Abstract: A connector assembly for connecting differential signal circuits on two different circuit boards has a connector housing formed from an insulative material with a conductive coating on the surfaces thereof and with cavities formed therein to receive terminal assemblies. Each internal cavity may have an elongated portion that extends transversely across the housing and a plurality of leg portions in communication with the elongated portion to define passages between opposite sides of the connector. Each cavity is suited for holding a terminal assembly having at least one pair of differential signal terminals. The terminals have opposing compliant tail portions, and interconnecting portions that are partially encapsulated by an insulative outer shell. Two shells are combined together to form a single terminal assembly. The terminal assemblies are identical in shape so that they may be inserted into any of the cavities of the housings, thereby imparting a measure of modularity to the connectors.

Abstract: A board to board array type connector comprising an array type connector, an upper supporting cover, a lower supporting cover, a screw with a bolt and a screw nut; during application, the upper supporting cover is on the top of the upper PCB, the upper pressing area/point presses down on the top of the upper PCB, the lower supporting cover is on the bottom of the lower PCB, the lower pressing area/point presses up on the bottom of the lower PCB; the screw with bolt passes through all the through holes and is fastened with the screw nut on the end to assemble the whole set, the stress is distributed equilibrium to the upper and lower pressing area/point, the pressure is evenly over all the connection pins of the array type connector for better electrical conductivity.

Abstract: A system includes a chassis and at least one mount apparatus mounted in the chassis. The chassis is arranged and configured to retain a plurality of mount apparatuses. The chassis includes a power bus having a plurality of power plugs for providing electrical power. The mount apparatus includes a power receptacle for receiving electrical power from one of the plurality of power plugs.

Abstract: A motion control system comprises a motion unit having a motor connected to an encoder and an amplifier. The motion control system further comprises a scalable motion controller connected to the motion unit wherein the scalable motion controller receives signals from the encoder and outputs signals to the amplifier. The scalable motion controller comprises a plurality of dip sockets arranged for inserting and removing one or more motion control processors and a connector interface comprising a plurality of male and female connectors arranged for stacking a plurality of motion controllers.

Abstract: The present invention provides a terminal pin for connecting a DC-DC power converter module or the like to a PCB. The pin has improved current carrying capabilities by having a diameter over most of its length that is larger than the ends that are connected to either the module or PCB. The larger diameter also provides for improved heat flow from the power converter module to the PCB. A smaller diameter portion near the PCB board provides for improved flow of solder between the pin and the PCB. A stand-off member is also provided to maintain the module and PCB at a predetermined stand-off distance.

Abstract: A parallel printed circuit board assembly includes a main circuit board (1) and an auxiliary circuit board (2). The main circuit board has a surface (14) with a plug connector (32) and a receptacle connector (44) mounted thereon. The auxiliary circuit board has a surface (22) with a plug connector (42) and a receptacle connector (34) mounted thereon. The plug and receptacle connectors of the main circuit board respectively mate with the receptacle and plug connectors of the auxiliary circuit board. Because of the arrangement of the plug and receptacle connectors on the main and auxiliary circuit boards, the circuit boards can only connect with one another in one correct way.

Abstract: A press-fit portion (24) of a press-fit pin (22) is constructed by cutting and outwardly pushing a band-like region (24a), which is placed in the vicinity of the widthwise center of a pin material, in one of orientations of the thickness direction in such a way as to project from peripheral regions (24b) of the band-like region (24a). At that time, the thickness dimension (W3) of the press-fit portion (24) is set to be equal to or less than that W1 of a pin body (23).

Abstract: A pin assembly is configured to interconnect a first circuit board and a second circuit board. The pin assembly includes a set of pins. Each pin of the set of pins has a first end, a second end, and a mid-portion. The pin assembly further includes a frame which contacts the mid-portion of each pin of the set of pins to position the pins such that (i) the first ends of the pins simultaneously register into respective holes of the first circuit board when the pin assembly engages with the first circuit board, and (ii) the second ends of the pins simultaneously register into respective holes of the second circuit board when the pin assembly engages with the second circuit board.

Abstract: A casing structure for an electronic apparatus is disclosed. The casing structure includes a main body to be placed on a surface of an object, and at least one sucker disposed on at least one side of the main body, thereby attaching the electronic apparatus on the surface to prevent the electronic apparatus from moving relative to the surface of the object.

