Abstract: Relief images or resist images are produced by a negative-working process, using a photosensitive resist layer which is applied on a base and contains a compound possessing two or more aromatic and/or heteroaromatic o-nitrocarbinol ester groups as well as a crosslinking compound possessing two or more reactive groups which are capable, under the action of heat, of reacting with carboxyl groups to form a covalent chemical bond. To produce the relief images or resist images, the photosensitive resist layer is first exposed imagewise to actinic light, the exposed areas of this layer are subjected to selective thermal hardening and crosslinking and the resist layer is then post-exposed uniformly to actinic light and finally washed out with an aqueous developer.

Abstract: Process for the preparation of flexible circuits formed from flexible photohardenable elements having at least one organic elastomeric polymeric binder which comprises(a) exposing imagewise said element,(b) applying particulate conductive metal, e.g., nickel, copper, to the unexposed image areas, optionally(c) heating the metal bearing areas, then(d) removing excess metal particles, optionally(e) fixing the particulate metal to the layer by heating, exposing to UV light or mechanical embedding, and(f) plating electrolessly or soldering the metal containing areas. The process can be operated continuously to prepare single and double layer flexible printed circuits, membrane switches, etc.

Abstract: Process for preparing flexographic photopolymer elements by passing into the nip of a calender a photopolymer composition mass comprising elastomeric binder, monomeric compound, and photoinitiator and calendering the photopolymer composition either between (1) a support and multilayer cover element consisting essentially of a flexible cover film, optionally a flexible polymeric film, e.g., polyamide, and a layer of elastomeric composition which is photosensitive or becomes photosensitive during or after calendering, or between (2) two supports, one of which is removed prior to contact, e.g., by lamination or pressing, with the multilayer cover element. The flexographic photopolymer elements are useful for flexographic printing, e.g., dry-offset, letterpress printing.

Abstract: A patterned polymer film is deposited on a substrate by pattern-wise exposing a monomer vapor to a beam of ions and dry developing by etching with oxygen plasma.

Abstract: Relief images or resist images are produced by a positive-working process, using a solid photosensitive resist layer which is applied to a base and contains a compound possessing two or more aromatic and/or heteroaromatic o-nitrocarbinol ester groups and crosslinking compounds possessing two or more reactive groups which are capable, under the action of heat, of reacting with carboxyl groups to form a covalent chemical bond. To produce the relief images or resist images, the photosensitive resist layer is first exposed imagewise to actinic light, the exposed areas of this layer are then washed out with an aqueous developer, the remaining resist layer is post-exposed uniformly to actinic light and finally the post-exposed resist layer is thermally crosslinked and hardened.

Abstract: Process for providing improved solvent resistant surfaces of relief flexographic printing plates prepared by imagewise exposure and liquid development of the unexposed areas of a layer of photosensitive elastomeric composition comprising a high molecular weight butadiene/acrylonitrile copolymer and a monomeric compound wherein, optionally after drying, the developed surface is, in either order, (1) postexposed to actinic radiation, and (2) contacted with two successive aqueous halogen solutions, first, 0.01 to 3.5% by weight aqueous bromine solution for about 15 seconds to 20 minutes or 0.2 to 10% by weight aqueous iodine solution for about 1.0 to 10 minutes, followed by chlorine solution equivalent to that supplied by an aqueous solution, 0.01 to 1.0 molar in NaOCl and 0.012 to 1.2 molar in HCl, for about 15 seconds to 5 minutes.

Abstract: An improved positive-working resist material capable of forming on a substrate either a positive resist pattern or a negative resist pattern. The positive-working resist material comprises a positive-working resist resin having incorporated therein one or more photochromic compounds, such as spiropyrans, triphenylmethane dyes, anils and the like. A positive or negative resist pattern having a remarkably improved definition can be obtained. The use of such a positive-working resist material in the formation of a negative resist pattern on the substrate is also disclosed.

