Abstract: Embodiments of the invention include connector assembly for a handheld computer. The connector assembly includes a plurality of conductive elements disposed on a first side of a printed circuit board housed with the handheld computer. One or more of the conductive elements has a pointed end.

Abstract: A contact element (4) comprises a fixed section (5) inserted into the slot (2) along the first minor side of the slot, a flexible section (6) extending from the fixed section toward the second minor side of the slot in a plane and being flexible in the plane, and contact portions (7A, 7B) extending from the flexible section so as to project from the major faces of a housing (1). The fixed section, the flexible section, and the contact portions are in the plane parallel to the major faces of the slot. A conductive layer or sheet (3) is provided on the major sides of the slot. A sliding contact (8A, 8B) are provided near the contact portions are brought into sliding contact with the conductive layer or sheet.

Abstract: Provided is a micro-machine mirror structure with hinges which after being released from a sacrificial layer will result in the mirror structure being lifted out of the plane of the substrate to a fixed defined geometric angle. Stresses in a metal layer of the mechanism, along with a constraint mechanism, causes the mirror structure to be maintained at the desire angle.

Abstract: Efficient methods for lithographically fabricating spring structures onto a substrate containing contact pads or metal vias by forming both the spring metal and release material layers using a single mask. Specifically, a pad of release material is self-aligned to the spring metal finger using a photoresist mask or a plated metal pattern, or using lift-off processing techniques. A release mask is then used to release the spring metal finger while retaining a portion of the release material that secures the anchor portion of the spring metal finger to the substrate. When the release material is electrically conductive (e.g., titanium), this release material portion is positioned directly over the contact pad or metal via, and acts as a conduit to the spring metal finger in the completed spring structure. When the release material is non-conductive, a metal strap is formed to connect the spring metal finger to the contact pad or metal via, and also to further anchor the spring metal finger to the substrate.

Abstract: An interposer for interconnection between microelectronic circuit panels has contacts at its surfaces. Each contact has a central axis normal to the surface and a peripheral portion adapted to expand radially outwardly from the central axis responsive to a force applied by a pad on the engaged circuit panel. Thus, when the circuit panels are compressed with the interposers, the contacts expand radially and wipe across the pads. The wiping action facilitates bonding of the contacts to the pads, as by conductive bonding material carried on the contacts themselves.

Abstract: An interconnection contact structure assembly including an electronic component having a surface and a conductive contact carried by the electronic component and accessible at the surface. The contact structure includes an internal flexible elongate member having first and second ends and with the first end forming a first intimate bond to the surface of said conductive contact terminal without the use of a separate bonding material. An electrically conductive shell is provided and is formed of at least one layer of a conductive material enveloping the elongate member and forming a second intimate bond with at least a portion of the conductive contact terminal immediately adjacent the first intimate bond. The component carries the contact structures on both sides, the spacing of the structures on the first side being different than that of the second side.

Abstract: Provided is a micro-machine mirror structure with hinges which after being released from a sacrificial layer will result in the mirror structure being lifted out of the plane of the substrate to a fixed defined geometric angle. Stresses in a metal layer of the mechanism, along with a constraint mechanism, causes the mirror structure to be maintained at the desire angle.

Abstract: An interposer for interconnection between microelectronic circuit panels has contacts at its surfaces. Each contact has a central axis normal to the surface and a peripheral portion adapted to expand radially outwardly from the central axis responsive to a force applied by a pad on the engaged circuit panel. Thus, when the circuit panels are compressed with the interposers, the contacts expand radially and wipe across the pads. The wiping action facilitates bonding of the contacts to the pads, as by conductive bonding material carried on the contacts themselves.

Abstract: Temporary connections to spring contact elements extending from an electronic component such as a semiconductor device are made by urging the electronic component, consequently the ends of the spring contact elements, vertically against terminals of an interconnection substrate, or by horizontally urging terminals of an interconnection substrate against end portions of the spring contact elements. A variety of terminal configurations are disclosed.

