Abstract: A bus bar structure includes: a bus bar stored in an electric junction box; and a tab terminal electrically connected to a pattern portion of the bus bar. The tab terminal is separately formed with the bus bar. The pattern portion is welded with the tab terminal by using a laser beam.

Abstract: A method of tinning one or more electrical terminals by hot solder dipping is disclosed herein. The process generally involves placing a solder resistant material in a through hole formed in an electrical terminal, and then dipping at least a portion of the terminal into a hot solder. The solder resistant material may include, for example, a titanium or stainless steel wire, and the solder may be a tin-lead solder such as Sn63.

Abstract: An electrical system includes a printed circuit board with conductive traces formed thereon. An electrical connector includes an insulative base with an array of cells defined therein. Each cell receives and retains a conductive contact having a tail portion corresponding to the conductive traces. Soldering pre-forms are arranged between the conductive traces and the tail portions. A heat distributor includes a thermally conductive base plate positioned on the connector base and thermally conductive pins extending from the base plate.

Abstract: An electrical inter-connection is provided such that a terminal pin which is positioned in a pin block extends through a plated through-hole in a circuit board substrate and is connected with the circuit board using a conductive bonding agent such as solder. The terminal pin is capable of inter-connection with conductive elements located on each major side of the circuit board and eliminates the need for an interference fit between the terminal pin and circuit board. The pin block includes a body and at least one stand-off. The stand-off maintains the body a sufficient distance from the circuit board substrate to enable a solder fillet to form between the plated through-hole and the terminal pin during re-flow processing. The electrical inter-connection further includes an eccentric aperture in the circuit board suitable for interference fit inter-connection with a protruding cylindrical feature such as on an electrical ground that has poor solderability characteristics.

Abstract: A battery pack containing a plurality of battery modules, these modules comprising a plurality of individual battery units, these battery units comprising a plurality of bicells with opposing terminals. The battery modules are connected in series by use of a flexible circuit and by opposing positive and negative terminals of each battery unit. The terminals of each battery unit contain a region of apertures which allow the adhesive of the envelope-like packaging material to seal more effectively by flowing through the apertures and sealing to itself, thereby eliminating or reducing the amount of leakage from an individual battery unit. The terminals pass through overlapped edges of the packaging material and include tangs for electrical connection to flaps formed in the flexible circuit.

Abstract: A Jack connector includes: a retainer which holds a semiconductor optical device and an electrical connection terminals; wherein the electrical connection terminals each extend out of the retainer so as to be soldered onto a board; wherein the retainer has recesses provided in a vicinity of the respective terminals so as to accommodate a solder possibly creeping up along the terminals when the jack connector is soldered onto the board.

Abstract: Holding element with a holding clip, arrangement with a carrier board and a holding element, and aA holding element (2) with a holding clip, an arrangement of a holding element (2) with a carrier board (32) and an arrangement of a holding element with a carrier strip are described, the carrier strip and the holding element being of integral construction. Advantageously, the holding element has two legs, with which a holding clip can be placed on a carrier board. In this way, a stable holding element is produced, which stands without further assistance on a base-board and can hence be easily soldered.

Abstract: A plug-in type electronic control unit is comprised of a wiring board, a plurality of electronic parts mounted on one surface of the wiring board by utilizing a wireless bonding process, and a plug member mounted on the other surface of the wiring board by utilizing a wireless bonding process. It is possible to suppress the planar extent of the unit by such a laminated structure, and to suppress the extent of the unit in a laminating direction by the employment of the wireless bonding process. Thus, it is possible to achieve a reduction in size of the plug-in type electronic control unit.

Abstract: A printed-circuit board (PCB) test jack comprises a body portion adapted for mounting on the top surface of a PCB and to provide mechanical support and signal and ground connections to an external test probe. At least one surface mount ground conductor is connected to and extends from the body portion to provide the ground connection; the ground conductors are arrayed for attaching to corresponding surface pads on the PCB's top surface. A single through-hole pin for insertion into a corresponding through-hole on the PCB is electrically isolated from the surface mount ground conductors and is connected to the body portion for providing the signal connection.

