Post Image Treatment To Produce Elevated Pattern Patents (Class 430/325)
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Patent number: 12213371Abstract: A method of preparing organic functional layers of light-emitting device including: forming a plurality of holding portions in a pixel definition layer on a substrate; forming a plurality of ink droplets in the holding portions, the ink droplets including a first solvent, a second solvent and one or more solutes, a first saturated vapor pressure of the first solvent being higher than a second saturated vapor pressure of the second solvent, a solubility of the solutes in the first solvent being less than a solubility of the solutes in the second solvent, and a first affinity of lower parts of side walls of the holding portions for the first solvent is greater than a second affinity of the lower parts of the side walls of the holding portions for the second solvent; adjusting a vacuum degree of vacuum drying equipment to a first vacuum degree below the first saturated vapor pressure and above the second saturated vapor pressure to completely remove the first solvent; and adjusting the vacuum degree of the vacuuType: GrantFiled: March 22, 2021Date of Patent: January 28, 2025Assignees: Hefei BOE Joint Technology Co., Ltd., BOE Technology Group Co., Ltd.Inventors: Wenbin Jia, Kaihong Ma, Zhijie Ye
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Patent number: 12099299Abstract: A method for patterning a substrate in which a patterned photoresist structure can be formed on the substrate, the patterned photoresist structure having a sidewall. A conformal layer of spacer material can be deposited on the sidewall. The patterned photoresist structure can then be removed from the substrate, leaving behind the spacer material. Then, the substrate can be directionally etched using the sidewall spacer as an etch mask to form the substrate having a target critical dimension.Type: GrantFiled: July 18, 2023Date of Patent: September 24, 2024Assignee: Tokyo Electron LimitedInventors: Jodi Grzeskowiak, Anthony Schepis, Anton Devilliers
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Patent number: 12099297Abstract: An energy-sensitive composition including a polysilane, a base generator, and a solvent, the base generator including a compound represented by formula (b1) and a photo base generator: in which Rb1 to Rb3 each independently represents a hydrogen atom, halogen atom, hydroxyl group, mercapto group, sulfide group, silyl group, silanol group, nitro group, nitroso group, sulfonato group, phosphino group, phosphinyl group, phosphonato group or organic group; Rb4 and Rb5 each independently represent a hydrogen atom, halogen atom, hydroxyl group, mercapto group, sulfide group, silyl group, silanol group, nitro group, nitroso group, sulfino group, sulfo group, sulfonato group, phosphino group, phosphinyl group, phosphono group, phosphonato group or aliphatic group; and Rb6 represents a hydrogen atom, alkyl group or alkoxy group.Type: GrantFiled: October 26, 2021Date of Patent: September 24, 2024Assignees: TOKYO OHKA KOGYO CO., LTD., Tokyo University of Science FoundationInventors: Kunihiro Noda, Dai Shiota, Koji Arimitsu
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Patent number: 12011874Abstract: A strain sensor can include a resistor, a first electrical contact at a first end of the resistor, and a second electrical contact at a second end of the resistor. The resistor can be formed of a matrix of sintered elemental transition metal particles interlocked with a matrix of fused thermoplastic polymer particles.Type: GrantFiled: July 15, 2021Date of Patent: June 18, 2024Assignee: Hewlett-Packard Development Company, L.P.Inventors: Sterling Chaffins, Kevin P. Dekam, Cassady Sparks Roop
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Patent number: 11981075Abstract: A 3-dimensional printed part can include a part body including a first matrix of fusing agent and thermoplastic polymer powder, a security feature including a second matrix of fusing agent, thermoplastic polymer powder, and photoluminescent agent, and a masking feature including a third matrix of fusing agent and thermoplastic polymer powder. The security feature can be positioned beneath and visible through the masking feature upon photoluminescent emission of the security feature.Type: GrantFiled: August 19, 2022Date of Patent: May 14, 2024Assignee: Hewlett-Packard Development Company, L.P.Inventors: Garry Hinch, Kevin P. DeKam, Sterling Chaffins, James William Stasiak
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Patent number: 11846884Abstract: A chemically amplified resist composition is provided comprising an acid generator and a quencher comprising a salt compound consisting of a nitrogen-containing cation and a 1,1,1,3,3,3-hexafluoro-2-propoxide anion having a trifluoromethyl, hydrocarbylcarbonyl or hydrocarbyloxycarbonyl group bonded thereto. The resist composition has a high sensitivity and forms a pattern with improved LWR or CDU, independent of whether it is of positive or negative tone.Type: GrantFiled: June 16, 2021Date of Patent: December 19, 2023Assignee: SHIN-ETSU CHEMICAL CO., LTD.Inventors: Jun Hatakeyama, Takeshi Nagata, Chuanwen Lin
