Plural Gate Electrodes (e.g., Dual Gate, Etc.) Patents (Class 438/283)
  • Patent number: 10847380
    Abstract: A semiconductor device is provided. The semiconductor device includes a core structure, a first pattern and a second pattern. The core structure is disposed on a substrate. The first pattern covers a sidewall of a bottom portion of the core structure. The top surface of the first pattern is lower than a top surface of the core structure. The second pattern is disposed on the first pattern and covering a top portion of the core structure. A sidewall of the top portion of the core structure and the top surface of the core structure are covered by the second pattern. The second pattern has an upper portion tapered away from the substrate. A material of the first pattern is different from a material of the second pattern.
    Type: Grant
    Filed: March 17, 2020
    Date of Patent: November 24, 2020
    Assignee: Winbond Electronics Corp.
    Inventors: Shu-Ming Li, Tzu-Ming Ou Yang, Ko-Po Tseng
  • Patent number: 10840153
    Abstract: A method includes providing a structure having a first region and a second region, the first region including a first channel region, the second region including a second channel region; forming a gate stack layer over the first and second regions; patterning the gate stack layer, thereby forming a first gate stack over the first channel region and a second gate stack over the second channel region; and laterally etching bottom portions of the first and second gate stacks by applying different etchant concentrations to the first and second regions simultaneously, thereby forming notches at the bottom portions of the first and second gate stacks.
    Type: Grant
    Filed: October 16, 2018
    Date of Patent: November 17, 2020
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Chang-Yin Chen, Che-Cheng Chang, Chih-Han Lin
  • Patent number: 10833206
    Abstract: A semiconductor structure includes a capacitor structure comprising an active region comprising opposing field edges parallel to a first horizontal direction and a gate region comprising opposing gate edges parallel to a second horizontal direction transverse to the first horizontal direction. The semiconductor structure also comprises a first dielectric material adjacent at least one of the opposing field edges or the opposing gate edges and a second dielectric material adjacent the active area and abutting portions of the first dielectric material. A height of the second dielectric material in a vertical direction may be less than the height of the first dielectric material. Semiconductor devices and related methods are also disclosed.
    Type: Grant
    Filed: December 11, 2018
    Date of Patent: November 10, 2020
    Assignee: Micron Technology, Inc.
    Inventor: Michael A. Smith
  • Patent number: 10833177
    Abstract: Semiconductor device and fabrication method are provided. The method includes: providing a substrate having a fin which has first fin layers and second fin layers; forming a dummy gate structure across the fin; after forming the dummy gate structure, respectively forming a first groove and a second groove in the fin on two sides of the dummy gate structure; removing a portion of the second fin layer adjacent to the first groove to form a first fin recess; removing a portion of the second fin layer adjacent to the second groove to form a second fin recess; forming a first spacer layer in the first fin recess and forming a second spacer layer in the second fin recess; after forming the first spacer layer, forming a doped drain layer in the first groove; and after forming the second spacer layer, forming a doped source layer in the second groove.
    Type: Grant
    Filed: August 1, 2019
    Date of Patent: November 10, 2020
    Assignees: Semiconductor Manufacturing International (Beijing) Corporation, Semiconductor Manufacturing International (Shanghai) Corporation
    Inventor: Fei Zhou
  • Patent number: 10825933
    Abstract: Present disclosure provides gate-all-around structure including a semiconductor fin having a top surface, a first nanowire over the top surface, a first space between the top surface and the first nanowire, an Nth nanowire and an (N+1)th nanowire over the first nanowire, and a second space between the Nth nanowire and the (N+1)th nanowire. The first space is greater than the second space. Present disclosure also provides a method for manufacturing the gate-all-around structure described herein.
    Type: Grant
    Filed: June 11, 2018
    Date of Patent: November 3, 2020
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Meng-Hsuan Hsiao, Wei-Sheng Yun, Winnie Victoria Wei-Ning Chen, Tung Ying Lee, Ling-Yen Yeh
  • Patent number: 10811541
    Abstract: A semiconductor device includes a gate electrode extending in a first direction on a substrate, a first active pattern extending in a second direction intersecting the first direction on the substrate to penetrate the gate electrode, the first active pattern including germanium, an epitaxial pattern on a side wall of the gate electrode, a first semiconductor oxide layer between the first active pattern and the gate electrode, and including a first semiconductor material, and a second semiconductor oxide layer between the gate electrode and the epitaxial pattern, and including a second semiconductor material. A concentration of germanium of the first semiconductor material may be less than a concentration of germanium of the first active pattern, and the concentration of germanium of the first semiconductor material may be different from a concentration of germanium of the second semiconductor material.
    Type: Grant
    Filed: January 23, 2019
    Date of Patent: October 20, 2020
    Assignees: Samsung Electronics Co., Ltd., Research & Business Foundation Sungkyunkwan University
    Inventors: Jin Bum Kim, Hyoung Sub Kim, Seong Heum Choi, Jin Yong Kim, Tae Jin Park, Seung Hun Lee
  • Patent number: 10777554
    Abstract: An integrated circuit (IC) device comprises a substrate having a metal-oxide-semiconductor (MOS) region; a gate region disposed over the substrate and in the MOS region; and source/drain features in the MOS region and separated by the gate region. The gate region includes a fin structure and a nanowire over the fin structure. The nanowire extends from the source feature to the drain feature.