Abstract: A pin solders to a circuit board. The pin includes a soldering portion which is configured to solder to a via of the circuit board and an engagement portion which is configured to engage with a circuit board component. The soldering portion has a circular cross-section and a soldering portion diameter. Similarly, the engagement portion has a circular cross-section and an engagement portion diameter. The soldering portion diameter is substantially narrower than the engagement portion diameter. Accordingly, the soldering portion can solder to relatively narrow circuit board via having a small anti-pad, and the thicker engagement portion can provide suitable strength for positioning the circuit board component in a reliable manner.

Abstract: The snap terminal of the present invention is provided with a top wall, a vertical wall, an annular flange, and an annular setoff extending therefrom. The setoff is positioned concentric to the open portion of the terminal. In use, the setoff provides a space between the flange and a component for receiving a minimum volume of solderable material. The setoff further prevents excess solderable material from flowing into the open portion of the terminal when the terminal is soldered to a component. The terminal may be formed in a one-piece unitary construction.

Abstract: A method of fabricating and using an interconnection element that includes a first element material adapted to be coupled to a substrate and a second element material comprising a material having a transformable property such that upon transformation, a shape of the interconnection is deformed. An example is a material that has a transformable property such that a volume of the first and/or second element material may undergo a thermal transformation from one volume to a different volume (such as a smaller volume) resulting in the deformation of the interconnection element.

Abstract: A straddle mount connector (1) includes a dielectric housing (2) defining a mating surface (200) and an opposite mounting surface (202), a pair of ground buses (4) and two rows of signal contacts (3) installed into the housing from the mounting surface. Each ground bus is accompanied with a carrier strip (46) and has solder tails (42) extending from the carrier strip. The ground bus has a number of fingers (460) extending from the carrier strip to define a number of parallel slits (462) between the fingers. The signal contacts have terminal portions (32) extending through the parallel slits, thereby keeping the signal contacts retained between the fingers of the ground bus.

Abstract: The folding blade terminal of the present invention includes a planar base and elongated terminal blade that are operatively connected through an upward projection fold feature and terminal blade angle hinge feature. In use, the folding blade terminal facilitates point-of-use final terminal forming and integral mechanical pull testing while producing a uniform solder fillet around the perimeter of the terminal base, eliminating the risk of stress points caused by irregular solder fillets. Alternate embodiments of the invention provide a terminal lock disposed at the opposite end of the terminal to prevent the unintentional removal of a box terminal from the terminal blade. Another embodiment of the invention provides a double folding blade terminal. Each of the embodiments of the present invention can be formed to have particular profile heights as required.

Abstract: A method for connecting a connector to a printed-circuit board that maintains the optimal terminal alignment accuracy and improves the terminal soldering reliability. The method includes forming a fastener for fastening the terminals from a metal having a fusion point that is substantially the same as solder, fastening the terminals at predetermined positions with the fastener in a state in which the terminals are accurately aligned to one another, inserting the terminals into the through holes, and releasing the terminals by fusing the fastener.

Abstract: A bus bar mounting system has a frame assembly and a bus bar assembly. The frame assembly includes a chassis which is mountable within an equipment cabinet, and an interlocking portion that forms a unitary member with the chassis. The bus bar assembly includes a set of bus bars, and a bus bar block. The bus bar block includes (i) a base portion, each bus bar of the set of bus bars coupling to the base portion, and (ii) an interlocking portion that is configured to interlock with the interlocking portion of the frame assembly in order to retain the bus bar assembly in a fixed position relative to the frame assembly. The interlocking portion of the bus bar block forms a unitary member with the base portion of the bus bar block.

Abstract: There is disclosed a method of surface mounting a connector which enables a connector to be automatically mounted while preserving reliability of soldered portions and without additionally providing a special apparatus. The connector is formed to be thick at a portion and thin at another portion with respect to an axis C1. In surface mounting the connector on the printed circuit board, a hook member is inserted into a through hole formed in advance through the printed circuit board. Then, the reflow process is carried out on the printed circuit board whereby terminals of the chips including the lead pins are soldered. The printed circuit board is removed from a reflow furnace, and cooled, whereupon the hook member is bent toward a hooking portion side. This brings the hooking portion into engagement with the underside of the printed circuit board, whereby the connector is firmly fixed to the printed circuit board.

