Abstract: There is disclosed herein a terminal connector 20 attachable to a metallic mating surface 52 on a workpiece 50 by friction joining. One embodiment of the connector 20 comprises an electrically conductive body 22 having a top end 24 to which an electrical connector 70 may be attached, a bottom end 26 having a bottom surface 28 generally conforming to the mating surface 52 of the workpiece 50, and an axis R substantially orthogonal to the bottom surface 28 about which the terminal 20 may be rotated. Attached to the bottom surface 28 is a layer of solder 30 having an outer perimeter 32 and defining a central solder-free region 34 about the axis R. In a preferred embodiment, the bottom surface 28 of the terminal 20 is substantially circular in shape, and the layer of solder 30 is substantially annular in shape with the central solder-free region 34 being substantially circular and generally centered about the rotational axis R.

Abstract: An array and method of forming an array of solder-holding clips is provided, suitable for fabrication by automatic progressive stamping techniques, and for ganged application to a corresponding array of terminal pins of an electrical device, for soldering such pins directly to the conductive pads or internally plated holes of a substrate, or to provide a lead connecting such pins to a substrate.

Abstract: The assembly of contacts for printed circuit boards 1, 1a consists of contacts 2, 2' and a housing 4, 4' fabricated by insert molding method. The mounting sections 8, 8' have lugs which fit into openings made in pads of the printed circuit board 50 in a staggered pattern. The printed circuit board assembly 70 consists of the printed circuit board 50 with contact assemblies 1, 1a attached to the bottom edge 56 and front edge 62 by surface mounting technique.

Abstract: An aluminum clip useful for being bonded to glass and serving as a terminal for an electrical lead circuit in or on such glass, comprising: an aluminum-based body having a cup shape. The cup shape having a substantially flat surface; an ultra thin pad of noble metal adhered to the substantially flat surface, the pad presenting a surface roughness in the range of 1-5 microns.

Abstract: The present invention provides a vertical card connector capable of preventing an undesirable flow of melted solder which destroys proper contacts and of removing a corrosion-causing acid gas. The vertical card connector includes an insulating housing with a plurality of contact terminals and a heat-resisting insulating resin film covering the bottom surface of the housing. The solder tail of the contact is inserted into a corresponding plated through hole and soldered there. The film prevents melted solder from flowing past the solder tail toward a contact beam of the contact at the time of soldering. Gas produced from the solder escapes through the gap between the circuit board and the bottom of the housing.

Abstract: One and two piece surface mount pin constructions include excess solder receiving channels. In the one piece construction an elongate channel is provided through a tubular pin which is flared or swaged at the lower end to form a base. In the two piece construction a solid pin is provided at a lower end with a uniform cross section in the form of a regular polygon, such as a square, hexagon or octagon. The resulting edges are press-fit against an internal surface of a sleeve which is also swaged at a lower end to form a base. The spaces between the sleeve and the flat or convex surfaces on the captured end of the pin provide the solder-receiving channels. A bead or shoulder on the pins can provide a stop for a vacuum nozzle. When a flared upper lip is used for this purpose it can also serve as a reservoir or well to receive excess solder beyond the amount that can be received in the channels.

Abstract: There is disclosed herein a leadless electronic component (LEC) which avoids solder joint crack initiation. A preferred embodiment of the LEC 110 comprises a body portion 112 having terminations 114 arranged thereabout, each termination having a bottom portion 124 with an interior edge 126, wherein the interior edge has a substantially meniscus-like shape oriented so as to be concave with respect to a centroid of the LEC.

Abstract: A surface mount electrical connector incorporating features to facilitate alignment of contact tails to contact pads on a printed circuit board. The contact tails are held together with a tie bar. Tabs on the tie bar are shaped to engage features on a blade of an alignment tool. The blade can be inserted into the small available on the printed circuit board, but can be easily manipulated for precise alignment of the contact tails.

Abstract: A leaded component (10) is provided with first and second leads (14 & 16). The leads are formed with stopping deviations (26 & 28) which prevent the leads from being inserted into a circuit board (38) beyond the stopping deviations. The leads may also be provided with retaining deviations (34 & 36) which function to retain the component on the circuit board. Further, the stopping deviations may be formed so as to indicate the polarity of a component, and finally, the stopping deviations may be provided with mounting portions (50 & 52) so that the leaded component may be surface mounted on a circuit board (54).

