Abstract: An electrical connector for mating with the CPU unit, includes an insulative housing with a plurality of passageways extending therethrough in the vertical direction. A plurality of contacts are disposed within the corresponding passageways, respectively. Each contact includes opposite first retaining section and second retaining section with an upward resilient contacting section linked therebetween, and a soldering section extending downwardly from the first retaining section. The contacting section includes opposite first contacting part unitarily extending from the first retaining section, and second contacting part unitarily extending from the second retaining section. The CPU unit forms a plurality of metal-coated recesses in an underside to receive the contacting section of the corresponding contacts, respectively. The first retaining section is essentially immovable in the passageway while the second retaining section is essentially movable relative to the housing in response to mating with the CPU.

Abstract: A display panel and a display apparatus containing the display panel are disclosed. The display panel includes a substrate, a circuit structure, and a first bonding adhesive. The substrate has a first bonding area. The circuit structure has a second bonding area that opposingly faces the first bonding area. The first bonding adhesive is arranged between, and configured to contact the first bonding area and the second bonding area. At least one of the first bonding area or the second bonding area comprises at least one first indentation. The first bonding adhesive at least partially fills one or more of the at least one first indentation.

Abstract: A semiconductor package includes a die, an insulation layer, a plurality of first electrical conductive vias, a plurality of second electrical conductive vias, a plurality of thermal conductive vias and a connecting pattern. The die includes a plurality of first pads and a plurality of second pads. The insulation layer is disposed on the die and includes a plurality of openings exposing the first pads and the second pads. The first electrical conductive vias and the second electrical conductive vias are disposed in the openings and contact the first pads and the second pads respectively. The thermal conductive vias are disposed on the insulation layer. The connecting pattern is disposed on the insulation layer and connects the first electrical conductive vias and the thermal conductive vias. The thermal conductive vias are connected to the first pads through the connecting pattern and the first electrical conductive vias.

Abstract: An interposer includes a housing and a contact disposed in the housing. The housing has a first face, a second face opposite the first face, and a passageway penetrating the first face and the second face. The contact has a base portion press-fitted in the passageway, a first contact beam extending obliquely with respect to the first face from the base portion, and a second contact beam extending obliquely with respect to the second face from the base portion. The first contact beam extends outward beyond the first face and has a first contact point portion. The second contact beam extends outward beyond the second face and has a second contact point portion. The first contact point portion and the second contact point portion both extend beyond a penetrated region of the passageway in a direction perpendicular to an insertion direction in which the contact is inserted into the passageway.

Abstract: A functional contactor is provided. A functional contactor according to an exemplary embodiment of the present invention comprises; a clip-shaped conductor having elasticity which is in electrical contact with a conductor of an electronic device; a functional element which is electrically connected to the clip-shaped conductor in series via a solder and comprises a first electrode and a second electrode respectively provided on the entire upper and lower surfaces thereof; and an arrangement guide which is formed to surround at least a part of the clip-shaped conductor on the upper surface of the functional element so as to arrange the position of the clip-shaped conductor and is made of nonconductive resin.

Abstract: An electrical connector comprises a plurality of substrates, a first plurality of spacers, a second plurality of spacers, a plurality of pitch transformation routing assemblies, and a plurality of contact assemblies. The plurality of substrates each extends along a first direction. Each of the second plurality of spacers and a respective spacer of the first plurality of spacers connect a respective substrate of the plurality of substrates to a respective adjacent substrate of the plurality of substrates. Each of the plurality of pitch transformation routing assemblies is surrounded by a corresponding substrate of the plurality of substrates, a corresponding spacer of the first plurality of spacers, a corresponding adjacent substrate of the plurality of substrates, and a corresponding spacer of the second plurality of spacers.

Abstract: Provided is an electric connector, which is to be arranged between a connection terminal of a first device and a connection terminal of a second device, and is configured to electrically connect the connection terminal of the first device and the connection terminal of the second device to each other, the electric connector including: an elastic body having a plurality of through holes each being opened on a first surface and a second surface; and one or more carbon nanotube yarns joined to each of the through holes.

Abstract: An electrical connector includes an insulative housing with a plurality of contacts retained therein in matrix wherein all the contacts are of the cantilevered spring arm type for connecting to the conductive pads of the CPU while categorized with at least two different types for performing different functions, i.e., signal transmission or power delivery. The different type may be related to the corresponding dimension/thickness, the configuration/position, the material, and the processing method which alters the mechanical or electrical characters of the contacts, etc. The different type contacts having the contact points initially at different heights while eventually at the same height, is another feature of the invention.

