Flexible Panel Patents (Class 439/77)
  • Patent number: 5426568
    Abstract: A launch-protected electronic assembly including a printed circuit board having several conductor paths. An electronic component is provided that is secured to the printed circuit board. The electronic component has several electrical connections each contacting a corresponding conductor path. The assembly further includes a support and at least one of a flexible adhesive layer and a dot-shaped flexible adhesive location connecting the printed circuit board to the support.
    Type: Grant
    Filed: December 23, 1993
    Date of Patent: June 20, 1995
    Assignee: Rheinmetall GmbH
    Inventors: Johannes Lamers, Norbert von der Lippe, Peter Sommer, Dietmar Stoffels
  • Patent number: 5421741
    Abstract: An electrical connection assembly for providing a variety of input/output connections between electrical conductors and connectors. An electrical path is established between insulation displacement contacts positioned on a printed circuit board and one or more connectors connected to the board. The insulation displacement contacts are pre-arranged on the board in accordance with the board circuitry to provide a desired input/output arrangement. The conductors are terminated at the insulation displacement contacts on the board in a simple manner without a complex assembly and pre-arrangement of the conductor wires.
    Type: Grant
    Filed: August 20, 1993
    Date of Patent: June 6, 1995
    Assignees: Berg Technology, Inc., Connector Systems Technology, N.V.
    Inventors: James J. David, Steven K. Forman, Ralph A. Papa
  • Patent number: 5418691
    Abstract: A printed circuit board device comprising at least two printed circuit boards in superposition to connect their interconnection patterns, and a positioning member for putting the two boards into registry when being superimposed, the positioning member including a hole provided in one of the boards, an extension provided on the other board and arranged to be inserted into the hole, and a pair of marks for position registry provided on the respective boards.
    Type: Grant
    Filed: November 18, 1992
    Date of Patent: May 23, 1995
    Assignee: Canon Kabushiki Kaisha
    Inventor: Go Tokura
  • Patent number: 5415556
    Abstract: A connector module for connecting at least one of an input device and an output device to a multi-wire bus including a first stage supporting the multi-wire bus, a second stage having an IC chip mounted on a lead frame, the lead frame including first electrical connections for connecting the input and output devices to the IC chip and second electrical connections including a plurality of stamped metal contacts that are bent with one end formed for an insulation displacement contact with multi-signals between the multi-wire bus and the input and output devices, and a stage fastener for interlocking the first stage to the second stage. Also disclosed are a first plurality of conductive patterns for connecting the input and output devices to the IC chip, and a second plurality of conductive patterns for connecting the multi-wire bus to the IC chip the second plurality of conductive patterns including button contacts for conveying signals between the multi-wire bus and the input and output devices.
    Type: Grant
    Filed: December 6, 1993
    Date of Patent: May 16, 1995
    Assignee: Xerox Corporation
    Inventor: Ross E. Schroll
  • Patent number: 5414220
    Abstract: Disclosed herein is a flexible wiring cable being provided on its forward end with a connecting portion to be connected with a connector, which comprises a base film, a wiring conductor provided on the base film, a dielectric member electrically connected with the wiring conductor in the connecting portion of the base film, and a ground electrode electrically connected with the dielectric member for forming a capacitor with the wiring conductor.
    Type: Grant
    Filed: October 19, 1993
    Date of Patent: May 9, 1995
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Yoshio Hanato, Toshio Hori, Hiromichi Tokuda, Toshimi Kaneko
  • Patent number: 5411402
    Abstract: A connector assembly is provided, which is compact and of light weight and which can lock to the rear of an IC (integrated circuit) card. The assembly includes a frame (54, FIG. 2 ) with a wide front portion (56) and a narrower rearward extension (90) that has a horizontal groove (92). A circuit board (74) has a slot (100), with opposite walls of the circuit board slot received in opposite groove parts of the frame rearward extension. A cable (20) whose front end is held to the rear of the board, has insulated wires (70) held in place against the board by tabs (120) projecting from the rearward extension. A pair of bendable latching arms (34, 36) project forwardly from the front of the frame for reception in a central aperture at the rear of the IC card. The frame has a central opening through which a locking pin (150) can slide to lock the arms in the IC card.
    Type: Grant
    Filed: December 17, 1993
    Date of Patent: May 2, 1995
    Assignee: ITT Corporation
    Inventor: Gary C. Bethurum
  • Patent number: 5411399
    Abstract: A connector connecting two circuit boards of different types comprises an insulative male housing which houses conductive plug contacts therein, a circuit board having conductive receptacle contacts engaged with the housing and making electrical connection with the plug contacts, and a flexible conductor engaged with the housing and making electrical connection with the plug contacts.
    Type: Grant
    Filed: February 11, 1993
    Date of Patent: May 2, 1995
    Assignee: Thomas & Betts Corporation
    Inventors: Hideki Okuyama, Masahiro Yamamoto, Toshimitsu Sonobe
  • Patent number: 5386342
    Abstract: An integrated circuit device package of this invention includes a flexible substrate having an upper patterned insulative layer, and a lower patterned conductive layer including a plurality of package leads. An integrated circuit die is fixed within a void of the upper surface of the flexible substrate, and is provided with electrical connections to the package leads. A rigid upper protective layer is provided to substantially enclose the integrated circuit die, and at least partially cover the top surface of the upper insulative layer. The integrated circuit device package further comprises a rigid or semi-rigid lower protective layer opposite the upper protective layer. The rigid lower protective layer is prefomed, and preferably is made from a material selected from the group consisting of rigid ceramic, glass, plastic, and combinations thereof.
