Panel Mounted Connector Which Receives Edge Of Panel Circuit Patents (Class 439/62)
  • Patent number: 6411520
    Abstract: A modular frame assembly and modules are provided. The modular frame assembly includes a motherboard, module connectors and an opening in the motherboard for allowing direct connection of first and second modules. The first modules have plugs that extend through the plane of the motherboard, allowing the size of the opening to be minimized. The second modules have a wide external connector portion that allows for high density interconnection on the rear of the frame. Each of the modules may be provided with a plurality of connectors.
    Type: Grant
    Filed: April 18, 2000
    Date of Patent: June 25, 2002
    Assignee: Grass Valley Group
    Inventors: Michael T. Hauke, Raymond A. Bryars
  • Patent number: 6411506
    Abstract: A web server chassis having a plurality of web server processing cards coupled with a midplane is provided. A first network interface card may also be coupled with the midplane. The midplane may include printed circuitry operable to provide data communications between the plurality of web server processing cards and the first network interface card. A second network interface card may also be coupled with the midplane, the second network interface card operable to couple the plurality of web server processing cards with a private network. In a particular embodiment the first network interface card may be operable to couple the plurality of web server processing cards with a public network. A third network interface card may also be provided. The third network interface card may be operable to couple the plurality of web server processing cards with a management network.
    Type: Grant
    Filed: July 20, 2000
    Date of Patent: June 25, 2002
    Assignee: RLX Technologies, Inc.
    Inventors: Christopher G. Hipp, David M. Kirkeby
  • Patent number: 6402525
    Abstract: The present invention is directed to an electrical power connector including a U-shaped body including a first wall with a first plurality of undercut grooves and a second wall that has a second plurality of undercut grooves and a base member that has a third plurality of rectangular slots. A first plurality of spring contacts are each positioned in a corresponding one of the first plurality of grooves. A second plurality of spring contacts are each positioned in a corresponding one of the second plurality of grooves. A third plurality of carrier mounted pins are each positioned in a corresponding one of the plurality of rectangular slots.
    Type: Grant
    Filed: May 17, 2001
    Date of Patent: June 11, 2002
    Assignee: Northrop Grumman Corporation
    Inventors: Carmine Gugliotti, George W. Brehm, Bruce E. Moore
  • Patent number: 6395987
    Abstract: A flexible electrically conductive track including an elongated flexible insulating member providing at least one longitudinally extending slot to receive an electric conductor. The conductor includes a pair of generally parallel co-extensive contact strips joined by a plurality of transverse ribs. The slots are closed by resiliently displaceable flanges which are displaced to provide access to the conductor.
    Type: Grant
    Filed: April 11, 1997
    Date of Patent: May 28, 2002
    Inventor: John Ashton Sinclair
  • Patent number: 6394850
    Abstract: A communications card allows computers to be electrically connected to electronic devices and communications systems. The communications card includes a modular jack with a plurality of contact pins. The contact pins include a plug engaging portion that does not include any sections that are angled more than about 90° in order to minimize the stresses in the contact pins. The contact pins also include a connector portion that allows the contact pins to be electrically connected to a printed circuit board disposed within the communications card. Preferably, the plug engaging portion includes an elongated arm that aids in absorbing stress and deflection of the contact pins. Advantageously, the contact pins are designed to minimize the height of the modular jack such that the modular jack can be used with communications cards that comply with the PCMCIA Type III standards.
    Type: Grant
    Filed: March 20, 2000
    Date of Patent: May 28, 2002
    Inventors: David Oliphant, Thomas A. Johnson, Brent D. Madsen
  • Patent number: 6392897
    Abstract: A circuit module includes a connector terminal (4A) provided on a front surface of a printed wiring board (2) and connected to a data pin (DQt) of a memory IC (3) through an interconnect line (5a). A conductive connector terminal (4c) corresponds to the connector terminal (4a) and is provided on a back surface of the printed wiring board (2). A through hole (16) extends between part of the front surface of the printed wiring board (2) where the connector terminal (4a) is formed and part of the back surface thereof where the conductive connector terminal (4c) is formed. A conductor fills the through hole (16), thereby suppressing skews resulting from a difference in interconnect line length on the circuit module and decreasing a stub capacitance to achieve the reduction in power consumption.
    Type: Grant
    Filed: August 10, 1998
    Date of Patent: May 21, 2002
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Yasunobu Nakase, Tsutomu Yoshimura, Yoshikazu Morooka, Naoya Watanabe
  • Patent number: 6382983
    Abstract: A module mounting system includes a mother board (1) having a plurality of layers, first and second sockets (2, 3) provided on a face of the mother board (1) such that their rear faces (9, 18) are opposed to each other, and a plurality of wiring patterns (27, 29) provided one for each layer to interconnect the terminals (7, 8, 20, 21) of the first and second sockets (2, 3).
