Resilient Contact Or To Receive Resilient Contact Patents (Class 439/81)
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Publication number: 20120156903Abstract: A contact node of a portable terminal includes: a body fixed on a main board of the portable terminal; at least one first contact piece protruding through one side surface of the body; and at least one second contact piece protruding through another side surface of the body, wherein one of the first contact piece and second contact piece is disposed toward an outer side surface of the portable terminal.Type: ApplicationFiled: September 7, 2011Publication date: June 21, 2012Applicant: SAMSUNG ELECTRONICS CO., LTD.Inventor: Yun-Sik KIM
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Patent number: 8187008Abstract: Various structures, such as microstructures and wall-like structures, can include parts or surfaces that are oblique. In some implementations, a cantilevered element includes a spring-like portion with a uniformly oblique surface or with another artifact of an oblique radiation technique. In some implementations, when a deflecting force is applied, a spring-like portion can provide deflection and spring force within required ranges. Various oblique radiation techniques can be used, such as radiation of a layer through a prism, and structures having spring-like portions with oblique radiation artifacts can be used in various applications, such as with downward or upward deflecting forces.Type: GrantFiled: February 12, 2010Date of Patent: May 29, 2012Assignee: Palo Alto Research Center IncorporatedInventors: Jurgen Daniel, David K. Fork, Armin R. Völkel
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Patent number: 8182273Abstract: A power semiconductor module having a housing, a pressure member, a substrate including at least one contact surface, and at least one connection element leading towards the exterior of the housing. The connection element has a first contact device, a resilient section and a second contact device. The pressure member has two stop elements. The first contact device is electrically conductively connected to the contact surfaces of the substrate. The second contact device is arcuate in shape and has at least one deformation at the beginning and at the end of the arc, wherein, as a result of the deformations of the second contact device co-operating with the two stop elements of the pressure member, the connection element is prestressed.Type: GrantFiled: November 19, 2009Date of Patent: May 22, 2012Assignee: SEMIKRON Elektronik GmbH & Co. KGInventor: Marco Lederer
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Patent number: 8179692Abstract: A board includes a board body; a first conductor provided at a first surface of the board body; and an electrically conductive connection terminal having a spring property. The connection terminal includes a first end part fixed to the first conductor; a second end part to be connected to a first object of connection to be placed opposite the first surface of the board body; and a projection part provided on the first end part so as to project toward the first conductor.Type: GrantFiled: June 28, 2010Date of Patent: May 15, 2012Assignee: Shinko Electric Industries Co., Ltd.Inventor: Yoshihiro Ihara
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Patent number: 8080293Abstract: Micro-machined (e.g., stress-engineered spring) structures are produced by forming a release layer, forming a partially or fully encapsulated beam/spring structure, and then releasing the beam/spring structure by etching the release layer. The encapsulation structure protects the beam/spring during release, so both the release layer and the beam/spring can be formed using plating and/or using the same material. The encapsulation structure can be metal, resist, polymer, oxide, or nitride, and may be removed after the release process, or retained as part of the completed micro-machined structure.Type: GrantFiled: March 19, 2010Date of Patent: December 20, 2011Assignee: Palo Alto Research Center IncorporatedInventors: Thomas Hantschel, Sven Kosgalwies, Eugene M. Chow, Gordon Todd Jagerson, Jr.
