Abstract: An electrical contact has a tab provided in passage which extends through the contact. The tab is dimensioned to provide a barrier, past which solder cannot flow. Consequently, as the contact is mounted to a printed circuit board, the tab prevents the solder from wicking from the mounting portion to the mating portion.

Abstract: An electrical connector has first terminals which are surface mounted to respective sides of a substrate and second terminals which extend through an edge surface of the substrate to make electrical connection to an opening provided in the substrate. As the connector is mated to the edge of the substrate, the connector occupies a minimal space on the substrate.

Abstract: An electrical contact having one or more spring-biased tabs for mounting to a circuit board precludes the need for additional mechanical fasteners and obviates any additional manufacturing steps, except for soldering. The tabs are formed and shaped to provide springs which, when inserted into holes in a circuit board, compress and grip the interior wall of the hole.

Abstract: An electrical connector is provided for mounting to a printed circuit board. The connector includes an insulating housing having a body with a through cavity for receiving an electrical terminal to be soldered to a circuit trace on a printed circuit board. A solder masking hollow peg projects from one side of the body for insertion in a hole in the printed circuit board for preventing solder from entering the hole during soldering of the electrical terminal to the circuit trace on the printed circuit board. The interior of the hollow peg communicates with the through cavity in the body to allow a mating terminal to be inserted through the hollow peg into contact with the terminal inside the body.

Abstract: A connector (22) includes a housing (24) having an array of first terminal-receiving passageways (34) each in communication with a spring arm receiving recess (38), each passageway (34) having a terminal member (50) disposed therein. Each terminal member (50) includes a body section (52) having a first connecting portion (54) adapted for surface mount engagement with a circuit pad (122) of a circuit board (120) and a spring arm portion (60). The spring arm portion (60) has a first transverse portion (62) extending laterally from the terminal member (50) proximate the first connecting portion (54), an axial portion (64) of a selected length extending from the first transverse portion (62) and toward a second connecting portion (72) of the terminal member (50), and a second transverse portion (68) extending toward the body section (52). The first transverse portion (62) extends essentially parallel to the mounting face (28) and is recessed therefrom.

Abstract: New standard industrial grade solder is first applied to leads of a tape automated bonding (TAB) component of a printed circuit board (PCB) to be replaced, which was previously bonded using standard industrial grade solder. The new and old solder are melted at the same time. The TAB component is removed without removing all the melted new solder. After applying flux to the solder pads, a replacement TAB component is placed onto the TAB component site. Heat and pressure are applied to leads of the replacement TAB component at the same time while the replacement TAB component is being placed onto the TAB component site. Pressure is maintained until the leads and the remaining new solder have cooled below the solder's melting temperature. As a result, the replacement TAB component is connected to the PCB replacing the removed TAB component with reduced number of steps and cycle time for the steps, thereby reducing opportunities to damage the PCB.

Abstract: A solder mask is useful in the preparation of circuit boards when the boards are to be subsequently stacked and a removable plug supported by the solder tail of the contact initially joined to the board affords facile manufacture of the contacts and solder mask and facile assembly of the boards.

Abstract: An electrical contact is disclosed for use in an electrical connector to be surface mounted to a printed circuit board. The contact includes an inverted U-shaped portion defining a pair of depending legs. One of the legs has a foot portion for electrical connection to an appropriate circuit trace on the printed circuit board. A terminal portion is turned upwardly from a distal end of the other leg for termination with an appropriate mating terminal. The contact is in the form of a one-piece metal component. In the preferred embodiment, the terminal portion of the contact is in the form of a terminal pin, with the pin and the legs of the inverted U-shaped portion of the contact all being generally parallel.

Abstract: A solder-bearing lead for attachment to the surface of a substrate, wherein a discrete mass of solder is mechanically held firmly by the lead in a position permitting close proximity to the substrate surface to connect the lead to the substrate with an electrical and mechanical bond upon melting of the solder, the lead body having a pair of fingers partially encircling the solder mass with a gap between the fingers providing an unobstructed flow for the melted solder to the substrate. The lead may also be used to interconnect a first substrate to a second substrate, forming a bond between conductive areas on both substrates.The present application is a continuation-in-part of application Ser. No. 416,505, filed Oct. 3, 1989, U.S. Pat. No. 5,052,954 which is a continuation of application Ser. No. 129,715, now U.S. Pat,. No. 4,883,435, and is also related to U.S. Pat. No. 4,728,305, U.S. Pat. No. 4,679,889, and U.S. Pat. No. 4,605,278. The disclosure of the parent application, Ser. No.