    Type: Grant
    Filed: March 21, 2001
    Date of Patent: May 7, 2002
    Assignee: Hirose Electric Co., Ltd.
    Inventors: Ryozo Koyama, Tsuyoshi Sakata
  • Patent number: 6377471
    Abstract: An apparatus and methods are provided for interfacing a disk drive to a computer system without requiring conventional power and signal cables between the apparatus and the disk drive. An interface assembly comprises a set of power connectors and a set of signal connectors for receiving corresponding connectors of a disk drive. One or more of the assembly connectors (e.g., the power connectors) are translatable in at least one dimension so that the assembly is not limited to disk drives having a particular spacing between their power and signal connectors. The interface assembly may comprise two printed circuit boards (PCB) or backplanes—one for the power connectors and one for the signal connectors. In this configuration one of the PCBs defines a set of apertures through which the connectors of the other PCB protrude, and the other PCB is slidably or otherwise translatable along a portion of the length of the first PCB so that the protruding connectors are movable within the apertures.
    Type: Grant
    Filed: November 6, 2000
    Date of Patent: April 23, 2002
    Assignee: Sun Microsystems, Inc.
    Inventors: Fay Chong, Jr., William L. Grouell
  • Publication number: 20020028588
    Abstract: A board connecting terminal and a connector using the terminal are provided, wherein a contact pressure of the terminal connecting the cross circuit boards is secured. The board connecting terminal 64 has a first elastic contact portion 70 projecting arcuately or mountain-shapedly on one side, a second elastic contact portion 71 bent or inclined in the same direction as that of the first elastic contact portion on the other side, and a middle baseplate portion 69 being curved or straight and connecting both the elastic contact portions. In a connector 50, one circuit board 55 is put into contact with the first elastic contact portion, and the other circuit board 52 is put into contact with the second elastic contact portion. A supporting portion 80 for the middle baseplate portion 69 is provided in connector housings 62,63 accommodating at least the first elastic contact portion of the board connecting terminal 64.
    Type: Application
    Filed: September 7, 2001
    Publication date: March 7, 2002
    Applicant: Yazaki Corporation
    Inventors: Hiroshi Watanabe, Mitsunobu Kato
  • Patent number: 6347950
    Abstract: The present invention provides a floating connector, used for electrical connection between electrical components and a circuit board. Multiple embodiments include a plurality of elastic contacts retained between the circuit board and an insulated housing movable laterally and orthogonally in a fixed range to accommodate misalignment. The contacts are in sliding contact with the circuit board to ensure a reliable connection without solder. The embodiments employ guiding slits to maintain electrical separation between the contacts during adjustment. Each embodiment accommodates movement in multiple directions, requires no solder, and provides for secure flexible electrical connection between an electronic component and the circuit board.
    Type: Grant
    Filed: March 26, 2001
    Date of Patent: February 19, 2002
    Assignee: SMK Corporation
    Inventors: Katsuharu Yokoyama, Kenji Nakata, Kenji Sugimori, Iwao Ishibashi
  • Patent number: 6346003
    Abstract: An edge guide arrangement for circuit boards is disclosed including a guide rail having a circuit board edge-receiving channel with a grounding strip therein. The grounding strip has clips at each end for resiliently grasping the guide rail thereby holding the grounding strip in its position within the channel. The grounding strip with its end clips can be standardized and inventoried in large quantities to be assembled to a variety of guide rails.
    Type: Grant
    Filed: February 22, 1999
    Date of Patent: February 12, 2002
    Assignee: Bivar
    Inventor: Anthony W. Vilgiate
  • Patent number: 6335867
    Abstract: Apparatus for interconnecting logic boards is provided with a backplane, a plurality of logic boards connected to the backplane, and a plurality of interconnecting boards, connected to the backplane, for interconnecting the plurality of logic boards. In the apparatus, the plurality of logic boards are connected to the backplane with the logic boards in vertical position at right angles with the interconnecting boards and a specified distance away from the interconnecting boards.
    Type: Grant
    Filed: November 9, 2000
    Date of Patent: January 1, 2002
    Assignee: Hitachi, Ltd.
    Inventors: Kenichi Ishibashi, Takehisa Hayashi, Tsutomu Goto, Akira Yamagiwa, Tsuyoshi Watanabe
  • Publication number: 20010042329
    Abstract: Signs including electroluminescent lamps are described. In accordance with one embodiment of the present invention the electroluminescent system has an electroluminescent lamp releasably and fixedly mateable with a slide connector to provide electrical energy for the light system.. The electroluminescent lamp includes a substrate, a rear electrode, a dielectric layer, a phosphor layer, a conductive layer, and a front electrode. The lamp further includes a tab interconnect tab portion, which receives the leads from the rear electrode and front electrode, and is configured to be releasably and fixedly mated with the connector.