Abstract: A method and apparatus for interconnecting at least two devices. Each of the interconnected devices includes a contact structure for electrically and/or physically interconnecting the devices. Preferably, the contact structure for at least one of the devices includes a spring contact. An adhesive, such as a UV-curable adhesive, is applied to at least a portion of one of the devices, and once the adhesive is applied, the devices are assembled, i.e., brought into sufficient proximity so that the contact structures interconnect the devices. The adhesive can be applied directly to contact structures of one of the devices and/or can be applied to other portions of the devices so that the adhesive flows around the contact structures during assembly. The adhesive is then cured to bond the devices together.

Abstract: A contact arrangement and method of producing the contact arrangement for electrical connection between mutually opposite contact points disposed on a surface of a first and second substrate. The contact arrangement further includes an insulating body disposed between the surfaces of the first and second substrate. The insulating body has holes extending between opposite sides of the insulating body wherein a conductive layer is disposed on a surface of the holes. A contact element mat is disposed on opposite sides of the insulating body. The contact element mat includes interconnected contact elements having projections respectively engaging depressions that surround each hole.

Abstract: A terminal attachment structure includes a circuit assembly and a terminal attached to the circuit assembly. The circuit assembly has an insulating substrate and a circuit printed on the insulating substrate. The terminal is composed of a circuit-contact part, a connecting part to be connected with a mating terminal and a cradle part arranged between the circuit-contact part and the connecting part. When a force directing the insulating substrate is applied on the connecting part, the cradle part operates to receive the force. Accordingly, the circuit-contact part does not rise from the insulating substrate, so that clattering of the terminal against the circuit assembly can be prevented.

Abstract: An electrical connector in a portable telecommunication device with a built-in antenna to enable the device to connect with an external antenna, comprises a dielectric housing having a base portion defining first and second chambers communicating with each other via a passage, and a cylindrical portion defining a hole therethrough in communication with the first chamber, a first contact fixedly received in the first chamber and electrically connecting with speaker/receiver circuitry of the device and a second contact fixedly received in the second chamber and electrically connecting with the built-in antenna. When the connector does not connect with a mating connector in electrical connection with an external antenna, the first contact electrically engages with the second contact by a spring force generated from the first contact.

Abstract: An electronic control unit has a connector intervening between an external load and a printed circuit board inside the unit housing including a circuit casing and a connector casing both formed integrally therewith. At least one connector terminal of the connector is provided with a buffering portion effective to absorb an external stress. This connector terminal can be accurately and precisely constrained in a housing and can provide a stabilized electrical connection with a high workability.

Abstract: A fastener apparatus for mechanically connecting and holding the main housing of an electrical device, such as an electrical connector, to a substrate, such as a PCB, in a manner that allows for a relatively low insertion force and a corresponding relatively high retention force. The fasteners are adapted for attachment to both an electrical connector and to a substrate, thereby forming a mechanical connection between the two. Preferably, one or more fasteners are attached to the housing of the electrical connector and then the electrical connector having fasteners extending therefrom is connected to board openings formed in the PCB. The fastener apparatus is constructed having one or more arms connected to a bottom end of the fastener, the arms sweep outward and upward from the bottom end toward the top end. Preferably, the arms have a cantilevered design that allows the arms to deflect inward during insertion of the fastener into the board openings, thereby providing for a relatively low insertion force.

Abstract: A semiconductor package and method for fabricating the package are provided. The package includes a housing having individual channels, each adapted to retain a semiconductor die in electrical communication with electrical connectors. The dice can include solder bumps, formed on electrodes, using electroless deposition and wave soldering. For fabricating the package, the dice can be inserted into the channels, with the electrical connectors on the housing proximate to the solder bumps on the dice. The solder bumps can then be reflowed to form bonded connections with the electrical connectors. In an alternate embodiment, conductive adhesive bumps, rather than solder bumps, are formed on the dice to provide compliant connections with the electrical connectors on the housing. In addition, the conductive adhesive bumps can be cured while in contact with the electrical connectors to form bonded connections.