    Type: Grant
    Filed: July 10, 2017
    Date of Patent: September 15, 2020
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Kuo-Cheng Ching, Ting-Hung Hsu
  • Patent number: 10770588
    Abstract: A device with improved device performance, and method of manufacturing the same, are disclosed. An exemplary device includes a group III-V compound semiconductor substrate that includes a surface having a (110) crystallographic orientation, and a gate stack disposed over the group III-V compound semiconductor substrate. The gate stack includes a high-k dielectric layer disposed on the surface having the (110) crystallographic orientation, and a gate electrode disposed over the high-k dielectric layer.
    Type: Grant
    Filed: August 1, 2016
    Date of Patent: September 8, 2020
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD
    Inventors: Chao-Ching Cheng, Chih-Hsin Ko, Hsingjen Wann
  • Patent number: 10756212
    Abstract: Roughly described, a computer program product describes a transistor with a fin, a fin support, a gate, and a gate dielectric. The fin includes a first crystalline semiconductor material which includes a channel region of the transistor between a source region of the first transistor and a drain region of the transistor. The fin is on a fin support. The fin support includes a second crystalline semiconductor material different from the first crystalline semiconductor material. The first crystalline semiconductor material of the fin and the second crystalline semiconductor material of the fin support form a first heterojunction in between. A gate, gate dielectric, and/or isolation dielectric can be positioned to improve control within the channel.
    Type: Grant
    Filed: September 27, 2018
    Date of Patent: August 25, 2020
    Assignee: SYNOPSYS, INC.
    Inventors: Victor Moroz, Stephen Smith, Qiang Lu
  • Patent number: 10734472
    Abstract: A negative capacitance device includes a semiconductor layer. An interfacial layer is disposed over the semiconductor layer. An amorphous dielectric layer is disposed over the interfacial layer. A ferroelectric layer is disposed over the amorphous dielectric layer. A metal gate electrode is disposed over the ferroelectric layer. At least one of the following is true: the interfacial layer is doped; the amorphous dielectric layer has a nitridized outer surface; a diffusion-barrier layer is disposed between the amorphous dielectric layer and the ferroelectric layer; or a seed layer is disposed between the amorphous dielectric layer and the ferroelectric layer.
    Type: Grant
    Filed: April 23, 2019
    Date of Patent: August 4, 2020
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Chun-Chieh Lu, Cheng-Yi Peng, Chien-Hsing Lee, Ling-Yen Yeh, Chih-Sheng Chang, Carlos H. Diaz
  • Patent number: 10727427
    Abstract: In a method of forming a gate-all-around field effect transistor (GAA FET), a bottom support layer is formed over a substrate and a first group of carbon nanotubes (CNTs) are disposed over the bottom support layer. A first support layer is formed over the first group of CNTs and the bottom support layer such that the first group of CNTs are embedded in the first support layer. A second group of carbon nanotubes (CNTs) are disposed over the first support layer. A second support layer is formed over the second group of CNTs and the first support layer such that the second group of CNTs are embedded in the second support layer. A fin structure is formed by patterning at least the first support layer and the second support layer.
    Type: Grant
    Filed: August 31, 2018
    Date of Patent: July 28, 2020
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Timothy Vasen, Mark van Dal, Gerben Doornbos, Matthias Passlack
  • Patent number: 10692849
    Abstract: Disclosed herein is a semiconductor integrated circuit device which includes a standard cell with a plurality of fins extending in a first direction and arranged in a second direction that is perpendicular to the first direction. An active fin of the fins forms part of an active transistor. A dummy fin of the fins is disposed between the active fin and an end of the standard cell.
    Type: Grant
    Filed: January 31, 2019
    Date of Patent: June 23, 2020
    Assignee: SOCIONEXT INC.
    Inventor: Hiroyuki Shimbo
  • Patent number: 10680063
    Abstract: Stacked SiGe nanotubes and techniques for the fabrication thereof are provided. In one aspect, a method of forming a SiGe nanotube stack includes: forming Si and SiGe layers on a wafer, one on top of another, in an alternating manner; patterning at least one fin in the Si and SiGe layers; depositing an oxide material onto the at least one fin; and annealing the at least one fin under conditions sufficient to diffuse Ge atoms from the SiGe layers along an interface between the oxide material and the Si and SiGe layers to form at least one vertical stack of SiGe nanotubes surrounding Si cores. A SiGe nanotube device and method for formation thereof are also provided.
