Conductor Is Compressible And To Be Sandwiched Between Panel Circuits Patents (Class 439/66)
  • Patent number: 11150269
    Abstract: A probe head includes a probe seat, a first spring probe penetrating through upper, middle and lower dies of the probe seat for transmitting a first test signal, and at least two shorter second spring probes penetrating through the lower die for transmitting a second test signal with higher frequency. Two second spring probes are electrically connected in a way that top ends thereof are abutted against two electrically conductive contacts on a bottom surface of the middle die electrically connected by a connecting circuit therein. The lower die has a communicating space and at least two lower installation holes communicating therewith and each accommodating a second spring probe partially located in the communicating space. The probe head is adapted for concurrent high and medium or low frequency signal tests, meets fine pitch and high frequency testing requirements and prevents probe cards from too complicated circuit design.
    Type: Grant
    Filed: August 11, 2020
    Date of Patent: October 19, 2021
    Assignee: MPI CORPORATION
    Inventors: Hui-Pin Yang, Shang-Jung Hsieh, Yu-Wen Chou, Ching-Fang Yu, Huo-Kang Hsu, Chin-Tien Yang
  • Patent number: 11139602
    Abstract: An electrical connector and an assembly method thereof are disclosed. The electrical connector includes a substrate provided with multiple accommodating holes, and multiple terminals. Each of the first terminals has a first insertion portion inserted downward into a corresponding accommodating hole, a first strip connecting portion to be connected to a first strip, and a first soldering portion located outside the corresponding accommodating hole and soldered on an upper surface of the substrate. A bottom portion of the first insertion portion, the first strip connecting portion and the first soldering portion are located on a same first plane, such that the first terminals are not easy to twist when the strip is bent and when being inserted into the substrate, thereby allowing the first terminals to be assembled stably.
    Type: Grant
    Filed: February 21, 2020
    Date of Patent: October 5, 2021
    Assignee: LOTES CO., LTD
    Inventor: Chien Chih Ho
  • Patent number: 11112828
    Abstract: According to certain embodiments of the present disclosure, an electronic device and manufacturing method are disclosed. The electronic device includes: a housing including a first face, a second face, and a side member surrounding a space defined between the first face and the second face, a support member within the housing such that a side face of the support member is oriented towards an inner wall of the side member, a circuit board mounted on one face of the support member, an electrically conductive plate mounted on a second face, and a contact member mounted on the support member to electrically couple at least a portion of the side member to the circuit board, wherein the contact member includes an end portion adjacent to the plate, and an end face of the end portion includes a width smaller than a width of another portion of the contact member.
    Type: Grant
    Filed: December 17, 2018
    Date of Patent: September 7, 2021
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Tae Hwa Jung, Young Kyu Kim, Young Moon Park, Jae Uk Ahn, Jong Chun Wee
  • Patent number: 11114778
    Abstract: A device includes a coaxial connector that has a signal portion to electrically couple with a signal portion of a printed circuit board (PCB) to enable transmission of a signal therebetween, a ground portion to electrically couple with a ground portion of the PCB, and a mounting portion to interact with a mounting component to secure the coaxial connector to the PCB. The device also includes a compressible and conductive component to be positioned and deformed between the ground portion of the coaxial connector and the ground portion of the PCB, and a standoff positioned between the coaxial connector and the PCB and to accurately control deformation of the compressible and conductive component.
    Type: Grant
    Filed: April 17, 2018
    Date of Patent: September 7, 2021
    Assignee: Tektronix, Inc.
    Inventor: Devin M. Bingham
  • Patent number: 11102885
    Abstract: A resin multilayer board includes a substrate including a stack of resin layers, and a first metal pin including a first end portion exposed at a first main surface of the substrate and penetrating through at least one of the resin layers in a thickness direction, wherein a gap is provided at a portion of an interface between a lateral side of the first metal pin and the resin layer.
    Type: Grant
    Filed: August 31, 2020
    Date of Patent: August 24, 2021
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Atsushi Kasuya, Yusuke Kamitsubo
  • Patent number: 11096292
    Abstract: A display apparatus comprises a display panel comprising a plurality of driving elements to drive pixels and a first terminal group electrically connected to the driving elements; a supporting member comprising a surface on which the display panel is to be placed and comprising, on the surface, a plurality of wirings and a second terminal group connected to the plurality of wirings; and a holding member provided along an edge of the display panel using a rod-shaped material having a linear or curved shape to hold the display panel at a given position on the surface of the supporting member, wherein the first terminal group is provided on a surface of the display panel to be directed to the supporting member; and the display panel is placed on the surface of the supporting member, and each of terminals constituting the first terminal group is connected to each of terminals constituting the second terminal.
