Abstract: A card edge connector for a daughter board comprises a connector body and a fastener. The fastener has a base portion with a pair of latching arms for latching the daughter board, a movable portion mounted on the base portion and being able to move in a top-to-bottom direction, a spring respectively abutting against the base portion and the movable portion at opposed ends thereof and a locking equipment. The daughter board inserts into the connector body and is downwardly pressed toward the fastener; then the movable portion of the fastener moves downwardly and brings the latching arms rotating outwardly to latch the daughter board. Then, the locking equipment locks the movable portion to keep the daughter board in a reliably electrical connecting with the card edge connector and a print circuit board.

Abstract: A PCB is provided that is suitable for use in applications where EMI control is of interest. The PCB includes circuitry that communicates with an edge connector having edge traces located on its surface. Additionally, embedded traces are disposed within the dielectric material of the PCB, and each embedded trace electrically connects an edge trace with a corresponding median trace located on a surface of the PCB. An embedded ground layer substantially disposed within the dielectric material defines an area within the dielectric material through which the embedded traces pass. Finally, one or more vias are provided that extend through the dielectric material of the PCB and are filled with a conductive material. The vias are electrically connected to the embedded ground layer and configured to electrically communicate with an associated module. In this way, a structure is implemented that facilitates control of electromagnetic radiation emitted by the PCB circuitry.

Abstract: An electrical connector comprised of a plurality of electrical contacts arranged in a stair-step configuration designed to mate with electrical components having electrical contacts arranged in a stair-step configuration. A direct connect signaling system comprised of stair-step electrical connectors mated to stair-step printed circuit boards, other stair-step electrical components, or combinations thereof.

Abstract: An interface card includes a circuit board including an opening, a connector installed on an edge of the circuit board, a covering means including a first shield installed on a side of the circuit board and including a hole, and a second shield installed on the other side of the circuit board including a pin for passing through the opening of the circuit board and inserting into the hole of the first shield so as to combine the second shield with the first shield for covering the connector.

Abstract: An impedance-matching electrical connection system, for use with high-frequency communication signals, includes a circuit board and a plurality of contact pads mounted on the circuit board. The contact pads are for coupling with a plurality of complementary connectors of an external electrical device. Each coupling is associated with an excess shunt capacitance. The electrical connection system further includes a plurality of inductive traces mounted on the circuit board, each of which is connected to a respective contact pad, and is associated with a compensating series inductance. Additionally, the electrical connection system includes a plurality of signal lines mounted on the circuit board, each of which is connected to a respective inductive trace. Each inductive trace is configured so that its associated compensating series inductance substantially offsets the excess shunt capacitance associated with the coupling between the contact pad connected to the inductive trace and a complementary connector.

Abstract: An interface card includes a circuit board including an opening, a connector installed on an edge of the circuit board, a covering means including a first shield installed on a side of the circuit board and including at least one hole, and a second shield installed on the other side of the circuit board, and a pin on the second shield for passing through the opening of the circuit board and inserting into the hole of the first shield so as to combine the second shield with the first shield for covering the connector.

Abstract: A card connector mounting apparatus includes a base including a card coupler and having a plurality of electrical coupling members positioned on a bottom surface of the base, a first base side positioned along the length of the base, and a first board mounting member extending from the first base side and positioned adjacent the bottom surface. A board may be provided which includes a board surface having a connector coupling section defined by a plurality of electrical connector couplers positioned on the board surface, a first section side positioned along the length of the connector coupling section, and a plurality of spaced apart first connector mounting members positioned adjacent the first section side and outside the connector coupling section. A plurality of different sized card connectors may then be mounted to the board by coupling their first board mounting members to the first connector mounting member.

Abstract: A memory card structure according to the invention includes a memory card body having contact terminals. Each of the contact terminals is extended forward to form a conducting plate to an insertion section at a front end of the memory card body to form an L-shaped structure or an individual structure at the insertion section at the front end. When the memory card structure is connected with a connecting device such as a card reading device or a connector, the memory card body is inserted into the accessing device using the insertion section at the front end thereof, and becomes conducted with the accessing device through the conducting plates at the front end of the contact terminals, thereby reducing an overall volume of the connecting device.

Abstract: The invention relates to a distribution device of a telecommunications system. Distribution devices of this type have at least one contact element, the or each contact element having at least two contact springs. According to the invention, the or each contact element has a modular structure in such a way that the configuration of the or each contact element can be modified by modifying the modular structure.

