Abstract: Methods are provided for calibrating a tool using an eddy current probe and calibration wafers that each have a measurable predetermined property and a measurement of the measurable predetermined property of a first calibration wafer is different than a measurement of the measurable predetermined property of a second calibration wafer. The methods include determining a first set of impedance measurements of the calibration wafers while each is disposed in the tool and the tool has a tool parameter that is at a first condition, collecting a second set of impedance measurements of the calibration wafers while each is disposed in the tool and the tool parameter is at a second condition, establishing a reference point, based upon a first and a second data point from the first set of impedance measurements and a first and a second data point from the second set of impedance measurements.

Abstract: Methods and apparatuses for analyzing and controlling performance parameters in planarization of microelectronic substrates. In one embodiment, a planarizing machine for mechanical or chemical-mechanical planarization includes a table, a planarizing pad on the table, a carrier assembly, and an array of force sensors embedded in at least one of the planarizing pad, a sub-pad under the planarizing pad, or the table. The force sensor array can include shear and/or normal force sensors, and can be configured in a grid pattern, concentric pattern, radial pattern, or a combination thereof.

Abstract: Planarizing workpieces, e.g., microelectronic workpieces, can employ a process indicator that is adapted to change an optical property in response to a planarizing condition. This process indicator may, for example, change color in response to reaching a particular temperature or in response to a particular shear force. In this example, the change in color of the process indicator may be correlated with an ongoing operating condition of the planarizing machine, such as excessive downforce, or correlated with an endpoint of the planarizing operation. Incorporating the process indicator in the planarizing medium, as proposed for select applications, can enable relatively simple, real-time collection of information that can be used to control a planarizing operation.

Abstract: Monitoring the process of planarizing a workpiece, e.g., conditioning a CMP pad, can present some difficulties. Aspects of this invention provide methods and systems for monitoring and/or controlling such a planarization cycle. For example, a control system may monitor the proximity of a workpiece holder and an abrasion member by measuring the capacitance between a first sensor associated with the workpiece holder and a second sensor associated with the abrasion member. This exemplary control system may adjust a process parameter of the planarization cycle in response to a change in the measured capacitance. This can be useful in endpointing the planarization cycle, for example. In certain applications, the control system may define a pad profile based on multiple capacitance measurements and use the pad profile to achieve better planarity of the planarized surface.

Abstract: A system for selectively sensing and removing asperities from hard disk drive disk is disclosed. The system includes a test stand supporting the disk, the test stand having at least one suspension for flying over a surface of the disk. The system also includes a glide pad coupled to the at least one suspension for flying over the surface and locating asperities. A PZT sensor is coupled to the glide pad for sensing and mapping asperities on the surface of the disk. A burnish pad is coupled to the at least one suspension for wearing-away sensed and mapped asperities on the surface of the disk and a thermal fly height controller is coupled to the burnish pad for protruding the burnish pad when it is proximate to one of the mapped asperities for facilitating the wearing-away of the mapped asperity.

Abstract: A chemical mechanical polishing apparatus and method can use an eddy current monitoring system and an optical monitoring system. Signals from the monitoring systems can be combined on an output line and extracted by a computer. The eddy current monitoring system or the optical monitoring system can be used to determine the substrate edge. A focusing optic can be used to improve the accuracy of the optical monitoring system in detecting the edge of the substrate.

Abstract: A method for selectively sensing and removing asperities from the surface of hard disk drive media is disclosed. A thermally controlled flying height burnish slider is flown on a test stand with its thermal flying height control deactivated. The burnish slider flies at a nominal flying height over the surface of the media to remove any existing loose particles from the surface. A glide slider coupled to a PZT sensor is then flown over the surface of the media, the PZT sensor head mapping locations of any asperities on the surface of the media. The thermal flying height controlled burnish slider is next flown over the surface of the media with the thermal flying height control activated. The thermal flying height control is actuated when a mapped location of an asperity on the surface is proximate to the burnish slider, causing the burnish slider to protrude, wearing off the asperity.