    Type: Grant
    Filed: May 13, 2020
    Date of Patent: August 17, 2021
    Assignee: SAKAI DISPLAY PRODUCTS CORPORATION
    Inventor: Katsuhiko Kishimoto
  • Patent number: 11051404
    Abstract: A method for connecting stacked circuit boards provides an insulation base as a hollowed annular plate and which has a first surface, a second surface, and a lateral surface. The insulating base defines stepped first grooves on the first surface, stepped second grooves on the second surface, and third grooves on the lateral surface. Insulating base is plated to deposit first pads in the first grooves, second pads in the second grooves, and wiring portions in the third grooves to connect first and second pads. Conductive ink layer is coated on first and second pads, and protective ink layer is coated on wiring portions and insulating base except for first and second pads. First and second circuit boards are provided for attachment to first and second pads respectively. A connecting structure is also provided.
    Type: Grant
    Filed: January 4, 2019
    Date of Patent: June 29, 2021
    Assignees: QING DING PRECISION ELECTRONICS (HUAIAN) CO., LTD, Avary Holding (Shenzhen) Co., Limited.
    Inventors: Rui-Wu Liu, Ming-Jaan Ho, Man-Zhi Peng
  • Patent number: 11043763
    Abstract: An electrical connector and an electrical connector assembly are provided. The electrical connector assembly includes: a mating assembly including a support plate and multiple insertion portions provided on the support plate and protruding downward out of the support plate; and an electrical connector. The electrical connector includes: a substrate, provided with multiple accommodating holes running through the substrate vertically; and multiple terminals accommodated in the accommodating holes. Each terminal has a base and two clamping portions configured to clamp a corresponding insertion portion. The two clamping portions are located in front of the base. A top end of the base is lower than top ends of the two clamping portions. When the two clamping portions jointly clamp the corresponding insertion portion, a portion of the corresponding insertion portion lower than the top ends of the clamping portions is located right above the base of an adjacent terminal.
    Type: Grant
    Filed: May 6, 2020
    Date of Patent: June 22, 2021
    Assignee: LOTES CO., LTD
    Inventor: Zuo Feng Jin
  • Patent number: 10996241
    Abstract: A probe card board in the present disclosure includes a plurality of through holes designed to receive a probe brought into contact with a measurement object. The probe card board is composed of silicon nitride based ceramics. The probe card board includes a first surface opposed to the measurement object and a second surface located opposite to the first surface. The probe card board contains a plurality of crystal phases of metal silicide. Metal constituting the metal silicide is at least one kind selected from among molybdenum, chrome, iron, nickel, manganese, vanadium, niobium, tantalum, cobalt and tungsten.
    Type: Grant
    Filed: October 30, 2017
    Date of Patent: May 4, 2021
    Assignee: KYOCERA Corporation
    Inventor: Tomohiro Imai
  • Patent number: 10985488
    Abstract: An electrical contact and connector (also known as elastic electrical contact and system) are disclosed herein for testing semiconductor devices such as integrated circuit (IC) packages, particular high density IC packages. The elastic electrical contact comprises a plurality of interlaced or interwove and unsupported conductive wires. The electrical contact system comprises the elastic electrical contacts and a carrier having a plurality of through openings. The elastic electrical contacts are placed in their respective through openings with both ends exposed from the through openings. Method of making and using the elastic electrical contact are also provided.
    Type: Grant
    Filed: January 30, 2020
    Date of Patent: April 20, 2021
    Assignee: BeCe Pte Ltd
    Inventors: Hiang Kwee Goh, Seow Meng Low
  • Patent number: 10978844
    Abstract: Various embodiments relating to a pogo module comprising a pogo pin for maintaining an electrical connection state when an electronic device is rotated and not rotated are disclosed, and according to one embodiment, the pogo module comprises: first and second housings; module circuit boards provided inside the first and second housings; at least one pogo pin provided to the module circuit board and comprising a rotatable structure electrically connected to at least one electrode pattern included in a printed circuit board of the electronic device; and a support body coupled to the module circuit board to support the at least one pogo pin, wherein the rotatable structure can maintain an electrical connection state with the at least one electrode pattern when the electronic device is rotated or not rotated. In addition, various other embodiments are possible.
    Type: Grant
    Filed: February 8, 2018
    Date of Patent: April 13, 2021
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Ki-Young Kwon, Ki-Won Kim, Ji-Min Kim
  • Patent number: 10971846
    Abstract: A board to board connector may include: a support including: a circumference part having an internal space of which a top and a bottom are open; one or more first protruding parts protruding outward from the top of the circumference part in an obliquely upward direction; and one or more first fixing parts protruding from the bottom of the circumference part; a terminal including: a body having an internal space of which a top and a bottom are open; a second protruding part protruding from the top of the body in an obliquely upward direction; and one or more second fixing parts protruding from the bottom of the body, and disposed on the inside of the circumference part of the support; and an insulating part formed between an inner circumferential surface of the circumference part of the support and an outer circumferential surface of the body of the terminal.
    Type: Grant
    Filed: August 29, 2019
    Date of Patent: April 6, 2021
    Assignee: MPD Corp.
    Inventors: Hyun-Hwa So, Hyun-Cheul Na
  • Patent number: 10969249
    Abstract: A method, apparatus, and system use logic circuitry arranged within an integrated circuit to: convert a self capacitance of a first sensor element arranged within the integrated circuit to a digital value, and apply a signal to an output pin of the integrated circuit based on the self capacitance.
