Abstract: An electronic assembly includes one or more conductive clamps (302, 304, FIG. 3), which are used to supply current to an integrated circuit (IC) package (308). The conductive clamps are attached to a printed circuit (PC) board (312), which supplies the current to the IC package over one clamp, and receives returned current from the IC package over another clamp. Each clamp contacts a contact pad (330) on the surface of the PC board, and contacts another contact pad (334) on the top surface of the IC package. Vias (338, 339) and conductive planes (340, 342) within the package then carry current to and from an IC (e.g., IC 306) connected to the package. In another embodiment, the clamp (904, FIG. 9) holds a conductive structure (902) in place between the PC board contact pad (908) and the IC package contact pad (914), and current is carried primarily over the conductive structure, rather than over the clamp.

Abstract: A board-to-board connector assembly (3, 3′) for connecting two printed circuit boards includes a pair of identical board-mountable connectors (1, 1′) and an extender (2, 2′) interconnecting the pair of connectors. Each connector has an insulating housing (12) defining a mating opening (121) therein and a partition wall (1211) extending in the mating opening, and a number of contacts (11, 11′, 13′) received in the housing. The extender includes a dielectric base (22) having an H-shaped section, and a plurality of terminals (21, 21′) received in the base for electrically engaging with corresponding contacts of the connector.

Abstract: A contact structure for establishing electrical contact with contact targets. The contact structure is formed of a contact substrate and a plurality of contactors in which each of the contactors has a hook shape. The contactor has a tip portion which is protruded in a vertical direction to form a contact point, a base portion which is inserted in a through hole provided on the contact substrate in such a way that an end of the contactor functions as a contact pad for electrical connection at a bottom surface of the contact substrate, and a curved portion provided between the tip portion and the base portion which produces a contact force when the contactor is pressed against the contact target. In another aspect, the contactor has a loop shape.

Abstract: A contactor for use in testing integrated circuit chips. The contactor is made with an array of V-shaped contact elements. The V-shaped contact elements are nested so that the contact elements can be longer than the pitch of the contact points. In this way, the compliance of the beam portions of the contact elements can be increased. Also, the V-shape is very robust. Further, the V-shape allows “fly-by” testing, which is very useful at high speeds.

Abstract: A connector assembly consisting of a dielectric housing having at least one socket cavity defined in a front end thereof and a fixing recess defined at one outer side surface of the housing, a PCB securely fixed in the fixing recess by a sealing resin, and at least one indicator fixedly embedded in the sealing resin and secured between an inner side of the PCB and a bottom of the fixing recess, wherein the fixing recess is defined with a front opening at a front end thereof, therefore the at least one indicator emit light from the front opening of the fixing recess.

Abstract: An elastomeric device for interconnecting two or more electrical components. The device includes an elastomeric matrix having one or more outer surfaces, one or more electrically conductive pathways through the matrix, and a frame for stretching the elastomer perpendicular to the electrical pathways.

Abstract: A method and apparatus for efficiently repairing or reworking a printed circuit board having a solder ball grid array thereon efficiently and at minimum cost includes the steps of drilling out a plated-through hole to sever electrical connections between a ball grid array pad on one surface of the printed circuit board and internal circuits and circuits on an opposite surface of the printed circuit board; inserting a pin having an insulated sleeve surrounding a portion thereof into the drilled-out hole, the pin having attached to one end a wire for attachment to the ball grid array on one surface of the printed circuit board and a post at the other end of the pin for attachment of a wire to the post; the pin having a stop along its length to control vertical positioning of the pin in the drilled-out hole, the pin referred to as a via replacement (VR) pin.

Abstract: An electrical connector is shown for stacking a plurality of printed circuit boards one above the other, where some of the terminals extending from the lower portion of the housing include both printed circuit board contacts as well as mating contacts for the next adjacent connector. The connector housing includes integral stand-offs for maintaining the parallel nature of the stacked boards, as well as a precise spacing between the boards. The connector housings can include stand-off members which are frangible and can be used to maintain the parallel nature of the boards when other connector housings of a similar height are not used.

Abstract: A method and connecting structure includes a first surface and a connection pad on said first surface, wherein, said first surface includes an opening adjacent to said connection pad, and wherein, upon sufficient stress, said opening forms a flap allowing a portion of said connection pad to separate from said first surface.