    Type: Grant
    Filed: December 23, 1993
    Date of Patent: January 31, 1995
    Assignee: LSI Logic Corporation
    Inventor: Michael Rostoker
  • Patent number: 5384435
    Abstract: An electronic device includes a flat flexible dielectric substrate which is less than 0.050 inch thick and has a generally round hole of a given diameter. A ductile conductive film is deposited on the substrate in an area at least about the hole. A generally round terminal pin is inserted into the hole in the substrate in contact with the conductive film. The pin has a given diameter greater than that of the hole. The difference between the diameter of the pin and the diameter of the hole is on the order of 5% to 50% of the diameter of the hole.
    Type: Grant
    Filed: January 28, 1994
    Date of Patent: January 24, 1995
    Assignee: Molex Incorporated
    Inventors: Robert M. Fuerst, Fred L. Krehbiel
  • Patent number: 5378161
    Abstract: An electrical connector includes a male plug having preferably two tapered major surfaces and a female receptacle having walls corresponding in taper to the major surfaces of the male plug. The male plug is adapted to terminate a ribbon cable and may be formed by a tapered circuit board or a tapered form around which conductors of a ribbon cable are bent. The female receptacle is lined with a flexible circuit for contact to the male plug and connection to a circuit board.
    Type: Grant
    Filed: August 4, 1993
    Date of Patent: January 3, 1995
    Assignee: Minnesota Mining and Manufacturing Company
    Inventor: Harry A. Loder
  • Patent number: 5378982
    Abstract: A test probe for use in testing a liquid crystal display device includes a rigid carrier block (20) having a lower surface to which is secured a flexible circuit (44) having a free end (50) aligned with the free end (26) of the carrier block. A plurality of projecting probe contact features (54) are integrally formed on traces (56) of the flexible circuit (44) and project from the plane of the flexible circuit adjacent the free end. An elastomeric back-up pad (40) is interposed between the carrier block (20) and the projecting contact features (54). The lower side of the carrier block is recessed (30) and the flexible circuit is pre-formed to the configuration of the recess in which it is mechanically secured by a rigid clamp or pressure bar (60). Conductive traces (56) of the flexible circuit have inner ends (58) bearing electrical contacts (68) for connection to test circuitry.
    Type: Grant
    Filed: February 25, 1993
    Date of Patent: January 3, 1995
    Assignee: Hughes Aircraft Company
    Inventors: Haim Feigenbaum, John S. Szalay, Blake F. Woith
  • Patent number: 5376009
    Abstract: A high density connector (12 ) for connecting to circuitry on a flexible circuit substrate (16). The connector (12 ) includes a stiffener member (14 ) that is attached to the connector housing (36 ) so that the flexible substrate (16) is clamped therebetween. Tails (46) of ground buses (40) within the connector extend through flexible substrate (16 ) and through openings (48) in the stiffener member (14) and are bent over into recesses (58) to hold the stiffener member (14) and connector (12) firmly against the substrate (16) along the entire length of the connector. Pivotal levers (90) are provided to cooperate with the stiffener member (14) to secure connector (12 ) to a mating connector (18 ) in mating engagement when pivoted to a closed position, and to separate the connectors (12,18 ) with minimum bowing of connector (12) when pivoted to an open position.
    Type: Grant
    Filed: October 29, 1993
    Date of Patent: December 27, 1994
    Assignee: The Whitaker Corporation
    Inventors: Billy E. Olsson, Iosif Korsunksy
  • Patent number: 5375041
    Abstract: An electronic package assembly that includes a flexible circuit wrapped around a metal substrate. The leads of the flexible circuit are connected to an integrated circuit that is mounted to the top surface of the substrate. The flexible circuit has a plurality of metal pads located adjacent to the bottom surface of the substrate. The flexible circuit also contains a power/ground plane and a number of conductive signal lines that couple the integrated circuit to the metal pads. The pads can be soldered to a printed circuit board to electrically couple the integrated circuit to the board.
    Type: Grant
    Filed: December 2, 1992
    Date of Patent: December 20, 1994
    Assignee: Intel Corporation
    Inventor: John F. McMahon
  • Patent number: 5371327
    Abstract: Proposed is a novel heat-sealable connector sheet, by which very reliable electric connection can be obtained with electrode terminals on an electronic device or a circuit board, consisting of a flexible insulating plastic substrate sheet and a patterned electroconductive layer formed thereon from an electroconductive paste with an overcoating layer of an insulating melt-flowable adhesive. Different from the electroconductive pastes used in conventional connector sheets, the electroconductive paste used here is compounded with an appropriate amount of relatively coarse particles of an insulating material having elasticity, e.g., plastic resins. The patterned electroconductive layer is formed from such a composite conductive paste in such a fashion that the insulating particles are fully embedded in the conductive paste but forming protrusions on the surface of the patterned electroconductive layer which accordingly exhibits a rugged appearance.
