grant
    Filed: December 13, 2013
    Date of Patent: July 28, 2020
    Assignee: Hitachi Chemical DuPont MicroSystems, Ltd.
    Inventors: Keishi Ono, Tetsuya Enomoto, Masayuki Ohe, Keiko Suzuki, Kazuya Soejima, Etsuharu Suzuki
  • Patent number: 10726966
    Abstract: Disclosed is a method of forming a conductive polymer thin film pattern, including (a) Coating substrate with solution including PEDOT:PSS (poly(3,4-ethylenedioxythiophene):poly(styrene sulfonate)) to form coating layer including solution on substrate, (b) irradiating a predetermined portion of the coating layer with light, thus manufacturing a pre-patterned substrate including PEDOT:PSS patterned on the predetermined portion and the coating layer other than the predetermined portion, and (c) removing the coating layer from the pre-patterned substrate, thus manufacturing a conductive polymer thin film having a PEDOT:PSS pattern.
    Type: Grant
    Filed: November 1, 2018
    Date of Patent: July 28, 2020
    Assignee: Korea Institute of Industrial Technology
    Inventors: Changhun Yun, Hyeck Go
  • Patent number: 10700387
    Abstract: A carboxymethyl cellulose is provided with a polydispersity index of 10 or more and a weight average molecular weight of 2,000,000 or more in a negative electrode mix slurry. Accordingly, phase stability of the negative electrode mix slurry is improved, achieving improved adhesiveness and low resistance of a negative electrode manufactured therefrom.
    Type: Grant
    Filed: November 14, 2017
    Date of Patent: June 30, 2020
    Assignee: LG CHEM, LTD.
    Inventors: Kwang-Ho Jeong, Ye-Cheol Rho, Jin-Sook Ryu, Je-Young Kim, Jung-Woo Yoo
  • Patent number: 10684729
    Abstract: The composition contains a compound represented by Formula 1, a binder polymer, a photopolymerization initiator, and a monomer having a carboxy group, in which the content of the compound represented by Formula 1 is 5% by mass or more and less than 50% by mass with respect to the total mass of monomer components, and in Formula 1, Q1 and Q2 each represent a (meth)acryloyloxy group, and R1 represents a divalent linking group having a chain-like structure.
    Type: Grant
    Filed: June 15, 2017
    Date of Patent: June 16, 2020
    Assignee: FUJIFILM Corporation
    Inventors: Takashi Aridomi, Kentaro Toyooka
  • Patent number: 10649330
    Abstract: A resist composition including a base component which exhibits changed solubility in a developing solution under action of acid, and a compound (B1) having an anion moiety and a cation moiety and being represented by general formula (b1) (wherein R01 to R014 each independently represents a hydrogen atom or a hydrocarbon group which may have a substituent, or two or more of R01 to R014 may be mutually bonded to form a ring structure, provided that at least two of R01 to R014 are mutually bonded to form a ring structure, and at least one of R01 to R014 has an anion group, and the anion moiety as a whole forms an anion having a valency of n; n represents an integer of 1 or more; represents an integer of 1 or more; and Mm+ represents an organic cation having a valency of m).
    Type: Grant
    Filed: November 27, 2017
    Date of Patent: May 12, 2020
    Assignee: TOKYO OHKA KOGYO CO., LTD.
    Inventors: Masatoshi Arai, Takaya Maehashi, Takuya Ikeda
  • Patent number: 10649331
    Abstract: The composition includes a compound represented by Formula 1, a binder polymer, and a photopolymerization initiator, in Formula 1, Q1 and Q2 each independently represent a (meth)acryloyloxy group or a (meth)acryloyloxyalkyl group; and R1 represents a divalent hydrocarbon group.
    Type: Grant
    Filed: February 8, 2017
    Date of Patent: May 12, 2020
    Assignee: FUJIFILM Corporation
    Inventors: Takashi Aridomi, Kentaro Toyooka
  • Patent number: 10599036
    Abstract: A chemically amplified positive-type photosensitive resin composition that can be well developed with an aqueous basic solution having low pH, a substrate with a photosensitive film formed from the composition, and a method for patterned resist film formation using the composition. The composition includes an acid generator that produces an acid upon irradiation with an active ray or radiation; a resin whose solubility in alkali increases under the action of acid; and an organic solvent, in which a predetermined amount of an alkali-soluble resin soluble in an aqueous basic solution having a pH of 12 and containing alkali-soluble groups with hydrogen atoms in at least a part thereof is substituted with an acid-dissociative dissolution-controlling group contained in the resin.
