Abstract: Disclosed herein is a method of forming a thin film pattern on a semiconductor substrate, which comprises a step of forming a photosensitive thin film on a semiconductor substrate, a step of exposing the photosensitive thin film with a fine pattern, a step of performing ultrasonic treatment on the exposed thin film, and a step of developing the ultrasonic-treated thin film for forming a fine pattern.

Abstract: A substantially dry method for making an optical waveguide device with at least one buried channel waveguide in a laminated and hardened matrix. The method begins with exposing to light a region of a substantially dry photohardenable film adhered to a support. Then a first substantially dry photohardenable layer which is adhered to a support is laminated to one side of the film. Then the support is removed from the film. Then a second substantially dry photohardenable layer which is adhered to a support is laminated to the other side of the film. Then the layers and film are hardened.

Abstract: In the preparation of a ink jet recording head by coating positive photoresist containing naphthoquinone diazide on a substrate, patterning the positive photoresist, then coating a photocurable material for liquid path formation, photocuring said material and dissolving the patterned photoresist thereby forming liquid paths, the patterned positive photoresist is subjected to flush exposure and degassing prior to the coating of the liquid path forming material in order to discharge the bubbles from the photoresist and to prevent eventual deformation of said material by the migrating bubbles generated from the positive photoresist.

Abstract: A negative resist pattern is formed using a resist containing a diazoquinone sensitizer. An imagewise exposed area of a layer of the resist is subjected to heat treatment with a water-containing heating medium in the presence of a carboxyl-inactivating agent. The entire surface of the layer is exposed to radiation. The thus-exposed surface is then treated with an alkaline developer solution. An apparatus suitable for use in the practice of the above process is also disclosed.

Abstract: In a manufacturing process for color filters wet-chemical fixing and cleaning steps, as well as the use of several (toxic) chemicals can be avoided by using a combined fixing and cleaning step with the aid of UV radiation in an ozonic atmosphere.

Abstract: A phase-shifting lithographic mask is made by a procedure involving only a single patterned electron, ion, or photon beam bombardment of a resist layer. The bombardment is arranged to produce three kinds of regions in the resist: no dosage, low dosage, and high dosage. These three regions in the resist are then utilized--in conjunction with an ordinary wet development step followed by either a silylation or an optical flooding technique, and thereafter by another ordinary wet development step--to pattern the resist layer and thereby to enable forming, by dry or wet etching, an underlying double layer consisting of a patterned opaque layer and a patterned transparent phase-shifting layer, the phase-shifting layer being located on, or being part of, a transparent substrate.

Abstract: A method of preparing a fine pattern on a substrate characterized by the dry development of a photoimaged, etch resistant pattern on a receiver substrate. The pattern is transferred from a carrier substrate to the receiver substrate via a hardenable liquid adhesive. This method eliminates adverse reflection effects caused from substrate topography in single layer photoresist systems and also avoids time consuming multiple coatings in multilayer photoresist systems used to make fine patterns. The method is particularly useful in the fabrication of integrated circuits and fine dimension patterns.

Abstract: Excellent resolution and sensitivity in the patterning of resists utilized in device and mask manufacture is obtained with a specific composition. In particular this composition involves polymers having recurring pendant acid labile .alpha.-alkoxyalkyl carboxylic acid ester and/or hydroxyaromatic ether moieties in the presence of a substance that is an acid generator upon exposure to actinic radiation.

Abstract: High resolution resist structures with steep edges are obtained using standard equipment, with high sensitivity, particularly in the deep UV range. A photoresist layer consisting of a polymer having anhydride groups and blocked imide- or phenolic hydroxyl groups and of a photoactive component which forms a strong acid during irradiation is first deposited on a substrate, followed by irradiation with a patterned image. The irradiated photoresist layer is then treated with a water-based or a water-alcohol-based solution of a polyfunctional amino- or hydroxy-siloxane, and is etched in an oxygen-containing plasma.

Abstract: A heat-developable photosensitive material is disclosed which has a support and provided thereon a photosensitive layer. The photosensitive layer contains at least an organic silver salt, a silver halide and a reducing agent represented by the formula (I). Also, an image forming method using the heat-developable photosensitive material is disclosed.