Abstract: A method of connecting a combined daughter printed circuit board and outrigger assembly to a mother board. The assembly has an outrigger with a one piece housing. Contacts of the outrigger are aligned with contact pads on the daughter board by their carry strips prior to soldering the contacts to the contact pads. When the assembly is inserted into a receptacle on the mother board, five different types of contact pads on the card edge connection area are sequentially connected to contacts of the receptacle.

Abstract: A zero insertion force electrical connector including a connector housing having a top surface and a plurality of cavities in the top surface corresponding to an array of pin terminals. Each of the cavities includes a base wall spaced from the top surface and terminal retention openings in the base wall. A plurality of terminals are mounted in the cavities. Each of the terminals is a stamped and formed segment of flat and planar metal stock including a mounting portion substantially in the plane of the stock, a free end portion, a contact structure adjacent the free end portion and a spring arm portion between the mounting portion and the contact structure. The pin terminals are moved in the cavities between an unmated position wherein the pins are spaced from the contact structures in the cavities and a mated position wherein the pins are mated with the contact structures.

Abstract: A solder-bearing metallic lead, and methods of fabricating and using it, where the lead is formed with a solder-retaining portion having a cross-sectional profile with undercuts, which may be in a V-shape or flat, where solder surrounds said solder-retaining portion and undercuts, and extends outwardly from the lead while leaving a portion of the lead uncovered by solder to permit the lead metal to form direct contact with a substrate or other conductive pad.

Abstract: A terminal socket assembly is adapted for mounting on a printed circuit board and includes a conductive terminal socket having a barrel portion insertable axially into a hole in the printed circuit board, with radially outwardly projecting wing portions for soldering to solder pads on the circuit board. A terminal-receiving dielectric housing mounts the terminal socket therewithin. The housing has walls which extend circumferentially about portions of the barrel portion of the terminal socket to prevent solder from wicking along exposed areas of the terminal and interfering with mating. The anti-solder wicking design allows a connector or component to be surface mounted directly on the surface of a circuit board to maximize the density of the entire assembly and the device in which it is used.

Abstract: A connector for substrates such as smart cards has a housing containing two parallel rows of spring contacts, each of which is held in a respective channel of the housing. Integral with each of the spring contacts and extending outside of one end of the housing is a terminal lead for connection to a substrate. The lead has a solder mass adjacent its end. The two parallel rows of solder-bearing leads will straddle and resiliently hold a substrate between them to improve accuracy in soldering during solder re-flow. The other end of the housing is provided with entry apertures for pins of a multi-pin connector, so that each pin will enter a respective housing channel to contact the spring contact therein. The entry apertures may accommodate a substrate with contact pads.

Abstract: An electrical contact terminal for mounting on a printed circuit board has a point of primary electrical contact with the circuit board physically separated from a pair of load-bearing connections to the circuit board. Physical loads caused by relative movement between the printed circuit board and an electrical component attached to the terminal are borne by the load-bearing points while the point of primary electrical contact is isolated from those loads and therefore will not be subjected to stresses which cause degradation of the electrical connection.

Abstract: A method and device for improved assembly to hole-free PCBs of high aspect ratio components or any other components that are not easily assembled to a hole-free PCB by standard surface-mount technology (SMT), such as pins, lugs, tabs, and test points. A metal or other electrically conductive member having one or more holes ("holed component") is mounted to the PCB, typically on a solder pad on the PCB. The said electrically conductive member, will have a low aspect ratio. The hole, which may be round, rectangular, or threaded, is sized to provide an interference fit with the male projection of the component which will be inserted within the hole. The holed component, like other low aspect ratio SMT components, may be delivered on tape and reel and conventional surface mount or pick and place equipment is used to surface mount the holed component on the hole-free PCB, following which the holed component is soldered in place.

Abstract: A solder-bearing lead, and methods of fabricating and using it, where the lead is formed with a solder-retaining portion having a cross-sectional profile with undercuts and a tip, preferably in a V-shape, where solder surrounds said solder-retaining portion and undercuts, and extends outwardly substantially no farther than said tip.

Abstract: An electrical connector comprises a housing and terminals mounted therein, the terminals comprising contact tails for soldered connection to a printed circuit board. The contact tails have sealing material deposited thereon for sealing between the contact tail and housing to prevent solder and flux wicking onto contact sections of the terminals. The concept also advantageously provides sealing of the connector from the environment, whilst using minimal quantities of sealing material and having very small sealing surfaces for increased reliability thereof.