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Patent number: 11833747Abstract: Methods for manufacturing articles of footwear are provided. In various aspects, the methods comprise utilizing additive manufacturing methods with foam particles. In some aspects, the disclosed methods comprise selectively depositing a binding material on foam particles in a target area such that the binding material coats at least a portion of defining surfaces of the foam particles with the binding material. The binding material is then cured to affix foam particles in the target area to one another. In various aspects, the disclosed methods can be used to manufacturer articles with sub-regions that differential levels of affixing between the foam particles, and thereby resulting in sub-regions with different properties such as density, resilience, and/or flexural modulus. This abstract is intended as a scanning tool for purposes of searching in the particular art and is not intended to be limiting of the present disclosure.Type: GrantFiled: July 9, 2021Date of Patent: December 5, 2023Assignee: NIKE, INC.Inventors: Jay Constantinou, Harleigh Doremus, Luis Folgar, Brandon Kvamme, Denis Schiller
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Patent number: 11800791Abstract: Provided is an organic electroluminescence device provided with a light absorber represented by Formula 1 below, and a light absorbing layer including the same. In Formula 1, Ar is pyrene, chrysene, or anthracene, and Y is a hydrogen atom or a substituent, and X is represented by any one of Formula 2-1 to 2-3 below.Type: GrantFiled: October 12, 2021Date of Patent: October 24, 2023Assignee: Samsung Display Co., Ltd.Inventors: Sanghyun Han, Wonmin Yun, Jongwoo Kim, Jangyeol Baek, Eunjae Jeong, Yohan Kim, Yisu Kim, Youngkook Kim, Seokhwan Hwang
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Patent number: 11761906Abstract: An optical device is provided. The optical device includes: a light source; a pinhole plate arranged on a path of input light between the light source and an objective lens; an image sensor configured to detect a reflected light generated by the input light being reflected by a sample; and a noise filter arranged on the path of the reflected light between the image sensor and the objective lens, and the noise filter may remove a part of the reflected light generated by underlying layers below a measurement target layer of the sample.Type: GrantFiled: January 7, 2022Date of Patent: September 19, 2023Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Yasuhiro Hidaka, Mitsunori Numata
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Patent number: 11732072Abstract: A neutral layer composition and a neutral layer formed from the same are disclosed herein. In some embodiments, a neutral layer composition includes a random copolymer having a unit represented by Formula 1, and a unit containing an aromatic structure having one or more halogen atoms, wherein the molar amount of the unit represented by Formula 1 is present in a range of 9 mol % to 32 mol %, based on the total molar amount of the copolymer. The neutral layer can effectively control orientation characteristics of various block copolymers deposited thereon.Type: GrantFiled: July 16, 2018Date of Patent: August 22, 2023Inventors: Se Jin Ku, Mi Sook Lee, Na Na Kang, Eung Chang Lee, Sung Soo Yoon, No Jin Park, Je Gwon Lee, Eun Young Choi, Hyung Ju Ryu, Yoon Hyung Hur
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Patent number: 11733611Abstract: An object of the present invention is to provide a pattern forming method which is excellent in developability and defect suppression performance. Another object of the present invention is to provide a method for producing an electronic device including the pattern forming method. Still another object of the present invention is to provide a kit capable of forming a pattern which is excellent in developability and defect suppression performance.Type: GrantFiled: March 29, 2019Date of Patent: August 22, 2023Assignee: FUJIFILM CorporationInventor: Tetsuya Kamimura
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Patent number: 11720026Abstract: A developing treatment method performs a developing treatment on a resist film on a substrate. The method includes: a pattern forming step of forming a resist pattern by supplying a developing solution to the substrate and developing the resist film on the substrate; a coating step of coating the developed substrate with an aqueous solution of a water-soluble polymer; and a rinse step of cleaning the substrate by supplying a rinse solution to the substrate coated with the aqueous solution of the water-soluble polymer.Type: GrantFiled: December 15, 2017Date of Patent: August 8, 2023Assignee: Tokyo Electron LimitedInventors: Akiko Kai, Kousuke Yoshihara, Kouichirou Tanaka, Hiroshi Ichinomiya