Abstract: An anisotropic conductive film 1 comprising an insulating film 2 and plural conductive paths (3, 4), wherein the plural conductive paths are insulated from each other and penetrate the insulating film 2 in the thickness direction of the film, with both ends of the paths being exposed on both surfaces of the insulating film, and wherein a conductive path 3 capable of contact with an electrode 12 of a semiconductor element 11 and a circuit 14 of a circuit board 13 has at least one end protruding more than an end on the same side of a conductive path incapable of contact with the electrode and the circuit. The ACF of the present invention can prevent a conductive path not involved in electrical connection from being in contact with a part other than an electrode of a semiconductor element and/or a part other than a circuit of a circuit board.

Abstract: An anisotropic electrically conductive film which reduces a connection resistance value in electrical connection to assure reliable electric connection, and an electrical connecting device employing this anisotropic electrically conductive film. To this end, metal coated particles having a resin (40) as a core material are dispersed in an insulating adhesive (8) to give an anisotropic electrically eonductive film. The resin (40) of the metal coated particles is coated with a metal layer having a thickness of 1000 to 3000 Å.

Abstract: A semiconductor chip interposer increases fatigue life of interconnections between a first component having a relatively high thermal coefficient of expansion (TCE) and a second component having a relatively low TCE. The semiconductor chip interposer includes a thin metal plate having a plurality of through holes, the thin metal plate having a TCE intermediate the relatively high TCE and the relatively low TCE. An insulation coating on the thin metal plate is also included on walls of the through holes. An electrical conductive material fills each of the insulated through holes for electrical interconnection between the first component and the second component.

Abstract: An interposer assembly includes an insulating plate with passages extending through the thickness of the plate and projections extending into the passages. Metal contacts are confined in the passages by the projections. The contacts include noses that project outwardly from the plate for engagement with contact pads on overlying and underlying circuit members.

Abstract: A contact element (4) comprises a fixed section (5) inserted into the slot (2) along the first minor side of the slot, a flexible section (6) extending from the fixed section toward the second minor side of the slot in a plane and being flexible in the plane, and contact portions (7A, 7B) extending from the flexible section so as to project from the major faces of a housing (1). The fixed section, the flexible section, and the contact portions are in the plane parallel to the major faces of the slot. A conductive layer or sheet (3) is provided on the major sides of the slot. A sliding contact (8A, 8B) are provided near the contact portions are brought into sliding contact with the conductive layer or sheet.

Abstract: An interposer having an array of contact structures for making temporary electrical contact with the leads of a chip package. The contact structures may make contact with the leads substantially as close as desired to the body of the chip package. Moreover, the contact structures can be adapted for making contact with leads having a very fine pitch. In a first embodiment, the contact structures include raised members formed over a body of the interposer. A conductive layer is formed over each of the raised members to provide a contact surface for engaging the leads of the chip package. In another embodiment, the raised members are replaced with depressions formed into the interposer. A conductive layer is formed on an inside surface of each depression to provide a contact surface for engaging the leads of the chip package. Moreover, any combination of raised members and depressions may be used.

Abstract: An improved securement device aligns adjacent printed circuit boards (“PCBs”) while simultaneously connecting all external hardware so as to prevent overcompression of elastomeric contacts positioned therebetween during assembly. The device supports a connector between a pair of PCBs in spaced parallel relation, wherein the connector itself supports a plurality of elastomeric contacts thereon for establishing electrical engagement between the PCBs. The PCBs and the connector each include aligned securement openings. The device includes an elongate fastener having a substantially cylindrical section positioned in the connector opening. The cylindrical section defines a pair of opposed, substantially planar spaced apart component landings for support of a similarly planar component thereupon. The landings are spaced apart a distance sufficient to place the PCBs in communication with the connector without overcompressing the elastomeric contacts therebetween.

Abstract: An intermediate electrical connector comprises a support plate (1) which is made of a dielectric material and has at least one support aperture (2) having an inside diameter; and at least one conductive member (3) provided through the support aperture to short-circuit circuit portions of connection objects. The conductive member is made of a conductive elastomer and comprises a retention section (4) with flange portions for engage with the support aperture to attach the conductive member to the support plate; and an elastic protruded section (5). The elastic protruded section extends from the retention section in a direction of thickness of the support plate to form at opposite ends contact faces (7) for elastic contact with the circuit portions (11A, 12A) of the connection objects (11, 12) and has, adjacent to the retention section, shoulder (6) portions having an outside diameter which is smaller than the inside diameter of the support aperture.