Abstract: The snap electrical terminal of the present invention includes a base having a top wall, a vertical wall, and an annular flange. The annual flange has an underside on which is disposed a ring of solder. In use, the snap electrical terminal provides a ring-shaped electrical and/or mechanical connection with the component to which it is connected. Alternate embodiments of the terminal permit the attachment of male or female threaded components thereto depending on the desired application.

Abstract: A surface mount connector for circuit board attachment is provided in the form of an elongate pin with a head or base formed at the lower end of the pin. The base has a bottom surface that extends substantially normal to the axis of the pin and is dimensioned to be positioned on, and soldered to, a pad on a primary circuit board. A solder bond is achieved by re-flowing a quantity of solder applied to the pad along with a quantity of flux before placing the base on top of the quantity of solder. The base is formed with a plurality of channels that open through the bottom surface and through a peripheral wall of the base for permitting gases generated by vaporizing the flux during solder re-flow to escape from underneath the base and to increase the strength of the solder bond between the pad and the base. Exhaustion of the gases prevents undesirable skating of the connector and misalignment and eliminates voids in the solder bond that would otherwise weaken the bond.

Abstract: An electrical connector includes a hollow conductive post member having a circular periphery, a foot portion and a distal end. The distal end has a generally cup shaped indentation. A base member is included having top and bottom surfaces. The foot portion of the post member is mounted to the top surface. At least one standoff extends from the bottom surface of the base member. The at least one standoff is for resting against a contact surface when soldering the electrical connector to the contact surface, thereby separating the bottom surface from the contact surface to define a minimum volume therebetween for occupation by solder.

Abstract: A clip connector (A) includes an insulating housing (1) and a plurality of terminals (2) projecting from the housing (1). The housing (1) includes an outer surface (1a) for engaging a support member such as a printed board. The outer surface (1a) is irregular, including a plurality of projecting portions (12) and a plurality of retreating portions (13). Each of the terminals (2) includes a straight portion (20a) and a bent portion (20b). Each of the straight portion (20a) is formed with a through-hole (22) through which a resin for bonding the support member and the outer surface (1a) is applied.

Abstract: A connector pin includes an electrically conductive rod having a first end that extends longitudinally from an edge of a circuit board. The rod includes a plug at an opposite end of the rod that is inserted into an electrical receptacle on the circuit board. The plug is orthogonal to a longitudinal axis of the rod. A clamping pivot arm is between the first end and the plug and is parallel to the plug. The clamping pivot arm terminates with a hook whose end points toward the plug. The connector pin is pivoted about the clamping pivot arm pivotally so that the plug is inserted into the receptacle on the circuit board. The edge of the circuit board has a notch therein and the clamping pivot arm engages the notch to prevent lateral movement of the connecting pin. The plug and the clamping pivot arm prevent longitudinal movement of the connecting pin.

Abstract: Several embodiments of enhanced integrated circuit probe card and package assemblies are disclosed, which extend the mechanical compliance of both MEMS and thin-film fabricated probes, such that these types of spring probe structures can be used to test one or more integrated circuits on a semiconductor wafer. Several embodiments of probe card assemblies, which provide tight signal pad pitch compliance and/or enable high levels of parallel testing in commercial wafer probing equipment, are disclosed. In some preferred embodiments, the probe card assembly structures include separable standard components, which reduce assembly manufacturing cost and manufacturing time. These structures and assemblies enable high speed testing in wafer form. The probes also have built in mechanical protection for both the integrated circuits and the MEMS or thin film fabricated spring tips and probe layout structures on substrates.

Abstract: A bus bar structure includes: a bus bar stored in an electric junction box; and a tab terminal electrically connected to a pattern portion of the bus bar. The tab terminal is separately formed with the bus bar. The pattern portion is welded with the tab terminal by using a laser beam.

Abstract: A resin substrate is made of resin or a composite material containing resin. Pins each having the surface, on which Au plating is formed, are, with a soldering material made of Sn and Sb, soldered to a substrate body having a first main surface and formed into substantially a rectangular shape to project over the first main surface 2A of the substrate body. Wettability of the soldering material for securing the pins and the substrate body to one another is relatively low as compared with that of a Pb—Sn soldering material. Therefore, the height of upward movement of the soldering material along the pin can be reduced. Hence it follows that the pins can sufficiently deeply be inserted into the socket so that the gap between the first main surface of the substrate body and the upper surface of the socket is reduced.

