Abstract: Provided is a method for manufacturing a sintered component having a hole formed therein, in which a sintered component having no defect, such as cracks, can be manufactured with good productivity and also a reduction in tool life accompanied by forming the hole can be suppressed. The method for manufacturing a sintered component includes a molding step of press-molding a raw material powder containing a metal powder and thus fabricating a green body; a drilling step of forming a hole in the green body using a candle-type drill and thus forming a thin-walled portion, of which a thickness Gt as measured between an inner circumferential surface of the hole and an outer surface of the green body is smaller than a diameter Gd of the hole; and a sintering step of sintering the green body after the drilling step.

Abstract: Provided is a method for manufacturing a sintered component having a hole formed therein, in which a sintered component having no defect, such as cracks, can be manufactured with good productivity and also a reduction in tool life accompanied by forming the hole can be suppressed. The method for manufacturing a sintered component includes a molding step of press-molding a raw material powder containing a metal powder and thus fabricating a green body; a drilling step of forming a hole in the green body using a candle-type drill and thus forming a thin-walled portion, of which a thickness Gt as measured between an inner circumferential surface of the hole and an outer surface of the green body is smaller than a diameter Gd of the hole; and a sintering step of sintering the green body after the drilling step.

Abstract: A method of controlling a chemical mechanical polishing (CMP) process, a temperature control, and a CMP apparatus, the method including measuring actual temperatures of at least two regions in a platen in real time during the CMP process in which a polishing pad attached to the platen polishes a substrate held by a polishing head using slurry and deionized water; receiving the measured actual temperatures of the regions; and individually controlling the actual temperatures of the regions in real time during the CMP process to provide the regions with a predetermined set CMP process temperature.

Abstract: The present invention provides an aluminum wheel burr removing machine which includes a roller bed device (1), a positioning and rotating device (2) and a knife box device (3). A wheel (4) is conveyed to a specified position by the roller bed device (1), the positioning and rotating mechanism (2) clamps and rotates the wheel (4), the knife box device (3) horizontally feeds to cut burrs of the wheel (4), the roller bed device (1) conveys the wheel to next station, meanwhile, next wheel enters the roller bed device (1), and next cutting cycle is carried out. The machining time of the present invention is 25-30 seconds, so that the manpower cost is reduced, the machining efficiency is improved, and positive effects are achieved in hub burr removal.

Abstract: With the center position CP of a support shaft 6 supporting a grinding wheel 4 being a reference, a provisional grinding start position S0? for a first workpiece 2 is calculated, based on a diameter ID of the first workpiece 2 before grinding, a diameter WD of the grinding wheel, a grinding completion position S4 on the first workpiece after the grinding, and an actual grinding start position S0 of the grinding wheel before grinding in second and subsequent grinding. S0 is determined by performing the grinding by moving the grinding wheel from S0? and by moving the grinding wheel away from the first workpiece by a distance corresponding to S4 near the grinding completion position S4. S0? is set by a calculation, S0?=ID?WD?S4?S?, considering an allowance S? between S0 and S0?.

Abstract: The invention relates to a device (10) for machining work pieces, particularly for sharpening tools with cutters for cutting-machining, such as for example drills, milling tools or the like, the device (10) comprising a monolithic machine block (12) with at least two functional surfaces (14, 16) disposed at an angle with respect to each other, a work piece support arrangement (18) for clamping-in a work piece (38) to be machined, a machining unit (20), on which at least one tool (66, 68, 70) can be attached to machine the work piece (38), and a support (22), on which the machining unit (20) can be displaceably attached, wherein on a first functional surface (14) of the two functional surfaces (14, 16) of the machine block (12) the machine block (12) has at least one first linear guide (24, 26) for guiding a work piece support arrangement (18) along at least one first guide axis (X1), and on the second functional surface (16) of the two functional surfaces (14, 16) of the machine block (12) the machine block h

Abstract: A control unit that relatively moves a headstock and tailstock and a tool to thereby machine a peripheral surface of a workpiece in a radial direction executes control such that a relative feed speed of the tool in the radial direction in a transitional state where an amount of warpage of the workpiece in the radial direction at a machining position increases is faster than a relative feed speed of the tool in the radial direction in a steady state where an amount of warpage of the workpiece in the radial direction at the machining position is constant. By so doing, it is possible to reduce a machining time at the time of the start of machining.

Abstract: The invention relates to a device (10) for machining, in particular eroding and grinding, rotational workpieces (44) provided with cutting edges, with a machine base (12), a machining mechanism (14), which can be displaced relative to the machine base (12), and a workpiece positioning mechanism (18), which can be displaced relative to the machine base (12), wherein the machining mechanism (14) has at least one machining tool (30), which is attached in a rotatably drivable manner to a slide arrangement (20), which can be displaced in relation to the machine base (12), for machining a functional portion to be machined of the rotational workpiece (44), and wherein the workpiece positioning mechanism (18) has a workpiece holding mechanism (46), which can be displaced relative to the machine base (12) and holds a holding portion of the rotational workpiece (44) directly or via a holding adapter for attaching the rotational workpiece (44) to the workpiece positioning mechanism (18).