    Type: Grant
    Filed: February 12, 1993
    Date of Patent: December 6, 1994
    Assignee: Shin-Etsu Polymer Co., Ltd.
    Inventors: Naoki Fujinami, Kazuyoshi Yoshida, Satoshi Odashima
  • Patent number: 5362243
    Abstract: An air data module connector and filter that provides a shielded housing 12 for supporting a standard air data signal carrying cable connector 22 on an exterior wall thereof, and having an access opening that has a cover plate 34 on an opposite wall from the mounting wall for the connector. The cover plate 34 has a plurality of tubular filters 36 installed therein with pins 40 extending into the housing toward the cable connector. A flexible circuit board 44 has opposite ends which fit on the pins of the connector 23, and the pins 40 of the filters 36 extending through the cover plate, respectively, so that the flexible circuit board 44 can be installed on the cable connector 23 and on the pins 40 for the filters on the cover plate 34 prior to assembly of the cable connector and the cover plate 34 in the housing 12.
    Type: Grant
    Filed: November 30, 1993
    Date of Patent: November 8, 1994
    Inventors: Charles G. Huss, Kenneth J. Freeman
  • Patent number: 5357386
    Abstract: A disc drive includes a sealed head/disc assembly that has airtight electrical connections. The head/disc assembly has a first flexible circuit having one end that has electrical contacts which provide power to a spindle motor and another end which is terminated at a first connecter that is mounted to the base of a casing. A second flexible circuit routes electrical signals to a pivotally mounted actuator. The actuator carries read/write transducer heads and an actuator coil. One end of the second flexible circuit is coupled to the actuator and another end of the second flexible circuit is coupled to a second connector that is mounted to the base of the casing. A circuit board is mounted exterior to and along the base of the HDA casing. The circuit board includes third and fourth connectors which couple directly to the first and second connectors, respectively, when the board is mounted to the HDA.
    Type: Grant
    Filed: November 13, 1992
    Date of Patent: October 18, 1994
    Assignee: Seagate Technology, Inc.
    Inventors: Mehdi S. Haidari, William J. Kostecka
  • Patent number: 5348482
    Abstract: A backplane assembly (200) for a compact card cage such as a junction box (10) having a forward wall section (202) and a rearward wall section (14) with interconnection circuitry (206) disposed therebetween. Struts (216) join forward and rearward wall sections and the backplane assembly is manipulatable as a unit. Interconnection circuitry (206) can be a laminar assembly of flexible circuit elements (230) with terminals (220) of daughter card-matable connectors (204) of the forward wall terminated to circuits thereof at a first connection region CR.sub.1 and terminals (212)of input/output connectors (208) terminated at a second connection region CR.sub.2. All circuits from second region CR.sub.2 can be directed to an integration region CR.sub.M part of first region CR.sub.1 and selected circuits can be directed to terminals of daughter card-matable connectors elsewhere in first region CR.sub.1 connected by a programmable integration member (130).
    Type: Grant
    Filed: June 11, 1993
    Date of Patent: September 20, 1994
    Assignee: The Whitaker Corporation
    Inventors: William J. Rudy, Jr., Howard R. Shaffer, Daniel E. Stahl
  • Patent number: 5345364
    Abstract: A printed circuit board capable of resilient deformation having two major surfaces and a contact edge. Electrically conductive traces are provided on each major surface of the board which lead to electrically conductive contact pads at the contact edge of the board. A gap is provided between the two major surfaces of the board along the contact edge. The gap permits resilient deformation of the board so that a force is created upon deformation which will bias the major surfaces toward their undeformed position. An elastomeric biasing member may be provided in the gap.
    Type: Grant
    Filed: August 18, 1993
    Date of Patent: September 6, 1994
    Assignee: Minnesota Mining and Manufacturing Company
    Inventor: Rolf W. Biernath
  • Patent number: 5343616
    Abstract: A conductive network, which can be flexible or rigid, can have self-aligning conductors which connect with corresponding conductors of other networks. The conductive network can be fabricated into densely packed contact clusters for use as electrical interconnectors or circuits. The contact clusters, which can be configured to substantially any shape, are the essential components of high density connector assemblies. The methods and apparatus for making the conductive network and cluster contacts are also described.
    Type: Grant
    Filed: February 14, 1992
    Date of Patent: September 6, 1994
    Assignee: Rock Ltd.
    Inventor: Joseph A. Roberts
  • Patent number: 5343363
    Abstract: Disclosed is a split backed pressure sensitive die carrier tape including a flexible carrier member having a plurality of holes formed therein of a size larger than a die to be carried. Two strips of pressure sensitive adhesive tape are placed along the back face of the carrier partially covering each hole in the carrier. The two strips of substantially straight pressure sensitive tape are spaced apart so that a poke up needle can be passed between the pressure sensitive tape and through the hole formed in the carrier without tearing or damaging either strip of pressure sensitive tape. An integrated circuit chip is positioned in the hole in the carrier and secured to the pressure sensitive tapes.