    Type: Grant
    Filed: March 23, 2017
    Date of Patent: March 24, 2020
    Assignee: TOKYO OHKA KOGYO CO., LTD.
    Inventors: Yasushi Kuroiwa, Yasuo Masuda
  • Patent number: 10577514
    Abstract: A curable composition includes a polymerizable compound containing diethylene glycol dimethacrylate and a mono-functional (meth)acrylate having an OH group and a resin, wherein the resin satisfies the following (1) and (2), (1). a viscosity at 25 degrees C. of a liquid mixture of 70 parts of the diethylene glycol dimethacrylate and 30 parts of the resin is 15 to 27 times greater than that of the diethylene glycol dimethacrylate alone, and (2). the liquid mixture has a spin-spin relaxation time of 240 ms or less as measured by Carr-Purcell-Meiboom-Gill (CPMG) of pulse Nuclear Magnetic Resonance (NMR) analysis.
    Type: Grant
    Filed: March 16, 2018
    Date of Patent: March 3, 2020
    Assignee: Ricoh Company, Ltd.
    Inventor: Yuuki Matsushita
  • Patent number: 10538627
    Abstract: A photosensitive resin composition using a polyimide precursor composition, a cured film, a method for producing a cured film, a semiconductor device, and a method for producing a polyimide precursor composition are provided. In the polyimide precursor composition, the molar ratio of repeating units represented by General Formula (1-2) among structural isomers of the polyimide precursor is 60% to 90% by mole. In General Formula (1-2), A1 and A2 each independently represents an oxygen atom or NH, R111 and R112 each independently represents a single bond or a divalent organic group, and R113 and R114 each independently represents a hydrogen atom or a monovalent organic group.
    Type: Grant
    Filed: November 28, 2017
    Date of Patent: January 21, 2020
    Assignee: FUJIFILM Corporation
    Inventors: Takeshi Kawabata, Takuma Amemiya, Hidekazu Oohashi, Yu Iwai, Akinori Shibuya
  • Patent number: 10525696
    Abstract: A lithographic printing plate precursor, a lithographic printing plate manufacturing method, a printing method and an aluminum support manufacturing method enable the resulting lithographic printing plate to have a long tiny dot press life. The lithographic printing plate precursor includes an aluminum support and an image recording layer. When measured over a 400 ?m×400 ?m region of a surface of the aluminum support on the image recording layer side using a three-dimensional non-contact roughness tester, pits with a depth from centerline of at least 0.70 ?m are present at a density of at least 3,000 pits/mm2. A surface area ratio ?S is not less than 35%, where ?S is determined using an actual area Sx obtained, through three-point approximation, from three-dimensional data acquired by measurement at 512×512 points in 25 ?m square of the surface of the aluminum support on the image recording layer side.
    Type: Grant
    Filed: January 11, 2019
    Date of Patent: January 7, 2020
    Assignee: FUJIFILM Corporation
    Inventors: Ryo Nakamura, Atsushi Matsuura, Tsuyoshi Hirokawa
  • Patent number: 10520816
    Abstract: An object is to provide a method for forming a resist pattern able to form a resist pattern, in which the resist shape is favorable, the occurrence of resist footing can be reduced, and the adherence and the aspect ratio are improved; and provided is a method for forming a resist pattern comprising a step of forming a photosensitive resin layer on a substrate using a photosensitive resin composition for projection exposure; a step of exposing the photosensitive resin layer to active light projecting an image of a photomask through a lens; and a step of removing an unexposed part of the photosensitive resin layer from the substrate by development, wherein the photosensitive resin composition for projection exposure comprises an (A) binder polymer, a (B) photopolymerizing compound having an ethylenically unsaturated bond, and a (C) photopolymerization initiator; and a light transmittance of the photosensitive resin layer at a wavelength of 365 nm is not less than 58.0% and not more than 95.0%.
    Type: Grant
    Filed: December 17, 2014
    Date of Patent: December 31, 2019
    Assignee: HITACHI CHEMICAL COMPANY, LTD.