Abstract: An apparatus (1) for removing a film layer on a glass plate includes: a movable base (5) which is movable in an X direction and a Y direction along a glass-plate placing surface (3); a moving means (6) for moving the movable base (5) in the X direction and the Y direction along the glass-plate placing surface (3); a movable base (7) provided on the movable base (5) in such a manner to be movable in a Z direction so as to be capable of moving toward or away from the glass-plate placing surface (3); a moving means (8) for moving the movable base (7) in the Z direction so as to cause the movable base (7) to move toward or away from the glass-plate placing surface (3); a grinding wheel (9) provided on the movable base (7) in such a manner as to be capable of being lifted or lowered with respect to the movable base (7); a resiliently pressing means (15) for resiliently pressing the grinding wheel (9) against a film layer (14); and a detecting means (17) for detecting the lifted or lowered position of the grinding

Abstract: A device for sharpening chain saw teeth, in particular a chain saw which is portable and applicable in the field, and where the chain is not to be taken off the chain saw blade when sharpened enables swinging of a grinding wheel (16) transversally to each tooth (8) of a chain (7) resulting in straight cutting faces of each tooth (8). The grinding wheel (16) of the relatively small diameter is rotated by an actuator (15) of the suitably small power and high number of the revolutions resulting in high cutting speed. Said actuator (15) can be either an electric motor, supplied with electricity from electric mains or a battery, a pneumatic motor or a hydraulic motor.

Abstract: Component (3) is pressed onto a circuit board (4) so that their respective metal interconnects (5), (6) are in close contact with each other, and ultrasonic vibration is applied to the suction nozzle (14) holding the component (3). Friction is thereby generated between metal interconnects (5), (6) whereby the component (3) is bonded on circuit substrate. Suction nozzle (14) for handling components is made of stainless steel and has a working face (14a) provided with a hardened layer (14b), or alternatively, suction nozzle (14) may have a suction head (14c) having a working face (14a) made of cemented carbide. Working face (14a) of suction nozzle (14) is refined by polishing as required during the mounting operation.

Abstract: It comprises a plurality of carrying units mounted on a turntable, with each of the carrying units securing a wheel rim or the like to be polished, and a plurality of polishing units, each one of which includes a polishing element that carries out a polishing operation on the wheel rim, in such a way that for each position of the turntable each one of the carrying units is situated facing a polishing unit. It is characterized in that the central shaft of each carrying unit is inclined with respect to the horizontal by a predetermined angle. It permits to polish a wheel rim or the like completely, and it is not necessary to polish manually the parts of the wheel rim which it is more difficult to reach.

Abstract: Methods and apparatuses for planarizing a microelectronic substrate. In one embodiment, a planarizing pad for mechanical or chemical-mechanical planarization includes a base section and a plurality of embedded sections. The base section has a planarizing surface, and the base section is composed of a first material. The embedded sections are arranged in a desired pattern of voids, and each embedded section has a top surface below the planarizing surface to define a plurality of voids in the base section. The embedded sections are composed of a second material that is selectively removable from the first material. A planarizing pad in accordance with an embodiment of the invention can be made by constructing the embedded sections in the base section and then removing a portion of the embedded sections from the base section. By removing only a portion of the embedded sections, this procedure creates the plurality of voids in the base section and leaves the remaining portions of the embedded sections.

Abstract: There are disclosed a polishing method and a polishing device in which cleaning of a glass substrate surface can be achieved to a high level. A glass substrate (MD substrate 1) in the shape of a circular disc having a circular hole in a center portion is immersed in an abrasive liquid 50 containing free abrasive grains, and an inner peripheral end surface of the glass substrate is polished using the abrasive liquid containing the free abrasive grains by rotating a rotary brush 4 or a polishing pad in contact with the inner peripheral end surface.

Abstract: In a machine tool for cutting treatment of workpieces, comprising a workpiece support having two opposing side walls, a tool support having two opposing side walls and at least one approximately horizontally disposed processing unit (work spindle 8) on the tool support, wherein during operation of the machine tool, forces act between workpiece and processing unit, in particular in the Z direction, the side walls of the tool support and workpiece support, respectively, are combined to form one common side wall (3). Since tool and also workpiece are held at the two common side walls, the forces acting between tool and workpiece are accommodated by said side walls.