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Publication number: 20110294315Abstract: Provided are a circuit board module and an electronic device provided with the same capable of increasing the strength of a card connector, with the configuration that the card connector is mounted to have a specific space from the board. The circuit board module is provided with a card connector portion 40 which includes a card insertion port from which a card C1 having at least one contact is inserted, and a housing chamber 42 which is formed to be communicated with the card insertion port to contain the card C1 therein; and a circuit board 10 having a surface which supports the card connector portion 40.Type: ApplicationFiled: November 17, 2009Publication date: December 1, 2011Applicant: PANASONIC CORPORATIONInventors: Masahito Kawabata, Seiji Yamaguchi
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Patent number: 8033838Abstract: Spring contact elements are fabricated by depositing at least one layer of metallic material into openings defined on a sacrificial substrate. The openings may be within the surface of the substrate, or in one or more layers deposited on the surface of the sacrificial substrate. Each spring contact element has a base end portion, a contact end portion, and a central body portion. The contact end portion is offset in the z-axis (at a different height) than the central body portion. The base end portion is preferably offset in an opposite direction along the z-axis from the central body portion. In this manner, a plurality of spring contact elements are fabricated in a prescribed spatial relationship with one another on the sacrificial substrate.Type: GrantFiled: October 12, 2009Date of Patent: October 11, 2011Assignee: FormFactor, Inc.Inventors: Benjamin N. Eldridge, Gary W. Grube, Igor Y. Khandros, Gaetan L. Mathieu
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Patent number: 8027168Abstract: An electrical assembly comprises a mounting bracket lift assembly and an electrical center. The electrical center is attached to the mounting bracket lift assembly for plugging wiring harness end connectors into the electrical center. The electrical center comprises a lower housing, a circuit board sub-assembly, an upper housing, electrical components such as fuses and relays that plug into the upper housing and a cover. The circuit board sub-assembly includes a power bus bar that provides a power path for the various electrical circuits of the vehicle via the circuit components carried on the circuit board. Three power bus bars that are configured, oriented and located to reduce the foot print of the electrical center and/or to improve the dissipation of heat generated by the electrical center are disclosed.Type: GrantFiled: August 13, 2008Date of Patent: September 27, 2011Assignee: Delphi Technologies, Inc.Inventors: Joseph Matthew Senk, Joseph Howard Gladd, Gino M. Roncone, John B. Kirk
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Patent number: 8021168Abstract: A contact spring having a free contact end for producing an electrical contact between the free contact end and a contact surface, the contact spring formed from N contact spring metal sheets and N?1 spacer elements. The contact spring metal sheets are fixed in a clamping region with a spacer element between two adjacent contact spring metal sheets, are at a distance from each other in a spring region around the thickness of the spacer elements, extend parallel to each other up to the free contact end in a freely elastic manner, and end in a common plane on the free contact end. In the spring region, the contact spring metal sheets have at least one bend with a pre-determined angle between the longitudinal axis of the contact spring metal sheets before the bend and the longitudinal axis of the contact spring metal sheets after the bend.Type: GrantFiled: January 21, 2009Date of Patent: September 20, 2011Assignee: Rosenberger Hochfrequenztechnik GmbH & Co. KGInventors: Christian Dandl, Michael Wollitzer, Armin Maiwälder
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Patent number: 8021167Abstract: A method of forming spring structures using a single lithographic operation is described. In particular, a single lithographic operation both defines the spring area and also defines what areas of the spring will be uplifted. By eliminating a second lithographic operation to define a spring release area, processing costs for spring fabrication can be reduced.Type: GrantFiled: January 27, 2010Date of Patent: September 20, 2011Assignee: Palo Alto Research Center IncorporatedInventors: Thomas Hantschel, David K. Fork
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Patent number: 8007291Abstract: A method, and structures are provided for implementing differential signal circuit board electrical contact. A removable member including a pair of independent electrical contacts is removably received within an associated contact-receiving cavity on the circuit board. The contact-receiving cavity includes a mating pair of circuit board pads. A respective dielectric is provided between each of the pair of independent electrical contacts and the mating pair of circuit board pads.Type: GrantFiled: October 15, 2010Date of Patent: August 30, 2011Assignee: International Business Machines CorporationInventors: Don Alan Gilliland, Joseph Kuczynski, Amanda Elisa Ennis Mikhail
