Abstract: A socket may receive both ball grid and land grid array packages. Thus, in some embodiments, the early package prototypes, without solder balls, may be packaged in the same socket design that is ultimately used for production devices using ball grid array packaging. Both land grid array and ball grid arrays may be self-centered on the socket in some embodiments. An S-shaped spring contact may be utilized to electrically connect to either solder balls or lands in a wiping action.

Abstract: A flexible circuit having vias disposed to minimize discontinuity in a ground plane separating opposing transmission lines. The flex circuit comprises a first transmission line coupled to a first surface, a second transmission line coupled to a second opposing surface and a ground plane separating the first transmission line and the second transmission line. The flexible circuit also includes a first type of electrical connection pads disposed on the first surface, and electrically coupled to the first transmission line. The flexible circuit also includes a second type of electrical connection pads disposed on the second surface, and electrically coupled to the second transmission line wherein the second type of electrical connection pads have a higher areal density than the first type of electrical connection pads.

Abstract: An interconnection device includes a carrier housing formed of non-conductive material and has at least one cavity extending through the housing. Within the cavity is disposed a non-formed compression contact that has a cantilevered beam portion that is tapered along its length. The may be tapered such that that deflection of the beam occurs across substantially the entire length of the beam when a compression force is applied to the contact. The contact may be installed in the housing such that it has some freedom of movement in the x, y, and z directions.

Abstract: A method of manufacturing contact sheets is provided, including the steps of providing an electrically conductive sheet to form a conductive member. The conductive member includes a plurality of adjacent contact members joined by a plurality of linking portions. At least one base sheet is provided having a plurality of openings formed therein. The conductive member is positioned and secured to at least one surface of the base sheet such the contact members are positioned in the openings. The contact members are processed to (i) sever the linking portions from adjacent contact members and (ii) to form extending contact portions having a predetermined configuration. The position of the linking portions prior to severing is such that opposing severed faces of the linking portions are separated from each other and the contact members are electrically insulated from one another.

Abstract: A method of making an interposer having an array of contact structures for making temporary electrical contact with the leads of a chip package. The contact structures may make contact with the leads substantially as close as desired to the body of the chip package. Moreover, the contact structures can be adapted for making contact with leads having a very fine pitch. In a first embodiment, the contact structures include raised members formed over a body of the interposer. A conductive layer is formed over each of the raised members to provide a contact surface for engaging the leads of the chip package. In another embodiment, the raised members are replaced with depressions formed into the interposer. A conductive layer is formed on an inside surface of each depression to provide a contact surface for engaging the leads of the chip package. Moreover, any combination of raised members and depressions may be used.

Abstract: The present invention provides an anisotropic conductive film for testing an electronic component, which comprises a film substrate comprising an insulating resin and plural conductive paths insulated from each other and penetrating the film substrate in the thickness direction, preferably, an anisotropic conductive film wherein the plural conductive paths are disposed in a houndstooth check pattern and the distance between conductive paths between adjacent rows of conductive paths is smaller than the distance between conductive paths within a row of conductive paths. In another preferable embodiment, the insulating resin comprises a naphthalene skeleton epoxy resin crosslinked with a phenol resin and an acrylic rubber, and both ends of the plural conductive paths are exposed on both the front and the back surfaces of the film substrate.

Abstract: An electrical connector includes an insulation body and a conducting pin received in the insulation body. The conducting pin includes a body and a flexible contacting arm that flexibly and compressively contacts an external electronic element. On the backside of the flexible contacting arm, there is a flexible colloid that prevents the flexible contacting arm of the pins from becoming permanently deformed when the conducting pin is pressed. The electrical connector of the present invention has the following merits: there is a flexible colloid located on the backside of the flexible contacting arm to prevent the flexible contacting arm of the pins from becoming permanently deformed. The electrical connection between the conducting pin and the external electronic element is thereby assured.

Abstract: An anisotropic conductive material body includes an insulating medium; and a plurality of conductive members dispersed in the medium. At least a surface of each of the plurality of conductive members is conductive. A force is applied to at least one of the plurality of conductive members so as to change the at least one conductive member, so that the conductive property of the anisotropic conductive material body provided by the at least one conductive member is changed to an insulating property.

Abstract: A Land Grid Array connector for connecting a Land Grid Array package mounted on a package board with a printed board. The Land Grid Array connector includes columns for conduction between the electrode of the Land Grid Array package and the electrode of the printed board and a socket supporting the columns. The Land Grid Array connector also includes a structure in which the columns receive an even load when the Land Grid Array package is mounted.