Abstract: A method of post-development cure of photoresists is described wherein the substrate carrying the developed photoresist is positioned within 6.0 cm of a flash lamp and flashed with visible light to effect a cure in 30 seconds or less.

Abstract: A layer of a photoresist composition on a substrate is exposed imagewise to actinic radiation, as through a negative, the photoresist composition comprising an epoxide resin, a benzenoid polyamine, and an aromatic compound which liberates an acid on exposure to actinic radiation. The composition is then heated such that where the radiation has struck the composition local curing of the epoxide resin takes place, the liberated acid acting as accelerator in the curing by the benzenoid polyamine. In parts not struck by radiation the acid accelerator is not liberated and so curing (and insolubilization of the epoxide resin in solvents) takes place much more slowly. By treatment with a suitable solvent unirradiated (and hence uncured) portions of the compositions are dissolved away, an image being formed on the substrate.

Abstract: A light-sensitive material having on a support a light-sensitive layer containing an o-quinonediazide compound as a main component and, additionally, a particular compound represented by the following general formula (I): ##STR1## wherein Z represents the nonmetallic atoms forming a 5-membered ring; X represents S, O, ##STR2## or .dbd.N--R.sub.c (where R.sub.a, R.sub.b and R.sub.c are each a hydrogen atom or an organic group other than a carboxylic acid group); and Y is a hydrogen atom or an organic group other than a carboxylic acid group, is disclosed. This material can provide both positive and negative working images having high resolution and good adhesiveness to the support. A process for producing positive working images includes the steps of imagewise exposure and development processing, while a process for producing negative working images includes the steps of imagewise exposure, heating, uniform (overall) exposure and development processing.

Abstract: Disclosed is a process for the preparation of relief copies, comprising the steps of imagewise irradiating a radiation-sensitive copying material comprising a layer support and a radiation-sensitive layer comprising (a) a compound which upon irradiation splits off acid, and (b) a compound possessing at least one acid-cleavable C--O--C group; heating the imagewise irradiated copying material to a temperature above room temperature for a period of time sufficient to produce an increase in radiation sensitivity of the radiation-sensitive layer; and washing out the irradiated layer areas by means of a developer.

Abstract: In a three stage process, a layer of a liquid composition containing a compound (A) having in the same molecule at least one (meth)acryloyl group and at least one 2,3-disubstituted maleimido group is exposed to actinic radiation so that the layer solidifies due to photopolymerization of (A) through the (meth)acryloyl group(s), remaining, however, further photocrosslinkable. When desired, the solidified layer is exposed, as through a negative, to a substantially greater amount of actinic radiation, the parts so further exposed becoming more highly photocrosslinked through the disubstituted maleimido group(s) and hence insoluble. An image is produced which can be developed by means of suitable solvents. Examples of (A) include N-(2-(acryloyloxy)ethyl)-2,3-dimethylmaleimide and N-(3-(methacryloyloxy)-2-hydroxypropyl)-2,3-dimethylmaleimide.

Abstract: Disclosed is the improvement in post-exposing relief printing plates prepared from photosensitive polymeric compositions which comprises immersing the relief printing plate in a dilute aqueous solution of a persulfate salt and a sufficient amount of a water-soluble carboxylic acid to provide a pH of about 1.5 to about 2.5 during exposure to actinic radiation.

Abstract: In a three stage process, a layer of a liquid composition containing a compound (A) having in the same molecule both at least one (meth)acryloyl group and at least one anthryl group is exposed to actinic radiation so that the layer solidifies due to photopolymerization of (A) through the (meth)acryloyl group(s), remaining, however, further photocrosslinkable. When desired, the solidified layer is exposed, as through a negative, to a substantially greater amount of actinic radiation, the parts so further exposed becoming more highly photocrosslinked through the anthryl group(s) and hence insoluble. An image is produced which can be developed by means of suitable solvents. Examples of (A) include 3-(acryloyloxy)-2-hydroxypropyl anthracene-9-carboxylate and its methacryloyl homologue.