Abstract: A plug connector comprising a rigid insulator plate made of an electrical insulator, and contact strip members embedded in the insulator. The insulator plate comprises a mating portion for mating with a socket contact and a mount portion for mounting the plug connector on a circuit board. The contact strip members extend in a surface of the circuit board from the mating portion to the mount portion and are led out from the mount portion to provide connecting portion for electrically connecting with the circuit board. The top surfaces of the contact strip members are exposed in the surface of the mating portion and form contact surface for coming into contact with socket contacts of the socket connector mating with the mating portion.

Abstract: A connector (80) for electrically interconnecting a semi-conductor device (92) to a substrate (86) is disclosed. The connector (80) includes a housing (50) having parallel channels (64) for receiving the devices (92) and contact elements (10) with cantilevered spring arms (18) for electrically engaging the devices (92) and a base (12) having an edge (26) for electrically engaging a circuit (84) on the substrate (86).

Abstract: A male terminal is provided with a male contact portion and a shroud portion disposed about the male contact portion. The male contact portion is integral with and folded into the interior of the shroud portion whereby the shroud portion protects the male contact portion. An electrical connector assembly includes a female connector having a housing which includes channels for receiving the shroud portion of the male terminal, and a female terminal in the housing mates with the male contact portion of the male terminal when the shroud is received in the channels of the housing.

Abstract: A method for packaging integrated circuits for surface mount which provides advantages over prior art techniques by providing increased strength to integrated circuit package leads for increased lead dimensional stability to accommodate the finer pitches needed for high density integrated circuits, i.e., with leadcounts of 200 or more leads. The method is for producing a plastic integrated circuit package that allows for transfer molding using a non-conductive, permanent dambar. The invention includes the resulting leadframe. The method produces a package having embedded leads (on both sides and in between) in a double sided film/adhesive combination which increases lead dimensional stability and which does not require removal before device mounting. The double sided film/adhesive combination is non-conductive, is able to withstand all the package assembly process steps and is applied before a die is dedicated to a leadframe.

Abstract: An RF contact (2) provides multiple RF paths (51-53) with minimal RF path lengths between a first (8) and second (36) interconnecting surfaces. A stationary member (6) is soldered on the first surface (8). A main spring member (22) is resiliently (26) connected to the stationary member (6) on a springing end (27) to provide contact travel (38) which ensures wiping action with the second surface (36). A secondary spring member (28) having at least two wiping portions (42 and 46) is resiliently (29) connected to the displacement member on its other end (38) to engage the stationary member (6) and the main spring member (22) along the at least two wiping portions (42 and 46) when the main spring member (22) is resiliently biased against the secondary spring member (28) and the stationary member (6).

Abstract: A connector (10) having one or more arrays of elongate cantilever beam arms (22) of contacts (20) can have contact sections (26) on free ends (24) thereof soldered to respective traces (94) of a circuit element (90), by securing a lead frame (50) to free ends (24) which includes a corresponding plurality of fingers (56) extending from a carrier strip (52). On the finger ends (58) are affixed preforms (80,82) of solder; on the carrier strip (52) is defined a thin magnetic layer, transforming the brass carrier strip into a Curie point heater. When the carrier strip is subjected to RF current, it generates thermal energy which melts the solder preforms to join the fingers first to the contact sections (26) of the connector contacts (20), and in a remote location later subjected to RF current to reflow solder preform (82) to join contact sections (26) to traces (94).

Abstract: A solderable lead is fashioned with a C-shaped contact portion along its length. The interior of the C-portion is dimensioned to receive and resiliently contact a substrate at a predetermined contact pad. A layer of solder is provided on the exterior of the C-shaped contact portion and extends around its edge. During heating, the solder migrates to the interior of the C-portion by capillary action to the area between the contact pad of the substrate and the interior of the C-portion. While the solder is liquid, the C-portion maintains engagement with the substrate.

