Abstract: Apparatuses and methods are provided for the continuous formation of solar cell material including an isolation chamber that reduces cross contamination between adjacent formation zones that are at different pressures.

Abstract: A method for fabricating a thin film photovoltaic device. The method includes providing a substrate comprising an absorber layer and an overlying window layer. The substrate is loaded into a chamber and subjected to a vacuum environment. The vacuum environment is at a pressure ranging from 0.1 Torr to about 0.02 Torr. In a specific embodiment, a mixture of reactant species derived from diethylzinc species, water species and a carrier gas is introduced into the chamber. The method further introduces a diborane species using a selected flow rate into the mixture of reactant species. A zinc oxide film is formed overlying the window layer to define a transparent conductive oxide using the selected flow rate to provide a resistivity of about 2.5 milliohm-cm and less and an average grain size of about 3000 to 5000 Angstroms.

Abstract: An anisotropic conductive material prevents conduction resistance from varying among bumps or among linear terminals when connecting an IC chip or a flexible wire to a wiring board via the anisotropic conductive material. The anisotropic conductive material is formed by dispersing conductive particles in an insulating binder. The minimum melt viscosity [?0] thereof is in a range of from 1×102 to 1×106 mPa·sec, and satisfies the following equation (1): 1<[?1]/[?0]?3??(1) where in the equation (1), [?0] represents the minimum melt viscosity of the anisotropic conductive material, and [?1] represents a melt viscosity at a temperature T1 which is 30° C. lower than a temperature T0 at which the minimum melt viscosity is exhibited.

Abstract: A system is provided for heating or cooling discrete, linearly conveyed substrates having a gap between a trailing edge of a first substrate and a leading edge of a following substrate in a conveyance direction. The system includes a chamber, and a conveyor operably configured within the chamber to move the substrates through at a conveyance rate. A plurality of individually controlled temperature control units, for example heating or cooling units, are disposed linearly within the chamber along the conveyance direction. A controller is in communication with the temperature control units and is configured to cycle output of the temperature control units from a steady-state temperature output as a function of the spatial position of the conveyed substrates within the chamber relative to the temperature control units so as to decrease temperature variances in the substrates caused by movement of the substrates through the chamber.

Abstract: In a method for continuously coating a wafer for solar cell production, in a coating bath comprising metal such as nickel, copper or silver, said metal is deposited on the wafer. The wafer is introduced into the coating bath and, at a point in time at which the wafer already extends into the coating bath with a first region, but does not extend into it with a second region, a current surge is effected at the second region of the wafer, This initiates the electrodeposition of the metal on the first region of the wafer extending into the coating bath for a subsequent automatic coating with the wafer having been completely introduced into the coating bath, also on the remaining area of said wafer, without a further current surge or current flow.

Abstract: An integrated apparatus is provided for vapor deposition of a sublimated source material as a thin film on a photovoltaic module substrate and subsequent vapor treatment. The apparatus can include a load vacuum chamber, a first vapor deposition chamber; and a second vapor deposition chamber that are integrally connected such that substrates being transported through the apparatus are kept at a system pressure less than about 760 Torr. A conveyor system can be operably disposed within the apparatus and configured for transporting substrates in a serial arrangement into and through load vacuum chamber, into and through the first vapor deposition chamber, and into and through the second vapor deposition chamber at a controlled speed. Processes are also provided for manufacturing a thin film cadmium telluride thin film photovoltaic device.

Abstract: The invention pertains to a method for making a solar cell module comprising solar cells connected in series, comprising the steps of: a) making in a system composed of a substrate-overlaid by a first electrode layer, itself overlaid by an active layer, a first, interruption, groove providing an interrupt in the front electrode and the active layer and a second, interconnection, groove through the active layer, the first and second grooves being positioned close to each other; b) inserting an insulating compound into the interruption groove; c) applying a lift-off compound onto the active layer at a position adjacent to the interconnection groove on the other side of the interconnection groove than the insulation groove; d) applying the second electrode; e) removing the lift-off compound and the overlaying second electrode at that position to obtain a groove in the second electrode.