Abstract: An electrical terminal including a base pad for soldering to a surface. The base pad has a curved perimeter, and top and bottom surfaces. The electrical terminal also includes a securement portion having a deformable member for deforming around a conductor wire to capture and secure the conductor wire directly to the securement portion. The securement portion is configured relative to the base pad such that forces exerted by the conductor on the base pad are directed to a central region of the base pad.

Abstract: An interposer includes a substrate having opposing surfaces. Conductive terminals are disposed on both surfaces, and conductive terminals on one surface are electrically connected to conductive terminals on the opposing surface. Elongate, springable, conducive interconnect elements are fixed to conductive terminals on both surfaces.

Abstract: An electrical socket for electrically connecting with a pin of a IC package. A contact secured in the socket comprises first and second claw portions formed on opposite ends thereof and two spring arms between the first and second claw portions for being engaged with the IC package pin. The first and second claw portions have two claw feet, respectively. The four claw feet define a clip section in which a solder ball can be received and kept in a predetermined plane when the solder ball is pressed towards the contact. The claw feet can grip the solder ball firmly to avoid the falling of the solder ball during assembling and soldering procedure.

Abstract: In a method for producing an electrical connection between a flexible printed-circuit board (1) and a metallic mating contact member (8), an illumination opening (5) is formed in a first insulating layer (2) and a connecting opening (6) is formed in a second insulating layer (3). A section (8a) of the metallic mating contact member (8) is brought into bearing contact with a conductor track (4) through the connecting opening (6). Welding/soldering of the conductor track (4) to the connecting section (8a) is brought about by radiant heating by means of laser light (9) directed through the illumination opening (5).

Abstract: A Ball Grid Array IC Socket connection with solder ball is characterized in that the conductive plate is formed from bendable, flexible conductive thin plate surrounded to form slotted cylindrical tube for the insertion and clipping of IC pins. The slotted cylindrical tube is in the form of square shape, wherein the size of the tube diameter can tightly clip the ball wall of a solder ball, such that the tube opening mounted with the solder ball provides a tight connection. On the other end of the slotted cylindrical tube, remote from the end inserted with IC pins, at a position about half the height of the solder ball, an arc-shaped slit is provided so that a blocking plate is joined to the wall of the tube, and the blocking plate touches the top portion of the solder ball.

Abstract: This comb includes a link bar (5) from which parallel contact plugs (6) extend. Each contact plug is in the form of a tooth (6) pierced by at least one longitudinal window (9) delimiting at least two connection branches (10, 12) which are parallel and deformed transversely in opposite directions one with respect to another and the adjacent edges of which, defined by the parallel edges of the window, are located at a certain distance from one another.

Abstract: An upright-pin-joined resin substrate 11 includes a resin substrate 13 formed from a resin or a similar material and having a main plane 13A and a pin pad 17AP exposed on the main plane; and a number of pins 1 joined to the pin pads 17AP by means of a solder HD. The pins 1 are obtained by shaping a wire material MT which is formed of 194 Alloy and has been heat-treated in advance at 450° C. to 900° C. The pin 1 includes a shaft portion 1A and an enlarged-diameter portion 1B having a round surface projecting in a direction opposite the shaft portion 1A. The enlarged-diameter portion 1B and another portion are joined to the pin pad 17AP through soldering. Also disclosed is a method of producing the upright-pin-joined resin substrate; a pin to be employed in the upright-pin-joined resin substrate; and a method of producing the pin.

Abstract: A method for producing a press in contact having a press-fitting portion having a U-shaped or V-shaped groove in cross-section to be press-fitted in a cylindrical through-hole of a printed circuit board. A block element having a rectangular cross-section corresponding to the press-fitting portion of the contact is formed at its center with a concaved portion by forging. Both the ends of the forged block element are removed by punching. Thereafter, the remaining U-shaped or V-shaped press-fitting portion in cross-section is further so worked by press working that its outer periphery is formed into arcs which are concentric to the through-hole when the press-fitting portion has been press-fitted and fixed therein.