Abstract: An electric component with a soldering-less terminal fitment capable of preventing a contact portion of the terminal fitment from being detached from an electrode on a surface of a circuit board due to slippage thereof on the circuit board. A terminal fitment arranged between a circuit board and an insulating casing includes a connection conductor holding section and a contact terminal section having a proximal portion formed integrally with the connection conductor holding section. The contact terminal section includes a contact portion, which is pressedly contacted with an electrode on the circuit board by elasticity. The contact terminal section includes a curved portion which is curved in a manner to be projected in a direction of insertion of a connection conductor through the terminal fitment and provided on a distal end thereof with the contact portion. The contact portion is constituted by a biting element.

Abstract: A terminal-receiving socket assembly (10) is mounted on the bottom of a printed circuit board (12). The socket assembly includes a housing (22) having a terminal-receiving passage (28) in registry with a hole (14) in the board. A conductive contact (32) is mounted on the housing (22) for connection to a circuit (16) on the board and includes a pair of opposing contact arms (36) on opposite sides of the terminal-receiving passage (28) and engageable with a terminal (20) inserted thereinto. The terminal is inserted from the top of the board into the passage (28) and causes the contact arms (36) to flex downwardly (B) and outwardly, allowing for easy insertion of the terminal. However, withdrawal of the terminal (20) causes the flexible contact arms (36) to bias toward each other against the terminal to increase the withdrawal forces of the terminal.

Abstract: A spring contact 10 has a pair of round contact projections 11 and 12 symmetrically formed at both sides of a peak of a bending top thereof. The spring contact is fixed to an insulator 20 at a central portion thereof and has a second contact region 13 at a lower end thereof. The spring contact is located in a natural condition where no external force is applied. In this condition, the round contact projection 11 is located at a position remotest from the surface of the insulator. When an electronic part approaches perpendicularly to the surface of the insulator, a contact pad of the electronic part at first touches one of the round contact projections 11 and finally touches the other of the round contact projections 12 after the spring contact is deformed and displaced to a deformed position. At this time, the wiping displacement d of the spring contact in the direction perpendicular to the connecting direction of this connector is extremely small.

Abstract: A method for manufacturing raised contacts on the surface of an electronic component includes bonding one end of a wire to an area, such as a terminal, of the electronic component, and shaping the wire into a wire stem configuration (including straight, bent two-dimensionally, bent three-dimensionally). A coating, having one or more layers, is deposited on the wire stem to (i) impart resilient mechanical characteristics to the shaped wire stem and (ii) more securely attach ("anchor") the wire stem to the terminal. Gold is one of several materials described that may be selected for the wire stem. A variety of materials for the coating, and their mechanical properties, are described. The wire stems may be shaped as loops, for example originating and terminating on the same terminal of the electronic component, and overcoated with solder. The use of a barrier layer to prevent unwanted reactions between the wire stem and its environment (e.g., with a solder overcoat) is described.

Abstract: There is disclosed herein an electronic circuit assembly, comprising: (1) a plastic molded substrate 10 having a first surface 12 with a mounting pad 14 disposed thereon; (2) a reinforcing member 20 having a first member portion 22 and a second member portion 24, wherein the first portion 22 is embedded within the substrate 10 beneath the first surface 12 thereof proximate the mounting pad 14 and wherein the second portion 24 is oriented generally parallel with and at a first predetermined distance h.sub.1 above the mounting pad 14; (3) an electronic surface mount component 18 having a termination 16 thereon, the component 18 being oriented such that the termination 16 is disposed at a second predetermined distance h.sub.2 above the second member portion 24; and (4) a solder joint 30 connecting the component termination 16 with the mounting pad 14 and the second member portion 24.

