Flexible Panel Patents (Class 439/77)
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Publication number: 20080070645Abstract: An assembly of a cable and a flexible print circuit includes a flexible print circuit, a first joining element joined to the flexible print circuit and having a profile similar thereto, and at least one cable fixed to the first joining element. A gap is formed between the first joining element and the flexible print circuit.Type: ApplicationFiled: September 20, 2007Publication date: March 20, 2008Applicants: QISDA CORPORATION, BENQ CORPORATIONInventor: Yung Tsun Hsieh
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Publication number: 20080014768Abstract: The present invention relates to a rigid-flexible printed circuit board and, more particularly, to a rigid-flexible printed circuit board including CL via holes which can facilitate electrical connection to an inner circuit pattern in a flexible region. Since the coverlays are layered on the entire surface of the double-sided FCCL without previous processing thereof, the via holes are formed in the coverlays while a drilling process is performed to form the via holes, and then the copper plating is performed over the entire surface thereof, it is possible to eliminate the cost of previously processing the coverlays, easily perform a process of provisionally layering the coverlays on the double-sided FCCL, and decrease the cost therefor.Type: ApplicationFiled: February 21, 2007Publication date: January 17, 2008Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Yang Je Lee, Il Woon Shin, Going Sik Kim, Doo Pyo Hong, Ha Il Kim, Dong Gi An
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Publication number: 20070298628Abstract: A connector includes a required number of contacts of three kinds and a housing having inserting holes for these contacts. One set of three contacts or contacts A, B and C are inserted into the same inserting hole of the housing. The contact A is inserted into the inserting hole from the side of a fitting opening of the housing, while the contact B and the contact C are inserted in parallel with each other into the inserting hole from the opposite side of the fitting opening such that the contact A and the contact C are aligned with each other and the contact A and the contact B are arranged to be staggered relative to each other, thereby bringing a flexible printed circuit board into contact with the contacts A and contacts B upon insertion of the circuit board. With this construction, narrow pitches less than 0.25 mm can be obtained, and high density can also be achieved.Type: ApplicationFiled: May 22, 2007Publication date: December 27, 2007Applicant: DDK LTD.Inventor: Masayuki Suzuki
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Patent number: 7309240Abstract: A mount structure having a substrate, a connector secured to the substrate, and a flexible printed wiring board electrically connected to the connector and spaced apart from the substrate. The flexible printed wiring board is opposed to the connector across the substrate or arranged in a space having a height generally equal to the thickness of the substrate.Type: GrantFiled: October 19, 2006Date of Patent: December 18, 2007Assignee: Kabushiki Kaisha ToshibaInventor: Kazuhito Horikiri
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Patent number: 7303400Abstract: A package of a semiconductor device with a flexible wiring substrate and a method thereof are provided. The package of the semiconductor device includes a semiconductor substrate with at least one pad on a surface thereof, a bump bonded to the pad, an adhesive layer on the bump, and a flexible wiring substrate having at least one contact section being electrically connected with the bump by the adhesive layer. The present invention makes the flexible wiring substrate directly conductively attached onto the semiconductor substrate. The package size is shrunk and the cost down can be obtained.Type: GrantFiled: January 27, 2005Date of Patent: December 4, 2007Assignee: United Microelectronics Corp.Inventors: Joseph Sun, Kuang-Chih Cheng, Ming-Chieh Chen, Kevin Lee, Jui-Hsiang Pan
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Patent number: 7297006Abstract: The invention relates to a flexible connector formed from a single layer flexible film with printed circuit lines. The flexible connector comprises a first connection means, a second connection means, a first part extending from the first connection means, wherein the first part is adapted to form a coiled part encircling a first axis, a second part extending from the second connection means, wherein the second part is adapted to form a coiled part encircling a second axis, and a third part interconnecting the first and second parts. The invention further relates to a method of manufacturing such a flexible connector, and a communication apparatus provided with such a flexible connector and comprising a first member and a second member, wherein the first and second members are mechanically connected by a two-axis hinge, and wherein circuitry of the first and second members are connected by said flexible connector.Type: GrantFiled: November 13, 2003Date of Patent: November 20, 2007Assignee: Nokia CorporationInventor: Niels Peter Emme
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Patent number: 7281953Abstract: Methods and apparatus to configure a computer to receive cards of a first or second card type are disclosed. The computer is configured through the use of an adapter including a flexible cable having a first connector adjacent one end and a second connector adjacent the other end. The computer is configured by coupling the first connector to the computer. Also, a determination is made to receive either the first or the second card types. For a determination to receive the first card type, the flexible cable is bent in a predefined manner to orient the second connector with respect to the first connector to receive the first card type. For a determination to receive the second card type, the flexible cable is bent in another predefined manner to orient the second connector differently with respect to the first connector to receive the second card type.Type: GrantFiled: August 5, 2005Date of Patent: October 16, 2007Assignee: Unisys CorporationInventors: Daniel A. Jochym, Joseph J. Scorsone
