Abstract: A flexible wiring board is adapted to be connected with a circuit board by means of an anisotropic conductive film. A flexible substrate of the flexible wiring board is mounted with an integrated circuit and has a generally rectangular connection portion. The connection portion includes a first edge of the substrate and parts of second and third edges adjoining the first edge of the substrate. A plurality of connection terminals are provided in the connection portion of the substrate. These connection terminals extend perpendicular to and arranged along the first edge of the substrate. Opposite end parts including the parts of the second and third edges of the connection portion do not extend beyond the connection terminals located closest to the second and third edges, respectively.

Abstract: A coil type contactor comprising an electrically-conductive coil spring, each turn constituting the coil spring being inclined such that one end of a diameter of each turn occupies a lower position and the other end occupies an upper position. The turns are arranged such that axes passing through the centers of the respective turns are in parallel relation. Upper and lower ends of the coil spring serve as pressure receiving points, respectively, for achieving electrical connections. The turns are arranged such that they are partly short-circuited, or the turns are arranged proximate to each other so that the turns are short-circuited at an initial stage of compression.

Abstract: The present invention is a rail-less bus system for a high density integrated circuit package, or module, made up of a plurality of vertically stacked high density integrated circuit devices. Each device has leads extending therefrom with bifurcated or trifurcated distal lead ends which electrically connect with lead ends of adjacent integrated circuit devices. The bus system provides a path for communication from the module to external electronic devices and internal communication between the individual integrated circuit devices in the module.

Abstract: This invention is directed to an improved elastomeric connector. The connector typically includes an elongated elastomeric core, having a substantially uniform cross section throughout its length, and a flexible film having electrical circuitry thereon for electrically interconnecting a pair of members having complementary electrical circuitry on its surface. The flexible film is wrapped about and supported by the elastomeric core to form the connector. In use the connector may be subjected to a compressive force to effect the electrical interconnection. The improved feature hereof is the provision of the wrapped and supported film defining a predetermined planar area, and that the area of the elastomeric core within the planar area is no more than about 90% of the planar area.

Abstract: An electrical interconnect is described which is a structure comprising a polymer matrix of a microstructure of nodes separated by void spaces and being interconnected by fibrils. The nodes are generally aligned elongated columns and have conductive particles embedded in them. The void spaces may be filled with a nonconductive adhesive.

Abstract: An improved elastic interconnector is proposed which consists of, different from conventional rubber-made interconnectors having a structure of alternate stratification of insulating rubber layers and electroconductive rubber layers, an insulating block made from a silicone rubber and a plural number of gold-plated fine metal wires embedded therein in a parallel alignment, each end portion of the metallic wires being protruded out of the surface of the insulating rubber block to ensure reliable contacting with electrode terminals.

Abstract: An electrical connector having a housing and a plurality of electrical contacts. The housing has contact receiving areas with a general uniform cross-like shape. The electrical contacts are one-piece serpentine shaped spring contacts connected to the housing in the receiving areas. A center section of the contact has mounting wings that are located in lateral apertures of the cross-like shape to fixedly mount the contacts to the housing. Opposite ends of the contacts extend out of the receiving areas for contacting contact pads on parallel printed circuit boards on opposite sides of the connector.

Abstract: A system is provided for effectively and efficiently interconnecting a first rigid circuit with a second rigid circuit. The interconnected circuit system includes, in addition to the first and second circuits, a compressive conductive member and a rigid conductive member. The compressive conductive member has a first end for interconnecting engagement with the first circuit and a second end for interconnecting engagement with a first end of the rigid conductive member. The rigid conductive member has a first end for interconnecting engagement with the compressive conductive member and a second end for interconnecting engagement with the second circuit. The first end of the compressive conductive member interconnectingly engages with the first end of the rigid conductive member. The second end of the rigid conductive member interconnectingly engages with the first circuit and the second end of the compressive conductive member interconnectingly engages with the second circuit.

