Abstract: An electrical connector having an electrically non-conductive carrier, the carrier having a plurality of contact pin mounting holes extending there through. Each hole has a square cross-section. An electrically conductive contact pin is passed through each hole. A retainer is provided on the pin separating a leading pin section from a trailing pin section. The trailing pin section has a length slightly longer than the length of the hole and a diameter slightly less than the width of the hole. The retainer and the contact head both have a diameter at least slightly greater than the width of the hole to retain the pin in the hole. An electrical contact pin for use with such a multi-pin electrical connector, a method of inserting such contact pin may be provided.

Abstract: An electrical inter-connection is provided such that a terminal pin which is positioned in a pin block extends through a plated through-hole in a circuit board substrate and is connected with the circuit board using a conductive bonding agent such as solder. The terminal pin is capable of inter-connection with conductive elements located on each major side of the circuit board and eliminates the need for an interference fit between the terminal pin and circuit board. The pin block includes a body and at least one stand-off. The stand-off maintains the body a sufficient distance from the circuit board substrate to enable a solder fillet to form between the plated through-hole and the terminal pin during re-flow processing. The electrical inter-connection further includes an eccentric aperture in the circuit board suitable for interference fit inter-connection with a protruding cylindrical feature such as on an electrical ground that has poor solderability characteristics.

Abstract: A fixing auxiliary device includes a main body, at least an extension arm and an adhesive element. The main body has a first portion in contact with a connecting portion of a circuit board and a second portion coupled to an extension plate of a metallic assembly. The at least an extension arm extends from an edge of the main body and is bent toward one side of the main body so as to clamp the extension plate of the metallic assembly. The adhesive element is used for bonding the first portion of the main body onto the connecting portion of the circuit board.

Abstract: An electric connector includes a body and a plurality of terminals received in the body. The surface of the body has a receiving surface for receiving electric elements. The receiving surface has a plurality of inserting holes and a plurality of ribs for receiving the electric elements. Besides, the ribs pass through the full receiving surface. Comparing to the prior arts, the situation of the central area of the upper cover out of shape is avoided so as to assure the central processing unit CPU chip module without damage in shaking circumstance.

Abstract: A method of retaining a solder mass to a solder-bearing article is provided and includes the steps of: (a) forming a plurality of openings in the solder-bearing article; (b) disposing a length of solder mass over at least some of the plurality of openings; and forming a plurality of solder rivets along the length of the solder mass. The solder rivets serve to retain the length of solder mass to the solder-bearing article. The solder-bearing article includes any number of different types of components where a solder mass is held thereby, e.g., leads, terminals, connectors, electromagnetic shields, etc.

Abstract: Electrical connectors capable of being mounted on circuit substrates by BGA techniques are disclosed. Also, disclosed is a method of manufacturing such connectors. There is at least one recess on the exterior side of the connector elements. A conductive contact extends from adjacent the interior side into the recess on the exterior side of the housing. A controlled volume of solder paste is introduced into the recess. A fusible conductive element, in the form of solder balls is positioned in the recess. The connector is subjected to a reflow process to fuse the solder ball to the portions of the contact extending into said recess. Contacts are secured in the insulative housing of the connector by deformable sections that minimize stress imposed on the central portions of the contacts to promote uniformity of solder volume.

Abstract: A tab terminal, capable of being mounted in a parts mounting space on a printed circuit board which is small in height, includes a terminal body, an extension portion formed integrally with the terminal body so as to extend from one end edge of the terminal body in the longitudinal direction thereof, side wall portions formed integrally with the terminal body so as to extend from side edges of the terminal body in the height direction of the tab terminal, respectively, and contact portions formed integrally with the side wall portions so as to extend from distal end edges of the side wall portions in substantially parallel to the terminal body, respectively. The extension portion is adapted to be connected with an electrical connecting part, and the tab terminal is fixedly connected at the contact portions to the printed circuit board.