    Inventors: Masakazu Kume, Momoko Munakata
  • Patent number: 10520810
    Abstract: A process for producing a photoresist pattern comprising steps (1) to (5); (1) applying a photoresist composition onto a substrate, said photoresist composition comprising an acid generator and a resin which comprises a structural unit having an acid-liable group; (2) drying the applied composition to form a composition layer; (3) exposing the composition layer; (4) heating the exposed composition layer; and (5) developing the heated composition layer with a developer which comprises butyl acetate, wherein a distance of Hansen solubility parameters between the resin and butyl acetate is from 3.3 to 4.3, the distance is calculated from formula (1): R=(4×(?dR?15.8)2+(?pR?3.7)2+(?hR?6.3)2)1/2??(1) in which ?dR represents a dispersion parameter of the resin, ?pR represents a polarity parameter of the resin, ?hR represents a hydrogen bonding parameter of the resin, and R represents the distance, and a film retention ratio of the photoresist pattern relative to the composition layer is adjusted to 65% or more.
    Type: Grant
    Filed: May 10, 2017
    Date of Patent: December 31, 2019
    Assignee: SUMITOMO CHEMICAL COMPANY, LIMITED
    Inventors: Tatsuro Masuyama, Koji Ichikawa
  • Patent number: 10501580
    Abstract: A photosensitive resin composition using a polyimide precursor composition, a cured film, a method for producing a cured film, a semiconductor device, and a method for producing a polyimide precursor composition are provided. In the polyimide precursor composition, the molar ratio of repeating units represented by General Formula (1-2) among structural isomers of the polyimide precursor is 60% to 90% by mole. In General Formula (1-2), A1 and A2 each independently represents an oxygen atom or NH, R111 and R112 each independently represents a single bond or a divalent organic group, and R113 and R114 each independently represents a hydrogen atom or a monovalent organic group.
    Type: Grant
    Filed: November 28, 2017
    Date of Patent: December 10, 2019
    Assignee: FUJIFILM Corporation
    Inventors: Takeshi Kawabata, Takuma Amemiya, Hidekazu Oohashi, Yu Iwai, Akinori Shibuya
  • Patent number: 10501601
    Abstract: The present invention provides a tire rubber composition prepared by mixing at least one rubber component selected from natural rubbers and synthetic diene rubbers (A), a filler including an inorganic filler (B), a silane coupling agent (C) and a thiosemicarbazone derivative (D), and provides a production method for a tire rubber composition, wherein the tire rubber composition is kneaded in plural stages, and in the first stage of kneading, the rubber component (A), all or part of the inorganic filler (B), all or part of the silane coupling agent (C), and the thiosemicarbazone derivative (D) are kneaded, therefore providing a tire rubber composition having improved reactivity between the coupling agent and the rubber component and excellent in low-heat-generation property and a production method for the composition.
    Type: Grant
    Filed: May 28, 2014
    Date of Patent: December 10, 2019
    Assignee: BRIDGESTONE CORPORATION
    Inventor: Noriaki Yukimura
  • Patent number: 10472529
    Abstract: The present invention relates to an ink composition containing a multifunctional adhesive suitable for a three-dimensional (3D) printer and the use thereof. The multifunctional adhesive of the present invention contains a compound with a catechol group and exhibits excellent adhesion to various materials (e.g. dry plaster powders, polymers, metals, ceramics, and composite materials). The use of the ink composition of the present invention containing the multifunctional adhesive enables the processing of various functional materials that were difficult to fabricate into a 3D structure. Therefore, it is highly likely that the ink composition of the present invention can effectively create a market for functional materials for a 3D printer and find new areas of application (e.g. automotive, medical, fashion, aviation/aerospace, construction, consumer electronics, entertainment, etc.).
    Type: Grant
    Filed: March 28, 2016
    Date of Patent: November 12, 2019
    Assignee: Korea Institute of Science and Technology
    Inventors: Heonju Lee, Myoungwoon Moon, Wonjin Jo, Sangsoo Han, Haeshin Lee, Intaek Song
  • Patent number: 10474099
    Abstract: A main object of the present invention is to provide a method of producing a volume hologram laminate which can regenerate a hologram image in an arbitrary wavelength by a simple process. To attain the object, the present invention provides a method of producing a volume hologram laminate using a volume hologram forming substrate which comprises: a substrate, a volume hologram layer formed on the substrate and containing a photopolymerizable material, a resin layer, formed on the substrate so as to contact to the volume hologram layer, containing a resin and a polymerizable compound, characterized in that the producing method comprises processes of: a hologram recording process to record a volume hologram to the volume hologram layer, a substance transit process of transiting the polymerizable compound to the volume hologram layer, and an after-treatment process of polymerizing the polymerizable compound.