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Publication number: 20070212906Abstract: A thin multichip module comprises: a foldable frame comprising two rigid, substantially planar members capable of being folded together about a selected fold axis to form a substantially closed structure; a flex circuit having a plurality of integrated circuit chips disposed thereon, the flex circuit bonded to at least one of the planar members over at least a portion of each of their respective surfaces; and, electrodes on the module configured to be accessible to an external socket after the frame is closed. A method for making a thin multichip module comprises the steps of: a. attaching integrated circuit chips to a flex circuit; b. bonding the flex circuit to a foldable frame comprising two rigid, substantially planar members capable of being folded together about a selected fold axis to form a substantially closed structure; and, c. folding the frame approximately 180° about the fold axis.Type: ApplicationFiled: March 7, 2007Publication date: September 13, 2007Inventors: James E. Clayton, Zakaryae Fathi
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Patent number: 7267552Abstract: A signal transmission cable with adaptive contact pin reference structure includes a first cable having a connecting edge; a second cable having a connecting edge; a component lay-out section having a first lateral edge adjacent to the connecting edge of the first cable, and a second lateral edge; and an overlapping section having an inner lateral edge adjacent to the second lateral edge of said component lay-out section with a folding line formed between them, and an outer lateral edge adjacent to the connecting edge of the second cable with another folding line formed between them. Signal transmission lines included in the component lay-out section and the first cable are correspondingly connected with one another, and signal transmission lines included in the overlapping section are correspondingly connected to those included in the second cable and the component lay-out section.Type: GrantFiled: October 27, 2005Date of Patent: September 11, 2007Assignee: Advanced Flexible Circuits Co., Ltd.Inventors: Gwun-Jin Lin, Chih-Heng Chuo, Kuo-Fu Su
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Patent number: 7252520Abstract: A flex film card edge connector includes a substantially planar substrate having opposite major surfaces joined at an edge; and a flexible film wrapped around the edge and supported on both of the major surfaces. A first and second set of conductive pads are arrayed along the edges on one and the other of the major surfaces. The flexible film has a span that extends around the edge without any electrical connection between the first set of conductive pads and the second set of conductive pads. A flex film cable assembly includes a flexible film configured as an elongated strip having first and second ends, and the flex film card edge connector at least one of the ends. Methods of manufacturing both the flex film card edge connector and the flex film cable assembly are also disclosed.Type: GrantFiled: April 25, 2006Date of Patent: August 7, 2007Assignee: Tyco Electronics CorporationInventors: Steven Jay Millard, Michael Warren Fogg
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Publication number: 20070173084Abstract: A board-to-board connecting structure (100) includes a flexible circuit board (10) and a substrate (210) fixed to the flexible circuit board (10). The substrate (210) has a plurality of first pads (212) and a plurality of first connecting sheets (214) disposed thereon, and the flexible circuit board has a plurality of second pads (112) and a plurality of second connecting pads (114) disposed thereon. The first pads are fixed to the second pads, and the first connecting sheets are fixed to the second connecting sheets.Type: ApplicationFiled: September 22, 2006Publication date: July 26, 2007Applicant: ALTUS TECHNOLOGY INC.Inventor: YUAN-PO WANG
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Patent number: 7248481Abstract: Circuit board and system with multi-portion sockets, and signal methods practiced thereon are described herein.Type: GrantFiled: June 24, 2004Date of Patent: July 24, 2007Assignee: Intel CorporationInventor: Mark B. Trobough
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Patent number: 7234945Abstract: There is provided a technique in which when a display apparatus is assembled, workability of an operation for fixing a printed circuit board disposed at an outer peripheral part of a display panel to a support member can be improved. The display apparatus includes a display panel, a flexible printed wiring board connected to the display panel, a printed circuit board connected to the flexible printed wiring board, and a support member to support the display panel and the printed circuit board. The printed circuit board is supported at a side surface of the support member by bending the flexible printed wiring board, the support member includes, at the surface for supporting the printed circuit board, a first support part to support a second end side of the printed circuit board opposite to a first end to which the flexible printed wiring board is connected and a projection-like second support part provided outside an area where the printed circuit board is supported.Type: GrantFiled: November 21, 2006Date of Patent: June 26, 2007Assignee: Hitachi Displays, Ltd.Inventors: Yuji Azuma, Masaki Tsubokura
