Conductor Is Compressible And To Be Sandwiched Between Panel Circuits Patents (Class 439/66)
  • Patent number: 9088084
    Abstract: An electrical connector includes an insulating housing and a plurality of contacts retained in the insulating housing. The insulating housing includes a top surface and bottom surfaces opposite to each other in an up-to-down direction and a plurality of receiving holes running through the top and bottom surfaces. A dimension from the top surface to the bottom surface in the up-to-down direction is defined as the height of the insulating housing, a plane on half the height of the insulating housing is defined as the center plane of the insulating housing. The contact engages the insulating housing forming an engaging area. A center line of the engaging area is parallel to the center plane of the insulating housing, and the distance between the center line of the engaging area and the center plane of the insulating housing is no more than 1/10 the height of the insulating housing.
    Type: Grant
    Filed: December 26, 2013
    Date of Patent: July 21, 2015
    Assignee: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventor: Fang-Jwu Liao
  • Patent number: 9087765
    Abstract: An integrated circuit package is disclosed that includes a first-pitch die and a second-pitch die. The second-pitch die interconnects to the second-pitch substrate through second-pitch substrates. The first-pitch die interconnects through first-pitch interconnects to an interposer adapter. The pitch of the first-pitch interconnects is too fine for the second-pitch substrate. But the interposer adapter interconnects through second-pitch interconnects to the second-pitch substrate and includes through substrate vias so that I/O signaling between the first-pitch die and the second-pitch die can be conducted through the second-pitch substrate and through the through substrate vias in the interposer adapter.
    Type: Grant
    Filed: March 15, 2013
    Date of Patent: July 21, 2015
    Assignee: QUALCOMM Incorporated
    Inventors: Dexter Tamio Chun, Jungwon Suh, Urmi Ray, Shiqun Gu
  • Patent number: 9052342
    Abstract: An electrically conductive probe can comprise a post to which a beam structure is attached. The beam structure can comprise a cantilevered portion that extends away from the post to a free end to which a contact structure can be attached. The cantilevered portion of the beam can include both a solid section and a hollow section. Multiple such probes can be used in a test contactor to make electrical connections with an electronic device such as a semiconductor die or dies to be tested.
    Type: Grant
    Filed: September 30, 2011
    Date of Patent: June 9, 2015
    Assignee: FormFactor, Inc.
    Inventors: Li Fan, Rui Xu
  • Patent number: 9052484
    Abstract: A connector assembly is provided that mates on one side with an optical transceiver module holder and that electrically connects on the opposite side with an external system circuit board. When the connector assembly is mated with an optical transceiver module holder, a base of a parallel optical transceiver module held in the holder mates with a socket of the connector assembly such that respective arrays of electrical contacts disposed on the base and in the socket come into contact with one another. At least one gearbox IC for performing data rate conversion is mounted on the assembly circuit board. A lower surface of the assembly circuit board has an array of electrical contacts on it that are in contact with an array of electrical contacts disposed on the surface of the external system circuit board on which the connector assembly is mounted.
    Type: Grant
    Filed: October 26, 2012
    Date of Patent: June 9, 2015
    Assignee: Avago Technologies General IP (Singapore) Pte. Ltd.
    Inventors: Laurence R. McColloch, Faouzi Chaahoub, Georgios Asmanis
  • Patent number: 9048594
    Abstract: A dual SIM card tray and an electrical connector device are disclosed. The electrical connector device comprises a tray and a connector module. The dual SIM card tray has a first receiving groove and a second receiving groove, which are positioned at two opposing sides, for respectively loading a mini-SIM card and a micro-SIM card, and has a first window communicated with the first receiving groove and a second window communicated with the second receiving groove. The first window and the second window are arranged in a lengthwise direction of the tray, so that conductive pads of the two SIM cards are exposed toward the same side. The connector module includes first and second connectors and an outer shell.
    Type: Grant
    Filed: March 18, 2013
    Date of Patent: June 2, 2015
    Assignee: Molex Incorporated
    Inventors: Kian Heng Lim, Shang-Xiu Zeng, Hong Liang Wang
  • Patent number: 9048556
    Abstract: A electric contact pin which can certainly contact a plunger with a contact spring and ensure smooth operation (vertical motion) of the plunger. The present invention can execute electrical tests of the electrical parts accurately. The electric contact pin according to the present invention contacts an eccentrical portion of an open coil portion provided for the contact spring capable of easily deforming in a radial direction with a conductive portion of the plunger. Consequently, the conductive portion of the plunger is elastically pinched between the eccentrical portion of the open coil portion and the closed coil portion. The eccentrical portion of the open coil portion and the closed coil portion are contact with the conductive portion of the plunger at any time.