Abstract: A relatively large-sized square substrate for use in the production of a color filter for liquid crystal display, a color image sensor or the like is applied with a coating film of a viscous liquid such as a photosensitive resin. For producing the coating film, the substrate is placed with its surface extending horizontally and the viscous liquid is dropped on the surface in a line along an edge portion of the surface. Then, a squeezee rod is moved along the surface with a predetermined gap maintained between the squeezee rod and the surface, to spread the viscous liquid over at least a part of the surface, whereby a predetermined thickness of the spread viscous liquid is obtained. Thereafter, the substrate is spinned in the plane of the surface thereof to disperse the spread viscous liquid uniformly by centrifugal force over the entire surface of the substrate, whereby a thin coating of the liquid of a uniform thickness is formed on the surface of the substrate.

Abstract: Disclosed is a process for forming a resist pattern, which comprises coating a resist material on a film to be processed, to form a resist film, exposing the resist film to light of a predetermined pattern to form a latent image corresponding to the light pattern, and subjecting the resist film to a development treatment while irradiating the resist film with pulsating rays of the infrared wavelength region at a temperature lower than room temperature. According to this process, a malforming of the pattern due to a swelling of the resist at the development stage is prevented, and an excellent pattern having a high resolving power can be formed.

Abstract: A process for converting a normally positive working photosensitive composition to a negative working composition is disclosed. One forms a composition containing an alkali soluble resin, a 1,2 quinone diazide-4-sulfonyl compound and an acid catalyzed crosslinker in a solvent mixture. After drying and imagewise exposing, the composition is baked and developed to produce a negative image. The image-reversal negative-working photoresists of this invention have superior storage stability and shelf life.

Abstract: A method for evaluating a resist coating comprising the steps of: forming a first layer resist pattern including an alignment mark by applying a first resist on a semiconductor substrate and by exposing and developing said first resist, said first layer resist pattern having a ridge portion; irradiating said first layer resist pattern with a deep ultraviolet ray; applying, onto said irradiated first layer resist pattern, a second resist having substantially the same refractive index as said first resist to form a second resist coating; detecting said alignment mark formed in said first layer resist pattern, and relatively positioning a pattern for said second resist and said first layer resist pattern; and determining nonuniformity characteristics of said second resist coating by measuring an overlay accuracy between said first layer resist pattern and said pattern for said second resist.

Abstract: A process for transferring non-electroscopic, non-prolonged tack, UV curable toned images to an image receptor wherein said process produces images having substantially reduced back transfer is described.

Abstract: A water soluble built-on mask layer is provided on a photoresist composition disposed on a substrate. The photoresist comprises an o-quinone diazide and a novolak or paravinyl phenol resin. The built-on mask layer comprises a water soluble, photobleachable diazonium salt, a coupler for the diazonium salt and an acidic, polymeric, film forming resin such as polystyrene sulfonic acid.

Abstract: A process is disclosed for applying a preformed photopolymerizable solder mask film and a photosensitive liquid to a printed circuit substrate containing a plurality of holes wherein reduced failure is obtained in photopolymerized areas of the solder mask film above the holes as determined after a soldering operation. The photosensitive liquid contains at least one ethylenically unsaturated compound capable of forming a high polymer by addition polymerization and a first photoinitiator system which has an absorption maximum in a first spectral region. The preformed photopolymerizable film contains at least one ethylenically unsaturated compound capable of forming a high polymer by addition polymerization and a second photoinitiator system, such that the preformed photopolymerizable film has an absorption maximum in a second spectral region and is activated by actinic radiation therein and has an absorption minimum in the first spectral region and transmits actinic radiation therein.

Abstract: An improved process for preparing a printed-circuit board, which successively comprises (I) a step of forming a positive photo-sensitive resist film onto a circuit board having a conductive film according to the electrodeposition coating process, (II) a step of irradiating a full dose of an actinic ray onto the positive photo-sensitive resist film through a photomask with which the actinic ray is cut off over a conductive circuit-forming area, (III) a step of developing the resulting resist film, (IV) a step of etching away a deposited copper-clad area, and (V) removing a remaining resist film on the conductive circuit-forming area, the improvement further comprising a step of imparting the resist film in the conductive circuit-forming area an increased alkali resistance prior to development so as to obtain the printed-circuit board having high resolution with good reproductivity without being affected by variations of the developing conditions.

Abstract: The present invention relates to a multistep process for generating a positive tone photoresist image with dry development.

