Abstract: A photosensitive polyimide resin precursor composition capable of providing a polyimide resin that is not substantially colored, is transparent and has heat resistance, an optical polyimide resin obtained from the composition, and an optical waveguide using the polyimide resin. The photosensitive polyimide resin precursor composition contains (a) 100 parts by weight of a polyamic acid obtained from a tetracarboxylic acid dianhydride and a diamine, (b) 0.01 parts by weight or more and less than 5 parts by weight of a 1,4-dihydropyridine derivative, (c) 5-50 parts by weight of a glycol (ether). The optical polyimide resin is obtained by irradiating the photosensitive resin precursor composition with UV light, followed by exposure, heating, development, and then heating. The optical waveguide comprises a core layer comprising the optical polyimide resin, and a cladding layer thereof.

Abstract: The present invention relates to a novel styrene-anhydride copolymer containing amido group, which comprises the following repeating units (I) and (II): wherein R represents a residue of (meth)acrylate monomer containing hydroxyl group; R1 and R2 are the same or different and each represents a C1-6 alkyl group, or R1 and R2 are taken together with the nitrogen atom to which they attach to form a 5- to 6-member heterocyclic group containing nitrogen. The present invention also relates to process for producing the above copolymer and to the use of the copolymer as a photo resist in an alkaline soluble development of an irradiative reaction and as a solder resistant photo resist in printed circuit boards.

Abstract: The present invention provides a PS plate for use in making a lithographic printing plate, comprising an aluminum substrate provided thereon with a light-sensitive layer comprising a polyurethane resin binder, an addition polymerizable ethylenically unsaturated bond-containing compound and a photopolymerization initiator, wherein the polyurethane resin binder is one synthesized from at least the following compounds (i) to (iv): (i) at least one di-isocyanate compound; (ii) at least one diol compound having at least one carboxyl group; (iii) at least one diol compound whose logP value is less than 0; and (iv) at least one diol compound whose logP value is higher than 0.

Abstract: Photoresist compositions, which can attain high-accuracy etching without causing separation and flexible printed wiring boards prepared with the photoresist compositions are disclosed. In order to etch a polyimide precursor layer on a conductive circuit, a photoresist composition comprising a photopolymerizable organic material (A), a water-soluble resin (B) and an amino-group-containing resin (C) is applied on the surface of the polyimide precursor layer to form a photoresist layer. Then, the photoresist layer is patterned by a photolithographic process. The polyimide precursor layer is etched and the pattern of the photoresist layer is transferred to the polyimide precursor layer. The amino-group-containing resin (C) in the photoresist layer is combined with an acid anhydride in the polyimide precursor layer to attain good adhesion and high-accuracy etching without causing separation of the photoresist layer.

Abstract: An infrared-sensitive photosensitive composition comprising (A) an alkali-soluble resin containing a repeating unit having an alkylene oxide group, and (B) a light-to-heat converting agent; and

Abstract: This invention discloses compositions that can be polymerized/crosslinked imagewise upon exposure to ionization radiation such as x-ray, electron beam, ion beam, and gamma-ray. This invention also discloses methods of use for these compositions for microfabrication of ceramics, for stereolithography, and for x-ray, e-beam, and ion-beam lithography which can be used for photoresists.

Abstract: A negative resist composition comprising (A) an alkali-soluble polymer, (B) a cross-linking agent forming cross-links between molecules of the alkali-soluble polymer (A) under the action of an acid and (C) a specified acid generator, which can satisfy all of performance requirements concerning sensitivity, resolution, pattern profile and line-edge roughness in the pattern formation by irradiation with electron beams or X-rays.

Abstract: The present invention relates to IR-sensitive compositions suitable for the manufacture of printing plates developable on-press. The IR-sensitive compositions comprise a first polymeric binder which does not comprise acidic groups having a pKa value≦8; a second polymeric binder comprising polyether groups; an initiator system; and a free radical polymerizable system comprising at least one member selected from unsaturated free radical polymerizable monomers, free radical polymerizable oligomers and polymers containing C═C bonds in the back bone and/or in the side chain groups. The initiator system includes (i) at least one compound capable of absorbing IR radiation; (ii) at least one compound capable of producing radicals selected from polyhaloalkyl-substituted compounds; and (iii) at least one polycarboxylic acid of formula R4—(CR5R6)r—Y—CH2COOH, wherein oxi<redii+1.