Abstract: A probe carrier of a probe card device includes an upper die unit, a lower die unit, a spacer sandwiched between the upper and lower die units, and an impedance adjusting member. The upper die unit includes a first die, a second die spaced apart from the first die, and a flexible board disposed on the second die and arranged away from the first die. The flexible board includes a plurality of penetrating holes and a circuit layer. The impedance adjusting member is disposed on the flexible board and is electrically coupled to the circuit layer. The circuit layer includes at least one plated wall arranged in at least one of the penetrating holes, a part of the flexible board having the at least one plated wall is separable from the second die by receiving an internal force.

Abstract: An interposer assembly having a housing with contact positioning holes each having a first wall face and a second wall face. The interposer contact has a base portion with shoulder portions and contact arm portions. The base portion is closer to the first wall face. The contact arm portions are once bulged from both respective vertical ends of the base portion toward the first wall face and then curved toward the second wall face. The housing has a retaining protrusion and a pair of slit portions. The retaining protrusion retains the interposer contact inside the contact positioning hole. Each of the shoulder portions is inserted into the slit portion. The slit portion blocks the interposer contact from moving toward the second wall face.

Abstract: A plurality of module housings extending in a lateral direction and arranged in a longitudinal direction orthogonal to the lateral direction, and terminals attached to the module housings are included. The terminals each include a pair of contact parts respectively projecting upward above an upper surface and downward below a lower surface of each of the module housings, and a first direction conversion mechanism configured to convert at least some of displacement and a force received by the pair of contact parts in an upper-lower direction orthogonal to the lateral direction and the longitudinal direction into displacement and a force in the longitudinal direction. The module housings each include a second direction conversion mechanism configured to convert at least some of displacement and a force received from each of the terminals in the longitudinal direction into displacement and a force in the upper-lower direction.

Abstract: System-in-package structures and methods of assembly are described. In an embodiment, a system-in-package includes opposing circuit boards, each including mounted components overlapping the mounted components of the opposing circuit board. A gap between the opposing circuit boards may be filled with a molding material, that additionally encapsulates the overlapping mounted components. In some embodiments, the opposing circuit boards are stacked on one another using one or more interposers that may provide mechanical or electrical connection.

Abstract: A base member is made of thermoplastic resin. A plurality of terminals are each inserted in a corresponding one of through holes formed through the base member. The terminals include fixed portions positioned on an upper surface of the base member. The base member includes a first fixing portion integrally formed with the base member. The first fixing portion has a covering portion overlapping with the fixed portion and fixing the fixed portion to the upper surface of the base member.

Abstract: A resin board includes: a resin layer and a through electrode buried in the resin layer, wherein the through electrode has an electrode surface exposed from a front surface or a back surface of the resin layer and a lateral surface, and the electrode surface and the lateral surface form an obtuse angle.

Abstract: A plurality of module housings extending in a lateral direction and arranged in a longitudinal direction orthogonal to the lateral direction, and terminals attached to the module housings are included. The terminals each include a pair of contact parts respectively projecting upward above an upper surface and downward below a lower surface of each of the module housings, and a first direction conversion mechanism configured to convert at least some of displacement and a force received by the pair of contact parts in an upper-lower direction orthogonal to the lateral direction and the longitudinal direction into displacement and a force in the longitudinal direction. The module housings each include a second direction conversion mechanism configured to convert at least some of displacement and a force received from each of the terminals in the longitudinal direction into displacement and a force in the upper-lower direction.

Abstract: An electrical connectors with electrodeposited terminals that are grown in place by electroplating cavities formed in a series of resist layers. The resist layers are subsequently stripped away. The resulting terminal shape is defined by the shape of the cavity created in the resist layers. Complex terminal shapes are possible. The present conductive terminals are particularly useful for electrical interconnects and semiconductor packaging substrates.

Abstract: A connector structure includes a conductive rubber. The consecutive rubber is accommodated in an accommodating recess part of a first connector, and is configured to be sandwiched between a first terminal and a second terminal to electrically connect them when a first casing and a second casing are assembled so as to abut the first connector to a second connector. The conductive rubber includes both end surfaces which are contact points abutting against the first terminal and the second terminal, and a resilient part including a groove part formed on an outer circumference between the contact points so as to extend in a circumferential direction orthogonal to an axial direction connecting the end surfaces.