Abstract: A system and method for in situ measurement and maintenance of preferred pad smoothness in a CMP process is disclosed. The system includes a linear polisher having one or more sensors for detecting fluid pressure, fluid flow or motor current at the linear polisher during a polishing process. A controller receiving the information provided by the sensors includes an algorithm for adjusting the pad conditioning process to achieve a desired pad smoothness based on the sensor data. The method includes obtaining baseline data on preferred linear polisher characteristics associated with desired pad smoothness and using the baseline data to adjust a pad conditioning regimen on a linear polisher to achieve the desired pad smoothness in situ.

Abstract: The object of the present invention is to provide a double side polisher capable of maintaining thickness control accuracy over a long period of time without being affected by a gradual change in thickness of a polishing pad, and a thickness control method. The first polishing operation is finished based on the polishing duration time, and the second and subsequent polishing operations are finished based on the measured distance values of a distance sensor, and after each polishing operation including the first polishing, the measured value of the distance sensor is calibrated based on the measured value and target value of finishing thickness of the work piece. Since the calibration is performed for each polishing operation, it is possible to maintain thickness control accuracy over a long period of time.

Abstract: Barrel polishing is effected while causing a mass (M) consisting of work and media (polishing material) to rotation-flow by rotating a rotary disk installed in the bottom of a polishing tank by a drive motor. A load on the drive motor for the rotary disk is preset as by a load current value, and the flow of the mass (M) in the polishing tank is controlled, thereby effecting polishing while maintaining the load on the drive motor within the preset range.

Abstract: The object of the present invention is to provide a thickness control method for a double side polisher, accuracy of which is not affected by wearing of polishing pad and applicable to polishing of nonconductive work pieces. An eddy current sensor in a cavity of an upper polishing plate measures distance from the senor to the upper surface of carrier with holes for the work pieces being inserted respectively. The measured distance is successively monitored and polishing is stopped when the distance has become a predetermined value corresponding to target amount of material removal from the work piece.

Abstract: An automatic razor blade sharpener simultaneously sharpens and sanitizes multiple edges of a spring-loaded disposable razor blade cartridge without edge overheating by lubricated gentle contact of the blade edges with a moving rubber or polymeric compliant belt that is motor driven. The disposable razor blade handle is set in a cradle aperture, which is spring loaded against the moving belt. A sanitizing and lubricating liquid is dispersed from a container between the razor blade edges and the moving belt forms a thin liquid layer on the belt surface. The liquid layer is illuminated by transversely located light illuminator and the reflected light is received by a transversely located sensor. Deep grooves in the blade cutting edge reduce this reflection, indicating an overly worn blade. The absence of reflection actuates an LED, informing the user that the thin liquid film has evaporated or spilled out, or that the container lacks a sufficient quantity of sanitizing and lubricating liquid.

Abstract: The invention relates to a machine (1) for grinding the blades of a turbine rotor (2) or a compressor. The inventive machine consists of a rotary head (6) which is provided with two different grinding wheels (7, 7?) for grinding the rotors (2), three carriages (8, 9, 10) of the head which are used for the linear and angular movement thereof, a machine control unit (16) comprising a numerical control (CNC) which is used to calculate the grinding position of each grinding wheel, an optical sensor (19) which is used to measure the radius R of the blades and a device (12, 13) for the individual shaping of each grinding wheel which is supported on a carriage (14, 15) with means for the linear movement thereof (U, C) and which operates automatically during the grinding process without altering the position of the grinding wheel.

Abstract: The invention relates to a method for machining a workpiece surface, wherein an area to be machined of the workpiece surface is machined under the influence of a polishing operation and wherein, during the machining, the displacement of the area to be machined relative to a reference area rigidly coupled to the workpiece surface is monitored by means of interferometry. The invention further relates to a machining apparatus, comprising a polishing tool and a measuring tool, while the measuring tool comprises an interferometer. Preferably, the polishing tool comprises a fluid jet polishing device.