Abstract: A positive planographic printing plate precursor includes a support having disposed thereon a lower thermosensitive layer containing a water-insoluble but alkali-soluble polymer compound and an upper thermosensitive layer containing a water-insoluble but alkali-soluble polymer compound, with alkali-solubility increasing under heat, wherein (i) both the upper thermosensitive layer and the lower thermosensitive layer contain an IR absorbing dye, with the ratio of the IR absorbing dye concentration in the upper thermosensitive layer to the IR absorbing dye concentration in the lower thermosensitive layer is 1.6 to 10.0, and/or (ii) the upper thermosensitive layer and the lower thermosensitive layer contain different IR absorbing dyes, and/or (iii) at least one of the upper thermosensitive layer and the lower thermosensitive layer contains an IR absorbent having, in one molecule, at least two chromophoric groups that absorb IR light, with the chromophoric groups bonding to each other via a covalent bond.

Abstract: A copolymer useful in radiation sensitive compositions for lithographic printing plates comprises the units A, B, C and D, wherein A is present in an amount of 0.5 to 30 wt.-% and is of the formula wherein R is hydrogen, C1-C4 alkyl, —CH═COOH or B is present in an amount of 5 to 35 wt.-% and is of the formula C is present in an amount of 10 to 55 wt.

Abstract: A compound of formula (I) wherein n is e.g. a number from 2 to 50; R5′ and R5″ are e.g. a group of formula (II); G1, G2, G3 and G4 are e.g. C1-C4akyl; R1 is e.g. hydrogen or C1-C4alkyl; R2 is e.g. methylene; R3′ is e.g. hydrogen and R3″ is e.g. hydrogen or C1-C4alkyl; R4 is e.g. C2-C8alkylene; and X is e.g. —N(R7)R8) with R7 and R8 being independently of one another hydrogen or C1-C8alkyl, is useful for stabilizing an organic material against degradation induced by light, heat or oxidation.

Abstract: The present invention provides an IR-sensitive composition, which includes: a polymeric binder; and a free radical polymerizable system consisting of: at least one component selected from unsaturated free radical polymerizable monomers, oligomers which are free radical polymerizable and polymers containing C═C bonds in the backbone and/or in the side chain groups; and an initiator system, which includes: (a) at least one compound capable of absorbing IR radiation; (b) at least one compound capable of producing radicals; and (c) at least one carboxylic co-initiator, provided that the total acid number of the polymeric binder is 70 mg KOH/g or less. The present invention further provides a printing plate precursor, a process for preparing the printing plate and a method of producing an image.

Abstract: The present invention includes an imageable element, comprising a substrate and a thermally imageable composition which includes a graft copolymer having hydrophobic and hydrophilic segments. Upon imagewise exposure to thermal energy, the graft copolymer produces exposed regions that are less soluble in a developer than the unexposed regions. Also included is a method of producing an imaged element which includes a graft copolymer according to the present invention.

Abstract: A lithographic printing plate precursor comprises a support and a hydrophilic layer capable of hydrophobicizing by heat,

Abstract: An imaging member, such as a negative-working printing plate or on-press cylinder, can be prepared with a hydrophilic imaging layer comprised of a heat-sensitive hydrophilic charged polymer (ionomer) and an infrared radiation sensitive negatively-charged oxonol dye that has a &lgr;max of greater than 700 nm. The heat-sensitive polymer and IR dye can be formulated in water or water-miscible solvents to provide highly thermal sensitive imaging compositions. In the imaging member, the polymer reacts to provide increased hydrophobicity in areas exposed to energy that provides or generates heat. For example, heat can be supplied by laser irradiation in the IR region of the electromagnetic spectrum. The heat-sensitive polymer is considered “switchable” in response to heat, and provides a lithographic image without conventional alkaline processing.