Abstract: A circuit board is aligned with the housing so that a mounting pin may be inserted through a circuit board mounting hole and into a housing mounting bore. The pin is heated when inserted into the bore so that solder at the bottom tip is in a melted state. After the pin is in the bore, the solder fuses and secures the pin in the bore. Accordingly, the pin head secures the electrical circuit board to the housing.

Abstract: An electrical connector (10,20,30,40) having an insulating housing (11,21,31,41) and electric contacts (14,24,34,44) therein has been disclosed. The electric contacts (14,24,34,44) are individually formed by removing selected parts (53,55,56,58,59,61,62) from stamped electric contact elements (50). The housing (11,21,31,41) includes cavities (12,32) opening on a front surface and cavities (22,42) opening on a back surface.

Abstract: A support block has slots in the top and rear faces receiving bent terminal strips. Protrusions on the strips abut a forward or downwardly facing surface at the front of the top slot. Protrusions at the other end of the strips abut a downwardly facing surface at the bottom of the rear slot. A terminal tip extends forwardly, and a tang for soldering into a circuit board extends downwardly. Terminal strips without protrusions fit within slots in the bottom face of the support block.

Abstract: A terminal pin is designed for insertion through a hole in a printed circuit board and for soldering to a circuit trace on the board. The pin includes a terminal portion at one end and a solder tail portion at an opposite end, with the neck portion therebetween. The neck portion has a reduced cross-sectional dimension versus that of the terminal portion and the solder tail portion to increase the flexibility of the pin at the neck portion. The neck portion provides an area of flexibility adjacent the area of soldering the pin to the printed circuit board.

Abstract: A solder-bearing terminal or lead for attachment to a receptacle in a substrate or to the surface of a substrate, wherein a discrete mass of solder is mechanically held by the terminal or lead in close proximity to the substrate receptacle or surface in position to be melted for connecting the terminal to the substrate with an electrical and mechanical bond, the terminal or lead providing an unobstructed flow for the melted solder to the substrate.

Abstract: A method and structure includes a solder plate assembly (20) includes a high temperature plastic having apertures (22) arranged in a grid to receive contact pins (14) of a connector (12) inserted therethrough with solder rings (28) cast into the said apertures and adapted to be reflowed to join pins to circuit board circuits contained in board apertures (34) therein.

Abstract: A solder-bearing lead adapted to be soldered to a conductive surface comprising an elongated body portion having a solder-bearing portion, a terminal portion, and a middle portion disposed between said solder-bearing portion and said terminal portion. The solder-bearing portion includes a pair of projections extending from one edge of said body portion and forming a gap therebetween dimensioned to receive a solder mass. A region of the middle portion is twisted so that the projections lie in a plane substantially perpendicular to the plane of the terminal portion. The solder-bearing lead can be used as an edge clip for mounting a substrate such as a printed circuit board/or as a surface-mounted lead for a substrate.

Abstract: A circuit board is aligned with the housing so that a mounting pin may be inserted through a circuit board mounting hole into a housing mounting bore. The pin is heated when inserted into the bore so that solder at the bottom tip is in a melted state. After the pin is in the bore, the solder fuses and secures the pin in the bore. Accordingly, the pin head secures the electrical circuit board to the housing.

Abstract: A solder terminal includes a clip adapted to be positioned on one edge of a substrate for forming soldered electrical connections with substrate pads. One end of the clip extends away from the substrate for making an electrical connection with a circuit component.

Abstract: The invention relates to a pin (21) for connecting an electrical conductor (2) to a PCB (4). The pin has a first part (24) thrust into a hole in the PCB and a second part (26), to which the electrical conductor (2) is connected by a sliding contact (8). The cross-sectional dimension (d2) of the second part (26) is greater than the cross-sectional dimension (d1) of the first part (24), and between these parts the pin (21) has a shoulder (27) with sharp edges. The hole in the circuit board is coated with a metal which is connected via tabs (22) to electrical conductors (3) of the PCB(4). The pin (21) is soldered in the hole with the aid of soldering metal (25) and flux. When the flux is heated it creeps along the surface of the pin. During soldering, the shoulder (27) with the edges prevents the flux reaching the second part (26) of the pin (21 ), the second part having contact surfaces (29) on the pin (21) against the sliding contact (8) and where the flux would be a contact resistance.