Abstract: An assembly for mounting an electric/electronic device (300) to a printed circuit board (PCB) (310) of an electronic system. The printed circuit board (310) is provided with first and second openings (311 and 312, respectively). The assembly includes a connector (320) mounted on a first side of the PCB (310) and the device (300) mounted on a second side of the PCB (310), the device (300) including a bushing (302) which extends through the first opening (311) and is fastened to the connector (320) by a nut (330). Male leads (304) of the device (300) are each plugged into a female terminal opening (324) of the connector (320) through the second opening (312). The connector (320) also includes leads having first ends located in the female terminal (323) for contacting the male device leads (304), and second ends which are soldered to conductive traces formed on the PCB (310) for providing connections between the PCB (310) and the device (300). Nut (330) is used to fasten bushing (302) to connector (320).

Abstract: A terminal attachment structure includes a circuit assembly and a terminal attached to the circuit assembly. The circuit assembly has an insulating substrate and a circuit printed on the insulating substrate. The terminal is composed of a circuit-contact part, a connecting part to be connected with a mating terminal and a cradle part arranged between the circuit-contact part and the connecting part. When a force directing the insulating substrate is applied on the connecting part, the cradle part operates to receive the force. Accordingly, the circuit-contact part does not rise from the insulating substrate, so that tottering of the terminal against the circuit assembly can be prevented.

Abstract: A photolithographically patterned spring contact is formed on a substrate and electrically connects contact pads on two devices. The spring contact also compensates for thermal and mechanical variations and other environmental factors. An inherent stress gradient in the spring contact causes a free portion of the spring contact to bend up and away from the substrate. An anchor portion remains fixed to the substrate and is electrically connected to a first contact pad on the substrate. The spring contact is made of an elastic material and the free portion compliantly contacts a second contact pad, thereby electrically interconnecting the two contact pads.

Abstract: A contact for the through-connection of a printed circuit board through a hole is specified, having a central pin made of a conductive material; arms, which are designed in an essentially C-shaped manner, are arranged on the pin on two opposite sides; and a plastic body is provided on one end of the pin, which body surrounds the pin and, on the side facing away from the pin, has a surface extending perpendicularly to the pin, which can be used as suction surface for the automatic processing of the contact.

Abstract: A terminal for mounting on a printed circuit board (PCB) has a receptacle contact portion for receiving a complementary pin therein between contact arms. The contact section is connected to the PCB connection section by long spring arms that comprise a series of spring beams oriented in different planes. The spring arms are thus supple in X, Y and Z directions to allow great floatability of the contact sections with respect to the PCB.

Abstract: A printed circuit board ground clip is provided having upwardly extending retainers and downwardly extending legs. The legs are designed to insert within plated-through holes of a variable thickness printed circuit board. The upwardly extending retainers terminate as a spaced pair of flanges which frictionally receive and electrically couple with a hook. The hook extends from the chassis of an electronic device, through a slot within the printed circuit board and between the spaced flanges. Accordingly, the hook and ground clip form an electrical conduit between a ground supply connected to the electronic device chassis and a ground conductor formed within the printed circuit board. Chassis-to-ground conductor attachment is performed during assembly of the board to the chassis backplane. Attachment can be quickly and easily reversed to allow board re-work, without requiring placement of heat upon the board.

Abstract: A photolithographically patterned spring contact is formed on a substrate and electrically connects contact pads on two devices. The spring contact also compensates for thermal and mechanical variations and other environmental factors. An inherent stress gradient in the spring contact causes a free portion of the spring contact to bend up and away from the substrate. An anchor portion remains fixed to the substrate and is electrically connected to a first contact pad on the substrate. The spring contact is made of an elastic material and the free portion compliantly contacts a second contact pad, thereby electrically interconnecting the two contact pads.

Abstract: A flexible circuit construction allows solder balls to be mass reflow attached to the ground plane of a double-sided flexible circuit by providing a first via which is separate from the remainder of the ground plane, but which is electrically connected to the ground plane through a second via at a distance from the first via by a circuit trace on the side of the flexible circuit opposite the ground plane.