Abstract: The invention pertains to a process for manufacturing a solar cell foil comprising the steps of: providing an etchable temporary substrate applying a front electrode of a transparent conductive oxide (TCO) onto the temporary substrate applying a photovoltaic layer onto the TCO layer applying a back electrode layer applying a permanent carrier ensuring that the front electrode and the back electrode are electrically connected in an interconnect to establish a series connection, the front and the back electrode each being interrupted by front and back groove, respectively, at different sides of the interconnect in any one of the preceding steps providing an etch resist on the non-TCO side of the temporary substrate at least at the location of the interconnect, and at least not at the entire location of the front groove selectively removing the temporary substrate where it is not covered with etch resist.

Abstract: This disclosure provides polymer electrolytes for dye-sensitized solar cells that can not only prevent electrolytes from leaking, but also exhibit a higher solar conversion efficiency when compared with conventional polymer electrolytes, whereby the polymer electrolytes are applicable to a process for manufacturing dye-sensitized solar cells with a large surface area or flexible dye-sensitized solar cells, and methods for manufacturing modules of dye-sensitized solar cells using the same.

Abstract: Methods for forming a TCO layer on a substrate are generally provided and include sputtering a TCO layer on a substrate from a target including cadmium stannate. A cap material (e.g., including cadmium) is deposited onto an outer surface of an indirect anneal system, and the TCO layer can be annealed at an anneal temperature while in contact with or within about 10 cm of the cap material. An anneal oven is also generally provided and includes an indirect anneal system defining a deposition surface and an anneal surface such that a cap material deposited on the anneal surface of the indirect anneal system is positioned to be in contact with or within about 10 cm of a thin film on the substrate. A cap material source can be positioned to deposit the cap material onto the deposition surface such that the anneal surface comprises the cap material.

Abstract: An apparatus includes a first substrate; and a second substrate coupled to the first substrate, characterized in that, to control formation of a segregated phase domain structure within a chemical reaction product by controlling an amount of a constituent of a precursor that is present per unit surface area, at least one member selected from the group consisting of the first substrate and the second substrate defines a substantially regularly periodically varying relief with respect to basal spatial location.

Abstract: Multi-zone, solar cell diffusion furnaces having a plurality of radiant element (SiC) or/and high intensity IR lamp heated process zones, including baffle, ramp-up, firing, soaking and cooling zone(s). The transport of solar cell wafers, e.g., silicon, selenium, germanium or gallium-based solar cell wafers, through the furnace is implemented by use of an ultra low-mass, wafer transport system comprising laterally spaced shielded metal bands or chains carrying non-rotating alumina tubes suspended on wires between them. The wafers rest on raised circumferential standoffs spaced laterally along the alumina tubes, which reduces contamination. The bands or chains are driven synchronously at ultra-low tension by a pin drive roller or sprocket at either the inlet or outlet end of the furnace, with appropriate tensioning systems disposed in the return path. The high intensity IR flux rapidly photo-radiation conditions the wafers so that diffusion occurs >3× faster than conventional high-mass thermal furnaces.

Abstract: An apparatus and related process are provided for vapor deposition of a sublimated source material as a thin film on a photovoltaic (PV) module substrate. A deposition head is configured for sublimating a source material supplied thereto. The sublimated source material condenses onto a transport conveyor disposed below the deposition head. A substrate conveyor is disposed below the transport conveyor and conveys substrates in a conveyance path through the apparatus such that an upper surface of the substrates is opposite from and spaced below a lower leg of the transport conveyor. A heat source is configured adjacent the lower leg of the transport conveyor. The source material plated onto the transport conveyor is sublimated along the lower leg and condenses onto to the upper surface of substrates conveyed by the substrate conveyor.

Abstract: A system and related method for deposition of multiple thin film layers on photovoltaic (PV) module substrates includes a first processing side wherein the substrates are conveyed in a first direction for deposition of a first thin film layer on the substrates. A second processing side is operably disposed relative to the first processing side such that substrates exiting the first processing side are subsequently conveyed in a second direction through the second processing side for deposition of a second thin film layer on the first thin film layer. A first transfer station is operably disposed between the first processing side and the second processing side to receive the substrates from an exit of the first processing side and to introduce the substrates into an entry of the second processing side such that the substrates are continuously moved through the first and second processing sides for deposition of multiple thin film layers thereon.