Abstract: Photoresist compositions and methods are provided for preparing photoresist films that are stable and impermeable to a broad range of organic solvents. Photoresist films provided herein may be photopatterned by selectively applying light, and may be stripped from a surface using unreactive agents. Photopatterned films may be used, for example, to selectively direct organic reagents to a solid support for the purpose of performing regionally selective solid-phase chemical synthesis with micron-scale resolution.

Abstract: This invention discloses compositions that can be polymerized/crosslinked imagewise upon exposure to ionization radiation such as x-ray, electron beam, ion beam, and gamma-ray. This invention also discloses methods of use for these compositions for microfabrication of ceramics, for stereolithography, and for x-ray, e-beam, and ion-beam lithography which can be used for photoresists.

Abstract: A dry film photoresist having a glass transition temperature (Tg) above room temperature. The dry film photoresist is tack free. An artwork may be placed directly on the photoresist without concern that the artwork may stick to the dry film photoresist or become contaminated with photoresist. The dry film photoresist may be laminated on a support sheet and wound into a roll without concern that the photoresist will stick to the backside of the support sheet. The dry film photoresist also has reduced cold flow problems.

Abstract: Provided is a positive photoresist composition for use in the production of a semiconductor device, which ensures high resolution, reduced edge roughness of a line pattern and a small number of development defects. The positive photoresist composition comprises a resin having a specific silicon-containing group on the side chain, the solubility of which resin in an alkali developer increases under the action of an acid.

Abstract: Photoresist compositions and methods are provided for preparing photoresist films that are stable and impermeable to a broad range of organic solvents. Photoresist films provided herein may be photopatterned by selectively applying light, and may be stripped from a surface using unreactive agents. Photopatterned films may be used, for example, to selectively direct organic reagents to a solid support for the purpose of performing regionally selective solid-phase chemical synthesis with micron-scale resolution.

Abstract: The present invention relates to a polymerizable coating composition suitable for the manufacture of printing plates developable on-press. The coating composition comprises (i) a polymerizable compound and (ii) a polymeric binder comprising polyethylene oxide segments, wherein the polymeric binder is selected from the group consisting of at least one graft copolymer comprising a main chain polymer and polyethylene oxide side chains, a block copolymer having at least one polyethylene oxide block and at least one non-polyethylene oxide block, and a combination thereof. The invention is also directed to an imageable element comprising a substrate and the polymerizable coating composition.

Abstract: The photoacid generator according to the present invention is represented by the general formula (1): wherein R1 and R2 are respectively H, OH or alkyl or alkoxy group of C1-5 and are the same or different, n is an integer from 1 to 3, and Ar1 is a naphthalene unit. The photosensitive resin used in a composition of the invention is represented by the general formula (2): wherein X is a tetravalent aromatic or aliphatic organic radical, Y is a bivalent aromatic or aliphatic organic radical, and R3 and R4 independently are H or a monovalent aliphatic organic protecting group removable by acid.

Abstract: [Object]

Abstract: The invention provides an photosensitive resin composition excellent in heat resistance and adhesion to wiring layers which yields high resolution after development with aqueous solution containing no organic solvent. The composition is used as an adhesive between circuits in a process producing a multi-layer printed wiring board by a built-up method. The composition comprises a compound (A) having the molecule at least one phenolic hydroxyl group and at least one acryloyl or methacryloyl group, an unsaturated imide compound (B), a photopolymerization initiator (c) and, optionally, an epoxy compound (D) having at least two epoxy groups in the molecule. Also, provided for is a multilayer printed wiring board comprising wiring layers and insulating layers, which are alternatively formed wherein said insulating layers are formed of said composition.

Abstract: The use of certain mercapto compounds as shelf life improvers for infrared-sensitive lithographic printing plate precursors is disclosed. The compounds are five-membered heteroaromatic rings containing a nitrogen atom and at least one other heteroatom, which can be oxygen, sulfur, or another nitrogen atom, such that two ring heteroatoms are bonded to a ring carbon bearing a thiol group.