Abstract: An apparatus and method for making a compliant interconnect assembly adapted to electrically couple a first circuit member to a second circuit member. The first dielectric layer has a first major surface and a plurality of through openings. A plurality of electrical traces are positioned against the first major surface of the first dielectric layer. The electric traces include a plurality of conductive compliant members having first distal ends aligned with a plurality of the openings in the first dielectric layer. The first distal ends are adapted to electrically couple with the first circuit member. The second dielectric layer has a first major surface positioned against the electric traces and the first major surface of the first dielectric layer. The second dielectric layer has a plurality of through openings through which the electric traces electrically couple with the second circuit member.

Abstract: An apparatus and method for making a compliant interconnect assembly adapted to electrically couple a first circuit member to a second circuit member. The first dielectric layer has a first major surface and a plurality of through openings. A plurality of electrical traces are positioned against the first major surface of the first dielectric layer. The electric traces include a plurality of conductive compliant members having first distal ends aligned with a plurality of the openings in the first dielectric layer. The first distal ends are adapted to electrically couple with the first circuit member. The second dielectric layer has a first major surface positioned against the electric traces and the first major surface of the first dielectric layer. The second dielectric layer has a plurality of through openings through which the electric traces electrically couple with the second circuit member.

Abstract: An integrated circuit (IC) package socket is provided with an array of single-piece socket contact pins arranged to connect an IC package to a circuit board. The single-piece contact pin is supported at a middle portion of the contact pin and includes two acutely angled bends that allow the two ends of the contact pin to independently resiliently engage the package lands of the IC package and the contact pads of the circuit board. The contact pins are further shaped and arranged to laterally swipe the package lands and contact pads during engagement to scrape away or penetrate through any oxide or other contaminant buildup.

Abstract: An intercoupling component is of the type used to couple an array of electrical connection regions disposed on a first substrate to an array of electrical connection regions disposed on a second substrate. The intercoupling component comprises: an insulative support member; a plurality of electrically conductive terminal elements; a second insulative support member; and a seal member positioned between the first insulative support member and the second insulative member to restrict fluid flow along the terminal elements.

Abstract: The present invention relates to an elastic contact-connecting device. An elastic elevation 3 is applied to a carrier area 2 of a carrier 1. The elastic elevation 3 has a first oblique area 4, a second ramp 5 and a roof area 6. The first oblique area 4 has a lesser inclination (30) with regard to the carrier area 2 than the second oblique area 5. A contact region 20 is applied to the roof area 6 of the elastic elevation. The contact region 20 is connected to other structures 12 on the carrier 1 via a conductor track 10. For this purpose, the conductor track 10 is guided over the first oblique area 4. If a mating contact is pressed onto the contact region 20, the elastic elevation yields, but presses against the mating contact on account of its elastic property and thus enables a reliable contact. In this case, essentially only the second oblique area 5 is deformed; the first oblique area 4 and the conductor track 10 applied thereto are not subjected to any mechanical stress.

Abstract: An electrical connector for electrically connecting to pads of a land grid array formed on an electronic component includes a dielectric layer including opposing first and second surfaces, and a multiple number of contact elements extending above the first surface of the dielectric layer. Each contact element includes a conductive portion disposed to engage a respective pad of the land grid array for providing electrical connection to the land grid array. In particular, the multiple number of contact elements includes a first contact element and a second contact element whereby the first contact element has an operating property different than an operating property of the second contact element. In one embodiment, the operating property includes a mechanical or an electrical property. For example, the first contact element can have a larger elasticity than the second contact element.

Abstract: An Anisotropic Conductive Elastomer (ACE)—based electrical connector that interconnects two or more electrical circuit elements. The connector includes at least two layers of ACE separated by alternate interconnection elements that include conductive elements. The conductive elements provide void space for the ACE elastomer to move to during the interconnection process.

Abstract: A dual compression electrical contact including a contact body having a first contact wall and a second contact wall, a first elastically bendable beam extending from the first contact wall, and a second elastically bendable beam extending form the second contact wall and from a position that is diagonally opposite to that from which the first elastically bendable beam extends.

Abstract: An electrical contact formed from a plurality of interlaced and annealed wires by weaving or braiding the wires together to form a mesh, annealing the mesh, and cutting the annealed mesh so as to form a plurality of individual electrical contacts. A method for forming a precursor material for use in manufacturing an electrical contact is also provided that includes manipulating a plurality of wires so as to interlace the wires into a unitary structure. The unitary structure is then annealed. An electrical contact may then be formed from the precursor material by elastically rolling a portion of the unitary structure so as to form a tube, annealing the tube, and then cutting the unitary structure so as to release the tube thereby to form an electrical contact.