Abstract: A CMP apparatus and process sequence. The CMP apparatus includes multiple polishing pads or belts and an in-line metrology tool which is interposed between adjacent polishing pads or belts in the apparatus. A material layer on each of multiple wafers is successively polished on the polishing pads or belts. The metrology tool is used to measure the thickness of a material layer being polished on each of successive wafers in a lot prior to the final polishing step, in order to precisely polish the layer to a desired target thickness at the final polishing step. This renders unnecessary an additional process cycle to polish the layer on each wafer to the desired target thickness. The metrology tool may be modularized as a unit with the polishing pads or belts.

Abstract: A method and apparatus are used for truing grindstones. Grinding wheels are arranged in a manner such that the respective grindstone surfaces are disposed apart from each other to define a space therebeween and respective ones of the grindstone surfaces are positioned in respective planes with the planes extending parallel to each other. Each grinding wheel is composed of a conductive grindstone having abrasive grains bound by a conductive binding material. An electrode discharge is applied from an electro-discharge truing electrode disposed in the space between the grindstone surfaces in a non-contacting relationship with the grindstone surfaces. The electrode discharge occurs in respective gaps formed between the electro-discharge truing electrode and the grindstone surfaces. The electro-discharge electrode is moved relative to the grindstone surfaces while applying the electrode discharge so that the grindstone surfaces are trued thereby.

Abstract: In a grinding machine, a generally cylindrical workpiece having at least first and second grinding areas is ground by use of a grinding wheel supported by a wheel head. The first grinding area is first ground such that power consumed by the grinding machine is maintained at a first level. After completion of grinding for the first grinding area, the grinding wheel is indexed to the second grinding area by moving the wheel head such that the power consumed by the grinding machine is maintained at a second level higher than the first level. After completion of the indexing operation, the second grinding area is ground in the same manner as the first grinding area.

Abstract: The present invention relates to a modified radial motion method for modifying lengthwise curvature of face-milling spiral bevel and hypoid gears, which is capable of modifying a locus of a cutter center into a curve, without changing a head cutter's geometry, by providing modified radial motion of the head cutter cooperating with rotation of a cradle. The modified radial motion method in accordance with the present invention completely solves the contradictions caused by the existing lengthwise curvature modification methods, which is able to increase the adjustability of the gear set without reducing the tooth contact.

Abstract: A chemical mechanical polishing apparatus and method can use an in-situ monitoring system. A measurement of a position of a carrier head and a sinusoidal first function can be used to define a second function that associates measurements from the series with positions on the substrate. For each measurement in a series from the in-situ monitoring system, the second function can be used to determine a position on the substrate where the measurement was taken. In addition, a measurement of the position of the carrier head, a time when the measurement of the substrate property is made, and a phase correction representing lag resulting from a processing delay in generating the measurement of the position of the carrier head can be used in determining a position on the substrate where a measurement of a substrate property was taken.

Abstract: A tool for gripping ophthalmic lenses including a vacuum gripper, a shaft associated with said vacuum gripper, the shaft having two ends and being slidably attached at one end thereof to a support structure, a resilient member which biases the vacuum gripper in a direction away from said support structure and a locking member which locks the shaft in a desired position during a lens gripping operation. Another embodiment of the present invention includes a lens hold down mechanism for holding lenses in a lens tray. Another embodiment of the present invention includes an electronic communications scheme for a robotic manufacturing operation. Another embodiment of the present invention includes an ophthalmic lens manufacturing cell layout wherein ophthalmic edging machines have an opening that faces away from a robotic arm. Another embodiment of the present invention includes an arrangement for holding an ophthalmic edging machine within an ophthalmic manufacturing cell.

Abstract: This disclosure provides methods and apparatus for predictably changing the thickness of a microfeature workpiece. One implementation provides a planarizing method in which a first workpiece is planarized in first and second planarizing processes and a total change in thickness is determined. This thickness change is modified by a thickness offset associated with the second planarizing process and a material removal rate is calculated from this modified thickness change and the time on the first planarizer. A thickness of a second microfeature workpiece is measured and a target thickness of material to be removed is determined. A target planarizing time is then determined as a function of the target thickness reduction and the material removal rate.

