Abstract: There are provided a photosensitive resin composition which can be applied to either a projection exposure or direct-write exposure machine without fine adjustment of the composition, and can form a resist pattern having an excellent cross-sectional shape in which an undercut in which the bottom portion of the resist pattern is hollowed and omission of the top of the resist pattern are less likely to occur, and a line width of an intermediate portion (central portion) and a deepest portion (bottom portion) in the depth direction of the cross section of the resist pattern is less likely to be larger than a line width of the surface portion (that is, linearity in the depth direction of the resist pattern contour is favorable), and which has excellent insulation reliability and crack resistance reliability, and a dry film using the same, a printed wiring board, and a printed wiring board manufacturing method.

Abstract: A pattern forming material is configured to use for forming an organic film on a film to be processed, patterning the organic film, and then forming a composite film by infiltrating a metallic compound into the patterned organic film. The pattern forming material contains a polymer including a monomer unit represented by a general formula (3) described below, where R21 is H or CH3, each R22 is a hydrocarbon group of C2-14 where a carbon is primary carbon, secondary carbon or tertiary carbon, Q is a single bond or a hydrocarbon group of C1-20 carbon atoms which may include an oxygen atom, a nitrogen atom, or a sulfur atom between carbon-carbon atoms of or at a bond terminal, and a halogen atom may be substituted for the hydrogen atom.

Abstract: A pattern forming material is configured to use for forming an organic film on a film to be processed, patterning the organic film, and then forming a composite film by infiltrating a metallic compound into the patterned organic film. The pattern forming material contains a polymer including a monomer unit represented by a general formula (1) described below, wherein, R5 is a hydrogen atom or a methyl group, each R6 independently is an ethyl group, an n-propyl group, an isopropyl group, an n-butyl group, an isobutyl group, or an s-butyl group, and a monomer unit derived from a compound represented by a general formula (2) described below, wherein, R11 is a hydrogen atom or a methyl group, each R12 independently is a methyl group, an ethyl group, an n-propyl group, an isopropyl group, an n-butyl group, an isobutyl group, an s-butyl group, or a t-butyl group.

Abstract: Provided is a composition for shrinking a photoresist pattern, which is capable of shrinking a photoresist pattern using a photoresist during the fabrication of a semiconductor, and to a method of shrinking a pattern using the composition, whereby a pattern to be formed can be shrunken in a photoresist-patterning process, thus remarkably decreasing the number of steps of a semiconductor fabrication process and reducing the fabrication time and costs.

Abstract: A negative-type photosensitive resin composition that has a satisfactory imidization rate and can yield a resin layer with high chemical resistance, even under low-temperature curing conditions of 200° C. or below, the negative-type photosensitive resin composition containing a photopolymerization initiator (B) in a proportion of 0.1 part by mass to 20 parts by mass with respect to 100 parts by mass of a polyimide precursor (A), the polyimide precursor (A) being a polyamic acid ester or polyamic acid salt with a specific structure, and the weight-average molecular weight (Mw) of the polyimide precursor (A) being 3,000 or greater and less than 16,000, in terms of polystyrene, according to gel permeation chromatography (GPC).

Abstract: The present invention provides a composition for forming an organic film, containing a polymer compound having one or more of repeating units shown by the general formulae (1) to (4) and an organic solvent containing one or more compounds selected from propylene glycol esters, ketones, and lactones, with a total concentration of more than 30 wt % with respect to the whole organic solvent. There can be provided a composition capable of forming an organic film that can be easily removed, together with a silicon residue modified by dry etching, in a wet manner with a removing liquid harmless to a semiconductor apparatus substrate and an organic resist underlayer film required in the patterning process, for example, an ammonia aqueous solution containing hydrogen peroxide called SC1, which is commonly used in the semiconductor manufacturing process.

Abstract: A photosensitive composition including a quantum dot dispersion, a photopolymerizable monomer having a carbon-carbon double bond, and a photoinitiator, wherein the quantum dot dispersion includes an acid group-containing polymer and a plurality of quantum dots dispersed in the acid group-containing polymer, and wherein the acid group-containing polymer includes a copolymer of a monomer combination including a first monomer having a carboxylic acid group or a phosphonic acid group and a carbon-carbon double bond and a second monomer having a carbon-carbon double bond and a hydrophobic group and not having a carboxylic acid group and a phosphonic acid group.