Abstract: An electronic package and filtered electrical connector assembly includes number of connector pins extending away from a main circuit board having a first ground plane, and an auxiliary circuit board having a second ground plane is positioned over the main circuit board with the connector pins extending therethrough and electrically connected to a corresponding number of capacitors mounted to the auxiliary circuit board. An inductive block and surrounding conductive spacer block are positioned between the main and auxiliary circuit boards with the connector pins extending through the inductive block and with the conductive spacer block electrically contacting the first and second ground planes. A connector shroud surrounds the connector pins extending through auxiliary circuit board, and all components are bonded together via an overmolding process to form the electronic package.

Abstract: An assembly structure of an adapter is disclosed. The assembly structure of an adapter includes a printed circuit board (PCB) having plural contacts thereon, a first insulation casing, a second insulation casing assembled with the first insulation casing and having a space for installing the PCB therein, and a plug disposed on the first insulation casing and having plural conductive terminals and plural metal extending pieces, wherein each of the conductive terminals is connected with a corresponding metal extending piece, thereby the metal extending pieces contact with the contacts of the PCB to conduct the conductive terminals with the PCB when the first insulation casing, the second insulation casing and the PCB are assembled together.

Abstract: A three-dimensional circuit module includes z-axis connection pins, such as twist pins to electrically connect multiple, spaced-apart substrates, such as circuit boards. An expanding portion of a bulge of the pin mechanically and electrically contacts a corner edge of a via in a substrate without full insertion of the bulge in the via. Compression of the expanding portion of the non-inserted bulge establishes the electrical connection, which is also assisted by the longitudinal restraint on the pin relative to the substrate. Assembly and disassembly is facilitated without requiring the bulge to be fully inserted into the via.

Abstract: An information-processing device comprises at least one crossbar-board; a plurality of back panels detachably connected electrically and mechanically to different sides of the crossbar-board; and at least one motherboard detachably connected electrically and mechanically to each of the back panels. The crossbar-board has a switching element mounted thereon. The motherboard has an information-processing semiconductor element mounted thereon.

Abstract: A three-dimensional circuit module includes z-axis connection pins, such as twist pins to electrically connect multiple, spaced-apart substrates, such as circuit boards. An expanding portion of a bulge of the pin mechanically and electrically contacts a corner edge of a via in a substrate without full insertion of the bulge in the via. Compression of the expanding portion of the non-inserted bulge establishes the electrical connection, which is also assisted by the longitudinal restraint on the pin relative to the substrate. Assembly and disassembly is facilitated without requiring the bulge to be fully inserted into the via.

Abstract: An electronic device connecting method according to a first aspect of the present invention includes: mounting an electronic device having at least one electrode portion on a sheet-like porous member having a hole therein so that the electrode portion is close to the porous member; selectively irradiating a predetermined region of the porous member, on which the electronic device is mounted, with energy lines to form a latent image in an irradiated or non-irradiated portion of the porous member, the predetermined region including a portion close to the electrode portion; after irradiating with the energy lines, filling a conductive material in a hole of the latent image of the porous member to form a conductive portion; and bonding and integrating the porous member, in which the conductive portion is formed, to and with the electronic device.

Abstract: Such a device is used for electrically connecting at least one contact point on a first circuit board to at least one contact point on a second circuit board positioned neighboring the first circuit board using at least one conductor provided with an insulating sheath.

Abstract: A sealed electrical assembly that includes a housing having an opening at an end. An electrical device is positioned in the housing. The electrical device includes a lead that extends out of the open end. A cover is positioned within the opening. The cover includes a plate portion and a tab portion spaced apart from the plate portion. The tab portion extends into a cutout in the housing that is located between the plate portion and the housing end to position the cover with respect to the housing. A sealant is disposed around a perimeter of the plate portion to provide a seal between the cover and the housing. A portion of the sealant is disposed in a space between the cutout and the plate portion to prevent leakage through the cutout.

Abstract: A contact assembly comprised of two parts bonded (e.g., welded) together, the first part including a male pin portion and the second part including a cylindrical jacket terminating in a flat end surface adapted for being electrically coupled (e.g., soldered) to a conductor (e.g., pad) on a substrate (e.g., PCB). Several contact assemblies may be positioned within a housing or substrate, to form a connector assembly which may then be positioned on and electrically coupled to a second substrate (e.g., a PCB), forming an electronic assembly.

