Abstract: An electrical connector includes an insulative housing adapted to engage a conductive contact (20). The conductive contact has a tail end, wherein the tail end (22) is angled and has a generally dished shape such that at least a portion of the tail end terminates within a hole (10) in a contact pad (12) of a circuit board (1). The conductive contact tail end in a dished shape has the advantages of facilitating the guiding of the tail end into or out of the hole of the circuit board during wipe actions, without removing gold plated layer, and of achieving a reliable travel of the tail end across the hole of the contact pad of the circuit board.

Abstract: Several embodiments of stress metal springs are disclosed, which typically comprise a plurality of stress metal layers that are established on a substrate, which are then controllably patterned and partially released from the substrate. An effective rotation angle is typically created in the formed stress metal springs, defining a looped spring structure. The formed springs provide high pitch compliant electrical contacts for a wide variety of interconnection systems, including chip scale semiconductor packages, high density interposer connectors, and probe contactors. Several embodiments of massively parallel interface integrated circuit test assemblies are also disclosed, comprising one or more substrates having stress metal spring contacts, to establish connections between one or more separated integrated circuits on a compliant wafer carrier.

Abstract: A semiconductor device (51) is provided. The device (51) comprises a die (53) having a contact pad (61) thereon, a redistribution conductor (59) having a base portion (64) which is in electrical communication with the contact pad (61) and a laterally extending portion (63), a bumped contact (65) which is in electrical communication with the redistribution conductor (59), and a passivation layer (57) disposed between the laterally extending portion (63) of the redistribution conductor (59) and the die (53). Preferably, the redistribution conductor (59) is convoluted and is adapted to peel or delaminate from the passivation layer (57) under sufficient stress so that it can shift relative to the passivation layer (57) and base portion (64) to relieve mechanical stress between substrate (69) and the die (53). Bump and coiled redistribution conductor (59) accommodating small CTE mis-match strain without failure allows DCA flip-chip to be reliable without underfill or additional assembly process.

Abstract: The present invention discloses a modular power integrated board that includes a plurality of power pin holes on a power integrated board for outputting electric power and installs a plurality of first conductive connecting members, such that the power integrated board can perform an electric potential detection process, and users can install at least one second conductive connecting member electrically coupled to the first conductive connecting members based on the specification of the power cable of the power integrated board to constitute a modular design that adopts a power integrated board to fit the connection of power cables of different specifications.

Abstract: An electrical interconnect structure that includes a spring portion that extends out of a plane. The electrical interconnect including curved regions to improve the lateral compliance of the interconnect. The curved region may be incorporated into a release region of the spring. The release region may include either or both an uplifted region and a planar region. The curves in the release region are arranged to improve the spring contact with a mating surface and also improve lateral compliance compared to prior art spring designs.

Abstract: This invention provides a solution to increase the yield strength and fatigue strength of miniaturized springs, which can be fabricated in arrays with ultra-small pitches. It also discloses a solution to minimize adhesion of the contact pad materials to the spring tips upon repeated contacts without affecting the reliability of the miniaturized springs. In addition, the invention also presents a method to fabricate the springs that allow passage of relatively higher current without significantly degrading their lifetime.

Abstract: An apparatus and method for making a compliant interconnect assembly adapted to electrically couple a first circuit member to a second circuit member. The first dielectric layer has a first major surface and a plurality of through openings. A plurality of electrical traces are positioned against the first major surface of the first dielectric layer. The electric traces include a plurality of conductive compliant members having first distal ends aligned with a plurality of the openings in the first dielectric layer. The first distal ends are adapted to electrically couple with the first circuit member. The second dielectric layer has a first major surface positioned against the electric traces and the first major surface of the first dielectric layer. The second dielectric layer has a plurality of through openings through which the electric traces electrically couple with the second circuit member.

Abstract: Spring contact elements are fabricated by depositing at least one layer of metallic material into openings defined on a sacrificial substrate. The openings may be within the surface of the substrate, or in one or more layers deposited on the surface of the sacrificial substrate. Each spring contact element has a base end portion, a contact end portion, and a central body portion. The contact end portion is offset in the z-axis (at a different height) than the central body portion. The base end portion is preferably offset in an opposite direction along the z-axis from the central body portion. In this manner, a plurality of spring contact elements are fabricated in a prescribed spatial relationship with one another on the sacrificial substrate.