Abstract: A photosensitive composition including a quantum dot dispersion, a photopolymerizable monomer having a carbon-carbon double bond, and a photoinitiator, wherein the quantum dot dispersion includes an acid group-containing polymer and a plurality of quantum dots dispersed in the acid group-containing polymer, and wherein the acid group-containing polymer includes a copolymer of a monomer combination including a first monomer having a carboxylic acid group or a phosphonic acid group and a carbon-carbon double bond and a second monomer having a carbon-carbon double bond and a hydrophobic group and not having a carboxylic acid group and a phosphonic acid group.

Abstract: A resin containing a structural unit derived from a compound represented by the formula (aa) wherein T, R1 and Z1 are defined in the specification.

Abstract: The present application relates to new coumarin compounds and their uses as fluorescent labels. The compounds may be used as fluorescent labels for nucleotides in nucleic acid sequencing applications.

Abstract: The present invention provides, inter alia, a process for incorporating a cyclopropenium ion into a polymeric system. Processes for making cross-linked polymers, linear polymers, and dendritic polymers, as well as for incorporating a cyclopropenium ion onto a preformed polymer are also provided. Further provided are stable, polycationic compounds, various polymers that contain stable cyclopropenium cations, and substrates containing such polymers. The use of these polymers in water purification systems, antimicrobial coatings, ion-transport membranes, cell supports, drug delivery vehicles, and gene therapeutic vectors are also provided.

Abstract: New photoresist compositions are provided that are useful for immersion lithography. Preferred photoresist compositions of the invention comprises one or more materials that have hetero-substituted carbocyclic aryl groups. Particularly preferred photoresists of the invention can exhibit reduced leaching of resist materials into an immersion fluid contacting the resist layer during immersion lithography processing.

Abstract: A resist composition which generates acid upon exposure and exhibits changed solubility in a developing solution under action of acid, the resist composition including a base component (A) which exhibits changed solubility in a developing solution under action of acid and an acid generator (B) which generates acid upon exposure, the base component (A) including a resin component having a structural unit (a0) represented by general formula (a0-1) shown below, and the acid generator component (B) containing a compound having a cation moiety having an electron withdrawing group (wherein R represents a hydrogen atom, an alkyl group of 1 to 5 carbon atoms or a halogenated alkyl group of 1 to 5 carbon atoms; Ya represents a carbon atom; Xa represents an atomic group required to form an alicyclic hydrocarbon group with Ya; and Ra01 represents an aromatic hydrocarbon group optionally having a substituent).

Abstract: Disclosed herein are coating compositions and methods of making and using the same. The coating composition includes a first polymer having at least one positively charged group; a second polymer having at least one negatively charged group; and at least one protecting group contacting the positively charged group of the first polymer, the negatively charged group of the second polymer, or both. The protecting group is configured to be removed by photocleavage to form a salt bridge between the positively and negatively charged groups. The coating composition may be hydrophilic when the salt bridge is formed.

Abstract: This adhesive contains an epoxy compound, a cationic catalyst, and an acrylic resin that includes acrylic acid and an acrylic acid ester having a hydroxyl group. The acrylic acid in the acrylic resin reacts with the epoxy compound, creating a link between the acrylic resin island part and the epoxy compound sea part, and strengthening the anchoring effect with respect to the epoxy compound sea part by roughening the surface of an oxide film. Furthermore, the hydroxyl-group-containing acrylic acid ester in the acrylic resin becomes electrostatically adhesive to wiring due to the polarity of the hydroxyl group. Excellent adhesive strength can be obtained by adhering, in this way, the entire cured product composed of the acrylic resin island part and the epoxy compound sea part to the oxide film.

Abstract: A positive photosensitive resin composition including: a polysiloxane synthesized by hydrolyzing and partially condensing a specific organosilane and an organosilane that has a carboxyl group and/or a dicarboxylic acid anhydride structure; particles of one or more metal compounds selected from an aluminum compound, a tin compound, a titanium compound, and a zirconium compound, or composite particles of a silicon compound and one or more metal compounds selected from an aluminum compound, a tin compound, a titanium compound, and a zirconium compound; a naphthoquinone diazide compound; and a solvent.