Abstract: A photopolymerizable composition that is cured with visible light or an infrared laser and is used as a recording layer in a negative planographic printing plate precursor. The photopolymerizable composition is cured by exposure and includes (A) a polymerizable compound that is solid at 25° C. and has at least one radical-polymerizable ethylenically unsaturated double bond in a molecule, (B) a radical polymerization initiator, (C) a binder polymer and, as required, (D) a compound generating heat by infrared exposure.

Abstract: A composition for forming a radiation absorbing coating which comprises an organic solvent, a radiation absorbing polymer or a radiation absorbing material dissolved therein and a crosslinking agent having blocked isocyanate groups. Since the isocyanate groups of the crosslinking agent have been blocked, the composition containing the crosslinking agent has excellent storage stability. When the composition applied to a substrate and then baked, crosslinking proceeds to give an antireflective coating, which does not intermix with a resist layer to be formed thereon by coating and is free from diffusion of a photo-generated acid thereinto from the resist layer. As a result, a resist image free from footing or scum can be formed.

Abstract: A photosensitive lithographic printing plate comprising: a support; and a photosensitive layer, wherein the photosensitive layer comprises: a polyurethane resin binder comprising an aliphatic cyclic structure which has a carboxyl group as a substituent directly or indirectly attached to the structure; or a polyvinyl alcohol resin binder modified with an acetal skeleton comprising an aliphatic cyclic structure.

Abstract: Disclosed are a positive type photosensitive resin composition which comprises (A) a polyimide precursor or a polyoxazole precursor having a group represented by —OR, wherein R represents a monovalent group constituting a acetal or ketal, an alkoxyalkyl group or an alkylsilyl group, which can be converted into a hydrogen atom by decomposition with an action of an acid, in the molecule which is bonded to an aromatic ring, and (B) a compound which generates an acid by irradiating radiation, a process for producing the same and electronic parts using the same.

Abstract: The present invention provides a positive resist fluid excellent in the storage stability of the fluid and in defocus latitude depended on line pitch, and a positive photoresist composition for far ultraviolet exposure which forms a resist pattern having excellent defocus latitude depended on line pitch and has excellent sensitivity to short-wavelength exposure lights. The positive resist fluid comprises a resin which contains repeating units represented by formula (I) as defined in the specification, a photo-acid generator, and a solvent and the positive photoresist composition for far ultraviolet exposure comprises a resin which contains both alkali-soluble groups protected by groups containing an alicyclic hydrocarbon structure and represented by at least one of formulae (pI) to (pVI) and groups represented by formula (qI): —A—X—R5 as defined in the specification.

Abstract: A polyvinyl acetal copolymer compound comprises the units A, B, C and D, wherein A is present in an amount of 0.5 to 30 wt.

Abstract: The present invention provides a positive resist fluid excellent in the storage stability of the fluid and in defocus latitude depended on line pitch, and a positive photoresist composition for far ultraviolet exposure which forms a resist pattern having excellent defocus latitude depended on line pitch and has excellent sensitivity to short-wavelength exposure lights. The positive resist fluid comprises a resin which contains repeating units represented by formula (I) as defined in the specification, a photo-acid generator, and a solvent and the positive photoresist composition for far ultraviolet exposure comprises a resin which contains both alkali-soluble groups protected by groups containing an alicyclic hydrocarbon structure and represented by at least one of formulae (pI) to (pVI) and groups represented by formula (qI): —A—X—R5 as defined in the specification.

Abstract: Reducing inhibition of the photochemical crosslinking by including in the photosensitive polyimide precursor composition a metal inhibitor selected from 1H-tetrazole, 1,2-cyclohexenediamine tetraacetic acid hydrate and 5-mercaptobenzimidazole.

Abstract: There are disclosed a photosensitive resin composition which comprises

Abstract: A multilayered photopolymer element made up of at least a support, a photosensitive layer and a cover film. The photosensitive layer is composed of at least two layers and the uppermost layer in the photosensitive layer contains a sensitivity controlling agent bonded with a polymer. The shape of the shoulder at a relief top is made sharp-edged whereby a printing plate having excellent print quality without being thickened by impression is prepared.