Abstract: High resolution resist structures with steep edges are obtained using standard equipment, even in cases involving critical contact-hole planes. First, a photoresist layer containing a polymer with chemically reactive groups and a photoactive component based on diazoketone or quinone diazide is deposited on a substrate. The photoresist layer is then irradiated with a patterned image and treated with a polyfunctional organic compound having functional groups that can chemically react with the reactive groups of the polymer. This step is followed by a maskless flood exposure. The photoresist layer irradiated in this manner is then treated with a metal-containing organic compound having at least one functional group capable of chemical reaction with the reactive groups of the polymer, followed by etching in an oxygen-containing plasma.

Abstract: A process for producing negative copies is disclosed in which a light-sensitive or radiation-sensitive recording material comprising a layer support and a normally positive-working light-sensitive or radiation-sensitive layer applied thereto is irradiated imagewise, thermally treated, irradiated overall and then developed with an alkaline developer. Thermal treatment is carried out with water or with an aqueous solution, at temperatures in the range from about 50.degree. to 100.degree. C., preferably from 60.degree. to 90.degree. C., within a period of time varying between about 1 second and 5 minutes, preferably between 5 seconds and 1 minute, overall irradiation is performed on the optionally still hot recording material and development is thereafter carried out within a period of time varying between about 10 seconds and 2 minutes, preferably between 15 seconds and 1 minute.

Abstract: A process for converting a normally positive working photosensitive composition to a negative working composition. One forms a composition containing an alkali soluble resin, a 1,2 quinone diazide-4-sulfonyl compound and an acid catalyzed crosslinker in a solvent mixture. After drying and imagewise exposing, the composition is baked and developed to produce a negative image.

Abstract: Negative-acting flexographic printing plates display enhanced performance when backside irradiated with ionizing radiation instead of longer wavelength ultraviolet radiation. A better defined floor and more readily controlled floor is produced on the final printing plate.

Abstract: A radiation-sensitive mixture is disclosed which contains as essential constituentsa) at least one thermoplastic, elastomeric block copolymer of the formulae(A-B).sub.m -A, (B-A).sub.m+a -B, (A-B).sub.m+1 or (A-B).sub.o Y,in whichA is a thermoplastic, nonelastomeric polymer block having a glass transition temperature of 25.degree. C. or above andB is an elastomeric polymer block having a glass transition temperature of 10.degree. C. or below,Y is Sn or Si,m is an integer from 1 to 10, ando is 2 if y is Sn, or 4 if y is Si,b) at least one ethylenically polyunsaturated compound, andc) a photopolymerization initiator,wherein at least one of the ethylenically polyunsaturated compounds corresponds to the formula I ##STR1## where R is a straight-chain or branched alkyl radical,X is a straight-chain alkylene or cycloalkylene, it being possible for individual methylene groups to be substituted by --O--, --S--, carbonyl or carbonyloxy groups, and n is 1 to 5.

Abstract: A method of forming a permselective layer on preselected areas of a substantially planar sensing device is disclosed. The claimed method includes establishing and confining a liquid film, derived from a silane compound mixed in a suitable solvent, within a predetermined area of the sensing device. The process relates to photolithographic imaging and developing methods coupled to a film-curing step that provides a patterned permselective layer having the desired semipermeable characteristics.

Abstract: A method of exposing a peripheral part of the wafer is used for a fine pattern formation process in the processing of ICs, LSIs and other electronic elements, to remove, in a development step, an unnecessary portion of a photoresist coated on a semiconductor substrate, typically a silicon wafer, or a substrate consisting of a dielectric, a metal or an insulator. A peripheral part of the wafer is exposed to light led by an optical fiber light guide. The same area is exposed to light at least twice in a predetermined time interval. The illumination intensity of light in a wavelength range necessary for the first exposure is set to be lower than that for the second and following exposures. In the first exposure, the wafer may be held in a heated state.

Abstract: Images are formed by the following process:(i) a substrate is treated with a layer of a liquid composition comprising(A) a residue that is polymerizable by means of free radicals, such as an acrylic ester,(B) a radiation-activated polymerization initiator for (A), such as a metallocene or a mixture of a Group IVA organometallic compound with a photoreducible dye.

