Abstract: The wiper (8) for a cosmetic product applicator (6) for a container (4) contains the cosmetic product, the wiper extending along a longitudinal axis (A-A?) and defining an insertion direction of the applicator into the container from a proximal end of the wiper toward a distal end of the wiper. The wiper comprises: a tube (16) having a longitudinal axis (A-A?), the tube defining a distal region (30) of constant interior section; and a wiping lip (20) of the applicator of longitudinal axis (A-A?), having an interior section becoming narrower in the insertion direction of the applicator up to a distal passage orifice (44). The wiper comprises a connecting segment (18) connecting the distal region of the tube to a proximal end of the wiping lip, the interior section of the connecting segment (18) becoming wider along the insertion direction.

Abstract: In an embodiment, a socket comprises a housing, where the housing is a dielectric material. In an embodiment, a shell passes through a thickness of the, where the shell is conductive. The socket may further comprise a plug within the shell, where the plug is a dielectric material, and where the plug has a bottom surface. In an embodiment, a pin passes through the thickness of the housing within an inner diameter of the shell, where the pin has a first portion with a first diameter and a second portion with a second diameter, and where the pin is conductive. In an embodiment, the socket further comprises a spring around the first portion of the pin, where a first end of the spring presses against the bottom surface, and where a second end of the spring presses against the second portion of the pin.

Abstract: An apparatus includes a shaft assembly, an end effector, a control module, a first electrical connector, and a plurality of nonconductive structures. The first electrical connector is operatively coupled with the control module and includes a first plurality of electrical contacts. At least one electrical contact of the first plurality of electrical contacts is configured to transfer a power output from the control module to a second plurality of electrical contacts of a second electrical connector while the first and second electrical connectors are coupled. The nonconductive structures are disposed adjacent each of the plurality of first electrical contacts. The nonconductive structures are configured to prevent a signal interference between each electrical contact of the first plurality of electrical contacts.

Abstract: An antenna element including a base plate, a first ground clustered pillar projecting from the base plate, a second ground clustered pillar projecting from the base plate and spaced apart from a first side of the first ground clustered pillar is provided. The ground clustered pillars, the signal ears, and the ground ears can be shapes so that the capacitive coupling between the ears and the pillars is sufficient to allow them to be spaced further apart, thereby reducing the number of elements required in the phased array. In some embodiments, the ground ear can be directly machined with the base plate thereby obviating the need for the ground ear to be overmolded into the base plate with the signal ear. In other embodiments the phased array antenna can utilize elastomeric connectors to further improve the mechanical and electrical reliability of the connections of the phase array antenna.

Abstract: An electrical connector including a substrate, a pitch transformation routing assembly formed on the substrate and including pitch transformation routing members, a first set of contact members where each contact member extends away from a first end of a corresponding pitch transformation routing member, and a second set of contact members where each contact member extends away from a second end of a corresponding pitch transformation routing member. Each pitch transformation routing member includes multiple routing sections, where each routing section extends in the first direction or the second direction. In a first subset of the pitch transformation routing members, the pitch transformation routing members have routing sections with different dimensions in the first direction and the second direction.

Abstract: A method, comprising: forming a dielectric structure, the structure comprising a first terminal surface, a second terminal surface and a through-hole that extends from the first terminal surface to the second terminal surface, applying an electrically conductive material to at least a portion of the dielectric structure, removing a first portion of the electrically conductive material from the first terminal surface, and removing a second portion of the electrically conductive material from the second terminal surface, a remaining portion of the electrically conductive material constituting at least an inner conductor of a first generally coaxial conductor pair and a first shielding conductor of the first generally coaxial conductor pair, and the inner conductor extending through the through-hole.