Abstract: A positive planographic printing material which is capable of recording a digital data from a computer and the like, using a solid laser or a semiconductor laser emitting infrared rays. The positive planographic printing material comprises at least the following components (A) to (C): (A) a polyfunctional amine compound, (B) a polymer which is water-insoluble and aqueous alkali solution-soluble and (C) an infrared absorber.

Abstract: A composition for an anti-reflective coating or a light absorbing coating, which shows good light absorption for lights of 100-450 nm in wavelength, suffers neither footing nor intermixing, and has excellent storage stability and step coverage, and novel copolymers to be used therein.

Abstract: A positive photoresist composition for exposure to far ultraviolet light which comprises (A) a compound which generates an acid upon irradiation with an actinic ray or radiation, and (B) a resin which is decomposed by the action of an acid to increase its solubility in an alkaline developing solution and has a group represented by the following formula (1) connected to at least one terminal of the molecular chain thereof: —X—R  (1) wherein X represents —R1—, —S—R1—, —O—R1—, —NH—R1— or —NR2—R1—; R represents an alkoxy group, a hydroxy group, —COO—R2, —CONH—R2, —CONHSO2—R2 or —CONH2; R1 represents a divalent hydrocarbon group having from 1 to 20 carbon atoms; and R2 represents an alkyl group.

Abstract: A monomer represented by the following general formula (m-1): wherein R is a group having an alicyclic skeleton, R2s may be the same or different and are individually hydrogen atom, halogen atom or monovalent organic group, X1 is a bivalent organic group containing a heteroatom, j is an integer of 0 to 3, and R1 is a group selected from the following groups, a monovalent organic group having Si (R1-1), and —(X2)k—R4—(X3)m—C(R6)3  (R1-2), wherein X2 and X3 are a bivalent organic group containing a heteroatom, k and m are an integer of 0 to 3, R4 is a bivalent alkyl group, R6s may be the same or different and are individually hydrogen atom, halogen atom or monovalent organic group.

Abstract: A photosensitive lithographic printing plate in which press life, deletion performance, photosensitive layer removability and image reproducibility are compatible with one another, while retaining scumming prevention performance, which comprises an aluminum support hydrophilized after anodic oxidization, an intermediate layer provided thereon containing an alkali-soluble polymer adjusted in a number-average molecular weight (Mn) to the range of 300 to 5,000 by using an initiator in combination with a chain transfer agent in radical polymerization, and a photosensitive layer provided on the intermediate layer.

Abstract: A photosensitive heat-resistant resin composition contains a polyamideimide resin, an organic solvent for dissolving the polyamideimide, an acrylic monomer or oligomer having at least two polymerizable double bonds, and a photoreaction initiator for initiating polymerization of the acrylic monomer or oligomer by photochemical reaction. The resin composition may be used to make a heat-resistant insulating film which may be patterned by selective irradiation of ultraviolet rays. The insulating film may be interposed between different conductor layers in a build-up multilayer circuit board.

Abstract: Disclosed is a positive resist composition which ensures, on use of an exposure light source of 220 nm or less, high sensitivity, good resolution, sufficiently high resistance against dry etching, satisfactory adhesion to the substrate, and superior developability even with a developer conventionally used for resists (for example, a 2.38% aqueous tetramethylammonium hydroxide solution), the positive resist composition comprising a compound generating an acid on irradiation of an active light ray or radiation, a resin having a polycyclic-type alicyclic group and a carboxyl group, and a compound having at least two groups having a specific structure.

Abstract: A positive photoresist composition for far ultraviolet ray exposure use, which comprises a resin that contains a repeating structural unit composed of a monomer having a specified acid-decomposable group and another monomer having an amine structure in its molecule and is decomposed by the action of an acid thereby increasing its alkali solubility, and a compound that generates an acid by irradiation of an active light ray or radiation, or a positive photoresist composition for far ultraviolet ray exposure use, which comprises a resin that contains a monomer having a specified acid-decomposable group, as a repeating structural unit, and is decomposed by the action of an acid thereby increasing its alkali solubility, a compound that generates an acid by irradiation of an active light ray or radiation and a basic low molecular weight compound.