Abstract: A connector for effecting a permanent, solderless connection between two printed circuit boards or other devices using plated through via openings is disclosed. The connector body captures pins that project from two surfaces thereof. Each of a plurality of pins presents dual compliant connecting portions, one adjacent each body surface from which the pin projects. The connector body portion may also include bosses adjacent the projecting pins to cause the pin compliant connecting portion to have a predetermined distance of penetration into the cooperating via opening of a connected board or panel and the edge surface of the body can be notched between pin locations to enable an extended length to be partitioned into smaller units. The connector may also be formed with two spaced body portions to effect greater separation between attached boards.

Abstract: An automatic main distributing frame, which can easily maintain the size accuracy required to insert into a through hole of the conductive pin is provided. The main distributing frame includes a frame body, plural matrix switch boards accommodated in the frame body, each having matrix switch sections and input/output connectors on a rear section, a back wire board provided on a rear section of the frame body, having connectors connected to the input/output connectors on each rear section of the plural matrix switch boards, and plural robots, each positioned between a pair of two matrix switch board sections of the plural matrix switch boards, each having a hand section for inserting connection pins to the matrix switch sections of the two matrix switch boards.

Abstract: A connector for effecting a permanent, solderless connection between two printed circuit boards or other devices using plated through via openings is disclosed. The connector body captures pins that project from two surfaces thereof. Each of a plurality of pins presents dual compliant connecting portions, one adjacent each body surface from which the pin projects. The connector body portion may also include bosses adjacent the projecting pins to cause the pin compliant connecting portion to have a predetermined distance of penetration into the cooperating via opening of a connected board or panel and the edge surface of the body can be notched between pin locations to enable an extended length to be partitioned into smaller units. The connector may also be formed with two spaced body portions to effect greater separation between attached boards.

Abstract: An evaluation device and method for DUT boards and probe cards which increase the reproducibility of the measured values and decrease the abrasion of pads in evaluation tests. A connection box is provided with contact pins, mounting mechanisms used to mount the DUT boards, and a plurality of connectors which feed signals from the contact pins to the outside.

Abstract: An improved PC/104 connector includes a pin by pin isolation mechanism to allow a standard PC/104 connector pin to transmit non-PC, vendor-specific I/O signals between stacked PC/104 modules.

Abstract: The present invention relates to an apparatus and method for enhancing the differential signaling speed performance of a PCI bus within a data processing system. In particular it involves the connectors employed with PCI bus architecture. The present invention involves providing improved connectors employed in a PCI bus architecture. These are Split Pin and Split Via connectors which provide significantly higher frequency and higher frequency capability to the board level.

Abstract: A plurality of board connecting terminals each having a board connecting portion and a pressed-in portion are fixed to an insulating connecting element and thus integrally formed as a circuit board connecting terminal assembly. The board connecting portion of each of the terminals is inserted into a corresponding one of through holes formed in the printed circuit board in such a manner as to penetrate therethrough. Thus, the board connecting portion of each of the terminals is electrically connected thereto, so that the printed circuit board with the board connecting terminals are constituted. Then, a pressed-in portion of each of the circuit connecting terminals is press-fitted into a corresponding press-fitting hole and electrically connected to a corresponding one of the bus bars.

Abstract: A electronic assembly is disclosed and claimed. The electronic assembly includes a first substrate and a second substrate. A plurality of power connections are coupled between the first substrate and the second substrate and a multiplicity of signal connections separate from the plurality of power connections are also coupled between the first substrate and the second substrate. Each of the plurality of power connections have a substantially different size and shape compared to each of the multiplicity of signal connections.

Abstract: A vehicle electric power distribution apparatus is provided which includes a plurality of vertically stacked conductive circuit layers, each layer including an array of contact pads, a layer of electrically insulating plastic material between each of the conductive circuit layers, at least some of the contact pads are electrically connected to selected other contact pads of the same conductive circuit layer via integrally formed conductive traces. In addition to the stacked circuit layers the apparatus includes a plurality of conductive pins providing electrical contact between selected contact pads of different selected conductive circuit layers.

Abstract: A method of assembling a wire harness circuit includes providing a plurality of module plates, attaching wire connection terminals to predetermined wires of a plurality of wire sub-harnesses, inserting one or more wire connection terminals into selected wire housing grooves on the module plates, laminating the module plates on each other so as to form a laminated body, and inserting at least one connection member into the laminated body through openings in the module plates to electrically connect selected wire connection terminals on respective module plates.

