Connected By Transversely Inserted Pin Patents (Class 439/75)
  • Patent number: 5211567
    Abstract: A completely shielded metallized connector block for use in multiple circuit modules of an electronic device. Electrical communication between the circuit boards is effected by an array of metallic pins which run through the blocks. The metallization on the nonconductive blocks can be held at ground or at a constant potential to increase the shielding between pins as well as maintaining voltage and ground planes at constant levels throughout the modules. The metallization is insulated from the pins and circuit boards by nonconductive bushings inserted in holes in the blocks. In one embodiment, the metallization consists of copper and solder plating and the blocks are constructed of liquid crystal polymer.
    Type: Grant
    Filed: July 2, 1991
    Date of Patent: May 18, 1993
    Assignee: Cray Research, Inc.
    Inventors: Eugene F. Neumann, Melvin C. August, Stephen A. Bowen, Gregory W. Pautsch
  • Patent number: 5187431
    Abstract: An universal connector employing a plurality of double female contacts installed with a certain clearance in receptacles of a body which may be suspended in a coupling position with a plurality of male contacts arranged on the top face of an EWS probe card and with a plurality of male contacts arranged on the bottom surface of a test card in a test-on-wafer station, provides a multicontact universal connection for any pair of so equipped cards of the inventories of probe cards and of test cards of the station. The connection is easily set up and exhibits excellent stability and uniformity characteristics of the electrical couplings, while reducing sensibly the time necessary for the setting-up and debugging of the test station for initiating a certain cycle of testing-on-wafer. The stability and reproducibility of the electrical couplings provided by the connection increases the precision of the measurements of critical parameters of the integrated devices with a positive effect on the production yield.
    Type: Grant
    Filed: June 18, 1991
    Date of Patent: February 16, 1993
    Assignee: SGS-Thomson Microelectronics s.r.l.
    Inventor: Giuseppe Libretti
  • Patent number: 5174763
    Abstract: A contact assembly is provided for connecting pairs of terminals of two circuits, which allows terminals to be positioned at high densities with minimum crosstalk, selected impedances, and minimum inductances for fast pulse rise times. The apparatus includes a dielectric frame (30, FIG. 2) having multiple miniature cavities (46), and an extendable contact assembly (26) lying in each cavity and having a pair of probes (32, 34) projecting from opposite faces of the frame. The two probes of each contact assembly are slideably engaged and are biased apart by a spring (70), the spring being constructed of dielectric material to avoid inductances and to allow for a high characteristic impedance. The frame can include a body (104, FIG. 6) having multiple plated through holes or cavities (106), and end wall structures (114) having dielectric bushings (122) shorter than the body holes and fitting into the body cavities.
    Type: Grant
    Filed: December 16, 1991
    Date of Patent: December 29, 1992
    Assignee: ITT Corporation
    Inventor: Albert H. Wilson
  • Patent number: 5169322
    Abstract: An electrical connector (19) for mounting against a circuit board (13) comprises, an insulative strip (20), conductive sockets (21) in the strip (20), solder tabs (35) projecting from the sockets (21) and outwardly from a corresponding edge (29) of the strip (20), a bottom of the strip (20) serving as a first mounting surface for engagement against the circuit board (13), and the solder tabs (35) being adapted for being bent, first, in a direction toward the bottom of the strip, and then, to extend outwardly from the edge (29) at nearly the same level with the bottom, and the top (23) of the strip (20) serving as a second, alternative mounting surface for engagement with the circuit board (13).
    Type: Grant
    Filed: March 13, 1992
    Date of Patent: December 8, 1992
    Assignee: AMP Incorporated
    Inventors: Robert H. Frantz, William J. Garver, Benjamin H. Mosser, III, Ronald M. Weber
  • Patent number: 5154621
    Abstract: A printed circuit contact system for use in high speed digital applications includes a generally tapered slotted socket made of beryllium copper or other conductive spring material. The socket has a wave-like configuration which forms a series of outer contact portions which alternate with increasingly smaller inner contact portions. Insertion of an appropriately dimensioned pin through the socket causes engagement of the pin with at least one of the inner contact portions to radially expand the socket and force adjoining outer contact portions to abut against a sleeve lining a hole in a printed circuit board into which the socket is inserted. Expansion of the socket provides at least one portion thereof which is always under optimum load, assuring proper retention and physical and electrical contact over extended periods.