    Type: Grant
    Filed: February 15, 2017
    Date of Patent: April 6, 2021
    Assignee: Cypress Semiconductor Coproration
    Inventors: Rajagopal Narayanasamy, Mahadevan Krishnamurthy Narayana Swamy, David G. Wright, Steve Kolokowsky
  • Patent number: 10939560
    Abstract: An electrical connector assembly includes a contact organizer having a substrate having a lower surface facing the host circuit board and an upper surface facing a component circuit board. The electrical connector includes data transmission contacts each including a main body, a upper mating element extending from the main body top mated to the component circuit board, and a lower mating element extending from the main body bottom soldered to the host circuit board. The main body includes a main body length between the top and the bottom and an adjustable height section to adjust a height of the main body between the top and the bottom. The adjustable height sections of the data transmission contacts are varied to adjust vertical positions of at least one of the upper mating element or the lower mating element such that the contacts have variable heights.
    Type: Grant
    Filed: July 22, 2020
    Date of Patent: March 2, 2021
    Assignees: TYCO ELECTRONICS JAPAN G.K., TE CONNECTIVITY SERVICES GmbH
    Inventors: Craig Warren Hornung, Chad William Morgan, Hiroshi Shirai, John Joseph Consoli
  • Patent number: 10931043
    Abstract: An electrical connector includes a substrate provided with an accommodating hole, and a first terminal and a second terminal provided vertically. The first terminal has a first elastic arm located outside the accommodating hole, and a first fixing portion retained in the accommodating hole. A plate surface of the first fixing portion forms a first laminated surface. The first elastic arm and the first laminated surface are located at two opposite sides of the first fixing portion. The second terminal has a second elastic arm located outside the accommodating hole, and a second fixing portion retained in the accommodating hole. A plate surface of the second fixing portion forms a second laminated surface parallel to and laminated with the first laminated surface along a horizontal direction. The second elastic arm and the second laminated surface are located at a same side of the second fixing portion.
    Type: Grant
    Filed: March 16, 2020
    Date of Patent: February 23, 2021
    Assignee: LOTES CO., LTD
    Inventor: Chien Chih Ho
  • Patent number: 10903591
    Abstract: An electrical connector includes: an insulating frame, having an accommodating space to accommodate a chip module; a metal sheet, fixed to the insulating frame and provided with multiple positioning slots; and multiple insulating blocks respectively positioned correspondingly in the positioning slots movably in a vertical direction. The metal sheet has a first stopping portion and a second stopping portion on a periphery of each positioning slot. Each insulating block is formed separately from the insulating frame and accommodates multiple conductive terminals, and has a first protruding portion located above the first stopping portion, and a second protruding portion located below the second stopping portion, such that the first and second stopping portions restrict the insulating blocks from moving vertically. In the vertical direction, a gap exists between the first protruding portion and the first stopping portion, and a gap exists between the second protruding portion and the second stopping portion.
    Type: Grant
    Filed: November 14, 2019
    Date of Patent: January 26, 2021
    Assignee: LOTES CO., LTD
    Inventor: Jun Zhang
  • Patent number: 10905002
    Abstract: A method for forming a flexible substrate having a via, according to the present embodiment, comprises the steps of: (a) arranging a mixture of conductive particles moving by means of a magnetic field, when a curable resin and the magnetic field are provided; (b) forming a material layer being cured and having flexibility; (c) arranging the conductive particles by providing a magnetic field; and (d) curing the curable resin and the material layer.
    Type: Grant
    Filed: September 22, 2017
    Date of Patent: January 26, 2021
    Assignee: SEOUL NATIONAL UNIVERSITY R&DB FOUNDATION
    Inventors: Yongtaek Hong, Eunho Oh, Junghwan Byun, Byeongmoon Lee
  • Patent number: 10886653
    Abstract: An improved method and structure is provided for constructing elastomeric pin arrays using a non-conductive medium and compression limiters. Pin to pin of the same elastomeric material, pin to pin of similar elastomeric material, or pin to metal cap structure interconnects are constructed using an elastomeric connection through a non-conductive medium. Compression limiting structures are mated to the non-conductive medium. This structure eliminates the need for PCB structures as the medium reducing manufacturing cost.
    Type: Grant
    Filed: December 14, 2018
    Date of Patent: January 5, 2021
    Assignee: R&D Sockets, Inc
    Inventors: Charles William Martin, Christopher Matthew Beers, James V. Russell
  • Patent number: 10872816
    Abstract: A system for interconnecting at least two die each die having a plurality of conducting layers and dielectric layers disposed upon a substrate which may include active and passive elements. In one embodiment there is at least one interconnect coupling at least one conducting layer on a side of one die to at least one conducting layer on a side of the other die. Another interconnect embodiment is a slug having conducting and dielectric layers disposed between two or more die to interconnect between the die. Other interconnect techniques include direct coupling such as rod, ball, dual balls, bar, cylinder, bump, slug, and carbon nanotube, as well as indirect coupling such as inductive coupling, capacitive coupling, and wireless communications. The die may have features to facilitate placement of the interconnects such as dogleg cuts, grooves, notches, enlarged contact pads, tapered side edges and stepped vias.