Abstract: A structure and method for providing a contact pin between a device under test (DUT) and a load board which provides upper and lower contact point which are axial aligned is disclosed. The pin has an upper (30) and lower (32) section and a hinge (44/46) in between which allow flex of both upper and lower contact (24/26) which, but the axial alignment can provide a direct replacement for POGO pins but with greater reliability. It also includes a structure and method for removing upper pins 230 by use of a modified hinge 244a.

Abstract: The socket of the present disclosure includes: a terminal unit assembly with a plurality of terminal units, each extending in a longitudinal direction, arranged along a lateral direction orthogonal to the longitudinal direction; and a frame member including an assembly accommodating recess that accommodates the terminal unit assembly. The terminal units each include: a terminal holding part extending in the longitudinal direction; a plurality of terminals; and a side wall. The plurality of terminals each includes a body held by the terminal holding part, a contact part protruding upward beyond an upper surface the terminal unit or protruding downward beyond a lower surface of the terminal unit, and a contact arm connecting the body and the contact part; and the side wall extends in the longitudinal direction, includes a plurality of abutting parts capable of abutting the contact arm, and is arranged adjacent to the terminal holding part in the lateral direction.

Abstract: An electrical connector, used for being electrically connected with a chip module, includes a body, at least one protruding portion, a metal layer, and a plurality of terminals. The body is provided with a plurality of accommodating holes, and has an upper surface. The protruding portion protrudes upward from the upper surface, and an insulating portion is located on the protruding portion to support the chip module. The metal layer covers the upper surface and a periphery of the at least one protruding portion, and a portion of the metal layer located on the periphery of the at least one protruding portion is higher than a portion of the metal layer located on the upper surface. The terminals are accommodated in the accommodating holes and used to be conductively connected with the chip module.

Abstract: One embodiment provides an electrical connector. The electrical connector includes a housing defining a slot; and a pin. The pin includes a stub member comprising a first portion and a second portion, the first portion to couple to a first printed circuit board; and a movable member operable to engage the second portion of the stub member to create a conductive path, wherein the stub member is only engaged with the movable member when a second printed circuit board is inserted into the slot.

Abstract: The invention features devices and methods for collecting and measuring light from external light sources. In general, the devices of the invention feature a light diffusing element, e.g., as a component of a light collector, connected by a light conducting conduit, e.g., a fiber optic cable, to a light measuring device, e.g., a spectrometer. This light diffusing element allows, e.g., for substantially uniform light diffusion across its surface and thus accurate measurements, while permitting the total footprint of the device to remain relatively small and portable. This light diffusing element also allows flexibility in scaling of the device to permit use in a wide range of applications.

Abstract: A light-emitting apparatus includes a first light guide, a converter, a second light guide, and a return. The first light guide includes a first photoreceptor, a second photoreceptor, and a leak. The first light guide guides first light radiated by a radiation apparatus and received by the first photoreceptor and the second photoreceptor. The leak allows second light to be leaked out in a direction crossing a light-guiding direction. The second light is part of the first light. The converter is disposed along the first light guide and converts a wavelength of the second light leaked out of the first light guide. The second light guide does not include the leak and guides third light radiated by the radiation apparatus toward the second photoreceptor. The return returns the third light guided by the second light guide.

Abstract: A light-emitting apparatus includes: a radiation apparatus which includes a first laser diode and a second laser diode; a light guide which includes a first photoreceptor, a second photoreceptor, and a leak, and guides laser light received by the first photoreceptor and the second photoreceptor, the leak allowing leakage laser light to be leaked out in a direction crossing a light-guiding direction, the leakage laser light being part of the laser light; a converter which converts a wavelength of the leakage laser light leaked out of the light guide; and a detector which detects, at a non-radiation time in which laser light is not radiated, an electromotive force of the first laser diode, the electromotive force being based on laser light radiated by the second laser diode.

Abstract: An electrical bridge device includes a support bracket and a flex bridge subassembly. The support bracket includes a frame that extends axially between top and bottom ends of the support bracket. The flex bridge subassembly includes upper and lower carriers held in the frame at least proximate to the top and bottom ends, respectively. The flex bridge subassembly further includes an electrically conductive flex circuit strip coupled to and extending between the upper and lower carriers. The flex circuit strip electrically connects to a first connector on a host circuit board and a second connector on a mating circuit board to provide an electrical circuit path between the host circuit board and the mating circuit board. The upper carrier within the frame is floatable relative to the support bracket to allow the flex circuit strip to align with the second connector.

