Abstract: A flexible printed circuit board terminal structure includes a flexible printed circuit board composed of electrically conductive patterns formed on a flexible insulative film of a thermoplastic synthetic resin by the screen-printing of an electrically conductive coating, and an insulative coating of synthetic resin disposed on the insulative film on a portion thereof except for a terminal section defined at one edge. Metallic terminal members are placed on the electrically conductive patterns at the printed circuit board terminal section directly or through the intermediary of an electrically conductive adhesive, a terminal fixing film made of a thermoplastic synthetic resin having the same properties as the thermoplastic insulative film is placed on the terminal section from above the metallic terminal members, and predetermined portions of the thermoplastic insulative film and terminal fixing film, with the exception of portions at which the metallic terminal members are situated, are thermally fused.

Abstract: A component and method are provided for making a soldered electrical connection between two mating members, in which a deposit of solder on the surface of one of the members is juxtaposed to a cooperatively shaped surface on the other member when the two members are mated, so that the solder will melt and bind the two surfaces when heated. The quality of this connection may be further improved by providing a resilient arrangement for urging the conforming surfaces together as heat is applied. In one form of contact element according to the invention a hollow, cylindrical metal shell with a longitudinal split provides a resilient fit into a mating member, such as a metal-lined hole on a printed circuit board. The shell is provided with a deposit of solder in a groove on its outer surface where the shell is to engage the metal lining of the hole.

Abstract: A printed circuit board includes a pair of mounting openings for a connector member comprising a strip of electrically conducting material having a pair of oppositely oriented concave legs joined in a convex head. Each of the legs has an end abutting the circuit board and a narrower foot extending through one of the openings and soldered to the printed circuit on the opposite side of the board in a wave soldering process. The spacing of the mounting openings is less than that of the ends of the legs of the unbiased connector member so that the latter must be pinched closed to be mounted on the board and is positively retained thereon until soldered. The spacing also maintains the concave legs of the mounted connector member in contact with each other at their point of closest approach for controlled retention of a mating connecting member shaft but separated at the ends so that no molten solder wicks therebetween by capillary action in the wave soldering process.

Abstract: A structure of joining two printed circuit boards with solder. A reserve solder layer is applied on a pattern of first joint leads of the printed circuit on a base plate of the first board. A pattern of high thermal conductivity similar to the pattern of second joint leads of the second printed circuit board, is formed on the opposite or back surface of the base plate thereof substantially superposed with the second joint leads. To join the first and second boards, the second board is turned upside down and then the second joint lead pattern is put on the solder layer in registry with the first joint lead pattern of the first board. And it is at a point on each patch of the thermal conductivity pattern that heat is then applied thereto to obtain the structure between the joint leads of the two printed circuit boards.

Abstract: A right angle connector assembly (20) has a plurality of rows of contact receiving passages (36) laterally aligned with parallel profiled channels (112, 114) in a solder post spacer plate (46). Contacts (38) having a mating portion (40) and a mounting portion (42), typically a solder post (44), are inserted into all of the contact receiving passages (36) in a row simultaneously. Concurrent therewith, the solder posts (44) thereof are inserted into alternate profiled channels (112, 114) in the solder post spacer plate (46). As the solder posts (44) are inserted into the channels (112, 114) the portion (122, 124) of the post spacer plate (46) between adjacent channels (112, 114) deflect laterally with a different effective beam length (126, 154, 170) for each row of contacts (38) inserted. Contacts (38) seat in detents (148, 162 and 130) in channels (112, 114).

Abstract: A printed circuit board is disclosed which comprises a plurality of non-through holes into thickness direction in one surface of the board, a plurality of through holes in some of the non-through holes to open through opposite surface of the board and having a smaller inside diameter than the non-through holes, a plurality of first conductive lands on the periphery of the openings of the non-through holes in one surface of the board, a plurality of second conductive lands on the periphery of the openings in opposite surface of the through holes and having the smaller outside diameter than the second lands on the periphery of the openings of the non-through holes, a conductor layer in inside wall of the non-through holes and the through holes for connecting the first lands in one surface and the second conductive lands in opposite surface of board, and conductive patterns formed in one surface and opposite surface of the board respectively, which invention is capable of including the great number of the conduc

Abstract: A conductive lead for connection to a first conductive area of a device having two opposed surfaces with a conductive area comprises an elongated conductive body formed from a substantially flat strip of a resilient material. The conductive body has a pair of opposite arms adapted to engage the opposed device surfaces resiliently. A non-conductive element is held by one arm and is adapted to engage the other surface of the device to insulate the lead from the other surface. The conductive area of the other surface is insulated by the lead and the non-conductive element from the conductive area of the first surface.

Abstract: A probe for an in-circuit emulator comprises flexible substrates, pins provided at one end of the substrates for connecting the flexible substrates with an LSI package, a base mounted on the flexible substrates and having a penetration hole for holding the pins, and a presser plate mounted on the flexible substrates and having a hole, characterized in that the base and presser plate sandwich the flexible substrates and pins for connecting the flexible substrates with the pins.

Abstract: An edge clip for attachment to a contact pad on a substrate includes a pair of spaced-apart spring fingers, adapted to receive the edge of the substrate therebetween. One or both of the fingers may at least partially encircle and support a mass of solder. The fingers are joined to the body portion with a folded connecting portion integral with the body between its ends, and one or more folded end portions, aligned with the connecting portion, can be supported from carrier rails at one or both ends during manufacture.