    Type: Grant
    Filed: November 14, 2016
    Date of Patent: November 12, 2019
    Assignee: Dai Nippon Printing Co., Ltd.
    Inventors: Minoru Azakami, Koji Eto, Hiroyuki Ohtaki, Yoshihito Maeno, Sakurako Hatori
  • Patent number: 10465029
    Abstract: Various embodiments disclosed relate to photopolymerizable compositions that are suitable for making three-dimensional structures when exposed to laser light.
    Type: Grant
    Filed: February 2, 2018
    Date of Patent: November 5, 2019
    Assignee: Pacific Light & Hologram, Inc.
    Inventors: Tina Qin, Joshua D. Wiensch
  • Patent number: 10444627
    Abstract: There are provided a pattern formation method, including: (1) forming a film using an active light-sensitive or radiation-sensitive resin composition; (2) exposing the film to active light or radiation; and (3) developing the exposed film using a developer including an organic solvent, wherein the active light-sensitive or radiation-sensitive resin composition contains a resin (A) having specific repeating units, and a crosslinking agent (C).
    Type: Grant
    Filed: February 1, 2016
    Date of Patent: October 15, 2019
    Assignee: FUJIFILM Corporation
    Inventors: Hiroo Takizawa, Toru Fujimori, Wataru Nihashi, Shuji Hirano, Natsumi Yokokawa
  • Patent number: 10409161
    Abstract: To provide a positive type photosensitive composition capable of forming a pattern of high resolution, of high heat resistance and of high transparency without emitting harmful volatile substances such as benzene, also capable of reducing pattern defects caused by development residues, by undissolved residues, or by reattached hardly-soluble trace left in pattern formation, and further capable of being excellent in storage stability. The present invention provides a positive type photosensitive siloxane composition comprising: a polysiloxane having a phenyl group, a diazonaphthoquinone derivative, a hydrate or solvate of a photo base-generator having a particular nitrogen-containing hetero-cyclic structure, and an organic solvent.
    Type: Grant
    Filed: January 20, 2017
    Date of Patent: September 10, 2019
    Assignee: AZ Electronic Materials (Luxembourg) S.a.r.l.
    Inventors: Motoki Misumi, Daishi Yokoyama, Megumi Takahashi, Toshiaki Nonaka
  • Patent number: 10400161
    Abstract: The present invention provides a quantum rod composition, a quantum rod polarizer and a fabricating method for the same. The quantum rod composition of the present invention comprises the photo-alignment agent modified quantum rods, the polymerizable monomers, and a solvent, said photo-alignment agent modified quantum rods are capable of being oriented in arrangement under irradiation of linearly polarized light, said polymerizable monomers are capable of forming polymer network under irradiation of UV light, thereby anchoring said photo-alignment agent modified quantum rods, for retaining arrangement directions thereof. The fabricating method of quantum rod polarizer of the present invention, applies the aforementioned quantum rod composition to prepare the quantum rod polarizer with simplified fabricating process. In the fabricated quantum rod polarizer, the photo-alignment agent modified quantum rods are consistent and retained in arrangement directions, and have stable polarizing property.
    Type: Grant
    Filed: April 10, 2017
    Date of Patent: September 3, 2019
    Assignee: SHENZHEN CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD.
    Inventor: Song Lan
  • Patent number: 10392458
    Abstract: Disclosed are a resin blend, a copolymer, a pellet, a method of manufacturing a resin-molded article using the same, and a resin-molded article. The exemplary resin blend can be useful in providing a protective film for polarizing plates having excellent adhesive strength to a polarizer. Also, the resin blend can be useful in exhibiting excellent adhesive strength to the polarizer without performing an additional primer coating process on a surface(s) of the protective film for polarizing plate, thereby reducing production time and cost and improving productivity.
    Type: Grant
    Filed: July 8, 2014
    Date of Patent: August 27, 2019
    Assignee: LG Chem, Ltd.
    Inventors: Eun Joo Choi, Jin Young Ryu, Jong Won Lee, Kyoung Hoon Kim, Hyeon Choi
  • Patent number: 10374178
    Abstract: A semiconductor device can be prepared using a precursor dielectric composition that comprises: (1) a photochemically or thermally crosslinked product of a photocurable or thermally curable thiosulfate-containing polymer that has a Tg of at least 50° C. and that comprises: an organic polymer backbone comprising (a) recurring units comprising pendant thiosulfate groups; and further comprises charge balancing cations, and (2) optionally, an electron-accepting photo sensitizer component. The electronic device can be prepared by independently applying the precursor dielectric composition and an organic semiconductor composition to a substrate to form an applied precursor dielectric composition and an applied organic semiconductor composition, respectively, and subjecting the applied precursor dielectric composition to curing conditions to form a gate dielectric layer that is in physical contact with the applied organic semiconductor composition.