Abstract: A contact has a leg portion at one end and a resilient contact element at the other end. The resilient contact element is provided with a mother contact nose, on which an external terminal of an electronic part is to be placed, formed on its free end. A child contact nose is loosely engaged with an outer surface of the mother contact nose so that the child contact nose can be idly moved, and the child contact nose has a contacting surface larger than that of the mother contact nose.

Abstract: The electrically insulating carrier comprises at least one through-hole which extends from a first face to an oppositely situated second face of the carrier and which serves to receive an electrically conductive pin having a mainly rectangular cross-section. The hole comprises three sections which are consecutively disposed in its longitudinal direction, the first section opening into the first face of the carrier and having a cross-section whose dimensions are so large that, after insertion, the pin does not contact the wall of the first section in any location. The second section has an at least partly circular cross-section whose diameter is so much smaller than the diagonal of the cross-section of the pin that the pin is retained by friction between the pin and the wall of this section. The third section has a cross-section whose largest dimension at the most equals the smallest dimension of the cross-section of the pin.

Abstract: A connection plug which is to be fitted to a casing (M) carrying a substrate plate (B, S), on which microwave components are mounted and mutually connected with the aid of striplines. Certain striplines have their end portions taken out to the edges of the substrate plate. The plug contains a coaxial conductor junction, known per se, between an incoming coaxial conductor (K) and an outgoing conductor (6b) towards the substrate plate. In accordance with the invention, the plug has a projecting part (3) carrying a substrate piece (8) with a stripline (12) which, when the plug is fitted, is in line with the end portion of a stripline (11) on the substrate plate (S). The coaxial junction can thus be tested before fitting, and the connection between stripline (11) of the substrate plate and the stripline of the substrate piece (8) can be readily carried out during fitting.

Abstract: A contact element and contact element assembly of electrically conducting material, intended, in particular, for surface mounting at a connecting area near the edge of a circuit substrate comprising an opening or recess. The contact element has a flat base face which in the mounted state of the contact element is situated completely or partially opposite the connecting area. The contact element also has at least one positioning device which projects from the flat base face and extends into the opening or recess of the substrate the contact element is mounted to the positioning device may be a positioning finger which fits freely into the opening or recess, or a positioning finger which acts on the substrate in a manner such that a retaining force is provided for keeping the contact element in position.

Abstract: Disclosed is a surface-mounted component's contact having an inverted "T"-shaped soldering portion. The contact is to be mounted to the surface of a printed circuit board, and is to be electrically connected to a conductor on the printed circuit board by soldering its soldering portion to the conductor. The soldering portion comprises a flat foot and a leg, which is integrally connected to and rising from the midportion of said foot. The relatively large foot has an effect of causing substantial reduction of the load per unit of solder upon application of an undesired force to the terminal, and of increasing the resistivity of the solder against removal from the conductor of the printed circuit board.

Abstract: A male circuit board terminal includes a unitary electrically conductive housing with an outboard section, a core section and an inboard section arranged to provide a sound mechnical connection and electrical connection between the circuit board and a cut electrical lead.

Abstract: An adapter for removably mounting electronic components on a circuit board or the like is disclosed which includes an insulating base having a plurality of holes extending therethrough, with a plurality of contacts disposed within the holes. Each contact includes a board-engaging section which extends from the base for compliantly engaging a hole in the circuit board. Each contact further includes a base-engaging section which resiliently engages a hole within the base, with the base-engaging section strongly engaging the adapter base to provide for essentially permanent placement therein. Each contact further includes a component end including means for mating with a component placed in contact therewith, which means may comprise solder on the component-facing side of the component end of the contact. Typically, a component will be placed on the base with mating conductive strips in contact with the component ends of the contacts.

Abstract: A wiring device is provided wherein a junction block (abbreviated to "J.B.") (a) which is used for electric wiring of an automobile, and an electronic unit (b) whose case (4,5) receives therein a printed circuit plate (e) formed with a functional circuit for connecting signals between wire harnesses and which is provided with a J.B. coupling connector (8) and an external coupling connector (7) at an outer periphery of the case, are detachably connected by the J.B. coupling connector. Signals from the function block are transmitted to the J.B. by way of a function-preset wiring device for an automobile comprising a through terminal (c) which is formed with a J.B. connecting portion (c.sub.1) at one end of a base plate (9) and an external output terminal portion (c.sub.2) at the other end thereof, and a branch terminal (d) which has lead terminals (23) associated with elastic sandwiching pieces (19) for receiving the external output terminal portion of the through terminals.