Abstract: A pick-and-place type circuit board mounting bracket is surface-mounted, or alternatively, soldered with reinforcing posts that occupy one or more through-holes in the circuit board. The mounting face of the bracket is offset with respect to its mounting base to allow the face of the bracket to be sub-flush, flush, or extend beyond the edge of the circuit board. The front surface of the bracket is preferably perpendicular to the bottom surface and a longitudinal threaded bore extends through the main body to provide attachment means for affixing structures to the bracket. The posts which extend downwardly through the circuit board may have at least one planar side surface or a single rectangular post may be employed. The length of the posts is preferably less than the thickness of the circuit board for surface mount applications or long enough to extend through the circuit board for wave soldering.

Abstract: A ground terminal mountable to a peripheral portion of a printed board, which includes a ground terminal body having a pick-up portion picked up by a mounter and a first end edge portion formed with a semicircular notch, and which includes a connection portion formed in, for example, a second end edge portion of the ground terminal body. To mount the ground terminal to a printed board having a first side edge portion formed with a mounting hole having a function of a positioning hole, the printed board is positioned at a part mounting position with its first and second side edge portions individually engaged with first and second guide rails, and the mounter is operated to place the ground terminal on the printed board, with the notch directed to the first guide rail and aligned with the mounting hole.

Abstract: A header assembly includes an insulative housing having a plurality of walls defining an interior cavity extending along a mating axis, and a plurality of contacts within the cavity and extending through one of the walls to an exterior of the housing for surface mounting to a circuit board. The insulative housing includes at least one alignment rib extending on an exterior surface thereof in a direction substantially perpendicular to the mating axis. The contacts are formed against and abutting the alignment rib, thereby ensuring coplanarity of the contacts for surface mounting to a circuit board.

Abstract: A header assembly includes an insulative contact housing having a plurality of walls defining an interior cavity and an insulative alignment housing having at least one alignment rib extending on an exterior surface thereof. The alignment housing is separately provided and independently mounted to the contact housing. A plurality of contacts are included within the cavity and extend through one of the walls to an exterior of the contact housing wherein the contacts flex against the alignment housing and abut the alignment rib, thereby ensuring coplanarity of the contacts for surface mounting to a circuit board.

Abstract: An electrical connector (100) adapted for electrically connecting an electronic element (1) such as a camera module with a substrate (200) comprises a shielding member (2, 3), an insulated housing (5) and a number of contacts (4) retained in the housing. Each contact comprises a contact portion (41) for electrically contacting with the camera module and a solder portion (44) extending out the housing for being soldered on the substrate. The shielding member surrounds the housing to prevent the contact from unexpected Electro Magnetic Interference and comprises a plurality solder legs soldered on the substrate. The solder legs are arranged among the solder portions of the contacts. Typically, the distance between every two adjacent solder legs is not greater than 2.5 millimeters. Therefore, the shielding member can effectively prevents various unexpected interference affecting signal transmission of the camera module.

Abstract: An electrical connector includes a hollow conductive post member having a circular periphery, a foot portion and a distal end. The distal end has a generally cup shaped indentation. A base member is included having top and bottom surfaces. The foot portion of the post member is mounted to the top surface. At least one standoff extends from the bottom surface of the base member. The at least one standoff is for resting against a contact surface when soldering the electrical connector to the contact surface, thereby separating the bottom surface from the contact surface to define a minimum volume therebetween for occupation by solder.

Abstract: An electrical contact (1) of an electrical connector includes a board-like base (11), a first arm (14) extending from a side of the base, and a second arm (15) extending from an opposite side of the base. The first arm extends forwardly and circuitously in a first plane, while the second arm extends forwardly and circuitously in a second plane. The second plane is parallel to and lower than the first plane.

Abstract: In a method of forming a thick-film wiring on a substrate, photosensitive-electroconductive paste is filled into a pattern groove formed on the surface of a light-transmitting intaglio plate. The pattern groove corresponds to a desired thick-film wiring pattern. The photosensitive-electroconductive paste filled in the pattern groove are irradiated with light-rays from the front and back sides of the intaglio plate to cause the paste to harden until the overall peripheral surface of the electroconductive paste has a predetermined hardness. The electroconductive paste hardened in the pattern grooves of the intaglio plate is transferred to an intermediate piece. Then, the electroconductive paste is transferred from the intermediate piece to a substrate. Thereafter, the electroconductive paste is fired, whereby a thick-film wiring is formed on the substrate.