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Publication number: 20110207346Abstract: A socket includes: a circuit board; a plurality of connection terminals disposed on the circuit board; a plurality of contacts each fixed to a corresponding one of the connection terminals, wherein each of the contacts is formed of a conductive elastic member, each of the contacts comprising: a tail portion fixed to the corresponding connection terminal; an extending portion connected to the tail portion and extending in a direction substantially parallel with a surface of the circuit board; a rise portion connected to the extending portion and extending in a direction substantially perpendicular to the surface of the circuit board; and a tip portion connected to the rise portion.Type: ApplicationFiled: February 17, 2011Publication date: August 25, 2011Applicant: SHINKO ELECTRIC INDUSTRIES CO., LTD.Inventor: Masato Tanaka
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Patent number: 7993145Abstract: A socket connector (100) adapted for electrically connecting a package to a printed circuit board comprises a substrate (2) and a plurality of contacts (3), the substrate (2) comprises a top surface (21), a bottom surface (22) opposite to the top surface (21) and a plurality of passageways (211) impenetrate the top surface (21) and the bottom surface (22), the contact (3) is partly received in the passageway (211) and comprises a body portion (31), at least one leg (33) extends downwardly from the body portion (31) and a spring arm (32) extends upwardly from the body portion (31), the body portion (31) is attached to the top surface of the substrate (2) and the leg (33) goes through the passageway (211) to position the contact (3) on the substrate (2).Type: GrantFiled: July 8, 2010Date of Patent: August 9, 2011Assignee: Hon Hai Precision Ind. Co., Ltd.Inventors: David Gregory Howell, Chih-Pi Cheng, Been-Yang Liaw, Cheng-Ching Chien
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Patent number: 7985077Abstract: A socket assembly for connecting an array of bulbous terminals such as balls wherein the female element is a miniature tube that has resilient prongs that grip the corresponding terminals with varying force during insertion and deletion. The tube is of resilient conductive material that has been sliced or helically partitioned into opposing prongs forming slots of a width that increases with axial distance from the end of the tube so as to allow the prongs of the connector to grip around the ball-like bulbous terminal and mechanically retain the terminal within the connector. The tubular element of the connector may be made by forming prongs in one or both ends of a tube by cuts of a width that increases with distance from the end of the tube.Type: GrantFiled: January 12, 2010Date of Patent: July 26, 2011Assignee: Centipede Systems, Inc.Inventor: Thomas H. Di Stefano
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Patent number: 7985081Abstract: A method for mounting the micro spring structures onto cables or contact structures includes forming a spring island having an “upside-down” stress bias on a first release material layer or directly on a substrate, forming a second release material over at least a portion of the spring island, and then forming a base structure over the second release material layer. The micro spring structure is then transferred in an unreleased state, inverted such that the base structure contacts a surface of a selected apparatus, and then secured (e.g., using solder reflow techniques) such that the micro spring structure becomes attached to the apparatus. The spring structure is then released by etching or otherwise removing the release material layer(s).Type: GrantFiled: July 3, 2008Date of Patent: July 26, 2011Assignee: Palo Alto Research Center IncorporatedInventors: Koenraad Van Schuylenbergh, Thomas Hantschel
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Publication number: 20110177702Abstract: An electrical connector includes an insulative housing and a plurality of contacts received in the housing. Each contact includes a body portion, a spring portion and a soldering tail. The insulative housing includes a smooth top face, a plurality of generally parallel ridges extending from an opposite face to the top face to provide with interposed grooves between every adjacent ridges. The body portions of the contacts are individually engaged in the corresponding grooves and the spring portions extend forwards beyond a front face of the housing. The insulating housing includes a mounting face opposite to the smooth top face for confronting with a printed circuit board and the soldering tails extend downwards beyond the mounting face.Type: ApplicationFiled: August 23, 2010Publication date: July 21, 2011Applicant: HON HAI PRECISION INDUSTRY CO., LTD.Inventor: YU ZHU
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Publication number: 20110171841Abstract: To provide an electronic device socket able to shorten conductive paths between terminals of an electronic device and contacts of a circuit board. An electronic device socket (1) wherein a socket part 10 electrically connecting a plurality of terminals of an electronic device to corresponding contacts of a circuit board has a plurality of through holes 105 arranged corresponding to the positions of the terminals.Type: ApplicationFiled: August 5, 2009Publication date: July 14, 2011Inventors: Yuichi Tsubaki, Masahiko Kobayashi