Abstract: A connector for electrically connecting to conductive structures formed on a semiconductor device includes a core including an isolation layer and signal vias and ground vias formed in the isolation layer; a first ground plane formed on a surface of or in the core and electrically connected to the ground vias; a first set of contact elements formed on a first surface of the core and electrically connected to the signal vias to form signal pins; a second set of contact elements formed on the first surface and electrically connected to a subset of the ground vias to form ground pins. The remaining ground vias without contact elements form buried ground vias. The first and second sets of contact elements are arranged on the first surface of the core to surround each signal pin by at least one adjacent ground pin and one or more adjacent buried ground vias.

Abstract: A semiconductor package for skew matching in a die-to-die interface, including: a first die; a second die aligned with the first die such that each connection point of a first plurality of connection points of the first die is substantially equidistant to a corresponding connection point of a second plurality of connection points of the second die; and a plurality of connection paths of a substantially same length, wherein each connection path of the plurality of connection paths couples a respective connection point of the first plurality of connection points to the corresponding connection point of the second plurality of connection points.

Abstract: An electronic assembly and methods of making the assembly are disclosed. The electronic assembly includes a substrate with an elastic member having an intrinsic stress profile. The elastic member has an anchor portion on the surface of the substrate; and a free end biased away from the substrate via the intrinsic stress profile to form an out of plane structure. The substrate includes one or more spacers on the substrate. The electronic assembly includes a chip comprising contact pads. The out of plane structure on the substrate touches corresponding contact pads on the chip, and the spacers on the substrate touch the chip forming a gap between the substrate and the chip.

Abstract: A probe card and a manufacturing method of a probe card are provided. The probe card includes a probe head, first and second substrates, a first elastic component, and a first adhesive member. The second substrate is disposed between the probe head and the first substrate, and is disposed on the first substrate. The second substrate faces the first substrate and includes second contacts. The second contacts are electrically connected to first contacts of the first substrate. The first elastic component is disposed between the first substrate and the second substrate, and disposed at an outer side of the second contacts. The first adhesive member is disposed on the first substrate, annularly arranged on the side surface of the second substrate, and disposed at an outer side of the first elastic component.

Abstract: A package includes a corner, a device die, a plurality of redistribution lines underlying the device die, and a plurality of metal pads electrically coupled to the plurality of redistribution lines. The plurality of metal pads includes a corner metal pad closest to the corner, wherein the corner metal pad is a center-facing pad having a bird-beak direction substantially pointing to a center of the package. The plurality of metal pads further includes a metal pad farther away from the corner than the corner metal pad, wherein the metal pad is a non-center-facing pad having a bird-beak direction pointing away from the center of the package.

Abstract: Embodiments include assemblies. An assembly includes a substrate having a first interconnect and a second interconnect. The first interconnect has a first conductive pad and a second conductive pad, and the second interconnect has a third conductive pad and a fourth conductive pad. The assembly includes a socket over the substrate. The socket has a first pin, a second pin, and a base layer with a first pad and a second pad. The first and second pins are vertically over the respective first and second interconnects. The first pad is directly coupled to the first pin and fourth conductive pad, while the second pad is directly coupled to the second pin and second conductive pad. The first pad is positioned partially within a footprint of the third conductive pad, and the second pad is positioned partially within a footprint of the first conductive pad.

Abstract: An electrical connector includes multiple conductive terminals respectively retained in multiple accommodating slots of an insulating body. Each conductive terminal includes a base portion, a connecting portion extending from one side of the base portion, a first elastic arm and a second elastic arm extending from the connecting portion toward a direction away from the same one side of the base portion, and at least one fixing portion extending from another side of the base portion. A width of the connecting portion is less than a width of the base portion and less than a width of a location of the first elastic arm near the connecting portion as well as a width of a location of the second elastic arm near the connecting portion. The fixing portion and the first elastic arm are respectively located at different sides of the base portion, thus achieving good elasticity and thinness.