Abstract: A light-sensitive transfer material is disclosed, which comprises a substantially transparent support; a physical development nucleus layer for diffusion transfer process using silver halide emulsion on one side of said support; and a release layer and, a color material layer containing a dye or a pigment and a photoresist layer, or a photoresist layer containing a dye or a pigment, sequentially on the side of said support opposite from said physical development nucleus layer. An image-forming method employing this light-sensitive transfer material is also disclosed.Further, a light-sensitive transfer material is disclosed, which comprises a substantially transparent support; a light-sensitive silver halide emulsion layer; and a release layer and, a color material layer containing a dye or a pigment and a photoresist layer, or a photoresist layer containing a dye or pigment, sequentially on the side of said support opposite from said physical development nucleus layer.

Abstract: A dry film for forming a solder mask includes a cover sheet, a photoimageable composition layer which is curable to form a solder mask and a top coat interposed between the cover sheet and the photoimageable composition layer which is selectively adherent to the photoimageable composition layer. The dry film is applied to a surface of a printed circuit board. With heat, vacuum and mechanical pressure, the photoimageable composition layer is laminated to the irregular surface of the printed circuit board, partially conforming the photoimageable composition layer to the contours thereof. Within about 60 seconds and with the photoimageable composition layer still heated, the cover sheet is peeled away, leaving the top coat as a protective covering over the photoimageable composition layer. Removal of the cover sheet allows the photoimageable composition layer to fully conform to the contours of the printed circuit board. Immediately thereafter, the circuit board is cooled to about ambient temperature or below.

Abstract: A process for selective metallization comprising the steps of providing a substrate coated with a photoresist, imaging the photoresist coating by exposure to pattern radiation and development, flood exposing the photoresist coating to activating radiation, depositing an electroless plating catalyst over the entire imaged photoresist coating and bared underlying substrate, removing the top surface of the flood exposed, catalyzed photoresist coating by development whereby plating catalyst remains in a desired selective pattern and depositing metal over the catalyzed surface to form a metal deposit in a selective pattern such as in a circuit pattern. The process is suitable for the manufacture of diverse articles including printed circuit boards.

Abstract: A process for producing images on a photosensitive material comprising a support and a normally positive-working photosensitive layer is disclosed. The photosensitive layer is activated by exposure to ultraviolet light and imaging is effected by means of thermal energy. A mixture comprising a compound containing at least one --C--O--C-- or --C--O--Si-- bond which can be split by acid and a compound forming a strong acid upon exposure is employed in the photosensitive layer and imaging in the activated region is carried out by means of laser or electron beams or with the aid of a thermal printer. The process of the invention is suitable for use with digital techniques and makes it possible, in a simple manner, to employ a combined procedure for imaging the photosensitive material (photocomposing).

Abstract: A method is provided for producing relief images having improved image fidelity and resolution. The method comprises positioning an image bearing negative transparency closely adjacent and substantially parallel to a layer of a photocurable material; positioning on the other side of the negative from the photocurable material and in substantially parallel relationship thereto at least one louver having a plurality of open cells, each cell extending through the louver along an axis perpendicular to the negative and having reflective side surfaces contoured to reflect and redirect rays of radiant energy incident thereon to a direction more normal to the negative surface; and passing radiant energy which is capable of curing the photocurable material through the louver and the negative and onto and through the photocurable material for a time sufficient to form a latent relief image in the photocurable material.

Abstract: The present invention provides a packaging semiconductor structure and method for obtaining same. The structure is comprised of at least one level of dielectric and metallurgy layers. The at least one level is comprised of a wiring metallurgy plane and a "through-via" plane of interconnecting metallurgy in association with both one and two layers of polymeric dielectric materials. The self-alignment method of fabrication of the level provides a streamlined technique wherein stringent masking and alignment requirements are relaxed, undue processing such as at least one polishing step is eliminated and a structure having adhesive integrity is fabricated.

Abstract: Photosensitive polyimides used in microelectronic structures are cross-linked without exposing the associated microelectronic structures to elevated temperatures that can lower the process yield and reduce the reliability of the microelectronic structures. The photosensitive polyimides are cured by exposing them to deep ultraviolet radiation that has a spectral output effective to crosslink the polyimide. The cross-linking hardens the polyimide and renders it insoluble in solvents such as photoresist strippers.