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Patent number: 7972149Abstract: Connection terminals each include: a bonding portion bonded to a pad of a substrate; a contacting portion disposed to face the bonding portion; a spring portion present between the bonding portion and the contacting portion; and an engaging portion engaged with a portion of a slit provided in a plate-like member. These constituent portions of the connection terminal are formed integrally with each other. The plate-like member has recessed portions formed at predetermined positions, and the connection terminals are electrically connected to the pads of the substrate with the bonding portions of the connection terminals being locked to the recessed portions.Type: GrantFiled: August 16, 2010Date of Patent: July 5, 2011Assignee: Shinko Electric Industries Co., Ltd.Inventor: Yoshihiro Ihara
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Publication number: 20110151691Abstract: The patent deals with a contact fixture for a PCB with one first plug-in connector and one second plug-in connector, whereby the first plug-in connector has a number of first contact elements, the second plug-in connector has a number of second contact elements, the first plug-in connector is arranged on the first side of the PCB, the second plug-in connector is arranged on the second side of the PCB opposite to the first side, the first contact element and/or the second contact element is/are designed as a connector to establish a detachable electrically conductive connection with at least the second contact element or the first contact element, and the first contact element and the second contact element are connected through an opening in the PCB.Type: ApplicationFiled: December 14, 2010Publication date: June 23, 2011Inventors: Peter Scheibelhut, Andreas Hostmann
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Patent number: 7963778Abstract: A burn-in socket for receiving an IC package comprises a socket body, a plurality of contacts mounted in the socket body and an actuator movably mounted upon the socket body. Each contact in the socket body includes a pair of clipping arms with tip portions at free ends thereof respectively. Solder balls attached to the bottom of the IC package are respectively clipped between the pair of the tip portions and thus the IC package should be brought into electrical contact with the contacts of the burn-in socket. The tip portion is plated with a Pd—Co layer for reducing the attachment of the Sn and preventing the impedance of the contacts to increase. Meanwhile, the IC package can be sucked up successfully without absorption from the contacts of the burn-in socket.Type: GrantFiled: December 23, 2008Date of Patent: June 21, 2011Assignee: Hon Hai Precision Ind. Co., LtdInventors: Ming-Yue Chen, Been-Yang Liaw, Wen-Yi Hsieh, Shih-Wei Hsiao
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Patent number: 7955088Abstract: One embodiment is an axially compliant electrical contactor for interconnecting microelectronic devices, the contactor including: an insulative sleeve having a hole therethrough; and a metal tube having a cylindrical wall being slidably disposed in the hole; wherein: (a) two or more elongated slots through the cylindrical wall extend from a first circumferential collar of the tube to a second circumferential collar of the tube; (b) the two or more slots form two or more elongated resilient legs connecting the first collar and the second collar; and (c) a portion of each elongated leg is disposed in the hole.Type: GrantFiled: April 21, 2010Date of Patent: June 7, 2011Assignee: Centipede Systems, Inc.Inventor: Thomas H. Di Stefano
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Patent number: 7938652Abstract: An electrical connector includes an insulative housing and a plurality of terminals secured in the insulative housing. The insulative housing defines a mating surface and a mounting surface opposite to the mating surface and includes a plurality of posts extending from the mounting surface away from the mating surface, the posts defining a distal surface. The insulative housing defines a plurality of mating passageways penetrating through the mating surface of the insulative housing and the distal surfaces of the posts and a plurality of receiving passageways corresponding to the mating passageways. Each terminal includes a retention portion retained in the receiving passageway, an engaging portion extending in one corresponding mating passageway and a soldering portion extending in the mounting face.Type: GrantFiled: July 21, 2010Date of Patent: May 10, 2011Assignee: Hon Hai Precision Ind. Co., Ltd.Inventors: Sheng-Ho Yang, Chun-Chieh Yang
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Patent number: 7936063Abstract: A carrier assembly for an integrated circuit is disclosed. The carrier assembly has a retainer with electrical contacts for receiving the integrated circuit, and island defining portions arranged about the retainer. Each island defining portion is connected to neighboring island defining portions through a serpentine member. This connection allows resilient deflection between the island defining portions.Type: GrantFiled: April 22, 2010Date of Patent: May 3, 2011Assignee: Silverbrook Research Pty LtdInventor: Kia Silverbrook
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Publication number: 20110086522Abstract: A connector assembly includes a printed circuit having a component surface, and an electrical connector having a bottom side mounted on the component surface of the printed circuit. The electrical connector extends a length from a mating face to a rear side that is opposite the mating face. The electrical connector is configured to mate with a mating connector at the mating face. The assembly includes a support member that includes a body having a connector face and a circuit face. The support member is positioned such that the connector face engages the rear side of the electrical connector and the circuit face engages the component surface of the printed circuit to support the electrical connector on the printed circuit.Type: ApplicationFiled: October 9, 2009Publication date: April 14, 2011Inventors: Keith McQuilkin Murr, Jordan M. Cole, Brian Patrick Costello