    Type: Grant
    Filed: December 27, 2012
    Date of Patent: June 2, 2015
    Assignee: EMPLAS CORPORATION
    Inventor: Takashi Morinari
  • Patent number: 9040841
    Abstract: A contact structure and assembly and a method for manufacturing the same for a microelectronics device includes first and second electrically conductive contacts being helically shaped. A carrier element is attached to and positioned between the first and second contacts. The first and second contacts are in electrical communication with each other, and the first and second contacts are in a mirror image relationship with each other. A pair of insulating substrates each include electrically conductive members. A contact point on each of the first and second contacts is attached and electrically communicating to respective electrically conductive members such that the first and second electrically conductive contacts between the pair of insulating substrates form an electrically conductive package. A metal layer on the carrier element provides electrical conductivity through a first opening defined by the carrier element between the first and second portions of the helix shaped contact.
    Type: Grant
    Filed: September 5, 2012
    Date of Patent: May 26, 2015
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Gareth Hougham, Gerard McVicker, Xiaoxiong Gu, Sung K. Kang, Frank R. Libsch, Xiao H. Liu
  • Patent number: 9039426
    Abstract: An electrical connector includes at least one body, a frame having at least one accommodating area for accommodating the body, a supporting cover, multiple signal terminals, and at least one grounding terminal. The body has an upper surface and a lower surface which are both smooth planes, multiple signal receiving slots and at least one grounding receiving slot. A conducting layer is disposed at the upper surface and extends to the grounding receiving slot. The upper surface has an isolation area at a position adjacent to the periphery of each signal receiving slot. The isolation area does not have the conducting layer. The supporting cover is assembled to the frame, covers the body, and used for supporting the chip module disposed on the supporting cover. The terminals are respectively received in the receiving slots, and passing through the supporting cover to be electrically connected to the chip module.
    Type: Grant
    Filed: March 11, 2014
    Date of Patent: May 26, 2015
    Assignee: LOTES CO., LTD.
    Inventors: Yong Quan Wu, Martinson Robert Ronald
  • Patent number: 9039425
    Abstract: An electrical interconnect device includes a substrate and an array of conductive elastomeric columns held by the substrate each having opposite first and second ends and being internally conductive between the first and second ends. A shield is mounted exterior of the first ends of the elastomeric columns. The shield has an insulative carrier holding an array of conductive pads. The conductive pads have inner surfaces and outer surfaces where the inner surfaces of the conductive pads engage the first ends of corresponding elastomeric columns and where the outer surfaces are configured to engage corresponding mating contacts of an electrical component. The outer surfaces of the conductive pads are non-coplanar such that the conductive pads have different heights. Optionally, the conductive pads may have different thicknesses above the carrier.
    Type: Grant
    Filed: January 21, 2013
    Date of Patent: May 26, 2015
    Assignee: Tyco Electronics Corporation
    Inventors: Jeffrey Walter Mason, Wayne Stewart Alden, III
  • Patent number: 9022790
    Abstract: A fixture for connecting a printed circuit board for a storage device to a storage device test equipment, the fixture including a body, a first set of contacts located on the body and configured to contact spindle motor contacts on the printed circuit board in a solderless manner, a second set of contacts located on the body configured to contact head stack assembly contacts on the printed circuit board in a solderless manner, and a plurality of alignment posts located on the body and configured to align the first set of contacts with the spindle motor contacts and align the second set of contacts with the head stack assembly contacts.
    Type: Grant
    Filed: September 11, 2012
    Date of Patent: May 5, 2015
    Assignee: Western Digital Technologies, Inc.
    Inventors: Kavitha Subramaniam, Kooi Hoe Choong
  • Publication number: 20150111400
    Abstract: A connector including a soft spring portion. A connector that electrically connects a first printed circuit board and a second printed circuit board includes a contact portion that can be brought into contact with the first printed circuit board, a connection portion that can be connected to the second printed circuit board, and an elastic spring portion that connects the contact portion and the connection portion. The elastic spring portion includes a first spring portion and a second spring portion that are connected via an open loop-shaped integral connection portion.
    Type: Application
    Filed: September 16, 2014
    Publication date: April 23, 2015
    Applicant: JAPAN AVIATION ELECTRONICS INDUSTRY, LIMITED
    Inventor: Osamu HASHIGUCHI
  • Publication number: 20150099376
    Abstract: A connector reduced in height without reducing contact reliability. A contact of the connector includes a first spring portion that supports a contact portion, a second spring portion that supports a connection portion, and an integral connection portion that integrally connects the first spring portion and the second spring portion. The first spring portion and the second spring portion are arranged on an imaginary straight line that extends through the contact portion and is parallel to a connection direction, and the integral connection portion is made away from the imaginary straight line in a direction orthogonal to the connection direction.
