Ultrasonic Patents (Class 451/165)
  • Patent number: 9303976
    Abstract: According to one embodiment, a substrate processing system includes a measuring unit, a data processing unit, and a processing unit. The measuring unit is configured to measure information relating to a thickness dimension of a substrate. The substrate includes a light emitting unit and a wavelength conversion unit. The wavelength conversion unit includes a phosphor. The data processing unit is configured to determine processing information relating to a thickness direction of the wavelength conversion unit based on the measured information relating to the thickness dimension of the substrate and based on information relating to a characteristic of light emitted from the light emitting unit. The processing unit is configured to perform processing of the wavelength conversion unit based on the determined processing information.
    Type: Grant
    Filed: April 26, 2012
    Date of Patent: April 5, 2016
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Masahiro Uekita, Hiroshi Koizumi, Tomomichi Naka, Naoaki Sakurai, Eijiro Koike
  • Patent number: 9168625
    Abstract: A computer numerical control machine tool for grinding two sides of a plane by shifting self-rotation ultrasonic vibration, wherein a pillar (3) is provided on the tool body (1) of the machine tool, a Y axis movement assembly (12) is provided on the platform of the tool body (1), with a lower revolving movement assembly (11), which revolves about a Z coordinate axis, being mounted on the upper surface of the Y axis movement assembly (12), and a lower grinding plate (10) being mounted coaxially above the lower revolving movement assembly (11); an ultrasonic vibration assembly (2) is mounted fixedly on the pillar (3), with a separation plate (8) for clamping a workpiece assembly (9) being provided on the ultrasonic vibration assembly (2); an X axis movement assembly (4) is mounted on the upper part of the pillar (3), a Z axis movement assembly (5) is mounted on the upright face of the X axis movement assembly (4), with an upper revolving movement assembly (6), which revolves about the Z coordinate axis, being p
    Type: Grant
    Filed: September 8, 2011
    Date of Patent: October 27, 2015
    Assignee: XI'AN UNIVERSITY OF TECHNOLOGY
    Inventors: Yumei Huang, Wen Yan, Feng Gao, Hao Jiang
  • Publication number: 20140263213
    Abstract: Systems and processes for improved laser machining, such as micro machining, of a workpiece. Systems and processes involve directing at a first surface of the workpiece a laser beam and wherein at least the laser-irradiated region of the first surface of the workpiece is immersed in a liquid, and delivering to the liquid-immersed and laser-irradiated workpiece surface region at least a first ultrasound output from a first ultrasound device. The ultrasound output and the laser beam desirably impact the workpiece first surface substantially simultaneously.
    Type: Application
    Filed: March 14, 2014
    Publication date: September 18, 2014
    Inventor: Benxin Wu
  • Patent number: 8808607
    Abstract: A thermally conductive sheet has cut surfaces with low surface roughness and hence shows reduced thermal resistance at the interfaces, and high thermal conductivity in the thickness direction. Thus, the thermally conductive sheet can be interposed between any of various heat sources and a radiation member. The process for producing the thermally conductive sheet includes at least: an extrusion molding step in which a thermally conductive composition containing a polymer, an anisotropic thermally conductive filler, and a filler is extruded with an extruder to thereby mold an extrusion-molded product in which the anisotropic thermally conductive filler has been oriented along the extrusion direction; a curing step in which the extrusion-molded product is cured to obtain a cured object; and a slicing step in which the cured object is sliced into a given thickness with an ultrasonic cutter in the direction perpendicular to the extrusion direction.
    Type: Grant
    Filed: June 17, 2011
    Date of Patent: August 19, 2014
    Assignee: Dexerials Corporation
    Inventors: Hiroyuki Usui, Keisuke Aramaki
  • Patent number: 8801496
    Abstract: Embodiments of the present invention pertain to reducing agglomeration of particles while manufacturing a lapping plate using an oil-based slurry. According to one embodiment, an oil-based slurry with particles of a known size is applied to a lapping plate. The oil-based slurry is ultrasonically mixed while applying the oil-based slurry to the lapping plate in order to reduce agglomeration of the particles.
    Type: Grant
    Filed: April 28, 2006
    Date of Patent: August 12, 2014
    Assignee: HGST Netherlands B.V.