Abstract: A description is given of a contact-making device which can be used in particular for making contacts between electrical components in electrical subassemblies and lead-frames, such as printed-circuit boards, multi-chip modules, flexible circuits or the like. To achieve dependable, inexpensive and very accurate contact-making between the components and the lead-frames, the contact-making device has an electrical zero-insertion-force connector having an elastic dielectric, a number of electrically conducting connections formed in the zero-insertion-force connector and a number of contact points disposed on an upper side and an underside of the electrical zero-insertion-force connector. The contact points being connected via the connections. The contact points advantageously protrude in each case beyond the planes of the upper side and the underside of the electrical zero-insertion-force connector. Furthermore, a process for producing such a contact-making device is described.

Abstract: Electronic devices include at least two electronic components in electrical contact by a connector, the components being at least partially encased by a molded resin. Preferably, the connector is a compression connector and the molded resin maintains a compressive force on the connector to ensure that reliable contact is maintained.

Abstract: The object of the present invention to provide an anisotropic conductive film capable of establishing electrical connection at a narrow pitch, maintaining strength in the film surface direction that has not been achieved so far, and improving the adhesion to an objective substance, as well as a preferable production method thereof. At least one coating layer made from an insulating material is formed on a metal thin wire, the wire is wound around a core member, the wire is heated and/or pressurized to weld and/or pressure-weld the coating layers to each other to give a winding block, and the winding block is cut in a predetermined film thickness. In this way, an anisotropic conductive film, wherein conductive paths 2 (=metal thin wires) are insulated from each other and pierce a film substrate 1 in the thickness direction, can be obtained. When the coating layer consists of two layers, the outer layer thereof corresponds to the film substrate 1 and the inner layer corresponds to a coating layer 3.

Abstract: An interface connector and method of connection provides balanced resilient contact force of sufficient magnitude for maintaining secure electrical connections between stacked circuit boards in high stress conditions, for example, at high acceleration, using a feed through connection while substantially minimizing size requirements.

Abstract: An electrical connector for interconnecting a first circuit such as an integrated circuit having a plurality of IC terminals with a second circuit having a plurality of contact pads when the terminals and pads are positioned opposite each other. The connector includes an electrically insulating sheet made of a first elastic material formed with a plurality of bores extending therethrough in a direction mutually perpendicular to the first and second circuits, and a plurality of electrical conductors, each made of a second, electrically conductive elastic material and shaped so as to contact the first circuit terminals. The elastic material electrical conductors are each positioned relative to the electrically insulating sheet so as to cover each of the bores and extend into the bore co-axially therewith.

Abstract: An apparatus for electrically interconnecting circuit boards and providing controlled low impedance current paths. A first conductive member has a first surface, a second surface and a third planar surface, the first surface attaches to a first circuit board or CIM and the second surface attaches to a second circuit board or CIM. An insulative sheet having dielectric properties is aligned parallel to the third surface of the first conductive member. A second conductive member has a fourth surface, a fifth surface and a sixth planar surface, the fourth surface connects to the first circuit board and the fifth surface is for attaching to the second CIM. The sixth planar surface is aligned parallel to the insulative sheet, such that a controlled low impedance high current interconnect can be achieved between the first CIM and the second circuit board responsive to the dielectric properties of the insulative sheet.

Abstract: An interposer assembly includes an insulating plate with passages extending through the thickness of the plate and metal contacts loosely confined in the passages. The contacts include noses that project outwardly from the plate for engagement with contact pads on overlying and underlying circuit members.

Abstract: An electronic package assembly for being electrically connected to a conducting member (e.g., a printed circuit board) wherein the assembly includes a pair of substrates. The first substrate includes opposing circuit patterns, those on one surface being of higher density and thus adapted for having high density electronic devices mounted thereon. This high density pattern is electrically coupled to the lesser density second pattern which is connected to conductors of a second substrate. These conductors are of the lesser density also, and extend through a dielectric member for being coupled to conductors (e.g., copper circuit pads) on the conducting member. These conductors are in contact with the dielectric member at only three locations before the dielectric is connected to the electronic package assembly and the conducting member. Ready separability of various parts of the assembly is thus assured.