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Publication number: 20110081791Abstract: A connector for a flexible cable is provided. Connection parts of an even terminal and an odd terminal alternately cross each other to align a rotation center with the center of an X-shape. Operation parts of the terminals are divided into rotation start sections and rotation end sections. Recesses of the rotation start sections are deeper than recesses of the rotation end sections. A stopper prevents reduction of a contact pressure after a rotator engages with the rotation end sections at an angle of 90°.Type: ApplicationFiled: May 28, 2009Publication date: April 7, 2011Applicant: MOLEX INCORPORATEDInventor: YongSoo Kim
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Patent number: 7909620Abstract: A low-profile socket contact is provided that is mountable on a print substrate and has a high contact pressure. The socket contact includes a base portion provided on a print substrate, and a contact connecting portion connecting to the tab-shaped contact provided on a central portion of the base portion. The base portion has an opening in which the tab-shaped contact passes through, and a plurality of lead portions solderable to the print substrate. The contact connecting portion has a pair of first bending fragments, a pair of first inverted arms, a pair of second bending fragments, and a pair of second inverted arms. A contact point in contact with the tab-shaped contact is provided on each front ends of the pair of first inverted arms, and a guiding face in which the tab-shaped contact slides is provided on the pair of second inverted arms.Type: GrantFiled: March 13, 2009Date of Patent: March 22, 2011Assignee: J.S.T. Mfg. Co., Ltd.Inventors: Katsuyuki Masaki, Masaki Kishimoto
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Publication number: 20110053392Abstract: Connection terminals each include: a bonding portion bonded to a pad of a substrate; a contacting portion disposed to face the bonding portion; a spring portion present between the bonding portion and the contacting portion; and an engaging portion engaged with a portion of a slit provided in a plate-like member. These constituent portions of the connection terminal are formed integrally with each other. The plate-like member has recessed portions formed at predetermined positions, and the connection terminals are electrically connected to the pads of the substrate with the bonding portions of the connection terminals being locked to the recessed portions.Type: ApplicationFiled: August 16, 2010Publication date: March 3, 2011Applicant: SHINKO ELECTRIC INDUSTRIES CO., LTD.Inventor: Yoshihiro IHARA
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Publication number: 20110021044Abstract: An electrical connector includes an insulative housing and a plurality of terminals secured in the insulative housing. The insulative housing defines a mating surface and a mounting surface opposite to the mating surface and includes a plurality of posts extending from the mounting surface away from the mating surface, the posts defining a distal surface. The insulative housing defines a plurality of mating passageways penetrating through the mating surface of the insulative housing and the distal surfaces of the posts and a plurality of receiving passageways corresponding to the mating passageways. Each terminal includes a retention portion retained in the receiving passageway, an engaging portion extending in one corresponding mating passageway and a soldering portion extending in the mounting face.Type: ApplicationFiled: July 21, 2010Publication date: January 27, 2011Applicant: HON HAI PRECISION INDUSTRY CO., LTD.Inventors: SHENG-HO YANG, CHUN-CHIEH YANG
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Publication number: 20110014801Abstract: An electrical socket comprises a socket body and a plurality of contacts. The socket body comprises a first section and a second section, the first section and the second section each having a plurality of contacts received therein, the first section defining an upper face being spaced away from a top face of the second section in a vertical direction.Type: ApplicationFiled: July 16, 2010Publication date: January 20, 2011Applicant: HON HAI PRECISION INDUSTRY CO., LTD.Inventor: FANG-JWU LIAO
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Publication number: 20110003493Abstract: An USB memory card (100) for mating with a receptacle connector includes a PCB (1) having opposed upper and lower surfaces; a set of metal contacting pads (13) disposed on the upper surface of the PCB; a metal shell (5) enveloping the upper surface of the PCB and collaborating with the upper surface to form a receiving space (101) for receiving a tongue plate of the receptacle connector; and a metal film (15) covering the lower surface of the PCB.Type: ApplicationFiled: July 5, 2010Publication date: January 6, 2011Applicant: HON HAI PRECISION INDUSTRY CO., LTD.Inventors: CHI-TUNG MO, MING-CHANG TSAI, JUI-CHI SU, YUH-HUEY KANG