Abstract: Process for the preparation of flexible circuits formed from flexible photohardenable elements having at least one organic elastomeric polymeric binder which comprises(a) exposing imagewise said element,(b) applying particulate conductive metal, e.g., nickel, copper, to the unexposed image areas, optionally(c) heating the metal bearing areas, then(d) removing excess metal particles, optionally(e) fixing the particulate metal to the layer by heating, exposing to UV light or mechanical embedding, and(f) plating electrolessly or soldering the metal containing areas. The process can be operated continuously to prepare single and double layer flexible printed circuits, membrane switches, etc.

Abstract: Optical patterns formed by localized optical density or refractive index variations in glass are produced by impregnating a porous glass support with a photolyzable organometallic compound and selectively exposing the glass to a photolyzing light source to cause the photolytic decomposition of the organometallic compound in exposed portions of the glass. The patterns are fixed, if desired, by removing unreacted organometallic compound from the pores.

Abstract: Process for providing improved solvent resistant surfaces of relief flexographic printing plates prepared by imagewise exposure and liquid development of the unexposed areas of a layer of photosensitive elastomeric composition comprising a high molecular weight butadiene/acrylonitrile copolymer and a monomeric compound wherein, after drying, the developed surface is in either order (1) postexposed to actinic radiation, and (2) contacted with 0.01 to 3.5% by weight aqueous bromine solution for about 15 seconds to 20 minutes.

Abstract: Process for providing improved solvent resistant surfaces of relief flexographic printing plates prepared by imagewise exposure and liquid development of the unexposed areas of a layer of a photosensitive elastomeric composition comprising a polymer of a conjugated diolefin hydrocarbon, and a monomeric compound wherein, after drying, the developed surface is in either order (1) postexposed to actinic radiation, and (2) contacted for about 15 seconds to 40 minutes with an aqueous treatment solution of an alkali monopersulfate, e.g., 2KHSO.sub.5.KHSO.sub.4.K.sub.2 SO.sub.4 and a bromide salt, e.g., potassium bromide.

Abstract: A photoresist that has strong resistance to reactive ion etching, high photosensitivity to mid- and deep UV-light, and high resolution capability is formed by using as the resist material a copolymer of methacrylonitrile and methacrylic acid, and by baking the resist before the exposure to light for improved photosensitivity, and after exposure to light, development, and prior to treatment with reactive ion etching.

Abstract: A method for making low barrier Schottky devices by the electron beam evaporation of a reactive metal such as tantalum, titanium, hafnium, tungsten, molybdenum, and niobium which is selectively deposited at a semiconductor surface such as n-type silicon using a photoresist mask. The method includes a series of steps during the deposition of the barrier metal for degassing the semiconductor substrate, photoresist mask, reactive metal charge and deposition chamber. More particularly, the method includes steps for preliminarily degassing the substrate, mask and surrounding chamber by infra red heating under vacuum followed by steps for preliminarily degassing the charge and surrounding chamber, while the substrate and mask are shielded by electron beam heating the charge while under vacuum.

Abstract: A chalcogenide such as As.sub.2 S.sub.3 is coated on a substrate at a very low rate of deposition in a vacuum evaporator and is coated with a thin silver layer. The silver coated layer is exposed to illumination in a quantity insufficient to form an etchable layer by conventional techniques and the silver is increased by treatment with a silver-containing agent capable of depositing silver on the image, preferably in the presence of radiation. NaAgSO.sub.3 is a presently preferred agent. The resulting image-bearing layer is photo-doped by exposure to band-gap radiation and the member is then etched.

Abstract: A novel desensitizing solution is disclosed which is applied to the surface of a lithographic printing plate coated with a photosensitive layer of a photopolymerizable composition, the desensitizing solution contains a hydrophilic colloid, a free radical polymerization inhibitor and water.