Abstract: The present invention relates to chip assembly with a ball array capacitance minimizing layout that includes a ball array disposed upon a substrate with trace routing laid out between each ball pad and a respective bond wire pad. After routing of both signal and ground traces between the ball pads and their respective bond wire pads, at least one buffer trace is also disposed upon the substrate as a closed loop. The buffer trace may or may not be connected to ground. Preferably, buffer traces are configured to reduce the capacitance of the highest capacitance ball pads. This is accomplished by placing more of a give buffer trace around the perimeter of a higher capacitance ball pad, than around the perimeter of a lower capacitance ball pad. Accordingly, a capacitance difference between a higher capacitance ball pad and signal trace and a lower capacitance ball pad and signal trace can be minimized according to the present invention.

Abstract: An electrical connector has a non-conductive planar base defining a centrally located center aperture extending therethrough. The base has at least three generally identical sectors circumferentially arranged around the center aperture. Each sector defines a plurality of contact-receiving apertures extending through the base in a first direction perpendicular to the base. The contact-receiving apertures in each sector are organized into a plurality of rows. Each row in each sector extends along the base in a second direction with regard to such center aperture. The base is formed from an injection mold that includes a gate structure at the center aperture of the to-be-molded base. A non-conductive molding material is injected into the injection mold through the gate structure, whereby the injected material is generally evenly distributed into each sector of the base.

Abstract: An interposition structure interposed between substrates and capable of guiding the insertion of a connection pin for electrically connecting the substrates to each other, whereby the connection pin can be inserted properly even in cases where the substrates to be connected or other members have a dimensional error caused during production thereof, a positioning error or the like. The interposition structure has an interposition body in which a through hole is formed such that connection pin inlet and outlet portions thereof each have an inner diameter gradually increasing in a direction from the inner part to the corresponding outer open end thereof, and also has a positioning protuberance provided on the underside of the interposition body.

Abstract: The present invention relates generally to a new semiconductor chip carrier connections, where the chip carrier and the second level assembly are made by a surface mount technology. More particularly, the invention encompasses surface mount technologies, such as, Ball Grid Array (BGA), Column Grid Array (CGA), to name a few, where the surface mount technology comprises essentially of a non-solder metallic connection, such as, a copper connection. The present invention is also related to Column Grid Array structures and process thereof.

Abstract: An electro-optical connector consists of a plug and a socket, each bearing both a multi-conductor and at least one optical fiber. The socket has an elongated cavity and a plurality of longitudinally spaced first contact elements. The plug has mating longitudinally spaced contacts. The plug and socket both has at least one optical fiber coaxial with the plug and the cavity. The plug and socket can be engaged in a predetermined orientation only.

Abstract: A method for altering a circuit pattern of a printed-circuit board includes the steps of removing a portion of the printed-circuit board so that the circuit pattern inside the printed-circuit board is exposed, and connecting an exposed portion of the circuit pattern to another portion of the printed-circuit board by a conductive body so that a circuit path is formed between the exposed portion of the circuit pattern and the other portion of the printed-circuit board.

Abstract: A mechanism for use in insertion and extraction of a first printed circuit board (PCB) to and from a second PCB so as to engage and disengage an electrical connector of the first PCB to and from a corresponding electrical connector of the second PCB. The insertion and extraction mechanism includes a stiffener bar and a mounting block. The stiffener bar is affixed to the first PCB immediately adjacent to the electrical connector for stiffening the first PCB in the vicinity of the electrical connector. The mounting block is affixed to the second PCB immediately adjacent to the corresponding electrical connector. A threaded fastener is carried by the stiffener bar and is engageable with the mounting block. Rotation of the fastener in a first direction causes the first PCB to be inserted to the second PCB which causes the electrical connector to be engaged with the corresponding electrical connector.

Abstract: A plurality of adapters is disclosed for connecting RF connectors to a printed circuit board. The adapters each include a foot print for receiving the RF connector and a plurality of pins for mounting the connector to a prototyping board. The output signal of the RF connector may be coupled to an controlled impedance transmission line, and each adapter is also configured with a ground plane. The adapters may be configured for use with connectors, such as SMA and BNC connectors. The adapters support easy connection of the RF connector to the prototyping board and minimize the noise associated with the output signal of the RF connector.