Abstract: A connector system including first housing having a first header, the first header including one or more conductive pads that are in electrical communication with a conductor. A second housing that is mateable with the first housing and includes a second header positioned on a mating face. The second header includes one or more conductive pad that are electrically engaged with a conductor and positioned in confronting relation with the one or more conductive pads of the first header. An interposer located between the first header and the second header, with a woven contact that extends continuously through the interposer toward conductive pads on the first and second headers. The interposer is movable between a first position where the woven contact is spaced away from the at least one of the conductive pads, and a second position where woven contact electrically engages one of the conductive pads.

Abstract: An area array connector adapted to connect contact pads on a first generally planar circuit element to corresponding contact pads on a second generally planar circuit element is described. The area array connector includes an interposer housing and at least one electrical interconnector positioned within the interposer housing. The at least one electrical interconnector is comprised of a plurality of electrical contacts stacked in a substantially parallel relationship to one another. The at least one electrical interconnector is positioned to make contact with a first contact pad on the first generally planar circuit element and a second contact pad on the second generally planar circuit element to provide an electrical interconnection therebetween.

Abstract: An apparatus and method for making a compliant interconnect assembly. The compliant interconnect assembly includes a first carrier having a first major surface and a plurality of through openings. A first major surface of a first flexible circuit member having a plurality of electrical traces is attached to the first major surface of the first carrier. The electrical traces include a plurality of compliant members having at least one distal end projecting in one of the openings of the first carrier. A first major surface of a second carrier is positioned opposite a second major surface of the first flexible circuit member. The second carrier has a plurality of through openings aligned with the plurality of the compliant members.

Abstract: A method and apparatus for achieving a fine pitch interconnect between a flexible circuit member and another circuit member with co-planar electrical contacts that have a large range of compliance. The interconnect assembly includes a substrate with one or more compliant raised portions. At least one flexible circuit member having a first surface with a plurality of contact pads and a second surface is provided. The substrate is located along the second surface of the flexible circuit member with the compliant raised portions aligned with the contact pads so that the compliant raised portions bias the contact pads with corresponding contact pads on the first circuit member when in a compressive relationship.

Abstract: A contact sheet is provided including two insulative base sheets having a plurality of through-holes formed therethrough in an array pattern and a plurality of conductive contacts interposed between the insulative base sheets. Each contact includes a fixed part bonded to an end of a respective through-hole and an integral moving part contiguous with the fixed part. The moving part includes a contact portion formed as an elastic cantilever. Part of the moving part protrudes from one side of the base sheet inside the through-hole and the contact portion elastically extends from the other side of the base sheet. The total area of the through-hole and the fixed part of the contact is greater than a unit grid area formed by an arrangement of the terminals of an electronic device, and the length of the moving part, including the contact portion, substantially corresponds to the overall length of the through-hole.

Abstract: An electrical contact assembly includes a first module having a first set of electrical contacts, a second module having a second set of electrical contacts, a shape-generating module, and a clamping arrangement. The second set of electrical contacts is aligned with the first set of electrical contacts and the shape-generating module is arranged to impart a shape to the second module such that the second set of electrical contacts is driven toward the first set of electrical contacts. The clamping arrangement is arranged to clamp the first, the second, and the shape-generating modules together, thereby resulting in a positive contact force between the first and second sets of electrical contacts. The positive contact force is equal to or greater than a predefined value.

Abstract: An adapter includes an insulative base holder 10 interposed between a cellular phone speaker 1 and an electronic circuit board 5, a pair of electrode plates 15 and 15A, arranged left and right, radially outwardly from the approximate center of base holder 10 to the outer peripheral edge of the base holder 10; and first and second coil springs 17 and 18 welded at both ends of each of electrode plates 15 and 15A, and is constructed such that the first coil springs 17 are put in pressing contact with speaker electrodes 4 at the outer peripheral edge on the underside of speaker 1 and the second coil springs 18 are put in pressing contact with approximately concentric board electrodes 6 of electric circuit board 5.

Abstract: An area array connector adapted to connect contact pads on a first generally planar circuit element to corresponding contact pads on a second generally planar circuit element is described. The area array connector includes an interposer housing and at least one electrical interconnector positioned within the interposer housing. The at least one electrical interconnector is comprised of a plurality of electrical contacts stacked in a substantially parallel relationship to one another. The at least one electrical interconnector is positioned to make contact with a first contact pad on the first generally planar circuit element and a second contact pad on the second generally planar circuit element to provide an electrical interconnection therebetween.