Abstract: A testing head comprises a plurality of contact probes, and a guide having a plurality of guide holes for housing the contact probes and including a conductive portion. Each contact probe includes a first end region and a second end region, and a body which extends between the first and second end regions. Suitably, the conductive portion includes a group of the guide holes and electrically connects contact probes of a first group of the contact probes. The contact probes of the first group slide in the guide holes in the conductive portion and are adapted to carry a same signal, and each contact probe of a second group of the plurality of contact probes is surrounded by an insulating coating layer that extends along the body of each contact probe of the second group, thereby insulating the contact probes of the second group from the conductive portion.

Abstract: The present application relates to a unitary RF connector (1), intended for example to link two printed circuit boards (PCB1, PCB2), the unitary RF connector extending along a longitudinal axis (X), the connector being a unique piece with an electrically insulating block which serves as a rigid support for both flexible conductive elements whose central portions are rigidly respectively held therein for the central contact and on the outer wall of the block for the ground contact, and with an arrangement as crown for the plurality of free ends of the ground contact.

Abstract: An electrical connector is adapted to be retained in a non-conducting housing and electrically connecting a first component to a second component spaced from one another. The connector includes a first end having a first contact portion for electrically communicating with the first component. A second end of the connector has a second contact portion for electrically communicating with the second component. The second end has a cantilevered beam adapted to flex at a knee portion to bias the second contact portion against an electrical contact surface of the second component. An attachment portion is disposed between the first and second ends. The attachment portion includes an engagement portion providing an interference fit with a mating groove of the housing in which the connector is retained.

Abstract: An electrical connector includes an insulative housing with plural passageways arranged in a hexagonal dense manner. Plural signal contacts and grounding contacts are disposed in the corresponding passageways, respectively, in a mixed manner wherein each pair of signal contacts are surrounded by eight grounding contacts. Some grounding contacts are aligned with one another along a row direction and linked together via a transverse bar, and a pair of extensions extend from the two opposite ends of the transverse bar in a column direction perpendicular to the row direction so as to have the pair of signal contacts essentially fully enclosed and shielded within a region with the boundary defined by a combination of the grounding contacts and the transverse bars.

Abstract: A method of reducing junction resistance variation for junctions in quantum information processing devices fabricated using two-step deposition processes. In one aspect, a method includes providing a dielectric substrate (208), forming a first resist layer (210) on the dielectric substrate, forming a second resist layer (212) on the first resist layer, and forming a third resist layer (214) on the second resist layer. The first resist layer includes a first opening (216) extending through a thickness of the first resist layer, the second resist layer includes a second opening (218) aligned over the first opening and extending through a thickness of the second resist layer, and the third resist layer includes a third opening (220) aligned over the second opening and extending through a thickness of the third resist layer.

Abstract: A card holder for use inside an electronic device is provided. The card holder includes a holder body and a plurality of electrical connectors. The holder body is disposed with a card slot matching a nano SIM card. The card slot is configured to accommodate the nano SIM card or a memory card having a same appearance or shape as the nano SIM card. At least some of the plurality of electrical connectors are first electrical connectors whose positions match the positions of electrical contact points in the nano SIM card. The first electrical connector is configured to electrically connect to the nano SIM card or the memory card accommodated in the card slot. The plurality of electrical connectors are configured to electrically connect to the memory card.

Abstract: Example implementations relate to a host device and a method for thermal management of a removable device, such as a pluggable electronic transceiver comprising a plurality of spring fingers that provide multipoint contact conduction cooling of the removable device. The host device includes a host circuit board having a connector, and a thermal management unit having a cooling component and the plurality of spring fingers. The cooling component is coupled to a portion of the host circuit board and includes a partially protruded portion. Each of the plurality of spring fingers includes a first end coupled to the partially protruded portion, and a second end having a dry contact surface to establish a direct thermal interface with a peripheral surface of the removable device to allow waste-heat to transfer from the removable device to the cooling component through each spring finger.