Abstract: Process for broadening the processing range of photohardenable negatively functioning reproduction materials wherein the unexposed areas are removed by liquid development and while still in contact with the developer the material is diffusely exposed to delayed actinic radiation, the delayed exposure amounting to at least 5% of the time necessary to clear the unexposed material.

Abstract: A photosensitive member comprising a photosensitive layer containing an o-quinonediazide compound as a photosensitive agent and an additive, characterized in that the additive is selected from a group consisting of quinone compounds and aromatic ketone compounds, and a method for forming an image using the same.

Abstract: Method and apparatus for removing a photoresist layer from a substrate surface of different material, such as a semiconductor slice, in the fabrication of an electronic structure, involving exposure of the photoresist layer to an ozone-containing gaseous atmosphere in a reaction zone of a reactor. The ozone is present as an active reagent in the gaseous atmosphere to which the layer of photoresist material is exposed in an amount sufficient to react with all of the photoresist material in the layer thereof, with the photoresist material being removed from the underlying substrate surface in response to its exposure to the ozone. The photoresist material being treated by the ozone for stripping thereof may be either a negative or positive photoresist.

Abstract: Lithographic printing plates are made by exposing to actinic light a lithographic plate having a water soluble light sensitive layer thereon and a coating of a solvent soluble, UV curable material thereover to form an image in the light sensitive layer and adhere said layer to the overlying UV curable material. The plate is developed with water to remove light sensitive layer and overlying UV curable material in the non-image areas, and the plate is exposed to UV source having an intensity greater than the imaging light to form a press-ready plate having a durable, reinforced cured image thereon.

Abstract: A method of depositing X-ray absorber patterns on a mask membrane to achieve minimum pattern feature dimensions less than 1 .mu.m. The membrane is covered with an ultraviolet (VU) sensitive photoresist which carries a thin metallic film. The metallic film is coated with an electron beam resist. The electron beam resist is exposed to the desired pattern by an electron beam. After development, the metal film is etched through the remaining electron beam resist. This forms a stencil overlying the lower UV photoresist layer which is then exposed by an ultraviolet or soft X-ray source. After development, an X-ray absorber, such as gold, is deposited on the membrane. The final exposure step may be done by means of a point source of radiation. The X-ray absorbers will then have sloping walls to prevent shadowing of the X-ray source.

Abstract: An improved lithographic printing plate prepared by exposing a lithographically suitable photosensitive sheet material through a mask or transparency, to radiation, developing the exposed sheet to remove unexposed light sensitive material and post-curing the developed sheet by exposure to high intensity radiation or air-baking at high temperatures.

Abstract: Described is a lithographic element which may optionally be used as a positive working or a negative working element by minor changes in exposure and development parameters.

Abstract: Master and working photomasks are made using a photoresist darkened on and bonded to respective quartz substrates. The working photomask is formed by deep ultraviolet light exposure through an electron beam patterned master mask. Deep ultraviolet light is also used to pattern a resist on a silicon slice through the working mask. The same resist is preferably used on the slice and both masks.

Abstract: An improved method for replicating a spiral groove pattern. The pattern is recorded in a photoresist layer which is then developed to reproduce the pattern in the photoresist layer. The pattern is transferred to a metal layer and formed in the surface of a plastic substrate. The improvement comprises the additional steps of uniformly irradiating the photoresist layer and removing the irradiated photoresist surface layer.

Abstract: A method of forming a pattern comprising heat-treating a resist film subjected to irradiation with light and thereafter removing an unhardened area of the resist film.Since the heat treatment reduces the film thickness of the unhardened area and hardens a hardened area still more, a pattern on the order of submicrons can be readily formed.

Abstract: An improved method for replicating a spiral groove pattern. The pattern is recorded in a photoresist layer which is then developed to reproduce the pattern in the photoresist layer. The pattern is transferred to a metal layer and formed in the surface of a plastic substrate. The improvement comprises the additional steps of asymmetrically irradiating the photoresist layer and removing the irradiated photoresist surface layer to produce a photoresist layer of uniform thickness.