    Type: Application
    Filed: March 22, 2001
    Publication date: November 22, 2001
    Inventors: Matthew Murasko, Clarence H. Duttlinger
  • Publication number: 20010044224
    Abstract: A modular mounting system which allows a circuit board to be removed, inserted or replaced through the front of the mounting frame without deactivating power to the equipment, and in the preferred embodiment without detaching any external cables. Connections for external equipment are disposed along the rear edge of the circuit board, and a row of contacts for the internal connections is provided along the bottom edge of the circuit board. The system of the invention provides a releasable connector which retracts the connector pins into a housing when a circuit board is inserted or removed, thus eliminating the possibility of a contact on the circuit board touching a live connector pin. In the preferred embodiment the external connections are made through adaptors that plug into external cable connectors provided on a connector plate detachably affixed to the rear of the mounting frame.
    Type: Application
    Filed: June 28, 2001
    Publication date: November 22, 2001
    Inventors: Richard A. Kupnicki, John Kupnicki, John E. Brook
  • Patent number: 6317329
    Abstract: A data storage module alignment system and method for use in a data storage module and enclosure system including a module enclosure having a plurality of bay slots and at least one data storage module. The data storage module alignment system comprises at least one alignment guide that is adapted to be mounted at the module enclosure entrance and at least one guide rail that is adapted to be mounted to the data storage module. The alignment guide includes a plurality of guide channels having rounded edges. The guide rail is sized and shaped for receipt within the guide channels. Typically, the alignment guide further includes a plurality of guide flanges that are arranged asymmetrically along the alignment guide. The inner side of each guide flange defines an edge of one of the guide channels and includes chamfers which facilitate initial alignment of the data storage module within one of the bay slots of the module enclosure.
    Type: Grant
    Filed: November 13, 1998
    Date of Patent: November 13, 2001
    Assignee: Hewlett-Packard Company
    Inventors: James L. Dowdy, Alicia G. Mercer, Herbert J. Tanzer, Darrel W. Poulter, David Dickey
  • Patent number: 6288902
    Abstract: The present invention provides a modular data storage system that can constraint movement of a data storage module within an enclosure during operation, handling, and transportation. The present invention achieves the objective by employing compliant features at strategic locations in the data storage system by utilizing shock/vibration isolators and the frictional forces generated by the compliant elements to introduce damping effects. In addition, this invention provides a locking mechanism that will allow the user to smoothly insert, remove and firmly grip a data storage module.
    Type: Grant
    Filed: May 25, 1999
    Date of Patent: September 11, 2001
    Assignee: Hewlett-Packard Company
    Inventors: Kwang Ho Kim, Julie McDonald
  • Patent number: 6285563
    Abstract: A support bracket, which can be used in a method of reinforcing a printed circuit board, secures the printed circuit board, such as a backplane having a plurality of electrical connectors that engage corresponding electrical connectors of daughter boards. The support bracket includes a cross member attachable to the printed circuit board in a direction substantially transverse to a direction of motion of the daughter boards. The support bracket also includes first and second end support members attached transversely to the cross member at corresponding ends of the cross member. The end support members are fixable to a support surface and are adapted to secure the support bracket in the direction of motion of the daughter boards.
    Type: Grant
    Filed: March 31, 1999
    Date of Patent: September 4, 2001
    Assignee: EMC Corporation
    Inventors: Erik Nelson, Edward Claprood, Paul T. Tirrell
  • Patent number: 6285432
    Abstract: A liquid crystal display (LCD) assembly (200) includes an LCD (100), a registration member (206) attached to the LCD and a connector (202). The connector defines a slot (208) sized to receive the edge (106) of the LCD and a channel (204) positioned to receive the registration member. In one embodiment, the registration member is an inactive electrical component placed on the surface of the LCD solely to provide registration for the connector. The electrical component is very inexpensive and greatly reduces the opportunity for misalignment.
    Type: Grant
    Filed: March 23, 1999
    Date of Patent: September 4, 2001
    Assignee: Ericsson Inc.
    Inventor: John Charles Phillips
  • Patent number: 6239984
    Abstract: A backplane circuit board for an electronic chassis includes a bracket and an upper circuit board operatively connected to the bracket. A lower circuit board is also operatively connected to the bracket wherein the upper circuit board is offset from the lower circuit board and the upper circuit board is parallel to the lower circuit board.
    Type: Grant
    Filed: August 12, 1999
    Date of Patent: May 29, 2001
    Assignee: 3Com Corporation
    Inventors: Amir Koradia, Philip A. Ravlin, Douglas J. Pogatetz, Gerald A. Greco
  • Patent number: 6231364
    Abstract: A memory module connector mounted on a mother board and adapted to receive a memory module, having two metal reinforcing members respectively fastened to two latches at two opposite ends of a connector body thereof to reinforce the structural strength of the latches for positively holding an inserted memory module in the connector body.