    Type: Grant
    Filed: July 29, 1991
    Date of Patent: October 13, 1992
    Assignee: Zierick Manufacturing Corporation
    Inventor: Janos Legrady
  • Patent number: 5152696
    Abstract: Z-axis connectors for interconnecting stacked printed circuit boards are formed from resilient material and have contact sections larger than cooperating through-plated holes formed in the boards. The connectors are drawn through the through-plated holes in the stacked circuit board, causing the contact section of the connector to frictionally engage the through-plated holes on at least two boards.
    Type: Grant
    Filed: April 2, 1991
    Date of Patent: October 6, 1992
    Assignee: Cray Research, Inc.
    Inventors: Nicholas J. Krajewski, David J. Johnson, Arthur O. Kunstmann
  • Patent number: 5133669
    Abstract: A printed circuit board pin having a dielectric body and two or more conductor lines extending along the body, the conductor lines insulated from one another. In one construction, the body is planar with a planar conductor line on each of two opposite sides of the pin. This pin may be made by stamping from a laminate sheet of the dielectric material sandwiched between layers of conductor material. Three or more conductors upon a pin may be formed by plating techniques or possibly by extrusion.
    Type: Grant
    Filed: July 23, 1990
    Date of Patent: July 28, 1992
    Assignee: Northern Telecom Limited
    Inventors: Robert L. Barnhouse, H. Scott Estes
  • Patent number: 5129830
    Abstract: Z-axis pin connectors for interconnecting stacked printed circuit boards are formed from resilient material and have contact sections larger than cooperating through-plated holes formed in the boards. The pin connectors are drawn through the through-plated holes in the stacked circuit board, causing the contact section of the pin connector to frictionally engage the through-plated holes on at least two boards.
    Type: Grant
    Filed: October 31, 1990
    Date of Patent: July 14, 1992
    Assignee: Cray Research, Inc.
    Inventors: Nicholas J. Krajewski, David J. Johnson, Arthur O. Kunstmann
  • Patent number: 5127837
    Abstract: A novel wadded wire-plunger contact is provided which possesses excellent durability and desired functional characteristics in a large variety of applications such as the testing of IC chips.
    Type: Grant
    Filed: August 28, 1991
    Date of Patent: July 7, 1992
    Assignee: Labinal Components and Systems, Inc.
    Inventors: Arun J. Shah, David W. McClung, Albert N. Hopfer, Richard J. Linderman, Saeed Zafar
  • Patent number: 5112232
    Abstract: A method and apparatus for interconnecting electronic circuit boards through the use of twisted wire jumpers which are formed from multifilament wire and which have enlarged bird cages formed along the pins. The pins are drawn through a stack of circuit boards to position the cages in contact with interconnection aperture located in the printed circuit boards. The frictional engagement of the cages in the apertures provides both electrical interconnection of, and mechanical coupling between the printed circuit boards.This application is a division of co pending patent application Her. No. 07/347,507, filed May 4, 1989, now U.S. Pat. No. 5,014,419, issued May 14, 1991, U.S. Pat. application Ser. No. 07/347,507 was a continuation-in-part of application Ser. No. 07/053,142, filed May 21, 1989, now U.S. Pat. No. 5,054,192, issued Oct. 8, 1991. All of these applications and patents are assigned to the same assignee.