Abstract: A connector 60 for disk-shaped batteries 40 including a housing 62 with a battery receiving cavity 74, opposed endwalls 66 having spring arms 68 that extend outwardly from the cavity 74 for retaining the battery 40 in the housing 62, a surface mountable positive terminal 77, and a surface mountable negative terminal 79. The positive and negative terminals 77,79, are disposed in respective terminal receiving passageways 72 of the housing with spring arm contact sections 80 opposing each other along the housing sidewalls and with surface mountable connecting sections 84 of both the terminals 77,79, extending outwardly from respective the housing sidewalls 64 at the bottoms thereof.

Abstract: An electrical edge connector housing (1), for mounting onto a printed circuit board substrate (100), has walls that form a plurality of slots (3) and a respective plurality of chambers (2). Each slot (3) is positioned on an opposite side of a substrate receiving groove (13) from a chamber (2). Each slot (3) and chamber (2) receives a contact (18) therein for connection to the substrate (101) received within the groove (13). A retention clip (40) cooperates with an alignment block (50) to align and retain the substrate (101) within the housing (1).

Abstract: A method of making an array of electrical components having pre-attached leads ready for automated surface-mounting on a substrate. The method involves aligning an array of leads with electrical components and attaching each lead to a conductive terminal on a respective component. A series or coil of leads joined integrally together and carried by a carrier strip is thus provided with a series of electrical components pre-attached thereto. The electrical components along with their leads may thus be quickly and easily surface-connected to the conductive pads on a substrate in a simple, automated manner.

Abstract: An electrical connector (20) having a housing block (24) with a plurality of passageways (50) having tapered portions (56) and straight portions (58) into which are inserted respective contact terminals (34). The passageways and the contact terminals are so designed that the contact terminals are press-fit into the passageways and displace dielectric material of the housing block to provide a "seal" which prevents solder flux from wicking up the passageways. In addition, the contact terminals are formed with a longitudinal knurl (38) to prevent rotation of the contact terminals after insertion. Still further, each contact terminal is formed with a frusto-conical retention collar (42) having a rearward facing surface (66) which, upon exiting a passageway, abuts against a recessed stop ledge (64) formed in the housing block to prevent the subsequent removal of the contact terminal from the housing block. The housing block (24) also includes channels (60) that aid in removal of solder flux.

Abstract: An electrical connection device of the type comprising a folded configuration of resilient material adapted to ensure elastic retention and a coating of malleable material to be soldered or brazed adapted to be melted to ensure electrical connection. The coating of malleable material (3) is substantially recessed within said resilient material (1), by being disposed in a groove (3) provided within said resilient material (1). The groove (2) has an inner surface and two flared edges (2b,2c). At least one of the edges (2b2c) of the groove (2) is outside the resilient bearing plane (P), such that the malleable material (3) will be separated from the bearing plane (P) by a predetermined distance (d). The folded configuration of resilient material and the malleable material (3) are cut out to form clips, the resilient material (1) is not to extend laterally beyond the cut-out clips (12).

Abstract: A pin-header comprises a one-piece molded insulator and metal pins extending through the insulator. One surface of the insulator has a first recess having and a plurality of second recesses are provided each at an area between the inner wall surface of an insertion hole and the outer peripheral surface of the pin with each pin inserted in the insertion hole. A sealant is filled in the first and second recesses of the insulator.

Abstract: A first connector is installed on an upper surface of a printed wiring board. A plurality of tabs is inserted into each inserting opening of the printed wiring board. The tabs are soldered on a lower surface of the printed wiring board. Then, a lever-holding casing holding a lever therein is installed on the connector.

Abstract: An electrical terminal for an electrical component to surface mount the component on a printed circuit board with the component extending upright from the printed circuit board. The electrical terminal includes a metal strip having a pair of spaced tabs extending in the same direction from the metal strip to form an U-shaped clip within which the electrical component fits. A separate foot extends from each tab with the feet being aligned in the same plane and extending in opposite directions from the tabs. The feet are adapted to seat on the surface of a printed circuit board to support the electrical component in the upright position on the board. A plurality of the terminals are mounted in spaced relation along an edge of the electrical component and can be soldered to terminal pads on the electrical component to electrically and mechanically connect the terminals to the electrical component.

Abstract: In order to allow header-less connector pins to be directly surface mounted to a PCB, using a standard pick and place machine, a novel pin holder is used to hold the pin while in pockets or holes of a reeled tape and during its pick and placement by the suction head of the pick and place machine supplied with the reel. The holder is configured to permit standard pin spacings of a row of pins to match standard female connectors, and to allow observation of the pin during the placement process. Novel pin designs for use with the holder are also described.