Abstract: A method for fabricating a thin film photovoltaic device. The method includes providing a substrate comprising an absorber layer and an overlying window layer. The substrate is loaded into a chamber and subjected to a vacuum environment. The vacuum environment is at a pressure ranging from 0.1 Torr to about 0.02 Torr. In a specific embodiment, a mixture of reactant species derived from diethylzinc species, water species and a carrier gas is introduced into the chamber. The method further introduces a diborane species using a selected flow rate into the mixture of reactant species. A zinc oxide film is formed overlying the window layer to define a transparent conductive oxide using the selected flow rate to provide a resistivity of about 2.

Abstract: Protuberances, having vertical and lateral dimensions less than the wavelength range of lights detectable by a photodiode, are formed at an optical interface between two layers having different refractive indices. The protuberances may be formed by employing self-assembling block copolymers that form an array of sublithographic features of a first polymeric block component within a matrix of a second polymeric block component. The pattern of the polymeric block component is transferred into a first optical layer to form an array of nanoscale protuberances. Alternately, conventional lithography may be employed to form protuberances having dimensions less than the wavelength of light. A second optical layer is formed directly on the protuberances of the first optical layer. The interface between the first and second optical layers has a graded refractive index, and provides high transmission of light with little reflection.

Abstract: A method and a system for forming a copper indium gallium sulfur selenide (CIGSSe) absorption layer and a cadmium sulfide (CdS) buffer layer under non-vacuum condition is disclosed. A coating layer is formed on the back electrode layer on the substrate by mixing the slurry on the back electrode layer, and the coating layer formed on the back electrode layer is densified by a densification device after initially dried, and then a primary selenization/sulfurization reaction process is carried out to form a primary CIGSSe layer, and then a thermal process is carried out to improve the lattice match of the primary CIGSSe layer, and then an impurity cleaning process is carried out by using potassium cyanide or bromide to remove the impurities of cuprous selenide and copper sulfide, and then a rear-stage selenization/sulfurization reaction process is carried out to produce the required rear-stage CIGSSe absorption layer.

Abstract: A photovoltaic device is disclosed that includes a transparent front electrode formed by the self-assembly of conductive nanoparticles from an emulsion coated onto a substrate and dried. The nanoparticles self-assemble into a network-like pattern of conductive traces that define randomly-shaped transparent cells. The cells may be filled with various transparent filler materials and additional layers may be present in the device in addition to conventional components. Processes for forming the transparent electrode are also disclosed.

Abstract: A photoelectric conversion device manufacturing method, includes: continuously forming a first p-type semiconductor layer, a first i-type semiconductor layer, and a first n-type semiconductor layer, which constitute a first-photoelectric conversion unit, and a second p-type semiconductor layer which constitutes a second-photoelectric conversion unit composed of a crystalline-silicon-based thin film, in a reduced-pressure atmosphere; exposing the second p-type semiconductor layer to an air atmosphere; and forming a second i-type semiconductor layer and a second n-type semiconductor layer, which constitute the second-photoelectric conversion unit, on the second p-type semiconductor layer which was exposed to an air atmosphere.

Abstract: A method for fabricating a microelectromechanical or microoptoelectromechanical component. The method includes producing first and second layer composites. The first has a first substrate and a first insulation layer, which covers at least one part of the surface of the first substrate, while the second has a second substrate and a second insulation layer, which covers at least one part of the surface of the second substrate. An at least partly conductive structure layer is applied to the first insulation layers and the second composite is applied to the structure layer so that the second insulation layer adjoins the structure layer. The first and second layer composites and the structure layer are configured so that at least one part of the structure layer that comprises the active area of the microelectromechanical or microoptoelectromechanical component is hermetically tightly sealed by the first and second layer composites.

Abstract: A system and associated process for vapor deposition of a thin film layer on a photovoltaic (PV) module substrate is includes establishing a vacuum chamber and introducing the substrates individually into the vacuum chamber. A conveyor system is operably disposed within the vacuum chamber and is configured for conveying the substrates in a serial arrangement through a vapor deposition apparatus within the vacuum chamber at a controlled constant linear speed. A post-heat section is disposed within the vacuum chamber immediately downstream of the vapor deposition apparatus in the conveyance direction of the substrates. The post-heat section is configured to maintain the substrates conveyed from the vapor deposition apparatus in a desired heated temperature profile until the entire substrate has exited the vapor deposition apparatus.