Abstract: A method and a probe device for testing an interposer prior to assembly are described herein. The method includes coupling a plurality of probe tips of a probe device to the plurality of signal interconnect paths of the interposer to be tested. A test signal is provided from the probe device to the plurality of signal interconnect paths of the interposer and a quality characteristic of signal interconnect paths of the interposer is detected based on behavior of the interposer in response to the test signal.

Abstract: A test probe card detection system includes a linear scanning lens module, a CCD microscope module, a CCD image adjustment module, and a computer. The CCD microscope module adjusts and confirms a scanning optical focal length of a test probe card to be tested. The linear scanning lens module scans all areas data of the test probe card and stores the scanned all areas data in a database. The all areas data is compared with a coordinate file in order to detect defected pins of the test probe card. The CCD microscope module confirms and obtains data of the detected defected pins of the test probe card. The data of the detected defected pins is sent to the CCD image adjustment module and are shown on the computer. The defected pins include pins having surface oxidation, wear, damage, and breaking; lacking of pins; and deflected pins.

Abstract: An radio-frequency (RF) interposer enables low-cost, high-performance RF interconnection of two or more large-area printed wiring boards (PWBs). The RF interposer may be provided as a multi-port coaxial structure embedded in a metal (or metalized) carrier. The RF interposer may include one or more conductive shims having spring fingers to provide contact across air-gaps between a PWB RF ground plane and a ground plane of the RF interposer. Retractable pins may be used as the coaxial transmission line center conductors. The RF interposer may be provided as an N×M grid of unit cells each having one or more RF ports and a cavities to provide clearance for a PWB component.

Abstract: This disclosure describes composite structures and method of making the structures. The structures according to this disclosure may be used in handheld electronics. In example embodiments, holes are formed through a planar polymeric core. A metallic coating is disposed on the core to coat external surfaces of the core as well as internal surfaces of the holes. The metallic coating may entirely occlude the holes. The resulting structure may provide improved strength and rigidity and resist delamination of the metallic coating.

Abstract: An electrical connector includes an insulating body having multiple receiving holes, and multiple conductive terminals respectively received in the receiving holes. Each conductive terminal has first and second elastic arms, and third and fourth elastic arms. When a chip module downwardly presses the conductive terminals, the first elastic arm are conducted upwardly with the chip module, and the third elastic arm are conducted downwardly with a circuit board. At the same time, the first elastic arm elastically deform to urge against the second elastic arm, and the third elastic arm elastically deform to urge against the fourth elastic arm, thereby forming two conductive paths to reduce terminal impedance, and improving signal transmission performance. Further, the second elastic arm provide elastic force for the first elastic arm and the fourth elastic arm provide elastic force for the third elastic arm.

Abstract: An electrical connector assembly includes first and second mezzanine electrical connectors that include respective first and second arrays of electrical contacts. The electrical contacts can be receptacle, or one can be a plug and the other can be a receptacle. Each electrical connector can further include at least one alignment member that cooperate to align the first and second arrays of electrical contacts relative to each other. Each electrical connector can further include at least one orientation member that allows the first and second electrical connectors to mate when in a predetermined orientation relative to each other.

Abstract: An electronic card connector comprises: an insulating housing and a plurality of terminals mounted to the insulating housing. Each terminal comprises two resilient arms, a contacting structure and a tail. The two resilient arms each have a first end and a second end, the two first ends of the two resilient arms are spaced apart from each other and fixed to the insulating housing, and the two second ends of the two resilient arms are connected to the contacting structure. The contacting structure comprises a convex curved surface for contacting the corresponding conducting pad of the electronic card.

Abstract: A contact terminal has a support section that holds an elastically deformable axle so as to rotate about the axle with an elastic deformation of the axle, and a contact section extending from the support section. The contact section has, at a distal end thereof, a contact portion configured to make a contact with a testing element. The contact section deforms elastically while rotating with the support section by the contact of the contact portion with the testing element.