Abstract: A positive type photosensitive resin composition which comprises (A) 100 parts by weight of a polyamide represented by the general formula (1): wherein X represents a tetravalent aromatic group; Y represents a divalent aromatic group; Z represents a divalent group represented by the formula: in which R1 and R2 represent divalent organic groups and R3 and R4 represent monovalent organic groups; a and b represent molar fractions; a+b=100 mole %; a=60.0-100.0 mole %; b=0-40.0 mole %; and n represents an integer of 2 to 500, (B) 1 to 100 parts by weight of a photosensitive diazoquinone compound and (C)1 to 50 parts by weight of a phenol compound represented by a specific structural formula and/or (D) 0.

Abstract: An energy sensitive composition comprising a monomeric organometallic complex essentially free of nucleophilic groups and which, upon exposure to energy, bonds to basic reactive sites on a substrate via the metal center, leaving the polymerizable group of the complex unreacted and unrestricted; an energy sensitive composition at least one energy sensitive organometallic group is incorporated in or appended to the backbone of a polymer, such that the resulting coordinatively unsaturated organometallic group or groups bond to basic reactive sites on a substrate, thus forming permanent bonds, and further, the adherent compositions are useful in applications such as adhesion of polymers to substrates, protective coatings, printing plates, durable release coatings, primers, binders, and paints.

Abstract: Optical waveguides prepared by irradiating selected regions of positive photochromic polymeric materials with actinic radiation are disclosed. The photochromic materials undergo an irreversible photochemical change which results in an increase in the refractive index of light-exposed regions. In addition, the materials exhibit negligible second-order polarizability prior to exposure and excellent nonlinear optical properties after exposure and polarization. Thus, the exposed regions are particularly useful as the core in active waveguides for use in second-order nonlinear optical applications, as well as the core in passive waveguides. In addition, a simple two step process is disclosed for forming optical waveguides from the positive photochromic polymers. Optical structures, such as optical integrated circuits, and optical devices which incorporate the waveguides are also disclosed.

Abstract: A photographic polyester film and a manufacturing method therefor. The photographic polyester film includes a polyester base film, a primer layer formed of polyurethane resin on at least one surface of the polyester base film, and a subbing layer formed of a hydrophillic polymer on at least one surface of the primer layer. Also, a photosensitive layer may be stacked on the subbing layer. The photographic polymer film having the primer layer, the subbing layer and the photosensitive layer exhibits excellent interlayer adhesiveness between the hydrophobic polyester base film and the hydrophilic sensitive layer.

Abstract: The present invention relates to a radiation-sensitive resist composition comprising a radiation-sensitive acid generator and a copolymer binder formed by the reaction of (a) an acrylate or methacrylate monomer having a photogenerated acid cleavable substituent and (b) an acrylate or methacrylate monomer having a polar non photoacid cleavable substituent.

Abstract: Disclosed is a light sensitive composition containing a compound capable of generating an acid on exposure of an actinic light, a compound having a chemical bond capable of being decomposed by an acid or a compound having a group cross-linking by an acid, an infrared absorber, and a solvent mixture of a first solvent with a viscosity of 1.5 cp or more and a second solvent with a viscosity of less than 1.5 cp.

Abstract: Disclosed are a safe slurry photosensitive composition superior in image formation capabilities such as resolution and sensitivity and containing no harmful compound, and a safe water-soluble photosensitive composition capable of being dissolved in water without using any organic solvent while maintaining a sufficient sensitivity as a resist and containing no harmful substance. The slurry photosensitive composition contains a compound which generates an acid when irradiated with light or ionizing radiation, at least one type of a resin with acid-crosslinkability or acid-decomposability, and a powder. Various devices can be manufactured by forming a layer of this photosensitive composition on a substrate, exposing the layer to light in accordance with a desired pattern, and heating the layer. The water-soluble photosensitive composition contains a compound which generates an acid when irradiated with light or ionizing radiation, and an acetal resin.