Abstract: A patch panel system including a chassis and a plurality of modules. The chassis includes elongated structures configured to interconnect top, bottom and side portions of the chassis. The elongated structures are also configured to receive and secure a printed circuit board and the plurality of modules to the chassis. The modules include a housing and a module card. The card can include a variety of connections that provide communication to connections located on a back plane of the chassis. The system can include a combination of passive and active modules that are interchangeable to provide a variety of interface configurations.

Abstract: A plurality of switch connectors are arranged in each of a plurality of memory slots. Each of the plurality of switch connectors includes a first-type connector pin and a second-type connector pin. The first-type connector pin is coupled to one of a plurality of signal lines of a memory bus. The second-type connector pin is coupled to impedance matching circuits included in an load circuit. In each of the memory slots in which the memory module is not inserted, a pair of the first-type connector pin and the second-type connector pin provide flexible electric contact. In each of the memory slots in which the memory module is inserted, the first-type connector pin and the second-type connector pin are physically separated and insulated from each other. The first-type connector pin provides electric contact with module pins of the memory module.

Abstract: This interconnection module for the base of an electronic device casing carries out the transfer, at the faces of the printed circuit boards (4, 5) supporting the components of the device housed in the casing, of a field of connection points with the external environment of the casing embodied by the rear ends of the pins of a semi-connector fixed to the back of the casing while still retaining the compactness of the casing despite a very large number of connection points with the external environment of the casing (several hundreds of them). This module takes the form of a three-panel structure with a central panel 7 fixed to the rear ends of the pins of the semi-connector (3) mounted on the back of the casing and two side panels (8, 9) folded and placed flat against each other, joined to the longitudinal edges of the central panel (7) by flexible printed circuit elements (10, 11) and supporting the field of connection points transferred to the level of the faces of the boards (4,5) of the electronic device.

Abstract: A signal channel extends from motherboard to a daughter card across an edge connection. The daughter card includes a conductive plane that is held at a constant electrical potential. In order to compensate for a number of sources of inductance within the signal line at the edge connection, a circuit trace forming a portion of the signal channel includes an enlarged portion, spaced inward along the daughter card from the contact pads forming the edge connection, that adds capacitive coupling of the signal channel with the conductive plane.

Abstract: An electrical connector (100) includes an insulative housing (1) and a number of electrical contacts (2). The insulative housing includes a base (10) having a pair of side walls (13), a slot (15) formed between the two side walls, and a number of passageways (19) and recesses (17) both defined on the side walls. Each side wall has an outer face (132) and each recess extends from a corresponding passageway to the outer face. The electrical contacts are received in the passageways of the insulative housing.

Abstract: An interface card connector having a slotted seat and a locking mechanism having an end for connecting with the slotted seat. The locking mechanism is provided on the top thereof with a hook with an inclined surface, in order to guide an interface card downwardly for engaging into a “U” shaped notch provided on the lower portion of one side of the interface card, thereby the interface card is fixedly connected with the slotted seat; the locking mechanism is provided on the bottom thereof with an abutting portion extending upwardly to an angular direction, so that when the moving and holding portion of the locking mechanism is moved, the abutting portion pushes the interface card upwardly to release it from the slotted seat easily. The connector is suitable for use as an interface card connector to connect an electrically connecting interface card with a printed circuit board of a mainframe of a computer.

Abstract: An electrical connector (1) includes a longitudinal insulative housing (10) and a number of contacts (20). The insulative housing includes a first side wall (13) and a second side wall (14) opposed to the first side wall. The first side wall includes first and second longitudinally arranged thicker portions (131, 132) and a transitional portion (133) having a lateral dimension less than and spacing the first and the second thicker portions. The second side wall includes a third thicker portion. Each of the first, the second and the third thicker portions defines a number of passageways (134) therein. The contacts comprise a number of first, second and third contacts (21, 22, 23) received in the passageways of the first, the second and the third thicker portions, respectively.

Abstract: In one embodiment, a dummy via is created in a circuit board. The dummy via is positioned and coupled to a portion of a transmission line. This portion of the transmission line is further coupled to a signal lead of a connector, which creates additional capacitance to lower the impedance of the connector.

Abstract: A connector includes a contact, a housing, and an actuator. The housing holds and fixes the contact. The actuator presses an FPC, an object to be connected, and thereby connects the FPC and the contact. The connector further includes a first member that is fixed to the housing. The housing includes an insertion slot therein the FPC is inserted and thereto an open portion is formed. The first member includes a projection segment that projects toward the open portion of the insertion slot. The projection segment is provided with a chamfered portion on a side facing the open portion of the insertion slot.