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Patent number: 11644753Abstract: A resist composition is provided comprising a base polymer and a quencher comprising a salt compound consisting of a cyclic ammonium cation and a 1,1,1,3,3,3-hexafluoro-2-propoxide anion having a trifluoromethyl, hydrocarbylcarbonyl or hydrocarbyloxycarbonyl group bonded thereto. The resist composition has a high sensitivity and forms a pattern with improved LWR or CDU, independent of whether it is of positive or negative tone.Type: GrantFiled: March 25, 2021Date of Patent: May 9, 2023Assignee: SHIN-ETSU CHEMICAL CO., LTD.Inventor: Jun Hatakeyama
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Patent number: 11531268Abstract: The present invention provides a positive photoresist composition having excellent storage stability, sensitivity, developing properties, plating resistance, and heat resistance. More specifically, a specific dissolution inhibitor in the form of an oligomer having the same repeating unit structure as the resin contained in the photoresist composition is applied to said composition.Type: GrantFiled: July 25, 2018Date of Patent: December 20, 2022Assignee: LG CHEM, LTD.Inventors: Min Young Lim, Tae Seob Lee, Ji Hye Kim
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Patent number: 11531271Abstract: A method for lithography patterning includes forming a first layer over a substrate, the first layer being radiation-sensitive, exposing the first layer to a radiation, mixing a first solution and a second solution, thereby forming a developer, and dispensing the developer to the exposed first layer to form a pattern over the substrate. The dispensing of the developer includes varying a concentration of a developing chemical in the developer in multiple stages, such that the concentration of the developing chemical in the developer increases from a first stage to a subsequent second stage, and increases from the second stage to a subsequent third stage real-time during the dispensing.Type: GrantFiled: March 2, 2021Date of Patent: December 20, 2022Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventor: Chung-Cheng Wang
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Patent number: 11511479Abstract: A device includes a carriage movable relative to a build pad along a bi-directional travel path and supporting at least a radiation source and an applicator to selectively apply a plurality of fluid agents, including first fluid agents to affect a first material property. A timing and order of operation of the radiation source and the applicator, with the carriage, is to maintain first and second portions of a 3D object under formation within at least one selectable temperature range despite a first total volume of the first fluid agents for application onto the first portion of the 3D object being substantially greater than a second total volume of second fluid agents for application onto the second portion of the 3D object.Type: GrantFiled: July 10, 2017Date of Patent: November 29, 2022Assignee: Hewlett-Packard Development Company, L.P.Inventors: Aja Hartman, Adekunle Olubummo, Kristopher J. Erickson, Lihua Zhao, Howard S. Tom
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Patent number: 11480878Abstract: In one preferred embodiment, polymers are provided that comprise a structure of the following Formula (I): Photoresists that comprises such polymers also are provided.Type: GrantFiled: August 31, 2016Date of Patent: October 25, 2022Assignee: ROHM AND HAAS ELECTRONIC MATERIALS KOREA LTD.Inventors: Eui Hyun Ryu, Min Kyung Jang, Jung Woo Kim, Kwang-Mo Choi, Hyun Jeon, Woo-Hyung Lee, Myung-Yeol Kim
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Patent number: 11460774Abstract: A photosensitive resin composition comprising a polymer containing a silphenylene skeleton and a fluorene skeleton and having a crosslinkable site in the molecule, a phenol compound having a Mw of 300-10,000, a photoacid generator, and a benzotriazole or imidazole compound has improved film properties. Even from a thick film, a fine size pattern can be formed.Type: GrantFiled: December 17, 2019Date of Patent: October 4, 2022Assignee: SHIN-ETSU CHEMICAL CO., LTD.Inventors: Yoshinori Hirano, Michihiro Sugo, Satoshi Asai, Takahiro Goi
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Patent number: 11453617Abstract: The invention relates to a water-based ceramic three-dimensional laminate material and a method for using the same material to manufacture the ceramic objects, comprising: a step Sa of preparing a plurality of projected slice graphics and a slurry, wherein the projected slice graphics are formed by slicing a three-dimensional image along a specific direction with a specific thickness, the slurry is prepared by mixing the material powder, the photo-curing resin, the solvent and the additive; a step Sb of uniformly laying the slurry on the substrate to form a sacrificial layer; and a step Sc of uniformly laying the slurry on the slurry to form a reaction layer on the sacrificial layer; a step Sd of irradiating the reaction layer with a light beam according to one of the plurality of projected slice graphics, and the slurry is cured after being irradiated; a step Se of repeating steps Sc and Sd until a ceramic body is formed; a step Sf of washing the ceramic body with water or an organic solvent; and a step Sg oType: GrantFiled: May 6, 2019Date of Patent: September 27, 2022Assignee: FRANZ COLLECTION INC.Inventors: Chun-Jung Yen, Feng-Ming Yen, Ching-Hsing Chang, Chun-Yen Tung, Shih-Wei Cheng