Abstract: A header assembly includes an insulative housing comprising a plurality of walls defining an interior cavity, and a plurality of contacts within said cavity and extending through one of the walls to an exterior of the housing for surface mounting to a circuit board. The insulating housing comprises at least one alignment rib extending on an exterior surface thereof. The contacts are formed to abut the alignment rib, thereby ensuring coplanarity of the contacts for surface mounting to a circuit board.

Abstract: The present invention discloses a USB interface solid memory module, comprising: a USB data transmission interface, being an interface in the module for transmitting data to a system; a USB interface controller, being a controller for converting an interface data and accessing a digital data in a memory; a memory array, at least having a non-volatile memory for serving as a data storage device electrically coupled to a circuit corresponding to said USB interface controller; and a USB interface connector, for connecting a USB signal with the system, such that said connector being directly coupled with a USB interface slot disposed in the system, without requiring a USB signal cable.

Abstract: An electrical inter-connection is provided such that a terminal pin which is positioned in a pin block extends through a plated through-hole in a circuit board substrate and is connected with the circuit board using a conductive bonding agent such as solder. The terminal pin is capable of inter-connection with conductive elements located on each major side of the circuit board and eliminates the need for an interference fit between the terminal pin and circuit board. The pin block includes a body and at least one stand-off. The stand-off maintains the body a sufficient distance from the circuit board substrate to enable a solder fillet to form between the plated through-hole and the terminal pin during re-flow processing. The electrical inter-connection further includes an eccentric aperture in the circuit board suitable for interference fit inter-connection with a protruding cylindrical feature such as on an electrical ground that has poor solderability characteristics.

Abstract: A soldering structure between a tab of a bus bar and a printed substrate is disclosed to provide a soldering structure between a tab of a bus bar and a printed substrate that causes no crack. An electrical conductive material is formed on a printed substrate. A tab through-hole is provide to penetrate the electrical conductive material and printed substrate. A tab formed by bending a body of the bus bar enters the tab through-hole. A periphery of the tab and the electrical conductive material are interconnected by soldering. A stress-absorbing aperture or recess is provided in an insulation plate on which the body of the bus bar is mounted. The stress-absorbing aperture or recess can absorb an axial stress caused in the tab.

Abstract: According to the invention, said charge of solder is in the form of a ring (9) crimped onto to said pin (1), coaxially with the latter.

Abstract: In accordance with the invention a surface mount connector is provided for vertically mounting one circuit device on another. By “vertically mounting” is meant that a circuit device with a major surface is mounted perpendicular to the major surface of another circuit device. The connector is a conductive body comprising a base section and a transverse section, the base section having a width greater than the transverse section and a length which extends beyond the transverse section. Advantageously, the base section extends beyond the transverse section in front, behind and on both sides. In typical use, a major surface of a subassembly can be connected to the transverse section and an edge of the subassembly can be connected to the base extensions. The base can then be connected to the mother board.

Abstract: A contact adopted for a socket includes a base, an orientation arm, a resilient arm, and a solder portion. The resilient arm has a first portion extending from the base and a second portion upwards bent from the first portion, and the second portion of the resilient arm parallels to the base as an inverse type with a straight, turning angle. Therefore, the contact is processed easily and simply and further capable of a secure connection to a peripheral device, and a contact resistance between the contact and the peripheral device is reduced thereby to guarantee an effective electrical contact.

Abstract: A solder transfer method which uses an electrically-conductive, e.g., metal, surface, of a stamping or pin or pad as a vehicle to transfer molten solder from a remote solder reserve to a solder joint to be made. In one of the preferred embodiments, a solder deposit previously formed on a surface mount pad during a first reflow step will transfer up to the adjoining contact surfaces by a wicking process to provide the additional solder needed to fabricate a robust solder joint. The method and construction are useful for attaching a daughter board to motherboard, and for surface mounting a long header with multiple pins to the contact surfaces of a PCB without the need to separately add solder during a second reflow step to make a robust solder joint between the contact surfaces.