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Patent number: 7212413Abstract: An electronic device with flexible printed circuit board structure. The electronic device includes a first flexible printed circuit board and a second flexible printed circuit board. The first flexible printed circuit board has a first bent portion. The second flexible printed circuit board has a second bent portion penetrating the first bent portion as the first and the second flexible printed circuit boards are bent simultaneously.Type: GrantFiled: May 12, 2004Date of Patent: May 1, 2007Assignee: AU Optronics Corp.Inventors: Che-Chih Chang, Chia-Jung Wu
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Patent number: 7168961Abstract: An expansible interface for expanding different kinds of data from a primary printed circuit board (PCB) (1) to a subsidiary PCB (2), the primary PCB is fixed with board-to-board connectors (13, 14) and flexible printed circuit (FPC) connectors (11, 12), and the subsidiary PCB is fixed with the corresponding board-to-board connectors (23, 24) and the corresponding FPC connectors (21, 22). The board-to-board connectors are directly electrically connected with each other for transmitting a data that is not a Peripheral Component Interconnect (PCI) data from the primary PCB to the subsidiary PCB; the FPC connectors are electrically connected with each other via cables (31, 32) for transmitting the PCI data from the primary PCB to the subsidiary PCB.Type: GrantFiled: April 26, 2005Date of Patent: January 30, 2007Assignee: Hon Hai Precision Industry Co., Ltd.Inventor: Ming-Chih Hsieh
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Patent number: 7160119Abstract: A method and apparatus for achieving a very fine pitch interconnect between a flexible circuit member and another circuit member with extremely co-planar electrical contacts that have a large range of compliance. An electrical interconnect assembly that can be used as a die-level test probe, a wafer probe, and a printed circuit probe is also disclosed. The second circuit member can be a printed circuit board, another flexible circuit, a bare-die device, an integrated circuit device, an organic or inorganic substrate, a rigid circuit and virtually any other type of electrical component. A plurality of electrical contacts are arranged in a housing. The electrical contacts may be arranged randomly or in a one or two-dimensional array. The housing acts as a receptacle to individually locate and generally align the electrical contacts, while preventing adjacent contacts from touching. The first ends of the electrical contacts are electrically coupled to a flexible circuit member.Type: GrantFiled: November 17, 2004Date of Patent: January 9, 2007Assignee: Gryphics, Inc.Inventor: James J. Rathburn
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Patent number: 7159306Abstract: A modular rotary anvil for mounting on an ultrasonic welding machine. The modular rotary anvil includes a first end segment configured to attach to the ultrasonic welding machine, a second end segment configured to attach to the ultrasonic welding machine, and at least one insert having a first side and a second side. Each of the first side and the second side is configured to attach to at least one of other inserts, the first end segment, and the second end segment.Type: GrantFiled: October 29, 2004Date of Patent: January 9, 2007Assignee: Methode Electronics, Inc.Inventors: Tom Schilson, Steve Kamps
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Patent number: 7104834Abstract: The present disclosure relates to a connector for electromechanically connecting an electrosurgical cable to a flexible circuit board of a surgical instrument. The connector includes a fixed portion having a cavity defined therein which includes a wire guide block. A series of wire slots are defined within the wire guide block wherein each wire slot is dimensioned to receive a respective conductive wire disposed within the electrosurgical cable. The connector also includes a cap portion designed for selective, friction-fit engagement with the cavity of the fixed portion. The cap portion includes a series of detents which define a corresponding series of slots therebetween for wedging the conductive wires of the cable against a series of corresponding terminal contacts disposed on the flexible circuit board.Type: GrantFiled: February 3, 2004Date of Patent: September 12, 2006Assignee: Sherwood Services AGInventors: William Robinson, Joe D. Sartor, Gene H. Arts
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Patent number: 7056134Abstract: A attachable/detachable probing tip system (10) has a housing (12) that includes a probing tip mounting member (14) and opposing substantially orthogonal attachment (16, 18) arms extending from the probing tip mounting member. The attachment arms define an inner surface of the probing tip mounting member in which is disposed at least a first a non-compressive set, resilient member (56). First and second probing tips (42, 44) are disposed over the non-compressive, resilient member (56) and secured to the housing by latching means (60, 66, 92, 96, 100, 130). The attachable/detachable probing tip system allows mounting of the probing tips (42, 44) to probing contacts on a device under test without a probe body or probing tip member (38) being attached. The attachment arms (16, 18) allows a probe body or probing tip member (38) to be attached and detached to the probing tip system (10). The probing tip member (38) includes contact pins that engage contact areas (82, 82, 92) of the probing tips (42, 44).Type: GrantFiled: May 27, 2004Date of Patent: June 6, 2006Assignee: Tektronix, Inc.Inventors: Jim L. Martin, Marc A. Gessford, William R. Pooley, William Q. Law, Ira G. Pollock, William A. Hagerup