Abstract: A flex circuit card with an elastomeric cable connector assembly is provided for transmitting high speed signals between two or more printed circuit boards in a high performance computer system. The flex circuit card connects a cable assembly to a printed circuit board. A conductor trace in the flex circuit card extends into an elastomeric end and terminates with a ball shaped contact which is angled to wipe against mating pads on the printed circuit card for making electrical contact. The cable assembly uses multiple wires attached to a plurality of elastomeric connectors. At least one elastomeric connector is attached to each end of the cable assembly and each elastomeric connector has a plurality of contacts which are used to mate with a plurality of pads on the surface of the printed circuit board. The elastomeric connector described in the present invention provides a high density, cable-to-board interconnection that is perpendicular to the surface of the printed circuit board.

Abstract: A buckling beam probe contactor in which an array of electrically conductive, parallel, probe test wires, are cast into a housing with urethane or silicone elastomer so as to elastically couple the wires to each other and cause all of the probe wires to bend and buckle in identical, parallel, congruent waveforms and thereby maintain spacing between the wires. Stiffer elastomers are used to insure that the wires have a greater number of inflections with less sideways displacement. Various modifications of the elastomer allow desired buckling patterns to be generated.

Abstract: The micropin array is comprised of a plurality of micropins having a given diameter and being aligned in parallel to one another at a given pitch, insulating tubular coatings disposed to cover individual micropins, and an adhesive provided to fill spacings among the insulating tubular coatings. This micropin array is produced by the steps of preparing a plurality of coated wire materials composed of a metal core having a given diameter and an insulating tubular coating of a given thickness formed around the metal core, aligning closely and successively the coated wire materials to form a bundle thereof, fixing the bundle of the coated wire materials by means of an adhesive, and cutting the fixed bundle of the coated wire materials by a given length to form a micropin array.

Abstract: A contactor for an electric part comprises a plurality of pressure bearing elements connected at one ends thereof and extending in opposed relation to each other. The other ends are left as free ends. A movable contactor has a press contacting portion formed at a connection end of the pressure bearing elements. The press contacting portion is pushed up by the elastic force stored by the pressure bearing elements, which are closed or opened against the elasticity thereof, thereby obtaining a contact pressure with a contact of an electric part.

Abstract: For electrically connecting a pair of circuit members each provided with a plurality of contact pads, an electric connector comprises a unitary insulator having through holes at locations corresponding to the contact pads on the circuit members. Each of the through holes is provided with an internal radial projection and adapted for holding a contact member therein. The contact member is given in the form of a substantially W-shaped leaf spring which has a central palate portion for engagement with the radial projection in the through hole and a pair of free end terminals for contact with the contact pads on the circuit members. Use of the unitary insulator reduces investment on insulator mould and advanced coupling of the contact members to the insulator simplifies assembly operation.

Abstract: A conductive elastomeric element electronic connector assembly in which a plurality of conductive elastomeric connector elements are held in openings in a connector element carrier positioned between a pair of spaced substrates having contact pads which are to be connected together electrically. Each connector element has a volume within the confines of the opening in which it is held which is less than the volume of the opening, so that upon axial compression of the connector element, which occurs as the substrates are brought together to establish contact between the contact pads and the ends of the connector elements, the connector elements can deflect and expand into the extra space in the openings in which they are held.

Abstract: Electrical contacts adapted to electrically mate with two electronic components having high cycle life. The contacts comprise a first interface means for electrically mating with a planar mating face of a first such electronic component and a second interface means for electrically mating with, a planar face of a second such electronic component. The contacts also preferably comprise connecting means for resiliently connecting said first and second interface means and mating resistance means for providing a first amount of mating resistance to said first interface means and a second amount of mating resistance to said second interface means.