    Type: Application
    Filed: September 16, 2014
    Publication date: April 9, 2015
    Applicant: JAPAN AVIATION ELECTRONICS INDUSTRY, LIMITED
    Inventor: Osamu HASHIGUCHI
  • Patent number: 8998621
    Abstract: A socket mount for use in connection with an integrated circuit test socket having a body with fastener holes, a plurality of electrical connector links, and a plurality of elastomer elements biasing said links, the socket mount comprising a block having a flat upper surface, a flat lower surface, and four flat edges defining a square, and respective fastener holes aligned with the fastener holes in the test socket, a first groove oriented perpendicularly with respect to a flat edge along the flat lower surface, and a second groove oriented diagonally from a first edge to a second edge along the flat lower surface, the grooves having a length equal to a length of elastomer in the test socket.
    Type: Grant
    Filed: December 20, 2013
    Date of Patent: April 7, 2015
    Assignee: Titan Semiconductor Tool, LLC
    Inventors: Victor Landa, Pongsak Tiengtum, Dan Mashayekh
  • Publication number: 20150087163
    Abstract: An electronic connector system includes one or more electronic components electronically coupled to one another by an elastomeric connector. The elastomeric connector is disposed in a compressed condition against the one or more electronic components to form a sound electrical connection therebetween. A casing is provided about the elastomeric connector to retain the elastomeric connector in the compressed condition as coupled to the one or more electronic components. The casing may be an overmolded polymer that is injection molded about the electrical connection between the elastomeric connector and the one or more electronic components.
    Type: Application
    Filed: September 25, 2013
    Publication date: March 26, 2015
    Applicant: Ford Global Technologies, LLC
    Inventors: Stuart C. Salter, Jeffrey Singer, Michael Istok
  • Patent number: 8982561
    Abstract: A lightweight radio/CD player for vehicular application includes a case and frontal interface formed of polymer based material molded to provide details to accept audio devices and radio receivers, as well as the circuit boards required for electrical control and display. The case and frontal interface are of composite structure, including an insert molded electrically conductive wire mesh screen that has been pre-formed to contour with the molding operation. The wire mesh provides shielding and grounding of the circuit boards via exposed wire mesh pads and adjacent ground clips.
    Type: Grant
    Filed: May 28, 2013
    Date of Patent: March 17, 2015
    Assignee: Delphi Technologies, Inc.
    Inventors: Chris R. Snider, Vineet Gupta, Joseph K. Huntzinger, Michael G. Coady, Curtis Allen Stapert, Kevin Earl Meyer, Timothy D. Garner, Allen E. Oberlin
  • Patent number: 8974626
    Abstract: A method of manufacturing a micro structure, includes the steps of: preparing separate first and second substrates, the first substrate having a first surface on which a first structural body having a first height and a second structural body having a second height greater than the first height of the first structural body are arranged, the second substrate having a second surface; then placing the first and second substrates to cause the first and second surfaces to face each other across the first and second structural bodies; and then bonding the first and second substrates to each other while compressing the second structural body in a height direction thereof between the first and second surfaces to cause the second structural body to have a height defined by the first structural body.
    Type: Grant
    Filed: March 22, 2011
    Date of Patent: March 10, 2015
    Assignee: FUJIFILM Corporation
    Inventors: Takamichi Fujii, Akihiro Mukaiyama
  • Patent number: 8977329
    Abstract: A cover panel is disposed on a surface of an electronic apparatus and is made of sapphire. A flexible printed wiring board extends in a state of being curved in the electronic apparatus. A gap reduction member is in contact with at least a curved portion of the flexible printed wiring board from the cover panel side.
    Type: Grant
    Filed: July 22, 2014
    Date of Patent: March 10, 2015
    Assignee: KYOCERA Corporation
    Inventors: Katsumi Arao, Akito Iwai
  • Patent number: 8970243
    Abstract: A test carrier 10A comprises: a base board 21A which holds a die 90; and a cover board 31A which is laid over the base board 21A so as to cover the die 90. The test carrier 10A comprises a seal member 24 which is interposed between the base board 21A and the cover board 31A and which surrounds the die 90.