    Type: Grant
    Filed: July 15, 1998
    Date of Patent: May 15, 2001
    Inventor: Chao-Zen Liu
  • Patent number: 6195263
    Abstract: In an electronic control unit, a pad portion thereof is firmly fixed to a terminal plate and vibration of the terminal plate under supersonic vibration is prevented so as to secure the bonding strength between the terminal plate and the wire during wire bonding. One lead portion of each terminal plate is connected to a pin of the connector and another lead portion is wire bonded to the terminal of the circuit substrate. The leads have bent portions extending from an exposed surface to be bonded in opposite directions to be embedded in the pad portion of the case such that the lead portion of the terminal plate is firmly fixed to the case.
    Type: Grant
    Filed: March 18, 1999
    Date of Patent: February 27, 2001
    Assignee: Aisin AW Co., Ltd.
    Inventors: Koji Aoike, Naotaka Murakami, Hiroki Takata, Osamu Yamato
  • Patent number: 6172308
    Abstract: A terminal attachment structure includes a circuit assembly and a terminal attached to the circuit assembly. The circuit assembly has an insulating substrate and a circuit printed on the insulating substrate. The terminal is composed of a circuit-contact part, a connecting part to be connected with a mating terminal and a cradle part arranged between the circuit-contact part and the connecting part. When a force directing the insulating substrate is applied on the connecting part, the cradle part operates to receive the force. Accordingly, the circuit-contact part does not rise from the insulating substrate, so that clattering of the terminal against the circuit assembly can be prevented.
    Type: Grant
    Filed: June 7, 1999
    Date of Patent: January 9, 2001
    Assignee: Yazaki Corporation
    Inventors: Makoto Katsumata, Toshiyuki Mori, Hitoshi Ushijima
  • Patent number: 6163464
    Abstract: Apparatus for interconnecting logic boards is provided with a backplane, a plurality of logic boards connected to the backplane, and a plurality of interconnecting boards, connected to the backplane, for interconnecting the plurality of logic boards. In the apparatus, the plurality of logic boards are connected to the backplane with the logic boards in vertical position at right angles with the interconnecting boards and a specified distance away from the interconnecting boards.
    Type: Grant
    Filed: August 4, 1998
    Date of Patent: December 19, 2000
    Assignee: Hitachi, Ltd.
    Inventors: Kenichi Ishibashi, Takehisa Hayashi, Tsutomu Goto, Akira Yamagiwa, Tsuyoshi Watanabe
  • Patent number: 6154373
    Abstract: Secondary backplane boards are secured to a main backplane board to provide interconnection paths in a direction transverse to interconnection paths provided on the main backplane board, so that current manufacturing capabilities of multi-layer backplane boards are not exceeded.
    Type: Grant
    Filed: March 24, 1999
    Date of Patent: November 28, 2000
    Assignee: Lucent Technologies Inc.
    Inventors: Andrew C. Durston, Liang Hwang, Hector F. Rodriguez
  • Patent number: 6152742
    Abstract: A high speed, high density surface mount connector which may be easily manufactured. The connector is formed by injection molding a ground plate into a portion of an insulative housing, leaving conducting beam portions and tail portions extending from opposite ends of the housing. A mating section of the housing is separately made. Signal contacts are sandwiched between the two pieces of the housing, which are then mated. The signal contacts are parallel to the ground plate but spaced apart from it, forming individual transmission lines. In use, the tail portions are soldered to a printed circuit board. The beam portions are bent to form contact springs. They make contact to a back plane when the connector is pressed against the back plane.
    Type: Grant
    Filed: May 31, 1995
    Date of Patent: November 28, 2000
    Assignee: Teradyne, Inc.
    Inventors: Thomas S. Cohen, Mark W. Gailus
  • Patent number: 6146150
    Abstract: A circuit card assembly includes a circuit card having a first type of connector extending along one of its longitudinal edges and a second type of circuit connector extending along its other longitudinal edge, so that the card assembly can be plugged into one type of computer bus or inverted and plugged into a second type of computer bus. Provisions are made for inverting a card bracket attached to an end of the card assembly, so that it is correct for both types of installations. In either case, the I/O connector(s) (if any) of the card assembly extend through the bracket for the connection of external cable(s).
    Type: Grant
    Filed: November 24, 1998
    Date of Patent: November 14, 2000
    Assignee: International Business Machines Corporation
    Inventor: Norman King Roberts
  • Patent number: 6144561
    Abstract: A reconfigurable connectorization panel assembly for a circuit board housing rack or chassis, particularly suitable for use in cable television (CATV) headend equipment. Each circuit module for use in the rack has an associated rear panel assembly or "connectorization panel" that bolts onto the rear side of a chassis which supports the rack and a backplane. The connectorization panels extend plug-action connectors through openings in the rear panel of the chassis and in the backplane, and mate with corresponding connectors on the circuit modules. On the rear side, the connectorization panels provide appropriate drop side connectors required for input/output signal cabling. The connectorization panel adapts a particular slot in the chassis for a particular type of input/out cabling and connectors. The slot can be reconfigured for a different type of circuit module by affixing a different type of connectorization panel.