Abstract: An electrical contact is provided for press-fit insertion into a circuit board, which produces a large retention force (resistance to pullout) with only moderate hole distortion, and which can be reliably produced at low cost. A press-fit section ( 14, FIG. 4) of the contact is of largely I-beam cross-section, with upper and lower flanges (60, 62) that each have outer faces (64, 66) for abutting the walls of the circuit board hole, and with a web (70) connecting the flanges. The entire cross-section of the contact is of rigid construction for minimal deformation when inserted into the hole, so most of the deformation is of the hole. Each flange face has about the same radius of curvature (C) as that of the hole, and the web is narrower than the flanges, but thick enough to avoid substantial bending.

Abstract: A method of simulating individualized art instruction is provided. The method utilize a CD compact disc playable on a CD-I compact disc player hooked up to a television. Each edition of a compact disc showcases a well-known instructor and background information. The actual instructor does the voice over, giving instructions at each step. Next, a substantially perfectly lit image appears; this image is a view of the object of study (i.e., the model, the still life, the landscape). Then, a completed painting of said object appears, the completed painting having been executed by the instructor. The screens contain step-by-step images of different stages of completion. At each screen, the instructor talks about what he or she is doing and why. The instructor can relate the actual colors and fundamental techniques used.

Abstract: An arrangement for making fatigue-free external connections to a device mounted on a direct copper bonded substrate, in which one or more connector tubes are brazed to respective copper areas on the substrate before the device is mounted on the substrate, and external connections are made by soldering leads or bus bars into the tubes.

Abstract: A module substrate consists of a substrate mounting electronic parts on one surface thereof, a conductor for electrically conducting the electronic parts mounted on the substrate to the other surface of the substrate, a conductive solder for attaching the conductor to a base substrate movably contacting the other surface of the substrate to electrically connect the electronic parts with the base substrate, and a deformable bushing for holding the conductor to maintain the attachment of the conductor to the base substrate regardless of whether the base substrate is moved.

Abstract: A process for manufacturing a housed metallic contact connector (1) for interconnecting electronic devices (17) comprising: (a) stamping from a conductive metal strip (7) a contact connector array (8), placing said contact connector array (8) into a mold, and injection molding directly around the contact connector array (8) a plastic to form an integral housing (4) directly around the stamped contact connector array (8). A plastic housed contact connector (1) forms part of the disclosed invention. Also forming part of this invention is a metallic array (8) with an aperture (11) to more efficiently bind plastic to the housing (4).

Abstract: A board-to-board interconnect connector apparatus is provided which substantially improves electrical connection even when some positional displacement occurs between a receptacle housing and a header housing. The connector apparatus includes the receptacle housing mountable on a mother board and the header housing mountable on a daughter board. Receptacle contact terminals are arranged in a parallel array in the receptacle housing, and header contacts terminals are arranged in another parallel array in the header housing. The surface of the contact terminal is angled relative to the direction of a pitch of the contact terminals. Thus, when some positional displacement of the receptacle housings occurs in the pitch array direction of the contact terminals, the receptacle contact terminals are kept in contact with the header contact terminals.

Abstract: A connector assembly for interconnecting microwave integrated circuit modules where each module has at least one microwave interconnection pin and one DC power pin. A groundplane (28) supports the mounting surfaces (32) of the modules (10) and has a plurality of holes (38, 40) for receiving the interconnection pins (18) and the DC power pins (22) of the modules. A conducting layer (78) opposite the mounting surface of the groundplane receives microwave signals from the interconnection pins extending down through it and communicates these signals between different modules. Resilient bellows and stripline are used to ensure matched impedances and secure microwave connections. The DC power pins extend through the conducting layer (78) and isolating groundplane (28) and a DC power grid board (88) where an electrical connection is made with each DC power pin.