Abstract: A machine part with a conical effective surface, which is machined by means of a device comprising a machine bed, a longitudinally movable grinding bench, and a workpiece spindle head that clamps the machine part by means of clamping jaws via a chuck. The conical effective surface of the machine part is ground by means of a first grinding disk in a vertical grinding mode by longitudinally moving the grinding bench in the direction of the longitudinal axis. The associated grinding spindle head is provided with a first grinding spindle for the first grinding disk and a second grinding spindle for a second grinding disk that is fixed to a grinding arbor. The grinding spindle head is fixed to a grinding spindle carriage so as to be pivotable around a vertical shaft, the grinding spindle carriage being movable in the direction of the x-axis via a displacement motor.

Abstract: Both a grinder system and a corresponding grinding method are based on a module, embodied preferably as a program or program segment, which, preferably automatically, defines the geometry of the corner cutting edge and the corner cutting face of a metal-cutting tool on the basis of predetermined peripheral conditions. The axial rake angle of the face-end cutting edge and the axial rake angle of the circumferential cutting edge as well as a desired effective profile can serve as the predetermined peripheral conditions. Further peripheral conditions may be a smooth transition of the cutting faces between the face-end chip cutting face, corner cutting face and circumferential cutting face. Tools are obtained that have a long service life and with which at the same time good machining quality can be achieved.

Abstract: A system, method, and computer program product for chemical mechanical polishing a substrate in which initially a plurality of predetermined pressures are applied to a plurality of regions of the substrate. A plurality of portions of the substrate are monitored during polishing with an in-situ monitoring system. If the difference in thickness between two portions of the substrate exceeds a predetermined threshold, a plurality of adjusted pressures are calculated in a closed-loop control system, and the plurality of adjusted pressures are applied to the plurality of regions of the substrate. The predetermined threshold includes an initial threshold for the start of the polishing process and a second threshold for a period of polishing after the start of the polishing process.

Abstract: Systems and methods for monitoring characteristics of a polishing pad used in polishing a micro-device workpiece are disclosed herein. In one embodiment, a method for monitoring a characteristic of a polishing pad includes applying ultrasonic energy to the polishing pad and determining a status of the characteristic based on a measurement of the ultrasonic energy applied to the polishing pad. In one aspect of this embodiment, applying ultrasonic energy includes applying ultrasonic energy from a transducer. The transducer can be carried by a conditioner, a fluid arm, a micro-device workpiece carrier, or a table. In another aspect of this embodiment, determining the status of the characteristic includes determining a thickness, density, surface contour, roughness, or texture of the polishing pad.

Abstract: A rotation axis of a work spindle and a rotation axis of a spindle primary-axis portion are rotated relative to each other and feeding of a work-piece to a tool is accordingly adjusted, whereby warpage of the tool in accordance with a change in machining condition is corrected. A revolution volume of the relative rotation is compared and calculated in process based on data entered in advance, a result of measurement by a displacement sensor and information such as a machining position, and controlled in real time until the end of machining. The relative rotation is driven by an actuator such as a piezoelectric element, at a resolution even as fine as in seconds. The data entered in advance can be sequentially updated in accordance with monitoring of a processed product.

Abstract: A cutting tool with a sensor according to the present invention includes an electrically conductive substrate, an insulation film provided on a surface of the electrically conductive substrate, and a sensor circuit of an electrically conductive film provided on the insulation film. The insulation film includes two consecutive insulation layers. Even if the plural insulation layers each have defects such as cracks and pinholes which possibly impair the insulation property impair the insulation film, the defects present in the plural layers are unlikely to be continuous. Therefore, the insulation film has an improved insulation reliability, thereby ensuring proper function of the sensor circuit in the cutting tool.

Abstract: A chopping control process, for controlling a machine tool during chopping, i.e., shaping or cutting a workpiece, is allowed without adding an extra axis dedicated just to the chopping, i.e., a chopping dedicated axis. To correct a chopping operation (i.e., an operation of shaping or cutting a workpiece), for a movement error in the contour control (i.e., control of contour along which the workpiece is cut) with a positioning axis or rotation axis, an interpolation processing part 12 and an axis control processing part 13 are provided with a function of generating the movement data for performing the chopping operation by controlling two or more axes at the same time and a function of correcting the chopping operation.