    Type: Grant
    Filed: September 7, 2018
    Date of Patent: June 9, 2020
    Assignee: International Business Machines Corporation
    Inventors: Juntao Li, Kangguo Cheng, Choonghyun Lee
  • Patent number: 10644109
    Abstract: After forming semiconductor fins including vertically oriented alternating first digital alloy sublayer portions comprised of SiGe and second digital alloy sublayer portions comprised of Si on sidewalls of a sacrificial fin located on a substrate, the sacrificial fin is removed, leaving the semiconductor fins protruding from a top surface of the substrate. The SiGe and Si digital alloy sublayer portions are formed using isotopically enriched Si and Ge source gases to minimize isotopic mass variation in the SiGe and Si digital alloy sublayer portions.
    Type: Grant
    Filed: August 3, 2018
    Date of Patent: May 5, 2020
    Assignee: International Business Machines Corporation
    Inventors: Karthik Balakrishnan, Stephen W. Bedell, Pouya Hashemi, Bahman Hekmatshoartabari, Alexander Reznicek
  • Patent number: 10636790
    Abstract: A semiconductor device and a method for manufacturing the same are disclosed. The method comprises forming active patterns on a substrate that includes first and second logic cell regions adjacent to each other in a first direction, and forming on the substrate a device isolation layer exposing upper portions of the active patterns. The forming the active patterns comprises forming first line mask patterns extending parallel to each other in the first direction and running across the first and second logic cell regions, forming on the first line mask patterns an upper separation mask pattern including a first opening overlapping at least two of the first line mask patterns, forming first hardmask patterns from the at least two first line mask patterns, and etching the substrate to form trenches defining the active patterns.
    Type: Grant
    Filed: September 25, 2018
    Date of Patent: April 28, 2020
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Min-chul Oh, Sejin Park
  • Patent number: 10580864
    Abstract: The present invention provides a semiconductor device, including a substrate, a first semiconductor layer, a plurality of first sub recess, a plurality of insulation structures and a first top semiconductor layer. The substrate has a first region disposed within an STI. The first semiconductor layer is disposed in the first region. The first sub recesses are disposed in the first semiconductor layer. The insulation structures are disposed on the first semiconductor layer. The first top semiconductor layer forms a plurality of fin structures, which are embedded in the first sub recesses, arranged alternatively with the insulation structures and protruding over the insulation structures.
    Type: Grant
    Filed: June 29, 2018
    Date of Patent: March 3, 2020
    Assignee: UNITED MICROELECTRONICS CORP.
    Inventor: Yu-Cheng Tung
  • Patent number: 10566417
    Abstract: A method of forming a self-forming spacer using oxidation. The self-forming spacer may include forming a fin field effect transistor on a substrate, the fin field effect transistor includes a gate on a fin, the gate is perpendicular to the fin; forming a gate spacer on the gate and a fin spacer on the fin, the gate spacer and the fin spacer are formed in a single step by oxidizing an exposed surface of the gate and an exposed surface of the fin; and removing the fin spacer from the fin.
    Type: Grant
    Filed: June 12, 2018
    Date of Patent: February 18, 2020
    Assignee: International Business Machines Corporation
    Inventors: Kevin K. Chan, Masaharu Kobayashi, Effendi Leobandung
  • Patent number: 10546770
    Abstract: A method of forming a semiconductor device. The method may include providing a semiconductor device structure. The semiconductor device structure may include a semiconductor fin; and a mask, disposed over the semiconductor fin, the mask defining a plurality of openings, wherein the semiconductor fin is exposed in the plurality of openings. The method may further include directing angled ions into the plurality of openings, wherein a plurality of trenches are formed in the semiconductor fin, wherein a given trench of the plurality of trenches comprises a reentrant profile.
    Type: Grant
    Filed: May 2, 2018
    Date of Patent: January 28, 2020
    Assignee: VARIAN SEMICONDUCTOR EQUIPMENT ASSOCIATES, INC.
    Inventor: Min Gyu Sung
  • Patent number: 10522685
    Abstract: The present disclosure teaches semiconductor devices and methods for manufacturing the same. Implementations of the semiconductor device may include: a semiconductor substrate; a semiconductor fin positioned on the semiconductor substrate; and a gate structure positioned on the semiconductor fin, where the gate structure includes a gate dielectric layer on a part of a surface of the semiconductor fin and a gate on the gate dielectric layer; where the gate includes a metal gate layer on the gate dielectric layer and a semiconductor layer on a side surface of at least one side of the metal gate layer; and where the semiconductor layer includes a dopant, where a conductivity type of the dopant is the opposite of a conductivity type of the semiconductor fin. The present disclosure can improve a work function of the device, thereby improving a current characteristic of the device during a working process, reducing the short channel effect (SCE), and lowering a leakage current.
    Type: Grant
    Filed: August 21, 2018
    Date of Patent: December 31, 2019
    Assignees: Semiconductor Manufacturing International (Beijing) Corp., Semiconductor Manufacturing International (Shanghai) Corp.