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Patent number: 11429024Abstract: The radiation-sensitive resin composition contains: a polymer having a structural unit that includes an acid-labile group; and a compound represented by formula (1). In the formula (1), Ar1 represents a group obtained by removing (m+n+2) hydrogen atoms from an aromatic ring of an arene having 6 to 30 carbon atoms; —OH and —COO— are bonded at ortho positions to each other on a same benzene ring on Ar1; and RG represents a group represented by formula (V-1), a group represented by formula (V-2), a group including a lactone structure, a group including a cyclic carbonate structure, a group including a sultone structure, a group including a ketonic carbonyl group, a group including a thiocarbonate group, or a group including a group represented by formula (V-3), or the like.Type: GrantFiled: June 5, 2020Date of Patent: August 30, 2022Assignee: JSR CORPORATIONInventors: Ryuichi Nemoto, Tsuyoshi Furukawa
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Patent number: 11340527Abstract: A resist composition containing: (A) a resin containing a repeating unit having an acid-labile group and not containing a repeating unit having an aromatic substituent; (B) a photo-acid generator shown by a general formula (B-1); and (C) a solvent, where W1 represents a cyclic divalent hydrocarbon group having 4 to 12 carbon atoms and containing a heteroatom; W2 represents a cyclic monovalent hydrocarbon group having 4 to 14 carbon atoms and not containing a heteroatom; Rf represents a divalent organic group shown by the following general formula; and M+ represents an onium cation. This provides a resist composition and a patterning process that uses the resist composition that show a particularly favorable mask dimension dependency (mask error factor: MEF), LWR, and critical dimension uniformity (CDU) particularly in photolithography where a high-energy beam such as an ArF excimer laser beam is used as a light source.Type: GrantFiled: October 28, 2020Date of Patent: May 24, 2022Assignee: SHIN-ETSU CHEMICAL CO., LTD.Inventors: Teppei Adachi, Shinya Yamashita, Masaki Ohashi, Takayuki Fujiwara
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Patent number: 11312877Abstract: The present disclosure is drawn to fluid sets, material sets, and 3-dimensional printing systems. A fluid set can include a pretreat composition that includes a salt of an alkali metal with bromide or iodide. The fluid set can also include a conductive fusing agent composition including a transition metal for fusing thermoplastic powder when exposed to electromagnetic radiation.Type: GrantFiled: October 25, 2016Date of Patent: April 26, 2022Assignee: Hewlett-Packard Development Company, L.P.Inventors: Sterling Chaffins, Kevin P. Dekam
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Patent number: 11276584Abstract: A method for producing a glass substrate according to the present invention includes the steps of: (I) forming a through hole (11) in a glass sheet (10); (II) forming a resin layer (20) on a first principal surface of the glass sheet (10) using a resin composition sensitive to light having a predetermined wavelength ?1; (III) photoexposing an area of the resin layer (20) that covers the through hole (11) by irradiating the area with light U having the wavelength ?1 and applied from the direction of a second principal surface of the glass sheet (10); and (IV) forming a through-resin hole (21) by removing the area photoexposed in the step (III). The glass sheet (10) protects the resin layer (20) from the light U so as to prevent the resin layer (20) from being photoexposed by beams of the light U that are incident on the second principal surface of the glass sheet (10) in the step (III).Type: GrantFiled: August 6, 2019Date of Patent: March 15, 2022Assignee: NIPPON SHEET GLASS COMPANY, LIMITEDInventors: Keiji Tsunetomo, Hideki Hashizume, Kazuya Ohkawa
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Patent number: 11249396Abstract: A resist underlayer composition includes a polymer including a structural unit represented by Chemical Formula 1; and a solvent and a method of forming patterns using the resist underlayer composition: In Chemical Formula 1, at least one of A1 and A2 is a group represented by Chemical Formula A:Type: GrantFiled: February 12, 2020Date of Patent: February 15, 2022Assignee: Samsung SDI Co., Ltd.Inventors: Hyeon Park, Yoojeong Choi, Soonhyung Kwon, Shinhyo Bae, Jaeyeol Baek