Abstract: A method of producing a substrate plate for a liquid crystal cell with black matrix areas in which blackened polymer material is already deposited before the structured areas of photosensitive resist overlying the structured electrode areas are removed. Rather, these structured areas of photosensitive resist are removed only after the blackened polymer material has been hardened.This processing sequence has the advantage that no special alignment processes are needed in order to arrange the black matrix areas accurately between the electrode areas.

Abstract: A flexographic printing plate which is resistant to ozone cracking and where the flexible recording layer has an anisotropy factor AF of <1.5 is produced from a photosensitive mixture consisting of A) one or more elastomeric binders,B) a mixture ofB1) from 5 to 20% by weight of one or more photopolymerizable organic compounds which are compatible with (A) and contain two or more olefinic double bonds andB2) from 1 to 15% by weight of one or more monoolefinically unsaturated organic compounds which are compatible with (A) and whose homopolymer has a glass transition temperature which is below room temperature,C) from 0.1 to 10% by weight of one or more photoinitiators andD) from 0 to 27% by weight of conventional assistants and additives,the anisotropy factor AF of the flexible recording layer being defined as the ratio of the moduli of elasticity at 100% elongation of strips measuring 2.times.

Abstract: A method of producing a light control plate which induces scattering of light at different angles of incidence for different places. The method comprises (1) preparing an assembly comprising a film of a photo-polymerizable composition and a light-pervious body having a light-impervious pattern arranged along the surface of the film, (2) irradiating light limitedly to the assembly from that side where the light-pervious body at a limited angle while moving the assembly continuously in the planar direction of the film thereby to polymerize at least part of the photopolymerizable film, the light being emitted from a first linear light source whose long axis is positioned in a direction crossing the moving direction of the assembly; and thereafter (3) polymerizing the photopolymerizable composition of that portion of the film-like molded article which is covered with the light-impervious pattern of the light-pervious body by light irradiation or heating.

Abstract: Method of recording information, recording element manufactured according to the method and method of producing a metal matrix.Recording in which a recording double layer which has an absorbing dye is exposed to laser light of a higher and a lower energy level, in which by exposure to laser light of the lower energy level, a bump is formed in the recording layer and in which by exposure to laser light of the higher energy level a bulge is formed which at the surface comprises a groove, as well as a recording element obtained by using the method and a method of manufacturing a metal copy from the recording element.

Abstract: An optical component of the integrated type is produced by coating a substrate (10) with a layer (12) of photo-polymerizable material which is substantially free of any thermal catalyst, exposing the layer to radiation at a first temperature via a mask for example so that zones of the layer are selectively polymerized in accordance with a predetermined pattern corresponding to the configuration of the desired optical component, heat treating the layer to post cure the polymerized zones, and thereafter flood illuminating the layer at a second temperature lower than the first to polymerize the previously unexposed areas. In this way, an enhanced refractive difference between the pattern and the surrounding areas can be achieved.

Abstract: A method of forming an image is disclosed comprising irradiating a heat-sensitive recording material with a laser beam, wherein the heat-sensitive recording material includes a support having provided thereon a light-absorbing layer containing microcapsules which encapsulate a core substance containing carbon black and a binder, and tranferring a latent image thus formed on the light-absorbing layer, in accordance with the pattern and amount of the laser beam irradiation, to an image-receiving film under pressure to thereby obtain a visible image on the image-receiving film.

Abstract: To achieve higher resolution integration in semiconductor device fabrication using electron beam (EB) or X-ray lithography or a method of lithography is disclosed in which: (1) an EB or X-ray resist material is mixed with an absorbing material for ultraviolet (UV)-rays; (2) the resist layer is selectively exposed to the EB or X-ray with the total irradiation density less than applied in a conventional EB or X-ray exposure; and (3) the entire surface of the resist layer is further exposed to the UV-ray for a total irradiation period less than a minimum level required to induce a reaction in said resist layer. Resist materials such as chloromethylated polystyrene (CMS), polydiarylorthophtalate (PDOP), and polymethylmethacrylate (PMMA), each mixed with p-azido acetophenone as the UV-ray absorbing material improve contrast and resolution of the resist layer. Other UV-ray absorbing materials such as p-azido benzoic acid and 3-sulfonylazido benzoic acid achieve the same result.

Abstract: A diffraction grating is created in the branching region of a photopolymer waveguide, preferably by directing onto the branching region coherent light through a hologram of a grating or by intersecting two or more coherent light beams on the branching region in a regular grating pattern.