    Inventors: Richard D. Bunch, Juan Francisco Coronado Nuno, Sergio Raul Elizalde Rojo, Ernesto Arturo Marguez Waldthausen
  • Patent number: 8782902
    Abstract: A method of making a bearing includes providing a bearing intermediate, which is unfinished while having an overall shape of a finished bearing product; and repeatedly impacting a surface of the bearing intermediate at one or more ultrasonic frequencies to modify characteristics of the bearing intermediate. The resulting bearing intermediate or finished bearing product includes nano-size grains at or underneath the surface.
    Type: Grant
    Filed: October 13, 2009
    Date of Patent: July 22, 2014
    Assignee: Designmecha Co., Ltd.
    Inventors: Young Sik Pyun, Jeong Hyeon Park, Chang Sik Kim, In Ho Cho
  • Publication number: 20140187122
    Abstract: A polishing apparatus includes: a pure water supply line configured to supply deaerated pure water into the polishing apparatus; a gas dissolving unit coupled to the pure water supply line and configured to dissolve a gas in the deaerated pure water to produce gas-dissolved pure water; a gas-dissolved pure water delivery line coupled to the gas dissolving unit and configured to deliver the gas-dissolved pure water; an ultrasonic cleaning unit coupled to the gas-dissolved pure water delivery line and configured to impart an ultrasonic vibration energy to the gas-dissolved pure water, which has been delivered through the gas-dissolved pure water delivery line, and then eject the gas-dissolved pure water onto an object to be cleaned; and a controller configured to control the gas dissolving unit and the ultrasonic cleaning unit.
    Type: Application
    Filed: December 23, 2013
    Publication date: July 3, 2014
    Inventor: Tomoatsu ISHIBASHI
  • Patent number: 8690638
    Abstract: Curved plastic objects and systems and methods for deburring the same are disclosed. The curved plastic object can be the cap or grill of a headphone or earbud.
    Type: Grant
    Filed: May 13, 2011
    Date of Patent: April 8, 2014
    Assignee: Apple Inc.
    Inventors: Jeff Hayashida, Jonathan Aase
  • Patent number: 8651921
    Abstract: A surface treatment device includes an enclosure which has an opening through which the leading edge of an aerofoil passes. A sealing element is provided on the enclosure to seal the device to the surfaces of the aerofoil. An abrasive is located within the enclosure and two fluid openings are also provided through which a chemical accelerant can be pumped. In operation the enclosure is oscillated relative to the component so that material is abraded. Whilst the enclosure is oscillated a chemical accelerant is simultaneously pumped through it. The device allows for the local application of a surface treatment on a component.
    Type: Grant
    Filed: February 3, 2010
    Date of Patent: February 18, 2014
    Assignee: Rolls-Royce PLC
    Inventors: Daniel Clark, Stephen John Tuppen
  • Patent number: 8632377
    Abstract: An ultrasonic trimming method is composed of steps, driving a cutter blade having a flat plate shape and supported by an arm at an end of an articulated robot via an ultrasonic oscillator, the cutter blade being driven by the arm while the cutter blade is ultrasonically vibrated; cutting a workpiece secured by a workpiece securing portion; and during, operation for cutting, moving the cutter blade held attached to the articulated robot to the position at where the cutting edge is brought into contact with the grindstone, maintaining the cutter blades attitude such that a plane containing the cutting edge thereof contacts the grindstone, and grinding the cutter blade by pressing the cutter blade against a grinding member by the arm while the cutter blade is ultrasonically vibrated, the grinding member being disposed within a movable range of the cutter blade driven by the articulated robot.
    Type: Grant
    Filed: May 30, 2013
    Date of Patent: January 21, 2014
    Assignee: Nihon Shoryoku Kikai Co., Ltd.