Abstract: Systems and methods for monitoring characteristics of a polishing pad used in polishing a micro-device workpiece are disclosed herein. In one embodiment, a method for monitoring a characteristic of a polishing pad includes applying ultrasonic energy to the polishing pad and determining a status of the characteristic based on a measurement of the ultrasonic energy applied to the polishing pad. In one aspect of this embodiment, applying ultrasonic energy includes applying ultrasonic energy from a transducer. The transducer can be carried by a conditioner, a fluid arm, a micro-device workpiece carrier, or a table. In another aspect of this embodiment, determining the status of the characteristic includes determining a thickness, density, surface contour, roughness, or texture of the polishing pad.

Abstract: A lapping machine comprises a lapping surface plate (1) rotated by a rotating mechanism, a lapping jig (28) having a plurality of projections to bottom surfaces of which a work (30) to be lapped by a lapping surface on the lapping surface plate (1) is fitted, amount-of-projection adjusting elements (29) for adjusting the variation of the plurality of projections (28c) to the lapping surface plate (1) individually, and a control circuit (36) for outputting variation-of-projection control signals to the variation-of-projection adjusting elements (29).

Abstract: Monitoring the process of planarizing a workpiece, e.g., conditioning a CMP pad, can present some difficulties. Aspects of this invention provide methods and systems for monitoring and/or controlling such a planarization cycle. For example, a control system may monitor the proximity of a workpiece holder and an abrasion member by measuring the capacitance between a first sensor associated with the workpiece holder and a second sensor associated with the abrasion member. This exemplary control system may adjust a process parameter of the planarization cycle in response to a change in the measured capacitance. This can be useful in endpointing the planarization cycle, for example. In certain applications, the control system may define a pad profile based on multiple capacitance measurements and use the pad profile to achieve better planarity of the planarized surface.

Abstract: A method and apparatus of in situ monitoring and dispersing unwanted particles in slurry used during CMP polishing. The method includes providing a slurry path, applying to the slurry path a microcavitation field of a first level to detect particles of a predetermined size, applying to the slurry path a microcavitation field of a second level that is capable of dispersing said particles, and after the second applying step, feeding the slurry to a CMP polishing unit. Particle size may be detected and/or the microcavitation field strength may be set according to particle size. In addition, field strength may be calibrated according to levels determined by polystyrene control particles of a known size and/or concentration. A single or dual transducer may apply the microcavitation.

Abstract: A grinding method for a vertical type of double disk surface grinding machine comprising a pair of rotating grinding wheels vertically opposed to each other and vertically movable and a moving table for moving a work having a work holding jig, wherein vertical positions of the upper and the lower surfaces of the work to be ground prior to the grinding operation are measured by means of a pre-grinding dimension measuring instrument disposed in a vicinity of the work attaching/detaching position and the standby positions of the grinding wheels are set based on the measured values in a step, the work is moved to the grinding position and the grinding wheels are moved at a high feeding speed from the set standby positions to grinding start positions in contact with the work or positions immediately before making the contact in a subsequent step, and the work is ground at a grinding speed lower than the feeding speed in a further subsequent step.

Abstract: A one-time feedback CMP process control method which contributes to uniformity in the quantity of material removed from wafers in a lot during semiconductor processing and is suitable for complex processes such as STI (shallow trench isolation) fabrication procedures, is disclosed. The method includes providing a plurality of wafers having a set of pilot wafers and a set of remaining wafers, polishing each of the pilot wafers according to an original process time, determining a compensation time for the pilot wafers, determining an update time by adding the compensation time to the original process time and polishing the set of remaining wafers according to the update time.

Abstract: Provided is a grinding machine comprising a carrier adapted to raise or lower, the carrier including a V-shaped groove across its top and a forward pad at either side, a spindle unit including an inverted L-shaped mounting plate, and a fine tilting adjustment mechanism comprising first, second, third, and fourth screw type fastening units for fastening horizontal and vertical portion of the mounting plate at the carrier. Each screw of the fastening units is spaced from the carrier by a peripheral gap. The gaps are adapted to allow the horizontal or vertical portion of the mounting plate and thus the spindle unit to either tilt to the left or right or tilt to the front or rear with respect to the carrier in response to unfastening the screws and loosening adjustment screws of the fastening units.