Abstract: A solder-bearing lead adapted to be soldered to a conductive surface comprises an elongated body portion having a solder-bearing portion, a terminal portion, and a middle portion disposed between said solder-bearing portion and said terminal portion. The solder-bearing portion carries a solder mass either on a pair of projections extending from one edge of said body portion and forming a gap therebetween dimensioned to receive a solder mass, or on one or both of the opposed faces of said solder-bearing portion. A region of the middle portion is twisted or the projections are bent so that the solder-bearing portion lies in a plane substantially perpendicular to the plane of the terminal portion. The solder-bearing lead can be used as an edge clip for mounting a substrate such as a printed circuit board, or as a surface-mounted lead for a substrate.

Abstract: A clip lead is provided for soldering to and supporting a first substrate vertically on a second substrate which may be horizontal. The terminal end of the clip is configured to form a stable support for the substrate during soldering in a vertical position to the second substrate by being bent at right angles to and extending under the first substrate.

Abstract: A component is mounted to a circuit board using two spaced apart conductive pad portions that make electrical contact with a terminal of the component. The space between the conductive pad portions provides an additional path through which a cleaning solution and debris can flow.

Abstract: A grid array 10 of terminals 20 secured with a fusible electrically conductive material 34 usable in conjunction with a source of constant amplitude high frequency alternating current of known frequency is formed by the steps of: selecting a plurality of terminals 20 having a thin magnetic layer 30 defined thereon, transforming the terminal into a Curie point heater, each terminal 20 including a first connecting section 24 having a fusible electrically conductive material 34 disposed thereon; releasably holding each of the terminals 20 precisely positioned within an array 22 corresponding to an array 14 of circuit termini 16 of a circuit bearing article 12 such that each of the first connecting sections 24 of the terminals 20 is substantially in physical engagement with a corresponding circuit terminus 16; interposing an electrical conductor 60 connected to the source of alternating current among and adjacent each terminal 20 positioned within the array 22; subjecting each heater body to said constant current

Abstract: An electrical connector is provided for surface mounting along an edge of a circuit board in an edge straddling configuration. The circuit board has a plurality of contact pads spaced along opposite faces of the board near the edge thereof. The connector includes a dielectric housing and a plurality of terminals mounted on the housing with solder tails projecting from the housing generally in two rows to define an elongate board-receiving mouth for receiving the edge of the circuit board. The contact pads are adapted to receive soft solder paste thereon prior to insertion of the board into the mouth between the two rows of solder tails.

Abstract: A solder terminal strip stamp formed from thin metal stock includes a carrier strip, a plurality of solder terminals extending to one side of the carrier strip and reverse bend the contact arms on the ends of the terminals away from the strip. A thin solder layer is integrally bonded to contact arm and is joined to solder reservoirs located on the sides of the arms.

Abstract: A completely shielded metallized connector block for use in multiple circuit modules of an electronic device. Electrical communication between the circuit boards is effected by an array of metallic pins which run through the blocks. The metallization on the nonconductive blocks can be held at ground or at a constant potential to increase the shielding between pins as well as maintaining voltage and ground planes at constant levels throughout the modules. The metallization is insulated from the pins and circuit boards by nonconductive bushings inserted in holes in the blocks. In one embodiment, the metallization consists of copper and solder plating and the blocks are constructed of liquid crystal polymer.

Abstract: A low profile connector 20 including a receptacle 22 and a plug 70, each having a housing 24,72 with respective arrays of contacts 44,92 secured therein, the contacts 44,92 being of thin metal set on edge in the housings 24,72 and including edge contact surfaces 50,98 projecting from the housings 24,72 in a common plane for soldering to the circuits. Each receptacle contact 44 has a C-shaped configuration including a base 48, an intermediate portion 60 and an arm 62, the arm 62 defining a contact surface 68 adapted to mate with a corresponding plug contact surface 110, the arm 62 extending transversely of the axis in a first direction. Each plug contact 92 has an L-shaped configuration including a base 94 and a post 104 extending from the base 94 parallel to the axis, a side surface 110 of the post 104 defining a mating surface for a corresponding one of the receptacle contacts 44.