    Type: Grant
    Filed: April 17, 2017
    Date of Patent: August 6, 2019
    Assignee: EASTMAN KODAK COMPANY
    Inventors: Deepak Shukla, Kevin M. Donovan
  • Patent number: 10345701
    Abstract: A photoresist polymer includes a first repeating unit and a second repeating unit. The first repeating unit includes a fluorine leaving group that is configured to be removed by a photo-chemical reaction. The second repeating unit includes a silicon-containing leaving group that is configured to be removed by the fluorine leaving group when the fluorine leaving group is removed from the first repeating unit.
    Type: Grant
    Filed: November 9, 2017
    Date of Patent: July 9, 2019
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Jin Park, Hyun-woo Kim, Jin-Kyu Han, Cha-Won Koh
  • Patent number: 10324376
    Abstract: The present invention provides a negative type colored photosensitive resin composition that serves to produce a cured film having a forward tapered shape. This negative type colored photosensitive resin composition includes an alkali-soluble resin (A), a photo initiator (B), a photo polymerizable compound (C), and a coloring agent (D), the alkali-soluble resin (A) containing a polyimide precursor, polybenzoxazole precursor, and/or a copolymer thereof (A-1), each resin (A-1) having a trifluoromethyl group in the backbone chain.
    Type: Grant
    Filed: September 21, 2016
    Date of Patent: June 18, 2019
    Assignee: TORAY INDUSTRIES, INC.
    Inventors: Satoshi Kamemoto, Yugo Tanigaki, Kazuto Miyoshi
  • Patent number: 10310375
    Abstract: The present invention provides photoacid generators for use in chemically amplified resists and lithographic processes using the same.
    Type: Grant
    Filed: March 19, 2014
    Date of Patent: June 4, 2019
    Inventors: Kenneth E Gonsalves, Mingxing Wang
  • Patent number: 10308042
    Abstract: The present invention relates to a radiation curable ink composition including a gellant. The present invention further relates to an ink set having such ink composition. The present invention further relates to a method for making such ink composition and a printing method using such ink composition.
    Type: Grant
    Filed: March 16, 2017
    Date of Patent: June 4, 2019
    Assignee: OCÉ HOLDING B. V.
    Inventors: Richard F. E. Van Hout, Björn H. A. J. M. Ketelaars, R. Van Hameren, Bas Venderbosch
  • Patent number: 10261417
    Abstract: An active-light-sensitive or radiation-sensitive resin composition includes a resin (A) and a photoacid generator (B) capable of generating an acid upon irradiation with active light or radiation, in which the active-light-sensitive or radiation-sensitive resin composition contains at least a photoacid generator (B1) represented by the following General Formula (1) and a photoacid generator (B2) other than the photoacid generator (B1) as the photoacid generator (B).
    Type: Grant
    Filed: October 12, 2016
    Date of Patent: April 16, 2019
    Assignee: FUJIFILM Corporation
    Inventors: Akiyoshi Goto, Michihiro Shirakawa, Keita Kato, Fumihiro Yoshino, Kei Yamamoto
  • Patent number: 10248019
    Abstract: A pattern forming, method, includes: (i) forming a film from an actinic ray-sensitive or radiation-sensitive resin composition that contains (A) a compound capable of generating an acid upon irradiation with an actinic ray or radiation and decomposing by an action of an acid to decrease a solubility of the compound (A) for an organic solvent; (ii) exposing the film; and (iii) performing development by using a developer containing an organic solvent.
    Type: Grant
    Filed: December 21, 2012
    Date of Patent: April 2, 2019
    Assignee: FUJIFILM Corporation
    Inventors: Shohei Kataoka, Kaoru Iwato, Kana Fujii, Sou Kamimura, Yuichiro Enomoto, Keita Kato, Shuhei Yamaguchi
  • Patent number: 10239999
    Abstract: Disclosed are a curable resin, a spacer composition, a filter, methods of preparing the same, a filter and a method of preparing the same, and a display device. The curable resin includes 1 part by weight of dianhydride, 0.6 to 2 parts by weight of diamine, and 0.8 to 3 parts by weight of vinyl monomer.