Abstract: A structure and method for forming contact structures in integrated circuits. A buffer layer is formed over an underlying conductive element. A first conductive layer is then deposited over the buffer layer and patterned to define a first interconnect layer. While the first interconnect layer is patterned, the buffer layer protects the underlying conductive element from damage. Portions of the buffer layer which are not covered by the first interconnect layer are then removed, and a second conductive layer is deposited over the integrated circuit. The second conductive layer is then anisotropically etched to form conductive sidewall spacers alongside the vertical sidewalls of the first interconnect layer, where at least one of the conductive sidewall spacers makes electrical contact with the underlying conductive element. Therefore, a conductive contact is made between the underlying conductive element and the first interconnect layer through at least one of the conductive sidewall spacers.

Abstract: A surface mount connector comprises two assemblable housing parts for engagement with a circuit board and for mating with a complementary connector respectively. A series of contacts are anchored in the board engaging part and the other mating part is provided with contact locating surface portions which engage and press the contacts into a coplanar circuit board engaging position when the two housing parts are assembled together.

Abstract: An electrical connector for electrically connecting circuit boards together comprising a plug connector (10,40) having plug contacts (13,43) secured in an insulating housing (11a, 11b, 41a) at spaced intervals therealong; a receptacle connector (20,30,50,60) having receptacle contacts secured in an insulating housing (21,31,52a,62a) for electrical engagement with respective plug contacts (13,43) When the connectors are mated; the receptacle contacts and the plug contacts have interlocking sections (17,28,35,43b, 56a,66a) which are interlocked when the connectors are connected together thereby preventing their disengagement.

Abstract: An electrical connector (10) includes a first housing part (20) fixed to a circuit board and a second housing part (30) fitted within the first housing part and spaced therefrom to alow limited X, Y, and Z movement between such parts, contacts (40) are provided including solder post portions (42) mounted in the first housing part and contact portions (41) in the second housing part adapted to engage the contacts of a mating housing. The contact portions (41) and (42) are interconnected by an integral S-shaped spring (43) to facilitate limited and resilient movement of the contact portions and housing parts to relieve stresses and strains caused by mating and unmating of components, including further connectors to a circuit board through the connector. An alternative embodiment (10') includes legs (42') and a J-shaped contact portions (40') in the second housing part (30') with the connector (10') being adapted to be surface mounted and soldered on a circuit board.

Abstract: A inner jacket member 1 having slit elements 1a is inserted into an outer jacket member 2. An inner jacket member pressing portion, 4, 13 for closing or dilating the inner jacket member 1 is formed within said outer jacket member 2 in such a manner as to be opposite the front end portions 1b of the split elements 1 a. A male terminal 7, 8 to be contacted with an electric part, such as the leadless IC or the like, under pressure is disposed at a tail end of either of the outer and inner jacket members 2 and 1.

Abstract: A connector (22) includes a housing (24) having an array of first terminal-receiving passageways (34) each in communication with a spring arm receiving recess (38), each passageway (34) having a terminal member (50) disposed therein. Each terminal member (50) includes a body section (52) having a first connecting portion (54) adapted for surface mount engagement with a circuit pad (122) of a circuit board (120) and a spring arm portion (60). The spring arm portion (60) has a first transverse portion (62) extending laterally from the terminal member (50) proximate the first connecting portion (54), an axial portion (64) of a selected length extending from the first transverse portion (62) and toward a second connecting portion (72) of the terminal member (50), and a second transverse portion (68) extending toward the body section (52). The first transverse portion (62) extends essentially parallel to the mounting face (28) and is recessed therefrom.