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Patent number: 7037114Abstract: The present invention is related to a flexible circuit connector as well as a system using the connector. The present invention further includes an electrical case comprising part of the flexible circuit connection system. Various embodiments of each the flexible circuit connector, flexible circuit system and electrical packaging integrated with the flexible circuit system of the present invention are possible. The flexible circuit connector of the present invention takes advantage of the stiffness of the flexible circuit to bias the circuit against leads in the connector. The flexible circuit connector can also be designed to provide for polarization (or only one means) to connect to the connector. In particular embodiments the connector can be designed into a circuit board, an electrical case or housing or into other types of connectors.Type: GrantFiled: January 21, 2005Date of Patent: May 2, 2006Assignee: Cleveland Medical Devices Inc.Inventors: Jay Eiger, Matthew Tarler
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Patent number: 7033187Abstract: An electrical connection and a method of electrically coupling are disclosed. In one embodiment, a circuit substrate with a first set of circuitry has a bonding pad mounted to a surface of the circuit board. The bonding pad is electrically coupled to the first set of circuitry. A flexible circuit substrate with a second set of circuitry has a connecting pad mounted to a surface of the flexible circuit substrate facing the surface of the circuit board. The connecting pad is electrically coupled to the second set of circuitry. A ball of conductive material is mounted on the bonding pad. A clamping device presses the connecting pad to the ball of conductive material.Type: GrantFiled: January 26, 2004Date of Patent: April 25, 2006Assignee: SAE Magnetics (H.K.) Ltd.Inventors: Li Xing Wu, Liu Jun Zhang
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Patent number: 7001187Abstract: The junction box housing of a junction box is provided with a strip portion containing portion which contains a lateral edge of a strip portion where a terminal connecting portion of a flexible printed circuit is contained in the inside and a terminal containing hole arranged at the outside of the strip-shaped portion containing portion which contains a first connecting terminal. Thus, the first connecting terminal and the strip portion can be contained in the junction box housing with the terminal connecting portion bent to show an S-shaped profile so that the junction box main body can be made lightweight and low-profiled to realize downsizing.Type: GrantFiled: November 18, 2003Date of Patent: February 21, 2006Assignee: Fujikura Ltd.Inventors: Ichiro Terunuma, Atsushi Momota, Hideyuki Kosugi, Nobumasa Misaki
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Patent number: 6991473Abstract: An electrical connector includes connector pads on a printed circuit board and contact members on an insulating substrate. The contact members are pressed against the contact pads by a compression mat having compressor fingers. A clamping arrangement forces the compressor fingers against the substrate and thereby presses the contact members against the contact pads. To counteract the inherent tendency of the compressor fingers to undergo stress relaxation after the compressor mat has been clamped, the connector also includes filler members disposed at least partially within the compressor fingers, essentially a “button-within-a-button” arrangement. Optionally, a filler deflection member may be interposed between the compression mat and a clamping plate of the clamping arrangement so that the filler deflection member abuts against the filler members. Alternatively, the filler members may be integral features of the deflection member.Type: GrantFiled: November 30, 2004Date of Patent: January 31, 2006Assignee: International Business Machines CorporationInventors: Gregory Ervin Balcome, Joseph Kuczynski, Kevin Albert Splittstoesser, Timothy Jerome Tofil, Paul Alan Vermilyea
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Patent number: 6898852Abstract: A connector assembly is disclosed and claimed. The connector assembly includes a connector and a cable attachable at one end to the connector. The cable includes a first conductive layer and a second conductive layer disposed over the first conductive layer. A layer of insulation material is disposed at least between the first conductive layer and the second conductive layer and a plurality of capacitors are connected between the first conductive layer and the second conductive layer.Type: GrantFiled: August 25, 2003Date of Patent: May 31, 2005Assignee: Intel CorporationInventors: Nader N. Abazarnia, Jeffrey H. Luke, James Neeb
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Patent number: 6840783Abstract: A press-fit bus-bar for distributing power along a backplane or a printed circuit board includes a number of flat bus bar conductors fabricated from an electrically conductive material. Each bus bar conductor is separated from adjacent bus bar conductors by layers of an insulating material. A number of electrically conductive press-fit tails protrude from one edge of each bus bar conductor. When the laminated bus bar conductors and insulating material layers are placed in a housing which is then filled with a hardened epoxy resin, the press-fit tails protrude from the surface of that epoxy resin. These protruding tails can be press-fit in a backplane(s) or printed circuit board(s) for the purpose of supplying these backplane(s) or printed circuit board(s) with electric power.Type: GrantFiled: September 11, 2002Date of Patent: January 11, 2005Assignee: FCI Americas Technology, Inc.Inventors: Gerald Wolford, James Mills, Steven E. Minich, Christopher J. Kolivoski, John D. Dodds, James R. Volstorf, Wilfred J. Swain, James S. Staron