    Type: Grant
    Filed: April 17, 2012
    Date of Patent: March 3, 2015
    Assignee: Advantest Corporation
    Inventors: Yoshinari Kogure, Takashi Fujisaki, Kiyoto Nakamura
  • Patent number: 8968007
    Abstract: Provided is a connector which ensures a sufficient contact pressure at a low cost and has a long connection life and also provide a fabrication method the connector. The connector 10 comprises a base member 100 and the contacts 200 projecting upwards and downwards of the base member 100. Openings 110 formed on the base member 100 extend in the direction crossing the pitch direction of the contacts 200. The contact 200 has an elastic-support member 220 and a contact film 260 pasted on the elastic-support member 220. The contact film 260 faces the opening 110 so that length of the contact film 260 can be larger than interval between the contacts 200 in the pitch direction. The contact 200 absorbs variations of a size of pads of the connection objects.
    Type: Grant
    Filed: June 17, 2013
    Date of Patent: March 3, 2015
    Assignee: Japan Aviation Electronics Industry, Limited
    Inventors: Takashi Kuwahara, Seiya Matsuo
  • Patent number: 8959764
    Abstract: A structure and method for manufacturing the same for manufacturing a contact structure for microelectronics manufacturing including the steps of forming first and second metal sheets to form a plurality of outwardly extending bump each defining a cavity. Symmetrically mating the first and second metal sheets in opposing relation to each other to form upper and lower bumps each defining an enclosure therebetween wherein the mated first and second sheets form a contact structure. Coating the contact structure with an insulating material, and fabricating helix shaped contacts from upper and lower bumps. The helix shaped contacts having first and second portions being in mirror image relationship to each other.
    Type: Grant
    Filed: November 6, 2009
    Date of Patent: February 24, 2015
    Assignee: International Business Machines Corporation
    Inventors: Gareth Hougham, Gerard McVicker, Xiaoxiong Gu
  • Patent number: 8956193
    Abstract: Methods of forming a socket assembly and associated structures formed thereby are described. Those methods and structures may include forming a socket assembly comprising a socket body having a plurality of vertical openings, wherein contact assemblies are disposed within individual vertical openings. The contact assemblies comprise a compression spring surrounding an insulated conductive wire.
    Type: Grant
    Filed: December 12, 2012
    Date of Patent: February 17, 2015
    Assignee: Intel Corporation
    Inventors: Donald Tran, Srikant Nekkanty
  • Patent number: 8952258
    Abstract: A method, and structures for implementing enhanced interconnects for high conductivity applications. An interconnect structure includes an electrically conductive interconnect member having a predefined shape with spaced apart end portions extending between a first plane and a second plane. A winded graphene ribbon is carried around the electrically conductive interconnect member, providing increased electrical current carrying capability and increased thermal conductivity.
    Type: Grant
    Filed: September 21, 2012
    Date of Patent: February 10, 2015
    Assignee: International Business Machines Corporation
    Inventors: Mark D. Plucinski, Arvind K. Sinha, Thomas S. Thompson
  • Patent number: 8951049
    Abstract: An electrical connector assembly includes a printed circuit board, an electrical connector assembled on the printed circuit board and an interposer assembled between the electrical connector and the printed circuit board, the electrical connector includes an insulative housing and a plurality of terminals and a shielding element received therein, and wherein the interposer electrically connect the terminals and the shielding element and electrically connect the printed circuit board.
    Type: Grant
    Filed: May 3, 2013
    Date of Patent: February 10, 2015
    Assignee: Hon Hai Precision Industry Co., Ltd.
    Inventors: Yen-Chih Chang, Tzu-Yao Hwang, Ke-Hao Chen
  • Publication number: 20150037987
    Abstract: A contact member establishes an electrical contact between a substrate and a first device. The contact member includes: a base extending substantially along a plane (P) and having a first surface that can be fixed on to the substrate, and a second surface (68) opposite the first surface along a normal direction (N) substantially perpendicular to the said plane. The second surface can be located face-to-face with the first device. At least one tongue can be integrally attached to the base. The tongue is flexible between a rest position, in which a distal end of the tongue is located at a distance away from the base on the side of the second surface along the normal direction, and a flexed position.
    Type: Application
    Filed: July 30, 2014
    Publication date: February 5, 2015
    Inventor: Patrice Retho
  • Publication number: 20150031221
    Abstract: Contact pads on structures such as printed circuits may be coupled to each other using printed circuit connectors such as board-to-board connectors. A printed circuit connector may have interlocking metal frame structures. The metal frame structures may be soldered to traces on the printed circuits. Rectangular openings in the metal frame structures may receive a rectangular contact array structure that is separate from the metal frame structures. The contact array structure may include a dielectric carrier structure and an array of conductive contacts. The dielectric carrier structure may align the contacts with respect to pads on the printed circuits to which the metal frame structures are soldered. The contacts may be formed from metal spring structures or conductive elastomeric structures that are compressed between respective printed circuit contact pads when the metal frame structures of a printed circuit connector are attached to each other.