    Inventor: Meng Zhao
  • Patent number: 10504786
    Abstract: A method of forming a semiconductor structure includes providing a semiconductor substrate, forming at least one precursor semiconductor fin from the semiconductor substrate, etching through at least a portion of the at least one precursor semiconductor fin to form at least one patterned precursor semiconductor fin having a gap therein. The at least one patterned precursor semiconductor fin includes a first vertical surface and a second vertical surface with the gap therebetween. In addition, the method further includes forming a semiconductor material in the gap of the at least one patterned precursor semiconductor fin, in which the first vertical surface and the second vertical surface laterally surround the semiconductor material, and transforming the at least one patterned precursor semiconductor fin into at least one semiconductor fin including the semiconductor material therein.
    Type: Grant
    Filed: March 20, 2017
    Date of Patent: December 10, 2019
    Assignee: International Business Machines Corporation
    Inventors: Veeraraghavan S. Basker, Kangguo Cheng, Theodorus E. Standaert
  • Patent number: 10483392
    Abstract: A radio frequency (RF) integrated circuit (RFIC) switch multi-finger transistor includes a first dual gate transistor having a first gate with a first gate length on a first side of a substrate, and a second gate with a second gate length on a second side of the substrate. The RFIC also includes a second dual gate transistor having a third gate with a third gate length on the first side of the substrate, and a fourth gate with a fourth gate length on the second side of the substrate. The second gate length is different than the fourth gate length, and the second dual gate transistor is coupled in series with the first dual gate transistor in the RFIC switch multi-finger transistor.
    Type: Grant
    Filed: May 24, 2018
    Date of Patent: November 19, 2019
    Assignee: QUALCOMM Incorporated
    Inventor: Ravi Pramod Kumar Vedula
  • Patent number: 10468306
    Abstract: A strip made of a semiconductor material is formed over a substrate. Longitudinal portions of the strip having a same length are covered with sacrificial gates made of an insulating material and spaced apart from each other. Non-covered portions of the strip are doped to form source/drain regions. An insulating layer followed by a layer of a temporary material is then deposited. Certain ones of the sacrificial gates are left in place. Certain other ones of the sacrificial gates are replaced by a metal gate structure. The temporary material is then replaced with a conductive material to form contacts to the source/drain regions.
    Type: Grant
    Filed: April 1, 2018
    Date of Patent: November 5, 2019
    Assignee: STMicroelectronics (Crolles 2) SAS
    Inventor: Loic Gaben
  • Patent number: 10461080
    Abstract: A method for manufacturing a semiconductor device is provided. In the method for manufacturing a semiconductor device, at first, a semiconductor substrate of a wafer is etched to form at least one fin. Then, an insulation structure is formed around the fin. Thereafter, the fin is recessed. Then, an epitaxial channel structure is epitaxially grown over the recessed fin. Thereafter, a portion of the epitaxial channel structure over a top surface of the insulation structure is removed. Then, a non-contact-type cleaning operation is performed to clean a top surface of the wafer after removing said portion of the epitaxial channel structure. Thereafter, the top surface of the wafer is cleaned using hydrogen fluoride after removing said portion of the epitaxial channel structure. Then, the insulation structure is recessed, such that the epitaxial channel structure protrudes from the recessed insulation structure.
    Type: Grant
    Filed: August 3, 2018
    Date of Patent: October 29, 2019
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Shen-Nan Lee, Kuo-Yin Lin, Pin-Chuan Su, Teng-Chun Tsai
  • Patent number: 10446393
    Abstract: A method for forming a silicon-containing epitaxial layer is disclosed. The method may include, heating a substrate to a temperature of less than approximately 950° C. and exposing the substrate to a first silicon source comprising a hydrogenated silicon source, a second silicon source, a dopant source, and a halogen source. The method may also include depositing a silicon-containing epitaxial layer wherein the dopant concentration within the silicon-containing epitaxial layer is greater than 3×1021 atoms per cubic centimeter.
    Type: Grant
    Filed: April 19, 2018
    Date of Patent: October 15, 2019
    Assignee: ASM IP Holding B.V.
    Inventors: Nupur Bhargava, John Tolle, Joe Margetis, Matthew Goodman, Robert Vyne
  • Patent number: 10446561
    Abstract: Semiconductor devices including a dummy gate structure on a fin are provided. A semiconductor device includes a fin protruding from a substrate. The semiconductor device includes a source/drain region in the fin, and a recess region of the fin that is between first and second portions of the source/drain region. Moreover, the semiconductor device includes a dummy gate structure overlapping the recess region, and a spacer that is on the fin and adjacent a sidewall of the dummy gate structure.
    Type: Grant
    Filed: August 29, 2018
    Date of Patent: October 15, 2019
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Sang-Jine Park, Kee-Sang Kwon, Do-Hyoung Kim, Bo-Un Yoon, Keun-Hee Bai, Kwang-Yong Yang, Kyoung-Hwan Yeo, Yong-Ho Jeon
  • Patent number: 10424580
    Abstract: Semiconductor devices having modulated nanowire counts and methods to form such devices are described. For example, a semiconductor structure includes a first semiconductor device having a plurality of nanowires disposed above a substrate and stacked in a first vertical plane with a first uppermost nanowire. A second semiconductor device has one or more nanowires disposed above the substrate and stacked in a second vertical plane with a second uppermost nanowire. The second semiconductor device includes one or more fewer nanowires than the first semiconductor device. The first and second uppermost nanowires are disposed in a same plane orthogonal to the first and second vertical planes.