Abstract: A method for the selective doping of silicon of a silicon substrate (1) for producing a pn-junction in the silicon is characterized by the following steps: a) Providing the surface of the silicon substrate (1) with a doping agent (2) based on phosphorous, b) heating the silicon substrate (1) for creating a phosphorous silicate glass (2) on the surface of the silicon, wherein phosphorous diffuses into the silicon as a first doping (3), c) applying a mask (4) on the phosphorous silicate glass (2), covering the regions (5) that are later highly doped, d) removing the phosphorous silicate glass (2) in the non-masked regions, e) removing the mask (4) from the phosphorous silicate glass (2), f) again heating for the further diffusion of phosphorous from the phosphorous silicate glass (2) into the silicon as a second doping for creating the highly doped regions (5), g); complete removal of the phosphorous silicate glass (2) from the silicon.

Abstract: The present invention relates to integrated thin film solar cells, and more particularly, to integrated thin film solar cells, which minimize the loss of integrated solar cells caused at the time of a manufacturing process and become available at a low cost process, and a method of manufacturing thereof, a processing method of a transparent electrode for integrated thin film solar cells, which widens an effective area and reduces manufacturing costs by minimizing a (insulating) gap between unit cells of the integrated thin film solar cells, and a structure thereof, and a transparent substrate having the transparent electrode.

Abstract: An environmental sensor including an inlet and an outlet such that a flow of fluid moves from the inlet to the outlet, a particle detection portion to detect particles in the fluid, and a controller connected to the particle detection portion. The environmental sensor can be in communication with a data acquisition system (e.g., via a wireless access point) to form a particle counting system. Also disclosed are methods of operating the environmental sensor and methods of operating the particle detection system.

Abstract: A process of making a photovoltaic unit includes steps of simultaneously forming a first layer of n-type material and a second layer of p-type material using a continuous casting process, and continuously bonding the first and second layers to form a p-n junction. The process may be performed using a twin-roll type continuous casting system having a continuous casting mold that includes a first mold compartment for receiving molten n-type material and a second mold compartment for receiving molten p-type material. The molten n-type material and the molten p-type material are gradually solidified into semi-solid shells and are pressed together by opposed casting rolls, creating a metallurgical bond between the n-type material and the p-type material that forms an effective p-n junction. The process permits the large scale efficient manufacturing of photovoltaic units.

Abstract: A photovoltaic device including a current collection element and a method of making same. The photovoltaic device includes a substrate, a conductive layer, an active photovoltaic material, a transparent electrode and a current collection element. The current collection element includes a transparent support and one or more conductive wires integrated therewith. The conductive wires are in electrical communication with the transparent electrode. Current generated by the active photovoltaic material passes to the transparent electrode. The current collection element facilitates delivery of current passing through the transparent electrode to leads that deliver the current to an external load. The method includes placing a pre-fabricated current collection element in direct contact with the transparent electrode of the photovoltaic device. The time and expense of assembling the conductive wires during fabrication of the photovoltaic device is thereby avoided and higher manufacturing speeds are achieved.

Abstract: A process of making a photovoltaic unit includes steps of simultaneously forming a first layer of n-type material and a second layer of p-type material using a continuous casting process, and continuously bonding the first and second layers to form a p-n junction. The process may be performed using a twin-roll type continuous casting system having a continuous casting mold that includes a first mold compartment for receiving molten n-type material and a second mold compartment for receiving molten p-type material. The molten n-type material and the molten p-type material are gradually solidified into semi-solid shells and are pressed together by opposed casting rolls, creating a metallurgical bond between the n-type material and the p-type material that forms an effective p-n junction. The process permits the large scale efficient manufacturing of photovoltaic units.

Abstract: An object relates to an electrode of a semiconductor device or a method for manufacturing a semiconductor device, which includes a bonding step, and problems are: (1) high resistance of a semiconductor device due to the use of an Al electrode, (2) formation of an alloy by Al and Si, (3) high resistance of a film formed by a sputtering method, and (4) defective bonding in a bonding step which is caused if a bonding surface has a large unevenness. A semiconductor device includes a metal substrate or a substrate provided with a metal film, a copper (Cu) plating film over and bonded to the metal substrate or the metal film by employing a thermocompression bonding method, a barrier film over the Cu plating film, a single crystal silicon film over the barrier film, and an electrode layer over the single crystal silicon film.