Abstract: Temporary connections to spring contact elements extending from an electronic component such as a semiconductor device are made by urging the electronic component, consequently the ends of the spring contact elements, vertically against terminals of an interconnection substrate, or by horizontally urging terminals of an interconnection substrate against end portions of the spring contact elements. A variety of terminal configurations are disclosed.

Abstract: An apparatus in one example includes a compliant component for supporting an electrical interface component that serves to electrically and mechanically couple a die with a separate layer. In one example, the compliant component, upon relative movement between the die and the separate layer, serves to promote a decrease in stress in one or more of the die and the separate layer. The apparatus in another example includes a compliant component for supporting an electrical interface component that serves to create an electrical connection between a die and a separate layer. The compliant component, upon relative movement between the die and the separate layer, serves to promote maintenance of the electrical connection.

Abstract: An electrical contact for a ball grid array connector includes a platform for holding a solder ball and a body having a first end frictionally coupled to the platform and an opposite second end that includes a separable interface configured to mate with a mating contact. The body is separable from the platform when the platform is mounted to a circuit board.

Abstract: A microelectronic spring contact for making electrical contact between a device and a mating substrate and method of making the same are disclosed. The spring contact has a compliant pad adhered to a substrate of the device and spaced apart from a terminal of the device. The compliant pad has a base adhered to the substrate, and side surfaces extending away from the substrate and tapering to a smaller end area distal from the substrate. A trace extends from the terminal of the device in a coil pattern over the compliant pad to its end area, forming a helix. At least a portion of the compliant pad end area is covered by the trace, and a portion of the trace that is over the compliant pad is supported by the compliant pad. In an alternative embodiment, the pad is removed to leave a freestanding helical contact.

Abstract: An out-of-plane micro-structure which can be used for on-chip integration of high-Q inductors and transformers places the magnetic field direction parallel to the substrate plane without requiring high aspect ratio processing. The photolithographically patterned coil structure includes an elastic member having an intrinsic stress profile. The intrinsic stress profile biases a free portion away from the substrate forming a loop winding. An anchor portion remains fixed to the substrate. The free portion end becomes a second anchor portion which may be connected to the substrate via soldering or plating. A series of individual coil structures can be joined via their anchor portions to form inductors and transformers.

Abstract: A connector includes a block-like insulator having a first surface confronting an IC card, and a second surface located on an opposite side relative to the first surface and confronting a wiring board. The insulator has standoff regions in the form of recesses that are formed at boundaries each between the second surface and a surface of the insulator adjacent to the second surface. The standoff regions enable placement of mounting components on the wiring board between the insulator and the wiring board. Contacts are disposed in predetermined positions of the insulator excluding the standoff regions.

Abstract: An electrical connector (10) includes an insulative housing (12) and a plurality of contacts (14) accommodating in the housing. Each contact comprises a spring arm (143) defining a lower portion (144), a medial portion (145) and an upper portion (146). The upper portion includes an extending beam (147) connecting with the medial portion, a contacting portion (149) for connecting with a mating component (30), and a connecting beam (148) connecting the extending beam and the contacting portion. The extending beam has a first axis A, about which the extending beam is symmetrical, and the contacting portion has a second axis B, about which the contacting portion is symmetrical. The second axis is deflective from the first axis and an angle C is formed therebetween accordingly. Thus, the superposed area between the contacting portion and the mating component is increased, which enables more reliable electrical connection therebetween.

Abstract: An out-of-plane micro-structure which can be used for on-chip integration of high-Q inductors and transformers places the magnetic field direction parallel to the substrate plane without requiring high aspect ratio processing. The photolithographically patterned coil structure includes an elastic member having an intrinsic stress profile. The intrinsic stress profile biases a free portion away from the substrate forming a loop winding. An anchor portion remains fixed to the substrate. The free portion end becomes a second anchor portion which may be connected to the substrate via soldering or plating. A series of individual coil structures can be joined via their anchor portions to form inductors and transformers.