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Patent number: 6819045Abstract: A display device comprises a display pail having a flexible panel substrate serving as a display elements disposed lengthwise and breadthwise on a surface opposite to the display screen of the panel substrate; and driving circuit parts having flexible driving circuit substrates on which semiconductor elements made of flexile semiconductor materials are mounted. Accordingly, the completely flexible display device in which not only the display part, but also the driving circuit parts have flexibility can be provided.Type: GrantFiled: September 6, 2001Date of Patent: November 16, 2004Assignee: Sony CorporationInventors: Hiroyuki Okita, Junichi Ohsako, Kazuhito Shimoda
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Patent number: 6811431Abstract: A connector for connecting a contact pad of a flexible printed circuit board against terminals of an electronic component comprises a body and a reinforcing plate, wherein the body is combined with the electronic component and two parallel sliding channels are mounted on the body corresponding to two sides of the terminals of the electronic component, and the reinforcing plate is combined with the contact pad of the flexible printed circuit board so as to increase the stiffness of the contact pad, and two sides of the reinforcing plate cooperate with the two parallel sliding channels of the body, thereby connecting the contact pad of the flexible printed circuit board against the terminals of the electronic component.Type: GrantFiled: October 21, 2003Date of Patent: November 2, 2004Assignee: Benq CorporationInventor: Yung-Tsun Hsieh
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Patent number: 6808422Abstract: A filter insert for a terminal connector includes a rigid substrate and low-cost interference fit connections between the filter insert circuitry and the connector terminals. In a first embodiment, the insert includes a flexible circuit bonded to the rigid substrate, and the substrate is provided with over-sized openings that the terminals pass through without interference. A second embodiment is like the first, except that the filter circuit traces are formed directly on the rigid substrate, and the substrate material backing the terminal connection sites is removed to form the over-sized openings.Type: GrantFiled: March 19, 2003Date of Patent: October 26, 2004Assignee: Delphi Technologies, Inc.Inventor: Mahesh K. Chengalva
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Patent number: 6802721Abstract: An electronic device includes a circuit board, a flexible printed wiring board, and an electric connector. The circuit board includes an electronic circuit. The flexible printed wiring board is electrically connected to the electronic circuit. The electric connector includes a plurality of leads and a connector body. Each lead has a substantially straight end and a bent end. A surface of the connector body is substantially parallel to a surface of the flexible printed wiring board. Each bent end of the leads is located on the surface of the connector body to be substantially parallel to the surface of the flexible printed wiring board. The connector is electrically connected to the flexible printed wiring board using the leads. With the structure of the connector, the circuit board and the electric connector is relatively readily connected by the flexible printed wiring board in the manufacturing process of the electronic device.Type: GrantFiled: January 27, 2003Date of Patent: October 12, 2004Assignee: Denso CorporationInventors: Kazuya Sanada, Toshiaki Yagura, Satoru Kawamoto, Akihiro Yanagisawa
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Patent number: 6781230Abstract: A flat circuit device without additional terminals can be connected with a connector. An insulator includes a bent portion and a laminated portion of a first and a second insulators forming the bent portion, and ends of a first conductor and a second conductor extend straightly at the bent portion along a curved surface of the bent portion. Thereby, the first conductor and the second conductor are formed straightly in parallel on an outer surface of the bent portion so that the bent portion performs as a connecting terminal.Type: GrantFiled: July 16, 2002Date of Patent: August 24, 2004Assignee: Yazaki CorporationInventor: Masashi Tsukamoto
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Patent number: 6749442Abstract: A flexible circuit board connecting device comprises a flat connector (10) to be connected to a predetermined circuit member, a flexible circuit board (1) to be connected to the circuit member via the connector (10). The connector (10) comprises a flat housing having a plurality of holding holes (12), a plurality of terminals (14) held in the holding holes (12). Each terminal (14) has a connection section (14A) to be connected to the circuit board and a contact section (14D) to be connected to the flexible circuit board. The contact points between the flexible circuit board and the terminals are made movable along the flexible circuit board from the zero insertion position to the contact position under spring forces.Type: GrantFiled: October 15, 2002Date of Patent: June 15, 2004Assignee: Hirose Electric Co., Ltd.Inventor: Tsutomu Matsuo
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Patent number: 6723928Abstract: An electronic device includes a flat flexible dielectric substrate less than 0.050 inch thick and having a generally round hole of a given diameter. A substantially square or polygonal terminal pin is inserted into the round hole in the substrate. The pin has a given cross-dimension between opposite diametral corners thereof greater than the diameter of the round hole. The difference between the cross-dimension of the pin and the diameter of the round hole is on the order of 7% to 67% of the diameter of the hole.Type: GrantFiled: September 29, 1997Date of Patent: April 20, 2004Assignee: Molex IncorporatedInventors: Paul Christopher Berg, Harry N. Etters, Robert M. Fuerst, Todd A. Hester, Fred Love Krehbiel