    Type: Grant
    Filed: December 1, 1998
    Date of Patent: November 7, 2000
    Assignee: Scientific-Atlanta, Inc.
    Inventors: James Eugene Cannella, Jr., Tareq K. Hassan, Kamal I. Parikh, Robert A. Saluski
  • Patent number: 6144560
    Abstract: A semiconductor device including bond pads disposed proximate an edge thereof, and an overcoat layer. The overcoat layer defines notches around each of the bond pads. The overcoat layer may be formed from a photoimageable material such as a photoimageable epoxy. The invention also includes an alignment device that secures the semiconductor device perpendicularly upon a carrier substrate. The alignment device includes intermediate conductive elements which correspond to the bond pads of the semiconductor device. Upon insertion of the semiconductor device into the alignment device, the notches facilitate alignment of the bond pads with their corresponding intermediate conductive elements. The intermediate conductive elements establish an electrical connection between the semiconductor device and the carrier substrate.
    Type: Grant
    Filed: December 16, 1999
    Date of Patent: November 7, 2000
    Assignee: Micron Technology, Inc.
    Inventors: Warren M. Farnworth, Walter L. Moden, Larry D. Kinsman
  • Patent number: 6128200
    Abstract: A butt-joint CPU mounting structure includes a connector having two opposite faces. Each face has a receiving slot disposed therein adapted to respectively and receivingly engage with a CPU module and an edge of a main board of a computer thereby connecting the CPU module to the main board. The receiving slots are arranged in alignment with each other whereby the CPU module is substantially coplanar with the main board. A CPU holder includes two support members each defining a channel for receiving opposite side flanges of the connector. Bolts are used to secure the support members to the side flanges of the connector. The CPU module is received between the two support members whereby opposite edges of the CPU module are engaged and supported by the support members. A connection member is connected between the two support members for strengthening the mechanical structure thereof. The support members are provided with bolt holes through which bolts extend for engaging with a housing of the computer.
    Type: Grant
    Filed: February 18, 1999
    Date of Patent: October 3, 2000
    Inventor: Ho-Kang Chu
  • Patent number: 6113396
    Abstract: An electrical connector comprises an insulative housing defining a number of passageways as well as a mating face, and a number of conductive terminals received in the corresponding passageways. Each terminal includes a contact section, a securing section and a joint section. The contact sections of the terminals each have a first crook connected to a second or contact crook by a connecting section. The terminals comprise both long terminals and short terminals arranged in the housing in two rows. The long terminals are alternately arranged with the short terminals whereby the electrical connector can clippingly engage with a PCB while exhibiting the advantages of quick assembly at low cost.
    Type: Grant
    Filed: May 3, 1999
    Date of Patent: September 5, 2000
    Assignee: Hon Hai Precision Ind. Co., Ltd.
    Inventor: Shun-Chi Tung
  • Patent number: 6094358
    Abstract: A method and implementing system are described in which planar board or motherboard stiffness is provided through a support structure mounted to the planar. The support structure includes support bars connected together to form a stiffening structure for the motherboard. The support bars are mounted within planes which are substantially perpendicular to the plane of the motherboard and in proximity to electrical connectors on the motherboard which are arranged to have circuit boards connected thereto. A board mounting apparatus is connected to the support structure to enable and guide the insertion and extraction of circuit boards to the motherboard with only enclosure side panel access. In one example, the circuit boards include guide pins which are inserted into slots of a mounting bracket, and the mounting bracket is selectively moved to exert an insertion or extraction force on a pin connector attached to the circuit board relative to a corresponding connector on a motherboard.
    Type: Grant
    Filed: July 13, 1998
    Date of Patent: July 25, 2000
    Assignee: International Business Machines Corporation
    Inventors: Steven Michael Christensen, Michael Paul Pierce, Ciro Neal Ramirez
  • Patent number: 6089904
    Abstract: A FFC connector comprises a dielectric housing having top and bottom faces. The top face defines an elongate slot extending into the housing and the bottom face defining an entrance in communication with the elongate slot for insertion of a FFC cable. A plurality of terminal cells is defined in the housing and each terminal cell being in communication with the elongate slot. A plurality of terminals is assembled in the terminal cells and each terminal includes a base portion received in the housing and a spring arm extending from the terminal cell into the elongate slot. The terminal further forms a soldering tail for mounting to a printed circuit board.