Abstract: The apparatus includes a frame and a holder rotatably secured to the frame for releasably holding a first workpiece of the workpieces. A mechanism is provided for rotating the holder from a loading station to a grinding station and a grinder is movably secured to the frame and selectively positionable relative to the first workpiece when the first workpiece is located at the grinding station. A control is included for selectively positioning the grinding means relative to the first workpiece for grinding the first workpiece and a further holder is rigidly secured to and spaced relative to the holder. The arrangement is such that when the holder is rotated in a direction towards the grinding station, the further holder is rotated in a direction towards the loading station for loading a second workpiece of the workpieces at the loading station so that sequential grinding and loading of the workpieces is permitted.

Abstract: A machine for cutting/grinding ophthalmic lenses has a lens spindle aligned on a vertical longitudinal axis and a tool spindle aligned on an angled axis in relation to the vertical axis. The lens blank is chucked on the upper end of the lens spindle and a tool is mounted on a lower end of the tool spindle. One motor rotates the lens spindle and the lens blank about the longitudinal axis and a second motor vertically reciprocates the lens spindle and the lens blank. A third motor rotates the tool spindle and the tool about the angled axis and a fourth motor linearly horizontally reciprocates the tool spindle and the tool. A microprocessor coordinates the rotation and reciprocation of the spindles to cause the tool to cut/grind the lens blank to a predetermined contour. The tool has a spherical grinding surface of diameter approximating but not greater than twice the radius of the steepest lens curvature to be cut/ground.

Abstract: A grinding machine for grinding an internal cylindrical surface of a workpiece in which the workpiece is moved toward a grinding wheel along the axis of revolution of the workpiece and the grinding wheel is moved transversely of the axis of revolution toward the cylindrical surface of the workpiece. The grinding wheel is mounted on a supporting structure which is mounted for pivoting about an axis which is transverse to the axis of revolution. A deflective stiffening element restrains the angular displacement of the supporting structure. The deflection of the stiffening element is proportional to the deflection of the spindle. The deflection of the stiffening element is measured by a sensor which transmits an electrical signal to a drive mechanism for angularly positioning the supporting structure in response to the signal to compensate for the deflection of the spindle. A ring-shaped workpiece is supported on the workhead by a magnetic face plate.

Abstract: An improved chemical mechanical polishing (CMP) device for chemically and mechanically planarizing the surface of a semiconductor wafer includes a flat wafer stage for loading and affixation of the semiconductor wafer so that the surface of a material to be polished, i.e. the surface of the wafer, faces up, and a cylindrical polishing pad formed above the exposed surface of the wafer to be polished which is rotatable at high speed so that the contact point of the wafer and the pad moves linearly. The stage is constructed to support a wafer by a vacuum suction through vacuum holes. The cylindrical polishing pad has a rotating axis for transmitting rotation at the center, thereof, and a double layer polishing pad having different hardness on a peripheral surface of the rotating axis.

Abstract: A finishing machine for internal spline tooth surfaces which comprises a holding device for holding a work having the internal spline tooth surfaces, a grinding stone having a plurality of tooth portions for simultaneously processing a plurality of tooth portions in the work, and a vibrating device for vibrating the grinding stone with a high speed in the axial direction of the work.

Abstract: The invention relates to an apparatus and process for machining a rotating workpiece by means of rotary ultrasonic grinding. The apparatus performs rotary ultrasonic grinding by rotating and vibrating a surface finishing tool in contact with a rotating workpiece. The rotary ultrasonic grinding process is a hybridized method which comprises a combination of conventional ultrasonic machining and diamond grinding. Important parameters in one embodiment of the process include ultrasonic vibration amplitude and frequency, static pressure or force, tool rotation speed, workpiece rotation speed, grit size, grit concentration, abrasive type, and bond type.

Abstract: An apparatus for the precision grinding of conical valve seats of nozzles, for example, injection nozzles for internal combustion engines. The body is entered hydraulically on a mandrel and a driver has a rubber O-ring braced against the nozzle body to frictionally engage it is rotation while passing through the mandrel for the shaft of a grinding tool which is located at the end of the mandrel. The system avoids radial clamping stresses on the workpiece and hence allows, precision low tolerance finish grinding to be achieved.

Abstract: The present invention relates to an apparatus for polishing semiconductor wafers and, in particular, one in which the polishing pads are linear, that is, the polishing pads have a long linear dimension relative to their width and have a uniform cross-section along this linear dimension. In addition, the wafer holder travels in a straight line parallel to the long linear dimension of the polishing pads.

Abstract: A twist drill sharpener employing a pair of rotary grinding wheels has three primary drill chuck receiving openings, one for alignment of the twist drill and cams on the twist drill chuck; a second receptacle for grinding the end of a chucked twist drill; and a third receptacle which receives the drill and chuck for grinding a split point on the sharpened twist drill.