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Patent number: 6712620Abstract: A board-to-board connector system is provided that may be used with a flex circuit, interposer, or polymer housing that includes a plurality of contacts that are arranged in an array. Each of the plurality of contacts includes a resilient body. A first conductor is provided that includes at least one wire formed in a spiral extending continuously through the resilient body, and having electrically accessible first and second ends. The first conductor is electrically connected to at least one of a plurality of signal conductor traces on a printed wiring board or the like. A second conductor is provided that includes at least one wire formed in a spiral extending continuously through the resilient body, and having electrically accessible first and second ends. The first conductor and the second conductor are in spaced apart relation to one another, and the second conductor is electrically connected to at least one of the plurality of ground path conductors arranged on the printed wiring board.Type: GrantFiled: September 12, 2002Date of Patent: March 30, 2004Assignee: High Connection Density, Inc.Inventors: Che-Yu Li, Zhineng Fan, Dirk D. Brown
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Patent number: 6705005Abstract: A method of forming a circuit board with electronic assemblies lying in different planes, includes providing a single circuit board with entire electronic assemblies pressed thereon. A channel is then formed in the circuit board of a predetermined depth to divide the circuit board into two separate, but integral portions. The circuit board is then bent at a point between the first and second portions of the circuit board such that the second portion of the circuit board can be bent between 0 and 180 degrees with respect to the first portion of the circuit board.Type: GrantFiled: February 12, 1999Date of Patent: March 16, 2004Assignee: Delphi Technologies, Inc.Inventors: Michael Wayne Blazier, Frank Martin Stephan
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Patent number: 6700075Abstract: A reduced noise ultrasound piezo film array on a printed circuit board. A printed circuit board carries a piezo array on one end and a standard coupling at the other end. The board is made in four layers with the two external layers being ground planes to prevent noise pickup. The two internal layers carry printed circuit lines between various elements of the array and terminals of the connector. The various arrays are sequentially scanned. All of the lines except the one selected are connected to ground to prevent crosstalk and noise pickup.Type: GrantFiled: January 10, 2001Date of Patent: March 2, 2004Assignee: Cavitat Medical Technologies, Ltd.Inventor: James H. Gordon
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Patent number: 6695641Abstract: A cable connector assembly (10) includes an electrical connector (12), a printed circuit board (14), a cable (16) and a plurality of power wires (18). The electrical connector has a housing (24) and a plurality of signal contacts (26) and power contacts (28) mounted in the housing. The cable contains a plurality of center conductors (160) each electrically connecting with a corresponding signal contact. The printed circuit board is received in the housing. The power contacts and the power wires are respectively electrically mounted on the printed circuit board to provide power transmission therebetween. A cover (22) is designed to over-mold the structural connection portion of the electrical connector, the printed circuit board, the cable and the power wires. The cable connector assembly is finally assembled on a panel (20) by a pair of screws (80).Type: GrantFiled: December 24, 2002Date of Patent: February 24, 2004Assignee: Hon Hai Precision Ind. Co., Ltd.Inventor: George Lee
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Patent number: 6685484Abstract: An electrical connector is provided for a flat circuit which has at least one pin-receiving hole therein and a conductor on a side thereof about the hole. A dielectric circuit support member supports the flat circuit and has a pin-receiving hole in registry with the hole in the flat circuit. A conductive terminal includes a pin portion insertable through the hole in the flat circuit and into the hole in the support member. A wing portion projects laterally of the terminal for engaging the conductor on the flat circuit. The hole in the support member is sized relative to the pin portion of the terminal to establish an interference fit therebetween and to maintain the wing portion in compressive engagement with the conductor of the flat circuit.Type: GrantFiled: November 1, 2001Date of Patent: February 3, 2004Assignee: Molex IncorporatedInventor: Frank T. Keyser
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Patent number: 6679713Abstract: A connector (1) for a flexible circuit board (30) has a housing (2), a pressing means (12), and parallel contacts (6) each having a conductive arm (8) and arranged at a pitch to form a row in the recess (3) of the housing. The pressing means (12) can be swung to close the recess so that an inner end portion of the flexible board (30) overlying the conductive arms (8) will be pressed down onto these arms. Reinforcement metals (20) face one another over the row of the contacts (6) and are attached to opposite sides (5) of the housing (2), so as to be soldered to a rigid printed circuit board. Each reinforcement metal (20) has a resilient support (25) for urging upwards the flexible board (30) in a direction away from the conductive arms (8) so as to keep the board in place.Type: GrantFiled: September 20, 2002Date of Patent: January 20, 2004Assignee: J.S.T. Mfg. Co., Ltd.Inventor: Kazuto Miura