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Publication number: 20110003492Abstract: A board includes a board body; a first conductor provided at a first surface of the board body; and an electrically conductive connection terminal having a spring property. The connection terminal includes a first end part fixed to the first conductor; a second end part to be connected to a first object of connection to be placed opposite the first surface of the board body; and a projection part provided on the first end part so as to project toward the first conductor.Type: ApplicationFiled: June 28, 2010Publication date: January 6, 2011Inventor: Yoshihiro IHARA
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Publication number: 20100311256Abstract: An electrical connector includes an insulative housing defining a receiving room having a bottom wall and a mating portion extending upward from an inner face of the bottom wall of the receiving room and a plurality of contacts received in the housing. The mating portion has a plurality of receiving passageways communicating with the receiving room and a plurality of nose portions are above the receiving passageways. Each contact defines an elastic portion, a soldering portion, and a fixing portion between the elastic portion and a soldering portion. The elastic portion includes a first contacting portion protruding from the nose portion in the receiving room, a second contacting portion extending from the fixing portion, and a connecting portion between two contacting portions and defining an arc portion extending in an upward-to-downward direction and under the nose portion. The arc portion defines a node extending far from the nose portion.Type: ApplicationFiled: June 8, 2010Publication date: December 9, 2010Applicant: HON HAI PRECISION INDUSTRY CO., LTD.Inventor: MING-CHING CHEN
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Patent number: 7837476Abstract: A socket assembly formed of hollow tubes for connecting an array of terminals off opposing electronic structures with both axial and lateral resilience, wherein the resilience is achieved through angular cuts in the tubes.Type: GrantFiled: August 11, 2009Date of Patent: November 23, 2010Assignee: Centipede Systems, Inc.Inventor: Thomas H. Di Stefano
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Patent number: 7837481Abstract: A socket for an integrated circuit is disclosed. The socket comprises a main body portion having a plurality of holes extending between a top surface and a bottom surface; an overlay positioned adjacent to the main body portion and having a plurality of holes corresponding to the plurality of holes of the main body portion, wherein the overlay comprises a plurality of conductors between holes; and a plurality of contact elements positioned in predetermined holes of the main body portion. A method of providing a connection in a socket is also disclosed.Type: GrantFiled: January 14, 2008Date of Patent: November 23, 2010Assignee: Xilinx, Inc.Inventors: David M. Mahoney, Mohsen Hossein Mardi
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Publication number: 20100279523Abstract: In order to separably connect an electric conductor (16) to a printed circuit board (2), it is proposed to insert a connecting element (1) into an opening (3) in the printed circuit board (2). In this case, a sleeve-like contact region (21) of the connecting element (1) is clamped against the inner surface (4) of the opening (3) by means of a clamping pin (7).Type: ApplicationFiled: April 20, 2010Publication date: November 4, 2010Inventors: Hartmut Schwettmann, Andreas Nass, Stefan Schnieder
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Publication number: 20100261359Abstract: An electro-magnetic interference device attached to a surface of an object by soldering is disclosed. The device comprises a base comprising a surface defining at least one recessed portion. The at least one recessed portion comprises a side wall. An angle between the side wall and the surface of the base is equal to or greater than 90 degrees.Type: ApplicationFiled: April 1, 2010Publication date: October 14, 2010Applicants: HONG FU JIN PRECISION INDUSTRY (ShenZhen) CO., LTD., HON HAI PRECISION INDUSTRY CO., LTD.Inventors: MING-CHIH CHAN, XIAO-QIN JIANG
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Patent number: 7806703Abstract: A component part has an electrical printed circuit board (12), which has an electronic circuit and has been contact-connected to a lead frame (10), which is generally surrounded at least partially by plastic (11), in which first contact elements (14) protrude on the lead frame (10) adjacent to the printed circuit board (12) and are mechanically connected to second contact elements (16) on the printed circuit board (12) via a flexible intermediate region (30), wherein the first and the second contact elements (16) are contact-connected to one another in pairs in such a way that in each case at least one punctiform and/or linear contact region (25, 27) on one contact element (14) interacts with a flat contact region on the other contact element (16) in a clamping connection.Type: GrantFiled: December 18, 2006Date of Patent: October 5, 2010Assignee: Continental Automotive GmbHInventor: Werner Wallrafen
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Patent number: 7798822Abstract: Microelectronic contact structures are fabricated by separately forming, then joining together, various components thereof. Each contact structure has three components: a “post” component, a “beam” component, and a “tip” component. The resulting contact structure, mounted to an electronic component, is useful for making an electrical connection with another electronic component. The post component can be fabricated on a sacrificial substrate, joined to the electronic component and its sacrificial substrate removed. Alternatively, the post component can be formed on the electronic component. The beam and tip components can each be fabricated on a sacrificial substrate. The beam component is joined to the post component and its sacrificial substrate is removed, and the tip component is joined to the beam component and its sacrificial substrate is removed.Type: GrantFiled: July 28, 2009Date of Patent: September 21, 2010Assignee: FormFactor, Inc.Inventors: Benjamin N. Eldridge, Gary W. Grube, Igor Y. Khandros, Gaetan L. Mathieu