    Type: Grant
    Filed: December 21, 1992
    Date of Patent: August 30, 1994
    Assignee: Delco Electronics Corporation
    Inventors: Michael R. Greeson, James C. Baar, Jerry D. Haines, James J. Tepe
  • Patent number: 5338207
    Abstract: A zero insertion force ("ZIF") electrical connector for mating the card edge of a daughter-board (7) orthogonally with respect to the surface of a mother-board (5). The connector includes a stacked plurality of compressible electrical contacts (30-1 . . . n, 32-1 . . . n) separated by a plurality of insulating plates (40-1 . . . n, 42-1 . . . n). End caps (26) are anchored to the mother-board (5) and mount the compressible electrical contacts (30-1 . . . n, 32-1 . . . n) and insulating plates (40-1 . . . n, 42-1 . . . n) in a stacked array with each compressible electrical contact (30-1 . . . n, 32-1 . . . n) bridging the junction of the mother-board (5) and daughter-board (7). This way, the array of compressible electrical contacts (30-1 . . . n, 32-1 . . . n) cumulatively complete multiple rows of high-density electrical connections between the mother-board (5) and daughter-board (7).
    Type: Grant
    Filed: June 9, 1993
    Date of Patent: August 16, 1994
    Assignee: The Whitaker Corporation
    Inventors: Daniel C. Lineberry, Warren A. Bates
  • Patent number: 5336095
    Abstract: An interface for connecting co-planar printed circuit ("PC") boards (10,20) using a compressible circuit (50) for bridging the PC boards (10,20), a base (80) underlying the second PC board and integrally attached thereto, and a support housing (30) which sandwiches the compressible circuit (50) against the two PC boards (10,20). The compressible circuit (50) is insertable into the underside of the support housing (30) and may be electro-optically aligned therewith. The compressible circuit (50) is then staked to the support housing (30), and the support housing is mounted on the two PC boards (10,20). In order to mount the support housing (30) on the PC boards (10,20) with the requisite precision, the support housing (30) is provided with alignment means including resilient finger (39) on the underside, and the second PC board (20) is provided with cooperating guide tabs (25).
    Type: Grant
    Filed: May 13, 1993
    Date of Patent: August 9, 1994
    Assignee: The Whitaker Corporation
    Inventors: Douglas M. Walburn, Morgan J. Bradley, John W. Jones, Robert D. Irlbeck, Robert M. Renn
  • Patent number: 5337202
    Abstract: The present invention is apparatus for interfacing the actuator arm assembly to control and signal processing circuits mounted external to the disc drive casing. The invention provides a sealed connective interface which protects the integrity of the "clean room" environment in which selected disc drive components function.
    Type: Grant
    Filed: April 2, 1993
    Date of Patent: August 9, 1994
    Assignee: Seagate Technology, Inc.
    Inventors: Iraj Jabbarai, Brian L. Phillips
  • Patent number: 5335145
    Abstract: An IC card exhibiting improved electrical insulation, heat radiation capability, and radiation noise resistance includes circuit boards stacked in two layers and spaced apart from each other and surface panels of the IC card while maintaining satisfactory mechanical strength in the card. Board supporting portions extending in a frame portion of a main frame and sub-frames disposed on the board supporting portions hold the circuit boards, maintain a predetermined interval between the two circuit boards and between each circuit board and the surface panels, and provide the desired mechanical strength for the card.
    Type: Grant
    Filed: June 11, 1993
    Date of Patent: August 2, 1994
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventor: Masaaki Kusui
  • Patent number: 5330365
    Abstract: Adapter, comprising a housing preferably made of plastic, which housing contains at least one flexible printed circuit carrier provided with at least electrical conductive pathways, which carrier is made of a flexible material, for example Kapton, and which conductive pathways on the carrier are electrically connected to at least two terminals of the adapter, wherein the flexible carrier is provided with electronic components on at least one side thereof, the carrier having a metallized side and being folded around the components to shield them from electromagnetic interference, and further having a flap-like portion disposed between the components and an electrical connector mated with the adapter to provide electrostatic protection for the components.
    Type: Grant
    Filed: February 12, 1993
    Date of Patent: July 19, 1994
    Inventor: Anthony M. Leeson
  • Patent number: 5324206
    Abstract: An arrangement is provided for mounting double ended hermaphroditic signal mode modules (10) that includes an elongated carrier (68) having longitudinal walls (70, 77) and transverse walls (71, 74) that define pockets to receive the connectors (10) and position them accurately so that one set of contact arrays (59) engages contact arrays (86) of a printed circuit board (69) attached to one side of the carrier by a clamping bar (82). Grounding means (87) may be provided at the connections to the printed circuit board (69). The other contact arrays (56) of the connectors (10) face outwardly on the other side of the carrier (68) to engage identical connectors (10). The carriers (68) may be attached to a frame (92) to interconnect printed circuit boards (69) positioned at 90 degrees relative to each other on opposite sides of the frame (92). The carrier (68) may include means (73) to support another connector for supplying power to the printed circuit board (69).