    Inventor: Norio Tanaka
  • Patent number: 8512094
    Abstract: An ultrasonic trimming method is composed of steps, driving a cutter blade having a flat plate shape and supported by an arm at an end of an articulated robot via an ultrasonic oscillator, the cutter blade being driven by the arm while the cutter blade is ultrasonically vibrated; cutting a workpiece secured by a workpiece securing portion; and during, operation for cutting, moving the cutter blade held attached to the articulated robot to the position at where the cutting edge is brought into contact with the grindstone, maintaining the cutter blades attitude such that a plane containing the cutting edge thereof contacts the grindstone, and grinding the cutter blade by pressing the cutter blade against a grinding member by the arm while the cutter blade is ultrasonically vibrated, the grinding member being disposed within a movable range of the cutter blade driven by the articulated robot.
    Type: Grant
    Filed: May 25, 2012
    Date of Patent: August 20, 2013
    Assignee: Nihon Shoryoku Kikai Co., Ltd.
    Inventor: Norio Tanaka
  • Patent number: 8257002
    Abstract: In the case of a method for chip-removing machining of workpieces (14), in particular for making bores in workpieces (14), wherein a tool (18) is put into rotation (20) relative to the workpiece (14) and the tool (18) is moved relative to the workpiece (14) with a feed motion, the tool (18) executes an oscillating motion in the direction (z) of the feed motion relative to the workpiece (14), a settable oscillation component being imparted to the feed motion through control means.
    Type: Grant
    Filed: April 21, 2010
    Date of Patent: September 4, 2012
    Assignee: Chiron-Werke GmbH & Co. KG
    Inventors: Dirk Prust, Claus Eppler
  • Patent number: 8197162
    Abstract: A method of making a hole in a composite material comprising the steps of providing an elongate cutting tool having a cutting portion in the form of a tubular cylinder; and advancing the cutting tool in a direction parallel to a longitudinal axis of the cutting tool whilst rotating the cutting tool about said axis and vibrating the cutting tool along said axis.
    Type: Grant
    Filed: November 30, 2007
    Date of Patent: June 12, 2012
    Assignee: Airbus Operations Limited
    Inventors: Wei Ming Sim, Martin Stalley
  • Patent number: 8100741
    Abstract: A vibration device for a super finishing apparatus for super finishing a mechanical object is disclosed. It comprises at least two sliding means (1, 3), each comprising a guide (5, 7) and an element (9, 11) provided with a through hole (13) for receiving the guide (5, 7), allowing a relative movement between the guide (5, 7) and the element (9, 11) provided with the through hole (13), and a movable structure (15) fixed to the at least two sliding means (1, 3). Further, each sliding means (1, 3) presents at least one liquid fluid inlet (19) allowing a liquid fluid to enter the through hole (13) and suspend the guide (5, 7) in relation to an inner surface of the through hole (13). An attachment tool comprising the vibration device is also disclosed.
    Type: Grant
    Filed: December 21, 2006
    Date of Patent: January 24, 2012
    Assignee: Aktiebolaget SKF
    Inventors: Martin Gustafsson, Paul Shore
  • Patent number: 8091192
    Abstract: A device for surface blasting, e.g., for ultrasonic shot blasting, components, e.g., gas turbine components, includes at least one vibrator having an oscillating surface, e.g., having at least one ultrasonic sonotrode, the or each oscillating surface of the or each vibrator being adjoined by a machining chamber for receiving a section to be blasted of the component to be machined. The machining chamber is bounded in its cross-section by at least three sides, e.g., by at least two substantially vertical sides and by at least one substantially horizontal side. At least the substantially vertical sides of the machining chamber are formed by oscillating surfaces of in each case one vibrator.
    Type: Grant
    Filed: August 5, 2005
    Date of Patent: January 10, 2012
    Assignee: MTU Aero Engines GmbH
    Inventors: Erwin Bayer, Thomas Dautl, Thomas Peschke, Holger Polanetzki
  • Patent number: 8016644
    Abstract: An apparatus and method for micro-machining a surface of a workpiece having a complex surface profile including desired profile features and finer undesired profile features to be removed, including shaping a formable polishing tool using either the workpiece itself or a replica of the workpiece to have at least said desired profile features, and using said formable polishing tool to micro-machine said surface to remove said finer undesired profile features while maintaining said desired profile features. The formable polishing tool can be shaped to have at least said desired profile features by pressing the formable polishing tool against either the workpiece itself or the replica of the workpiece when the formable polishing tool is in a formable state, and the formable polishing tool can be used for micro-machining when the formable polishing tool is in a solid state.