    Type: Grant
    Filed: March 6, 2018
    Date of Patent: December 22, 2020
    Assignee: GULA CONSULTING LIMITED LIABIITY COMPANY
    Inventor: Ernest E. Hollis
  • Patent number: 10854362
    Abstract: Provided are a guide-connected contactor and a portable electronic device comprising same. A guide-connected contactor, according to an embodiment of the present invention, comprises: an elastic conductor which comes in contact with a circuit board of an electronic device or a bracket connected to the circuit board; a functional element which is connected to the elastic conductor and has a first electrode and a second electrode on the upper surface and the lower surface, respectively; and a guide which is plate-shaped, has the functional element connected thereto, and is connected to a groove portion provided on a conductive case of the electronic device.
    Type: Grant
    Filed: February 21, 2017
    Date of Patent: December 1, 2020
    Assignee: AMOTECH CO., LTD.
    Inventors: Byung Guk Lim, Dong Hun Kong, Jae Woo Choi, Jae Su Ryu
  • Patent number: 10840660
    Abstract: The present invention relates to an electronic device and an antenna connector. The electronic device includes a first unit, a transmission dock, a base, and an antenna connector. The transmission dock is pivotally provided at the first unit. The base is movably provided at the transmission dock, and includes a top plate and a bottom plate that are mutually fixed. The antenna connector is movably provided at the base, and includes a housing, an installation flange, a central moving terminal and an elastic member. The central moving terminal is located in the housing. The installation flange is radially formed outside the housing, and is located between the top plate and the bottom plate and abuts against the top plate. The elastic member is clamped between the installation flange and the bottom plate.
    Type: Grant
    Filed: January 31, 2019
    Date of Patent: November 17, 2020
    Assignee: Getac Technology Corporation
    Inventors: Wan-Lin Hsu, Juei-Chi Chang, Kun-Cheng Lee
  • Patent number: 10804621
    Abstract: According to one embodiment, a printed wiring board includes a wiring board, a connector part, a connection pad provided between the wiring board and the connector part and connected with the connector part with a solder material and a guide groove provided in the wiring board to be continuous to the connection pad, to guide a portion of the solder material from the connection pad.
    Type: Grant
    Filed: July 29, 2019
    Date of Patent: October 13, 2020
    Assignee: KABUSHIKI KAISHA TOSHIBA
    Inventors: Akira Tanaka, Masaya Hirashima, Satoru Yasui, Shukuyo Yamada, Masashi Watanabe
  • Patent number: 10797424
    Abstract: An electrical contact for connecting a chip module to a print circuit board, the electrical contact comprises a main body, an upper elastic arm and a lower mounting arm extending upwardly from the main body, and a lower elastic arm and a lower mounting arm extending downwardly from the main body. The upper mounting arm is disposed at the downside of the upper elastic arm and forms a space therebetween; the lower mounting arm is disposed at the downside of the lower elastic arm and forms a space therebetween. The upper elastic arm and the lower elastic arm are respectively deformed by the chip module and print circuit board to resist to the upper mounting arm and lower mounting arm, thereby shortening the current path between the chip module and the print circuit board for improving the high frequency performance of an electrical connector.
    Type: Grant
    Filed: April 26, 2019
    Date of Patent: October 6, 2020
    Assignees: FUDING PRECISION COMPONENTS (SHENZHEN) CO., LTD., FOXCONN INTERCONNECT TECHNOLOGY LIMITED
    Inventor: Shuo-Hsiu Hsu
  • Patent number: 10756041
    Abstract: A finned contact of an IC device may be utilized to electrically connect the IC device to external circuitry. The finned contact may be fabricated by forming a base upon the IC device and subsequently forming two or more fins upon the base. Each fin may be formed of the same and/or different material(s) as the base. Each fin may include layer(s) of one or materials. The fins may be located upon the base inset from the sidewall(s) of the base. The fins may be arranged as separated ring portions that are concentric with the base. The fins may drive current into the external circuitry connected thereto. Solder may be drawn towards the center of the base within an inner void that is internal to the fins, thereby limiting the likelihood of solder bridging with a neighboring contact.
    Type: Grant
    Filed: March 14, 2019
    Date of Patent: August 25, 2020
    Assignee: International Business Machines Corporation
    Inventors: Charles L. Arvin, Brian M. Erwin, Clement J. Fortin, Chris Muzzy
  • Patent number: 10749283
    Abstract: A power electronics assembly for an electric motor controller is disclosed having a first circuit board, a second circuit board spaced from the first circuit board by a stand-off distance, an electrically insulating housing held between the first circuit board and the second circuit board, multiple conductors, and a restraint adapted to hold the electrically insulating housing to the first circuit. The electrically insulating housing includes multiple channels. Each of the multiple conductors are arranged to provide a conduction path through a corresponding channel and are each trapped between the electrically insulating housing and the first circuit board and biased into electrical contact with an electrical conductor of the first circuit board.