Abstract: A flexible printed-circuit board is covered imagewise with a polymer film as a cover layer to improve the flexibility of the board. The cover layer is formed by laminating a photoprintable, photosensitive layer supported on a flexible support to the surface of a flexible printed-circuit board, exposing the photosensitive layer imagewise to light to form a polymer image in the layer and removing the unexposed areas of the layer to leave an imaged polymer film on the surface of the board. The formation of the cover layer can be easily conducted by a continuous operation.

Abstract: A high resolution image is accurately but readily reproduced by placement of a film master, such as a positive photographic film, in direct contact with a wet, high solids content, radiation curable material distributed on a screen. The radiation curable material is responsive to a limited wavelength band in the ultraviolet region. It includes a sensitizer, may include a reactive diluent, is preferably free of acrylates and of low toxicity, has a viscosity sufficient to maintain a fixed spatial relationship between the master and substrate, and further advantageously incorporates a minor amount of radiation attenuating dimensional stabilizer in the form of a distributed particulate. The photopolymer material is first spread across one side of the screen against the film master to form an underlayer which is then irradiated through the film master with a suitable light source.

Abstract: A phase compatibile polymer blend serves as a radiation sensitive lithographic resist in the fabrication of circuits and circuit elements. Radiation sensitivity is due to inclusion of a "modifier". Resist properties, notably stability to agents and ambients to be masked are attributed largely to a second component, the "matrix polymer".In an exemplary embodiment in which the blend is positive acting, fabrication including dry processing is dependent upon use of a resist blend of a vapor developing polysulfone and a novolac. The novolac, inherently soluble in alkaline media is rendered insoluble in the blend. Radiation initiated depolymerization results in volatilization of the modifier to render the irradiated portions of the resist soluble in alkaline developers.Modifier may function in other manner; for example, it may undergo radiation initiated polymerization so as to insolubilize the blend in irradiated regions, so resulting in a negative acting resist.

Abstract: A metallic foil is laminated to a transparent substrate with a photopolymerizable adhesive. An outer layer of photoresist is used in etching a pattern in the foil. The etched foil itself is then used as a resist in the complete removal of the uncovered portions of the adhesive, leaving the transparency of the revealed substrate material totally unimpaired. Finally, the remaining adhesive is hardened by polymerization resulting from exposure to ultraviolet light passed through the substrate from the unlaminated side.

Abstract: A method for forming an image comprising forming a silver, silver halide or binder image in the emulsion layer of a photographic material which comprises a support having a masking layer thereon which carries a silver halide emulsion layer, by exposing and developing the photographic material, heating the photograpic material to thermally decompose the binder of the emulsion layer, selectively removing the thermally decomposed emulsion layer at non-image areas to uncover the masking layer lying thereunder using a binder-removing solution, and then etching away the masking layer at the uncovered areas.

Abstract: A plasma-polymerized film formed on the surface of a substrate is found to be suitable for subsequent use in electron-beam lithography and the film exposed to a beam of electrons is then developed to provide it with the predetermined pattern. These steps of plasma polymerization, electron-beam exposure and development can be consecutively carried out in vapor phase within a unified vacuum apparatus.

Abstract: A method of making flyleads for video disc playback cartridges wherein a dry film resist is coated on both sides of a metal sheet, one side is exposed through a patterned mask, the patterned side is developed and etched, and the remaining photoresist is removed.

Abstract: A photosensitive composition useful as a photoresist which may be completely processed by dry techniques, especially by means of an oxygen plasma.The composition includes an N-vinylmonomer and an organic hydrogen compound in a binder which contributes significantly to the utility of the composition in the fabrication of micro-electronic devices.