Abstract: Resilient contact structures are mounted directly to bond pads on semiconductor dies, prior to the dies being singulated (separated) from a semiconductor wafer. This enables the semiconductor dies to be exercised (e.g., tested and/or burned-in) in) by connecting to the semiconductor dies with a circuit board or the like having a plurality of terminals disposed on a surface thereof. Subsequently, the semiconductor dies may be singulated from the semiconductor wafer, whereupon the same resilient contact structures can be used to effect interconnections between the semiconductor dies and other electronic components (such as wiring substrates, semiconductor packages, etc.). Using the all-metallic composite interconnection elements of the present invention as the resilient contact structures, burn-in can be performed at temperatures of at least 150.degree. C., and can be completed in less than 60 minutes.

Abstract: A multi-board module provides high density electronic packaging in which multiple printed circuit boards are stacked. Electrical power, or signals, are conducted between the boards through a resilient contact. One end of the contact is located at a via in the lower circuit board and soldered to a pad near the via. The top surface of the contact rests against a via of the facing printed circuit board.

Abstract: A contact element 1 comprises a rigid fixing section 2 to be inserted into a slot 12 of an insulation housing 10 and a flexible section 3 extending from the fixing section 2. The flexible section 3 comprises a pair of upper and lower first thin springs 5 extending from the fixing section 2 and a pair of second thin springs 6 extending from the first thin springs 5 and connect with or spaced from each other. A pair of contact points 7 are provided at the joints between the first and second thin springs.

Abstract: An electronic package assembly for being electrically connected to a conducting member (e.g., a printed circuit board) wherein the assembly includes a pair of substrates. The first substrate includes opposing circuit patterns, those on one surface being of higher density and thus adapted for having high density electronic devices mounted thereon. This high density pattern is electrically coupled to the lesser density second pattern which is connected to contacts of a second substrate. These contacts are of the lesser density also, and extend through a dielectric member for being coupled to conductors (e.g., copper circuit pads) on the conducting member. Ready separability of various parts of the assembly is thus assured.

Abstract: A multiple circuit board assembly comprising: a first circuit board having a first predetermined set of conductive traces on a surface; a second circuit board having a second predetermined set of conductive traces on a surface; an interconnect mechanism having a third set of traces that mate the first and second set of traces when sandwiched between the first circuit board and the second circuit board in a predetermined manner; and fastened to the first and second circuit boards together with the interconnect mechanism sandwiched between such that there is electrical contact between the first and second predetermined set of conductive traces. The interconnect mechanism can be either single sided flex connector cable, double sided flex connector cable, or Cinch connectors. The fastening mechanism can be snaps fittings or screw setups without or without resilient washers.

Abstract: A replaceable chip module for electrically connecting one or more first circuit members to a second circuit member. The replaceable chip module includes a module housing has a plurality of device sites each capable of receiving at least one first circuit member. A first connector is located in each of the device sites. The first connector includes one or more first contact members having a first compliant member defining a first circuit interface engageable with the first circuit member, a resilient, dielectric encapsulating material defining a second compliant member surrounding a portion of the first contact member, the first and second compliant members providing a first mode of compliance, and at least one end stop positioned to engage with the first contact member in a second mode of compliance. A second connector is positioned to electrically connect the first connector to the second circuit member.

Abstract: A connector having a connector body with opposing end contacts. The connector also includes tabs coupled to the connector body and positioned between the opposing end contacts. Provided between the tabs and the opposing end contacts are circular stabilizers. When no force is applied to the opposing end contacts, the tabs and the circular stabilizers hold the connector in a cylindrical holder. When a compressive force is applied on each opposing end contact, the circular stabilizers pivot about an axis while maintaining the position of the connector in the holder. Further, as the opposing end contacts are compressed, they move across the connector surface of the component making contact with the connector. The movement of the opposing end contacts "wipes" across the surface and, thus, forms a good electrical connection between the connector and the surface.

Abstract: A multilayer printed-circuit board includes at least one inner-layer signal line, first and second ground layers between which the inner-layer signal line is sandwiched via a frame member made of an insulating material in a thickness direction of the multilayer printed-circuit board, and metallic wall members which are provided on inner walls of slits formed in the frame member and extending along the inner-layer signal line. The first and second ground layers and the metallic wall members shielding the inner-layer signal line.