    Type: Grant
    Filed: April 16, 1999
    Date of Patent: July 18, 2000
    Assignee: Hon Hai Precision Ind. Co., Ltd.
    Inventor: Jerry Wu
  • Patent number: 6091475
    Abstract: Proposed is a novel connector for display inspection of a liquid crystal display panel, by which the display panel per se can be inspected before mounting of a driver IC chip thereon to greatly improve the productivity of the display inspection.
    Type: Grant
    Filed: December 9, 1997
    Date of Patent: July 18, 2000
    Assignee: Shin-Etsu Polymer Co., Ltd.
    Inventors: Tsutomu Ogino, Hiroto Komatsu
  • Patent number: 6043988
    Abstract: When a plurality of hard disks are connected by using a backplane, in order to enable a low-noise installation of the bus and a high-density installation of the hard disk to be simultaneously realized, a signal line of the bus and connectors are installed to the backplane, slots are set to installing regions of the drives, wirings of the signal lines between the connectors are set to, for example, a U-character shape, and a length of signal lines between the connectors is set to be longer than a distance between the connectors adjacent to the bus.
    Type: Grant
    Filed: February 19, 1999
    Date of Patent: March 28, 2000
    Assignee: Hitachi, Ltd.
    Inventors: Hiroki Kanai, Mitsuo Ooyama, Yoshifumi Takamoto
  • Patent number: 6036519
    Abstract: A circuit card connector utilizes flexible circuitry and a card-engagement assembly which applies a normal force to the contact pads of the circuit card. The connector includes two opposing connector end portions and a card-engagement assembly extending therebetween, the card-engagement assembly including two opposing spring members which are seated upon a pair of fulcrums. The spring members are spaced apart from each other on opposite sides of a centerline of a card-receiving slot of the connector. The spring members have lower leg portions and upper contact arm portions.
    Type: Grant
    Filed: September 22, 1997
    Date of Patent: March 14, 2000
    Assignee: Molex Incorporated
    Inventors: John E. Lopata, Russell G. Larsen
  • Patent number: 6021049
    Abstract: A retention device for retaining the forward edge of a PCI or ISA adapter card in a computer frame is provided. The retention device has a channel mounted to the frame opposite a rearward edge of the card. The channel has upper and lower panels which define a slot for receiving the forward edge of the card. A finger is pivotally mounted to one end of the channel and has grooves on a lower surface for engaging grooves on an upper surface of the forward edge. The finger is movable between an engaged position for capturing the forward edge to retain it from moving, and a disengaged position for releasing the forward edge and allowing the card to be removed from the slot.
    Type: Grant
    Filed: March 5, 1998
    Date of Patent: February 1, 2000
    Assignee: International Business Machines Corporation
    Inventors: Donald L. Thompson, Roy A. Rachui
  • Patent number: 6000952
    Abstract: An integrated BEDC and PCB provided through a low cost, highly reliable interconnect system. The upper and/or lower half of the main insulation assembly of a BEDC is provided with a recess for accommodating at least an edge portion of the substrate of a PCB. The PCB is provided with apertures such as holes for receiving therethrough a buss wire and/or terminal slots through which terminals having wire slots are fixedly staked. The apertures on the PCB are arranged in a predetermined pattern so as to align with corresponding respective apertures in the form of corresponding holes and/or terminal slots on the BEDC at the recess thereof. Accordingly, with the PCB seated in the recess, as the buss wires are laid, they will pass through the holes in the PCB and/or pass through the wire slot of the terminals and thereby provide interconnection therebetween when the two halves of the main insulation assembly are united and the PCB is sandwiched therebetween.
    Type: Grant
    Filed: September 29, 1998
    Date of Patent: December 14, 1999
    Assignees: Delco Electronics Corporation, General Motors Corporation
    Inventors: Joseph Howard Gladd, Jeffrey Michael Hickox, Andrew Frank Rodondi, Sean Michael Kelly, William Shane Murphy
  • Patent number: 5986891
    Abstract: A card adapter for insertion of an IC card in a card slot of a receiving member of an electronic apparatus. The IC card is provided with card contacts and the receiving member is provided with a receiving member connector. The card adapter includes a base on which the IC card is positioned with the card contacts in registration with an opening in the base, a circuit board having circuit board contacts and a circuit board connector, and a cover supported on the base. The circuit board contacts project through the opening in the base to make electrical contact with the card contacts and the circuit board connector is connectable to the receiving member connector. The cover movable to a closed position at which it encloses the IC card and exerts pressure on the card contacts to maintain good electrical contact with the circuit board contacts.
    Type: Grant
    Filed: February 18, 1998
    Date of Patent: November 16, 1999
    Assignee: Oki Electric Industry Co., Ltd.