Abstract: The present invention provides, inter alia, a process for incorporating a cyclopropenium ion into a polymeric system. Processes for making cross-linked polymers, linear polymers, and dendritic polymers, as well as for incorporating a cyclopropenium ion onto a preformed polymer are also provided. Further provided are stable, polycationic compounds, various polymers that contain stable cyclopropenium cations, and substrates containing such polymers. The use of these polymers in water purification systems, antimicrobial coatings, ion-transport membranes, cell supports, drug delivery vehicles, and gene therapeutic vectors are also provided.

Abstract: A black resin film is produced by applying a photosensitive resin composition containing a black pigment, an alkali-soluble polymer compound, an ethylenic unsaturated bond-containing compound and ?-aminoalkylphenone or ?-hydroxyalkylphenone as a photopolymerization initiator, to a substrate; and subjecting the composition to exposure, development and post-exposure. The post-exposure is performed from both side with 1,300 mJ/cm2 or more in terms of i line.

Abstract: The present technology provides compositions, methods, and processes to form polysiloxanes. In one aspect, the present technology provides a process for the ring opening polymerization of a cyclosiloxane comprising contacting a cyclosiloxane with a N-trialkylsilyl-bis(perfluoroalkylsulfonyl)imide compound.

Abstract: New lactone-containing photoacid generator compounds (“PAGs”) and photoresist compositions that comprise each PAG compounds are provided. These photoresist compositions are useful in the manufacture of electronic device.

Abstract: A polymer compound (I) with bacteria-adhesion inhibition properties against bacteria such as P. aeruginosa Xen 5, E. coli Xen 14, S. typhimurium Xen 26, S. aureus Xen 36 and K. pneumoniae Xen 39 is described. The group R is provided by a substituted furanone linked by an alkyl chain or, more preferably a hydrophilic moiety such as oligo(ethylene oxide) ((CH2—CH2—O)i) to the polymer backbone. The group R may be the same or different along the polymer backbone. The invention also provides nanofibers and coatings which include a polymer compound as defined above.

Abstract: The present invention provides a photosensitive resin composition comprising an unsaturated group-containing resin (D), a (meth)acrylic compound (E) having a specific structure, a silane compound (G) having a substituent selected from the group consisting of an amino group, an amide group, a ureido group, a ketimine group, and an isocyanate group, and a photo-polymerization initiator (F), the unsaturated group-containing resin (D) being obtained by adding an epoxy group-containing unsaturated compound (C) to some acid radicals of a copolymer obtained by copolymerizing a (meth)acrylic ester (A) with an unsaturated group- and acid-containing compound (B).

Abstract: A reversible recording medium based on optical storage of at least one item of information within a support material, includes at least one layer of support material having: base molecules able to take, in a local zone, a first collective state of molecules able to generate a first signal of second harmonic characteristic of this first collective state of molecules when excited by electromagnetic reading radiation; the base molecules having the first collective state of molecules able to transform, at least in part, into transformed molecules so as to pass to a second collective state of molecules when excited by electromagnetic writing radiation, the molecules having the second collective state of molecules able to generate a second signal of second harmonic characteristic of this second collective state of molecules when excited by the electromagnetic reading radiation. The molecules exhibit a molecular structure based on a coumarin skeleton of Formula (I).

Abstract: Provided is a pattern forming method that is excellent in roughness performance such as line width roughness and exposure latitude, and an actinic-ray-sensitive or radiation-sensitive resin composition and a resist film used for the pattern forming method. The pattern forming method includes (1) forming a film using an actinic-ray-sensitive or radiation-sensitive resin composition containing a resin that includes 65 mol % or more of a repeating unit having a group which generates a polar group by being degraded by the action of an acid based on all repeating units in the resin and at least one kind of repeating unit represented by the following General Formula (I) or (II), (2) exposing the film, and (3) developing the exposed film using a developer that contains an organic solvent.

Abstract: The invention provides a vinyl ether group-containing copolymer, preparation process and use thereof. The copolymer comprises of the structural units represented by the following general formulae I, II and III, wherein, R1 is O or HN, R2 is an alkyl group with a carbon atom number of 1-4, cyclohexyl or a group represented by the following general formula IV (m represents a positive integer of 1-3), n is a positive integer of 1-4, the molar numbers of the structural units represented by the general formulae I, H and III are x, y and z, respectively, and x:y:z=3-8:1-4:1-5, the weight average molecular weight of the copolymer is 5000-20000. A color light blocking agent added with the copolymer can increase sensitivity. Furthermore, the copolymer has solubility in an alkaline solution, and thus, the color light blocking agent added with the copolymer has a superior developing property.