    Type: Grant
    Filed: February 15, 1991
    Date of Patent: May 12, 1992
    Assignee: Cray Computer Corporation
    Inventors: Seymour R. Cray, Nicholas J. Krajewski
  • Patent number: 5107587
    Abstract: A method for the construction and application of a plate interface for the electrical interconnection in control and monitoring devices with terminal outlets of the plate type, using the steps of:making a rigid printed circuit having apertures disposed according to the layout of the output terminals of the control device;applying by screen-printing a soldering paste onto the locations of the printed circuit corresponding to the terminals to be brought into electrical contact;preheating only the terminals of the control device;assembling the electrical interconnection plate on the control device with the interposition of a further plate for the thermal protection of the control device itself; andmelting of the soldering paste according to a thermal cycle comprising an associated programming and monitoring device having output terminals for connectors of the plate-type, electrically interconnected and functionally arranged by means of an interface having a rigid plate electrically connected to the terminals by
    Type: Grant
    Filed: February 7, 1990
    Date of Patent: April 28, 1992
    Assignee: Crouzet S.p.A.
    Inventor: Claude Thepault
  • Patent number: 5106310
    Abstract: Z-axis pin connectors for interconnecting stacked printed circuit boards are formed from resilient material and have contact sections larger than cooperating through-plated holes formed in the boards. The pin connectors are drawn through the through-plated holes in the stacked circuit board, causing the contact section of the pin connector to frictionally engage the through-plated holes on at least two boards. Formation of pin connectors from a resilient thermoplastic material coated with a conductive layer is also disclosed.
    Type: Grant
    Filed: October 31, 1990
    Date of Patent: April 21, 1992
    Assignee: Cray Research, Inc.
    Inventors: Nicholas J. Krajewski, David J. Johnson, Arthur O. Kunstmann
  • Patent number: 5098305
    Abstract: A method and apparatus for interconnecting circuit board assemblies using memory metal wires mechanically inserted into through-plated holes. The invention has its application in the interconnection of stacked circuit board assemblies where kinked memory metal wires are stretched so the wires are substantially straight; inserted into axially aligned through-plated holes of circuit boards; and released so that the memory metal wires reform their original kinked shaped within the through-plated holes, forming an electrical connection between the circuit boards. Memory metal alloys are used in the construction of the kinked memory metal wires to take advantage of the pseudoelastic behavior of the alloys in the austenitic phase below the forming temperature range.
    Type: Grant
    Filed: March 17, 1989
    Date of Patent: March 24, 1992
    Assignee: Cray Research, Inc.
    Inventors: Nicholas J. Krajewski, David J. Johnson, Arthur O. Kunstmann
  • Patent number: 5060113
    Abstract: This invention provides a connector assembly for forming electrical connections to at least two circuit boards disposed in a parallel surface-to-surface relationship. The assembly comprises at least two modules, each of which comprises connector elements. A first set of connector elements provides connections between the circuit board and another electrical device, and a second set of connector elements provides connections between the circuit boards. A heat sink may be provided between the circuit boards. Electronic components on the circuit boards may be sealed by means of a gel, which can also serve to transmit heat from the components.
    Type: Grant
    Filed: July 31, 1990
    Date of Patent: October 22, 1991
    Assignee: Raychem Corporation
    Inventor: Brian Jacobs
  • Patent number: 5055073
    Abstract: An improved anti-bend pin spacer is disclosed for use in a multi-pin connector which includes a male plug having pins terminals fixed in its housing, and a female receptacle having pin holes and contact terminals fixed in its housing. The pin spacer is an insert molded part which is insert molded about free ends of the pin terminals simultaneously with the insert molding of substantial lengths of the pin terminals in the housing of the male plug.
    Type: Grant
    Filed: March 8, 1990
    Date of Patent: October 8, 1991
    Assignee: Molex Incorporated
    Inventors: Yuuji Yamada, Shinsuke Kunishi, Yoshiyuki Mizuno
  • Patent number: 5051097
    Abstract: A three dimensional stack of printed circuit assemblies (10,12) provides electrical interconnection or bussing between layers of the stack by means of a composite contactor (34, 35, 36, 77, 79, 81, 83) formed of a shape-memory core (90) having a number of highly electrically conductive resilient wires (92, 94) wrapped around it. The shape-memory core (90) has a low temperature configuration that is substantially straight and enables the contactor assembly or core (90) and wires (92, 94) to be inserted into vias (30, 31, 76, 78, 80, 82) extending through this stack of layers with little or no insertion force. When heated above its phase change temperature, the shape-memory core (90) assumes a sinuous configuration which tightly presses the encircling conductive wires (92, 94) against the electrically conductive interior surfaces of the vias (30, 31) to provide mechanical and electrical contact from layer to layer.