    Type: Grant
    Filed: December 14, 2013
    Date of Patent: March 26, 2019
    Assignees: BOE TECHNOLOGY GROUP CO., LTD., BEIJING BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
    Inventors: Hongyan Li, Jiuxia Yang
  • Patent number: 10209618
    Abstract: A photoresist composition comprising an acid generator and a resin which comprises a structural unit having an acid-liable group, the acid generator generating an acid (I) or an acid (II): the acid (I) showing a hydrogen bonding parameter in the range of 12 (MPa)1/2 to 15 (MPa)1/2 and a polarity parameter in the range of 15 (MPa)1/2 or more; the acid (II) showing a hydrogen bonding parameter in the range of 12 (MPa)1/2 to 15 (MPa)1/2, and a distance of Hansen solubility parameters between the acid (II) and ?-butyrolactone being 7.5 or less, and the distance being calculated from formula (1): R=(4×(?dA?18)2+(?pA?16.6)2+(?hA?7.4)2)1/2??(1) in which ?dA represents a dispersion parameter of an acid, ?pA represents a polarity parameter of an acid, ?hA represents a hydrogen bonding parameter of an acid, and R represents a distance of Hansen solubility parameters between an acid and ?-butyrolactone.
    Type: Grant
    Filed: May 10, 2017
    Date of Patent: February 19, 2019
    Assignee: SUMITOMO CHEMICAL COMPANY, LIMITED
    Inventors: Tatsuro Masuyama, Koji Ichikawa
  • Patent number: 10203599
    Abstract: A photosensitive composition includes a plurality of quantum dots including an organic ligand on the surface thereof; a binder; a photopolymerizable monomer composition; photoinitiator; and a solvent, wherein the photopolymerizable monomer includes a main monomer having 1 to 6 carbon-carbon double bonds, a first accessory monomer having 8 to 20 carbon-carbon double bonds, and a second accessory monomer represented by Chemical Formula A; and a method of preparing the photosensitive composition and a quantum dot-polymer composite pattern prepared therefrom are provided: R1O-(L1)m-L3-A-L4-(L2)n-OR2??Chemical Formula A wherein, A, L1, L2, L3, L4, R1, and R2 are the same as defined herein.
    Type: Grant
    Filed: October 17, 2016
    Date of Patent: February 12, 2019
    Assignees: SAMSUNG ELECTRONICS CO., LTD., SAMSUNG SDI CO., LTD.
    Inventors: Jonggi Kim, Shang Hyeun Park, Shin Ae Jun, Hojeong Paek
  • Patent number: 10183477
    Abstract: A light-polymerizable composition for additive manufacturing of resorbable scaffolds and implants comprising a biocompatible resin. The biocompatible resin includes a combination of photo-initiators or a dye-initiator package tailored to manufacture implants with the desired physical and chemical properties. A dye or other constituent controls between layer (z) resolution of the manufactured part built in an additive manufacturing device. A light absorber or other constituent controls within layer (x-y) resolution of the manufactured part.
    Type: Grant
    Filed: December 2, 2013
    Date of Patent: January 22, 2019
    Inventors: H. David Dean, Al Siblani, Eric J. Mott, John P. Fisher, Martha O. Wang, Antonios G. Mikos
  • Patent number: 10126653
    Abstract: Provided is a method of forming a pattern, ensuring excellent sensitivity, limiting resolving power, roughness characteristic, exposure latitude (EL), dependence on post-exposure bake (PEB) temperature and focus latitude (depth of focus DOF), and a resist composition for use in the method. The method comprises (A) forming a film from a resist composition comprising a resin containing a repeating unit containing a group that is decomposed when acted on by an acid to thereby produce an alcoholic hydroxyl group, which resin thus when acted on by an acid decreases its solubility in a developer containing an organic solvent, (B) exposing the film to light, and (C) developing the exposed film using a developer containing an organic solvent.
    Type: Grant
    Filed: February 24, 2011
    Date of Patent: November 13, 2018
    Assignee: FUJIFILM Corporation
    Inventors: Kaoru Iwato, Shohei Kataoka, Shinji Tarutani, Sou Kamimura, Keita Kato, Yuichiro Enomoto, Kazuyoshi Mizutani, Toru Tsuchihashi, Kana Fujii