Abstract: A computer controlled grinding machine grinds a cylindrical region and an annular shoulder of a rotatable workpiece. Relative movement is effected between the workpiece and a grinding wheel along a line of action which subtends an angle of approach of less than 90 degrees to the Z axis of rotation of the workpiece. Such an angle of approach enables the wheel to grind the annular shoulder of the workpiece simultaneously with grinding the cylindrical portion.

Abstract: A ferrule polishing control machine has a ferrule type input part for selecting one type of ferrule from various ferrule types stored in a computer. A ferrule end face shape input part selects one type of ferrule end face shape from various types of ferrule end face shapes stored in the computer. A connector type input part selects one type of connector from various connector types stored in the computer. A ferrule polishing number input part selects from ferrule polishing numbers stored in the computer a number of ferrules to be mounted on a polishing jig for a polishing operation. A transmitting part selects polishing pressure information stored in the computer in accordance with polishing information inputted from the ferrule type input part, the ferrule end face shape input part, the connector type input part, and the ferrule polishing number input part, and transmits the polishing pressure information to a ferrule polishing machine.

Abstract: The present invention discloses a method, system and apparatus for use in a roll grinding machine. Data is read from an RFID tag automatically by providing an RF read/write sensor on a movable cylinder rod. The RF sensor is held away from the work roll area while the work roll is loaded or removed. When the work roll is placed in the position for grinding, a signal to rotate the roll is sent to the grinding machine, and also operates to advance the cylinder rod. An RFID tag embedded in the work roll and containing identification and other data related to the work roll, is read by a read/write sensor, and the data is then transferred from the sensor to a serial control interface, which converts the data and transmits the information to the grinding machine control desk and the computer control management data base.

Abstract: There is provided a chemical mechanical polishing apparatus, which may include a polishing table rotated by a polishing table motor and having a pad thereon, a carrier head located above the polishing table to be rotatable by the driving of a carrier head motor and having a wafer located under the bottom thereof, a slurry supplier for supplying a slurry to the upper portion of the polishing table, a first polishing end point detector for detecting a polishing end point through the temperature change of the temperature sensor, at least one temperature sensor for detecting the temperature of a polishing region (the wafer, the pad, and the slurry), and a second polishing end point detector for detecting a polishing end point from the changes of load current, voltage, and resistance of the carrier head motor.

Abstract: A pad conditioning system for conditioning a polishing pad in conjunction with polishing of a workpiece includes a pad conditioning head coupled with a positioning unit. The pad conditioning head includes a conditioning surface that is configured to be moved into contact with a polishing pad to condition the polishing pad. The pad conditioning system also includes a polishing liquid supply port disposed in the conditioning surface. The polishing liquid supply port is configured to selectively discharge polishing liquid during the conditioning operation. The discharged polishing liquid is worked into the polishing pad by the pad conditioning head during the conditioning operation. A workpiece, such as a semiconductor wafer, that is also moved into contact with the polishing pad is polished using the discharged polishing liquid.

Abstract: An automatic processing unit comprising a conveyor (1) extending through the automated processing unit and having a longitudinal direction and a transversal direction; and at least one working station located above the conveyor (1) for processing a workpiece (2). The working station is configured such that it can be displaced in an oblique angle in relation to both the longitudinal direction and the transversal direction of the conveyor (1).

Abstract: A saw cutting pattern is dynamically established for a semiconductor dicing saw based on detection of the saw blade contacting a wafer or a portion of a wafer. The dynamic cutting pattern may terminate cuts if the saw blade no longer contacts the wafer or a portion of a wafer. Thus, irregular shaped wafers may be cut without requiring that an entire predefined cutting pattern be carried out and/or without previously mapping the shape of the wafer or portion of a wafer. A map of the wafer or a portion of a wafer may also be generated based on the detection of the saw blade contacting the wafer during a first cutting pass and may be used during a second cutting pass.