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Patent number: 11204554Abstract: Oxime ester compounds of the formula I, II, III, IV or V wherein Z is for example Z1 for is NO2, unsubstituted or substituted C7-C20 aroyl or unsubstituted or substituted C4-C20heteroaroyl; provided that at least one Z1 is other than NO2; Z2 is for example unsubstituted or substituted C7-C20aroyl; R1, R2, R3, R4, R5 and R6 for example are hydrogen, halogen, or unsubstituted or substituted C1-C20alkyl, unsubstituted or substituted C6-C20aryl, or unsubstituted or substituted C4-C20heteroaryl; R9, R10, R11, R12 and R13 for example are hydrogen, halogen, OR16, unsubstituted or substituted C1-C20alkyl; provided that R9 and R13 are neither hydrogen nor fluorine; R14 is for example unsubstituted or substituted C6-C20aryl or C3-C20heteroaryl Q is for example C6-C20arylene or C3-C20heteroarylene; Q1 is —C1-C20alkylene-CO—; Q2 is naphthoylene; Q3 is for example phenylene; L is for example O-alkylene-O—; R15 is for example hydrogen or C1-C20alkyl; R20 is for example hydrogen, or unsubstituted or substituted C1Type: GrantFiled: September 9, 2019Date of Patent: December 21, 2021Inventors: Yuichi Nishimae, Hisatoshi Kura, Kazuhiko Kunimoto, Ryuhei Yamagami, Keita Tanaka
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Patent number: 11187985Abstract: The present invention relates to a method of reducing the LWR (Line Width Roughness) of a photoresist pattern using a negative tone photoresist during the fabrication of a semiconductor, and more specifically to a composition capable of reducing LWR in order to ensure a higher pattern CDU after a negative tone development process, and a processing method using the composition, thus reducing the LWR, thereby providing better CDU than existing methods.Type: GrantFiled: April 26, 2017Date of Patent: November 30, 2021Assignee: YOUNG CHANG CHEMICAL CO., LTDInventors: Su Jin Lee, Gi Hong Kim, Seung Hun Lee, Seung Hyun Lee
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Patent number: 11169444Abstract: The present invention relates to a method of reducing the LWR (Line Width Roughness) of a photoresist pattern using a negative tone photoresist during the fabrication of a semiconductor, and more specifically to a composition capable of reducing LWR in order to ensure a higher pattern CDU after a negative tone development process, and a processing method using the composition, thus reducing the LWR, thereby providing better CDU than existing methods.Type: GrantFiled: April 26, 2017Date of Patent: November 9, 2021Assignee: YOUNG CHANG CHEMICAL CO., LTDInventors: Su Jin Lee, Gi Hong Kim, Seung Hun Lee, Seung Hyun Lee
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Patent number: 11158809Abstract: Provided is an organic electroluminescence device provided with a light absorber represented by Formula 1 below, and a light absorbing layer including the same. In Formula 1, Ar is pyrene, chrysene, or anthracene, and Y is a hydrogen atom or a substituent, and X is represented by any one of Formula 2-1 to 2-3 below.Type: GrantFiled: October 31, 2018Date of Patent: October 26, 2021Assignee: Samsung Display Co., Ltd.Inventors: Sanghyun Han, Wonmin Yun, Jongwoo Kim, Jangyeol Baek, Eunjae Jeong, Yohan Kim, Yisu Kim, Youngkook Kim, Seokhwan Hwang
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Patent number: 11014293Abstract: Methods, processes, and systems for the manufacture of three-dimensional articles made of polymers using 3D printing are provided. A layer of high performance polymer can be deposited on a build plate to form a powder bed. Then, a solution of a photothermal dye can be printed on the powder bed in a predetermined pattern. Alternatively, the photothermal dye can be added to the entire powder bed. Electromagnetic radiation can be applied, either to the entire bed or in a predetermined pattern, to form the final polymer. After a predetermined period of time, sequential layers are printed to provide the three-dimensional article. The three-dimensional object can be cured to produce the three-dimensional article composed of the final polymers.Type: GrantFiled: March 8, 2018Date of Patent: May 25, 2021Assignees: Ricoh Co., Ltd., University of WashingtonInventors: Chang-Uk Lee, Andrew J. Boydston, Mark A. Ganter, Duane W. Storti
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Patent number: 10985320Abstract: The present disclosure provides an organic transistor and a manufacturing method thereof, an array substrate, and a display device. The method for manufacturing the organic transistor includes: applying a photoresist on a side of an organic insulating layer; patterning the photoresist to form a confinement well; adding a solution of an organic semiconductor material and an orthogonal solvent to the confinement well; volatilizing the orthogonal solvent by an annealing process to induce directional growth of single crystal of the organic semiconductor material in the confinement well, thereby obtaining an organic single crystal layer; and removing remaining photoresist and using the organic single crystal layer as an active layer. The embodiment of the present disclosure produces an organic single crystal in a flexible display device at a low temperature, and the organic single crystal can be used as an active layer, resulting in an organic transistor having high mobility and stability.Type: GrantFiled: December 26, 2018Date of Patent: April 20, 2021Assignees: HEFEI BOE DISPLAY TECHNOLOGY CO., LTD., BOE TECHNOLOGY GROUP CO., LTD.Inventors: Ji Zhang, Weiwei Hu, Liang Chen, Jincheng Gao, Guanbao Hui