Abstract: A grid array 10 of terminals 20 secured with a fusible electrically conductive material 34 usable in conjunction with a source of constant amplitude high frequency alternating current of known frequency is formed by the steps of: selecting a plurality of terminals 20 having a thin magnetic layer 30 defined thereon, transforming the terminal into a Curie point heater, each terminal 20 including a first connecting section 24 having a fusible electrically conductive material 34 disposed thereon; releasably holding each of the terminals 20 precisely positioned within an array 22 corresponding to an array 14 of circuit termini 16 of a circuit bearing article 12 such that each of the first connecting sections 24 of the terminals 20 is substantially in physical engagement with a corresponding circuit terminus 16; interposing an electrical conductor 60 connected to the source of alternating current among and adjacent each terminal 20 positioned within the array 22; subjecting each heater body to said constant current

Abstract: A tab type male terminal intended for circuit board mounting comprising a body of terminal tab and mounting legs provided integrally with the terminal tab body to extend through respective terminal mounting holes in a circuit board to be soldered to an electrically conducting layer on the circuit board and having reinforcing projection means integrally provided with the terminal tab body between the adjacent mounting legs and inserted into a slot type common terminal mounting hole and soldered to the electrically conducting layer on the circuit board together with the mounting legs so as to more securely mount the tab type male terminal onto the circuit board.

Abstract: A solder-bearing lead adapted to be soldered to a conductive surface comprising an elongated body portion having a solder- bearing portion, a terminal portion, and a middle portion disposed between said solder-bearing portion and said terminal portion. The solder-bearing portion carries a solder mass either on a pair of projections extending from one edge of said body portion and forming a gap therebetween dimensioned to receive a solder mass, or on the opposed faces of said solderbearing portion. A region of the middle portion is twisted so that the solder-bearing portion lies in a plane substantially perpendicular to the plane of the terminal portion. The solder-bearing lead can be used as an edge clip for mounting a substrate such as a printed circuit board, or as a surfacemounted lead for a substrate.

Abstract: A grid array 10 of terminals 20 secured with a fusible electrically conductive material 34 usable in conjunction with a source of constant amplitude high frequency alternating current of known frequency is formed by the steps of: selecting a plurality of terminals 20 having a thin magnetic layer 30 defined thereon, transforming the terminal into a Curie point heater, each terminal 20 including a first connecting section 24 having a fusible electrically conductive material 34 disposed thereon; releasably holding each of the terminals 20 precisely positioned within an array 22 corresponding to an array 14 of circuit termini 16 of a circuit bearing article 12 such that each of the first connecting sections 24 of the terminals 20 is substantially in physical engagement with a corresponding circuit terminus 16; interposing an electrical conductor 60 connected to the source of alternating current among and adjacent each terminal 20 positioned within the array 22; subjecting each heater body to said constant current

Abstract: A solder-bearing lead for attachment to the surface of a substrate, wherein a discrete mass of solder is mechanically held firmly by the lead in a position permitting close proximity to the substrate surface to connect the lead to the substrate with an electrical and mechanical bond upon melting of the solder, the lead body having a pair of fingers partially encircling the solder mass with a gap between the fingers providing an unobstructed flow for the melted solder to the substrate. The lead may also be used to interconnect a first substrate to a second substrate, forming a bond between conductive areas on both substrates.

Abstract: A solderable lead structure adapted for joining or soldering to a substrate carrying electrical components, comprising a double comb-like configuration made of conductive material, having two rows of contact strips or leads that are connected to opposite edges of a common carrier strip. At the free or distal ends of the leads, individual clips are formed for resiliently engaging both sides of a substrate. The leads extend from the carrier strip from opposite edges and are then folded to result in a linear, intermeshed arrangement.

Abstract: An electrical connector is provided for surface mounting along an edge of a circuit board in an edge straddling configuration. The circuit board has a plurality of contact pads spaced along opposite faces of the board near the edge thereof. The connector includes a dielectric housing and a plurality of terminals mounted on the housing with solder tails projecting from the housing generally in two rows to define an elongate board-receiving mouth for receiving the edge of the circuit board. The contact pads are adapted to receive soft solder paste thereon prior to insertion of the board into the mouth between the two rows of solder tails.

Abstract: An electrical contact comprising a holding section (2) formed of opposing side plates (6) bent from a bottom plate (5), a contact section (3) extending outwardly from the holding section (2) for electrical connection with a circuit board, a wire-connection section (4) between the side plates (6) for electrical connection to an insulated electrical wire (30), projections (18) at the sides of the wire-connection section (4) disposed in projection-receiving holes (8) in the side plates (6), and the side plates (6) having thermal-insulation holes (9, 9') adjacent the projection-receiving holes (8) to dissipate heat conducted along the contact section (3) and holding section (2) when the contact section (3) is soldered to the circuit board to obviate the melting or softening of the insulation of the electrical wire (30) in the wire-connection section (4).