    Type: Grant
    Filed: July 4, 2016
    Date of Patent: August 18, 2020
    Assignee: Sevcon Limited
    Inventors: Gary Squire, Matt Jackson, Peter Barrass
  • Patent number: 10736542
    Abstract: Insole or shoe sole, which has a sensor device (10) having a plurality of sensor fields (1-9) for pressure detection and an electronic unit (15) that is electrically connected to the sensor fields (1-9) and has electronic components (17), wherein the sensor device (10) is formed in the manner of a sandwich with a middle layer (12) made of a piezoresistive material, a top layer (13) arranged above the middle layer (12) and a bottom layer (11) arranged underneath the middle layer (12). The top and bottom layer (13, 11) each include an electrically conductive material (14) in the region (1a-9a; 1b-9b) of a respective sensor field (1-9). The top and bottom layer (13, 11) each have a protruding flexible tab (23, 22) having conductor tracks (24-26) for electrically connecting the sensor fields (1-9) to the electronic unit (15). The electronic unit (15) has contact regions (29), against which the tabs (23, 22) bear by way of their conductor tracks (24-26).
    Type: Grant
    Filed: September 27, 2017
    Date of Patent: August 11, 2020
    Assignee: stAPPtronics GmH
    Inventors: Peter Krimmer, Philip Olbrich, Thomas Frois
  • Patent number: 10732201
    Abstract: A test probe for testing a chip package is provided, wherein the test probe comprises a test probe body comprising a conductive material; and a probe tip arranged on an end of the test probe body and comprising carbon nano tubes.
    Type: Grant
    Filed: April 13, 2014
    Date of Patent: August 4, 2020
    Assignee: Infineon Technologies AG
    Inventor: Kok Kiat Koo
  • Patent number: 10707124
    Abstract: A system for interconnecting at least two die each die having a plurality of conducting layers and dielectric layers disposed upon a substrate which may include active and passive elements. In one embodiment there is at least one interconnect coupling at least one conducting layer on a side of one die to at least one conducting layer on a side of the other die. Another interconnect embodiment is a slug having conducting and dielectric layers disposed between two or more die to interconnect between the die. Other interconnect techniques include direct coupling such as rod, ball, dual balls, bar, cylinder, bump, slug, and carbon nanotube, as well as indirect coupling such as inductive coupling, capacitive coupling, and wireless communications. The die may have features to facilitate placement of the interconnects such as dogleg cuts, grooves, notches, enlarged contact pads, tapered side edges and stepped vias.
    Type: Grant
    Filed: March 6, 2018
    Date of Patent: July 7, 2020
    Assignee: GULA CONSULTING LIMITED LIABIITY COMPANY
    Inventor: Ernest E. Hollis
  • Patent number: 10701807
    Abstract: A multi-layered circuit board structure includes a first circuit board, a second circuit board, and a heat dissipation plate. The first circuit board includes a first surface. The second circuit board includes a second surface facing the first surface. The heat dissipation plate is located between the first circuit board and the second circuit board. The heat dissipation plate includes a substrate and a fixing base integrally extending from the substrate and bent. The fixing base includes a connecting plate, a first plate, and a second plate spaced apart from the first plate. The connecting plate is connected between the first plate and the second plate. The first surface is bonded to a surface of the first plate, the second surface is bonded to a surface of the second plate, and the substrate is in contact with neither the first surface nor the second surface.
    Type: Grant
    Filed: February 5, 2019
    Date of Patent: June 30, 2020
    Assignee: CHICONY ELECTRONICS CO., LTD.
    Inventors: Wei-Cheng Chen, Jin-Kae Jang
  • Patent number: 10698026
    Abstract: A testing holder for a chip unit, a multi site holding frame for plural chip units and a method for testing a die thereof are provided. The proposed multi site holding frame for testing plural chip units simultaneously includes a first holder frame having a plurality of testing holders. Each of the plurality of testing holders includes a holder body containing a specific one of the plural chip units, and a pressure releasing device formed on the holder body to release an insertion pressure when the specific one of the plural chip units is inserted in the holder body.
    Type: Grant
    Filed: August 31, 2018
    Date of Patent: June 30, 2020
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Mill-Jer Wang, Kuo-Chuan Liu, Ching-Nen Peng, Hung-Chih Lin, Hao Chen
  • Patent number: 10699056
    Abstract: A computer-implemented method for a simulation of a printed circuit board includes dividing a layout of the printed circuit board into elements having the same size, detecting first elements that have at least two materials from the elements, calculating anisotropic attributes of the first elements and assigning the anisotropic attributes to each of the first elements, and calculating a warpage of the printed circuit board based on the anisotropic attributes of the first elements. The anisotropic attributes depend on physical properties according to directions of the first elements on the layout.