Abstract: A method of forming a MEMS device provides a wafer having a base with a conductive portion. The wafer also has an intermediate conductive layer. After it provides the wafer, the method adds a diaphragm layer to the wafer. The method removes at least a portion of the intermediate conductive layer to form a cavity between the diaphragm layer and the base. At least a portion of the diaphragm layer is movable relative to the base. After it forms the cavity, the method seals the cavity.

Abstract: The invention permits a plurality of strips of resin adhesive film having a desired width and unwound from a single feeding reel to be simultaneously pasted on a solar cell. For this purpose, the invention comprises the steps of: unwinding a resin adhesive film sheet from a reel on which the resin adhesive film sheet is wound; splitting the unwound resin adhesive film into two or more film strips in correspondence to lengths of wiring material to bond; pasting the strips of resin adhesive film on an electrode of the solar cell; and placing the individual lengths of wiring material on the electrode of the solar cell having the plural strips of resin adhesive film pasted thereon and thermally setting the resin adhesive film by heating so as to fix together the electrode of the solar cell and the wiring material.

Abstract: According to one aspect of the present invention, there is provided a thin film solar cell comprising a substrate, a photoelectric conversion layer formed on said substrate, said photoelectric conversion layer having a thickness of 1 ?m or less, and said photoelectric conversion layer comprising a p-type semiconductor layer, an n-type semiconductor layer, and are i-type semiconductor layer placed between said p-type semiconductor layer and said n-type semiconductor layer, a light-incident side electrode layer formed on a light-incident surface of said photoelectric conversion layer and a counter electrode layer formed on the surface opposite to the light-incident surface. Said light-incident side electrode layer has plural openings bored though said layer, and the thickness thereof is in the range of 10 nm to 200 nm. Each of said openings occupies an area of 80 nm2 to 0.8 ?m2. The opening ratio is in the range of 10% to 66%.

Abstract: Embodiments of the invention generally contemplate methods for treating a semiconductor solar cell substrate to reduce the number of undesirable material defects or interface state traps on the surface or within the substrate. These defects can adversely affect the efficiency of the solar cell because electron-hole pairs tend to recombine with the defects and are essentially lost without generating any useful electrical current. In one aspect, a method of forming a solar cell on a semiconductor substrate is provided, comprising doping a front surface of the substrate, applying a passivating layer to the front surface and/or a back surface of the substrate, and annealing the substrate to reduce the interface state trap density (Dit).

Abstract: There is provided a method for manufacturing a solid-state image device which includes the steps of: forming a silicon epitaxial growth layer on a silicon substrate; forming photoelectric conversion portions, transfer gates, and a peripheral circuit portion in and/or on the silicon epitaxial growth layer and further forming a wiring layer on the silicon epitaxial growth layer; forming a split layer in the silicon substrate at a side of the silicon epitaxial growth layer; forming a support substrate on the wiring layer; peeling the silicon substrate from the split layer so as to leave a silicon layer formed of a part of the silicon substrate at a side of the support substrate; and planarizing the surface of the silicon layer.

Abstract: This invention comprises manufacture of photovoltaic cells by deposition of thin film photovoltaic junctions on metal foil substrates. The photovoltaic junctions may be heat treated if appropriate following deposition in a continuous fashion without deterioration of the metal support structure. In a separate operation, an interconnection substrate structure is provided, optionally in a continuous fashion. Multiple photovoltaic cells are then laminated to the interconnection substrate structure and conductive joining methods are employed to complete the array. In this way the interconnection substrate structure can be uniquely formulated from polymer-based materials employing optimal processing unique to polymeric materials. Furthermore, the photovoltaic junction and its metal foil support can be produced in bulk without the need to use the expensive and intricate material removal operations currently taught in the art to achieve series interconnections.