Abstract: An electrical connector includes a hollow conductive post member having a circular periphery, a foot portion and a distal end. The distal end has a generally cup shaped indentation. A base member is included having top and bottom surfaces. The foot portion of the post member is mounted to the top surface. At least one standoff extends from the bottom surface of the base member. The at least one standoff is for resting against a contact surface when soldering the electrical connector to the contact surface, thereby separating the bottom surface from the contact surface to define a minimum volume therebetween for occupation by solder.

Abstract: A circuit board standoff for use with SMT placement machinery is provided comprising a hollow substantially cylindrical member, a flange extending from a bottom section of the cylindrical member and an opening positioned in the top section of the substantially cylindrical member operable to receive a fastener. The circuit board standoff operates to provide physical connection between two circuit boards while maintaining a minimum distance there between for inclusion of any required electronic components.

Abstract: Several embodiments of enhanced integrated circuit probe card and package assemblies are disclosed, which extend the mechanical compliance of both MEMS and thin-film fabricated probes, such that these types of spring probe structures can be used to test one or more integrated circuits on a semiconductor wafer. Several embodiments of probe card assemblies, which provide tight signal pad pitch compliance and/or enable high levels of parallel testing in commercial wafer probing equipment, are disclosed. In some preferred embodiments, the probe card assembly structures include separable standard components, which reduce assembly manufacturing cost and manufacturing time. These structures and assemblies enable high speed testing in wafer form. The probes also have built in mechanical protection for both the integrated circuits and the MEMS or thin film fabricated spring tips and probe layout structures on substrates.

Abstract: The described embodiments relate to electrical interconnect assemblies and methods of forming same. One exemplary method applies a generally flowable protective material to an electrical interconnect region comprising portions of at least two conductors. The method also exposes the protective material to conditions sufficient to render the protective material to a generally non-flowable state which protects the electrical interconnect region from degradation, wherein said exposing also reflows solder positioned proximate the electrical interconnect region to allow the solder to bond with the at least two conductors.

Abstract: A holding element with a holding clip for holding a carrier board is soldered freestanding to a printed circuit board (PCB). The holding element has first and second holding arms that extend from a supporting region and form a receiving region therebetween. The first holding arm is connected to a first leg and the second holding arm is connected to a second leg. The first and second legs each have a base in an end region. At least one of the legs has a curved surface in the region of the base so that the holding element can be soldered to the PCB. The holding element being made of a strip material, and the first and second holding arms each having an outward bend forming a transition into the first and second legs, respectively.

Abstract: A connecting method for pins and tin balls of an electric connector. Pins of the electric connector elastically resist against tin balls so as to position the pins. The lower ends of the pins store elastic energy due to the elastically resisting contact. During welding by blowing heated air, the elastic energy is released to push the melting tin balls so that the lower ends of the pins of the electric connector is tightly combined with the PC board.

Abstract: Circuit board reworking techniques involve removing original solder from the metallic pad, removing an outer portion of the metallic pad to expose an inner portion of the metallic pad, and applying new solder to the metallic pad. Removal of the original solder and the outer portion of the metallic pad exposes the inner portion which has non-corroded and non-contaminated metal. The application of new solder to this inner portion of the pad enables wettability of the pad as well as provides a protective coating to prevent corrosion of the inner portion (e.g., oxidation, reaction with contaminants, etc.). Accordingly, circuit board abnormalities such as “Black Pad” defects can be cured.

Abstract: An electric connector is disclosed to include an electrically insulative housing, the housing having a plurality of terminal slots and a protruded block in each terminal slot near the bottom side, a plurality of U-shaped terminals respectively mounted in the terminal slots in the housing, each terminal having two bonding ends held between two opposite lateral sidewalls of the corresponding terminal slot and two sides of the corresponding protruded block, and a plurality of solder balls located on the bottom side of the housing and supported on the protruded block in each terminal slot and clamped between the bonding ends of each terminal.

Abstract: In a connector adapted to be connected to and disconnected from a connection object, a fixing member is provided for fixing an insulator holding a contact to a fixation object. The fixing member has a butting portion to be brought into contact with a connection object when the connection object is connected to the connector. The fixing member may be a hold-down or an anchor pin.