Abstract: The invention provides a printed-wiring board that is capable of preventing the lift-off phenomenon without changing the related process for fabricating related printed-wiring boards. A printed-wiring board of the present invention has the structure in which land portions are formed on both sides (front side and back side) of a board, a through hole is formed through the board, and an electrically conducting layer is formed on the inside peripheral surface of the through hole by means of plating to connect between the above-mentioned land portions of a wiring pattern, wherein the entire surface of the land part including the opening circumference of the through hole is covered with an insulating layer that covers the other part of the wiring pattern on the component side and on the other hand the land part is not covered with an insulating layer and remains exposed on the soldering side.

Abstract: An improved structure of a Ball Grid Array IC mounting seat is disclosed. The IC mounting sear is characterized in that the middle section of the elongated thin strap is provided with a notch such that when the thin strap is folded correspondingly, the folding is at the side wall of the notch and all regions of the side edge of the notch are curved to externally clip the clipping body of the ball edge of the solder ball and the solder ball is mounted to the bottom clipping body of the conductive plates, thereby the solder ball is secured. In application the pre-soldering of the solder ball onto the conductive clipping plate is avoided, and the production process is rapid.

Abstract: An array and method of forming an array of solder-holding clips is provided, suitable for fabrication by automatic progressive stamping techniques, and for ganged application to a corresponding array of terminal pins of an electrical device, for soldering such pins directly to the conductive pads or internally plated holes of a substrate, or to provide a lead connecting such pins to a substrate.

Abstract: A microelectronic package includes first and second microelectronic elements in spaced-apart relationship which are electrically interconnected by a plurality of flexible leads and a layer of anisotropic conductive material. The flexible leads having one end attached to terminals on one of the microelectronic elements extends away therefrom having its opposite tip end electrically interconnected to contacts on the other microelectronic element by virtue of an interposed layer of the anisotropic conductive material.

Abstract: An electrical connector includes a hollow conductive post member having a circular periphery, a foot portion and a distal end. The distal end has a generally cup shaped indentation. A base member is included having top and bottom surfaces. The foot portion of the post member is mounted to the top surface. At least one standoff extends from the bottom surface of the base member. The at least one standoff is for resting against a contact surface when soldering the electrical connector to the contact surface, thereby separating the bottom surface from the contact surface to define a minimum volume therebetween for occupation by solder.

Abstract: A stud bump structure for electrical interconnection between a pair of members includes a base portion, and a stem portion. The base portion is affixed to a pad or trace in one of the pair of members to be interconnected (such as an integrated circuit chip), and the stem end is configured to contact a metal pad on the other member (such as a printed circuit board) to complete the interconnect. According to the invention, the stem end is truncated to form a transverse plane, and the stem is more compliant than the base. Also, a method for forming a stud bump on a contact surface, includes forming a bump base portion on the surface, drawing out a generally conical tail from a top of the base, and truncating the tail to form a stem portion having a planar transverse top surface and having a length from the top of the base portion to the top surface. In some embodiments the tail portion, at least, of the stud bump is formed using a wire bonding tool.

Abstract: According to the invention, a metal insertion piece (6) is provided in a solderable electrical connection element (1) with a thin support sheet (2), at least one metal conductor (3) and at least one free contact face (5), which may be joined to an associated connection face (11) of another component (12), by means of a soldered joint that can be made using a solder deposit (9), which metal insertion piece (6) passes through the connection element (1) and the support sheet (2) respectively in the region of the contact face (5) and is securely joined to this support sheet, which serves as a base for the solder deposit (9). Preferably, the insertion pieces (6) may be derived from conventional crimp attachments. They may also be used for mechanically fastening both the solder deposit (9) and an electrical conductor to the support sheet (2).

Abstract: In a hot-plug connector comprising a plurality of contacts used for a plurality of the uses, each of the contacts being provided with a peg portion for being mounted on a main surface of an electrical circuit board, a contact portion for removable connection to a mating contact of a mating connector, and a squeezed portion for being pushed into and hold by an insulator, the peg portions are equal in length to one another in a depth direction. The squeezed portions are equal in length to one another in the depth direction. The contact portions are different in length in the depth direction from one another so as to correspond to the uses. Therefore, the peg and the squeezed portions are located at the same location in the depth direction. The contact portions are protruded to the different location from each other in the depth direction.