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Patent number: 6648675Abstract: A method for fitting a carrier with a cable harness having main and branch conductors and with a device. A contact element is arranged on the carrier. A top portion of the main conductor, a bottom portion of a first end of the branch conductor, and a top portion of a second end of the branch conductor are exposed. The conductors are arranged on the carrier with the main conductor lying on the carrier, the exposed bottom portion of the branch conductor contacting the exposed top portion of the main conductor, and the exposed top portion of the branch conductor placed on the contact element for realizing a plug connector. The carrier is fitted with a device having a plug connector such that the device is electrically connected to the branch conductor and mechanically connected to the carrier via a connection between the plug connector and the contact element.Type: GrantFiled: June 28, 2002Date of Patent: November 18, 2003Assignee: Leopold Kostal GmbH & Co. KGInventors: Jorg Welschholz, Roland Drees, Norbert Bendicks, Detlef Kerkmann, Berthold Eesders
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Patent number: 6638080Abstract: An integrated probe assembly provides the capability to test integrated circuit (IC) packages mounted onto ball grid arrays. The present invention comprises an unsealed BGA socket (102), nail head pins (107) which can be inserted flush into a pin carrier to produce a PGA header (103), a Flex circuit assembly comprising a piece of flexible circuit (104) with various passive resistors and connectors attached and solder preforms (113) used to solder the flex assembly to the pin grid array. Matched impedance connectors (105) are attached at an end of the flexible circuit.Type: GrantFiled: January 18, 2001Date of Patent: October 28, 2003Assignee: Agilent Technologies, Inc.Inventors: Kenneth W Johnson, Brent A. Holcombe
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Patent number: 6634892Abstract: An electrical connector housing includes a first shell carrying connector mounts, fuse mounts and relay mounts. A second shell comprises second connector mounts, and fitted to the first shell. The electrical connector housing contains a connector circuitry module, a fuse circuitry module, a relay circuitry module and a printed board. The connector circuitry module includes connector-connecting circuitry formed of a first bus bar stack and a flexible printed board, while the fuse circuitry module includes fuse-connecting circuitry formed of a second bus bar stack. Likewise, the relay circuitry module includes relay-connecting circuitry formed of a third bus bar stack.Type: GrantFiled: August 6, 2001Date of Patent: October 21, 2003Assignee: Sumitomo Wiring Systems, Ltd.Inventor: Masayoshi Nakamura
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Patent number: 6609916Abstract: A band-like conductor connecting connector comprises a second connector 6 which is inserted into a first connector 2 to release a temporarily locked state between the first connector 2 and the holder 1, and which pushes the band-like conductor together with the first connector 2 toward a bottom of the holder 1, wherein in a process during which the second connector 6 pushes the first connector 2 toward the bottom of the holder 1, a plurality of terminal metal fittings 19 provided on a tip end of the second connector 6 push the band-like conductor 5 into the bottom of the holder 1 while scrubbing the exposed wire conductor patterns.Type: GrantFiled: August 9, 2001Date of Patent: August 26, 2003Assignee: Yazaki CorporationInventor: Toshiaki Okabe
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Patent number: 6599135Abstract: A power distributor having a power distribution circuit, and a housing 22 in which the power distribution circuit is housed, and a method of connecting a control circuit board 18 to the power distributor. A board support portion 32 for supporting the control circuit board 18 in an erect state is provided in the housing 22. The control circuit board 18 and the power distribution circuit are connected to each other through a wiring material 30 in the condition that the control circuit board 18 is supported by the board support portion 32. Then, the control circuit board 18 is toppled over to thereby be housed in the housing 22.Type: GrantFiled: July 17, 2001Date of Patent: July 29, 2003Assignees: Autonetworks Technologies, Ltd., Sumitomo Wiring Systems, Ltd., Sumitomo Electric Industries, Ltd.Inventor: Shigeki Yamane
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Patent number: 6597580Abstract: A shielded serpentine extension, internal signal path and receptor result in a flexible shielded interface for a circuit board that can be formed consistent with efficient circuit board fabrication processes. The shielded serpentine extension, continuous with the circuit board, has a receptor at an end that is distal from the circuit board. The receptor has a signal contact and a shield contact adapted to receive a surface mount connector. A signal path internal to the serpentine extension couples the signal contact of the receptor to the circuit board. The serpentine extension has shielding disposed about the signal path that couples the shield contact to the circuit board.Type: GrantFiled: November 30, 2001Date of Patent: July 22, 2003Assignee: Agilent Technologies, Inc.Inventors: Leonard M. Weber, Terrence R. Noe
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Patent number: 6573609Abstract: A connection component is provided. The connection component includes (1) a first interposer having a first surface to which a microelectronic may be mounted and a second surface opposite from the first surface, (2) a second interposer that is more flexible than the first interposer and that is disposed under the second surface of the rigid interposer, and (3) a plurality of conductive parts that may be positioned in the first and second interposers and that may be exposed at the first surface of the first interposer, a bottom surface of the second interposer, or both the first and bottom surfaces. The electrically conductive parts may include leads. A socket assembly or a microelectronic element such as semiconductor chip may be mounted onto the first surface of the rigid interposer. The connection component may be mounted onto a support substrate.Type: GrantFiled: January 26, 2001Date of Patent: June 3, 2003Assignee: Tessera, Inc.Inventors: Joseph Fjelstad, John Myers