Abstract: In a connective jumper, recesses are defined in jumper connecting portions and surfaces of the recesses are plated. Thus, the connective jumper can be strongly soldered. Even if cracking is caused in the soldering portions, progress of cracking can be reduced since such cracking can be easily visually inspected. A manufacturing method whereby such connective jumpers can be efficiently manufactured with high mass productivity at a low manufacturing cost is also provided.

Abstract: A foil (15) has cutouts (17) which are bridged over by strips of solder (18, 19). The cutouts (17) are so dimensioned that the strips of solder (18, 19) can be placed transversely over the ends of conductive paths (9-14). The terminals (3-8) of the corresponding electronic component (2) are then placed on the strips of solder (18, 19). Pressure is exerted by means of a ram and heat applied, which leads to the melting of the strips of solder (18, 19) and thus to the soldering of the terminals (3-8) to the conductive paths (9-14).

Abstract: A socket for mounting an integrated circuit unit on a printed circuit board comprises a plurality of inserts of a platable electrically insulating material each having an opening and an exterior surface portion. The inserts are mounted in rows in a support body so the openings are accessible from one side of the body and the exterior surface portions are exposed at an opposite side of the body. Electrically conductive layers are provided on the inner surfaces of the insert openings, preferably by electroless plating techniques using the body as a plating mask, to extend to the exterior surface portions of the inserts to be soldered to circuit paths on the printed circuit board at prescribed circuit locations. Contacts are disposed in the insert openings in electrical engagement with the electrically conductive layers therein for resiliently and detachably electrically engaging terminals of integrated circuit units or the like inserted into the openings.

Abstract: A solder terminal includes a clip adapted to be positioned on one edge of a substrate for forming soldered connections with substrate pads. A leg extends from the clip for forming an electrical connection with a circuit component.

Abstract: An electronic socket carrier system in which a plurality of lead sockets are mounted on a thin flexible carrier strip which can be removed from the sockets after mounting on a circuit board. The lead sockets each include retention elements on the socket body to retain the socket on the carrier strip and which can also be employed for locking the socket into a mounting hole of a circuit board. The sockets are cold formed or machined to have a plurality of barbs each with a ramp surface to facilitate installation of the sockets into cooperative holes in the carrier strip, and an edge portion for retaining the socket once installed on the carrier strip.

Abstract: In an electronic memory card, an IC pellet has a number of electrode pads which are provided on one surface thereof and have a size larger than that of bonding terminals formed in the IC pellet. The IC pellett is received in a storage section of an upper inner core and is adhered on a writing substrate by an anisotropic conductive adhesive tape. Thus, internal connecting terminals formed ont he substrate are electrically connected through portions of the conductive tape to the electrode pads. The wiring substrate is mounted on a lower inner core and is received in a storage section of an intermediate inner core. Films are formed on the multi film structure of the inner core and wiring substrate and contact terminals are so provided in the film and inner core as to be connected to the internal connecting terminals.

Abstract: The electrical connector comprises a first connector half having a heating element mounted therein. The heating element includes at least one non electrically conductive surface having a set of electrically conductive surface traces mounted on the at least one surface. Also included in the first connector half are a set of first contacts having one end joined to a first portion of the surface traces on the at least one surface. A second connector half is included for mating with the first connector half. The second connector half includes a set of second electrial contacts for contacting a second portion of the surface traces on the at least one surface of the heating element when the connector halves are joined. A coating of solder is applied to the second portion of the conductive surface traces on the heating element or the one end of the second electrical contacts or both.

Abstract: An electrical component (21) for mechanical mounting and electrical connection with respect to plated through holes (34) of a printed circuit board (20) compatibly with a surface mount attaching process includes an electrically non-conducting body (30), plural generally elongate contacts (31) extending from the body for insertion into such plated through holes (34), and the component (21) having a strip of solder type material (33) for melting, for flow into respective plated through holes, and for re-solidifying mechanically and electrically to couple the component to such printed circuit board. The strip preferably encircles the contacts and has reduced cross section portions between adjacent contacts. Preferably the component is a connector, such as a header, and the contact pins or leads thereof provide an interface connection between the printed circuit board and a separate or portable connector.