    Type: Grant
    Filed: July 31, 1992
    Date of Patent: June 28, 1994
    Assignee: Hughes Aircraft Company
    Inventor: Theodore R. Conroy-Wass
  • Patent number: 5323214
    Abstract: An electrostatic actuator for forming an electric field for transporting the particles of a developer having a predetermined charge in a predetermined direction. A plurality of stripe-like drive electrodes are continuously formed on only one of opposite sides of a substrate in parallel. Pins are affixed to three electrode terminals and contact every third drive electrode selected in matching relation to the electrode terminals. The three terminals are held on an electrode connector which is fitted on one edge of the substrate. The portions of the pins contacting the drive electrodes are thinner than the portions connected to the electrode terminals.
    Type: Grant
    Filed: August 5, 1993
    Date of Patent: June 21, 1994
    Assignee: Ricoh Company, Ltd.
    Inventor: Tsukuru Kai
  • Patent number: 5313416
    Abstract: A semiconductor memory control device includes a flexible circuit board having a plurality of panels and folded so that the panels are stacked on one another, a plurality of semiconductor elements mounted on the flexible circuit board, and a package enclosing the flexible circuit board and the plurality of semiconductor elements. A method of mounting semiconductor memory control devices in high density includes mounting a plurality of semiconductor elements on a flexible circuit board, forming an internally mounted module by folding the flexible circuit board in panels that are stacked in multiple layers, and enclosing the internally mounted module in a package.
    Type: Grant
    Filed: July 1, 1992
    Date of Patent: May 17, 1994
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventor: Masatoshi Kimura
  • Patent number: 5306160
    Abstract: A connector for electrically conductive connection to electrically conductive contact pads of a circuit comprising a rigid housing; a resilient flexible circuit assembly captively housed, at least in part, in the housing and having an end portion carrying a row of conductive circuit areas on one face thereof corresponding to the row of pads; the assembly being permitted a limited desired float, so that the areas are self aligning with and are resiliently urged into electrically conductive contact with the pads when the connector is attached at a desired location to the circuit. The elements have alignment features engaging a cooperating feature of the circuit to register the areas with the pads, when the connector is attached at a desired location to the circuit, with sufficient accuracy to ensure that only the desired conductive contact between the areas and the pads is achieved.
    Type: Grant
    Filed: March 26, 1993
    Date of Patent: April 26, 1994
    Assignee: Rock Ltd. Partnership
    Inventor: Joseph A. Roberts
  • Patent number: 5296831
    Abstract: A coil arrangement for a control circuit which controls the motion of a housing includes coils arranged as a printed circuit on a flexible foil. The coils serve as the control elements for the control circuit. The foil is H-shaped and the coils are arranged on the verticals of H. The portions of the verticals in contact with the cross-bar of the H-shaped foil support connecting-conductors which connect the coils on the individual verticals. An aperture, soldering terminals and connecting conductors are arranged on the cross-bar of the H. The cross-bar is affixed to the top or bottom of a block-shaped housing and the verticals of the H are folded against the sides of the housing.
    Type: Grant
    Filed: April 24, 1992
    Date of Patent: March 22, 1994
    Assignee: Deutsch Thomson Brandt GmbH
    Inventor: Tsuneo Suzuki
  • Patent number: 5285354
    Abstract: A controller base unit for a DIN-standard installation wherein a molded base is provided with an internal chassis for support and a contour that permits the direct and releasable attachment of the unit to a DIN rail via a plurality of hooks that are simultaneously moveable between an engaged and non-engaged position. The base is provided with a recess in a planar face thereof for accommodating a printed circuit board and has fixed tabs along the periphery of the recess. The circuit board has cut-outs that mate with the tabs for insertion of the board into the recess and is slidable laterally into a position where the tabs secure the board against the surface of the recess and a screw or the like can secure the board against further lateral movement. The board has at both ends thereof a pair of connectors that are connectable with either end of a separate similarly designed board via a cable.
    Type: Grant
    Filed: February 21, 1992
    Date of Patent: February 8, 1994
    Assignee: Mitsubishi Denki K.K.
    Inventors: Osamu Ohsawa, Noboru Takahashi
  • Patent number: 5282751
    Abstract: A connector apparatus having a reduced total packaging height despite the presence of mounting receptacle connectors on each the surfaces of a mount board is disclosed. The mount board is formed from a flexible printed circuit bonded to a support plate. The mount board is bent in a stepped or offset relation to an axis extending perpendicular to the surface of the board mount to provide a pair of opposed step sections, lower and upper. A receptacle connector is mounted to the upper and to the lower step section of the mount board; that is, to the side of the board mount having the flexible printed circuit board side and one to the side of the board mount having the support plate. The upper and lower receptacles extend in mutually opposed directions along the axis.
    Type: Grant
    Filed: July 31, 1992
    Date of Patent: February 1, 1994
    Inventor: Nai Hock Lwee
  • Patent number: 5277593
    Abstract: A compressible electrical connector (10) includes a rigid molded body (11) having elastomeric caps (19, 20) at the top (12) and bottom (13) thereof. A thin flexible film (21), provided with respective connector elements (22), is wrapped around the rigid molded body (11) and its caps (19, 20) and is retained by a film retaining plate (23). The film retaining plate (23) has a plurality of latching lances (24) received in corresponding mounting holes (30) formed transversely in the rigid molded body (11). A hot melt layer (36) is placed over the film retaining plate (23), and a plurality of compressible electrical connectors (10) are stacked side-by-side to form an array (35). The array (35) is disposed between a pair of PC boards or other electronic assemblies (39, 40) having respective circuit elements (37, 38). The height of the rigid molded body may be changed conveniently to readily accommodate different product applications.