Abstract: A multi-board electronic assembly (10) includes a first substrate (12) and a second substrate (14) electrically connected by a spacer (16). The spacer (16) includes a first end (26) that is received in a first receptacle (18) on the first substrate (12) and a second end (28) that is received in a second receptacle (22) in the second substrate (14). The spacer (16) is formed generally of a nonconductive body (15) and includes ridges (60) and longitudinal channels (30) defined between the ridges (60). The ridges (60) are formed generally of a nonconductive material, and the spacer (16) includes a metallic strip (32) disposed within the channel (30). The metallic strip (32) forms a conductive path to connect the first circuit trace (20) to the second circuit trace (24) to form an electrically connected microelectronic assembly (10).

Abstract: The present invention is to provide an electronic part mounting device including: a lamination body composed of a circuit board and a structural member; an electronic part attached in an opening formed in the lamination body; and an encapsulant layer to encapsulate the electronic part, wherein an outer circumferential line of the opening is arranged inside an outer circumferential line of the encapsulant layer. Due to the foregoing arrangement, in the electronic part mounting device of the present invention, even if the device is bent, the encapsulant layer to encapsulate the electronic part is engaged with the circuit board or the structural member arranged inside the outer circumferential line of the encapsulant layer, so that electronic parts are prevented from coming off. Further, the manufacturing process is simple. Therefore, the cost of the electronic part mounting device can be greatly reduced.

Abstract: A method for producing an electrical circuit member includes the steps of positioning and arranging first and second electrical circuit parts having plural electrical connecting portions to be spaced and oppose each other, preparing an electrical connecting member having a plurality of electrical conductive members, each of which extends from one side of a holding member of an electrical insulating material therethrough to an opposite side of the holding member and is held in the holding member so that opposing ends of the electrical conductive member protrude from opposite sides of the holding member, and applying an adhesive to at least one side of the electrical connecting member including the electrical conductive members. The electrical connecting member with the adhesive is inserted between the first and second electrical circuit parts, and a pressing force is applied so that the first and second electrical parts contact the ends of the electrical conductive members.

Abstract: A microelectronic assembly including elements such as a semiconductor chip and substrate has electrical connections between the elements incorporating fusible conductive metal masses. The fusible masses are surrounded and contained by a compliant material such as an elastomer or gel. The fusible material may melt during operation or processing of the device to relieve thermal cycling stress in the electrical connections.

Abstract: The invention relates to making temporary, pressure connections between electronic components and, more particularly, to techniques for performing test and burn-in procedures on semiconductor devices prior to their packaging, preferably prior to the individual semiconductor devices being singulated from a semiconductor wafer.

Abstract: The present invention relates generally to a new apparatus and method for use in chip, module, card, etc., burn-in and/or test or electrical interconnection. More particularly, the invention encompasses an apparatus that is used as a temporary media between a chip, module, card, etc., that needs to be tested and/or burned-in and a test or burn-in system. A method for such burn-in and/or test or electrical interconnection is also disclosed.The invention also encompasses an apparatus and a method that can be used as a permanent media between two electrical devices, such as, for example, between a chip and a module or a card, etc., that is to be contained in and part of a system.

Abstract: A layered circuit-board designing method and layered circuit-board where circuit-boards to be overlaid are connected at the center or an arbitrary position of each circuit-board. The layered circuit-board includes an upper-layer first circuit-board, a lower-layer third circuit-board, and an intermediate-layer second circuit-board between the first and third circuit-boards. A first connector is mounted on the first circuit-board, a second connector is mounted on the third circuit-board, a third connector is mounted on the top surface of the second circuit-board, while maintaining the positional relation between the third connector and the first connector, and a fourth connector is mounted on the bottom surface of the second circuit-board, while maintaining the positional relation between the fourth connector and the second connector. In addition, through holes are provided at pins of the third and fourth connectors for passing through the front and bottom surfaces of the second circuit-board.

Abstract: A printed circuit board having a footprint that is capable of receiving one of two electronic components having differing pin configurations. The footprint includes a first and a second common pin receptor arranged about a first axis. The first and second common pin receptors are configured to receive a first and a second pin on either of the electronic components. The footprint also includes a third pin receptor that is positioned along the first axis so as to be interposed between the first and the second common pin receptors and is configured to receive a third pin receptor of the first electronic component. The footprint also includes a fourth pin receptor that is positioned along a second axis, that is orthogonal to and intersects the first axis at the location of the third pin receptor. The fourth pin receptor is configured to receive a third pin of the second electronic component.

