Abstract: Systems and methods are presented herein for lubricating a differential assembly using a double baffle assembly. The differential assembly comprises a lubrication jet, an output gear, and the double baffle assembly. The output gear comprises openings and the lubrication jet is aligned with the openings in the output gear. The double baffle assembly comprises an inner baffle and an outer baffle that collectively form a slot aligned with the openings in the output gear. The inner baffle is configured to guide lubrication expelled from the lubrication jet towards the openings in the output gear, regardless of whether the differential assembly is in an engaged state or disengaged state.

Abstract: A multi-functional wheel deburring device is capable of removing burrs at the center hole, the flange weight reducing socket, the spoke back cavity weight reducing socket and the spoke edge of the wheel during the use.

Abstract: A method for polishing lens surfaces, in which a) prior to the polishing process, for the purpose of determining an abrasion profile, at least one point of a workpiece is polished by means of a polishing tool to be used, using at least one pre-defined parameter; b) the polishing abrasion thus achieved on the workpiece side is determined by measuring; c) on the basis of the abrasion profile, at least one parameter is set for a subsequent polishing process, and the polishing process is completed at least partially. A method for polishing lens surfaces, in which the polishing point is places at least outside of the workpiece center at a distance a from a plane which is tensioned by the tool spindle axis and the workpiece spindle axis.

Abstract: A chemical-mechanical polishing apparatus including a table top, a transfer station mounted on the table top, a plurality of polishing stations mounted on the table top, a plurality of washing stations, and a plurality of carrier heads supported by a support member rotatable about an axis. Each washing station is located between a first polishing station and either a second polishing station or the transfer station, and the transfer station and the plurality of polishing stations are arranged at approximately equal angular intervals about the axis.

Abstract: A chemical-mechanical polishing apparatus including a table top, a transfer station mounted on the table top, a plurality of polishing stations mounted on the table top, a plurality of washing stations, and a plurality of carrier heads supported by a support member rotatable about an axis. Each washing station is located between a first polishing station and either a second polishing station or the transfer station, and the transfer station and the plurality of polishing stations are arranged at approximately equal angular intervals about the axis.

Abstract: An apparatus and associated methods for polishing semiconductor wafers and other workpieces that includes polishing surfaces located at multiple polishing stations. Multiple wafer heads, preferably at least one greater in number than the number of polishing stations, can be loaded with individual wafers. The wafer heads are suspended from a rotatable support, which provides circumferential positioning of the heads relative to the polishing surfaces, and the wafer heads move linearly with respect to the polishing surface, thus providing relative linear motion between the wafer and the polishing station. A load/unload station may be located at a position symmetric with the polishing surfaces. The rotatable support can simultaneously position one of the heads over the load/unload station while the remaining heads are located over polishing stations for wafer polishing so that loading and unloading of wafers can be performed concurrently with wafer polishing.

Abstract: A method of positioning a grooved grinding wheel relative to a disc-like circular workpiece for edge grinding the workpiece using the groove in the wheel includes the steps of mounting the workpiece for rotation about a first axis, mounting the grinding wheel for rotation about a second parallel axis, effecting relative movement between the workpiece and the wheel to engage the rim of the wheel within the groove and performing a preliminary grind. The position of the wheel is axially adjusted in accordance with the measurements made on the profile of the rim produced by the preliminary grind, and the rim is ground again with a second preliminary grind with the grinding wheel located at the axially shifted position. The steps of grinding and measuring the periphery of the workpiece are repeated until the rim profile possesses the desired accuracy. The final position of the grooved grinding wheel is then utilized for grinding future wafers.

Abstract: It comprises a plurality of carrying units mounted on a turntable, with each of the carrying units securing a wheel rim or the like to be polished, and a plurality of polishing units, each one of which includes a polishing element that carries out a polishing operation on the wheel rim, in such a way that for each position of the turntable each one of the carrying units is situated facing a polishing unit. It is characterized in that the central shaft of each carrying unit is inclined with respect to the horizontal by a predetermined angle. It permits to polish a wheel rim or the like completely, and it is not necessary to polish manually the parts of the wheel rim which it is more difficult to reach.

Abstract: A semi-conductor wafer (12) has its inclined edge flanks polished by a grooved wheel (16) of synthetic plastics material, while a jet (20) of polishing slurry, which may comprise colloidal silica, is fed downwards into the zone of contact between the wheel and the wafer. The wheel (16) is preferably rocked or oscillated laterally such that a constant polishing force is alternatively applied to each flank of the wafer (12). The wheel may be mounted in a buffer store to which the wafers are transported from a grinding station which grinds the edge flanks.

Abstract: A shotpeening machine for helical compression springs. It comprises a spring-peening chamber accommodating shot-impelling rotors, mechanisms for accommodating and tensioning the springs, and mechanisms for loading the springs into and unloading them from the accommodating and tensioning mechanisms. The accommodating and tensioning mechanisms comprise one or two spring holders (5) that travel back and forth horizontally into the peening chamber (3) and in that the loading and unloading mechanisms are prismatic belts (6) that parallel the chamber.

Abstract: A grinding machine comprises a table movably disposed on a fixed base to undergo reciprocal movement relative to the fixed base along a reciprocating axis. A first shaft is rotatably disposed on the table to undergo rotation relative to the table about a first axis extending perpendicular to the reciprocating axis. A workpiece holder is connected to the first shaft for rotation therewith. A workpiece having a work surface is connected to the workpiece holder for rotation therewith. A second shaft is rotatably supported for rotation about a second axis extending at an inclination angle to the first axis, and is supported for reciprocal movement towards and away from the workpiece along the second axis. A grinder having a grinding surface is connected to the second shaft for rotation therewith and for reciprocal movement of the grinding surface towards and away from the work surface of the workpiece.