Abstract: A compressible electrical connector (10) includes a rigid molded body (11) having elastomeric caps (19, 20) at the top (12) and bottom (13) thereof. A thin flexible film (21), provided with respective connector elements (22), is wrapped around the rigid molded body (11) and its caps (19, 20) and is retained by a film retaining plate (23). The film retaining plate (23) has a plurality of latching lances (24) received in corresponding mounting holes (30) formed transversely in the rigid molded body (11). A hot melt layer (36) is placed over the film retaining plate (23), and a plurality of compressible electrical connectors (10) are stacked side-by-side to form an array (35). The array (35) is disposed between a pair of PC boards or other electronic assemblies (39, 40) having respective circuit elements (37, 38). The height of the rigid molded body may be changed conveniently to readily accommodate different product applications.

Abstract: A multi-chip module electrical and thermal conducting apparatus is provided. The apparatus is disposed between layers or boards of the module and includes electrical conducting traces. Electrical conductors are deposited on the faces of the layers and the traces electrically interconnect the electrical conductors of the two layers. The traces are joined to an elastomeric body and insulating material that are essentially non-conductive of electrical and thermal energy. The apparatus includes a thermal conduction unit that acts as a thermal shunt around the body and insulating material. The thermal conduction unit is electrically isolated from the traces. Thermal energy is received by the thermal conduction unit when heat is generated by the activation of electronic components mounted on the module layers. The thermal energy received by the thermal conduction unit is carried away by thermal vias formed in the module layers.

Abstract: An apparatus (25) and method for loading elliptically cross-sectioned canted contact springs (11) on to respective rows of U-shaped tabs (18) lanced out of a continuous strip (17) of relatively-thin flexible material.

Abstract: An electrical connector for interconnecting a pair of circuit members (e.g., a circuit board and module), which, in one embodiment, includes a housing, at least one flexible circuit within the housing and a spring means attached to the flexible circuit at two spaced locations for exerting force against the flexible circuit to cause the circuit to engage respective conductive pads on the circuit members when the circuit members are moved toward each other (e.g., compressed). The shape of the spring means conforms substantially to the portion of the flexible circuit between the locations of attachment. In another embodiment, a connector for interconnecting such circuit members includes a housing adapted for being located between both members and at least one elongated, compressible contact member in the housing and including conductive end portions for engaging the circuit members.

Abstract: A land grid array connector (10) includes a housing (20) and clamping lid (38) for interconnecting arrays of contact pads of a component (50) and the contact pads (14) of a circuit board (12) through a planar connector insert (50) having a plastic comb (51) with coil springs (72) threaded on teeth (54) of the comb and with plastic cross bars (60) threaded over the comb teeth to position the contact springs in rows compatible with the rows of contact pads. The cross bars and springs are alternated to define a planar structure with the springs on the centers to engage the pads of contacts when the insert is positioned within the connector and clamped to press the springs between the pads. A method of manufacture including the steps of assembly of comb, contact springs and cross bars and affixing the cross bars to the comb.

Abstract: An electrical contact and connector assembly utilizing same wherein the contact includes a first, highly conductive element (e.g., oxygen-free copper) having a first modulus of elasticity and including a pair of contacting portions each of which is designed for engaging respective conductors on first and second circuit members, and a second, spring element (e.g., stainless steel) operatively coupled to the first conductive element and having a second modulus of elasticity greater than that of the first, conductive element. A connector assembly is also defined which includes a common housing for having the contact (preferably several) located therein. The housing is metallic (e.g., stainless steel) and includes a coating of suitable dielectric material on appropriate surfaces thereof so as to prevent electrical shorting with the internally contained contacts. A preferred coating for this purpose is polyimide.

Abstract: An electrical connector (10) for interconnecting a component (50) and a circuit (58) having pads (54, 60) on closely spaced centers for high density packaging includes a thin, dielectric member (12) carrying contacts (20) on centers compatible with the centers of the component and circuit pads; the contacts having spring arms (28, 32, 36, 40) extending from a central mounting portion (22) in a star-like configuration to provide an outward wiping engagement with component and contact pads as the contact is compressed by displacement of the component toward the circuit. The contact arms are of a geometry and have characteristics to provide a balanced force precluding rotary or twisting loads on the dielectric member and are tapered to further provide a desired deflection and sufficient normal force to define a stable, low-resistance electrical interface.