Abstract: A copolymer of the present invention comprises a repeating unit derived from phenylphenyl (meth)acrylate; a repeating unit derived from a hydroxyphenyl group-containing unsaturated compound; and a repeating unit derived from an epoxy group-containing unsaturated compound. The copolymer of the present invention brings together excellent transparency and a high refractive index. A resin film formed from the copolymer of the present invention can be suitably utilized in the formation of a protective film or interlayer insulating film for an electronic part such as a liquid crystal display device, an integrated circuit device, or a solid-state imaging device, the formation of a microlens or a microlens array, the formation of an optical waveguide, or the like.

Abstract: There is provided a cured-film formation composition that forms a cured film having excellent photoreaction efficiency and solvent resistance, and high adhesion, an orientation material for photo-alignment, and a retardation material formed with the orientation material. The cured-film formation composition comprises a component (A) that is a compound having a photo-aligning group and one substituent selected from a hydroxy group, a carboxy group, anvil an amino group, a component (B) that is a hydrophilic polymer having one or more substituents selected from to hydroxy group, a carboxy group, and an amino group; and a component (C) that is cross-linking agent that reacts with the component (A) and the component (B) and reacts at a temperature lower than a sublimation temperature of the component (A), wherein when the component (B) is an acrylic polymer, the cured-film formation composition further comprises a component (E) that is an adhesion enhancing component.

Abstract: Semiconductor nano-sized particles possess unique optical properties, which make them ideal candidates for various applications in the UV photolithography. In this patent several such applications, including using semiconductor nano-sized particles or semiconductor nano-sized particle containing materials as highly refractive medium in immersion lithography, as anti-reflection coating in optics, as pellicle in lithography and as sensitizer in UV photoresists are described.

Abstract: Disclosed is a photosensitive resin composition capable of displaying satisfactory patterning performance against an alkaline developer and yielding a cured film of a sufficiently low coefficient of linear thermal expansion. The photosensitive resin composition contains a photopolymerization initiator and a polyimide precursor obtained by the reaction of an ester-containing diamine such as 4-aminophenyl 4?-aminobenzoate, a biphenyl-based diamine such as 4,4?-diamino-2,2?-dimethylbiphenyl, and an unsaturated group-containing diamine such as 4,4?-diamino-2,2?-divinylbiphenyl with an acid anhydride such as pyromellitic dianhydride. The content of the structural unit derived from the unsaturated group-containing diamine in the polyimide precursor is 5-60 mol %.

Abstract: Disclosed are a black photosensitive resin composition including (A) a binder resin; (B) a colorant including a pigment and a silica nanoparticle; (C) a photopolymerizable compound; (D) a photopolymerization initiator; and (E) a solvent, wherein the silica nanoparticle is included in an amount of about 1 part by weight to about 11 parts by weight based on about 100 parts by weight of the pigment, and a light blocking layer and a color filter using the same.

Abstract: A negative resist composition comprising a polymer comprising recurring units (a) of formula (1) and having a Mw of 1,000-500,000 as base resin is provided. R1 is H or methyl, X is a single bond or —C(?O)—O—R4—, R2 is a single bond or C1-C4 alkylene, R3 is C2-C8 alkylene, R4 is a single bond or C1-C4 alkylene, and 0<a?1.0. The composition exhibits a high resolution due to controlled acid diffusion and forms a resist film which is unsusceptible to swell in the developer and hence to pattern collapse.

Abstract: An object of the present invention is to provide a composition enabling to form a topcoat layer capable of preventing outgassing and of keeping deep UV light from impairing pattern shape in a lithographic process with extreme UV light. The object can be achieved by a composition of the invention for forming a topcoat layer. The composition contains a water-soluble polymer comprising hydrophilic groups and deep-UV absorbing groups absorbing light of 170 to 300 nm, and an aqueous solvent. The solvent comprises 70 weight % or more of water. The composition is cast on a resist layer and heated to harden, and thereafter the resist layer is subjected to exposure by use of extreme UV light and then developed to form a pattern.