    Inventor: Yasuki Sugimoto
  • Patent number: 5984720
    Abstract: An angled interconnect panel assembly includes an enclosure, a plurality of support brackets mounted inside the enclosure, a plurality of interconnect panels which are each pivotally mounted to one of the support brackets and are each disposed in an angled position when at rest between adjacent support brackets, and a pair of key-operated lock mechanisms for locking or holding the interconnect panels in their angled positions. The enclosure has a pair of opposite end walls and defines wire entry ports in the end walls. One wire entry port is for passage of user wiring into the assembly while the other of the wire entry ports is for passage of technician wiring into the assembly. Each interconnect panel has opposite user and technician sides and defines a plurality of openings extending between the opposite user and technician sides for receiving one or more interconnection members. The assembly also includes a pair of front closure doors.
    Type: Grant
    Filed: October 17, 1997
    Date of Patent: November 16, 1999
    Assignee: Hubbell Incorporated
    Inventors: John J. Milner, Michael R. O'Conner, Gregg J. Lafontaine, Alan C. Miller, William G. Sobieski
  • Patent number: 5966293
    Abstract: An electrical interconnection structure. The electrical interconnection structure includes a mother board substrate having a plurality of layers. At least one layer includes a signal path having a characteristic impedance of Z.sub.O and a conductive ground plane. A signal via passes through each layer of the mother board substrate. The signal via electrically is connected to the signal path. A ground via passes through each layer of the mother board substrate. The ground via is electrically connected to the conductive ground plane. The electrical interconnection structure further includes a plurality of flex circuits. Each flex circuit includes a flex signal path having a characteristic impedance of Z.sub.O and a flex ground plane. Each flex signal path is electrically connected to the signal via and each flex ground plane is electrically connected to the ground via.
    Type: Grant
    Filed: December 15, 1997
    Date of Patent: October 12, 1999
    Assignee: Hewlett-Packard Company
    Inventors: Hannsjorg Obermaier, Keunmyung Lee
  • Patent number: 5945637
    Abstract: A terminal attachment structure includes a circuit assembly and a terminal attached to the circuit assembly. The circuit assembly has an insulating substrate and a circuit printed on the insulating substrate. The terminal is composed of a circuit-contact part, a connecting part to be connected with a mating terminal and a cradle part arranged between the circuit-contact part and the connecting part. When a force directing the insulating substrate is applied on the connecting part, the cradle part operates to receive the force. Accordingly, the circuit-contact part does not rise from the insulating substrate, so that tottering of the terminal against the circuit assembly can be prevented.
    Type: Grant
    Filed: March 21, 1997
    Date of Patent: August 31, 1999
    Assignee: Yazaki Corporation
    Inventors: Makoto Katsumata, Toshiyuki Mori, Hitoshi Ushijima
  • Patent number: 5943215
    Abstract: PCI cards are plugged into vertical risers, the lower edges of which have been plugged into a motherboard. This involves a considerable force being applied to the riser card, both during insertion and removal, and may damage the card or the underlying motherboard. A support for the top edge of the riser card clips onto the upper end thereof. Rearward extensions of the support are gripped by tabs struck out of a wall of the enclosure.
    Type: Grant
    Filed: June 24, 1997
    Date of Patent: August 24, 1999
    Assignee: Sun Microsystems, Inc.
    Inventors: James Carney, David Desilets, Clifford Willis
  • Patent number: 5903442
    Abstract: When a plurality of hard disks are connected by using a backplane, in order to enable a low-noise installation of the bus and a high-density installation of the hard disk to be simultaneously realized, a signal line of the bus and connectors are installed to the backplane, slots are set to installing regions of the drives, wirings of the signal lines between the connectors are set to, for example, a U-character shape, and a length of signal lines between the connectors is set to be longer than a distance between the connectors adjacent to the bus.
    Type: Grant
    Filed: August 14, 1996
    Date of Patent: May 11, 1999
    Assignee: Hitachi, Ltd.
    Inventors: Hiroki Kanai, Mitsuo Ooyama, Yoshifumi Takamoto
  • Patent number: 5901049
    Abstract: An electronic device has an opening for up to two data carrier devices or, respectively, chip cards with row-type contact surfaces positioned alongside one another. The devices or, cards are stackable over one another in offset fashion. In a region of the terminal side lying opposite the plug opening it comprises two rows of contact springs lying next to one another, said rows being spatially offset upwards by the height of a card, and also offset in the insertion direction in a manner corresponding to the card offset. The resilient ends at the plug side of these contact springs respectively contact the contact surfaces of inserted data carriers from above.