Abstract: A land grid array includes a flat-plate connector plastic housing having a plurality of terminal grooves, and a plurality of terminals having a pair of contact points and disposed in the various terminal grooves, wherein the contact points serve as connecting structures between a circuit board and another circuit board, or between an integrated circuit and a circuit board. Each terminal is formed by bending an integral metal plate, and has a fixing portion, a flexible portion and a signal transmission portion. The terminal is capable of reducing overall stress, such that the signal transmission portion is easily deformed without leaving permanent deformation. Meanwhile, wiping motions by the contact points are performed between a circuit board and another circuit board, or between an integrated circuit and a circuit board for removing oxidized thin-films on contact surfaces involved.

Abstract: An assembly contained within a housing slideably connects device leads to apparatus terminals with predetermined forces. Parallel slots through the housing contain “S” shaped rotatable contacts. The connection force is obtained by compressing two elastomeric members extending through holes perpendicular to the slots and opposite to the contact ends by rotating the contacts. The leads and terminals are opposite and parallel to opposite ends of the contacts, and their connection is provided by this contact rotation. The contact rotations are provided by the nose ends of the contacts extending outward slightly from the slots such that, when the device under test is pressed against the housing, the contacts will be forced within the housing to rotate the contacts and compress the elastomeric members. This provides both a sliding and predetermined force electrical connection between the leads, terminals and contacts.

Abstract: An elastomeric device for interconnecting two or more electrical components, comprising, an elastomeric matrix having one or more outer surfaces; one or more electrically conductive pathways through the matrix; and one or more electrically conductive contact pads, wherein at least a portion of one or more of the pads is flush with or extends outward from one or more of the outer surfaces of the matrix, and wherein at least a portion of the pad is in at least intimate contact with one or more of the pathways; and methods for making same.

Abstract: An elastomer interposer employed between a package and a printed circuit board and the method of manufacturing the same are disclosed. The elastomer interposer includes an elastomer, a plurality of conductive wires, Cu pads, solder resistant blocks and Ni/Au plated pads. The elastomer has two contact surfaces. The conductive wires are arranged inside the elastomer at a certain interval and tilted toward one of the contact surfaces with an inclined angle. The Cu pads are formed on both of the surfaces at a space, and electrically connected to the corresponding conductive wires. Also, the Ni/Au plated pads are formed over the Cu pads.

Abstract: A connector for mounting to a circuit board, includes a housing and a plurality of terminals arranged side by side at the predetermined pitch. Each terminal includes a flat base portion, a pair of contact members formed from a continuous folded-back portion that is folded back to one side of the flat base portion, and a carrier coupling section that is bent at substantially right angle to the opposite side of the flat base portion. The housing holds the terminals by an over-molding of the housing around the flat base portions of the terminals to form a generally flat plate-like housing. The pair of contact members of the terminal extends toward one surface of the dielectric housing and the carrier coupling section extends toward the other surface of the housing.

Abstract: A motion control system comprises a motion unit having a motor connected to an encoder and an amplifier. The motion control system further comprises a scalable motion controller connected to the motion unit wherein the scalable motion controller receives signals from the encoder and outputs signals to the amplifier. The scalable motion controller comprises a plurality of dip sockets arranged for inserting and removing one or more motion control processors and a connector interface comprising a plurality of male and female connectors arranged for stacking a plurality of motion controllers.

Abstract: A connector-transport assembly for holding and transporting a electronic component includes a socket connector having a receptacle sized to receive the component therein and a transport carrier member. The socket receptacle includes two engagement arms formed therewith which are deflectable between first and second operative positions. In the first operative position, the engagement arms extend into the receptacle for contacting opposing exterior surfaces of the component, and in the second position the engagement arms are deflected away from the receptacle so as to not engage exterior surfaces of the component. The engagement arms have cam portions disposed thereon, and the carrier member includes actuating members disposed thereon in opposition to the socket connector engagement arm cam portions so that movement of either the socket connector or the carrier member will move the engagement arms between their first and second operative positions to release or engage the electronic component.