    Type: Grant
    Filed: June 25, 1990
    Date of Patent: September 24, 1991
    Assignee: Hughes Aircraft Company
    Inventors: Robert S. Miles, Gustav A. Schmidt
  • Patent number: 5040993
    Abstract: An interchangeable adapter module allows a circuit board, tape cartridge system, or other add-on device to be readily interfaced with any of a variety of different computer systems. A number of pins extend perpendicularly outward from the device circuit board. An adapter circuit board having a pin connector attached thereto engages these pins to removably secure the adapter module in a plane parallel to the device circuit board. One or more external connectors attached to the adapter circuit board are then plugged into corresponding connectors of the external electronic system. Electrical interface circuitry on the adapter circuit board provides electrical interconnections between a predetermined set of the pins attached to the device, and a predetermined set of the electrical contacts of the external connectors.
    Type: Grant
    Filed: June 19, 1990
    Date of Patent: August 20, 1991
    Assignee: Colorado Memory Systems, Inc.
    Inventors: Eric M. Krug, Terrence A. Precht, Bruce D. Roemmich
  • Patent number: 5030110
    Abstract: A cage assembly for stacking one or more PRIOR ART integrated circuit packages or leadless chip carriers (LCC), and for electrically and mechanically interconnecting the LCCs selectively to each other and to a PRIOR ART printed circuit board (PCB). The cage assembly includes a flexible wafer with an electrical conductor pattern that is electrically and mechanically connected to an LCC positioned thereon, is mechanically retained by a rigid cage member. The cage member electrically interconnects the one or more LCCs positioned in a stacked relationship, and can be electrically and mechanically connected to a PCB.
    Type: Grant
    Filed: November 6, 1989
    Date of Patent: July 9, 1991
    Assignee: Litton Systems, Inc.
    Inventors: Henry T. Groves, Frank R. Hultberg, John A. Klacks
  • Patent number: 5017145
    Abstract: A matrix switching device includes a matrix board and a connecting pin. X-conductor patterns are arranged in parallel with each other on one surface of the matrix board, and Y-conductor patterns are arranged in parallel with each other on the other surface. Both the patterns are arranged in a matrix form. At each crossing point of the both patterns, a through hole having conductive portions respectively connected to the X- and Y-conductor patterns and an intermediate isolation portion for interrupting conduction between the conductive portions is formed in the matrix board. The connecting pin includes conductive portions respectively electrically connected to the X- and Y-conductor patterns through the conductive portions of the through hole upon insertion of the connecting pin into the through hole.
    Type: Grant
    Filed: April 24, 1989
    Date of Patent: May 21, 1991
    Assignee: Nippon Telegraph & Telephone Corporation
    Inventors: Tsuneo Kanai, Shigefumi Hosokawa, Yasuo Kumakura, Shigeru Umemura, Shuichiro Inagaki
  • Patent number: 5013249
    Abstract: Electrical connectors including a row of conductive interconnect elements in the form of slugs which extend through openings in a block of insulating material and which are associated resilient wadded elements to connect conductive pads of circuit boards. A wall portion of conductive material is positioned in parallel relation to the row or elements to provide a ground plane and an air dielectric is provide along the length of each element to cooperate with the dielectric of the block and obtain a desired characteristic impedance.
    Type: Grant
    Filed: September 12, 1989
    Date of Patent: May 7, 1991
    Assignee: Labinal Components and Systems, Inc.
    Inventors: Richard J. Lindeman, Robert J. Smith, II
  • Patent number: 4999023
    Abstract: A socket for an electronic component is comprised of an electrically insulative base having patterned electrical conductors integrated therein; a plurality of electrically conductive springs are held by the base; the springs are arranged in a pattern such that they can be compressed perpendicular to a plane by respective input/output terminals on the component; and, each spring is a sponge-like mass which is forced against a respective one of the conductors in a direction parallel to the plane in response to being compressed perpendicular to the plane by the component's terminals.