Abstract: Disclosed is a raised SATA PCB connector for high-density mounting on a PCB. The raised SATA PCB connector is configured for connection with a SATA cable connector and is further configured for mounting onto a first side of a PCB. The raised SATA PCB connector includes a raised mounting portion for mounting to the first side of the PCB. A blade connector may project from the raised mounting portion at a sufficient height from the PCB to allow the blade connector to suitably connect with a SATA cable connector and to allow another SATA cable connector to be suitably connected to another raised SATA PCB connector mounted in opposing relation to the second side of the PCB.

Abstract: A holding element with a holding clip for holding a carrier board is soldered freestanding to a printed circuit board (PCB). The holding element has first and second holding arms that extend from a supporting region and form a receiving region therebetween. The first holding arm is connected to a first leg and the second holding arm is connected to a second leg. The first and second legs each have a base in an end region. At least one of the legs has a curved surface in the region of the base so that the holding element can be soldered to the PCB. The holding element being made of a strip material, and the first and second holding arms each having an outward bend forming a transition into the first and second legs, respectively.

Abstract: A female edge connector is cut into a circuit board to reduce the connector size and therefore the distance the signal path is separated from the ground plane. Preferably, the female connector is a surface mount connector and is provided in two pieces. This allows the female connector to be attached to either side of the printed circuit board or can be connected to both sides if half of the connector is mounted on the opposite side of the board from the other. A male edge connector of a plug-in board can then be inserted through the aperture formed in the mother board to contact the female edge connector, providing very little distance between the ground planes of the plug-in board and the mother board. The distance between the two pieces of the female connector can be varied by changing the width of the aperture such that PC boards of various thicknesses can be accommodated.

Abstract: A plurality of switch connectors are arranged in each of a plurality of memory slots. Each of the plurality of switch connectors includes a first-type connector pin and a second-type connector pin. The first-type connector pin is coupled to one of a plurality of signal lines of a memory bus. The second-type connector pin is coupled to impedance matching circuits included in an load circuit. In each of the memory slots in which the memory module is not inserted, a pair of the first-type connector pin and the second-type connector pin provide flexible electric contact. In each of the memory slots in which the memory module is inserted, the first-type connector pin and the second-type connector pin are physically separated and insulated from each other. The first-type connector pin provides electric contact with module pins of the memory module.

Abstract: A coaxial connector with a switch can be used even when an internal ANT and an RF circuit on a printed wiring board are inversely arranged by mounting the connector through the reverse mounting. The connector is mounted on a printed wiring board by engaging a notch portion in an edge thereof and comprises a normally closed terminal, a common terminal, an insulator, a shell, and a housing. A pair of connecting portions of the shell are horizontally symmetric with respect to a vertical plane passing the center or nearly the center of the housing. The connecting portions of the normally closed terminal and the common terminal are also horizontally symmetric with respect to the vertical plane. A top surface and a bottom surface of each of the connecting portions are vertically symmetric with respect to a horizontal plane passing the centers or nearly the centers of the connecting portions.

Abstract: Methods for forming a modular bare die socket assembly 10 and attaching a plurality of miniature semiconductor dice 18 to a substrate. The socket assembly 10 is comprised of a plurality of two-sided plates 14 joined vertically in a horizontal stack, wherein each plate 14 has a die socket 22 for the removable insertion of a bare semiconductor die 18. A multi-layer interconnect lead tape 50 has a plurality of lithographically formed leads bent on one end to form nodes 88 for attachment to bond pads 90 on the removably inserted semiconductor die 18, and having opposing ends 92 connectable to the substrate.

Abstract: A printed circuit board mounted electrical has a metal housing (20) defining, at one end thereof, a connecting opening (21) for receiving a mating connector. The housing includes a pair of right and left side walls (20a) and at least one horizontal wall (20b) interconnecting the side walls. The side walls and said horizontal wall together enclose a board segment (11) having a terminal land (11a) which is formed at a portion of a printed circuit board (10) and which also is capable of directly contacting the mating connector. A fixing piece (23) extends from each side wall (20a), the fixing piece having an attaching face (23a) which is to be placed on and solder-fixed to a solder attaching land (15) formed on the circuit board (10).