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Patent number: 10976675Abstract: A lithographic apparatus having a substrate table, a projection system, an encoder system, a measurement frame and a measurement system. The substrate table has a holding surface for holding a substrate. The projection system is for projecting an image on the substrate. The encoder system is for providing a signal representative of a position of the substrate table. The measurement system is for measuring a property of the lithographic apparatus. The holding surface is along a plane. The projection system is at a first side of the plane. The measurement frame is arranged to support at least part of the encoder system and at least part of the measurement system at a second side of the plane different from the first side.Type: GrantFiled: January 28, 2020Date of Patent: April 13, 2021Assignee: ASML Netherlands B.V.Inventors: Hans Butler, Engelbertus Antonius Fransiscus Van Der Pasch, Paul Corné Henri De Wit
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Patent number: 10890847Abstract: A pattern forming method includes, in this order, forming a film on a substrate, using an active-light-sensitive or radiation-sensitive resin composition containing a resin (A) which has a repeating unit having a phenolic hydroxyl group, and a repeating unit having a group that decomposes by the action of an acid to generate a carboxyl group, and a compound (B) that generates an acid upon irradiation with active light or radiation; exposing the film; and developing the exposed film using a developer including an organic solvent, in which the developer including an organic solvent contains an organic solvent having 8 or more carbon atoms and 2 or less heteroatoms in the amount of 50% by mass or more.Type: GrantFiled: November 22, 2016Date of Patent: January 12, 2021Assignee: FUJIFILM CorporationInventors: Toru Tsuchihashi, Wataru Nihashi, Hideaki Tsubaki
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Patent number: 10879067Abstract: In one embodiment, a pattern forming method includes forming a first film on a substrate. The method further includes supplying energy to the first film to form a first region to which the energy have been supplied, and a second region including at least a region to which the energy has not been supplied. The method further includes impregnating at least the first region out of the first and second region with metal atoms. The method further includes developing the first film after impregnating the first region with the metal atoms to remove the second region while leaving the first region.Type: GrantFiled: February 21, 2019Date of Patent: December 29, 2020Assignee: Toshiba Memory CorporationInventors: Seiji Morita, Takashi Sato, Ryosuke Yamamoto
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Patent number: 10864676Abstract: Methods for manufacturing articles of footwear are provided. In various aspects, the methods comprise utilizing additive manufacturing methods with foam particles. In some aspects, the disclosed methods comprise selectively depositing a binding material on foam particles in a target area such that the binding material coats at least a portion of defining surfaces of the foam particles with the binding material. The binding material is then cured to affix foam particles in the target area to one another. In various aspects, the disclosed methods can be used to manufacturer articles with sub-regions that differential levels of affixing between the foam particles, and thereby resulting in sub-regions with different properties such as density, resilience, and/or flexural modulus. This abstract is intended as a scanning tool for purposes of searching in the particular art and is not intended to be limiting of the present disclosure.Type: GrantFiled: June 1, 2018Date of Patent: December 15, 2020Assignee: Nike, Inc.Inventors: Jay Constantinou, Harleigh Doremus, Luis Folgar, Brandon Kvamme, Denis Schiller
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Patent number: 10717232Abstract: The present disclosure is drawn to material sets for 3-dimensional printing, 3-dimensional printing systems, and 3-dimensional printed parts. A material set can include a polyamide polymer powder having an average particle size from 20 ?m to 120 ?m and a fusing agent. The polyamide-11 can have a solution viscosity from 1.5 to 1.75 at room temperature, and may increase by no more than 5% after exposure to 180° C. for 20 hours. The fusing agent can include an energy absorber capable of absorbing electromagnetic radiation to produce heat.Type: GrantFiled: May 13, 2016Date of Patent: July 21, 2020Assignee: Hewlett-Packard Development Company, L.P.Inventors: Yi Feng, Erica Montei Fung, Michael A. Novick
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Patent number: 10634821Abstract: This invention is related to a method of manufacturing an anti-glare cover. The method includes preparing a crosslinking precursor solution, wherein the precursor solution is an organic solution with crosslinkable polymer monomer and crosslinking initiator; applying the crosslinking precursor solution on a cover to form a crosslinking precursor layer; pre-crosslinking and crosslinking the crosslinking precursor layer to form a mesh crosslinked layer; etching the cover with acid solution and the mesh crosslinked layer acting as a hard mask to form an anti-glare microstructure on the cover; and removing the mesh crosslinked layer.Type: GrantFiled: November 14, 2017Date of Patent: April 28, 2020Assignee: WUHAN CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD.Inventor: Yong Yang