    Type: Grant
    Filed: July 13, 2007
    Date of Patent: September 13, 2011
    Assignee: Université Laval
    Inventors: Alain Curodeau, Louis Brault, Julie Guay
  • Patent number: 7981071
    Abstract: A handheld instrument for minimizing pain during administration by injection of a liquid, such as, an anesthetic that has a main body, a vibration unit mounted in the main body when initiated to cause the main body to vibrate, and a detachable tip cantilever mounted on the main body to vibrate with it, the tip having a free end characterized by a bifurcation to form two spaced projections defining a space between them, whereby the spaced projections can be placed in proximity to, adjacent to and bracketing a preselected injection site on a human or animal and the tissue at said preselected injection site and vibrated while an injection is given.
    Type: Grant
    Filed: September 19, 2005
    Date of Patent: July 19, 2011
    Assignee: Bing Innovations, LLC
    Inventor: Steven G. Goldberg
  • Patent number: 7837535
    Abstract: A superfinishing stone 2 is slid on a rotating subject surface 7 as pressed against the subject surface 7 and is held in contact against the subject surface 7 as vibrated thereon in a different direction from the sliding direction. The superfinishing stone includes plural stone portions 3, 4 divided by a split surface 6 inclined to both the sliding direction and the vibrating direction and mutually independently movable along the split surface 6 and in the pressing direction.
    Type: Grant
    Filed: March 28, 2006
    Date of Patent: November 23, 2010
    Assignee: JTEKT Corporation
    Inventor: Takashi Uchino
  • Patent number: 7824247
    Abstract: A hand-held drilling device, and method for drilling using the device, has a housing, a transducer within the housing, with the transducer effectively operating at ultrasonic frequencies, a rotating motor component within the housing and rigid cutting end-effector rotationally connected to the rotating motor component and vibrationally connected to the transducer. The hand-held drilling device of the present invention operates at a noise level of from about 50 decibels or less.
    Type: Grant
    Filed: June 1, 2007
    Date of Patent: November 2, 2010
    Assignee: The United States of America as represented by the Administrator of the National Aeronautics and Space Administration
    Inventors: Yoseph Bar-Cohen, Mireca Badescu, Xiaoqi Bao, Zenshea Chang, Stewart Sherrit
  • Patent number: 7695351
    Abstract: A low-stress polishing device includes a base; a plurality of actuators mounted to the base and spaced from each other in a predetermined interval, each of the actuators having a drive shaft and a buffer spring connected with the drive shaft for providing the drive shaft with a predetermined impulsive pressure, each of the drive shafts having a buffer pad located at a distal end thereof; at least one drive circuit electrically connected with the actuators for control of driving the actuators; a working plate mounted to the buffer pads; and a polishing pad mounted to the working plate. Accordingly, the vibration mode generated by the device provides a dynamic pressure on the wafer surface for destroying the chemical product on the wafer surface and is applicable to polishing of low-dielectric integrated copper structures.
    Type: Grant
    Filed: February 21, 2008
    Date of Patent: April 13, 2010
    Assignee: National Chung Cheng University
    Inventors: Meng-Shiun Tsai, Yeau-Ren Jeng
  • Patent number: 7563155
    Abstract: A cutting apparatus includes a blade mount supporting a first ultrasonic transducer for imparting ultrasonic vibrations to a cutting blade. The blade mount includes an annular flange having a grip surface on an outer circumferential side surface thereof for gripping the cutting blade, a first ultrasonic transducer housing portion for housing the first ultrasonic transducer, and a hollow cylindrical mount boss having a fitting hole fitting over the spindle. The annular flange has a plurality of through holes defined therein between the first ultrasonic transducer housing portion and the mount boss. A blade grip flange has a fitting hole fitted over the mount boss, a grip surface on an outer circumferential side surface thereof for gripping the cutting blade, a second ultrasonic transducer housing portion for housing a second ultrasonic transducer, and a plurality of through holes defined therein between the second ultrasonic transducer housing portion and the fitting hole.