Abstract: A stacked-layered thin film solar cell and a manufacturing method thereof are provided. The stacked-layered thin film solar cell includes a front electrode layer, a stacked-layered light-absorbing structure, and a back electrode layer. The stacked-layered light-absorbing structure has a p-i-n-type layered structure and consists essentially of I-III-VI compounds, wherein the group III elements at least include indium (In) and aluminum (Al). The p-type layer of the stacked-layered light-absorbing structure is near the front electrode layer while the n-type layer is near the back electrode layer. The Al/In concentration ratio in the p-type layer is higher than that in the n-type layer.

Abstract: The invention pertains to a method for making a solar cell module comprising solar cells connected in series, comprising the steps of: a) making in a system composed of a substrate-overlaid by a first electrode layer, itself overlaid by an active layer, a first, interruption, groove providing an interrupt in the front electrode and the active layer and a second, interconnection, groove through the active layer, the first and second grooves being positioned close to each other; b) inserting an insulating compound into the interruption groove; c) applying a lift-off compound onto the active layer at a position adjacent to the interconnection groove on the other side of the interconnection groove than the insulation groove; d) applying the second electrode; e) removing the lift-off compound and the overlaying second electrode at that position to obtain a groove in the second electrode.

Abstract: The present invention generally provides a batch substrate processing system, or cluster tool, for in-situ processing of a film stack used to form regions of a solar cell device. In one configuration, the film stack formed on each of the substrates in the batch contains one or more silicon-containing layers and one or more metal layers that are deposited and further processed within the various chambers contained in the substrate processing system.

Abstract: A method for forming a thin film photovoltaic material. The method includes providing a plurality of substrates. Each of the substrates has a surface region, an overlying first electrode material, an absorber material including at least a copper species, an indium species, and a selenium species. The method immerses the plurality of substrates in an aqueous solution including an ammonia species, a cadmium species, and a organosulfur (for example, thiourea) species in a bath to form a cadmium sulfide window material having a thickness of less than about 200 Angstroms overlying the absorber material. The aqueous solution is maintained at a temperature ranging from about 50 to about 60 Degrees Celsius. The plurality of substrates having at least the absorber material and the window layer are removed from the aqueous solution. The aqueous solution is further subjected to a filter process to substantially remove one or more particles greater than about 5 microns.

Abstract: The present invention generally relates to a system that can be used to form a photovoltaic device, or solar cell, using processing modules that are adapted to perform one or more steps in the solar cell formation process. The automated solar cell fab is generally an arrangement of automated processing modules and automation equipment that is used to form solar cell devices. The automated solar fab will thus generally comprise a substrate receiving module that is adapted to receive a substrate, one or more absorbing layer deposition cluster tools having at least one processing chamber that is adapted to deposit a silicon-containing layer on a surface of the substrate, one or more back contact deposition chambers, one or more material removal chambers, a solar cell encapsulation device, an autoclave module, an automated junction box attaching module, and one or more quality assurance modules that are adapted to test and qualify the completely formed solar cell device.

Abstract: Solar cells provided with color modulation and a method for fabricating the same are disclosed. The solar cell includes a photoelectric conversion layer and a color-modulating layer provided over the photoelectric conversion layer. The photoelectric conversion layer is employed for generating electrical energy from incident light and the color-modulating layer is used to modulate colorful appearance.

Abstract: A continuous flexible sheet for use in fabricating flexible solar cell modules is provided. The continuous flexible sheet includes an elongated protective sheet having a front surface and a back surface. The back surface includes at least two barrier regions and an at least one separation region. At least two moisture barrier layers attached to the at least two barrier regions. The at least one separation region surrounds and physically separates the at least two barrier layers attached to the at least two barrier regions.

Abstract: A photoelectric conversion device and a method for manufacturing the same are provided. The photoelectric conversion device includes a first semiconductor layer including a first impurity element over a substrate, a second semiconductor layer including an amorphous layer and a crystal over the first semiconductor layer, and a third semiconductor layer including a second impurity element over the second semiconductor layer. The crystal penetrates between the first semiconductor layer and the third semiconductor layer.

Abstract: Apparatuses and methods for manufacturing a solar cell are disclosed. In a particular embodiment, the solar cell may be manufactured by disposing a solar cell in a chamber having a particle source; disposing a patterned assembly comprising an aperture and an assembly segment between the particle source and the solar cell; and selectively implanting first type dopants traveling through the aperture into a first region of the solar cell while minimizing introduction of the first type dopants into a region outside of the first region.