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Patent number: 10613435Abstract: A coating solution has a polymer having a formula (1) structural unit, a formula (2) primary, secondary, or tertiary amine, and a formula (3) ester capable of dissolving the polymer and amine: R1 is a hydrogen atom or methyl group. L is a divalent aromatic group optionally having at least one substituent, —C(?O)—O— group, or —C(?O)—NH— group. The —C(?O)—O— or —C(?O)—NH— group carbon atom is attached to a polymer main chain. X is a hydrogen atom or linear or branched alkyl or alkoxy group having a 1-10 carbon atom number. At least one alkyl group hydrogen atom is optionally substituted with a halogen atom or hydroxy group. R2, R3, and R4 are independently a hydrogen atom, hydroxy group, or linear, branched, or cyclic organic group having a 1-16 carbon atom number. R5 and R6 are each independently a linear or branched organic group having a 1-16 carbon atom number.Type: GrantFiled: March 18, 2016Date of Patent: April 7, 2020Assignee: NISSAN CHEMICAL INDUSTRIES, LTD.Inventors: Tokio Nishita, Rikimaru Sakamoto
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Patent number: 10597793Abstract: The disclosure improves a position confirmation method for members in a plating tank. A plating apparatus for applying a plating process on a substrate is provided. The plating apparatus includes a plating tank, a first member disposed in the plating tank, a second member disposed opposite to the first member in the plating tank, an optical sensor disposed on one of the first and second members, and a plurality of detected parts disposed on the other of the first and second members to be detectable by the optical sensor.Type: GrantFiled: May 3, 2018Date of Patent: March 24, 2020Assignee: EBARA CORPORATIONInventor: Naoto Takahashi
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Patent number: 10451974Abstract: The present invention relates to a new rinse composition, the forming of resist patterns using the rinse composition, and a semiconductor device manufacturing method using the rinse composition in a photolithography method.Type: GrantFiled: June 19, 2017Date of Patent: October 22, 2019Assignee: AZ Electronic Materials (Luxembourg) S.a.r.l.Inventors: Kazuma Yamamoto, Yuriko Matsuura, Tomoyasu Yashima, Tatsuro Nagahara
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Patent number: 10438822Abstract: A method and a device for prefixing substrates, whereby at least one substrate surface of the substrates is amorphized in at least one surface area, characterized in that the substrates are aligned and then make contact and are prefixed on the amorphized surface areas.Type: GrantFiled: March 6, 2019Date of Patent: October 8, 2019Assignee: EV Group E. Thallner GmbHInventor: Friedrich Paul Lindner
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Patent number: 10437146Abstract: A method for forming a 3D pattern structure on a 3D substrate and a device having color resist pattern is disclosed. The disclosure uses the fitting aids to apply pressure on the thin-film mask to paste on the 3D substrate. After the template device had formed, send the template device to the exposure machine, and then the high resolution photo-resist pattern is made on the 3D substrate. After a Lift-off procedure, the thin-film pattern is formed and the photo-resist is removed.Type: GrantFiled: December 30, 2016Date of Patent: October 8, 2019Inventor: Ming-An Hsu
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Patent number: 10401727Abstract: A resist composition including a polymeric compound having 0 to 20 mol % of a structural unit containing a polar group-containing aliphatic hydrocarbon group, and an acid generator compound represented by general formula (b1-1) in which R101 represents a hydrocarbon group having at least 1 hydroxy group as a substituent; Y101 represents a single bond or a divalent linking group containing an oxygen atom; V101 represents a single bond, an alkylene group or a fluorinated alkylene group; R102 represents a fluorine atom or a fluorinated alkyl group of 1 to 5 carbon atoms; M?m+ represents an organic cation having a valency of m.Type: GrantFiled: September 6, 2017Date of Patent: September 3, 2019Assignee: TOKYO OHKA KOGYO CO., LTD.Inventors: Takashi Nagamine, Tsuyoshi Nakamura
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Patent number: 10386723Abstract: A method for lithography patterning includes forming a first layer over a substrate, the first layer being radiation-sensitive. The method further includes exposing the first layer to a radiation. The method further includes applying a developer to the exposed first layer, resulting in a pattern over the substrate, wherein the developer includes a developing chemical whose concentration in the developer is a function of time during the applying of the developer.Type: GrantFiled: March 4, 2016Date of Patent: August 20, 2019Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventor: Chung-Cheng Wang