Abstract: Methods for forming a modular bare die socket assembly 10 and attaching a plurality of miniature semiconductor die 18 to a substrate. The socket assembly 10 is comprised of a plurality of two-sided plates 14 joined vertically in a horizontal stack, wherein each plate 14 has a die socket 22 for the removable insertion of a bare semiconductor die 18. A multi-layer interconnect lead tape 50 has a plurality of lithographically formed leads bent on one end to form nodes 88 for attachment to bond pads 90 on the removably inserted semiconductor die 18, and having opposing ends 92 connectable to the substrate.

Abstract: A device to be detachably attached to a mechanical substructure includes rails on opposed sides joined at the front by a cross member. A pair of guides mounted on the substructure slidably receives and retains the rails upon attachment of the device. An alignment pin extending from a rail mates with a hole in one of the guides to insure alignment of an electrical connector of the device with an electrical connector mounted on the substructure. The cross member includes screws for securing the cross member to the substructure. A spring extending from a rail makes electrical contact with an adjacent guide and an electrostatic discharge contact plate to discharge any existing static charge.

Abstract: A support assembly for mounting a semiconductor device vertically relative to a carrier substrate. The support assembly includes an interposer to which the semiconductor device is attached. The support assembly also includes traces carried on the interposer, which electronically connect the semiconductor device to contacts on the interposer. The contacts are disposed along a single edge of the interposer. The invention also includes an alignment device for releasably mounting the support assembly. The alignment device, which mounts to a carrier substrate, includes one or more receptacles. As a support assembly is inserted into a receptacle, the alignment device establishes an electrical connection between the contacts and corresponding terminals on the carrier substrate. The assembly may also include a cover that attaches to the top of the alignment device and biases the interposer against the carrier substrate.

Abstract: A system and method for blind-mateably electrically connecting a 1U industrial personal computer with an industrial PC receiving bay in a rack, where the 1U industrial personal computer has a protuberant printed circuit trace member extending therefrom for cooperation with a blind-mateable connector assembly having a plurality of conductive trace grasping contacts therein.

Abstract: An apparatus and a method for connecting high-frequency circuit boards, and for providing an electrical connection between respective electrodes of two high-frequency circuit boards includes an electrode connecting member including a bar-shaped member having a predetermined sectional shape, and having connecting electrodes formed on a part of an outer periphery of the bar-shaped member. The connecting electrodes are located so as to provide an inter-connection between the respective electrodes of the two high-frequency circuit boards through the connecting electrodes and to be sandwiched between the respective electrodes thereof. The connecting electrodes are preferably composed of a plurality of electrode lines formed so as to be spaced at a predetermined interval on the outer periphery of the bar-shaped member.

Abstract: A structure of an electronic device connection port is disclosed. The electrical device connection port comprises a socket at on end of a housing for connecting with an external connection port and a plurality of terminal connectors extending rearwardly from the socket and projection out of the other end of the housing opposite to the socket. The terminal connectors are inserted into apertures that are located on predetermined positions on a surface of a PCB of an electronic device and are welded therein to securely attach with a PCB and also to make an electrical contact with the circuit of the PCB. This structure of the connection port of the present invention would allow the electrical device connection port to be connected in a position perpendicular to the PCB and could be located at any position on the PCB.

Abstract: A method for insertion of inserting printed circuit card into socket connectors which prevents sockets from getting contaminated or damaged during the insertion of a printed circuit card comprises the steps of: inserting a cam for moving a socket connector's contacts outwardly so that they will not make contact with a card's edge when it is inserted between the contacts of the sockets connector as it is inserted, and after the printed circuit card is inserted the printed circuit card moving the printed circuit card until it makes contact with a stop in the socket connector, and after the printed circuit card has contacted the stop in the socket connector, moving the cam to a closed position allowing the printed circuit card to be seated, and seating the printed circuit card by moving it to cause and allow for an amount of wipe to clean the connector's contacts without contaminating or damaging the socket connector's contacts during the insertion of said printed circuit card.

Abstract: The coupling apparatus couples two cards of a first size to fit in to a chassis having slots of second size. The coupling apparatus can connect two 3U cards together by clamping the first card and the second card between a first plate and a second plate to effectively form a combined card of a second size. Thus two 3U cards can be connected together and inserted into a 6U slot in a 6U chassis.

Abstract: A card edge connector comprises a connector body and a conductive pad, and is constructed such that the conductive pad terminates at a predetermined distance from the end of the tip portion of the connector body, and that there is further provided a protective pad, adjacent to the terminating portion of the conductive pad, which is formed at the same time with the formation of a wiring pattern in a post-fabrication step of the wiring pattern. Using the card edge connector, an electric card and an electric equipment are also provided.