    Type: Application
    Filed: July 29, 2013
    Publication date: January 29, 2015
    Applicant: Apple Inc.
    Inventors: Jason Sloey, Varun Sehrawat
  • Patent number: 8934259
    Abstract: A method for fabricating a substrate having transferable chiplets includes forming a photo-sensitive adhesive layer on a process side of a source substrate including active components or on a patterned side of a transparent intermediate substrate. The intermediate substrate is brought into contact with the source substrate to adhere the active components on the process side to the patterned side of the intermediate substrate via the photo-sensitive adhesive layer therebetween. Portions of the source substrate opposite the process side thereof are removed to singulate the active components. Portions of the photo-sensitive adhesive layer are selectively exposed to electromagnetic radiation through the intermediate substrate to alter an adhesive strength thereof. Portions of the photo-sensitive adhesive layer having a weaker adhesive strength are selectively removed to define breakable tethers comprising portions of the adhesive layer having a stronger adhesive strength.
    Type: Grant
    Filed: June 7, 2012
    Date of Patent: January 13, 2015
    Assignee: Semprius, Inc.
    Inventors: Christopher Bower, Joseph Carr
  • Patent number: 8926338
    Abstract: A contact member includes first and second bent portions provided between a joining part to be joined to a first board and a contacting part to come into contact with a second board, a first contact part to come into contact with the second bent portion when the first bent portion is caused to bend by the pressing of the contacting part by the second board, a second contact part to come into contact with the first bent portion when the second bent portion is caused to bend by the pressing of the contacting part by the second board after the first contact part comes into contact with the second bent portion, and a third contact part to come into contact with the first board by the pressing of the contacting part by the second board after the second contact part comes into contact with the first bent portion.
    Type: Grant
    Filed: September 13, 2013
    Date of Patent: January 6, 2015
    Assignee: Fujitsu Component Limited
    Inventors: Koichi Kiryu, Manabu Shimizu
  • Patent number: 8919656
    Abstract: A mounting spring coil is made to grip and releasably hold a cylindrical periphery of a memory button while transmitting an ID effectively. A memory button held in a coil of the mounting spring can support objects such as tags and keys that are identified by the memory button to account for removal and replacement of the objects being secured.
    Type: Grant
    Filed: May 30, 2012
    Date of Patent: December 30, 2014
    Assignee: Key Systems, Inc.
    Inventor: George Eckerdt
  • Patent number: 8920179
    Abstract: A connector 10 comprises a base member 100 and a connection film 200 which consists of an insulator film 300 and conducive portions 400 formed thereon. Openings 130 formed in the base member 100 extend in a direction crossing the pitch direction of contacts 15. The conductive portions 400 attached to elastic support portions 120 of the base member 100 face the openings 130, respectively. Therefore, the extension length of each conductive portion 400 of the connection film 200 can be larger than the pitch of the contacts 15 so that the height of each contact 15 can be made higher.
    Type: Grant
    Filed: April 9, 2013
    Date of Patent: December 30, 2014
    Assignee: Japan Aviation Electronics Industry, Limited
    Inventors: Takashi Kuwahara, Seiya Matsuo
  • Patent number: 8911242
    Abstract: An electrical component including a substrate having opposite first and second sides and a plurality of vias extending into the substrate from the first side. The substrate has first conductive pads on the first side that are electrically connected to corresponding vias. The electrical component also includes a plurality of electrical contacts that are mounted to the substrate along the first side. Each of the electrical contacts includes a contact heel and a contact beam that extends from the corresponding contact heel and at least partially away from the first side. The contact heels are laser-welded to corresponding first conductive pads.
    Type: Grant
    Filed: March 5, 2012
    Date of Patent: December 16, 2014
    Assignee: Tyco Electronics Corporation
    Inventors: Myoungsoo Jeon, Attalee Snarr Taylor, Craig Warren Hornung
  • Patent number: 8911243
    Abstract: A connection member to be inserted into a through-hole of a socket module that is electrically connected between an electronic component and a substrate, the connection member includes: a first end portion that is connected to the electronic component; a second end portion that is connected to the substrate; a plurality of upper flexure portions that correspond to projections of a waveform arranged near the electronic component; and a plurality of lower flexure portions that correspond to projections of the waveform arranged near the substrate; wherein the connection member is a single conductor member with elasticity and is formed in the shape of the waveform.