    Type: Grant
    Filed: May 19, 2008
    Date of Patent: July 21, 2009
    Assignee: Disco Corporation
    Inventors: Souu Kumagai, Fumiteru Tashino
  • Patent number: 7547244
    Abstract: An apparatus for sharpening one or more razor blades secured within a holder is disclosed. The holder includes a head for retaining the one or more razor blades in a cutting position and a handle affixed to the head. A housing includes a razor slot adapted to receive the head. A sharpening assembly disposed within the housing includes a sharpening member positioned adjacent the razor slot. The sharpening member is adapted to engage the one or more blades in the cutting position. A motor assembly is also disposed within the housing and is adapted to transmit a high frequency vibration to the sharpening assembly.
    Type: Grant
    Filed: November 1, 2007
    Date of Patent: June 16, 2009
    Inventor: Charles J. Fletcher
  • Patent number: 7219419
    Abstract: Component (3) is pressed onto a circuit board (4) so that their respective metal interconnects (5), (6) are in close contact with each other, and ultrasonic vibration is applied to the suction nozzle (14) holding the component (3). Friction is thereby generated between metal interconnects (5), (6) whereby the component (3) is bonded on circuit substrate. Suction nozzle (14) for handling components is made of stainless steel and has a working face (14a) provided with a hardened layer (14b), or alternatively, suction nozzle (14) may have a suction head (14c) having a working face (14a) made of cemented carbide. Working face (14a) of suction nozzle (14) is refined by polishing as required during the mounting operation.
    Type: Grant
    Filed: February 28, 2003
    Date of Patent: May 22, 2007
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Kazushi Higashi, Shozo Minamitani, Shinji Kanayama, Kenji Takahashi
  • Patent number: 7175506
    Abstract: The tool unit for the ultrasonically assisted rotary machining of a workpiece comprises a converter (23) including at least one electroacoustic transducer (22) for generating and transmitting ultrasonic oscillations, a tool (30) that is coupled to the converter, and a holder (21) in which the converter including the transducer is arranged and which is insertable at least partially in the retainer (11) of a tool spindle (10) and connectable thereto by means of a detachable connection (27).
    Type: Grant
    Filed: December 9, 2005
    Date of Patent: February 13, 2007
    Assignee: Fritz Studer AG
    Inventors: Frank Fiebelkorn, Paul Stadler, Thomas Fankhauser
  • Patent number: 7163442
    Abstract: The micro titer plates, especially for micro reaction systems used in biotechnology, each have an array of special microstructures, which typically include micro cups and micro channels with different cross-sections. These microstructures are introduced into a preferably borosilicate glass wafer (18) by ultrasonic machining. Individual rectangular micro titer plates (19?) made from borosilicate glass for biotechnology are produced by cutting the structured glass wafer into individual micro titer plates. Particularly arrays of from 10 to 100 of these microstructures are formed in a 6-inch borosilicate glass wafer, in order to facilitate subsequent cutting of the wafer to economically manufacture a corresponding number of these micro titer plates (19?).
    Type: Grant
    Filed: March 17, 2003
    Date of Patent: January 16, 2007
    Assignee: Schott AG
    Inventors: Michael Jacquorie, Markus Vos
  • Patent number: 7115016
    Abstract: Planarizing machines and methods for mechanical and/or chemical-mechanical planarization of micro-device workpieces are disclosed herein. In one embodiment, a method for polishing a workpiece includes determining an estimated frequency of serial defects in a workpiece, pressing the workpiece against a polishing pad and moving the workpiece relative to the pad. The method further includes vibrating the workpiece and/or the pad at a frequency that is greater than the estimated frequency of the serial defects. In one aspect of this embodiment, determining the estimated frequency of serial defects can include: determining a relative velocity between the workpiece and the polishing pad; estimating the length of a mark on the workpiece; estimating the time a particle in a planarizing solution is in contact with the workpiece; and estimating the number of cracks in the workpiece.
    Type: Grant
    Filed: December 1, 2005
    Date of Patent: October 3, 2006
    Assignee: Micron Technology, Inc.
    Inventor: Nagasubramaniyan Chandrasekaran
  • Patent number: 7063596
    Abstract: Material is removed from objects to be marked or machined by applying tools having cutouts arranged in a pattern on the objects, filling the cutouts with abrasive particles, pouring a molten metal over the tools to solidify as a backing, and then ultrasonically vibrating the backing to propel the abrasive particles through the cutouts to transfer the pattern to the objects.