Abstract: An assembly for passing controlled impedance electrical signals between two different environments via feedthroughs in an electrically-conductive feedthrough block. The feedthrough has a signal coupling, a dielectric spacer surrounding the signal coupling, and a ground coupling surrounding the dielectric. The feedthrough is sealed to hermetically separate the two environments. One or both ends of the dielectric are recessed from the face of the block forming a gap. The gaps is filled with a potting material to form the hermetic seal.

Abstract: A cantilever-type probe with multiple metallic coatings is disclosed. The cantilever-type probe includes at least one probe pin. A first metallic coating is disposed upon a tip of the probe pin, and a second metallic coating is disposed upon a root of the probe pin. The second metallic coating is in contact with the first metallic coating and comprises a softer (more flexible) metal than the first metallic coating.

Abstract: A probe card device and a dual-arm probe are provided. The dual-arm probe has a probe length, and includes a bifurcation end portion and a testing end portion. The dual-arm probe has two broad side surfaces respectively arranged on two opposite sides thereof. The dual-arm probe has a separation slot that is recessed from a bifurcation opening of the bifurcation end portion toward the testing end portion and that penetrates from one of the two broad side surfaces to the other one, so that two branch arms of the dual-arm probe are defined by the separation slot and are spaced apart from each other. The separation slot has a slot length being 50% to 90% of the probe length. In a cross section of the two branch arms, an area of any one of the two branch arms is 90% to 110% of that of the other one.

Abstract: The present invention relates to a contact and a socket device for testing a semiconductor device. The contact of the present invention is a spring contact which is integrally formed by blanking and bending a metal plate member and includes an elastic portion made of various strips of certain pattern and a tip provided at both ends of the elastic portion. Preferably, an inner volume of the contact is filled with a filler having conductivity and elasticity, whereby durability and electrical characteristics are excellent. Further, the test socket according to the present invention is a rubber type employing the above-mentioned contact and has an advantage that it is suitable for testing a fine pitch device.

Abstract: The present invention relates to a contact and a socket device for testing a semiconductor device. The contact of the present invention is a spring contact which is integrally formed by blanking and bending a metal plate member and includes an elastic portion made of various strips of certain pattern and a tip provided at both ends of the elastic portion. Preferably, an inner volume of the contact is filled with a filler having conductivity and elasticity, whereby durability and electrical characteristics are excellent. Further, the test socket according to the present invention is a rubber type employing the above-mentioned contact and has an advantage that it is suitable for testing a fine pitch device.

Abstract: An electrical contact is stamped from sheet metal and includes a planar main body, a resilient upper contacting arm extending from an upper end of the main body and a resilient lower contacting arm extending from a lower end of the main body. The upper contacting arm includes an upper oblique section and an upper contacting section at a free end thereof, and the lower contacting arm includes a lower oblique section and a lower contacting section at the free end thereof. The width of the contacting arm is similar to that of the main body while the width of the contacting section is smaller than one half of that of the main body.

Abstract: A stress mechanism and a connector including the stress mechanism are provided. When a stress portion of a stress component of the stress mechanism is loaded to a lateral stress or a longitudinal stress, the extent of deformation of a bent structure of the stress portion can be reduced so as to prevent the stress portion from producing yield deformation. This advantageously prolongs lifetime of the connector formed by the stress mechanism, and assures desirable electrical connection performance between the connector and an external device.

Abstract: An interposer and an electronic device including an interposer are provided. The interposer includes a multi-conductive member. The multi-conductive member includes an insulation member, a first conductive member that is disposed inside the insulation member and electrically transmits a designated signal or a designated power; and a ground member that surrounds the insulation member.

Abstract: A contact pin, a spring contact including the same, and a socket device are proposed, in which the contact pin has a minimum length suitable for testing a semiconductor IC for a high speed signal and allows the spring contact to secure a maximum compression distance. The contact pin (100) includes: a plate-shaped body part (110) having a width and a thickness; a head part (120) configured to be integrated with an upper end of the body part (110); and a leg part (130) formed by extending from a lower end of the body part (110) to be integrated therewith, wherein the head part (120) is a plate-shaped strip (122) provided on the upper end of the body part (110).