Abstract: A thin interface pellicle probe for making temporary or permanent interconnections to pads or bumps on a semiconductor device wherein the pads or bumps may be arranged in high density patterns is described incorporating an electrode for each pad or bump wherein the electrode has a raised portion thereon for penetrating the surface of the pad or bump to create sidewalls to provide a clean contact surface and the electrode has a recessed surface to limit the penetration of the raised portion. The electrodes may be affixed to a thin flexible membrane to permit each contact to have independent movement over a limited distance and of a limited rotation. The invention overcomes the problem of making easily breakable electrical interconnections to high density arrays of pads or bumps on integrated circuit structures for testing, burn-in or package interconnect and testing applications.

Abstract: A modified high density backplane (MHDB) connector is provided for electrically interconnecting high density printed circuit boards having predetermined interconnect circuitry including high density arrays of ground/signal contact pads, discrete power pads and discrete ground pads. The MHDB connector includes one or more contact modules, a connector housing, a pcb biasing mechanism, connector end caps, a flexible film, two interactive biasing modules for each contact module, and a camming member secured to the pcb to be mated. The interactive biasing modules contact with the flexible film to provide uniform contact force distribution over the interconnect regions of the connector and provide contact rivet displacement tolerance relief. The MHDB connector provides sequenced movement of the pcb to be mated into the contact rivets to provide contact wipe and may provide for alignment of the one pcb with the MHDB connector.

Abstract: A inner jacket member 1 having slit elements 1a is inserted into an outer jacket member 2. An inner jacket member pressing portion, 4, 13 for closing or dilating the inner jacket member 1 is formed within said outer jacket member 2 in such a manner as to be opposite the front end portions 1b of the split elements 1 a. A male terminal 7, 8 to be contacted with an electric part, such as the leadless IC or the like, under pressure is disposed at a tail end of either of the outer and inner jacket members 2 and 1.

Abstract: An electrical contact has a main body section, a top contact section, and a bottom contact section. The main body section has a general ring shape with a general diagonally shaped open area extending from a top of the main body section to a bottom of the main body section. The top contact section extends from the top of the main body section and the bottom contact section extends from the bottom of the main body section.

Abstract: An electrical terminal is interposed between first and second opposing conductive surfaces. The terminal includes an intermediate support portion and first and second spring contact portions projecting from the intermediate support portion for respectively engaging the first and second opposing conductive surfaces. Complementary interengaging latches are provided between at least one of the first and second spring contact portions and the intermediate portion for holding the one spring contact portion out of engagement with the respective conductive surface. The electrical terminal is disclosed mounted within a connector housing by a floating mount to afford limited movement of the terminal relative to the connector housing.

Abstract: A contact assembly is provided for connecting pairs of terminals of two circuits, which allows terminals to be positioned at high densities with minimum crosstalk, selected impedances, and minimum inductances for fast pulse rise times. The apparatus includes a dielectric frame (30, FIG. 2) having multiple miniature cavities (46), and an extendable contact assembly (26) lying in each cavity and having a pair of probes (32, 34) projecting from opposite faces of the frame. The two probes of each contact assembly are slideably engaged and are biased apart by a spring (70), the spring being constructed of dielectric material to avoid inductances and to allow for a high characteristic impedance. The frame can include a body (104, FIG. 6) having multiple plated through holes or cavities (106), and end wall structures (114) having dielectric bushings (122) shorter than the body holes and fitting into the body cavities.

Abstract: An area array connector (32,42,50) for electrically interconnecting two electronic devices is disclosed. The connector (32,42,50) includes a plurality of contact elements (10) having parallel cantilevered contact fingers (18) extending obliquely outwardly from a plate (20) for one embodiment, a laminate (32) is formed by securing the contact elements (10) to a dielectric (26) having windows (28) through which the fingers (18) extend. The laminate (32) can then be fixed to a device such as a circuit board (40) to form another form of a connector (42) and further, the dielectric (26) can be removed to form yet another form of connector (50).