    Type: Grant
    Filed: June 9, 2003
    Date of Patent: June 20, 2006
    Inventor: David Benderly
  • Patent number: 6942554
    Abstract: An apparatus for polishing a substrate with an optical surface. The apparatus contains a polishing pad and and a device for oscillating the polishing pad while simultaneously contacting it with at least 90 percent of said optical surface.
    Type: Grant
    Filed: July 21, 2003
    Date of Patent: September 13, 2005
    Assignee: Optimax Systems, Inc.
    Inventor: Michael P. Mandina
  • Patent number: 6932682
    Abstract: A method for machining a component. The method includes providing a machining apparatus configured to induce vibrations such that a vibration direction of the machining apparatus is substantially aligned with respect to a machining direction of the component, and vibrating the machining apparatus in the vibration direction to machine the component in the machining direction.
    Type: Grant
    Filed: October 17, 2002
    Date of Patent: August 23, 2005
    Assignee: General Electric Company
    Inventors: Timothy D. Kostar, Thomas W. Rentz
  • Patent number: 6913528
    Abstract: A method and apparatus for improving uniformity of the rate of removal of material from the surface of a workpiece, such as semiconductor substrate, by polishing. In accordance with the invention, the workpiece is subjected to a vibratory polishing method, and optionally at least one additional polishing motion selected from rotational, oscillating, sweeping, orbital and linear polishing motions. As a result, polished workpieces, such as semiconductor wafers, have reduced surface defects, improved planarity, and are polished more uniformly over a wider area.
    Type: Grant
    Filed: March 19, 2001
    Date of Patent: July 5, 2005
    Assignee: SpeedFam-IPEC Corporation
    Inventors: Stephen C. Schulz, John D. Herb
  • Patent number: 6872124
    Abstract: The superfinishing apparatus according to the present invention includes a frame 51 for holding the entirety of the apparatus, a cam shaft 52 attached to the frame 51 so as to rotate freely, first and second eccentric cams 53, 54 which are attached to the cam shaft 52 and rotate with a phase difference of 180 degrees therebetween, a first vibrator 55 having a polygonal shape in its section which moves in a sliding manner in accordance with the rotation of the first eccentric cam 53, a second vibrator 57 having a polygonal shape in its section which is disposed so as to oppose to the first vibrator 55 through the cam shaft 52 and moves in a sliding manner in accordance with the rotation of the second eccentric cam 54, air bearings 59, 60 for supporting the first vibrator 55 and the second vibrator 57, and a superfinishing stone 61 attached to the first vibrator 55 or the second vibrator 57.
    Type: Grant
    Filed: December 9, 2003
    Date of Patent: March 29, 2005
    Assignee: NSK Ltd.
    Inventors: Kazumi Matsuzaki, Etsuo Kanakubo
  • Patent number: 6872125
    Abstract: A tool for abrading a workpiece to smooth the surface thereof. The tool has a shank portion and a working portion. The working portion has a smooth and non-abrading surface, with one or more depressions formed therein. Each depression includes an abrading mechanism. The abrading mechanism does not protrude above the smooth surface of the working portion of the tool. During operation, once the workpiece has been smoothed by removal of the raised areas by the abrading mechanism, the smooth surface of the tool engages the workpiece and further abrasion of the workpiece is prevented.
    Type: Grant
    Filed: March 19, 2004
    Date of Patent: March 29, 2005
    Inventor: Stephen K. Harrel
  • Publication number: 20040242131
    Abstract: A system and method are disclosed for edge blending hard drive head sliders by oscillating abrasive lapping tape across the edges of multiple sliders simultaneously.
    Type: Application
    Filed: October 22, 2003
    Publication date: December 2, 2004
    Inventors: Zhu Jian Zhan, Ryuji Fujii, Quan Bao Wang, Niraj Mahadev, Kazumasa Yasuda
  • Patent number: 6811468
    Abstract: A polishing apparatus and a polishing method which can reduce the amount of consumption of the polishing agent and scratches caused on the object to be polished due to an increase of the particle size in the polishing agent. The polishing apparatus has a polishing head which is provided with a polishing agent receiving unit, a holding means for holding an object to be polished in a holding recess, a contact portion which is positioned at the periphery of the holding recess, a feed port for feeding the polishing agent from the polishing agent receiving portion into the closed space, a vibration imparting means for imparting vibration to the polishing agent, and a valve means provided with a valve for opening and closing the feed port.