    Type: Grant
    Filed: September 30, 1992
    Date of Patent: January 11, 1994
    Assignee: The Whitaker Corporation
    Inventors: Warren A. Bates, Frederick R. Deak, David C. Johnson, Robert M. Renn, Douglas M. Walburn, Keith L. Volz
  • Patent number: 5276590
    Abstract: A flex circuit, which is fabricated from metallization on thin film, is mounted between two opposite sides of frame to form an electronic card sized to fit as a replacement for a rigid epoxy glass card in a card carrier having a backplane. Appropriate placement of electrical components on the flex circuit and using a flex circuit longer than the spacing between the opposite sides of the frame to which the flex circuit is mounted, allows the use of taller parts on adjacent cards in the card carrier, since the flex circuit can be conformed to eliminate obstructions caused by insufficient spacing between cards.
    Type: Grant
    Filed: October 24, 1991
    Date of Patent: January 4, 1994
    Assignee: International Business Machines Corporation
    Inventors: Mark Budman, Mark J. Kuzawinski, Douglas M. Saunders
  • Patent number: 5276817
    Abstract: A system for splitting and connecting computer bus lines, including a ribbon cable with a flat end connector which is piggy-backed to the contact strip of a circuit board. The circuit board is then plugged into a bus slot with the flat end connector insulating selected terminal contacts of the slot from said contact strip. The ribbon connector is connected to the circuit board, the terminal contacts, the contract strip, or both. A control signal selector connected to the other end of the ribbon cable sends signals to one of several circuit boards so as to allow more than one work station to be supported by a single microprocessor.
    Type: Grant
    Filed: August 12, 1991
    Date of Patent: January 4, 1994
    Assignee: Technosales Company Establishment
    Inventors: Manfred Matschke, Achim Rubert, Miroslaw Paczesny, Marek Rakowski
  • Patent number: 5263868
    Abstract: An interface for connecting coplanar printed circuit ("PC") boards (10, 20) using a flexible jumper circuit (50) for bridging the PC boards (10, 20), a base (80) underlying the second PC board and integrally attached thereto, and a support housing (30) with compression plugs (60) which may be tightened against base (80) for securing the two PC boards (10, 20) and for compressing the flexible jumper circuit (50) against the two PC boards (10, 20). The interface is precision aligned by a plurality of guide pins (34) which protrude from support housing (30) and conform to guide holes in the two PC boards (10, 20) and the flexible jumper circuit (50). Guide pins (34) fix the relative positions of the boards (10, 20) and circuit (50) within their respective planes.
    Type: Grant
    Filed: March 8, 1993
    Date of Patent: November 23, 1993
    Assignee: The Whitaker Corporation
    Inventors: Robert M. Renn, Keith L. Volz, Frederick R. Deak, David C. Johnson, Warren A. Bates
  • Patent number: 5255155
    Abstract: A flexible flat conductor wiring board (5) having required electric circuits is affixedly disposed on an instrument cluster (2) of an instrument panel portion of an automobile so as to be connected to switches and instruments (3A to 3E) that are provided on the instrument cluster (2) in groups so that an electric circuit is formed. Electric functioning components needed to carry out electric control of the switches and instruments are dispersedly provided on the end portions of centrally arranged switches and instruments or provided on the wiring board (5) with the electric control functions being incorporated in the electric circuits of the instrument cluster (2). Switches and instruments (3A to 3E) are provided, and electric circuits for the switches and instruments (3A to 3E) are provided so as to make the instrument cluster (2) an independent electric component. The instrument cluster (2) as an independent electric component is mounted on the instrument panel portion 1 of an automobile.
    Type: Grant
    Filed: September 18, 1991
    Date of Patent: October 19, 1993
    Assignees: Sumitomo Wiring Systems, Ltd., Sumitomo Electric Industries, Ltd.
    Inventors: Tetsuo Sugimoto, Junichi Kojima, Yoshitsugu Tsuji, Tetsuo Yamamoto, Yukio Kominami
  • Patent number: 5248261
    Abstract: An hermaphroditic electrical connector (10) is provided for interconnecting printed circuit boards (69) which includes a housing (11) of dielectric material and two pressure tables (28, 35) which are biased outwardly by springs (30, 34) in directions perpendicular to each other. Each pressure table (28, 35) includes a flat surface (48, 51) over which is a resilient pad (47, 50). A flexible circuit (46) has contact arrays (56, 59) over the flat surfaces (48, 51) and pads (47, 50) with conductors (57) in the intermediate portion that extends through the housing (11). A grounding clip (61) may be provided with the forward pressure table to give 360 degree shielding.