Abstract: A compliant interconnect with a cylindrical bellows structure is configured to reduce a stress between a substrate and a PCB board. The stress can be caused by a CTE (coefficient of thermal expansion) mismatch, a physical movement, or a combination thereof. The compliant interconnect can be solder to and/or immobilized on one or more coupling structure. Alternatively, the compliant interconnect can include an instant swapping structure (such as a socket) that makes the upgrade of the electronic components easier.

Abstract: Electrical contacts are described. An electrical contact can be formed on an exterior surface of a housing of an electronic device and can be cosmetically similar to the exterior surface. For example, the electrical contact can include a conductive plug inserted through an opening in a wall of the housing. A metallic coating can be applied to an outward-facing end of the conductive plug and fill up an outer portion of the opening until the metallic coating is about flush with the exterior surface of the housing. Properties of the metallic coating can be selected to closely match a color and a texture of the housing.

Abstract: An exemplary miniature support has upper and lower spaced-apart engagement surfaces each having at least a portion that are parallel to each other. Two supports each with an end supporting the upper engagement surface and another end supporting the lower engagement surface. The two supports have a spring-like property so that the upper and lower engagement surfaces can repeatedly move between an uncompressed state when not engaged to provide an interconnection and a compressed state when engaged between two opposing boards to provide an interconnection between the boards. The connector is preferably made using 3-D printing and may be integrally made as part of a board also made using the same 3-D printing. The support may have upper and lower engagement surfaces and at least one of the at least two supports that are conductive to establish connectivity between the upper and lower engagement surfaces.

Abstract: Provided are a printed circuit board which can be used as a substrate for a package, a method of manufacturing the printed circuit board, and a semiconductor package using the printed circuit board, the printed circuit board including: a first substrate having a first mounting area for mounting a package substrate and a second mounting area for mounting a semiconductor element; a single layer or multi-layered circuit pattern of the first substrate; and a post bump connected to the circuit pattern, provided on an external insulating layer of the first mounting area, and having a concave upper surface.

Abstract: Electrical connector includes a connector housing configured to engage a mating connector during a mating operation. The electrical connector also includes a plurality of electrical contacts coupled to the connector housing. Each of the electrical contacts includes a proximal base coupled to the connector housing and an elongated body that extends from the proximal base to a distal end. The elongated body includes an outer plating that comprises a precious metal. The outer plating forms interstitial regions that define an array of cavities. The interstitial regions form an exterior surface of the corresponding electrical contact that engages a corresponding contact of the mating connector during the mating operation.

Abstract: The present invention is generally directed to a system for controlling placement of nanoparticles, and methods of using same. In one illustrative embodiment, the device includes a substrate and a plurality of funnels in the substrate, wherein each of the funnels comprises an inlet opening and an elongated, rectangular shaped outlet opening. In one illustrative embodiment, the method includes creating a dusty plasma comprising a plurality of carbon nanotubes, positioning a mask between the dusty plasma and a desired target for the carbon nanotubes, the mask having a plurality of openings extending therethrough, and extinguishing the dusty plasma to thereby allow at least some of the carbon nanotubes in the dusty plasma to pass through at least some of the plurality of openings in the mask and land on the target.

Abstract: A compressible contact pin. The contact pin includes a first contact element and a second contact element. A compressible member is coupled between the first contact element and the second contact element to compress when one or more external forces are applied between the first contact element and the second contact element. In addition, the compressible member maintains a separation distance between the first and second contact elements when no external forces are applied. An elastomeric connector is coupled between the first contact element and the second contact element. The elastomeric connector electrically couples the first contact element to the second contact element by deforming when the one or more external forces are applied between the first contact element and the second contact element.

Abstract: A modular portable device interconnection system includes a magnetic attachment point on a first portable device and a corresponding magnetically responsive attachment point on a second portable device. The magnetic attachment point includes a plated annular magnet, an electrically conductive pin extending through the magnet and an electrically insulating layer insulating the electrically conductive pin from the magnet. The magnetically responsive attachment point includes a ferromagnetic annulus, plated or otherwise conductive, configured and located to mate with the annular magnet when the first and second devices are placed together. In this configuration, the electrically conductive pin and electrically insulating layer extend through both the magnet and the ferromagnetic annulus, forming a shielded electrically conductive pathway between the devices. This pathway is suitable for RF signals but may also be used for other AC signals or DC signals.