    Type: Grant
    Filed: December 23, 2011
    Date of Patent: September 24, 2019
    Assignee: Intel Corporation
    Inventors: Annalisa Cappellani, Kelin J. Kuhn, Rafael Rios, Gopinath Bhimarasetti, Tahir Ghani, Seiyon Kim
  • Patent number: 10381479
    Abstract: Techniques for interface charge reduction to improve performance of SiGe channel devices are provided. In one aspect, a method for reducing interface charge density (Dit) for a SiGe channel material includes: contacting the SiGe channel material with an Si-containing chemical precursor under conditions sufficient to form a thin continuous Si layer, e.g., less than 5 monolayers thick on a surface of the SiGe channel material which is optionally contacted with an n-dopant precursor; and depositing a gate dielectric on the SiGe channel material over the thin continuous Si layer, wherein the thin continuous Si layer by itself or in conjunction with n-dopant precursor passivates an interface between the SiGe channel material and the gate dielectric thereby reducing the Dit. A FET device and method for formation thereof are also provided.
    Type: Grant
    Filed: July 28, 2017
    Date of Patent: August 13, 2019
    Assignee: International Business Machines Corporation
    Inventors: Devendra Sadana, Dechao Guo, Joel P. de Souza, Ruqiang Bao, Stephen W. Bedell, Shogo Mochizuki, Gen Tsutsui, Hemanth Jagannathan, Marinus Hopstaken
  • Patent number: 10355140
    Abstract: The present disclosure provides a manufacturing method for a transistor with an SONOS structure, including providing a semiconductor substrate, wherein the semiconductor substrate includes a select transistor well and a memory transistor well; depositing an oxide layer on an upper surface of the select transistor well, depositing an ONO memory layer on an upper surface of the memory transistor well, depositing a barrier wall over adjacent portions of the select transistor well and the memory transistor well, depositing polycrystalline silicon covering the oxide layer, the ONO memory layer, and the barrier wall, and etching the polycrystalline silicon, to retain the polycrystalline silicon deposited on both sides of the barrier wall so as to form a select gate and a memory gate, and removing the oxide layer and the ONO layer on a surface of the semiconductor substrate other than the select gate, the barrier wall, and the memory gate.
    Type: Grant
    Filed: April 4, 2018
    Date of Patent: July 16, 2019
    Assignee: SHANGHAI HUALI MICROELECTRONICS CORPORATION
    Inventor: Xiaoliang Tang
  • Patent number: 10347767
    Abstract: A subfin layer is deposited in a trench in an insulating layer on the substrate. A fin is deposited on the subfin layer. The fin has a top portion and opposing sidewalls. The fin comprises a first semiconductor material. The subfin layer comprises a III-V semiconductor material.
    Type: Grant
    Filed: June 16, 2015
    Date of Patent: July 9, 2019
    Assignee: Intel Corporation
    Inventors: Willy Rachmady, Matthew V. Metz, Van H. Le, Ravi Pillarisetty, Gilbert Dewey, Jack T. Kavalieros, Ashish Agrawal
  • Patent number: 10332802
    Abstract: Integrated chips include a first device and a second device. The first device includes a stack of vertically arranged sheets of a first channel material, a source and drain region having a first dopant type, and a first work function metal layer formed from a first work function metal. The second device includes a stack of vertically arranged sheets of a second channel material, a source and drain region having a second dopant type, and a second work function metal layer formed from a second work function metal.
    Type: Grant
    Filed: October 27, 2017
    Date of Patent: June 25, 2019
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Zhenxing Bi, Kangguo Cheng, Peng Xu, Wenyu Xu
  • Patent number: 10332969
    Abstract: A semiconductor device includes a gate electrode structure that is positioned adjacent to a channel region of a transistor element. The gate electrode structure includes a floating gate electrode portion, a negative capacitor portion, and a ferroelectric material capacitively coupling the floating gate electrode portion to the negative capacitor portion. A first conductive material is positioned between the floating gate electrode portion and the ferroelectric material, wherein a first portion of the first conductive material is embedded in and laterally surrounded by the floating gate electrode portion, and a second conductive material is positioned between the first portion of the first conductive material and the ferroelectric material, wherein the second conductive material is embedded in and laterally surrounded by a second portion of the first conductive material.
    Type: Grant
    Filed: October 22, 2018
    Date of Patent: June 25, 2019
    Assignee: GLOBALFOUNDRIES Inc.