    Type: Grant
    Filed: November 14, 1989
    Date of Patent: March 12, 1991
    Assignee: Unisys Corporation
    Inventor: Philip P. Froloff
  • Patent number: 4949455
    Abstract: An electrical pin comprises a metal pin having plated metal members at peripheral end surfaces thereof and head members including solder secured to the end surfaces of the metal pin and the plated metal members.
    Type: Grant
    Filed: February 1, 1989
    Date of Patent: August 21, 1990
    Assignee: AMP Incorporated
    Inventors: Keiichi Nakamura, Tsutomu Oshima, Noriharu Kurokawa, Toshihiko Kitai
  • Patent number: 4939624
    Abstract: An improved multiple circuit module for use in an electronic device includes a number of cold plates sandwiched between pairs of circuit boards for taking away excess heat from the circuit boards. Each plate is provided with open spaces which permit communication between the circuit boards, and with circuit boards on other cold plates. Electrical communication between the circuit boards is effected by an array of metallic pins. The pins are received in a perforate pin header which extends along the depth of the cold plate, and pins communicating with other circuit boards extend into a connector block which is placed between a pair of pin headers. Shielding is provided in both the connector blocks and pin headers to prevent electronic cross-talk between pins disposed therein. In one embodiment, a novel type of pin which reduces installation and disconnection friction is utilized.
    Type: Grant
    Filed: December 14, 1988
    Date of Patent: July 3, 1990
    Assignee: Cray Research, Inc.
    Inventors: Melvin C. August, Eugene F. Neumann, Stephen A. Bowen, John T. Williams
  • Patent number: 4936785
    Abstract: An interchangeable adapter module allows a circuit board, tape cartridge system, or other add-on device to be readily interfaced with any of a variety of different computer systems. A number of pins extend perpendicularly outward from the device circuit board. An adapter circuit board having a pin connector attached thereto engages these pins to removably secure the adapter module in a plane parallel to the device circuit board. One or more external connectors attached to the adapter circuit board are then plugged into corresponding connectors of the external electronic system. Electrical interface circuitry on the adapter circuit board provides electrical interconnections between a predetermined set of the pins attached to the device, and a predetermined set of the electrical contacts of the external connectors.
    Type: Grant
    Filed: December 19, 1988
    Date of Patent: June 26, 1990
    Inventors: Eric M. Krug, Terrence A. Precht, Bruce D. Roemmich
  • Patent number: 4934945
    Abstract: The electrical connector forming a plate over plate arrangement is configured by a connector body, a plurality of female pins, male pins, and mount plates. Vertical through holes for insertion of the male pins and lateral holes for the female pins are provided with the connector body and intersecting respectively in the body, wherein a female pin each having a bifurcate portion at its tip is inserted into the lateral through hole so that the bifurcated portion is located at the intersection, and a male pin mounted on another plate to be connected is inserted in the vertical through hole. The bifurcated portion of the female pin each makes a contact with the male pin, when a plate mounted with male pins is approached closely to a plate mounted with a female pin-inserted connector body.
    Type: Grant
    Filed: June 8, 1989
    Date of Patent: June 19, 1990
    Assignee: Hosiden Electronics Co., Ltd.
    Inventor: Masahiko Nakamura
  • Patent number: 4929185
    Abstract: The subject invention is a device for joining and separating first and second printed circuit boards connectable by a socket on one of the boards and a plurality of pins projecting from the other of the boards. The device comprises a screw held captive to the first board but rotatable therein, and a spacer fastened to the second board and having a threaded hole for receiving the screw. The pins are inserted into and withdrawn from the socket by the engagement and disengagement, respectively, of the threaded hole by the screw.
    Type: Grant
    Filed: April 3, 1989
    Date of Patent: May 29, 1990
    Assignee: NRC Corporation
    Inventors: Daniel T. Wong, Floyd G. Speraw
  • Patent number: 4913656
    Abstract: An electrical connector is presented for effecting a non-wiping pressure mated connection between at least a pair of flexible circuits and another circuit device in a compact package with allowance for very tight tolerances on pad width and spacing.