Abstract: A solder-bearing terminal or lead for attachment to a receptacle in a substrate or to the surface of a substrate, wherein a discrete mass of solder is mechanically held by the terminal or lead in close proximity to the substrate receptacle or surface in position to be melted for connecting the terminal to the substrate with an electrical and mechanical bond, the terminal or lead providing an unobstructed flow for the melted solder to the substrate.

Abstract: A method for providing an electrical connection (via) between the top and bottom of a printed circuit board (PCB) is presented. An eyelet extends through a hole in the PCB. The top of the PCB has a first conductive layer. Around the hole the first conductive layer is shaped such that a conductive pad is isolated from the rest of the first conductive layer, except that spokes of the first conductive layer extend from the conductive pad to the rest of the first conductive layer. The eyelet is crimped such that crimped fingers or tabs of the eyelet cause the eyelet to be mechanically retained in the hole. The tabs are curved so that the tabs do not lie flat upon the conductive pad. The bottom of the PCB is then wave soldered so that a base of the eyelet is electrically coupled to a conductive layer on the bottom of the PCB and the tabs are electrically coupled to the conductive pad.

Abstract: An electrical socket is provided which includes a connector element to which a soluble temporary housing is attached. The socket is suitable for mounting on a printed circuit board or other substrate. The temporary housing provides a handle which an automatic component placement machine can grip. Once the socket is installed in an aperture in the printed circuit board, the housing is removed via solvent to free-up space on the board.

Abstract: Redundant interconnection bonds are formed on an integrated circuit using an interconnection lead comprising a plurality of electrically conductive fingers separated from each other by an electrically nonconductive medium. The individual conductive fingers are attached to, and extend out from, an electrically conductive base at one end. In addition, the individual conductive fingers are connected to each other at a separate region. The improved interconnect lead is structurally durable and the resulting redundant bond exhibits improved electrical and operating characteristics. The interconnection lead is suitable for use with tape automated bonding or flexible circuitry technologies.

Abstract: A contact for a connector is characterized by a barrel portion having a layer of a reflowable solderable material disposed on the inner and outer surfaces thereof. The barrel is expansible from a first to a second dimension upon the insertion of a camming member thereinto. The contact is disposed in a connector that is used in conjunction with a pin header and a board with plated through holes therein. The barrels, when inserted into the through holes from one surface of the board, are expanded by the receipt of pins or wires inserted into the barrels from a header disposed on the other side of the board. The connections between the barrels and the through holes may be mass terminated. The board assembly so formed is able to be conveniently stacked.

Abstract: A surface mountable electronic component socket for mounting on the surface of a printed circuit board includes a socket made of insulative material and a plurality of surface mountable terminals which are disposed within the socket body. Each terminal includes a lead portion for surface mounting on an associated contact area of a circuit board, and a hollow body section adapted to receive the lead of an integrated circuit or other electronic component. Each terminal is axially movable or floatable within its respective opening in the socket. This axial movement of the terminals accommodates misalignment which may occur between the surface mounted leads and the printed circuit board thereby providing reliable engagement of the socket with the circuit board.

Abstract: An improved combination of a circuit board and mounted electrical device with means to indirectly secure the electrical device to the circuit board. A pin of the electrical device extends through an aperture in the circuit board. An electrically conductive connector overlies the circuit board and has an end portion configured to releasably grip the pin thus securing the electrical device to the circuit board. The connector also includes a tab extending through a second aperture in the circuit board adjacent an electrical pad thereon so that the tab may be soldered to the pad to both secure the connector and to provide electrical power to the pin through the connector.

Abstract: The method and the arrangement for the connection of a multipole connector to a circuit board (1), specifies that the circuit board (1) is provided with a plurality of blind holes (3), equivalent in number to and matching the location of terminals (4) extending out of the connector housing (2). The blind holes (3) are filled with solder paste (5) and the mechanical and electrical connection of the connector (2) with the circuit board (1) is carried out by reflowing the solder paste. Compared with the conventional technique utilizing through-drilled connection holes, the invention provides the advantage that conductor paths can be routed underneath the blind holes, soldering paste cannot get on the underside of the circuit board, and a tolerance compensation of the lengths of the terminals is insured without subjecting the circuit board to preload forces exerted by the terminals.