    Inventors: Rohit Galatage, Steven Bentley, Puneet Harischandra Suvarna, Zoran Krivokapic
  • Patent number: 10332891
    Abstract: A static random access memory includes a substrate, fins on the substrate and including a first fin for a first pull-up transistor, a second fin for a second pull-up transistor, a third fin for a first pass-gate transistor and a first pull-down transistor, and a fourth fin for a second pass-gate transistor and a second pull-down transistor, dummy fins on the substrate, gate structures on the fins for forming transistors, first and second recesses in the fins on opposite sides of the gate structures, third recesses in the dummy fins, a first epitaxial region in the first recess, a second epitaxial region in the second recess, a third epitaxial region in the third recess, a merged epitaxial region including the third epitaxial region and the first epitaxial region or the third epitaxial region and the second epitaxial region, and a contact member on the merged epitaxial region.
    Type: Grant
    Filed: April 30, 2018
    Date of Patent: June 25, 2019
    Assignees: SEMICONDUCTOR MANUFACTURING INTERNATIONAL (BEIJING) CORPORATION, SEMICONDUCTOR MANUFACTURING INTERNATIONAL (SHANGHAI) CORPORATION
    Inventor: Nan Wang
  • Patent number: 10332897
    Abstract: Various aspects include a static random access memory (SRAM) bitcell array structure. In some cases, the SRAM bitcell array structure includes at least one fin in an array of fins in a substrate, where a width of a first portion of the at least one fin is less than a width of a second portion of the at least one fin in the array of fins.
    Type: Grant
    Filed: September 17, 2018
    Date of Patent: June 25, 2019
    Assignee: GLOBALFOUNDRIES INC.
    Inventors: Xiaoqiang Zhang, Hui Zang, Ratheesh R. Thankalekshmi, Randy W. Mann
  • Patent number: 10332972
    Abstract: A vertical, single column compound semiconductor bipolar junction transistor device includes an all-around extrinsic base. Homojunction and heterojunction devices are formed using III-V compound semiconductor materials with appropriate bandgaps. Fabrication of the transistor device includes epitaxially growing a III-V compound semiconductor base region on a heavily doped III-V compound semiconductor bottom layer. A polycrystalline emitter/collector layer and the all-around extrinsic base are grown on the base region.
    Type: Grant
    Filed: November 20, 2017
    Date of Patent: June 25, 2019
    Assignee: International Business Machines Corporation
    Inventors: Karthik Balakrishnan, Pouya Hashemi, Tak H. Ning, Alexander Reznicek
  • Patent number: 10325819
    Abstract: At least one method, apparatus and system disclosed herein involves forming trench silicide region contact. A plurality of fins are formed on a semiconductor substrate. An epitaxial (EPI) feature is formed at a top portion of each fin of the first portion over a first portion of the fins. A gate region is formed over a second portion of the fins. A trench is formed in a portion of the gate region. A void is formed adjacent the a portion of the gate region. A first silicon feature is formed in the trench. A second silicon feature is formed in the void. Subsequently, a replacement metal gate (RMG) process is performed in the gate region. A TS cut region is formed over the trench. The first silicon feature and the second silicon feature are removed. A metallization process is performed in the void to form a contact.
    Type: Grant
    Filed: March 13, 2018
    Date of Patent: June 18, 2019
    Assignee: GLOBALFOUNDRIES INC.
    Inventors: Jinsheng Gao, Daniel Jaeger, Michael Aquilino, Patrick Carpenter, Jessica Dechene, Huy Cao, Mitchell Rutkowski, Haigou Huang
  • Patent number: 10319581
    Abstract: A method includes providing a structure having a substrate and first and second fins over the substrate and oriented lengthwise generally along a first direction; epitaxially growing semiconductor source/drain (S/D) features over the first and second fins, wherein a first semiconductor S/D feature over the first fin merges with a second semiconductor S/D feature over the second fin; and performing a first etching process to an area between the first and second fins, wherein the first etching process separates the first and second semiconductor S/D features.
    Type: Grant
    Filed: November 30, 2017
    Date of Patent: June 11, 2019
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Ming-Chang Wen, Chang-Yun Chang, Hsien-Chin Lin, Hung-Kai Chen
  • Patent number: 10312109
    Abstract: Patterning techniques are disclosed that can relax overlay requirements and/or increase integrated circuit design flexibility. An exemplary method includes forming a first set of fins and a second set of fins having different etch sensitivities on a material layer. The fins of the second set of fins are interspersed between the fins of the first set of fins. A first patterning process removes a subset of the first set of fins and a portion of the material layer underlying the subset of the first set of fins. The first patterning process avoids substantial removal of an exposed portion of the second set of fins. A second patterning process removes a subset of the second set of fins and a portion of the material layer underlying the subset of the second set of fins. The second patterning process avoids substantial removal of an exposed portion of the first set of fins.
    Type: Grant
    Filed: June 1, 2018
    Date of Patent: June 4, 2019
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Chin-Yuan Tseng, Chi-Cheng Hung, Chun-Kuang Chen, De-Fang Chen, Ru-Gun Liu, Tsai-Sheng Gau, Wei-Liang Lin
  • Patent number: 10297663
    Abstract: A method of forming a semiconductor structure includes forming outer spacers surrounding a dummy gate, the dummy gate being disposed over a channel stack comprising two or more nanosheet channels and sacrificial layers formed above and below each of the two or more nanosheet channels. The method also includes forming an oxide surrounding the outer spacers, the oxide being disposed over source/drain regions surrounding the channel stack. The method further includes removing the dummy gate, removing the outer spacers, and performing a channel release to remove the sacrificial layers in the channel stack following removal of the outer spacers. The method further includes performing conformal deposition of a dielectric layer and a work function metal on exposed portions of the oxide, and filling a gate metal over the channel stack, the gate metal being surrounded by the work function metal.