Abstract: A card guide apparatus for retaining a PCI or ISA computer add-on card within a computer chassis frame. The card guide includes a bracket fixed to the computer chassis frame and a shuttle that is moveable between a first position disengaged with edges of the card to a second position engaged with the edges of the card for support during transport. The shuttle is slidably retained along at least one track defined within the bracket and includes an upper and lower panel defining a channel therebetween in which the card edge is received.

Abstract: A system and method for blind-mateably electrically connecting a 1U industrial personal computer with an industrial PC receiving bay in a rack, where the 1U industrial personal computer has a protuberant printed circuit trace member extending therefrom for cooperation with a blind-mateable connector assembly having a plurality of conductive trace grasping contacts therein.

Abstract: A board connecting terminal and a connector using the terminal are provided, wherein a contact pressure of the terminal connecting circuit boards arranged orthogonally is secured. The board connecting terminal has a first elastic contact portion projecting arcuately or mountain-shapedly on one side, a second elastic contact portion curvingly inclined extending in substantially the same direction as the extending direction of the first elastic contact portion, and a middle baseplate portion curved or straight and connecting both the elastic contact portions. In a connector, one circuit board is put into contact with the first elastic contact portion, and the other circuit board is put into contact with the second elastic contact portion. A supporting portion for the middle baseplate portion is provided in a connector housings accommodating at least the first elastic contact portion of the board connecting terminal.

Abstract: The present invention is directed to a shelf for housing PCPs. A backplane extends across the shelf. A connector module having the OAM&P connectors is electrically connected to the backplane and has two positions. In one position it extends sideways from the shelf with the connectors in a front to rear direction. In the second position, the OAM&P connector module is substantially flush with the side of the shelf.

Abstract: A power distribution assembly (PDA) includes AC and/or DC power modules and control modules that are installed within a chassis that is mounted to a vehicle, such as an aircraft. Each module includes a wiring harness connector and a control connector for attachment to a motherboard. A wiring harness is externally mounted to the chassis to provide a simplified connection for the wiring harness connector. The modules can be individually and selectively removed from the chassis for repair or replacement without having to remove the entire PDA from the aircraft. This is accomplished by simply removing the module from the chassis, thereby disconnecting the aircraft interface and motherboard connectors for the selected modules. Also, a common PDA can be utilized on different types of aircraft by installing desired modules within the chassis. Thus, the number and type of modules are selected to meet predetermined specifications for a specific aircraft and then installed within a PDA common to all aircraft.

Abstract: A system and method for blind-mateably electrically connecting a 1 U industrial personal computer with an industrial PC receiving bay in a rack, where the 1 U industrial personal computer has a first dedicated blind-mateable connector for standard equipment disposed on a bracket at the back end of an industrial PC and a second dedicated blind mateable connector for use with a later added expansion card, where the connectors are coupled to circuitry in the 1U industrial personal computer via jumper cables.

Abstract: An electrically conductive circuit conductor 2 is disposed on an insulating resin substrate 1, an electrically conductive surface 3 of the circuit conductor is exposed from the resin substrate continuously in a longitudinal direction, and both side portions 4 of the conductive surface are covered and fixed by collar walls 5 of the resin substrate. A bus bar or an electrically conductive resin material is used as the circuit conductor 2. The bus bar 2 is insert-molded onto the resin substrate. The electrically conductive resin material is poured and solidified in a groove portion in the resin substrate. A contact terminal on a mating circuit side or electrical component side is brought into contact with the conductive surface of the circuit conductor 2. A second circuit board is laminated on the resin substrate, and an insertion hole for allowing the conductive surface of the circuit conductor 2 to be exposed is provided in the second circuit board, and the contact terminal is inserted in the insertion hole.

Abstract: There is provided a composite wiring board that occupies a small space and is low in price and a manufacturing method thereof; the composite wiring board comprises at least two rigid wiring boards on end faces of which connection portions are formed, in which each of the rigid wiring boards is arranged so that each of the connection portions is situated on a plane and each of corresponding connection portions is connected with each other in the plane.