Abstract: A grid array 10 of terminals 20 secured with a fusible electrically conductive material 34 usable in conjunction with a source of constant amplitude high frequency alternating current of known frequency is formed by the steps of: selecting a plurality of terminals 20 having a thin magnetic layer 30 defined thereon, transforming the terminal into a Curie point heater, each terminal 20 including a first connecting section 24 having a fusible electrically conductive material 34 disposed thereon; releasably holding each of the terminals 20 precisely positioned within an array 22 corresponding to an array 14 of circuit termini 16 of a circuit bearing article 12 such that each of the first connecting sections 24 of the terminals 20 is substantially in physical engagement with a corresponding circuit terminus 16; interposing an electrical conductor 60 connected to the source of alternating current among and adjacent each terminal 20 positioned within the array 22; subjecting each heater body to said constant current

Abstract: An electrical connector is disclosed having pin terminals positioned within an insulating housing where the terminal includes a cylindrical contact portion having an inner diameter formed at which carries a plastic cylindrical bead. The terminal also includes a serrated portion positioned within a converging bore portion of the housing passageway. A printed circuit board can be positioned against the lower portion of the housing and when wave soldered causes the serrated portion to form corresponding grooves in the housing through hole and causes the plastic bead to melt and fill the seam between the edges of the serrated portion.

Abstract: A solder-bearing lead having a C-clip to resiliently grip the upper and lower surfaces of a substrate. One of the two arms forming the "C" is solder-bearing for mechanical and electrical connection to a conductive area on the substrate. In one embodiment, a polymer plug may be provided on the second arm, the plug having a narrowed neck region for improved retention by the second arm. In another embodiment, the second arm is coated with a non-conductive material, eliminating the need for mechanically retaining a plug or other insulator between the second arm and substrate. The coating on the lead is provided preferably by applying a liquid polymer to the second arm of the lead and hardening the polymer to form a durable, insulating coating.

Abstract: To bridge the gap between a semiconductor die and the leads of a leadframe, an insulating bridging and support member is used to support the die. The member has thereon conductive traces connected to the die. Provided in the interior portion of the member away from its edges are connecting structures such as holes, slots or grooves. The leads have bent end portions engaging the holes, slots or grooves. The bent end portions are soldered or otherwise connected to the inner surfaces of the holes, slots or grooves by soldering to electrically connect the leads to the traces and to physically attach the member to the leadframe. The above-described structure permits the bonding sites between adjacent leads to the member to be greater than lead spacing of the leadframe. The leads are in the shape of elongated rods of uniform cross-section to maximize the lead density possible around the bridging and support member.

Abstract: A chip carrier socket 2 comprises, a chip carrier receiving member, multiple electrical terminals 4 extending over component mounting pads 64 of a substrate 10, and surface mount contacts 62 of the terminals 4 being aligned so as to engage the conductive mounting pads 64 that are in alignment with conductive leads 6 of a chip carrier 8, whereby the same mounting pads 64 can be used for surface mount attachment to the leads 6, and can be used for surface mount attachment to the terminals 4 of the chip carrier socket 2. The terminals include recesses 66 on edges adjacent to the surface mount contacts to prevent these edges from being wetted by solder. Certain ones of the terminals include posts 38 to uniquely orient the socket 2 with respect to the substrate 10.

Abstract: A telephone line overvoltage protection device and a method of forming an overvoltage protection device are provided. A first terminal guard housing defines a plurality of terminal receiving channels. A second housing contains a printed wiring board and the first terminal guard housing is arranged for mating engagement with the second housing. A plurality of terminals are inserted in the terminal receiving channels. Each of the terminals includes an outwardly extending terminal portion extending outside the first terminal guard housing. The outwardly extending terminal portion of each of the terminals is formed to define a line of terminal portions corresponding to a plurality of terminal receiving apertures in the printed wiring board. Then the terminal portions are inserted in the terminal receiving apertures and soldered to the printed wiring board. The terminals are bent to position the printed wiring board and a mating portion of the first terminal guard housing for insertion into the second housing.

Abstract: A solderable lead is fashioned with a C-shaped contact portion along its length. The interior of the C-portion is dimensioned to receive and resiliently contact a substrate at a predetermined contact pad. A layer of solder is provided on the exterior of the C-shaped contact portion and extends around its edge. During heating, the solder migrates to the interior of the C-portion by capillary action to the area between the contact pad of the substrate and the interior of the C-portion. While the solder is liquid, the C-portion maintains engagement with the substrate.