Abstract: A pin-array, separable, compliant electrical contact member for separably, electrically interconnecting a first electrical device having electrical contacts to a second electrical device having electrical contacts. The inventive device includes a probe housing having a thickness, and defining a plurality of openings through the thickness, one or more pin probes, each pin probe located in and protruding from an opening in the probe housing, and each defining an enlargement larger than the opening in which the pin is located, to inhibit lateral pin motion, and also prevent the pins from being removed from their openings vertically in at least one direction, and a layer of Anisotropic Conductive Elastomer (ACE) adjacent to the probe housing and comprising a plurality of conductive chains of particles through the layer thickness and aligned generally perpendicularly to the layer's major surfaces.

Abstract: An electrical connector includes at least a first contact element and a second contact element, wherein each of the first and second contact elements include alternating conductive materials and nonconductive materials. An insulating layer separates the first contact element and the second contact element. The insulating layer divides the first and second contact elements into dedicated contact regions and has a length to prevent the first contact element and the second contact element from contacting more than one terminal contact surface on an electrical component.

Abstract: A low-profile receptacle connector for use in making a required electric connection between an integrated circuit package and a printed circuit board includes a terminal housing part that is sandwiched between the integrated circuit package and the printed circuit board, and the terminal housing part has terminals embedded therein. Each terminal includes a flat trunk and at least one cantilever-like contact arm integrally connected to its flat trunk. The terminals are arranged with their flat trunks parallel to the plane of the terminal housing part, and are supported by the terminal housing part by allowing the mold to overhang the opposite lateral and longitudinal edges of the trunk of each terminal.

Abstract: A portable testing apparatus operable with a force applying apparatus for testing loading characteristics on an integrated circuit assembly coupled to a circuit board. Included is a housing assembly having a size and shape to simulate an integrated circuit assembly to be tested; a loading element coupled for movement relative to the housing assembly and engageable with a load detecting system for transferring forces thereto in response to forces applied by a force applying apparatus; an interposer which mates the housing assembly to a circuit board; and, a load detecting system associated with the housing assembly for providing signals representative of characteristics of loading forces applied thereto by a force applying apparatus, whereby the load delivery characteristics of a force applying apparatus can be determined. A method of testing is also provided.

Abstract: Recesses are located along an elongated elastomeric member. Electrical contacts are associated with the elastomeric member in registration with the recesses. The elastomeric member expands or compresses along its length to receive one of the closely spaced plates in each of the plurality of recesses and to thereby register the electrical contacts with a corresponding contact point on the plates. The elastomeric strip is confined under compression between two adjacent members which may be parts of two plates or of a single plate. The adjacent members define a recess, including locking protrusions, adapted to resist removal of the connector from within the retention recess unless the elongated elastomeric strip is compressed. An associated method optionally includes allowing the compressed elastomeric strip to push against adjacent members to generate a force which pushes the contact points against the one of the closely spaced plates.

Abstract: A connecting spring plate has a first end connecting portion to be connected to a terminal of a sound generator and a second end connecting portion to be connected to a circuit for operating the sound generator. The surface of the first end connecting portion is coated with gold or with a solder, and the surface of the second end connecting portion is coated with gold.

Abstract: A method of making an interposer having an array of contact structures for making temporary electrical contact with the leads of a chip package. The contact structures may make contact with the leads substantially as close as desired to the body of the chip package. Moreover, the contact structures can be adapted for making contact with leads having a very fine pitch. In a first embodiment, the contact structures include raised members formed over a body of the interposer. A conductive layer is formed over each of the raised members to provide a contact surface for engaging the leads of the chip package. In another embodiment, the raised members are replaced with depressions formed into the interposer. A conductive layer is formed on an inside surface of each depression to provide a contact surface for engaging the leads of the chip package. Moreover, any combination of raised members and depressions may be used.

Abstract: An IC socket for an IC package as an electrical part has a socket body to which a number of contact pins are arranged so as to establish an electrical connection between a printed circuit board and a terminal of the IC package. The contact pin comprises a first contact piece disposed on an electrical part side so as to contact the terminal of the electrical part and a second contact piece disposed on a printed circuit board side so as to contact the printed circuit board. When the first contact piece contacts the terminal and is pressed, the first contact piece is inclined and a contact end portion of the first contact piece is moved so as to slide with respect to the electrical part.

Abstract: Recesses are located along an elongated elastomeric member. Electrical contacts are associated with the elastomeric member in registration with the recesses. The elastomeric member expands or compresses along its length to receive one of the closely spaced plates in each of the plurality of recesses and to thereby register the electrical contacts with a corresponding contact point on the plates. The elastomeric strip is confined under compression between two adjacent members which may be parts of two plates or of a single plate. The adjacent members define a recess, including locking protrusions, adapted to resist removal of the connector from within the retention recess unless the elongated elastomeric strip is compressed. An associated method optionally includes allowing the compressed elastomeric strip to push against adjacent members to generate a force which pushes the contact points against the one of the closely spaced plates.