Abstract: A microelectromechanical system (MEMS) based sensor comprises: a substrate defining a plane; a first conductive material layer having a first stress, a first portion of the first conductive material layer being connected to the substrate and extending in a substantially parallel direction to the plane defined by the substrate and a second portion being disconnected from the substrate and extending in a substantially non-parallel direction to the plane defined by the substrate; and a sensor material layer formed over at least the second portion of the first conductive material layer, the sensor material layer having a second stress that is less than the first stress of the first conductive material layer. The stresses form a stress gradient that bends the second portion of the first conductive material layer and the sensor material layer formed over the second portion of the first conductive material layer away from the substrate.

Abstract: An apparatus and method providing improved interconnection elements and tip structures for effecting pressure connections between terminals of electronic components is described. The tip structure of the present invention has a sharpened blade oriented on the upper surface of the tip structure such that the length of the blade is substantially parallel to the direction of horizontal movement of the tip structure as the tip structure deflects across the terminal of an electronic component. In this manner, the sharpened substantially parallel oriented blade slices cleanly through any non-conductive layer(s) on the surface of the terminal and provides a reliable electrical connection between the interconnection element and the terminal of the electrical component.

Abstract: An electric connector and IC tin ball shaping and fixing manufacturing method is used in welding portions of terminals of one of an electric connector, IC and other electronic elements. A tin film is covered on a bottom of the ball grid array seat; wherein the tin film is formed by connecting a plurality of round small tin pieces with respect to the terminals, and a periphery of the small tin pieces being enclosed by slender connecting portions the ball grid array seat is melt so that the small tin pieces of the tin film weld as tin liquid, then the slender connecting portions will break and the small tin pieces are connected as a tin ball; thereby, the liquid tin ball will enclose the welding portion of the terminal. Finally the tin balls is cooled and condensed and then combined to the welding portions of the terminals.

Abstract: Spring contact elements are fabricated by depositing at least one layer of metallic material into openings defined in masking layers deposited on a surface of a substrate which may be an electronic component such as an active semiconductor device. Each spring contact element has a base end, a contact end, and a central body portion. The contact end is offset in the z-axis (at a different height) and in at least one of the x and y directions from the base end. In this manner a plurality of spring contact elements are fabricated in a prescribed spatial relationship with one another on the substrate. The spring contact elements make temporary (i.e., pressure) or permanent (e.g., joined by soldering or brazing or with a conductive adhesive) connections with terminals of another electronic component to effect electrical connections therebetween.

Abstract: A socket for a cathode ray tube (CRT) forms part of a circuit board. The socket is positioned on the side of the circuit board away from the funnel portion of the CRT. The terminals which couple to the electron gun of the CRT are positioned along the side of the neck of the CRT, so that when the socket is engaged with the CRT, there is substantially no portion of the socket board which protrudes beyond the end of the neck portion of the CRT.

Abstract: An electric connector includes a base formed with a plurality of slots; and a plurality of terminals inserted into the plurality of slots of the base respectively. Each of the terminals is formed with an elastic pin protruding out of the slot. When the base is forced to contact the circuit board, the pins of the terminals retract and evenly contact the circuit board.

Abstract: A method of forming an electrical interconnection between a first electrical device and a second electrical device comprises the steps of providing contacts in an uncompressed state. The uncompressed contacts are then deformed to a compressed state and then the contacts are positioned in a device adapted to hold the contacts between the first and second electrical devices. Or alternatively, the uncompressed contacts are positioned in the device and then compressed to the compressed state. The contacts are then activated to substantially expand to the uncompressed state wherein each contact expands to substantially its uncompressed state for establishing the electrical interconnection between the first and second electrical devices.

Abstract: Methods are disclosed for fabricating spring structures in which a passive, conductive coating is deposited onto the spring structure before release. A release layer is deposited on a substrate and then a spring metal layer is formed thereon. A first mask is used to form a spring metal finger from these layers. A second mask defines a window exposing a tip of the finger. The release layer under the tip is etched through the window, and then a passive-conductive coating material (which may also have spring characteristics) is deposited on the tip. The second mask and residual coating material are then lifted off, and a third (release) mask is formed that is used to release a free end of the spring metal finger. The release mask is then stripped. When the passive-conductive coating includes spring characteristics, the stress variations of the coating help to lift the free end if the finger during release.