Abstract: The substrate polishing apparatus for polishing a polishing surface of a substrate comprises a film thickness monitoring device for monitoring a state of a film thickness of a thin film on the polishing surface of the substrate during polishing. The apparatus includes a table, a polishing member fixed on a surface of the table, a substrate support member for pressing the substrate onto the polishing member, an optical system composed of an optical fiber for irradiating the polishing surface of the substrate with a light of irradiation and an optical fiber for receiving a reflected light reflected on the polishing surface of the substrate, an analysis-processing system for processing an analysis of the reflected light received with the optical system, and the film-thickness monitoring device. The table is provided with a liquid-feeding opening for feeding a translucent liquid into a through-hole disposed in the polishing member.

Abstract: A reliable, inexpensive “back side” thinning process and apparatus therefor, capable of globally thinning an integrated circuit die to a target thickness of 10 microns, and maintaining a yield of at least 80%, for chip repair and/or failure analysis of the packaged die. The flip-chip packaged die is exposed at its backside and mounted on a lapping machine with the backside exposed. The thickness of the die is measured at at least five locations on the die. The lapping machine grinds the exposed surface of the die to a thickness somewhat greater than the target thickness. The exposed surface of the die is polished. The thickness of the die is again measured optically with high accuracy. Based on the thickness data collected, appropriate machine operating parameters for further grinding and polishing of the exposed surface are determined. Further grinding and polishing are performed. These steps are repeated until the target thickness is reached.

Abstract: A method of predicting the lapping property of a charged lapping plate uses samples with a known lap surface. The samples are lapped on the plate and a non-invasive sensor is used to determine the lapping rate under a fixed load and rotation speed. The total frictional force of the samples is measured during the lapping to calculate the friction and Preston coefficients of the plate. The samples are held in place while the plate rotates and the sensor measures the distance to the plate. The plate rotates for a specific time so that adequate removal of the pad material has occurred. The lapping rate is determined from a change in the gap distance over a time interval. The lapping rate and friction are then assessed to determine if the plate is lapping worthy.

Abstract: A magnetoresistive read head has read head layers that are shaped to form an air bearing surface and a sensor stripe cavity with an open side at the air bearing surface. A sensor stripe is deposited in the sensor stripe cavity. The sensor stripe has a front surface that is set back from the air bearing surface to define an encapsulation cavity extending from the front surface to the air bearing surface. An encapsulation layer is deposited in the encapsulation cavity. The encapsulation layer encapsulates the front surface.

Abstract: The present invention relates to a polishing apparatus for polishing a workpiece such as a semiconductor wafer. The polishing apparatus has a processing section including a polishing section (1) for polishing a semiconductor wafer (6) and a cleaning section (10) for cleaning a polished semiconductor wafer, a receiving section (40) for supplying a semiconductor wafer (6) to be polished to the processing section and receiving a polished semiconductor wafer (6), and a cleaning chamber (20) disposed between the processing section and the receiving section and defined by partitions (102, 103) with shutters (22, 24) which separate the processing section and the receiving section from each other.

Abstract: A method and system for dicing a semiconductor wafer providing a structure with greatly reduced backside chipping and cracking, as well as increased die strength. Semiconductor chip structures obtained from wafers diced according to this invention are also encompassed.

Abstract: A material removal optimizing system for a wood surface treating apparatus with a plurality of individual work stations arranged serially along an endless conveyor. Each station includes a working abrasive head along with an elevation adjustment mechanism for adjustably positioning the contact surface of each abrasive head at a desired working distance from the opposed surface of the workpiece traveling along the endless conveyor. An incoming workpiece dimension indicator is positioned at the infeed end, and additional workpiece dimension indicators are positioned downstream from each work station, with each dimension indicator being positioned to measure the dimensional deviation of the workpiece from a datum plane after it has passed through its preceding individual work station.

Abstract: A lens processing system (1) includes a lens stocking device (400a; 400b) capable of stocking a plurality of lenses (LE); and a lens grinding device (100a; 100b); and a lens conveying device (200) which conveys one of the plurality of lenses between the lens stocking device and the lens grinding device.