Abstract: An electrical connector includes a hollow conductive post member having a circular periphery, a foot portion and a distal end. The distal end has a generally cup shaped indentation. A base member is included having top and bottom surfaces. The foot portion of the post member is mounted to the top surface. At least one standoff extends from the bottom surface of the base member. The at least one standoff is for resting against a contact surface when soldering the electrical connector to the contact surface, thereby separating the bottom surface from the contact surface to define a minimum volume therebetween for occupation by solder.

Abstract: A tab terminal, capable of being mounted in a parts mounting space on a printed circuit board which is small in height, includes a terminal body, an extension portion formed integrally with the terminal body so as to extend from one end edge of the terminal body in the longitudinal direction thereof, side wall portions formed integrally with the terminal body so as to extend from side edges of the terminal body in the height direction of the tab terminal, respectively, and contact portions formed integrally with the side wall portions so as to extend from distal end edges of the side wall portions in substantially parallel to the terminal body, respectively. The extension portion is adapted to be connected with an electrical connecting part, and the tab terminal is fixedly connected at the contact portions to the printed circuit board.

Abstract: The described embodiments relate to electrical interconnect assemblies and methods of forming same. One exemplary method applies a generally flowable protective material to an electrical interconnect region comprising portions of at least two conductors. The method also exposes the protective material to conditions sufficient to render the protective material to a generally non-flowable state which protects the electrical interconnect region from degradation, wherein said exposing also reflows solder positioned proximate the electrical interconnect region to allow the solder to bond with the at least two conductors.

Abstract: A bus bar structure includes: a bus bar stored in an electric junction box; and a tab terminal electrically connected to a pattern portion of the bus bar. The tab terminal is separately formed with the bus bar. The pattern portion is welded with the tab terminal by using a laser beam.

Abstract: An electric circuit board component, in particular a RF coaxial connector, in which the housing (1) of the component is fixed on the circuit board (7) by way of solder joints between the SMD solder connections provided on the bottom side (6) of said housing and solder connections assigned thereto on the side of the circuit board, and in which the housing (1), for additionally securing the same to the circuit board (7), has on the bottom side (6) thereof a plurality of solderable bolt pins (11) which engage in continuous plated bolt holes (12) assigned thereto on the circuit board (7) and are soldered in said bolt holes.

Abstract: An electrical terminal includes a generally planar base pad having two opposed legs and an intermediate portion. The base pad legs have proximal and distal ends and are joined at the proximal ends to the intermediate portion. The legs are spaced apart from each other to form a gap between the legs. The base pad legs have inner edges facing each other which extend away from each other moving away from the proximal ends of the base pad legs to the distal ends. A connector arm having a neck extends upwardly from the intermediate portion of the base pad between the base pad legs and terminates in a blade connector for engaging with a mating terminal. The neck has a proximal end with a width that is less than the gap between the proximal ends of the base pad legs by about ½ mm to 3 mm. The neck has a narrowing section moving away from the proximal end of the neck.

Abstract: A flat twisted electrical terminal is provided for connecting a first circuit element to a second circuit element on respective first and second circuit boards. The terminal includes a flat conductive member having a first end for connecting to a first circuit element and a second end for connecting to a second circuit element. The conductive member is axially twisted about its longitudinal axis.

Abstract: An electrical connector (1) for electrically connecting a central processing unit (CPU) with a printed circuit board (PCB). The connector includes a base (2), and a cover (3) slidably engaged on the base. The base includes a body (21), and a multiplicity of holes (211) defined through the body. The holes are arranged in a rectangular array, and retain a multiplicity of terminals (22) therein. Each terminal includes a solder portion (223) adapted to receive a solder ball (224) fused thereon. A curved dimple (2232) is defined in a middle of a bottom of the solder portion. A largest cross-sectional area of the dimple is slightly less than an area of the solder portion.

Abstract: An electrical connector includes a hollow conductive post member having a circular periphery, a foot portion and a distal end. The distal end has a generally cup shaped indentation. A base member is included having top and bottom surfaces. The foot portion of the post member is mounted to the top surface. At least one standoff extends from the bottom surface of the base member. The at least one standoff is for resting against a contact surface when soldering the electrical connector to the contact surface, thereby separating the bottom surface from the contact surface to define a minimum volume therebetween for occupation by solder.