    Type: Grant
    Filed: October 3, 2012
    Date of Patent: December 16, 2014
    Assignees: Fujitsu Component Limited, Fujitsu Limited
    Inventors: Junichi Akama, Toshihiro Kusagaya, Manabu Shimizu, Akira Tamura, Yoshihiro Morita, Yasushi Masuda
  • Publication number: 20140357100
    Abstract: An electrical connector assembly (100) includes a first electrical connector for connecting a substrate (300) and a second electrical connector for connecting a package (200), the first electrical connector includes a first insulating housing (1) with a plurality of first contacts (3) and second contacts (4) received therein, the second electrical connector includes a second insulating housing with (2) a plurality of third contacts (5) and fourth contacts (6) received therein, the third contact (5) includes a pair of spring arms (51), the first contact (3) includes a first contacting portion (31) contact with the spring arms (51), the second contact (4) includes a spring portion (41) having a second contacting portion (410), the fourth contact (6) includes a press portion (61) contacting the second contacting portion (410) and press the spring portion (41) to be deformed.
    Type: Application
    Filed: May 27, 2014
    Publication date: December 4, 2014
    Applicant: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventor: SHUO-HSIU HSU
  • Patent number: 8899993
    Abstract: The disclosure relates to interposer assembly plates with large numbers of closely spaced contact apertures extending through the plates and contact members inserted into and retained in the apertures.
    Type: Grant
    Filed: April 24, 2013
    Date of Patent: December 2, 2014
    Assignee: Amphenol InterCon Systems, Inc.
    Inventor: Paul R. Taylor
  • Patent number: 8896157
    Abstract: The power supply includes a first power connector, a power conversion circuit, a control unit and a detection circuit. The first power connector includes a plurality of power terminals and a first detecting terminal. The power conversion circuit is coupled to the power terminals of the first power connector for converting an input voltage into an output voltage. The control unit is coupled to the power conversion circuit for controlling an operation of the power conversion circuit. The detection circuit is coupled to the control unit and the first detecting terminal of the first power connector for detecting if the first detecting terminal is connected or disconnected with a predetermined voltage terminal and correspondingly generating a power transmission status signal to the control unit.
    Type: Grant
    Filed: November 22, 2010
    Date of Patent: November 25, 2014
    Assignee: Delta Electronics, Inc.
    Inventor: Yu-Hung Huang
  • Patent number: 8888502
    Abstract: An electrical connector includes an insulative housing having a plurality of passageways and a number of contacts restricted in the insulative housing. Each contact includes an upper contact half sliding in the passageways and a lower contact half supporting the upper contact half. The upper contact half has three curve sections and the lower contact half has two curve sections. When a force is applied to the upper contact half, the upper and lower contact halves are wiping each other and both are deflectable in vertical and transverse directions.
    Type: Grant
    Filed: November 15, 2012
    Date of Patent: November 18, 2014
    Assignee: Hon Hai Precision Industry Co., Ltd.
    Inventor: Albert Harvey Terhune, IV
  • Patent number: 8870579
    Abstract: An elastomeric material includes an elastomeric matrix having one or more outer surfaces and a set of electrically conductive pathways disposed through the elastomeric matrix. The elastomeric material also includes a thermally-conductive and electrically-insulative material, disposed through the elastomeric matrix, which improves the formation of the electrically conductive pathways.
    Type: Grant
    Filed: January 13, 2012
    Date of Patent: October 28, 2014
    Assignee: Paricon Technologies Corporation
    Inventors: Roger E. Weiss, Clifford Read, Everett Simons
  • Patent number: 8870580
    Abstract: A connector is adapted to be interposed between a first connection object and a second connection object for establishing electrical connection therebetween. The connector comprises a plurality of connecting members each having a plurality of elastically deformable conductive portions formed at a predetermined interval along a longitudinal direction thereof, a beam holding the connecting members, and a support portion supporting the beam. The connecting members, each having its longitudinal direction extending in a second direction perpendicular to a first direction in which the first and second connection objects and are caused to approach each other, are arranged in a third direction perpendicular to the first and second directions. The beam is disposed with its longitudinal direction extending in the third direction so as to perpendicularly cross the connecting members. The beam has engaging portions, engaging with the connecting members, at positions where the beam crosses the connecting members.