    Type: Grant
    Filed: July 31, 1992
    Date of Patent: September 28, 1993
    Assignee: Hughes Aircraft Company
    Inventors: Theodore R. Conroy-Wass, Willis A. Williams
  • Patent number: 5248262
    Abstract: An electrical connector for interconnecting a pair of circuit members (e.g., a circuit board and module), which, in one embodiment, includes a housing, at least one flexible circuit within the housing and a spring means attached to the flexible circuit at two spaced locations for exerting force against the flexible circuit to cause the circuit to engage respective conductive pads on the circuit members when the circuit members are moved toward each other (e.g., compressed). The shape of the spring means conforms substantially to the portion of the flexible circuit between the locations of attachment. In another embodiment, a connector for interconnecting such circuit members includes a housing adapted for being located between both members and at least one elongated, compressible contact member in the housing and including conductive end portions for engaging the circuit members.
    Type: Grant
    Filed: June 19, 1992
    Date of Patent: September 28, 1993
    Assignee: International Business Machines Corporation
    Inventors: Raymond A. Busacco, Chi S. Chang, Fletcher W. Chapin, David W. Dranchak, Thomas G. Macek, James R. Petrozello, George J. Saxenmeyer, Jr., Rod A. Smith
  • Patent number: 5240420
    Abstract: A connector for electrically conductive connection to electrically conductive contact pads of a circuit comprising a rigid housing; a flexible circuit housed, at least in part, in said housing and having an end portion carrying a row of conductive circuit areas on one face thereof corresponding to said row of pads; a spring structure having a resilient arched feature and being held captive by the housing while being permitted a limited desired float, the flexible circuit being captively located relative to the housing so that the areas are resiliently urged by the arched feature into electrically conductive contact with the pads when the connector is attached at a desired location to the circuit.
    Type: Grant
    Filed: March 31, 1992
    Date of Patent: August 31, 1993
    Assignee: Research Organization For Circuit Knowledge
    Inventor: Joseph A. Roberts
  • Patent number: 5228862
    Abstract: An electrical connector for interconnecting opposed circuit members (e.g., modules, printed circuit boards) using an interim housing on which are positioned a pair of flexible circuit members which are capable of being expanded to provide desired connections. Expansion is accomplished through the application of pressurized fluid to the housing to cause expansion. Such a fluid (liquid or gas) may also cool the structure during operation. The respective conductors of the expandable flexible circuit members are electrically coupled using a common circuitized element (e.g., a thin dielectric having opposed arrays of conductive members thereon). Means for aligning the connector of the invention with the respective electrical circuit members being connected is also provided.
    Type: Grant
    Filed: August 31, 1992
    Date of Patent: July 20, 1993
    Assignee: International Business Machines Corporation
    Inventors: John G. Baumberger, James R. Petrozello
  • Patent number: 5224865
    Abstract: An electrical connector is provided for connecting a flexible circuit (45) to a printed circuit board (14). The connector includes a housing (10) within which is a slide (26) beneath which is a pressure bar (34) and a pad (42). The housing (10) is attachable to a circuit board (14) and a flexible circuit end can be inserted into the housing (10) beneath the pad (42). The slide (26) is moved longitudinally, causing cam surfaces (29, 30, 31, 32, 38, 39) on the slide (26) and pressure bar (34) to force the pressure bar (34) against the flexible circuit (45). This causes contacts (47) on the flexible circuit (45) to firmly engage contacts (46) on the circuit board (14) to effect an electrical connection.
    Type: Grant
    Filed: February 24, 1992
    Date of Patent: July 6, 1993
    Assignee: Hughes Aircraft Company
    Inventors: Blake F. Woith, Robert E. Daugherty
  • Patent number: 5219293
    Abstract: A connection structure and method of circuit boards including electronic parts thereon and a flexible cable for coupling the circuit boards. A first circuit board mounting electronic parts such as light detector elements and the like in an image sensor and a conductive pattern for connecting an image signal of the light detector elements to an external circuit and a second circuit board including amplifying ICs and a conductive pattern connected thereto are mutually laminated. The first circuit board is formed with a slot and a flexible bridging conductor is inserted into the slot. The flexible cable having a conductive pattern at its end is laminated on the laminated circuit boards so as to correspond to the conductive patterns. The flexible cable and the laminated circuit boards are closely fixed by a fixing plate to perform an electrical connection between the electronic parts of the circuit boards and between the electronic parts and the flexible cable at the same time without using soldering.
    Type: Grant
    Filed: June 30, 1992
    Date of Patent: June 15, 1993
    Assignee: Rohm Co., Ltd.
    Inventor: Masaya Imamura
  • Patent number: 5213511
    Abstract: An electrical connector assembly (10) comprises first and second electrical connectors (12 and 14) and/or a printed wiring board (70) having electrical conductors thereon ending in termini (32, 34). Dimples (36, 38 and/or 72) are provided on the termini and provide connections between the flex cables or a flex cable and the printed wiring board. The dimples also provide self-alignment between the matable electrical connectors.
    Type: Grant
    Filed: March 27, 1992
    Date of Patent: May 25, 1993
    Assignee: Hughes Aircraft Company
    Inventor: Mohi Sobhani
  • Patent number: 5213512
    Abstract: An electrical connector device (10) is provided in which a first member (15) of dielectric material defines a four-sided recess having a bottom wall (20) and side walls (16), and a second member (24) of dielectric material which can fit inside the recess with its edges (25) spaced a predetermined distance from the side walls (16) of the first member (15). Tab portions (31, 32, 44, 45) of one or more flexible circuits (11, 12) are bent around the side walls (16) of the first member (15) and frictionally held between the wall (16) of the first member (15) and the edge (25) of the second member (24). Exposed conductors (29, 49) of the flexible circuit (11, 12) on the outside of the wall (16) can mate with conductors (75) in a socket connector (13). Alignment means (19, 26, 73) are provided to align the flexible circuits (11, 12) with the members ( 15, 24) of dielectric material and to align the latter two members and frictionally hold them together.