Abstract: This invention provides shielded and wireless connectors for interconnecting electronic circuit boards that are stacked in metal carriers. Serial interconnectors through the carriers provide transmission line paths through the stacked layers through connector assemblies embedded in and fed through each carrier in collinear alignment with each other. Each of the embedded feed through connector assemblies has upper and lower button connectors interconnected by a metal conductor, all positions within an axial hole formed by a pair of substantially cylindrical dielectric inserts. The upper and lower button connectors protrude from the upper and lower surfaces of the upper and lower adjacent circuit boards, respectively. This invention provides connector assemblies having the ability to withstand very high inertial forces without degradation of the electrical contact with the metal pads of the respective circuit boards.

Abstract: An electrical connector for interconnecting a pair of circuit members (e.g., circuit module and printed circuit board) which assures highly reliable yet separable connections for these members. The connector includes an electrically insulative (e.g., plastic) frame which defines an internal opening therein. Bridging this opening are a plurality of individual, resilient contact members which are maintained in a suspended and spaced orientation within the opening by a plurality of pairs of elongated insulative members (e.g., polymer rods). Each of the contacts is thus readily removable from the connector's frame to thus facilitate repair and/or replacement. As described, the connector is capable of providing wiping connections, thus assuring removal of debris or other contaminants from the respective conductive pads for each circuit member. In another embodiment, the connector includes a common carrier (e.g., plastic) having therein a plurality of cylindrical shaped resilient contact members (e.g.

Abstract: A connector assembly (10) and a method of manufacture include a connector sheet (30) formed of a fine web of insulating strands (32, 34) woven together to define a mesh of cavities (35) containing discrete contacts (36, 40) held by an adhesive (38) to define an ordered anisotropic area of discrete contact points useful in interconnecting contact pads (24) of a component (20) to contact pads (18) of a circuit (12). A connector housing (60) is provided to clamp the component (20) to the circuit (12) with the connector sheet (30) therebetween.

Abstract: A low profile socket connector includes a plastic, rectangular, frame-like base member (11) having substantially rigid walls (21,22,23,24) defining between them a socket (20), receiving an LGA device (16) in coplanar relation. Beam springs (34,35), integrally formed with two adjacent walls (22,24) adjacent one corner, protrude into the socket (20) into biassing engagement with adjacent edge portions of the LGA device (16) forcing opposite adjacent edge portions into abutment with walls (23,25) defining the opposite corner, automatically locating and maintaining the device (16) in a reference position (A). A stud-like, outer securing member (14) with flexible legs (48) is insertable in a mounting socket (38) in the base member (11) and through an aperture in a circuit board (18) and an inner securing member (15) is completely receivable in an axial passageway (43) in the outer securing member (14) to spread the legs (48) into anchoring engagement with the circuit board (18).

Abstract: A high density connector (10) includes a plastic housing (12) with covers (30, 38) hinged to a frame (14) and foldable thereagainst to compress a plurality of circuits (60, 67) fitted between the covers to engage and compress elastomeric members (46, 54) and be interconnected thereby through fasteners (76-82), clamping the assembly of circuits and housing together. Embodiments include having frame and cover hinged at the sides by hinges (36, 44) or at the ends by hinges (108, 116) and including integrally molded cover frame and hinges versions include interconnecting two or more boards from the same or opposite directions relative to the connector housing.

Abstract: A floating stackable connector for connecting the conductors of stacked substrates such as printed circuit boards is provided. The connector includes an elongated insulator block having a plurality of parallel spaced spring contacts mounted in channels formed on the insulator block. The connector also includes a mounting means for mounting the connector to one of the substrates such that it may move or float between the substrates. In an illustrative embodiment the mounting means includes threaded inserts mounted within counterbored openings on either side of the insulator block adapted to be attached to threaded fasteners placed through one of the substrates.