    Type: Grant
    Filed: April 19, 2017
    Date of Patent: May 21, 2019
    Assignee: International Business Machines Corporation
    Inventors: Chun W. Yeung, Chen Zhang
  • Patent number: 10283413
    Abstract: A semiconductor device includes a semiconductor substrate, an isolation structure, and a spacer. The semiconductor substrate includes at least one fin structure. The isolation structure is partly disposed in the fin structure and partly disposed above the fin structure. The fin structure includes a first fin and a second fin elongated in the same direction. A part of the isolation structure is disposed between the first fin and the second fin in the direction where the first fin and the second fin are elongated. The spacer is disposed on sidewalls of the isolation structure on the fin structure. The isolation structure in the present invention is partly disposed in the fin structure and partly disposed above the fin structure. The negative influence of a gate structure formed on the isolation structure and sinking into the isolation structure on the isolation performance of the isolation structure may be avoided accordingly.
    Type: Grant
    Filed: September 13, 2016
    Date of Patent: May 7, 2019
    Assignee: UNITED MICROELECTRONICS CORP.
    Inventors: En-Chiuan Liou, Yu-Cheng Tung, Chih-Wei Yang
  • Patent number: 10276697
    Abstract: A negative capacitance device includes a semiconductor layer. An interfacial layer is disposed over the semiconductor layer. An amorphous dielectric layer is disposed over the interfacial layer. A ferroelectric layer is disposed over the amorphous dielectric layer. A metal gate electrode is disposed over the ferroelectric layer. At least one of the following is true: the interfacial layer is doped; the amorphous dielectric layer has a nitridized outer surface; a diffusion-barrier layer is disposed between the amorphous dielectric layer and the ferroelectric layer; or a seed layer is disposed between the amorphous dielectric layer and the ferroelectric layer.
    Type: Grant
    Filed: October 27, 2017
    Date of Patent: April 30, 2019
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Chun-Chieh Lu, Cheng-Yi Peng, Chien-Hsing Lee, Ling-Yen Yeh, Chih-Sheng Chang, Carlos H. Diaz
  • Patent number: 10276559
    Abstract: A mandrel is formed over an active region that includes a first region and a second region. The first region and the second region are reserved for the formation of a source and a drain of a FinFET, respectively. A portion of the mandrel formed over the second region is broken up into a first segment and a second segment separated from the first segment by a gap. Spacers are formed on opposite sides of the mandrel. Using the spacers, fins are defined. The fins protrude upwardly out of the active region. A portion of the second region corresponding to the gap has no fins formed thereover. The source is epitaxially grown on the fins in the first region. At least a portion of the drain is epitaxially grown on the portion of the second region having no fins.
    Type: Grant
    Filed: January 5, 2018
    Date of Patent: April 30, 2019
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Tzung-Chi Lee, Tung-Heng Hsieh, Bao-Ru Young, Yung Feng Chang
  • Patent number: 10269935
    Abstract: A semiconductor device includes a first fin structure for a first fin field effect transistor (PET). The first fin structure includes a first base layer protruding from a substrate, a first intermediate layer disposed over the first base layer and a first channel layer disposed over the first intermediate layer. The first fin structure further includes a first protective layer made of a material that prevents an underlying layer from oxidation. The first channel layer is made of SiGe, the first intermediate layer includes a first semiconductor (e.g., SiGe) layer disposed over the first base layer and a second semiconductor layer (e.g., Si) disposed over the first semiconductor layer. The first protective layer covers side walls of the first base layer, side walls of the first semiconductor layer and side walls of the second semiconductor layer.
    Type: Grant
    Filed: August 31, 2017
    Date of Patent: April 23, 2019
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Gin-Chen Huang, Tzu-Hsiang Hsu, Chia-Jung Hsu, Feng-Cheng Yang, Teng-Chun Tsai
  • Patent number: 10262855
    Abstract: A method is provided for forming Group IIIA-nitride layers, such as GaN, on substrates. The Group IIIA-nitride layers may be deposited on mesa-patterned semiconductor-on-insulator (SOI, e.g., silicon-on-insulator) substrates. The Group IIIA-nitride layers may be deposited by heteroepitaxial deposition on mesa-patterned semiconductor-on-insulator (SOI, e.g., silicon-on-insulator) substrates.
    Type: Grant
    Filed: December 21, 2015
    Date of Patent: April 16, 2019
    Assignee: GlobalWafers Co., Ltd.