    Type: Grant
    Filed: March 14, 2013
    Date of Patent: October 28, 2014
    Assignee: Japan Aviation Electronics Industry, Limited
    Inventors: Takeru Kojima, Takeshi Takahashi
  • Publication number: 20140315398
    Abstract: The invention relates to a PCB connector for fastening a first printed circuit board on a second printed circuit board. The PCB connector may have a longitudinal base body with a clamping and fastening device for tool-free fastening of the PCB connector on a printed circuit board. The clamping and fastening device has a put-through body and a spring body which is formed extendable upon putting-through the put-through body through the land. The base body is thus pressed against the printed circuit board by the spring body.
    Type: Application
    Filed: April 9, 2014
    Publication date: October 23, 2014
    Applicant: Knuerr GmbH
    Inventor: Josef FEIGL
  • Publication number: 20140308825
    Abstract: A connector comprises a plurality of contacts which are formed using a plurality of conductive contact points provided on a first plate surface of an FPC as a connection object, a frame member which has an opening size and a height capable of receiving a mating connector and is attached to the first plate surface of the FPC so as to surround the contacts, and a plate-like member which is provided on a second plate surface of the FPC so as to extend over a region corresponding to the contacts. The frame member has locking holes which respectively engage with mating locking claws of the mating connector when the connector is fitted to the mating connector, thereby maintaining the fitting state of the connector and the mating connector.
    Type: Application
    Filed: February 11, 2014
    Publication date: October 16, 2014
    Applicant: JAPAN AVIATION ELECTRONICS INDUSTRY, LIMITED
    Inventor: Osamu HASHIGUCHI
  • Patent number: 8858238
    Abstract: A compression connector for connecting two PCBs includes an insulative housing and a plurality of terminals received in the housing. Each terminal includes a retaining section and two spring contacting sections extending from opposite ends of the retaining section and exposing beyond mating surface of the housing. The insulative housing includes a base housing and a pair of matching housing sandwich the base housing from opposite directions to retain the retaining sections in said three housings such that the terminals can be well retained therein.
    Type: Grant
    Filed: September 10, 2012
    Date of Patent: October 14, 2014
    Assignee: Hon Hai Precision Industry Co., Ltd.
    Inventors: Yu Luo, Xing-Liang Liu
  • Publication number: 20140273553
    Abstract: An apparatus includes a plurality of contact elements to provide electrical continuity between an integrated circuit and an electronic subassembly, wherein a contact element includes a spring element and a separate lead element, wherein the spring element is arranged to be substantially vertically slidable over at least a portion of the lead element in response to a force applied to the contact element.
    Type: Application
    Filed: March 13, 2013
    Publication date: September 18, 2014
    Inventors: Joshua D. Heppner, Sriram Srinivasan
  • Patent number: 8832932
    Abstract: A printed circuit board assembly (PCBA) includes a printed circuit board (PCB) with through holes, a supporting member standing on the PCB adjacent to the through holes, and an electronic component mounted on the PCB is provided. The electronic component includes a component body and a plurality of conductive leads. Fixing ends of the conductive leads of the electronic component is received in the though hole and electrically and mechanically fixed to the PCB. The component body of the electronic component is supported by the supporting member.
    Type: Grant
    Filed: November 29, 2011
    Date of Patent: September 16, 2014
    Assignees: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.
    Inventors: Xiao-Hui Zhou, Hong Li, Ping Li, Rui Li
  • Patent number: 8834183
    Abstract: A board-to-board connector includes a receptacle connector and a plug connector. The receptacle connector includes a plurality of beam parts having a metal plate and an insulating layer formed on the metal plate and a plurality of conductive patterns formed on the insulating layer of the plurality of beam parts. The plug connector includes a beam contact part having a metal plate and an insulating layer formed on the metal plate and a plurality of conductive patterns formed on the insulating layer of the beam contact part. A beam projection is formed between the adjacent conductive patterns of the plug connector, and the beam projection is inserted between the adjacent beam parts of the receptacle connector when the receptacle connector and the plug connector are mated.
    Type: Grant
    Filed: May 16, 2013
    Date of Patent: September 16, 2014
    Assignee: Japan Aviation Eletronics Industry, Ltd.
    Inventors: Tetsuya Komoto, Yu Tatebe, Takuya Yakahashi, Ryuzo Shimeno
  • Patent number: 8827730
    Abstract: There is provided a socket. The socket includes: a wiring substrate including a first surface and a second surface opposite to the first surface; a plurality of connection terminals provided on the wiring substrate and each including a contact portion, wherein the connection terminals extend from the first surface of the wiring substrate; and a positioning member formed in a frame shape and provided on the wiring substrate to surround the connection terminals. The positioning member includes a sidewall plate having a plurality of holes formed therethrough.
    Type: Grant
    Filed: December 7, 2011
    Date of Patent: September 9, 2014
    Assignee: Shinko Electric Industries Co., Ltd.