Abstract: An electrical connector for engaging a plurality of contact beams with an electronic substrate includes an elongated support body on which the contact beams are individually attached as cantilevers. A plurality of mounting points are formed on the support body to separate the contact beams into segments, and are used for holding the electrical connector against the substrate. Importantly, the contact beams are separated into segments which are of either a first length or a second length. Preferably, in order to more effectively balance the distributed load of the electrical connector against the electronic substrate, the first length is approximately one third the second length and the segments of first length are located at the ends of the support body.

Abstract: An electrical connector for interconnecting the contact pads (52, 56) of components (49, 53) features a planar lamination of insulating sheets forming a body (39) having recesses (46, 48) and apertures (44) containing contacts (10) formed of flat metal stock having spring characteristics including spring elements (22, 26, 30, 36) which provide a redundancy of contact interface through extending upwardly and downwardly relatively to said lamination to engage and interconnect the contact pads. Each of the spring elements is attached to a contact base with a free end providing a cantilever spring action, including wipe of contact points.

Abstract: An electrical connector for interconnecting a pair of circuit members (e.g., printed circuit boards) wherein the connector includes a plurality of electrical contacts, these contacts including at least one semi-spherical end portion for engaging a respective conductor on one of the circuit members. Significantly, the semi-spherical end portion is capable of moving in two different directions of rotation during such engagement to provide an effective wiping motion against the surfaces of the member's conductor. In one embodiment, the connector includes contacts with opposed, semi-spherical end portions, while in another embodiment, a singular semi-spherical end portion is taught.

Abstract: Disclosed is a three-dimensional circuit structure particularly useful in semiconductor memories. The circuit structure consists of a stack of modules mounted on a mother board with connectors between adjacent modules in the stack. The connectors mate with staggered and through terminals on the modules; the staggered terminals being used for circuits routed to destinations on specific modules and the through terminals for circuits routed to destinations on more than one module.

Abstract: An electrical backplane makes high density electrical connections with logic boards in a computer system. The electrical backplane is comprised of an assembly pressure connector and a connector interconnect board that connects the logic boards to external wiring. The assembly pressure connector has electrical contact bumps on its surfaces for making electrical connections with contact points on the surface of the logic boards. The assembly pressure connector prevents the permanent deformation of its electrical contact bumps by using resilient bumps. The resilient bumps are formed from the end portions of interconnecting wires extending through the assembly pressure connector. The interconnecting wires are bent in the shape of a leaf spring. Thus, the wires are compressed within the elastic range of their composing material and are not permanently deformed by the force applied to the assembly pressure connector.

Abstract: An electrical connector (30) includes a body (34) of elastomeric material having cavities (38) containing a conductive gel (42) operable upon deformation of the body of said connector to interconnect conductive pads (14, 22) between components such as a printed circuit board (12) and a chip carrier (18). An alternative embodiment uses a connector body (34') comprised of a sheet (48) of a low thermal coefficient of expansion material with separate inserts (50) of a higher thermal coefficient of expansion fitted in sheet perforations (49).

Abstract: An electrical connector which utilizes fluid pressure to interconnect two electrical circuit members (e.g., a circuit module and a printed circuit board) in a sound and effective manner. In one embodiment, two flexible circuits are brought together using two expandable bladders which are located within a housing located between the circuit members. When expanded, the bladders engage the flexible circuits and cause these to move toward each other such that arrays of contacts become engaged. In another embodiment, a singular flexible circuit and operatively connected bladder are used such that expansion of the bladder causes separate arrays of contacts on the flexible circuit to move toward and engage respective circuitry on the circuit members.

Abstract: Connector and processes for preparing same for demateably interconnecting arrays of contact pads. The connector has a preformed elastomeric sheet-form member provided with a series of apertures through each of which an electrically conductive plated metal deposit extends. An integral end of the deposits protrudes outwardly beyond a surface of the sheet-form member, forming contact surfaces for demateably engaging the pads.