    Type: Grant
    Filed: July 10, 2019
    Date of Patent: June 30, 2020
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Youngbae Kim, Kyungsuk Oh
  • Patent number: 10680371
    Abstract: A connector assembly for connecting a battery to different electrical components within an electrical device includes a housing, and a plurality of sheet metal contacts coupled to and extending through the housing. The plurality of sheet metal contacts define a plurality of battery contact regions and a plurality of internal contact regions spaced form the plurality of battery contact regions. The plurality of internal contact regions physically contact the plurality of different electrical components. A first one of the plurality of internal contact regions is offset from a second one of the plurality of internal contact regions in a different spatial plane than a spatial plane of the second one of the plurality of internal contact regions.
    Type: Grant
    Filed: March 29, 2019
    Date of Patent: June 9, 2020
    Assignee: MOTOROLA SOLUTIONS, INC.
    Inventors: Guerin L. Williams, Jody H. Akens, Timothy Brand, Anthony M. Kakiel, Kevin K. Maggert, William Robertson
  • Patent number: 10680373
    Abstract: A plurality of contact are received within the corresponding passageways of the insulative housing of an electrical connector, respectively. Each contact has juxtaposed first body and second body angled with each other via a linking section connected therebetween. A resilient spring arm extends upwardly from the first body, and includes a wide plate section adjacent to the first body, a bulged contacting section at a top thereof, and a narrow connecting section therebetween. The spring arm is asymmetric with regard to a centerline of the spring arm for avoiding interference with a standoff around a neighboring passageway in a neighboring row.
    Type: Grant
    Filed: March 19, 2019
    Date of Patent: June 9, 2020
    Assignees: FU DING PRECISION COMPONENT (SHEN ZHEN) Co., FOXCONN INTERCONNECT TECHNOLOGY LIMITED
    Inventors: Shan-Yong Cheng, Tzu-Yao Hwang
  • Patent number: 10680372
    Abstract: A plurality of contact are received within the corresponding passageways of the insulative housing of an electrical connector, respectively. Each contact has juxtaposed first body and second body angled with each other via a connecting section linked therebetween. A resilient contacting section extends upwardly from the first body. A spring arm extends upward from the first body and includes a wide plate section adjacent to the first body and a narrow bulged contacting section at a top thereof. During operation, the plate section is parallel to a top face of the housing in a compressed manner.
    Type: Grant
    Filed: March 18, 2019
    Date of Patent: June 9, 2020
    Assignees: FU DING PRECISION COMPONENT (SHEN ZHEN) CO., LTD., FOXCONN INTERCONNECT TECHNOLOGY LIMITED
    Inventors: Tzu-Yao Hwang, Kuo-Wei Chang
  • Patent number: 10680374
    Abstract: An electrical connector includes an insulative housing retaining a plurality of contacts therein. The contact includes a mating part with a first body and a spring arm extending therefrom for mating a conductive pad of a CPU (Central Processing Unit), and a soldering part with a second body and a solder tail extending therefrom for mounting a solder ball thereon. The spring arm is downwardly pressed by the CPU to contact the soldering part when the CPU is mounted upon the electrical connector The mating part and the soldering part are spaced from each other either without any connection, or alternately linked with each other via a bridge transversely connected therebetween wherein the latter may optionally omit the barbed structure from one of the mating part and the soldering part.
    Type: Grant
    Filed: April 29, 2019
    Date of Patent: June 9, 2020
    Assignees: FU DING PRECISION COMPONENT (SHEN ZHEN) CO., LTD., FOXCONN INTERCONNECT TECHNOLOGY LIMITED
    Inventor: Shuo-Hsiu Hsu
  • Patent number: 10673194
    Abstract: A manufacturing method of connector structure including the following steps is provided. First, providing a dielectric layer having. Then, forming a first adhesive layer and a second adhesive layer on two opposite sides of the dielectric layer respectively. Then, providing at least one first conductive elastic cantilever and at least one second conductive elastic cantilever, wherein the first conductive elastic cantilever comprises a first fixing end portion and a first free end portion, and the second conductive elastic cantilever comprises a second fixing end portion and a second free end portion. Then, fixing the first fixing end portion and the second fixing end portion to the first adhesive layer and the second adhesive layer respectively, wherein the first fixing end portion is aligned with the second fixing end portion. Afterward, forming at least one conductive via for electrically connecting the first conductive elastic cantilever with the second conductive elastic cantilever.
    Type: Grant
    Filed: August 6, 2018
    Date of Patent: June 2, 2020
    Assignee: Unimicron Technology Corp.
    Inventors: Yu-Hsiang Chuang, Guodong Li, He Lei, Jianyu Zhang
  • Patent number: 10673156
    Abstract: A connecting device is provided that includes a movable part contacting an external contact terminal, and an elastic part connected to the movable part and configured to provide an elastic force enabling movement of the movable part. The connecting device also includes a support connected to the elastic part, and at least one protecting wall connected to the support and configured to protect the movable part from external forces. The connecting device further includes an extension extending from the at least one protecting wall in a direction along which the movable part moves and configured to bring the movable part close to the external contact terminal, and a base part provided within the extension and configured to reinforce the support.