    Type: Grant
    Filed: November 25, 1997
    Date of Patent: May 4, 1999
    Assignee: Siemens Aktiengesellschaft
    Inventors: Helge Schmidt, Gerhard Ackermann
  • Patent number: 5839906
    Abstract: A computer/disk storage system interface is provided having disk controller, CPU controller, and cache memory printed circuit boards interconnected through buses provided in a backplane. The backplane has columns of electrical connectors. Each electrical connector has a plurality of rows of pins. One portion of the pins in each row is electrically connected to one bus and the other portion of the pins is electrically connected to the other bus. Each printed circuit board has an electrical connector adapted to connect with the backplane electrical connectors. While the number of pins in the each row of the cache memory printed circuit board electrical connector is the same as the number of pins in each row of the backplane electrical connector, the number of pins in each row of the controller printed circuit board electrical connector is less than the number of pins in the row of pins in the backplane electrical connector.
    Type: Grant
    Filed: September 28, 1995
    Date of Patent: November 24, 1998
    Assignee: EMC Corporation
    Inventor: Eli Leshem
  • Patent number: 5820388
    Abstract: A low profile, surface-mounted receptacle includes a housing having a cavity defined at least in part by the interior surfaces of the sidewalls thereof. The interior surface of at least one sidewall has a groove, one wall of the groove being defined by an inclined portion. An electrical spring contact is received within the groove, the contact being of the curved, dual cantilever type having a first leg, a curved transition portion and a second leg. The contact being disposed to define a clearance space between itself and the inclined. The legs and curved portion responding to the introduction of a male plug by cantilever toward the inclined sidewall and undergoing a reduction in the radius of curvature, thereby displacing to an extent sufficient to exert a predetermined normal force on the plug, despite dimensional variations in the housing due to manufacture.
    Type: Grant
    Filed: July 17, 1997
    Date of Patent: October 13, 1998
    Assignee: Berg Technology, Inc.
    Inventor: John Donald Walden
  • Patent number: 5822193
    Abstract: An apparatus and method for rigidly stabilizing or restraining circuit boards is provided. The apparatus has a rigid cross member (20) and a circuit board clamp (10). These provides stabilization of commercial off the shelf (COTS) circuit boards for use in harsh environments. A one piece clamp has hooks with notched ends that attach to opposite sides of each circuit board. The clamp has a surface parallel to the hook. The parallel surface has threaded holes. Threaded shafts are used with the threaded holes to contact the clamp hook and provide pressure on the printed circuit board. A threaded hole is used with a threaded shaft to engage a rigid cross member. The cross member has unthreaded holes to allow for attaching to the clamps with threaded fasteners. The rigid cross member is then attached to the chassis with a fastener. This eliminates flexing of the circuit board under vibration.
    Type: Grant
    Filed: June 3, 1997
    Date of Patent: October 13, 1998
    Assignee: Motorola, Inc.
    Inventors: Mark David Summers, Ronald Newell Hamilton, Frederick Conrad Ehorn, Brian Mitchel Cover
  • Patent number: 5822197
    Abstract: An electrical connection system includes a frame, a main printed circuit "mother board", a series of secondary printed circuit "daughter boards", and interconnecting spacers formed of an insulative material plate with holes in it into each of which is inserted a buffer that is a good conductor of electricity. The frame includes a support plate with series of slides, the mother board resting on the support plate and receiving the interconnecting spacer. The daughter boards are slid into the slides and include, along an edge which cooperates with the interconnecting spacer, a heel-piece on which is mounted and to which is fixed a flexible printed circuit the tracks of which are connected to those of the daughter board and cooperate with the buffers. Arrangements are provided to fix the daughter boards to the frame.
    Type: Grant
    Filed: April 23, 1997
    Date of Patent: October 13, 1998
    Assignee: Connecteurs Cinch
    Inventor: Michel Thuault
  • Patent number: 5790382
    Abstract: A relatively large printed circuit board includes a pair of stiffening members for preventing bending of the board during handling. The stiffening members are disposed along opposite sides of the board and include edge portions abutting against the board side surfaces and forming planar side extensions of the board. The member edge portions adjoin lateral extensions which are off-set from the plane of the edge portions and which lie flat against a substrate major surface and there secured to the substrate. A beam is rigidly secured to the lateral extension of each member by means of spaced apart posts. The beam overlies the lateral extension and functions, in combination with the lateral extension and post, as a lattice-type I-beam.
    Type: Grant
    Filed: December 26, 1995
    Date of Patent: August 4, 1998
    Assignee: Lucent Technologies Inc.
    Inventor: Eric T. Sexton
  • Patent number: 5766023
    Abstract: An electrical connector with a housing and a contact strip. The housing has a receiving area with openings into the receiving area on opposite sides of the housing. The contact strip has a support of resilient conductive material, an insulating layer on the support, and signal conductors on the insulating layer. The contact strip is located in the receiving area with portions of the signal conductors located at the openings at the opposite sides of the housing.
    Type: Grant
    Filed: August 4, 1995
    Date of Patent: June 16, 1998
    Assignee: Framatome Connectors USA Inc.
    Inventors: Rocco J. Noschese, Heinz Piorunneck