Abstract: A resist utilized to prepare semiconductor elements or the like comprises a copolymer of, for example, 2,3 dibromo-n-propyl methacrylate and methylmethacrylate. The resist is applied onto a substrate to form a copolymer resist layer, the copolymer resist layer is irradiated with ionizing radiations, the irradiated portions of the copolymer resist layer are dissolved to form a positive pattern, the positive pattern is heated in inert atmosphere to cause crosslinking reaction of reactive radicals remaining in the copolymer resist, and then the assembly is etched with a liquid etchant to form an etched pattern on the substrate. Alternatively, the positive pattern and the underlying substrate are treated with plasma or ions to cause a crosslinking reaction of reactive radicals remaining in the copolymer resist to simultaneously etch portions of the substrate not covered by the positive pattern.

Abstract: A layer of a chalcogenide glass resist material, on a substrate on which a microlithographic pattern is to be formed, has a deposit of silver halide on its outer surface. By actinic irradiation a latent silver image replicating the desired pattern is formed in the silver halide deposit. This image is developed to a metallic silver, which is used to photodope the resist material for subsequent etching to produce the microlithographic pattern on the substrate. Positive and negative patterns are possible from the same starting laminate. One form of a microlithographic pattern is a mask for producing electronic circuits.

Abstract: A photopolymerizable coating composition comprising(1) a nongaseous, ethylenically unsaturated, polymerizable compound,(2) a specified nitroaromatic compound, and(3) an organic, radiation-sensitive, free-radical generating systemis useful for making a positive or negative polymeric image on a substrate.

Abstract: End point detection in developing photoresist is accomplished by monitoring the output of a photodetector and sensing a plateau in the output.

Abstract: A process of forming mask images having high contrast at the edges thereof and possessing high heat resistance and high durability comprising imagewise exposing a photographic light-sensitive material comprising a transparent support having thereon, in succession, a mask layer and a layer of an emulsion of a silver halide in a binder followed by development without employing fixing processing to form silver images at the image areas, removing the silver forming the silver images at the image areas with an aqueous solution containing ceric sulfate and sulfuric acid; then reducing the silver halide remaining at the non-image areas to silver; halogenating the silver formed in the non-image areas with an aqueous solution containing dichromate ions and halogen ions; heating the photographic material above about 200.degree. C.

Abstract: Microwave curing of photoresist films employed in processing semiconductor wafers provides an alternative to conventional drying techniques. The time of curing may be reduced from about 20 to 25 minutes required for conventional air drying to about 5 minutes employing microwave curing. Further, the photoresist film is the only part of the semiconductor assembly that experiences elevated temperatures. The remainder of the wafer remains near ambient conditions, without experiencing possible deleterious effects as a consequence of the high temperature processing.

Abstract: A semitransparent photolithography mask, i.e., one transparent to a portion of the visible light spectrum, is achieved by electron and ion bombardment of a positive photoresist. This bombardment is performed after the desired photoresist pattern is defined by the sequential steps of depositing, baking and developing the photoresist (14) on a light transparent substrate (15). In the preferred embodiment, the electron and ion bombardment is accomplished in a predominantly nitrogen atmosphere within a sputtering chamber using indium tin oxide as the sputtering target. As a result of the bombardment, the photoresist is converted into a material which is opaque to only the ultraviolet portion of the light spectrum.

Abstract: A photosensitive printing plate with high sensitivity comprising a support having a hydrophilic surface and formed in succession thereon (1) a layer of an oleophilic photosensitive resin composition whose solubility in a solvent is changed by exposure to light to which the resin composition layer is sensitive and (2) directly on the layer (1) a layer containing a dispersion of particles of photosensitive silver halide grains coated with a water-soluble polymer in an oleophilic polymer capable of being dissolved in a developer for the photosensitive resin composition.

Abstract: An organic polymer resist image layer, formed on a substrate, is stabilized by placing the substrate with the resist image layer in an electrodeless glow discharge in a low pressure fluorine containing atmosphere, for example, CF.sub.4, so as to harden the exposed surface of the layer and then heating the layer.