Abstract: According to the present invention, a method is provided for attaching a package substrate to a circuit board. In one version of the invention, the package substrate has a semiconductor die disposed thereon, and the semiconductor die has a plurality of bond pads formed thereon which are electrically connected to conductive traces on the package substrate. In one embodiment of the invention, the method comprises the steps of attaching a first surface of an electrical connector to one of the conductive traces by thermoplastic adhesion; and attaching a second surface of the electrical connector to a conducting pad on the circuit board, also by thermoplastic adhesion.

Abstract: Proposed is a connecting socket used for electric connection between electrode terminals of a semiconductor package and electrode terminals of a circuit board by being interposed therebetween. The socket is an assembly consisting of a base body in the form of a frame made from an insulating material, in which a semiconductor package is put and secured in the position, and an anisotropically electroconductive elastic sheet member bonded to the bottom surface of the base body. When the socket holding the semiconductor package is mounted on a circuit board, electric conduction is established between the electrode terminals of the semiconductor package and the electrode terminals of the circuit board through the anisotropically electroconductive elastic sheet member.

Abstract: A surface mountable flexible interconnect (10) for connecting two circuit board (30, 32) consists of a flex circuit (12) with solderable runners (14) on one side, the runners traversing the flex circuit from one end to the other. There is a solderable pad (16) at the end of each runner, and each solderable pad has a solder bump (18) fused to it. A rigid carrier ring (20) is used to hold the flex circuit in position prior to placement on the PCB. The flex circuit is formed into a U-shaped loop (26), and the loop is aligned to the carrier so that the loop is situated in an aperture (24) in the carrier. The solder pads lie directly under the carrier ring and face away from it. An adhesive (22) bonds the flex circuit to the carrier ring.

Abstract: A pad array carrier module for packaging discrete electronic components is provided. A circuit substrate (8) contains component mounting pad pairs (20), each consisting of a power pad (22) and a ground pad (21), on a first side (10). Component mounting pads are electrically connected by circuit traces (23), through conductive vias (14), to terminal solder pads (16) on the second side (12) of the circuit substrate. Some of the ground pads are connected to a common ground solder pad (17). Likewise, some of the power pads are connected to a common supply voltage solder pad (19). Solder spheres (18) are attached to the solder pads. Discrete electronic components (24) are conductively coupled (26) to the component-mounting pad pairs.

Abstract: An improved electrical connector for use in electronic assemblies to link electronic components in order to transmit electric signals or current. The connector includes a wafer interface connective construction with at least one resiliently compressible contact to provide a means across which electrical current can flow from one male pin to another male pin without placing the pins in direct contact with each other. The contact retains its form and resiliency through its non-compressive retainment within the aperture of the wafer interface connective construction. Engagement and disengagement of the connector is facilitated, yet reliability and conductivity are enhanced. Further, the size and weight of the connector is reduced, and the assembly of the connector is facilitated. In addition, the pin contacts and the retainment components for the pin contacts are common to both halves of the connector which eliminates the need for socket contacts and their associated components.

Abstract: An apparatus, comprising a first member, including two conductive paths, a conductive adhesive, a second member, including two conductive paths, each of the two conductive paths of the second member being connected to a corresponding one of the two conductive paths of the first member via the conductive adhesive, to form two electrical connections, and a peak-shaped dielectric dam, formed on the second member between the two electrical connections.

Abstract: An electrical connector comprises a dielectric housing having a slot and an elastomeric connector of uniform width disposed in the slot.

Abstract: A printed circuit board assembly which includes a two-dimensional array of connectors to provide significantly higher data transfer rates than typical one-dimensional connectors, without sacrificing board space. The assembly preferably includes a plurality of connection pads on each printed circuit board. An anisotropically conducting material is placed between the connection pads and the boards pressed together.

Abstract: A photolithographically patterned spring contact is formed on a substrate and electrically connects contact pads on two devices. The spring contact also compensates for thermal and mechanical variations and other environmental factors. An inherent stress gradient in the spring contact causes a free portion of the spring contact to bend up and away from the substrate. An anchor portion remains fixed to the substrate and is electrically connected to a first contact pad on the substrate. The spring contact is made of an elastic material and the free portion compliantly contacts a second contact pad, thereby electrically interconnecting the two contact pads.