Abstract: A solar cell element and method of manufacturing same is disclosed. A reverse-conductive-type layer is formed on at least one part of a first surface side of a one-conductive-type semiconductor substrate. A conductive layer is formed on the reverse-conductive-type layer. A contact region for electrically connecting the conductive layer and the one-conductive-type semiconductor substrate is formed by heating and melting at least one part of the conductive layer. The solar cell element can be manufactured without conducting complicated treatments, such as removal by etching and re-growing of a silicon thin layer.

Abstract: Micro-mechanical devices, such as MEMS, having layers thereon, and methods of forming the layers, are disclosed. In one aspect, a method may include forming a layer including an oxide of aluminum over at least a portion of a micro-mechanical device, and coating the layer by bonding material to surface hydroxyl groups of the layer. In another aspect, a method may include introducing a micro-mechanical device into an atomic layer deposition chamber, and substantially filling nanometer sized voids of the micro-mechanical device by using atomic layer deposition to introduce material into the voids. In a still further aspect, a method may include introducing an alkylaminosilane to a micro-mechanical device having a surface hydroxyl group, and bonding a silane to the micro-mechanical device by reacting the alkylaminosilane with the surface hydroxyl group.

Abstract: A semiconductor photovoltaic device comprises a semiconductor substrate having a first surface and a second surface, the first surface and the second surface being opposed to each other, a plurality of trenches extending into the semiconductor substrate from the first surface, the first surface being a substantially planar surface, a dopant region in the semiconductor substrate near the first surface and the plurality of trenches, a first conductive layer over the semiconductor substrate, and a second conductive layer on the second surface of the semiconductor substrate.

Abstract: With a conventional cylindrical can method, a region used as a film formation ground electrode is a portion of the cylindrical can, and an apparatus becomes larger in size in proportion to the surface area of the electrode. A conveyor device and a film formation apparatus having the conveyor device are provided, which have a unit for continuously conveying a flexible substrate from one end to the other end, and which are characterized in that a plurality of cylindrical rollers are provided between the one end and the other end along an arc with a radius R, the cylindrical rollers being arranged such that their center axes run parallel to each other, and that a mechanism for conveying the flexible substrate while the substrate is in contact with each of the plurality of cylindrical rollers is provided.

Abstract: Methods for manufacturing microelectronic imaging units and microelectronic imaging units that are formed using such methods are disclosed herein. In one embodiment, a method for manufacturing a plurality of microelectronic imaging units includes placing a plurality of singulated imaging dies on a support member. The individual imaging dies include a first height, an image sensor, an integrated circuit operably coupled to the image sensor, and a plurality of external contacts operably coupled to the integrated circuit. The method further includes electrically connecting the external contacts of the imaging dies to corresponding terminals on the support member and forming a base on the support member between adjacent imaging dies. The base has a second height less than or approximately equal to the first height of the dies. The method further includes attaching a plurality of covers to the base so that the covers are positioned over corresponding image sensors.

Abstract: Ion sources and methods for generating molecular ions in a cold operating mode and for generating atomic ions in a hot operating mode are provided. In some embodiments, first and second electron sources are located at opposite ends of an arc chamber. The first electron source is energized in the cold operating mode, and the second electron source is energized in the hot operating mode. In other embodiments, electrons are directed through a hole in a cathode in the cold operating mode and are directed at the cathode in the hot operating mode. In further embodiments, an ion beam generator includes a molecular ion source, an atomic ion source and a switching element to select the output of one of the ion sources.

Abstract: A method of making a light emitting device is disclosed. The method includes providing a light emitting diode and forming an encapsulant in contact with the light emitting diode; wherein forming the encapsulant includes contacting the light emitting diode with a photopolymerizable composition comprising a silicon-containing resin, a metal-containing catalyst, and surface treated particles, the silicon-containing resin comprises silicon-bonded hydrogen and aliphatic unsaturation, the surface treated particles comprising nonabsorbing metal oxide particles, semiconductor particles, or combinations thereof, and applying actinic radiation having a wavelength of 700 nm or less to initiate hydrosilylation within the silicon-containing resin.