Abstract: A photosensitive resin composition is provided, which comprises an alkali-soluble resin (A), a polysiloxane polymer (B), a compound containing vinyl unsaturated group(s) (C), a photoinitiator (D), a solvent (E), a black pigment (F) and a light stabilizer (G). The alkali-soluble resin (A) includes a resin having unsaturated group(s) (A-1), which is obtained by reacting an epoxy compound having at least two epoxy groups (a-1) with a compound having at least one vinyl unsaturated group and carboxyl group (a-2). The light stabilizer (G) includes a UV absorber (G-1) and/or a hindered amine (G-2). Therefore, the photosensitive resin composition has an excellent temporal stability, and a black matrix formed by such composition has a better heat resistance.

Abstract: A photosensitive resin composition, a color filter and a method for manufacturing the same, and a liquid crystal display apparatus are provided. The photosensitive resin composition includes a pigment, an alkali-soluble resin, a compound containing an ethylenically unsaturated group, a photoinitiator, and an organic solvent. The photosensitive resin composition has the advantages of high contrast, low post-baking color difference, and good linearity of high precision pattern.

Abstract: A photosensitive resin composition includes (A) a photopolymerization initiator including a compound represented by the following Chemical Formula 1, wherein in Chemical Formula 1, each substituent is the same as defined in the detailed description, (B) a binder resin, (C) a photopolymerizable monomer, (D) a colorant, and (E) a solvent, and a light blocking layer and liquid crystal display (LCD) using the same.

Abstract: A liquid crystal display including a first substrate; a second substrate facing the first substrate; a thin film transistor disposed on the first substrate; an organic layer disposed on the thin film transistor; a pixel electrode disposed on the organic layer; a lower alignment layer disposed on the pixel electrode; a common electrode disposed on the second substrate; and an upper alignment layer disposed on the common electrode, wherein a first free radical included in the organic layer and a second free radical included in at least one of the lower alignment layer and the upper alignment layer are radical bonded.

Abstract: A photoresist composition comprising: a resin which has an acid-labile group; an acid generator; a compound which has a sulfide bond and a mercapto group; and a solvent.

Abstract: The present invention relates to a positive photosensitive resin composition and a method for forming a pattern by using the same. The positive photosensitive resin composition includes a novolac resin (A), a polysiloxane (B), an ortho-naphthoquinone diazide sulfonic acid ester (C) and a solvent (D). The novolac resin (A) includes a xylenol-type novolac resin (A-1). The xylenol-type novolac resin (A-1) is synthesized by polycondensing an aldehyde compound with a xylenol compound.

Abstract: The invention relates to a photosensitive polysiloxane composition and a thin film formed by the aforementioned photosensitive polysiloxane composition. The thin film is a planarization film of a TFT substrate, an interlayer insulating film or an overcoat of a core material or a protective material in a waveguide. The photosensitive polysiloxane composition has excellent chemical resistance. The photosensitive polysiloxane composition comprises a polysiloxane (A), an o-naphthoquinone diazide sulfonic acid ester (B), a thermal base generator (C) and a solvent (D).

Abstract: Polymers, methods of use thereof, and methods of decomposition thereof, are provided. One exemplary polymer, among others, includes, a photodefinable polymer having a sacrificial polymer and a photoinitiator.

Abstract: A resist top coat composition includes a polymer including a base resin having a repeating unit p of styrene having a 1,1,1,3,3,3-hexafluoro-2-propanol group and a repeating unit q of acenaphthylene having chemical formula 1. R is hydrogen, hydroxyl. R1 is hydrogen, hydroxyl, linear or branched C1-C10-alkyl, cycloalkyl, acyloxy, alkoxycarbonyl, carboxyl, —OC(?O)R2. R2 is linear or branched C1-C10-alkyl, cycloalkyl or fluorinated alkyl. m is 1 or 2. p and q are positive numbers satisfying the expressions 0<p<1.0 and 0<q<1.0, and 0<p+q?1.0.

Abstract: Provided is a pattern forming method that is excellent in resolving power such as pre-bridging dimension, a roughness performance such as line edge roughness, and development time dependency, and an actinic-ray-sensitive or radiation-sensitive resin composition and a resist film used for the pattern forming method. The pattern forming method includes (1) forming a film using an actinic-ray-sensitive or radiation-sensitive resin composition that contains a resin (A) and a compound (B) which has a polymerizable group and generates an acid by being irradiated with actinic rays or radiations; (2) exposing the film; and (3) developing the exposed film using a developer that contains an organic solvent, wherein a pattern formed in this method is a negative pattern.