    Inventors: Gang Wang, Michael R. Seacrist
  • Patent number: 10256152
    Abstract: One illustrative method disclosed herein includes, among other things, forming a conformal piezoelectric material liner layer on at least the opposing lateral sidewalls of a fin, forming a recessed layer of insulating material on opposite sides of the fin and on the conformal piezoelectric material liner layer, removing portions of the conformal piezoelectric material liner layer positioned above the recessed layer of insulating material to thereby expose a portion of the fin above the recessed upper surface, and forming a gate structure above the recessed layer of insulating material and around a portion of the fin positioned above the recessed upper surface.
    Type: Grant
    Filed: July 24, 2017
    Date of Patent: April 9, 2019
    Assignee: GLOBALFOUNDRIES Inc.
    Inventors: Qun Gao, Naved Siddiqui, Anthony I. Chou
  • Patent number: 10249536
    Abstract: A method of forming a semiconductor structure includes providing a semiconductor substrate, forming at least one precursor semiconductor fin from the semiconductor substrate, etching through at least a portion of the at least one precursor semiconductor fin to form at least one patterned precursor semiconductor fin having a gap therein. The at least one patterned precursor semiconductor fin includes a first vertical surface and a second vertical surface with the gap therebetween. In addition, the method further includes forming a semiconductor material in the gap of the at least one patterned precursor semiconductor fin, in which the first vertical surface and the second vertical surface laterally surround the semiconductor material, and transforming the at least one patterned precursor semiconductor fin into at least one semiconductor fin including the semiconductor material therein.
    Type: Grant
    Filed: March 20, 2017
    Date of Patent: April 2, 2019
    Assignee: International Business Machines Corporation
    Inventors: Veeraraghavan S. Basker, Kangguo Cheng, Theodorus E. Standaert
  • Patent number: 10181526
    Abstract: The present disclosure relates to a field-effect transistor and a method of fabricating the same. A field-effect transistor includes a semiconductor substrate including a first semiconductor material having a first lattice constant, and a fin structure on the semiconductor substrate. The fin structure includes a second semiconductor material having a second lattice constant that is different from the first lattice constant. The fin structure further includes a lower portion that is elongated in a first direction, a plurality of upper portions protruding from the lower portion and elongated in a second direction that is different from the first direction, and a gate structure crossing the plurality of upper portions.
    Type: Grant
    Filed: May 23, 2017
    Date of Patent: January 15, 2019
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Mirco Cantoro, Yeoncheol Heo
  • Patent number: 10141428
    Abstract: A method of forming a semiconductor device that includes forming a silicon including fin structure and forming a germanium including layer on the silicon including fin structure. Germanium is then diffused from the germanium including layer into the silicon including fin structure to convert the silicon including fin structure to silicon germanium including fin structure.
    Type: Grant
    Filed: March 21, 2017
    Date of Patent: November 27, 2018
    Assignee: International Business Machines Corporation
    Inventors: Kangguo Cheng, Bruce B. Doris, Hong He, Ali Khakifirooz, Yunpeng Yin
  • Patent number: 10141189
    Abstract: In some embodiments, a compound semiconductor is formed by diffusion of semiconductor species from a source semiconductor layer into semiconductor material in a substrate. The source semiconductor layer may be an amorphous or polycrystalline structure, and provides a source of semiconductor species for later diffusion into the other semiconductor material. Advantageously, such a semiconductor layer may be more conformal than an epitaxially grown, crystalline semiconductor layer. As a result, this more conformal semiconductor layer acts as a uniform source of the semiconductor species for diffusion into the semiconductor material in the substrate. In some embodiments, an interlayer is formed between the source semiconductor layer and the substrate, and then the interlayer is trimmed before depositing the source semiconductor layer. In some other embodiments, the source semiconductor layer is deposited directly on the substrate, and has an amorphous or polycrystalline structure.
    Type: Grant
    Filed: December 29, 2016
    Date of Patent: November 27, 2018
    Assignee: ASM IP HOLDING B.V.
    Inventors: Harald Profijt, Qi Xie, Jan Willem Maes, David Kohen
  • Patent number: 10134876
    Abstract: The present disclosure generally relates to semiconductor structures and, more particularly, to finFETs with strained channels and reduced on state resistances and methods of manufacture. The structure includes: a plurality of fin structures comprising doped source and drain regions with a diffusion blocking layer between the doped source and drain regions and an underlying fin region formed within dielectric material.
    Type: Grant
    Filed: March 31, 2017
    Date of Patent: November 20, 2018
    Assignee: GLOBALFOUNDRIES INC.
    Inventors: Bharat V. Krishnan, Timothy J. McArdle, Rinus Tek Po Lee, Shishir K. Ray, Akshey Sehgal
  • Patent number: 10103025
    Abstract: A method includes oxidizing a semiconductor fin to form an oxide layer on opposite sidewalls of the semiconductor fin. The semiconductor fin is over a top surface of an isolation region. After the oxidizing, a tilt implantation is performed to implant an impurity into the semiconductor fin. The oxide layer is removed after the tilt implantation.
    Type: Grant
    Filed: November 28, 2016
    Date of Patent: October 16, 2018
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventor: Wen-Tai Lu