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Publication number: 20100216321Abstract: An adapter apparatus includes a substrate having a plurality of openings defined therethrough. Further, a sleeve spring contact is mounted in each of the openings.Type: ApplicationFiled: February 26, 2009Publication date: August 26, 2010Applicant: Ironwood Electronics, Inc.Inventors: Mickiel P. Fedde, Ranjit Raghunath Patil
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Patent number: 7780460Abstract: The invention relates to a connecting terminal with an insulating housing and a clamping contact positioned in the connecting terminal housing for the purpose of connecting an electrical conductor, such that a contact spring, which is electrically connected to the clamping contact in the housing, is guided through an initial hole in the housing of connecting terminal to the outside of the housing, and where the contact spring is so designed that it presses against the contact surface of the circuit board when the connecting terminal is mounted on a circuit board, to thereby produce an electrical contact between the circuit board and the clamping contact.Type: GrantFiled: September 10, 2008Date of Patent: August 24, 2010Assignee: MC Technology GmbHInventor: Frank Walter
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Publication number: 20100190362Abstract: A component part has an electrical printed circuit board (12), which has an electronic circuit and has been contact-connected to a lead frame (10), which is generally surrounded at least partially by plastic (11), in which first contact elements (14) protrude on the lead frame (10) adjacent to the printed circuit board (12) and are mechanically connected to second contact elements (16) on the printed circuit board (12) via a flexible intermediate region (30), wherein the first and the second contact elements (16) are contact-connected to one another in pairs in such a way that in each case at least one punctiform and/or linear contact region (25, 27) on one contact element (14) interacts with a flat contact region on the other contact element (16) in a clamping connection.Type: ApplicationFiled: December 18, 2006Publication date: July 29, 2010Applicant: Continental Automotive GmbHInventor: Werner Wallrafen
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Patent number: 7762820Abstract: A socket connector (10) utilizes contacts (41) that have a shape similar to an inverted ohm sign and which have two flexible contact arms (43) located at one end thereof for contacting elements such as solder balls (62). The other end of the contact have a closed end and the contacts may be slotted in increase their flexibility or they may be solid.Type: GrantFiled: June 27, 2007Date of Patent: July 27, 2010Assignee: Molex IncorporatedInventor: Yutaka Kojima
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Publication number: 20100184311Abstract: Micro-machined (e.g., stress-engineered spring) structures are produced by forming a release layer, forming a partially or fully encapsulated beam/spring structure, and then releasing the beam/spring structure by etching the release layer. The encapsulation structure protects the beam/spring during release, so both the release layer and the beam/spring can be formed using plating and/or using the same material. The encapsulation structure can be metal, resist, polymer, oxide, or nitride, and may be removed after the release process, or retained as part of the completed micro-machined structure.Type: ApplicationFiled: March 19, 2010Publication date: July 22, 2010Applicant: Palo Alto Research Center IncorporatedInventors: Thomas Hantschel, Sven Kosgalwies, Eugene M. Chow, Gordon Todd Jagerson, JR.
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Publication number: 20100144213Abstract: An electrical connector (100) includes an insulative housing (1) and at least one contact (2) retained in the housing. The housing includes a base portion (11) and a mating portion (12) extending forwards from the base portion, and the base portion defines a mounting face (114) thereof and the mating portion defines a mating cavity (121) extending from a mating face (120) into the housing. The at least one contact defines a retaining portion (21) retained in the base portion, a resilient arm (22) extending from the retaining portion with a part projecting into the mating cavity and a soldering leg (23) arranged to parallel to the mounting face. The soldering leg is disposed within the scope of the mounting face and defines a first and a second soldering portion (231, 232) forming an angle therebetween.Type: ApplicationFiled: August 3, 2009Publication date: June 10, 2010Applicant: HON HAI PRECISION INDUSTRY CO., LTD.Inventors: Kuo-Lung Lin, Kuo-Chun Hsu