Abstract: An accommodation for electronic components contained in a circuit board. The accommodation comprises a housing which is rectangular as seen in plan and has a bottom wall and four side walls. The circuit board containing the electronic components is molded into the bottom wall and connectors project therefrom into the interior of the housing. An upright rim is defined around the top of the housing onto which is secured by screws a cover which, with the bottom wall and side walls, seal the interior of the accommodation against the entry of dirt and water. The bottom wall and the side walls are preferably composed of a synthetic material and elastic material is included in one of the longer side walls. An aperture through the elastic material is provided for sealingly receiving a cable for connection to the connectors extending from the circuit board and its electronic components.

Abstract: An anisotropic conductive film 1 comprising an insulating film 2 and plural conductive paths (3, 4), wherein the plural conductive paths are insulated from each other and penetrate the insulating film 2 in the thickness direction of the film, with both ends of the paths being exposed on both surfaces of the insulating film, and wherein a conductive path 3 capable of contact with an electrode 12 of a semiconductor element 11 and a circuit 14 of a circuit board 13 has at least one end protruding more than an end on the same side of a conductive path incapable of contact with the electrode and the circuit. The ACF of the present invention can prevent a conductive path not involved in electrical connection from being in contact with a part other than an electrode of a semiconductor element and/or a part other than a circuit of a circuit board.

Abstract: An apparatus for connecting a plurality of electrical circuits borne upon a plurality of substrates is disclosed. A first substrate of the plurality of substrates has a first aperture having a first diametral displacement and a first inner wall. A portion of the first inner wall is electrically connected with a first circuit borne upon the first substrate. The apparatus comprises a sheet of electrically conductive material arranged to a displacement from an axis in a substantially helical orientation about the axis. The material has a spring characteristic when the helical orientation establishes the displacement at a spring displacement. The spring characteristic urges the conductive material to a greater displacement from the axis than the spring displacement and permits insertion of the apparatus in the first aperture. The spring characteristic and the first diametral dimension cooperate to seat the apparatus in the first aperture to establish electrical connection with the first circuit.

Abstract: It is provided an automatic MDF control system comprising: a plurality of matrix boards provided with openings in locations where a plurality of first wires and second wires cross without electrical connections; a robot which inserts electrically conductive connecting pins into the openings and connects the first wires with the second wires where the pins are inserted; a path data conversion unit converting connection requests from an operating terminal into path data having a plurality of addresses of the openings; a robot command conversion unit receiving the path data and converting the path data into robot commands for controlling activity of the robot as a distance moved by the robot moving between the plurality of addresses being reduced by a selected sequence of the converted path data; and a robot control unit controlling the activity of the robot based on the robot commands.

Abstract: A micro-zero insertion force socket is fabricated capable of connecting pins with diameters of 25 to 200 microns and minimum pitches of from 3:1 to 10:1 using micro-fabrication techniques, MEMS components, and high-density interconnections.

Abstract: A press-fit pin for use with a printed circuit board assembly consisting of two opposed printed circuit boards, the press-fit pin having an upper first press-fit section and a lower second press-fit section. The first press-fit section and the second press-fit section are disposed so that the first press-fit section enters the first through-hole in the first printed circuit board before the second press-fit section enters the second through-hole in the second printed circuit board. As a result, the peaks of the forces required to press the first press-fit section and second press-fit section into place are staggered and do not coincide, resulting in a reduction in peak total force required and thus reducing the danger of bending the press-fit pin during insertion in the printed circuit boards.

Abstract: A circuit board assembly is provided for electrically coupling together two or more circuit boards, with one circuit board oriented at an acute angle relative to the other circuit board. The assembly includes a first circuit board having a first edge and a plurality of connecting holes disposed therethrough adjacent the first edge. Each of the holes is electrically isolated from the others and each is electrically connected to electronic circuitry printed on the first circuit board. The assembly further includes a second circuit board having a first edge and a plurality of connecting holes disposed therethrough adjacent the first edge. Each of the holes of the second board is electrically isolated from the others and is electrically connected to electronic circuitry printed on the second circuit board. The assembly also includes a conductive support plate having a plurality of connecting legs extending therefrom along a first edge thereof.