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Patent number: 10353288Abstract: A litho-litho-etch double patterning method including forming a resist layer by coating a substrate with a resist composition; exposing the resist layer to a first radiant energy density of UV rays; forming a first pattern in the resist layer by developing the resist layer with a positive developer; exposing the resist layer to a second radiant energy density of UV rays; and forming a second pattern in the resist layer by developing the resist layer with a negative developer, the second pattern including one or more features of the first pattern.Type: GrantFiled: November 28, 2017Date of Patent: July 16, 2019Assignee: GLOBALFOUNDRIES INC.Inventors: Vineet Sharma, Sohan S. Mehta, Craig D. Higgins, Sunil K. Singh, Feng Wang
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Patent number: 10345718Abstract: In a pattern forming method, a resist layer disposed on a wafer is exposed by an energy beam. A post-exposure-bake (PEB) is performed on the wafer with the exposed resist layer by using a PEB apparatus. After the PEB, the exposed resist layer is developed, thereby forming a resist pattern. The PEB apparatus includes a baking plate, and the wafer is placed on the baking plate for the PEB when a temperature of the wafer is within a predetermined temperature range.Type: GrantFiled: May 17, 2017Date of Patent: July 9, 2019Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Chung-Cheng Wang, Chun-Kuang Chen, Chia-Cheng Chao
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Patent number: 10340161Abstract: A method and a device for prefixing substrates, whereby at least one substrate surface of the substrates is amorphized in at least one surface area, characterized in that the substrates are aligned and then make contact and are prefixed on the amorphized surface areas.Type: GrantFiled: December 23, 2014Date of Patent: July 2, 2019Assignee: EV Group E. Thallner GmbHInventor: Friedrich Paul Lindner
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Patent number: 10332751Abstract: A monomer, an organic layer composition including the monomer, an organic layer, and a method of forming patterns, the monomer being represented by Chemical Formula 1:Type: GrantFiled: December 28, 2015Date of Patent: June 25, 2019Assignee: Samsung SDI Co., Ltd.Inventors: Yoo-Jeong Choi, Yun-Jun Kim, Yu-Shin Park, You-Jung Park, Hyun-Ji Song
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Patent number: 10325813Abstract: A method for manufacturing a semiconductor device includes providing a substrate structure including a substrate, semiconductor fins extending in a first direction on the substrate, a hardmask layer on the semiconductor fins, and an isolation region surrounding the semiconductor fins and having an upper surface flush with the hardmask layer, the isolation region including a first region on a side of the semiconductor fins in the first direction and a second region on a side of the semiconductor fins in a second direction different from the first direction. The method also includes removing the hardmask layer, etching a portion of the first region above the semiconductor fins, forming a mask layer on the semiconductor fins and a remaining first region, etching the second region such that an upper surface of the remaining second region is lower than an upper surface of the semiconductor fins, and removing the mask layer.Type: GrantFiled: October 9, 2017Date of Patent: June 18, 2019Assignees: SEMICONDUCTOR MANUFACTURING INTERNATIONAL (SHANGHAI) CORPORATION, SEMICONDUCTOR MANUFACTURING INTERNATIONAL (BEIJING) CORPORATIONInventors: Hai Yang Zhang, Fangyuan Xiao, Yan Wang
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Patent number: 10303054Abstract: A photosensitive resin composition includes a binder resin, a black colorant, a photopolymerizable monomer, a photopolymerization initiator, and a solvent. The binder resin includes a first binder resin having a glass transition temperature of about ?50° C. to about 150° C. and a second binder resin having a glass transition temperature of greater than about 150° C.Type: GrantFiled: January 17, 2017Date of Patent: May 28, 2019Assignee: Samsung SDI Co., Ltd.Inventors: Sang Soo Kim, Jinhee Kang, Heekyoung Kang, Chang-Hyun Kwon, Jiyun Kwon, Chanwoo Kim, Bumjin Lee, Junho Lee, Chungbeum Hong
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Patent number: 10274847Abstract: A photo-sensitive layer is applied over a wafer. The photo-sensitive layer is exposed. In some embodiments, the photo-sensitive layer is exposed to EUV light. The photo-sensitive layer is baked. The photo-sensitive layer is developed. Humidity is introduced in at least one of: the applying, the baking, or the developing.Type: GrantFiled: September 19, 2017Date of Patent: April 30, 2019Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: An-Ren Zi, Chin-Hsiang Lin, Ching-Yu Chang, Joy Cheng