Abstract: A comb-like array of electrical leads is provided, each having a solder mass and/or a locating structure at a terminal end, the array being in two sets for respective attachment to conducting areas on the top and bottom surfaces of a substrate (such as a printed circuit board), the leads being pivotable either at their stem ends (as in FIGS. 1-2, 21-22 and 31-33) or at an intermediate fulcrum (as in FIGS. 40-41). Resilient structures in the form of resilient bowed portions are formed in the leads, so that upon applying appropriate force to the resilient structures, the sets of leads are separated to accept a substrate therebetween, with the lead terminal ends aligned with respective contact pads on the substrate, and so that upon releasing such force, the leads will tend to return to their initial positions and thereby resiliently clamp the lead structure to the substrate, to be held there during subsequent soldering.

Abstract: A solder-bearing terminal is formed from a blank having a main body portion and side tabs extending laterally from it, which are bent perpendicularly to the main body. The tabs may be formed in pairs to retain a solder mass therebetween, or may be in the form of single fingers partially encircling or staked to a solder mass. The solder mass is positioned to facilitate soldering of a terminal of a device to a substrate, as for surface mounted devices. The tabs may be on one or both edges of the main terminal body.

Abstract: A generally rectangular, flat, conductive metal sheet is formed and provided with a predetermined array of apertures and slots by stamping. The sheet is generally comprised of first and second lateral sections and upper and lower center sections which are each coupled to a respective lateral section by a thin jumper, or bridge, element or elements. Each section further includes a mounting/terminal pin extending from a respective lower edge thereof. The sheet is then bent such as by automatic handling apparatus along three spaced axes located between or extending through the various sections and along and parallel to the length of the sheet from top to bottom so as to form a generally "E"-shaped structure when viewed from above. Four axial lead diodes are then inserted within respective pairs of facing slots within the lateral and center sections and are soldered in place.

Abstract: A flat multiconductor jumper cable comprises a plurality of elongate substantially parallel and transversely spaced conductors surrounded by a casing of insulation. At one or both ends of the jumper cable, exposed portions of the conductors are formed in a curved clipped portion for solder connection to an integrated circuit substrate. The conductors are preferably formed of a soft non-resilient material such as copper and the clip portion is provided to have a substantially circular cross-section. The clip portion, formed in a generally U-shaped configuration defines a pocket for receipt therein of the edge of a substrate having conductive pads on opposing surfaces. Upon soldering the clip portion to the conductive pads, solder fillets are formed in such a manner as to provide an enhanced electrical and mechanical joint.

Abstract: A chip carrier mounting device which is hereinafter also referred to as an "interconnection preform placement device" includes a retaining member having a predetermined pattern of apertures in which are positioned preforms of joint-forming material such as solder. The preform retains its general configuration after the interconnection or soldering process to form a resilient joint which is more capable of withstanding stress, strain and fatique. A method of forming resilient interconnections comprises placing the interconnection retaining member device between parallel patterns of electrically conductive elements, such as the conductive pads on an electronic component and a circuit board, and effecting the bonding of the conductive elements with the preforms. The joint-forming material may be a filled solder composition or a supported solder which substantially maintain their physical shape when the solder is molten, or a conductive elastomer.

Abstract: An edge clip for attachment to a contact pad on a substrate includes a pair of spaced-apart spring fingers, adapted to receive the edge of the substrate therebetween. One or both of the fingers may at least partially encircle and support a mass of solder. The fingers are joined to the body portion with a folded connecting portion integral with the body between its ends, and one or more folded end portions, aligned with the connecting portion, can be supported from carrier rails at one or both ends during manufacture.

Abstract: A frame member is bonded on a base plate having a plurality of electrical contacts thereon. The frame member includes a plurality of apertures corresponding to the electrical contacts. Bonding means bonding the frame member on the base plate is formed by a waterproof double faced bonding member including a waterproof sheet and waterproof bonding agent applied to both sides of the sheet, the double faced bonding member separates the electrical contacts from each other to prevent accidential conduction between the adjacent electrical contacts due to a water drop.

Abstract: The present invention relates to a solder-bearing lead for attachment to a contact pad on a printed circuit board or like substrate, or for mounting a circuit component on a substrate, suitable for being continuously stamped from a thick strip of metal at high speed, with an improved arrangement for holding the solder mass to provide the necessary solder for a soldered joint, without weakening the lead. Instead of retaining the solder mass by means of a finger struck from the elongated body of the lead (which for narrow leads might only weakly retain the solder and also weaken the lead by unduly reducing its already small cross-section), the solder mass is retained by one or more pairs of integral tabs or ears initially extending laterally from the elongated blank body, and then bent to form a solder-retaining channel in which the tabs may stake the solder.

Abstract: A multiple male pin electrical header is provided for connection to the surface of a printed circuit board. No header components need extend entirely through the board. The header comprises an integral and electrically insulating body member; and the plurality of male pin connectors extend through the body member. The pins have tail portions adapted to electrically contact pads or other surfaces of a printed circuit board. Pin head portions extend upwardly for connection with another electrical connector. The header body portion is formed to define a plurality of pin cavities, each cavity being shaped to expose only an individual male pin connector for contact by test probe. These cavities are shaped to discourage simultaneous test probe shorting contact across a plurality of connector pins.