Abstract: A contact for testing an integrated circuit includes a contact body with multiple embedded links within the body having at least two axes of rotation. The contact body is hollow with cavities that house tubular resilient members to bias the embedded links in a first preferred orientation and position.

Abstract: A connecting device for electrically connecting two circuit boards is provided. The connecting device has a first and a second coaxial connector and a coupling member. The two coaxial connectors and the coupling member each have an outer conductor and an inner conductor. The outer conductors of the coaxial connectors are electrically interconnected via the outer conductor of the coupling member and the inner conductors of the coaxial connectors are electrically interconnected via the inner conductor of the coupling member. The coupling member is arranged between the two coaxial connectors so as to be tiltable from an axially aligned orientation and displaceable in an axial direction. The coupling member is held on an elastically deformable dielectric holding ring which surrounds the coupling member in a circumferential direction and is in contact against at least one coaxial connector.

Abstract: In order to avoid cost for accommodating a shield wire in a housing while bending, and smoothly and readily accommodate within the housing while the shield electric wire is insulated, a conductive housing 1 including a rear wall 4 continuing to an annular wall 3, and a tube wall 5 continuing to down the rear wall 4, a method comprising the steps of: passing through a shield electric wire 2 from a lower opening 5a of the tube wall of the conductive housing to a front opening 3a of the annular wall while bending the shield electric wire; putting a shield terminal 9 movably around the shield electric wire from top of the shield electric wire; exposing a core wire 2b and a braid 2a of the shield electric wire by stripping a tip thereof; connecting an L-shaped terminal 11 to the core wire; mounting an L-shaped insulation inner housing 12 outside the L-shaped terminal; connecting the shield terminal to the braid; and accommodating a vertical part 14 of the inner housing within the conductive housing by pulling in t

Abstract: The present disclosure relates to sensors including pressure sensors, humidity sensors, flow sensors, etc. In some cases, a cover for use with a sensor assembly may include an electrically insulating body having perimeter features extending a majority of the way around perimeters of upper and lower printed circuit boards that the cover may vertically separate. In one example, the body of the cover may include support features that extend from a lower side of the cover and those support features may contact the lower printed circuit board in at least two locations. The support features of the cover may be separated by a gap and a sensor connected to the lower printed circuit board may be situated within the gap.

Abstract: An electronic device may contain components such as flexible printed circuits and rigid printed circuits. Electrical contact pads on a flexible printed circuit may be coupled electrical contact pads on a rigid printed circuit using a coupling member. The coupling member may be configured to electrically couple contact pads on a top surface of the flexible circuit to contact pads on a top surface of the rigid circuit. The coupling member may be configured to bear against a top surface of the flexible circuit so that pads on a bottom surface of the flexible circuit rest against pads on a top surface of the rigid circuit. The coupling member may bear against the top surface of the flexible circuit. The coupling member may include protrusions that extend into openings in the rigid printed circuit. The protrusions may be engaged with engagement members in the openings.

Abstract: Electrical resistance between a male part and a female part through a canted spring is disclosed using mathematical modeling. Increase or decrease in resistance can be quickly analyzed by looking at the equivalence resistance and the number of contacts at the input side, the output side, or both. The number of contacts may also be created by forming a dimple having a discontinuity.

Abstract: An electric power charge and discharge system for an electronic device having a battery, by which the electronic device can be used for a long period of time. In a wireless communication device including a wireless driving portion including a first battery and a wireless charging portion including a second battery, the first battery is charged by electric power from a fixed power supply and the second battery is charged by using electromagnetic waves existing in an external space. Further, the first battery and the second battery are discharged alternately, and during a period in which the first battery is discharged, the second battery is charged.

Abstract: An anisotropic conductive joint package in which an anisotropic conductive film is joined to at least one conductive material selected from among the group consisting of gold (Au), silver (Ag), copper (Cu), aluminum (Al), magnesium (Mg), nickel (Ni), a tin oxide doped with indium (ITO), molybdenum (Mo), iron (Fe), palladium (Pd), beryllium (Be), and rhenium (Re).

Abstract: A processor module socket accommodates processor modules of different sizes with adapters that align smaller-sized modules so that module pins align with desired contact points. The largest supported processor module engages with the socket in a conventional manner without the use of an adapter. Smaller processor modules engage within an adapter that in turn engages in the socket in a manner similar to the largest supported processor module. The contact points of the socket support different sized processor modules by keying logical functions based upon the type of processor module installed in the socket.