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Patent number: 6486410Abstract: The present invention uses the resilient behaviour of a flexible printed circuit board (10), both to mechanically clamp the components (20) in a permanent manner and to achieve good electrical contacts (24) between conducting parts (12) of the flexible circuit board (10) and the components (20). By cutting the flexible printed circuit board in such a manner that small tab-like, resilient members (12,16) are formed, the forces caused by elastically deformed resilient members (12,16) are usable both for mechanically fixing the components (20) and for causing an electrical contact (24). By choosing appropriate sizes of the resilient members (12,16), the relative strength of the spring force is increased, which even will be large enough to cause a plastic deformation of the material in the contact points (24) between the conducting resilient members (12) and the component contact members (22). In such a manner, soldering or gluing may be totally omitted.Type: GrantFiled: July 20, 2001Date of Patent: November 26, 2002Assignee: Piezomotors Uppsala ABInventors: Stefan Johansson, Staffan Karlsson
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Publication number: 20020137369Abstract: The present invention relates generally to a new apparatus and method for a land grid array electronic module. The land grid array electronic module packaging assembly includes a substrate member upon which electronic components are mounted and which is permanently fastened to an frame member that engages an alignment and mounting feature of an underlying socket. The frame member is sized to overlap the substrate member on at least two opposing edges thereof, and is permanently affixed to the substrate member by an adhesive applied to the overlap. The assembly arrangement allows a permanently correct alignment of the substrate to the underlying socket at minimal expense in valuable substrate top surface real estate. The adhesive accommodates the different thermal expansions between the substrate member and frame member.Type: ApplicationFiled: March 21, 2001Publication date: September 26, 2002Applicant: International Business Machines CorporationInventors: David Linn Edwards, Michael Joseph Ellsworth, John G. Torok, Hilton T. Toy, Jeffrey Allen Zitz
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Patent number: 6449821Abstract: A method for constructing a connection assembly for use in a multiple aperture ultrasonic tranducer including an array of elements for transmitting or receiving signals, wherein each element is comprised of a plurality of segments, and the connection assembly for interconnecting the segments of each elements and for connecting the segments to transmit/receive circuitsto form the aperatures of the array. An isolating layer is superimposed on the segments of the array and a plurality of via openings are formed through the isolating layer. At least one via opening being assocated with each segment of the array and each via opening exposing an area of an assocated segment. A conductive layer is superimposed on the isolating layer, the conductive layer having conduxtive paths interconnecting the segments and connecting the segments to the transmit/receive circuits to form the apertures of the array.Type: GrantFiled: August 12, 1999Date of Patent: September 17, 2002Assignee: Koninklijke Philips Electronics, N.V.Inventors: Wojtek Sudol, Francis E. Gurrie
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Patent number: 6431881Abstract: An electrical connector includes a connector housing formed of a connector body carrying contact pins and a fixing part. A receiving gap for a foil conductor is formed between the connector body and the fixing part. At least some of the contact pins carry at least one contact element protruding into the receiving gap to make contact with a conductor track of the foil conductor. The fixing part is in the form of a sleeve and receives at least one longitudinal portion of the connector body, in an assembled state. The receiving gap, which is formed by an inner surface of the fixing part and a peripheral surface of the connector body, at least partially encloses the connector body.Type: GrantFiled: February 26, 2001Date of Patent: August 13, 2002Assignee: Leoni Bordnetz-Systeme GmbH & Co. KGInventors: Jürgen Engbring, Ulrich Grzesik, Guido Renner
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Patent number: 6427019Abstract: A speaker assembly comprising a speaker housing, a speaker mounted in the housing, and at least two threaded studs connected to the housing and speaker and extending away from the external surface of the housing. The studs have an unthreaded, pointed end that is particularly suitable for piercing a ceiling tile with little effort or mess. There are at least two nuts for threading over the studs to secure the studs to a ceiling tile after the studs pierce the tile to attach the housing to the tile, and at least two wire nuts to connect amplifier wires to the tip of the studs. The speaker is mounted to a ceiling tile by piercing the tile with the studs and securing the studs to the other side of the tile with the nuts. The amplifier wires are then connected to the tips of the studs via the wire nuts.Type: GrantFiled: January 14, 2000Date of Patent: July 30, 2002Assignee: Bogen Communications, Inc.Inventors: Ernest Ketterer, Anthony Farinaro, William Kieltyka