Abstract: In accordance with the invention, a low impedance surface-mount connector comprises a length of cylindrical rod having an I-shaped cross section. The device permits interconnection by pick-and-place techniques, and the interconnection has advantageous qualities of low resistance, low inductance, mechanical compliance and ease of manufacture. A first circuit device having one or more circuit components is interconnected with a second circuit device by surface mounting such connectors on the first circuit device, providing corresponding solder pads on the second circuit device, and mounting the connectors of the first circuit device onto the pads of the second.

Abstract: An electrical terminal including a base pad for soldering to a surface. The base pad has a curved perimeter, and top and bottom surfaces. The electrical terminal also includes a securement portion having a deformable member for deforming around a conductor wire to capture and secure the conductor wire directly to the securement portion. The securement portion is configured relative to the base pad such that forces exerted by the conductor on the base pad are directed to a central region of the base pad.

Abstract: The snap electrical terminal includes a base having a top wall, a vertical wall, and an annular flange. The annual flange has an underside on which is disposed a ring of solder. In use, the snap electrical terminal provides a ring-shaped electrical and mechanical connection with the component to which it is connected.

Abstract: A contact, insertable into an insulative housing of a connector, has a mating end for receiving a mating contact; a retention portion for insertion into the connector; and a mounting end opposite the mating end. The mounting end has a transition area adapted to pass through the insulative housing without substantially skiving the insulative housing. A method of making a contact, comprising the steps of: providing a sheet of material; stamping the sheet to form a carrier strip having an edge and a plurality of contacts, each having a mounting end extending from the edge of the carrier strip; placing a window in the mounting ends of the contacts; and removing the contacts from said carrier strip.

Abstract: An electrical terminal including a base pad for soldering to a glass substrate surface. The base pad has a curved perimeter that is generally circular, and top and bottom surfaces. The electrical terminal also includes a securement portion having a deformable member for deforming around a conductor wire to capture and secure the conductor wire directly to the securement portion. The securement portion is configured relative to the base pad such that forces exerted by the conductor on the base pad are directed to a central region of the base pad. Two or more cable/terminal assemblies can be attached to a carrier strip by breakable regions to facilitate installation.

Abstract: An array and method of forming an array of solder-holding clips is provided, suitable for fabrication by automatic progressive stamping techniques, and for ganged application to a corresponding array of terminal pins of an electrical device, for soldering such pins directly to the conductive pads or internally plated holes of a substrate, or to provide a lead connecting such pins to a substrate.

Abstract: A capillary action enhanced surface mount pin header includes a first flat substrate provided with a predetermined array of plated-through holes having substantially parallel and each having an internal surface defining a first substantially uniform cross section. Pins are provided each of which defines a longitudinal axis and having one end extending through an associated plated-through hole and another end extending to one side of said first substrate. Each pin has an external surface on at least a portion thereof which is received within an associated plated-through hole which defines a second substantially uniform cross section. In the disclosed embodiment, the pins have square or hexagonal cross sections while the plated-through holes have circular cross sections.

Abstract: It is an object of the present invention to provide a printed circuit board with no likelihood of scattering of a powdery material from inner walls of mounting holes formed in the printed circuit board at the time of inserting boss portions of a mounting member into the mounting holes, the mounting member being for mounting the printed circuit board or to be mounted to the same board, as well as a switch using the printed circuit board. In the printed circuit board according to the present invention, an insulating board portion is provided with circuit patterns and mounting holes, which mounting holes are subjected to a through-hole plating to formed electrically conductive layers respectively therein, and then boss portions of a mounting member are inserted into the thus-plated through holes.

Abstract: An array and method of forming an array of solder-holding clips is provided, suitable for fabrication by automatic progressive stamping techniques, and for ganged application to a corresponding array of terminal pins of an electrical device, for soldering such pins directly to the conductive pads or internally plated holes of a substrate, or to provide a lead connecting such pins to a substrate.