    Type: Grant
    Filed: April 7, 1989
    Date of Patent: April 3, 1990
    Assignee: Rogers Corporation
    Inventors: Herman B. Gordon, Mark J. Owens, Scott Simpson
  • Patent number: 4911645
    Abstract: The present invention provides a parallel board connector having zero insertion force between a PC board and a backplane which presents effectively zero impedance change through the connector interface. The PC board and the backplane to which it is to be connected have through-plated holes. The boards are positioned to overlap such that the through-plated holes are axially aligned. A shuttle block is provided with a number of parallel dual flex pins attached to one surface. To effect connection, the flex pins of the shuttle block are inserted through the holes of one board and into the holes of a second board to provide an electrical connection having very low or no impedance interface.
    Type: Grant
    Filed: December 14, 1988
    Date of Patent: March 27, 1990
    Assignee: Cray Research, Inc.
    Inventors: Melvin C. August, Eugene F. Neumann
  • Patent number: 4910415
    Abstract: An electronic apparatus comprising a power supply device such as a solar cell having at least one electrode for supplying power, a printed circuit board having at least one electrode for inputting the power from the power supply device, and an elastic, electrically conducting connector for connecting the electrode of the power supply device with the electrode of the printed circuit board. The electrically conducting elastic connector is made of silicone rubber containing carbon filler dispersed therein.
    Type: Grant
    Filed: April 17, 1989
    Date of Patent: March 20, 1990
    Assignee: Sharp, Kabushiki Kaisha
    Inventor: Yutaka Yoshimura
  • Patent number: 4889496
    Abstract: A compressible core electrical connector for forming a connection within a circuit board hole includes a plurality of conductive spiral strands extending between the ends of the connector and defining spiral wound lead-in and trailing portions at the ends of the connector and a centrral contact portion including a compressible core with the spiral wound strands wrapped around the core.
    Type: Grant
    Filed: January 23, 1989
    Date of Patent: December 26, 1989
    Assignee: InterCon Systems, Inc.
    Inventor: Douglas A. Neidich
  • Patent number: 4867691
    Abstract: A contact for a connector is characterized by a barrel portion having a layer of a reflowable solderable material disposed on the inner and outer surfaces thereof. The barrel is expansible from a first to a second dimension upon the insertion of a camming member thereinto. The contact is disposed in a connector that is used in conjunction with a pin header and a board with plated through holes therein. The barrels, when inserted into the through holes from one surface of the board, are expanded by the receipt of pins or wires inserted into the barrels from a header disposed on the other side of the board. The connections between the barrels and the through holes may be mass terminated. The board assembly so formed is able to be conveniently stacked.
    Type: Grant
    Filed: October 29, 1987
    Date of Patent: September 19, 1989
    Assignee: E. I. Du Pont de Nemours and Company
    Inventor: Michael P. Eck
  • Patent number: 4859806
    Abstract: A discretionary interconnect which includes orthogonal arrays of conductors sandwiched between conductive planes and accessible through a number of selectively arranged vias for interconnection and interruption. Also disclosed is a process of personalizing an interconnect of this type by selectively connecting and disconnecting the conductors.
    Type: Grant
    Filed: May 17, 1988
    Date of Patent: August 22, 1989
    Assignee: Microelectronics and Computer Technology Corporation
    Inventor: Robert T. Smith
  • Patent number: 4830620
    Abstract: An electrical connector comprises four conductor elements each having a surface portion which is spaced from, but presented towards, a first axis. The surface portions are equiangularly distributed about the first axis and are substantially equidistant from the first axis. Each conductor element extends at least partly between first and second planes which are perpendicular to the first axis. A rod structure has a central axis, the rod structure comprises four elongate bodies of conductive material which are supported in mutually electrically insulated relationship. The bodies of conductive material are substantially parallel to each other and substantially equiangularly distributed about the central axis of the rod structure and substantially equidistant therefrom.