Abstract: An electrical connector (1) comprises a dielectric body (10) and a plurality of conductive contacts (20) retained to the dielectric body. The dielectric body defines two rows of positioning holes (11) and a row of retaining holes (13) between the positioning holes. Each contact has a retaining portion (22) retained to a corresponding retaining hole, a mating beam (24) and a press-fit tail (26) extending from opposite ends of the retaining portion. A pair of resilient beams (28) project from a joint portion between the retaining portion and the press-fit tail for insertion into a corresponding positioning hole and upper ends (282) thereof are bent to abut against a slanted portion (114) formed adjacent to the positioning hole.

Abstract: Several methods and structures for improving the yield of out-of-plane micro-device structures including springs and coils are described. In one method the elastic members have graded perforations for controlling rate of release. In another method and structure, a layout enables the contact landing area to be increased. The high yield structures may be used in numerous electronic applications such as filter circuits.

Abstract: Several methods and structures for improving the yield of out-of-plane micro-device structures including springs and coils are described. In one method the springs used to form out-of-plane structures are constrained via a tether to avoid bunching and entanglement. The high yield structure may be used in numerous electronic applications such as filter circuits.

Abstract: A method of forming a core for and forming a composite wiring board. The core has an electrically conductive coating on at least one face of a dielectric substrate. At least one opening is formed through the substrate extending from one face to the other and through each conductive coating. An electrically conductive material is dispensed in each of the openings extending through the conducting coating. At least a portion of the surface of the conductive coating on one face is removed to allow a nub of the conductive material to extend above the substrate face and any remaining conductive material to thereby form a core that can be electrically joined face-to-face with a second core member or other circuitized structure.

Abstract: An electrostatic actuator with an intrinsic stress gradient is provided. The electrostatic actuator comprises an electrode and an electrostatically actuated beam fixed at one end relative to the electrode. The electrostatically actuated beam further includes a metal layer made substantially of a single metal with an induced stress gradient therein. The stress gradient in the metal layer determines the initial curvature of the beam. Upon electrostatic actuation of the beam, the beam is deflected from its initial curvature relative to the electrode. In one embodiment, the electrostatically actuated beam is used as a top movable electrode of an electrostatically actuated variable capacitor. The capacitance of the electrostatically actuated capacitor is changed upon electrostatic actuation of the beam.

Abstract: A circuit board assembly having a circuit board including a via, and a contact element positioned adjacent to the via for providing electrical attachment of the pin to the via of the circuit board.

Abstract: Several methods and structures for improving the yield of out-of-plane micro-device structures including springs and coils are described. In one method the springs used to form out-of-plane structures are constrained via a tether to avoid bunching and entanglement. The high yield structure may be used in numerous electronic applications such as filter circuits.

Abstract: Methods are disclosed for fabricating spring structures in which a passive, conductive coating is deposited onto the spring structure before release. A release layer is deposited on a substrate and then a spring metal layer is formed thereon. A first mask is used to form a spring metal finger from these layers. A second mask defines a window exposing a tip of the finger. The release layer under the tip is etched through the window, and then a passive-conductive coating material (which may also have spring characteristics) is deposited on the tip. The second mask and residual coating material are then lifted off, and a third (release) mask is formed that is used to release a free end of the spring metal finger. The release mask is then stripped. When the passive-conductive coating includes spring characteristics, the stress variations of the coating help to lift the free end if the finger during release.

Abstract: Efficient methods are disclosed for fabricating spring structures in which a passive, conductive coating is deposited onto the spring structure after release. A release layer is deposited on a substrate and then a spring metal layer is formed thereon. A first mask is then used to etch the spring metal layer to form a spring metal finger. A second (release) mask is then deposited that defines a release window used to remove a portion of the release layer and release a free end of the spring metal finger. The second mask is also used as a mask during the subsequent directional deposition of a conductive coating material on the cantilevered tip of the finger. The second mask is then stripped, and the residual coating deposited thereon is lifted off. The resulting spring structure includes conductive coating on the upper surface and front edge of the finger tip.

Abstract: An electric connector includes a base formed with a plurality of slots; and a plurality of terminals inserted into the plurality of slots of the base respectively. Each of the terminals is formed with an elastic pin protruding out of the slot. When the base is forced to contact the circuit board, the pins of the terminals shrink and evenly contact the circuit board.