Abstract: An electrical connector includes an insulative housing composed of a plurality of parallel partitions each extending in a longitudinal direction, and plural rows of contact modules each extending in the longitudinal direction and disposed in the housing. Each contact module includes a plurality of contacts integrally formed within an insulator/wafter which extends in a longitudinal direction. In each contact module, each contact includes a main body with opposite contacting arms on upper and lower sections. The contact modules are successively assembled downwardly in the housing by plural assembling poles each of which retainably extends through plural contact modules in the transverse direction and retained in the corresponding positioning grooves formed in the corresponding partitions, respectively.

Abstract: An electrical contact includes a retention section of an outer part and an extension section of an inner part parallel to each other and linked to each other via a transverse bridge located in another vertical plane perpendicular to both the retention section and the extension section. An upper contacting arm extends, toward the extension section, from an upper end of the retention section with an upper mating apex and an upper abutment tip region, and a lower contacting arm extends, toward the extension, from a lower end of the retention section with a lower mating apex and a lower abutment tip region. An upper abutment tab upwardly and obliquely extends from an upper end of the extension section toward the retention section and adapted to be mated with the upper abutment tip region when the upper contacting arm is downwardly depressed by the CPU.

Abstract: An electrical contactor capable of coping with an electrical test under a high temperature environment and realizing reliable positioning is provided.

Abstract: According to an embodiment, an LGA socket includes a center substrate, first and second insulator and a plurality of pairs of contacts. The center substrate is configured by a multi-layer structure including a ground layer and a plurality of through holes formed through the center substrate. The first insulator is arranged around the plurality of through holes on an upper surface of the center substrate. The second insulator is arranged around the plurality of through holes on a lower surface of the center substrate. The plurality of pairs of contacts are inserted into the through holes from an upper side and from a lower side of the through holes and are soldered via the through holes to be electrically connected to each other.

Abstract: A connector includes a flat-plate housing made of insulating resin and including a first positioning hole and a second positioning hole, a plurality of contacts held on the housing, and a first hold-down and a second hold-down made of metal and disposed to correspond to a first positioning hole and a second positioning hole, respectively. The housing includes a CPU board opposed surface to be opposed to a CPU board. The first hold-down includes a reinforcing plate part to cover the CPU board opposed surface around the corresponding first positioning hole. The second hold-down includes a reinforcing plate part to cover the CPU board opposed surface around the corresponding second positioning hole.

Abstract: This electrical connection socket for relaying exchange of electrical signals between a first electrical component and a second electrical component, is provided with: a signal pin which is inserted in a communication hole of a metallic casing so as to form a coaxial line path between the inner wall surface of the communication hole and the outer circumferential surface of the signal pin so that one end of the signal pin is electrically connected to a terminal of the first electrical component while the other end is electrically connected to a terminal of the second electrical component; and a holding member which holds the signal pin in the communication hole such that the outer circumferential surface of the signal pin is separated from the inner wall surface of the communication hole, wherein the characteristic impedance of a signal path formed by the signal pin in a first region where the signal pin is held by the holding member is smaller than a predetermined characteristic impedance which is a reference

Abstract: A circuit board includes a wiring board. The wiring board includes a first wiring layer, a dielectric layer and a second wiring layer stacked, and a plurality of spaced conductive pillars. Each conductive pillar connects the first wiring layer and the second wiring layer. A groove is recessed from a side of the dielectric layer facing away from the second wiring layer, and includes first recessed portion and at least two spaced second recessed portions recessed from a sidewall of the first recessed portion. An end surface of each conductive pillar is exposed from the at least two spaced second recessed portions, and a sidewall of each pillar close to the first recessed portion is exposed from the second recessed portion. At least one electronic component is received in the first recessed portion, and is connected to the conductive pillars through electrical connecting portions received in the second recessed portions.