    Inventor: Yoshihiro Ihara
  • Patent number: 8821198
    Abstract: An electrical contact is provided for electrically connecting a connecting object to a printed circuit board, without the need of a housing. The electrical contact a board mounting portion, a spring region, and a contact portion. The board mounting portion extends parallel to the major surface of the printed circuit board with one end mounted thereto. The spring region extends from another end of the board mounting portion and having a holding portion that extends parallel to the major surface of the printed circuit board and an inclined portion that extends vertically from the holding portion and with respect to the printed circuit board. The contact portion connects to the inclined portion of the spring region and includes a curved shape with a connecting object contact point at a top of a curved part.
    Type: Grant
    Filed: March 14, 2012
    Date of Patent: September 2, 2014
    Assignee: Tyco Electronics Japan G.K.
    Inventor: Yohei Harada
  • Patent number: 8824150
    Abstract: The present disclosure discloses a driving printed circuit board (PCB) for use in a display device. More particularly, a driving printed circuit board improving the bonding by preventing PCB warpage is provided. The rear surface stiffener plate includes polygonal patterns to prevent a PCB warpage of the driving printed circuit board due to different heat shrinkage from that of the board during the surface mounting technology (SMT) process.
    Type: Grant
    Filed: February 29, 2012
    Date of Patent: September 2, 2014
    Assignee: LG Display Co., Ltd.
    Inventors: JungYoul Kang, SeongHun Kim
  • Patent number: 8808037
    Abstract: There is provided a slidable pogo pin including: a first member including a first body and a first connection portion extending from the first body and integrally formed with the first body; a second member including a second body and a second connection portion extending from the second body and integrally formed with the second body; and a spring applying elastic force to the first member and the second member, with at least a part of the first member and at least a part of the second member inserted into the spring. Further, the first member and the second member are electrically connected to each other via the first connection portion and the second connection portion, and the first connection portion and the second connection portion are configured to slide with respect to each other while the first connection portion is brought into surface-to-surface contact with the second connection portion.
    Type: Grant
    Filed: August 9, 2010
    Date of Patent: August 19, 2014
    Assignee: Iwin Co., Ltd.
    Inventor: Sangyang Park
  • Patent number: 8808038
    Abstract: A spring contact and a socket embedded with spring contacts. The spring contact includes an upper contact pin having a contact portion, two spring holding protrusions and a body, a lower contact pin coupled to the upper contact pin, and a spring fitted over the assembly of the upper and lower contact pins, wherein the body has two symmetric elastic portions with both an oblique surface and a locking protrusion, in which a moving slit is formed between the elastic portions so as to provide a moving space for an opposite contact pin, with moving grooves being formed to movably receive the locking protrusions of an opposite contact pin and to be in electric contact with the locking protrusions.
    Type: Grant
    Filed: October 28, 2010
    Date of Patent: August 19, 2014
    Assignees: Hicon Co., Ltd.
    Inventor: Dong Weon Hwang
  • Patent number: 8808010
    Abstract: A socket for use in a test system is provided, where the test system is configured to align at least a portion of an electronic device with a plurality of aligned connectors. The socket can include a metal structure having a plurality of openings, the plurality of openings spaced to accommodate the plurality of aligned connectors. At least one opening in the plurality of openings can extend through a thickness of the metal structure and can have an annular inner surface. The annular inner surface can be proximal to at least a portion of a conductive outer surface of at least one aligned connector of the plurality of aligned connectors in the test system. The socket can further include an insulation layer provided on the annular inner surface.
    Type: Grant
    Filed: June 4, 2012
    Date of Patent: August 19, 2014
    Assignee: Interconnect Devices, Inc.
    Inventors: Jiachun Zhou, Dexian Liu, Siang Soh, Brian Hahn, Bizhao Li
  • Patent number: 8808009
    Abstract: An interconnect device for electrically connecting first and second electrical components together along a connection axis includes a contact assembly having an insulative carrier and electrical contacts held by the insulative carrier. The electrical contacts include mounting segments and mating segments. The mating segments are configured to be compressed along the connection axis. A frame includes a central opening and at least one perimeter segment that defines a boundary of the central opening. The contact assembly is held within the central opening. The frame includes a compression stop having a stop surface that is configured to engage the second electrical component to limit an amount of compression of the mating segments along the connection axis. The stop surface is aligned with a mating side surface of the perimeter segment.
    Type: Grant
    Filed: April 2, 2012
    Date of Patent: August 19, 2014
    Assignee: Tyco Electronics Corporation
    Inventors: Jeffery W. Mason, Wayne Alden, III