    Type: Grant
    Filed: June 12, 2018
    Date of Patent: June 2, 2020
    Assignees: Samsung Electronics Co., Ltd, Hyupjinconnector Co., Ltd
    Inventors: Jang-Won Hur, Jae-Woon Lee, Jung-Hyun Cho, Seon-Tae Kim, Jin-Woo Park, Chang-Su Park, Yoon-Jae Jung, Kyung-Bin Han
  • Patent number: 10648872
    Abstract: A sensor device may include an elastic dielectric; a sensing unit including a first wiring and a second wiring for outputting sensing signals, and a flexible printed circuit board provided with a first connection terminal to which the first wiring is connected, and with a second connection terminal to which the second wiring is connected. The first wiring is formed on one surface of the dielectric and may be connected to the first connection terminal. The second wiring is formed on another surface of the dielectric facing the surface on which the first wiring is formed and may be connected to the second connection terminal.
    Type: Grant
    Filed: December 9, 2016
    Date of Patent: May 12, 2020
    Assignee: LG Innotek Co., Ltd.
    Inventors: Yong Hwa Park, Bi Yi Kim, Seung Jin Kim, Hyun Gyu Park, Hyung Yoon, In Hee Cho
  • Patent number: 10638629
    Abstract: A hold down member can be surface mounted to a substrate, such that a post of the hold down member extends at least into an interposer. Accordingly, when an on board transceiver is placed in electrical communication with the interposer, a fastener can be inserted at least into the on board transceiver so as to attach to the post, thereby securing the on board transceiver to the interposer and the substrate.
    Type: Grant
    Filed: November 12, 2015
    Date of Patent: April 28, 2020
    Assignee: FCI USA LLC
    Inventor: John P. Thompson
  • Patent number: 10629635
    Abstract: An array substrate and a display device are provided. The array substrate includes a display region and a non-display region surrounding the display region. The non-display region includes a connection region where a plurality of connection pads is arranged, and for at least parts of the connection pads, two adjacent connection pads are not overlap each other or partially overlap each other in a first direction.
    Type: Grant
    Filed: September 2, 2016
    Date of Patent: April 21, 2020
    Assignee: BOE TECHNOLOGY GROUP CO., LTD.
    Inventors: Jianbo Xian, Pan Li
  • Patent number: 10615530
    Abstract: An electrical connector or electrical connector assembly that has a housing, a contact carrier, one or more spring members, and an interposer. The contact carrier is movable with respect to the housing between unmated and mated electrical positions.
    Type: Grant
    Filed: January 30, 2019
    Date of Patent: April 7, 2020
    Assignee: Amphenol Corporation
    Inventors: Ronald I. Frank, James R. Meszaros, George L. Goulart, Jr., Braden J. Ishaug, Robert G. Hennemuth, III, Michael D. Smith, Michael A. Yashin, Gordon J. Udall, Daniel R. Mcnevin
  • Patent number: 10591964
    Abstract: The disclosed apparatus may include (1) a plurality of vapor chambers that (A) are mounted to a plurality of individual power components that dissipate heat within a computing device and (B) absorb heat dissipated by the plurality of individual power components within the computing device and (2) at least one thermal coupling that (A) physically bridges the plurality of vapor chambers to one another within the computing device and (B) facilitates heat transfer among the plurality of vapor chambers mounted to the individual power components. Various other apparatuses, systems, and methods are also disclosed.
    Type: Grant
    Filed: February 14, 2017
    Date of Patent: March 17, 2020
    Assignee: Juniper Networks, Inc
    Inventors: Travis S. Mikjaniec, Mahesh Nagarajan, Henry K. Sim, Daniel Farmer, Attila I. Aranyosi
  • Patent number: 10578646
    Abstract: A testing head for functionality testing a device under test comprises a plurality of contact probes, each contact probe having a rod-like body having a preset length less than 5000 ?m extending between a first and a second end, the second end being a contact tip and an opening extending all over its length and defining a plurality of arms, parallel to each other, separated by the opening and connected to the end portions of the contact probe, and an auxiliary guide, arranged transverse to the body and provided with suitable guide holes, the contact probes sliding through each of them, the auxiliary guide defining a gap including one end of the opening being a critical portion of the body and a zone more prone to breakings in the body undergoing low or even no bending stresses in the gap with respect to the rest of the body.
    Type: Grant
    Filed: September 13, 2017
    Date of Patent: March 3, 2020
    Assignee: TECHNOPROBE S.P.A.
    Inventor: Daniele Acconcia
  • Patent number: 10573620
    Abstract: The present invention relates to a spring element for a power semiconductor module, wherein the spring element includes a first part made from a first material and a second part made from a second material, the first material being different from the second material, wherein the first part comprises both a first contact portion having a first contact and a second contact portion having a second contact, wherein the first part comprises an electrically conductive path formed from the first contact portion to the second contact portion, and wherein the second part is adapted for exerting a spring force (FS) onto the first contact portion and the second contact portion for pressing the first contact to a first contact area of a power semiconductor module and the second contact to a second contact area of a power semiconductor module. Such a spring element may form a press contact in a power semiconductor module and may be less bulky compared to solutions in the prior art and may be formed cost-sparingly.