Abstract: An electrical interconnect assembly for interconnecting a lead of an integrated circuit device to a terminal spaced at a distance from a corresponding lead of the integrated circuit. The assembly includes a housing which is, typically, positioned between the lead of the integrated circuit and the corresponding terminal. The housing includes at least one slot which extends through the thickness thereof. Each of first and second opposed surfaces of the housing has formed therein a trough which is positioned at a location proximate the integrated circuit lead and the spaced terminal corresponding to the integrated circuit lead, respectively. A rigid first element is received in the trough formed in the first surface, and the rigid element extends across any slots in which one or more contacts are received. A generally planar contact is received within each of the one or more of the slots.

Abstract: An electrical connector (20) for electrically connecting circuit boards (30,32) or the like comprises two housings (22,24) engaged via a plurality of tongues (100) and grooves (102) positioned on each housing (22,24). The grooves (102) of one housing (22) receive the tongues (100) of the other housing (24), and vice versa, by sliding one into the other. A plurality of interlocks (104) formed on each tongue (100) of one housing (22) mate with interlocks (104) formed on the grooves (102) of the other housing (24) to form a rugged spacer (25). By positioning the housings (22,24) so that different interlocks (104) slide together, one of a plurality of preselected distances may be achieved to match the spacing between circuit boards (30,32). An electrical circuit conductor (26) is positioned on the spacer (25) to provide for electrical connection between the circuit boards (30,32).

Abstract: An electrical connector for interconnecting a pair of circuit members (e.g., circuit module and printed circuit board) which assures highly reliable yet separable connections for these members. The connector includes an electrically insulative (e.g., plastic) frame which defines an internal opening therein. Bridging this opening are a plurality of individual, resilient contact members which are maintained in a suspended and spaced orientation within the opening by a plurality of pairs of elongated insulative members (e.g., polymer rods). Each of the contacts is thus readily removable from the conenctor's frame to thus facilitate repair and/or replacement. As described, the connector is capable of providing wiping connections, thus assuring removal of debris or other contaminants from the respective conductive pads for each circuit member. In another embodiment, the connector includes a common carrier (e.g., plastic) having therein a plurality of cylindrical shaped resilient contact members (e.g.

Abstract: An anisotropically conductive polymeric matrix comprising a polymeric layer having conductive members extending substantially through the thickness thereof, said conductive members comprising a coating of a conductive material, and a process for making same.

Abstract: A connector arrangement for providing electrical interconnection between corresponding contact pads of opposed first and second circuit boards includes an electrically nonconductive support member disposed between the boards, a bodily-rotatable, electrically conductive interconnect element, generally of dumbbell shape, extending through the thickness of the support and having a pair of pad engagement surfaces disposed to engage the respective contact pads, and a clamp for retaining the circuit boards in a clamped-together relationship with the support member in a compressed, reduced thickness state and with the interconnect member bodily rotated. The support member includes a resilient elastomeric material, has support surfaces respectively opposed to the board surfaces, and is adapted to be compressed by urging of the boards together.

Abstract: Electrical interconnections are made by means of a layer or sheet medium comprising chains of magnetically aligned, electrically conducting particles in a nonconducting matrix material. End particles of chains protrude from a surface of the medium, thereby enhancing electrical contact properties of the medium. The medium can be used for temporary as well as permanent connections; in the latter case the use of a nonconductive adhesive material is convenient for physical attachment to contacts on both sides of the medium.

Abstract: An interconnect strip is provided for effecting electrical interconnection between pluralities of conductor pads disposed on circuit boards or the like in a high density configuration. The strip is fabricated from a polymer film carrier having laminated thereon a metal foil with preselected spring properties. After lamination, lithographic techniques from a series of electrically isolated metallic beams on the carrier. Additional chemical processing removes portions of the carrier at opposing sides of the strip to expose opposing ends of the beams which extend beyond the carrier parallel to one another in opposing directions outwards from the carrier. By urging the pads towards respective beam ends of the strip disposed between the pads until mating engagement therewith, a plurality of electrical interconnections are established through the beams.