    Type: Grant
    Filed: July 24, 1992
    Date of Patent: May 25, 1993
    Assignee: Hughes Aircraft Company
    Inventors: Ronald L. Campbell, Douglas E. Riddle
  • Patent number: 5208729
    Abstract: A high density package for a plurality of integrated circuit chips is described, the package including a number of planar subunits. A subunit includes first and second planar metal plates and a spacer metal plate sandwiched therebetween. Each spacer metal plate is provided with a plurality of circuit-receiving apertures. A planar circuit carrier is provided for each aperture in the spacer metal plate. One face of each circuit carrier includes a plurality of bonded chips. Each circuit carrier is positioned in a circuit-receiving aperture so that rear aspects of the bonded chips bear upon the second planar metal plate. Each circuit carrier has a connector region which extends out from between the first planar metal plate and the metal spacer plate at one extremity of each circuit-receiving aperture. A circuit card is positioned at that extremity and has a plurality of interconnection areas, one for each extended connector region.
    Type: Grant
    Filed: February 14, 1992
    Date of Patent: May 4, 1993
    Assignee: International Business Machines Corporation
    Inventors: Thomas M. Cipolla, Paul W. Coteus, Glen W. Johnson, Lawrence S. Mok
  • Patent number: 5207585
    Abstract: A thin interface pellicle probe for making temporary or permanent interconnections to pads or bumps on a semiconductor device wherein the pads or bumps may be arranged in high density patterns is described incorporating an electrode for each pad or bump wherein the electrode has a raised portion thereon for penetrating the surface of the pad or bump to create sidewalls to provide a clean contact surface and the electrode has a recessed surface to limit the penetration of the raised portion. The electrodes may be affixed to a thin flexible membrane to permit each contact to have independent movement over a limited distance and of a limited rotation. The invention overcomes the problem of making easily breakable electrical interconnections to high density arrays of pads or bumps on integrated circuit structures for testing, burn-in or package interconnect and testing applications.
    Type: Grant
    Filed: October 31, 1990
    Date of Patent: May 4, 1993
    Assignee: International Business Machines Corporation
    Inventors: Herbert P. Byrnes, Jean-Marc Halbout, Michael R. Scheuermann, Eugene Shapiro
  • Patent number: 5205740
    Abstract: A connector for connecting large numbers of contact points on a flat ribbon cable to corresponding contact points on a second flat ribbon ribbon cable is described. The connector is a rigid clamping device which encompasses the cables where they join and through the use of springs and force spreaders the connections at the cable interface are completed. The connections of the cables are disposed within a chamber within the connector and rigidly clamped to prevent movement or separation of the connections.
    Type: Grant
    Filed: December 13, 1991
    Date of Patent: April 27, 1993
    Assignee: International Business Machines, Corp.
    Inventors: Richard F. Frankeny, Karl Hermann, Ronald E. Hunt, Verlon E. Whitehead
  • Patent number: 5205750
    Abstract: A structure and method for mounting a flexible electrical circuit to rigid substrate to effect electrical connection between contacts on one side of the flexible electrical circuit with electrical pads on one side of the substrate is provided. The connection allows for strain relief due to mechanical stress, as well as compensating for thermally induced stress. The structure includes a clamping member disposed to clamp and position the flexible circuit with its one side in face to face relationship with the surface of the substrate. A supporting structure is carried by the substrate and has a mounting member mounting the clamping member to maintain the flexible circuit and the substrate in face to face contacting relationship. The mounting structure also includes a spring mechanism yieldingly responsive to thermal expansion stress which mechanism urges the flexible circuit into contact with the substrate.
    Type: Grant
    Filed: December 6, 1991
    Date of Patent: April 27, 1993
    Assignee: International Business Machines Corporation
    Inventors: Robert E. Darrow, David E. Engle
  • Patent number: 5205741
    Abstract: A non-invasive connector for testing an integrated circuit package has a connector housing with a substantially rectangular recess adapted to fit over the integrated circuit package. A plurality of teeth made of an insulative material extend laterally inward from the edges of the connector housing into the recess. The spacing between the teeth is predetermined to enable the teeth to be removably inserted between the integrated circuit leads as said connector housing is fitted in place. Test leads extend from the connector housing into the space between said teeth to make electrical contact with the integrated circuit leads. Electrical connections are provided through the connector housing between these test leads and external testing equipment by means of pins and a flexible circuit assembly. In addition, an elastomeric pad can be positioned between the connector housing and the test leads to exert an inward biasing force against the test leads to maintain electrical contact with the integrated circuit leads.
    Type: Grant
    Filed: August 14, 1991
    Date of Patent: April 27, 1993
    Assignee: Hewlett-Packard Company
    Inventors: Michael J. Steen, Robert H. Wardwell, Joseph A. McKenzie, Jr.