Abstract: Provided is an alkali-developable photosensitive resin composition, the dry coating film of which has a favorable dryness to touch, excellent storage stability and few substances that are harmful to humans. The alkali-developable resin composition comprising (A) a carboxyl group-containing resin, (B) a photopolymerization initiator, (C) a compound with two or more ethylenic unsaturated groups in the molecule, (D) filler and (E) an aromatic petroleum solvent, is characterized in that the naphthalene content of said composition is 300 ppm or less.

Abstract: The present invention relates to an isocyanate-modified photosensitive polyimide. The photosensitive polyimide of the invention possesses excellent heat resistance, chemistry resistance, and flexibility, and can be used as a liquid photo resist or dry film resist, or used in a solder resist, coverlay film, or printed wiring board.

Abstract: There is provided an actinic ray-sensitive or radiation-sensitive composition containing (?) a compound represented by the formula (?I) capable of generating an acid having a size of 200 ?3 or more in volume and (?) a compound capable of generating an acid upon irradiation with an actinic ray or radiation, and the formula (?I) is defined as herein, and a resist film formed using the actinic ray-sensitive or radiation-sensitive composition, a resist-coated mask blanks coated with the resist film, a resist pattern forming method comprising exposing the resist film and developing the exposed film, a photomask obtained by exposing and developing the resist-coated mask blanks, a method for manufacturing an electronic device, comprising the resist pattern forming method and an electronic device manufactured by the manufacturing method of an electronic device.

Abstract: The invention relates to a method for making a polymer wherein during the polymerization is incorporated in the polymer chain by ring opening polymerization a cyclic (alkyl)acryloyl carbonate having the formula (4): wherein R1 and R2 each independently are hydrogen, methyl or ethyl. Preferable the polymer is an (alkyl)acryloyl polycarbonate such that at least one first monomer a cyclic (alkyl)acryloyl carbonate having the formula (4). The (alkyl)acryloyl polyester may be modified and used in biodevices.

Abstract: The present invention provides a composition for forming a coating type BPSG film, which comprises: one or more structures comprising a silicic acid represented by the following general formula (1) as a skeletal structure, one or more structures comprising a phosphoric acid represented by the following general formula (2) as a skeletal structure and one or more structures comprising a boric acid represented by the following general formula (3) as a skeletal structure. There can be provided a composition for forming a coating type BPSG film which is excellent in adhesiveness in fine pattern, can be easily wet etched by a peeling solution which does not cause any damage to the semiconductor apparatus substrate, the coating type organic film or the CVD film mainly comprising carbon which are necessary in the patterning process, and can suppress generation of particles by forming it in the coating process.

Abstract: A photoresist composition containing (A) a polymer having a structural unit (I) that includes an acid-labile group, and (I) a compound represented by the following formula (1). In the following formula (1), R1, R2, R3 and R represent a hydrogen atom or a monovalent organic group having 1 to 20 carbon atoms. X represents a single bond, an oxygen atom or —NRa—. Ra represents a hydrogen atom, a hydroxy group or a monovalent organic group having 1 to 20 carbon atoms, and optionally taken together represents a ring structure by binding with R each other. A? represents —SO3? or —CO2?. M+ represents a monovalent onium cation.

Abstract: A photo-curable transfer sheet having a photo-curable transfer layer comprising a photo-curable composition, the photo-curable composition being deformable by application of pressure and containing a reactive polymer having a photopolymerizable functional group, wherein the photo-curable transfer layer shows linearity in relationship between strain [?] (%) and time [t] (second) measured by a creep test using a dynamic viscoelasticity measuring apparatus under the conditions of an ordinary temperature, stress of 50 Pa and a time period of 120 seconds, and satisfies a following formula: log ?=a+b·log t, in which “a” is a real number, and “b” is in the range of 0.10 to 0.53; and a process for the preparation of an optical information recording medium using the sheet and an optical information recording medium.

Abstract: Provided is an actinic-ray- or radiation-sensitive resin composition including (A) a resin that when acted on by an acid, is decomposed to thereby increase its alkali solubility, which resin comprises at least either any of repeating units (I) of general formula (I) below or any of repeating units (II) of general formula (II) below, (B) an onium salt acid generator that when exposed to actinic rays or radiation, generates a sulfonic acid whose volume ranges from 250 ?3 to less than 350 ?3, and (C) an onium salt acid generator that when exposed to actinic rays or radiation, generates a sulfonic acid whose volume is 400 ?3 or greater.