Abstract: A contact assembly is provided for connecting pairs of terminals of two circuits, which allows terminals to be positioned at high densities with minimum crosstalk, selected impedances, and minimum inductances for fast pulse rise times. The apparatus includes a dielectric frame (30, FIG. 2) having multiple miniature cavities (46), and an extendable contact assembly (26) lying in each cavity and having a pair of probes (32, 34) projecting from opposite faces of the frame. The two probes of each contact assembly are slideably engaged and are biased apart by a spring (70), the spring being constructed of dielectric material to avoid inductances and to allow for a high characteristic impedance. The frame can include a body (104, FIG. 6) having multiple plated through holes or cavities (106), and end wall structures (114) having dielectric bushings (122) shorter than the body holes and fitting into the body cavities.

Abstract: An area array connector (32,42,50) for electrically interconnecting two electronic devices is disclosed. The connector (32,42,50) includes a plurality of contact elements (10) having parallel cantilevered contact fingers (18) extending obliquely outwardly from a plate (20) for one embodiment, a laminate (32) is formed by securing the contact elements (10) to a dielectric (26) having windows (28) through which the fingers (18) extend. The laminate (32) can then be fixed to a device such as a circuit board (40) to form another form of a connector (42) and further, the dielectric (26) can be removed to form yet another form of connector (50).

Abstract: According to the present invention, an electrical connector includes a body having first and second portions. The connector also includes a plurality of first contacts situated in the first portion of the body. Each of said first contacts includes a first end portion configured to be coupled to a conductive member on a printed circuit board and a second free end portion situated within the first portion of the body to define a movable spring contact surface section. The connector further includes a plurality of second contacts situated in the second portion of the body. Each of said second contacts includes a first end portion configured to be coupled to a conductive member on the printed circuit board and a second end portion coupled to the second portion of the body to define a fixed contact surface section.

Abstract: An electrical contact assembly (10) comprises a housing having a bottom portion (26) and a top portion (24), the top portion having a first inverted wall section (29) and a second inverted wall section (28), the housing having at least one aperture (31 and 32), the aperture extending from the bottom of the first inverted wall section to the bottom of the second inverted wall section. The assembly further comprises a substrate (20) within the housing having at least one contact area (22), and a contact finger (11) for placement in the housing aperture, the contact finger having at least a first portion (12), a second portion (14) and a third portion (16). The first portion protrudes below the aperture and contacts the contact area (22) on the substrate. The second portion (14) clips on to opposing walls of the second inverted wall (28) and the third portion (16) protrudes from the aperture (31) forming an external contact area.

Abstract: A connector (10) for electrically connecting a circuit between electronic devices has been disclosed. The connector (10) includes a platform (14, 64, 94, 114) with cantilevered spring arms (22, 62, 92, 112) extending obliquely outwardly therefrom. The spring arms (22, 62, 92, 112) include raised contact surfaces (26, 72, 102, 122) and in one embodiment, the geometry of the arms (22) provide compound wipe during deflection.

Abstract: The connector comprises an insulating support 20 in which are provided uniformly spaced passages and electrical signal contacts, each intended to connect a pad and a track, which are arranged in at least some of the passages.

Abstract: An electrical contact is disclosed for use in an electrical connector to be surface mounted to a printed circuit board. The contact includes an inverted U-shaped portion defining a pair of depending legs. One of the legs has a foot portion for electrical connection to an appropriate circuit trace on the printed circuit board. A terminal portion is turned upwardly from a distal end of the other leg for termination with an appropriate mating terminal. The contact is in the form of a one-piece metal component. In the preferred embodiment, the terminal portion of the contact is in the form of a terminal pin, with the pin and the legs of the inverted U-shaped portion of the contact all being generally parallel.

Abstract: An electrical connector for interconnecting the contact pads (52, 56) of components (49, 53) features a planar lamination of insulating sheets forming a body (39) having recesses (46, 48) and apertures (44) containing contacts (10) formed of flat metal stock having spring characteristics including spring elements (22, 26, 30, 36) which provide a redundancy of contact interface through extending upwardly and downwardly relatively to said lamination to engage and interconnect the contact pads. Each of the spring elements is attached to a contact base with a free end providing a cantilever spring action, including wipe of contact points.