Abstract: An electrical connector includes an insulative housing (10) defining a first surface (100) and a second surface (101), a plurality of contacts (11) received in the housing, a cover (13) slidably mounted on the housing and a spring (12) positioned between the housing and the cover. The housing defines a plurality of restricting slots (1050) having a first protruding portion (1051) and a second protruding portion (1052). The cover defines a plurality of openings (1301) and a plurality of hooks (131) cooperating with the corresponding restricting slot of the housing. When the cover is at a first position where the hooks cooperate with the first protruding portions, the contact is between the upper surface of the cover and the first surface of the housing, when the cover is at a second position where the hooks cooperate with second protruding portion, the contact is beyond the openings of the cover.

Abstract: An interconnection device is provided for temporary connection of a first electronic system to a second electronic system having a support substrate that includes an ordered array of conductive solder pads. A plurality of coil signal contacts are mounted to the conductive solder pads. Each one of the coil signal contacts comprises a central longitudinal axis, a top turn and a bottom turn that are arranged in spaced relation to one another. In this way, the bottom turn of one of the plurality of coil signal contacts is fastened to each of the conductive pads such that the top turns are spaced away from the support substrate.

Abstract: Interconnection elements for electronic components, exhibiting desirable mechanical characteristic (such as resiliency, for making pressure contacts) are formed by using a shaping tool (512) to shape an elongate core element (502) of a soft material (such as gold or soft copper wire) to have a springable shape (including cantilever beam, S-shape, U-shape), and overcoating the shaped core element with a hard material (such as nickel and its alloys), to impart to desired spring (resilient) characteristic to the resulting composite interconnection element. A final overcoat of a material having superior electrical qualities (e.g., electrical conductivity and/or solderability) may be applied to the composite interconnection element.

Abstract: A coil spring contact connector (C) includes a plurality of coil spring contacts (1) and an insulating holder (2) holding the coil spring contacts arranged at intervals. Each coil spring contact has a pair of end contact coils (10) to be brought into contact with a terminal electrode (6c), and middle contact coils (12) radially offset relative to the end contact coils (10) so as to be brought into contact with another terminal electrode (5c). The holder is provided with openings through which contact parts of the end and the middle contact coils project outside, respectively, restrains each coil spring contact (1) from axial deformation and axial movement, and allows each coil spring contact (1) to be deformed in an offset direction thereof.

Abstract: The present invention is a cost effective, reworkable, LGA-based interconnection for use between two circuit members such as a ceramic module and an FR4-based system board. The resilient contact members allow the reliable interconnection of two circuit members, even though the circuit members may have significantly different CTEs and have interconnections where the distance from neutral point is great enough to crack BGA or CGA solder connections. For factory reworkable applications, the ends of the contact members are semi-permanently attached to both the module and the system board. For certain field separable applications, semi-permanently attaching only one of the ends of an LGA to either the module or the system board provides increased reliability.

Abstract: A probe card assembly includes a probe card, a space transformer having resilient contact structures (probe elements) mounted directly to (i.e., without the need for additional connecting wires or the like) and extending from terminals on a surface thereof, and an interposer disposed between the space transformer and the probe card. The space transformer and interposer are “stacked up” so that the orientation of the space transformer, hence the orientation of the tips of the probe elements, can be adjusted without changing the orientation of the probe card. Suitable mechanisms for adjusting the orientation of the space transformer, and for determining what adjustments to make, are disclosed.

Abstract: The present invention is directed to an improved electrical connector for electrically connecting a first component to a second component. The connector includes a plurality of electrical conductors partially embedded in a dielectric frame. The frame is formed with a first side and a second side opposed to the first side. Each conductor includes a first finger, a second finger and a midsection connecting the first finger to the second finger. The midsection of each conductor is molded in place within the frame. The first finger of each conductor extends away from the first side of the frame while the second finger of each conductor extends away from the second side of the frame. The midsections of adjacent conductors can be spaced apart within the frame at distances of less than 1.5 mm.

Abstract: An anisotropic conductive adhesive film contains a first insulating adhesive layer, a second insulating adhesive layer whose modulus of elasticity after curing is less than the modulus of elasticity of the cured first insulating adhesive layer, and electrically conductive particles which are dispersed in at least either the first insulating adhesive layer or the second insulating adhesive layer.