Abstract: A mounting structure of a connector 6 for use with a circuit board 7 includes fixing parts 8 provided on one side of the connector 6 and fixed to the circuit board 7, terminals 25 contained in the connector and connected to the circuit board by soldering, a plurality of wiring boards 41 to 42 arranged adjacent to the circuit board,. and a pair of support walls 9 provided on the other side of the connector 6 and projected from the connector. The support walls 9 are abutted at their lower ends against the uppermost wiring board 41, enabling the connector to be supported by both the support walls 9 and the fixing parts 8. The fixing parts 8 and the support walls 9 are projected in directions intersecting at a right angle so that the support walls 9 may be abutted against the wiring board 41 in an engaging direction of a mating connector 37. The support walls 9 are projected longer than the terminals 25 toward the wiring board 41.

Abstract: A cable modern termination system (CMTS) having front and rear sides is disclosed. A rear panel receives a plurality of connector cards. At least one first connector card wherein each first connector card has a row of connectors. At least one second connector cards, wherein each second connector card has a row of connectors, wherein connectors on the first connector cards are staggered from connectors on the second connector cards when the connector cards are inserted into the rear panel.

Abstract: An apparatus for indicating data transfer between a personal electronic device and a host device includes a common node that connects at least one data line to the personal electronic device and at least one data line to the host device. A high impedance amplifier has an input electrically coupled to the common node and generates an amplified signal corresponding to a signal value present on the common node. A monostable circuit is responsive to the amplified signal and generates a plurality of electrical pulses when the amplified signal exhibits changes in value corresponding to a data transfer through the common node. A lamp driver circuit, that is responsive to the plurality of electrical pulses, generates pulses of light correspond to the electrical pulses. Each of the plurality of electrical pulses is of sufficient duration so that each of the pulses of light is of sufficient duration to be perceived by a human eye.

Abstract: Methods for forming a modular bare die socket assembly 10 and attaching a plurality of miniature semiconductor dice 18 to a substrate. The socket assembly 10 is comprised of a plurality of two-sided plates 14 joined vertically in a horizontal stack, wherein each plate 14 has a die socket 22 for the removable insertion of a bare semiconductor die 18. A multi-layer interconnect lead tape 50 has a plurality of lithographically formed leads bent on one end to form nodes 88 for attachment to bond pads 90 on the removably inserted semiconductor die 18, and having opposing ends 92 connectable to the substrate.

Abstract: A support assembly for mounting a semiconductor device vertically relative to a carrier substrate. The support assembly includes an interposer to which the semiconductor device is attached. The support assembly also includes traces carried on the interposer, which electronically connect the semiconductor device to contacts on the interposer. The contacts are disposed along a single edge of the interposer. The invention also includes an alignment device for releasably mounting the support assembly. The alignment device, which mounts to a carrier substrate, includes one or more receptacles. As a support assembly is inserted into a receptacle, the alignment device establishes an electrical connection between the contacts and corresponding terminals on the carrier substrate. The assembly may also include a cover that attaches to the top of the alignment device and biases the interposer against the carrier substrate.

Abstract: A method of connecting a first conductive device to a second conductive device is provided. The first conductive device has a first conductive trace supported by a first substrate. The first trace has a generally planar first surface spaced away from the first substrate that defines a first edge. The second conductive device has a second conductive trace supported by a second substrate. The second trace has a generally planar second surface spaced away from the second substrate that defines a second edge. The method includes joining the first edge of the first trace with the second trace to form an area of contact such that a portion of the first surface proximate the area of contact is non-parallel with a portion of the second surface proximate the area of contact.

Abstract: A printed circuit board connection for connecting printed circuit boards provided with conductor tracks and arranged at a right angle with respect to each other consists of a first plug connector having an isolating housing and a plug-in portion provided with contact sleeves, and a second plug connector having an isolating housing and a plug-in portion provided with contact pins, each of the plug connectors being mounted at one of the printed circuit boards. A conductor foil is mounted at the isolating housing of the first plug connector, the conductor foil being provided with contact tracks.

Abstract: A multi in-line module and an electronic component socket for the multi in-line module are provided. One embodiment of a multi in-line memory module includes a printed circuit board having at least two protrusions formed along one edge of the printed circuit board. Each of the protrusions has first and second surfaces for blocks of contact pins. Accordingly, the module can include three or more pin blocks on separate surfaces of the protrusions. The module provides a large number of pins without being significantly larger than a conventional SIMM or DIMM. Alternatively, physical and electrical attachment of multiple circuit boards provides three or more independent pin blocks on the various surfaces of the printed circuit boards. A socket for a module includes dielectric protrusions with two or more gaps between the protrusions and contact pins on side surfaces of the protrusions that are in the gaps.