Abstract: According to some embodiments of the present invention, a connectable electronic component-carrying board is provided. The connectable electronic board comprises at least one resilient conductive element integrally molded onto at least part of a contact of the connectable board. The resilient conductive element is able to provide an electrical pathway between the contact it is molded to and a corresponding contact on another electronic component-carrying board. A method of fabricating the connectable electronic component-carrying board is also provided.

Abstract: An interposer includes a substrate having opposing surfaces. Conductive terminals are disposed on both surfaces, and conductive terminals on one surface are electrically connected to conductive terminals on the opposing surface. Elongate, springable, conducive interconnect elements are fixed to conductive terminals on both surfaces.

Abstract: A contactor for use in testing integrated circuit chips. The contactor is made with an array of V-shaped contact elements. The V-shaped contact elements are nested so that the contact elements can be longer than the pitch of the contact points. In this way, the compliance of the beam portions of the contact elements can be increased. Also, the V-shape is very robust. Further, the V-shape allows “fly-by” testing, which is very useful at high speeds.

Abstract: The power handling capabilities and operational lifetime of a MEMS device, e.g., a MEMS mirror, operating in a high intensity optical beam environment are enhanced by packaging the device in an packaging atmosphere having a suitably high thermal conductivity, preferably exceeding that of air. The packaging atmosphere can be selected to provide a desired level of heat loss from the MEMS device.

Abstract: A method of fabricating a package for a micro-electromechanical systems (MEMS) device. A flex circuit interconnect subassembly for the package is made by placing a flex circuit on a pad insert, attaching a carrier insert to the pad insert to deflect the lead portions of the flex circuit, and applying a cover insert to the pad insert, after the attachment of the carrier insert, to re-deflect the lead portions of the flex circuit toward the device bond sites. The flex circuit interconnect subassembly may be combined with an electronic device die/carrier subassembly to form a completed electronic device package. The flex circuit interconnect subassembly and the die/carrier subassembly are joined using mechanical interlocking layers. The invention is particularly suited for making such an electronic device die/carrier subassembly which has a MEMS die permanently affixed to a carrier.

Abstract: An apparatus and method for making a solderless electrical connection between a plurality of electrical contact pads on a disc drive printed circuit board (disc drive PCB) and a plurality of electrical contact pads on a external printed circuit board (external PCB). The apparatus and method involve or include a connector which is operable for mounting directly on the disc drive PCB. The connector preferably includes a plurality of electrically conductive pins operable for simultaneously connecting the contact pads on the disc drive PCB to the contact pads on the external PCB when the connector is mounted to the disc drive PCB and the disc drive is mounted to the external PCB.

Abstract: The present invention provides a mechanism of a lattice type contact assembly capable of ensuring an appropriate space occupied by an deformation section, and a contact having an appropriate deformation structure conforming to the arrangement in which thin plate contacts are inclined. Contacts having winding elastic deformation sections such that the shape of elastic deformation sections can be selected from many possible alternatives and the relative positional relationship between input sections and output sections can be freely selected are arranged so as to have a certain angle with respect to the x-axis, thereby making it possible to realize a contact assembly with a lattice arrangement of a small pitch.

Abstract: A method and apparatus for interconnecting at least two devices. Each of the interconnected devices includes a contact structure for electrically and/or physically interconnecting the devices. Preferably, the contact structure for at least one of the devices includes a spring contact. An adhesive, such as a UV-curable adhesive, is applied to at least a portion of one of the devices, and once the adhesive is applied, the devices are assembled, i.e., brought into sufficient proximity so that the contact structures interconnect the devices. The adhesive can be applied directly to contact structures of one of the devices and/or can be applied to other portions of the devices so that the adhesive flows around the contact structures during assembly. The adhesive is then cured to bond the devices together.

Abstract: An interconnection structure comprises: an interlayer insulating film; and first interconnection layer to which low potential is applied and second interconnection layer to which high potential is applied when the interconnection structure is used, formed with the interlayer insulating film therebetween; and a via hole formed in the interlayer insulating film for electrically connecting the first interconnection layer and second interconnection layer. Overlap regions including regions of the first interconnection layer and the second interconnection layer faced said via hole are formed for both the first interconnection layer and second interconnection layer.