Abstract: A probe unit includes: a plurality of contact probes each of which has one end that is brought into contact with a contacting electrode, the one end being an end in a longitudinal direction; a first ground member connected to an external ground; a second ground member provided around each of the contact probes; a connecting member electrically connected to the first ground member, and electrically connected to one end of the second ground member; and a probe holder configured to hold the contact probes, the first ground member, the second ground member and the connecting member.

Abstract: A printed wiring line formed on a substrate connects two different points on the substrate which are connectable by another printed wiring line with a shape of a straight-line segment and has a shape corresponding to at least one of: 1) a shape with no linear part parallel to the straight-line segment; 2) a shape with line segments connected in series, each line segment having a shape with no linear part parallel to the straight-line segment; 3) a shape having a part parallel to the straight-line segment and a part not parallel to the straight-line segment, length of the part parallel to the straight-line segment being not more than length of the straight-line segment; and 4) a shape in which line segments are connected in series, each line segment having a shape having a part parallel to the straight-line segment and a part not parallel to the straight-line segment.

Abstract: An interface element (20) for a testing apparatus of electronic devices comprises at least one support (21) provided with a plurality of through-openings (22) that house respective interconnections elements (23), which extend between a first end (23a) and a second end (23b). Suitably, the interconnections elements (23) are made of a conductive elastomer that fills the openings (22) of the support (21), each of the interconnection elements (23) forming a conductive channel between different and opposing faces (Fa, Fb) of the support (21).

Abstract: An land grid array (LGA) or hybrid land grid array (HLGA) includes a socket housing and a plurality of electrical contacts. The socket housing is made of a first material that defines a first dielectric constant. The plurality of electrical contacts extends through the socket housing to electrically couple a printed circuit board on a first side of the socket housing to a processor on a second side of the socket housing. A coating of a second material that defines a second dielectric constant that is higher than the first dielectric constant covers surfaces of a subset of the plurality of electrical contacts.

Abstract: A printed circuit board (PCB) connector interface module and an accessory system. The module including a first layer, a second layer, and a plurality of inner layers. The first layer includes a first set of contact pads configured to electrically connect to an accessory device, and a heat and scratch resistant coverlay that is adjacent to and has a first surface that is level with a first surface of the first set of contact pads. The second layer including a second set of contact pads configured to electrically connect to an internal printed circuit board (PCB) of an electronic apparatus. The plurality of inner layers including one or more printed circuit boards (PCB) and a plurality of contact vias, wherein the plurality of contact vias electrically connect the first set of contact pads to the second set of contact pads.

Abstract: Methods, systems, and apparatus for an electrical connector assembly for connecting an integrated circuit chip to a printed circuit board. The electrical connector assembly includes a socket body that is made of an insulating material. The socket body has a top surface, a bottom surface, and a first plurality of cavities including a first cavity and a second cavity. The first cavity and the second cavity each have an inner surface plated with a conductive material to form a metal grounding shell. The electrical connector assembly includes multiple probes including a first probe and a second probe. The first probe is configured to be positioned within the first cavity and the second probe is configured to be positioned within the second cavity. The electrical connector assembly includes one or more signal traces that electrically connect the metal grounding shells of the first cavity and the second cavity.

Abstract: A plurality of contacts are disposed within the corresponding passageways of the housing of the electrical connector, respectively. Each contact includes a main body extending in a vertical plane with two pairs of fixing sections on two opposite lateral sides to form an X-like shape, and a pair of resilient contacting arms extending from opposite upper and lower ends of the main body for mating with the CPU and PCB. A pair of extension arms extend from the waist section of the main body in a direction perpendicular to the vertical plane. The contacting arm includes a vertical section coplanar with the main body, an oblique section extending from an upper end of the vertical section with a bulged and narrowed contacting section at the free end. Each pair of fixing sections are located by two sides of the vertical section of the corresponding contacting arm.