Abstract: The present invention relates to a ball array capacitance minimizing layout that includes a ball array disposed upon a substrate with trace routing laid out between each ball pad and a respective bond wire pad. After routing of both signal and ground traces between the ball pads and their respective bond wire pads, at least one buffer trace is also disposed upon the substrate as a closed loop. The buffer trace may or may not be connected to ground. Preferably, buffer traces are configured to reduce the capacitance of the highest capacitance ball pads. This is accomplished by placing more of a give buffer trace around the perimeter of a higher capacitance ball pad, that around the perimeter of a lower capacitance ball pad. Accordingly, a capacitance difference between a higher capacitance ball pad and signal trace and a lower capacitance ball pad and signal trace can be minimized according to the present invention.

Abstract: A communication main layout rack structure includes a first PC board, a second PC board, several insertion seats, several pairs of insertion pins, several bus lines, several mating insertion seat, and several connectors. A central portion of the first PC board is formed with multiple copper-plated insertion holes arranged in a square pattern, while upper and lower sections of the one side edge of the first PC board are respectively formed with an insertion seat soldering section. Similarly, a central portion of the second PC board is formed with multiple copper-plated insertion holes arranged in a square pattern, while front and rear sections of an upper side edge of the second PC board are respective formed with an insertion seat soldering section, the insertion seats being soldered to the insertion seat soldering sections of the front faces of the first and second PC boards, and the mating insertion seats being respectively connected with one end of the bus lines and inserted into the insertion seats.

Abstract: An adapter of the present invention comprises two different types of connectors and an adapting device. The adapting device comprises a plurality of conducting pins and two printed circuit boards (PCBs). The two PCBs comprise a plurality of aligned through holes. The conducting pins are inserted through and retained in the aligned through holes of the two PCBs to connect the two PCBs. The two PCBs are contacted by three rows of terminals of the first type electrical connector on three of surfaces thereof near one end thereof. One of the two PCBs is straddled by two rows of terminals of the second type electrical connector on opposite surfaces of the other end thereof.

Abstract: A printed circuit terminal includes a main terminal body and an integrally formed fixing portion that is coaxial with the terminal body for mounting the terminal to a printed circuit base member. A frusto-conical flange is integrally connected between the body and the fixing portion and has a peripheral surface located in radially outward relation to the body and the fixing portion. The flange includes two surface portions. The first surface portion is adapted to contact and extend from the base member for receiving solder deposited in electrical contact with the base member. A second surface portion is axially adjacent to the first portion and exposes a different surface material than the first portion in order to restrain solder adhesion to the second surface portion.

Abstract: A method of making a wiping connection between a male connector and a female connector in a single layer of a flexible polymeric dielectric film substrate having a thickness of less than 0.012 inches is disclosed. A laser directs a beam towards the substrate cutting a smooth pattern through the substrate to define a passage extending through the substrate and providing at least one resilient foldable flap normally closing the passage through the substrate. Next an electrically conductive material is coated on the flexible polymeric dielectric film substrate including a circuit trace providing an electrical contact land area surrounding the pattern extending over the foldable flap to form the female connector.

Abstract: An integrated BEDC and PCB provided through a low cost, highly reliable interconnect system. The upper and/or lower half of the main insulation assembly of a BEDC is provided with a recess for accommodating at least an edge portion of the substrate of a PCB. The PCB is provided with apertures such as holes for receiving therethrough a buss wire and/or terminal slots through which terminals having wire slots are fixedly staked. The apertures on the PCB are arranged in a predetermined pattern so as to align with corresponding respective apertures in the form of corresponding holes and/or terminal slots on the BEDC at the recess thereof. Accordingly, with the PCB seated in the recess, as the buss wires are laid, they will pass through the holes in the PCB and/or pass through the wire slot of the terminals and thereby provide interconnection therebetween when the two halves of the main insulation assembly are united and the PCB is sandwiched therebetween.

Abstract: An interconnect structure adapts one or more signals conducted between a printed circuit board (PCB) and an integrated circuit (IC) including leads, the IC having signal requirements not provided by the PCB. The interconnect structure includes sockets that provideA. conductive paths between the circuit board and some, but not all, of the leads on the package. To adapt the signals, the interconnect structure also includes an intermediate adaptor board that includes one or more electrical components. The adaptor board and the sockets fit beneath the package containing the IC and above the PCB, and do not extend beyond the lateral boundaries of the package. Heat generated by these components during operation of the IC is dissipated through the IC package via a layer of thermally conductive material sandwiched between the component and the package.