Abstract: A cordless compression motor connector connects a spindle motor inside a hard disk drive enclosure to a printed circuit board (PCB) mounted outside the disk enclosure. The disk enclosure includes a base casting formed with a lipped aperture. The connector includes a rigid, cantilever-like insulating body having conductors supported therein. The conductors terminate at the resilient spring contacts located at both ends of the connector body. One end of the connector body is secured to the PCB with a screw such that the resilient contacts on one end are compression connected to contacts on the PCB. The other end of the connector body passes through the aperture and reacts against the lip in the base casting. Contacts formed on the spindle motor are compression connected to the electrical contacts on the other end of the connector body.

Abstract: A system for delivering power to a processor enables a DC-to-DC converter substrate to be secured to the processor carrier in the Z-axis direction. The ability to assemble converter to the processor in this way facilitates assembly compared to systems in which the converter is plugged in to the processor carrier in the direction substantially parallel to the surface of the motherboard.

Abstract: An electrical connector comprising a housing having a first surface and a second surface; and a contact secured to the housing. The contact comprises a mounting section connected to the housing and, a first arm and a second arm extending from the mounting section. The mounting section comprises an aperture and a slit through the contact from the aperture and between the first and second arms. The first arm extends towards the first surface and the second arm extends towards the second surface.

Abstract: Efficient methods for lithographically fabricating spring structures onto a substrate containing contact pads or metal vias by forming both the spring metal and release material layers using a single mask. Specifically, a pad of release material is self-aligned to the spring metal finger using a photoresist mask or a plated metal pattern, or using lift-off processing techniques. A release mask is then used to release the spring metal finger while retaining a portion of the release material that secures the anchor portion of the spring metal finger to the substrate. When the release material is electrically conductive (e.g., titanium), this release material portion is positioned directly over the contact pad or metal via, and acts as a conduit to the spring metal finger in the completed spring structure. When the release material is non-conductive, a metal strap is formed to connect the spring metal finger to the contact pad or metal via, and also to further anchor the spring metal finger to the substrate.

Abstract: An apparatus for connecting a plurality of electrical circuits borne upon a plurality of substrates is disclosed. A first substrate of the plurality of substrates has a first aperture having a first diametral displacement and a first inner wall. A portion of the first inner wall is electrically connected with a first circuit borne upon the first substrate. The apparatus comprises a sheet of electrically conductive material arranged to a displacement from an axis in a substantially helical orientation about the axis. The material has a spring characteristic when the helical orientation establishes the displacement at a spring displacement. The spring characteristic urges the conductive material to a greater displacement from the axis than the spring displacement and permits insertion of the apparatus in the first aperture. The spring characteristic and the first diametral dimension cooperate to seat the apparatus in the first aperture to establish electrical connection with the first circuit.

Abstract: Efficient methods for lithographically fabricating spring structures onto a substrate containing contact pads or metal vias by forming both the spring metal and release material layers using a single mask. Specifically, a pad of release material is self-aligned to the spring metal finger using a photoresist mask or a plated metal pattern, or using lift-off processing techniques. A release mask is then used to release the spring metal finger while retaining a portion of the release material that secures the anchor portion of the spring metal finger to the substrate. When the release material is electrically conductive (e.g., titanium), this release material portion is positioned directly over the contact pad or metal via, and acts as a conduit to the spring metal finger in the completed spring structure. When the release material is non-conductive, a metal strap is formed to connect the spring metal finger to the contact pad/via.

Abstract: A disk drive test device for performing a test (e.g., power only self test, tests which use a serial interface) on at least one disk drive at a time. The test device includes an electrical connector which is configured so as to be able to provide the necessary electrical interconnections for executing a test on disk drives having different types of drive interface connectors (i.e., the same electrical connector may be used with at least 2 different types of drive interface connectors). There is no need to use an in-line adapter to electrically interconnect a disk drive having a first drive interface connector or to electrically interconnect a disk drive having a second drive interface connector. There is also is no need to change out the electrical connector when performing a test on disk drives which use this different types of drive interface connectors.