Abstract: A detection device includes: a metal body having a plurality of main vias, a plurality of main through holes with insulators formed on the hole walls of the main vias, and a plurality of connecting elements disposed in the main through holes. Therefore, when testing a chip with I/O pins of high density with the detection device, the connecting elements contact the insulator only, without contacting the hole walls of the main vias, and the problem of short circuits can be avoided. A method of forming a detection device is also provided.

Abstract: The purpose of the present disclosure is to provide a electro-conductive part protecting member for a signal transmitting connector and a manufacturing method therefor, and a signal transmitting connector having same and a manufacturing method therefor, the electro-conductive part protecting member being capable of protecting an electro-conductive part so as to be able to minimize deformation of and damage to the electro-conductive part coming into contact with the terminals of an electronic component such as a semiconductor package, and more specifically, the electro-conductive part protecting members capable of being elastically modified in the longitudinal direction of the electro-conductive parts by having a hollow tube-shaped protection member body encompassing the electro-conductive parts, and a spiral groove to promote elasticity provided along the circumference of the protection member body so as to pass through the inside and the outside of the protection member body.

Abstract: A probe card device and a fence-like probe thereof are provided. The fence-like probe includes a stroke segment, a fan-out segment, and a testing segment. The stroke segment is in an elongated shape defining a longitudinal direction, and the stroke segment has two end portions and a plurality of penetrating slots that are arranged along a fan-out direction perpendicular to the longitudinal direction, so that the stroke segment is deformable to store an elastic force by being applied with a force. The fan-out segment and the testing segment are respectively connected to the two end portions of the stroke segment. The fan-out segment has a fixing point arranged away from the stroke segment, and the testing segment has an abutting point arranged away from the stroke segment. Along the fan-out direction, the fixing point is spaced apart from the abutting point by a fan-out distance.

Abstract: The invention relates to a spring-loaded inner-conductor contact element comprising at least one inner conductor and an elastic element that surrounds the at least one inner conductor. The axial dimension of the at least one inner conductor can be modified. The at least one inner conductor is metallic. The elastic element is made of an electrically insulating material and is attached to each inner conductor.

Abstract: The semiconductor structure includes a first die, a second die, a connecting portion, and a through-substrate via. The first die includes a first dielectric layer and a first helical conductor embedded therein. The second die includes a second dielectric layer and a second helical conductor embedded therein, wherein the second dielectric layer is bonded with the first dielectric layer, thereby forming an interface. The connecting portion extends from the first dielectric layer through the interface to the second dielectric layer and interconnects the first helical conductor with the second helical conductor. The through-substrate via extends from the first die to the second die through the interface, wherein the through-substrate via is surrounded by the first and the second helical conductors.

Abstract: Systems and methods are disclosed for a self-indexing removable storage device. In certain embodiments, the removable storage device is configured to be connected to a memory reader of a host device. The removable storage device comprises storage media, a controller configured to run firmware, and a buffer. The controller is configured to, while connected to a first host device, receive a write operation from the first host device, monitor changes to the storage media caused by the write operation, and update a file index stored on the removable storage device with the monitored changes. The controller is further configured to, in response to connecting the removable storage device to a memory reader of a second host device, provide the file index to an application on the second host device, and cause the application to display files on the storage media based on the file index.

Abstract: A card socket for mounting a SIM card and an SD card for a mobile communication terminal includes a housing and a shell. The housing includes a first terminal portion having a first terminal disposed therein, a second terminal portion having a second terminal and a third terminal disposed therein, and a switch portion. The shell includes an upper wall and a sidewall. The shell includes a sensing portion extended from the upper wall to detect insertion of a card tray into the card socket. The sensing portion has a shape which is extended downward from the upper wall in the height direction and then is extended upward in the height direction. The switch portion includes a stopper which is configured to come into contact with an upper surface of the sensing portion and to prevent the sensing portion from being lifted up in the height direction.