Abstract: A controllable feature shrinkage technique permits shrinkage of feature sizes beyond the capability of current lithographic tools by using high temperature flow to shrink the conventionally formed resist image of the feature and then deep UV exposure to stabilize the resist profile at the desired reduced size. A preliminary partial stabilization using hard bake and low intensity deep UV exposure reduces the rate of resist flow at temperature, permitting better control and repeatability of the amount of shrinkage. Feature sizes in the range of about 0.15 .mu.m may be achieved.

Abstract: A method for transferring patterns on a silicone ladder type resin, which comprises: applying onto a substrate a silicone ladder type resin to be represented by the following general formula (I) ##STR1## (where: R.sub.1 denotes a phenyl group or a lower alkyl group, and two R.sub.1 's may be the same or different kinds; R.sub.2 denotes hydrogen atom or a lower alkyl group, and four R.sub.2 's may be the same or different kinds; and n represents an integer of from 5 to 1,000); drying the thus applied resin layer; thereafter applying onto the resin layer a cresol novolac type positive photo-resist; forming a predetermined pattern in the photo-resist layer; subjecting the photo-resist layer to pretreatment; and finally etching the silicone ladder type resin.An etching liquid for etching a silicone ladder type resin, which comprises an aromatic type solvent.

Abstract: A process for substantially improving dimensional stability in photopolymeric flexographic relief printing plates wherein the surface of the printing plate is post-exposed to a high intensity radiation source having broad wavelength emission in the 200 to 700 nm range.

Abstract: A method for selectively exposing a resist layer using a charged particle beam to form a desired pattern. The method includes the steps of repeatedly exposing a basic pattern segment using a charged particle beam so as to expose a pattern within a first predetermined region of the resist layer by a main exposure. The pattern within the first predetermined region is a multiple repetition of the basic pattern segment. A second predetermined region of the layer is exposed by auxiliary exposure at an intensity level lower than that of the main exposure. The second predetermined region excludes the central portions of the first predetermined region and includes a region in which a proximity effect occurs due to the main exposure.

Abstract: The invention describes a developing solvent for layers which are crosslinkable by photopolymerization and contain a binder based on an elastomeric polymer, a photopolymerizable monomer compatible therewith and a photoinitiator. The developing solvent comprises a phenol ether of the general formula I ##STR1## wherein R.sup.1 denotes (C.sub.1 -C.sub.6)n-alkyl or iso-alkyl, cycloalkyl or (C.sub.6 -C.sub.12)-aryl andR.sup.2 denotes hydrogen, (C.sub.1 -C.sub.6)n-alkyl or iso-alkyl or --OR.sup.1.Compared with solvents of the prior art, the developing solvent of the present invention is non-toxic, can quickly be removed from the layer and has a high capacity for layer components.

Abstract: A positive-working photosensitive composition is disclosed that comprises a photosensitive compound which is either of the o-quinone diazide type or comprises a photolytic acid donor in combination with a compound containing a C-O-C group, a binder which is soluble or swellable in an aqueous-alkaline solution and a dye of the general formula I ##STR1## The photosensitive composition of the present invention has a higher photosensitivity than comparable compositions containing other dyes.

Abstract: A photosensitive member suitable for multi-color image formation is obtained by forming a plurality of photosensitive layers laminated on a substrate. Each photosensistive layer comprises a matrix phase and particles dispersed therein. The matrix phase contains a photosensitive silver salt, an organic silver salt and a reducing agent which react with each other on exposure and heating to form a light-absorbing organic compound. The particles contain a heat-diffusive colorant, a polymerizable polymer precursor and a photopolymerization initiator. The light-absorbing organic compound in a photosensitive layer being capable of absorbing a wavelength of light to which the photopolymerization initiator in the photosensitive layer is sensitive. Because the heat-diffusive colorant, the polymerizer and the initiator are contained in the particles, the diffusion of the heat-diffusive colorant can be effectively controlled to prevent color fog.

Abstract: A method for producing a negative image by coating a substrate with a photosensitive layer containing a blocked hydrophobic polymer capable of deblocking in the presence of an acid, and an oxime sulfonate ester or o-quinone-4-sulfonyl-containing diazide, then imagewise exposing, treating with a gaseous base, removing excess base, overall flood exposing, baking and developing with an aqueous alkaline solution.