Abstract: A solder transfer method which uses an electrically-conductive, e.g., metal, surface, of a stamping or pin or pad as a vehicle to transfer molten solder from a remote solder reserve to a solder joint to be made. In a preferred embodiment, a solder deposit previously-formed on a surface mount pad during a first reflow step will transfer up to the adjoining contact surfaces by a wicking process to provide the additional solder needed to fabricate a robust solderjoint. When one of the contact surfaces is a contact or pin on a first PCB, and the other contact surface is a SMT pad on a second PCB serving, for example, as a memory card, the process of the invention makes for an easy SMT processed attachment of the memory card to the first PCB without the need to add solder during a second reflow step to make a robust solder joint between the contact surfaces.

Abstract: The wiring board having terminals disclosed in this invention is aimed at providing a narrow pitch and downsized design for connecting circuit boards of various kinds of electronic devices. Each terminal 11 has an L-shaped or bar-shaped coupling section 11A having an uneven shape and held between a top substrate 6 and a bottom substrate 1.

Abstract: An electrical connector (1) for soldering to a printed circuit board includes a housing (10) defining a number of channels (22) therethrough, a number of contacts (12) received in corresponding channels. At least two contacts share a same channel. Each contact includes an intermediate portion (124) pre-coated with a Sn—Pb plating which has a higher melting point than that of the soldering paste. The intermediate portions of corresponding contacts in the same channel are soldered with each other by heating the Sn—Pb plating and a wicking barrier (28) is formed on soldering area. The wicking barriers block the melted soldering paste from passing therethrough to thereby protect contact portions when soldering the contacts with the printed circuit board.

Abstract: A bus bar structure includes: a bus bar stored in an electric junction box; and a tab terminal electrically connected to a pattern portion of the bus bar. The tab terminal is separately formed with the bus bar. The pattern portion is welded with the tab terminal by using a laser beam.

Abstract: A method of tinning one or more electrical terminals by hot solder dipping is disclosed herein. The process generally involves placing a solder resistant material in a through hole formed in an electrical terminal, and then dipping at least a portion of the terminal into a hot solder. The solder resistant material may include, for example, a titanium or stainless steel wire, and the solder may be a tin-lead solder such as Sn63.

Abstract: An electrical system includes a printed circuit board with conductive traces formed thereon. An electrical connector includes an insulative base with an array of cells defined therein. Each cell receives and retains a conductive contact having a tail portion corresponding to the conductive traces. Soldering pre-forms are arranged between the conductive traces and the tail portions. A heat distributor includes a thermally conductive base plate positioned on the connector base and thermally conductive pins extending from the base plate.

Abstract: An electrical inter-connection is provided such that a terminal pin which is positioned in a pin block extends through a plated through-hole in a circuit board substrate and is connected with the circuit board using a conductive bonding agent such as solder. The terminal pin is capable of inter-connection with conductive elements located on each major side of the circuit board and eliminates the need for an interference fit between the terminal pin and circuit board. The pin block includes a body and at least one stand-off. The stand-off maintains the body a sufficient distance from the circuit board substrate to enable a solder fillet to form between the plated through-hole and the terminal pin during re-flow processing. The electrical inter-connection further includes an eccentric aperture in the circuit board suitable for interference fit inter-connection with a protruding cylindrical feature such as on an electrical ground that has poor solderability characteristics.

Abstract: A battery pack containing a plurality of battery modules, these modules comprising a plurality of individual battery units, these battery units comprising a plurality of bicells with opposing terminals. The battery modules are connected in series by use of a flexible circuit and by opposing positive and negative terminals of each battery unit. The terminals of each battery unit contain a region of apertures which allow the adhesive of the envelope-like packaging material to seal more effectively by flowing through the apertures and sealing to itself, thereby eliminating or reducing the amount of leakage from an individual battery unit. The terminals pass through overlapped edges of the packaging material and include tangs for electrical connection to flaps formed in the flexible circuit.

Abstract: A Jack connector includes: a retainer which holds a semiconductor optical device and an electrical connection terminals; wherein the electrical connection terminals each extend out of the retainer so as to be soldered onto a board; wherein the retainer has recesses provided in a vicinity of the respective terminals so as to accommodate a solder possibly creeping up along the terminals when the jack connector is soldered onto the board.