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Patent number: 7731509Abstract: A battery connector includes an insulating housing defining a receiving cavity cutting through a top surface and a bottom surface thereof and a conductor accommodated in the corresponding receiving cavity of the insulating housing. The conductor includes a substantial inverted U-shaped contacting portion exposed beyond the top surface of the insulating housing. A pair of substantially symmetrical elastic portions which extends downward from two lower free ends of the contacting portion respectively is restricted in the receiving cavity. A pair of soldering portions extends from two lower ends of the elastic portions. Because the conductor has a substantially symmetrical structure, the force acted on the conductor is shared out equally between the pair of elastic portions. Therefore, the conductor is prevented from offsetting when the battery connector is in use. It ensures the stable contact between the battery and battery connector.Type: GrantFiled: August 6, 2009Date of Patent: June 8, 2010Assignee: Cheng Uei Precision Industry Co., Ltd.Inventor: Hong-Tu Zhang
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Patent number: 7731504Abstract: A printed circuit board according to the present invention is a printed circuit board (4) including a component mounting pin (1) made of a metal wire to connect with a semiconductor chip (10). The semiconductor chip (10) is a surface mounting type semiconductor chip having an electrode pad on its mounting surface for use in a flip-chip mounting system. The component mounting pin (1) is formed by using wire-bonding technology. This printed circuit board (4) is able to decrease malconnections or disconnection caused by a difference between the coefficients of thermal expansion of the semiconductor chip (10) and the printed circuit board (4).Type: GrantFiled: October 20, 2008Date of Patent: June 8, 2010Assignee: Ibiden Co., Ltd.Inventors: Takashi Kariya, Toshiki Furutani, Takeshi Kawanishi
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Patent number: 7730615Abstract: Micro-machined (e.g., stress-engineered spring) structures are produced by forming a release layer, forming a partially or fully encapsulated beam/spring structure, and then releasing the beam/spring structure by etching the release layer. The encapsulation structure protects the beam/spring during release, so both the release layer and the beam/spring can be formed using plating and/or using the same material. The encapsulation structure can be metal, resist, polymer, oxide, or nitride, and may be removed after the release process, or retained as part of the completed micro-machined structure.Type: GrantFiled: February 26, 2008Date of Patent: June 8, 2010Assignee: Palo Alto Research Center IncorporatedInventors: Thomas Hantschel, Sven Kosgalwies, Eugene M. Chow, Gordon Todd Jagerson, Jr.
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Publication number: 20100130035Abstract: A power semiconductor module having a housing, a pressure member, a substrate including at least one contact surface, and at least one connection element leading towards the exterior of the housing. The connection element has a first contact device, a resilient section and a second contact device. The pressure member has two stop elements. The first contact device is electrically conductively connected to the contact surfaces of the substrate. The second contact device is arcuate in shape and has at least one deformation at the beginning and at the end of the arc, wherein, as a result of the deformations of the second contact device co-operating with the two stop elements of the pressure member, the connection element is prestressed.Type: ApplicationFiled: November 19, 2009Publication date: May 27, 2010Applicant: SEMIKRON Elektronik GmbH & Co. KGInventor: Marco LEDERER
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Patent number: 7722393Abstract: A battery connector adapted for being electrically connected with a printed circuit board includes an insulating housing defining a plurality of terminal passageways, a plurality of fixing members fastened in the insulating housing and stretching beyond a top surface of the insulating housing for being soldered to the printed circuit board, and a plurality of electrical terminals disposed in the corresponding terminal passageways and each having a fixing board, a first contact portion stretching out of a bottom surface of the insulating housing and a substantially lying-V shaped second elastic portion extended from a top of the fixing board. A free end of the second elastic portion stretches out of the top surface of the insulating housing and is arched upward to form a second contact portion capable of elastically abutting against the printed circuit board.Type: GrantFiled: December 1, 2008Date of Patent: May 25, 2010Assignee: Cheng Uei Precision Industry Co., Ltd.Inventors: Sheng-Yuan Huang, Yung-Chi Peng
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Patent number: 7712215Abstract: A method for assembling a flexible bus connector is disclosed, which includes the following steps. The first is a preparing step. An insulative housing and a plurality of terminals are provided. The insulative housing defines an opening and a plurality of passageways, and forms an upper side wall, a lower side wall, and a rear wall corresponding to the opening. The second is an assembling step. Each terminal includes at least a contact portion, a support portion and a soldering portion. The contact portion and the support portion are located near the opening when assembled, and the soldering portion extending toward the rear wall of the insulative housing. The third is a positioning step. A lower end of the soldering portion is located on a position where the lower end is lower than an inner surface of the lower side wall of the insulative housing.Type: GrantFiled: January 7, 2008Date of Patent: May 11, 2010Assignee: P-Two Industries Inc.Inventors: Chien Chun Wang, Tung Chiung Kua