    Type: Grant
    Filed: December 22, 2017
    Date of Patent: February 25, 2020
    Assignee: ABB Schweiz AG
    Inventor: Franc Dugal
  • Patent number: 10571517
    Abstract: Examples of the present disclosure generally relate to a probe head assembly having modular interposer and a test system having the same. In one example, a probe head assembly includes a rigid stiffener plate, a PIB substrate, a bracket, a plurality of interposers disposed in the bracket, a probe card board electrically coupled by a plurality of contact pins disposed through the interposers to the PIB substrate, and a probe card electrically coupled to the probe card board. The PIB substrate, the interposers and the probe card board are sandwiched between the stiffener plate and the probe card.
    Type: Grant
    Filed: December 1, 2017
    Date of Patent: February 25, 2020
    Assignee: XILINX, INC.
    Inventors: Mohsen H. Mardi, Lik Huay Lim, King Yon Lew, Andy Widjaja
  • Patent number: 10557867
    Abstract: A probe pin includes an elastic hollow cylinder that expands and contracts along a central axis, a conductive first plunger extending in the cylinder along the central axis from a first end of the cylinder, and a conductive second plunger extending in the cylinder along the central axis from a second end of the cylinder. The first and second plungers are coupled together in the cylinder in a manner movable relative to each other along the central axis. The first plunger includes a first plunger body contained in the cylinder, and a first terminal connected to the first plunger body and located outside the cylinder. The second plunger includes a second plunger body contained in the cylinder, and a second terminal connected to the second plunger body and located outside the cylinder.
    Type: Grant
    Filed: January 5, 2017
    Date of Patent: February 11, 2020
    Assignee: OMRON Corporation
    Inventors: Hirotada Teranishi, Takahiro Sakai
  • Patent number: 10541480
    Abstract: An electrical connector assembly provides an electrical connector mounted upon a main board, a CPU assembled upon connector with an interposer therebetween wherein some conductors on the CPU are electrically connected to the main board or to an external device via the conductive elements on the outer/exposed region of the interposer outside of the connector and a connection device, e.g., the connector set or the cable set, which is linked to those conductive elements on the outer/exposed region, while remaining conductors on the CPU are electrically connected to the main board via the conductive elements on the inner/hidden region of the interpose inside the connector by cooperation with the contacts of the connector.
    Type: Grant
    Filed: May 7, 2018
    Date of Patent: January 21, 2020
    Assignee: FOXCONN INTERCONNECT TECHNOLOGY LIMITED
    Inventor: Shuo-Hsiu Hsu
  • Patent number: 10490925
    Abstract: An electrical connector is used to be electrically connected to a chip module, and includes a body provided with at least one accommodating groove. The body has a supporting block protrudingly provided upward at one side of the accommodating groove, and the supporting block is configured to upward support the chip module. At least one terminal is correspondingly accommodated in the at least one accommodating groove. The terminal includes: a first base accommodated in the accommodating groove; an elastic arm formed by bending and extending forward from the first base and located at one side of the supporting block to be electrically connected to the chip module; and a through slot running vertically through the elastic arm. The supporting block has a rear end. The first base is located behind the rear end. The through slot extends forward and does not pass beyond the rear end.
    Type: Grant
    Filed: March 8, 2019
    Date of Patent: November 26, 2019
    Assignee: LOTES CO., LTD.
    Inventor: Chang Wei Huang
  • Patent number: 10488439
    Abstract: An electrical contact that employs a common compressible layer for all contacts, wherein the compressible layer is fashioned with ducts that contain bridges within them. The bridges are formed of the compressible layer. This bridge serves as a compressible member for a first and second member in electrical contact with each other, and that interact with each other such that a compression force acted on the first and second members will cause them to maintain electrical contact whilst compressing the bridge. When the compressive force is released, the bridge, acting like a spring, expands thus pushing the first and second members apart, but still in electrical contact with each other.
    Type: Grant
    Filed: July 3, 2018
    Date of Patent: November 26, 2019
    Assignee: JF MICROTECHNOLOGY SDN. BHD.
    Inventors: Wei Kuong Foong, Kok Sing Goh, Shamal Mundiyath, Eng Kiat Lee
  • Patent number: 10481176
    Abstract: A signal lead structured to be attached to an electrical device that comprises a signal pad, a spring housing, a spring, and a flexible conduit. The spring is carried in the spring housing, and a portion of the spring extends beyond a surface of the spring housing when the spring is unsprung. The spring is structured to touch the electrical device and carry an electrical signal between the electrical device and the signal pad when the signal lead is attached to the electrical device. The flexible conduit is coupled to the signal pad at an end of the flexible electrical conduit and extends away from the spring housing.
    Type: Grant
    Filed: September 30, 2016
    Date of Patent: November 19, 2019
    Assignee: Tektronix, Inc.
    Inventor: James H. McGrath, Jr.