    Type: Grant
    Filed: October 15, 1987
    Date of Patent: May 16, 1989
    Inventors: Daniel W. Marks, Richard Schmachtenberg, III
  • Patent number: 4820171
    Abstract: A coupling plate with a plurality of electric coupling points comprises, in a preferred embodiment, a pair of plane plates (10, 12), between which there is provided an electrically insulating carrier layer (11), on which a pattern of electrically conducting areas (21-26) is provided. In the preferred embodiment, an electric coupling point is provided for each mechanical coupling stud (15) projecting from the upper side of the top plate (10). The studs (15) are hollow and flush with projections (19) on the lower plate (12) so that punched parts of the electrically conducting areas (20, 22, 24, 26) are just moved into the hollow coupling studs by means of the projections (19) on the lower plate (12), thus making the conducting areas accessible through cuts (16) in the coupling studs (15). The invention also concerns a method of producing such a plate and a board consisting of a plurality of interconnected plates of said type.
    Type: Grant
    Filed: September 14, 1987
    Date of Patent: April 11, 1989
    Assignee: A/S Modulex
    Inventor: Per Korteqaard
  • Patent number: 4819131
    Abstract: An integrated circuit package including a multilayer ceramic substrate for mounting a plurality of integrated circuit chips on a first surface thereof. The substrate is provided with a power supply layer, a ground connection layer and circuit patterns. An array of coaxial pins is juxtaposed on the opposite surface of the substrate. Each coaxial pin includes an inner conductor and an outer conductor. The inner conductor of one or more coaxial pins is connected to the power supply layer and the inner conductors of the remaining coaxial pins are connected to the circuit patterns. The outer conductors of all the coaxial pins are connected to the ground connection layer.
    Type: Grant
    Filed: August 26, 1987
    Date of Patent: April 4, 1989
    Assignee: NEC Corporation
    Inventor: Toshihiko Watari
  • Patent number: 4816426
    Abstract: A process for forming an integral circuit pin grid array package comprising a flexible metal tape adapted for use in tape automated bonding with a plurality of holes. Terminal pins are inserted in the holes and the tape and pins are disposed within a mold so that a cavity is formed about the pins and tape. The cavity is filled with a polymer resin so as to at least partially surround and support the pins and tape and thereby form the plastic encapsulated pin grid array.
    Type: Grant
    Filed: May 21, 1987
    Date of Patent: March 28, 1989
    Assignee: Olin Corporation
    Inventors: William G. Bridges, Thomas A. Armer, Kin-Shiung Chang
  • Patent number: 4724180
    Abstract: A shielding device, as for spring pins, is provided by providing a base having shielding holes, grounding holes, and a trough connecting them with an interconnected covering, providing within the shielding holes insulators with element holes therethrough.
    Type: Grant
    Filed: August 5, 1985
    Date of Patent: February 9, 1988
    Assignee: Teradyne, Inc.
    Inventor: Walter P. Kern
  • Patent number: 4723196
    Abstract: By a special structure the conductor paths between connection prongs at one end of an electric circuit unit and circuit components located on two circuit boards are greatly shortened. The circuit boards are connected at their ends remote from the connector prongs by studs that releasably snap together while a flexible flat conductor makes connections between the two circuit boards. The two circuit boards are electrically and mechanically connected with separable parts of a plug connector each carrying at least one row of prongs projecting into a plug-in space of a receptacle body. One of these separable parts is integrated into a receptable body, which is provided with an aperture through which the other plug connector part can be slipped and locked into place after the boards have been electrically connected together at their far ends and the circuits have been checked.
    Type: Grant
    Filed: October 8, 1985
    Date of Patent: February 2, 1988
    Assignee: Robert Bosch GmbH
    Inventors: Werner Hofmeister, Dieter Neuhaus
  • Patent number: 4707039
    Abstract: The invention comprises first and second wiring carriers surrounded and separated by shielding means, conductive lines on said carriers being electrically joined by means of a projection (pin) and socket. The projection extends coaxially through a hole in the shielding means.
    Type: Grant
    Filed: February 26, 1987
    Date of Patent: November 17, 1987
    Assignee: John Fluke Mfg. Co., Inc.
    Inventor: Charles K. Whipple