    Type: Grant
    Filed: October 14, 2003
    Date of Patent: November 2, 2004
    Assignee: Sony Corporation
    Inventor: Yoshifumi Nobe
  • Publication number: 20040137830
    Abstract: An object such as an electronic device can be favorably lapped by a method composed of preparing a lapping machine having a longitudinal or circular lapping board equipped with a ultrasonic oscillation-applying device which applies elliptical vibration to the lapping board and a supporting means arranged adjacently to the lapping board; placing the object on the lapping board via abrasive grains and further on the supporting means; and activating the ultrasonic oscillation-applying device to apply elliptical vibration to the lapping board whereby the object is caused to rotate on an axis thereof and lapped.
    Type: Application
    Filed: December 23, 2003
    Publication date: July 15, 2004
    Applicant: Kazumasa OHNISHI
    Inventor: Kazumasa Ohnishi
  • Patent number: 6726531
    Abstract: A tool for abrading a workpiece to smooth the surface thereof. In one embodiment, the tool is an ultrasonic tip (12) having plural grooves (16) formed in a smooth surface (14) thereof. Each groove (16) includes an abrasive material (24) coating the depression thereof. Rough surface areas of a workpiece projecting into the groove (16) are abraded to thereby result in a smooth workpiece surface. Once the surface roughness of the workpiece has been removed, the smooth areas (14) of the ultrasonic tip (12) are engaged, thereby preventing further abrasion of the workpiece.
    Type: Grant
    Filed: March 23, 2000
    Date of Patent: April 27, 2004
    Inventor: Stephen K. Harrel
  • Patent number: 6682396
    Abstract: A linear polisher for polishing a substrate that always provides a fresh abrasive surface for polishing and a method for linear polishing a substrate are described. In the linear polisher, a length of a polishing pad is supported on a pair of rollers which are driven by a motor means for either intermittently or continuously advancing the pad during a polishing process. A vibration generator which is connected to the polishing pad through an adaptor provides lateral, or vibration in a transverse direction of the pad throughout the polishing process. The present invention novel linear polisher enables substantially constant removal rate to be achieved throughout the pad life of a polishing pad without deterioration such as that normally seen in a conventional rotary or linear CMP apparatus. Optionally, a rotatable substrate holder is utilized to further improve the polishing uniformity of the linear polishing apparatus.
    Type: Grant
    Filed: April 11, 2000
    Date of Patent: January 27, 2004
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd
    Inventors: Tsu Shih, Chen-Hua Yu
  • Patent number: 6656020
    Abstract: A polishing apparatus and a polishing method which can reduce the amount of consumption of the polishing agent and scratches caused on the object to be polished due to an increase of the particle size in the polishing agent. The polishing apparatus has a polishing head which is provided with a polishing agent receiving unit, a holding means for holding an object to be polished in a holding recess, a contact portion which is positioned at the periphery of the holding recess, a feed port for feeding the polishing agent from the polishing agent receiving portion into the closed space, a vibration imparting means for imparting vibration to the polishing agent, and a valve means provided with a valve for opening and closing the feed port.
    Type: Grant
    Filed: April 30, 2001
    Date of Patent: December 2, 2003
    Assignee: Sony Corporation
    Inventor: Yoshifumi Nobe
  • Patent number: 6612906
    Abstract: Material is removed from objects to be marked or machined by applying apertured masks having cutouts arranged in a pattern on the objects, applying a liquid mixture of abrasive particles over the masks, and then ultrasonically vibrating the mixture to propel the abrasive particles through the cutouts to transfer the pattern to the objects.
    Type: Grant
    Filed: October 22, 2001
    Date of Patent: September 2, 2003
    Inventor: David Benderly
  • Patent number: 6497164
    Abstract: A ultrasonic vibration cutting tool which can optimize materials as in a separate type and can improve the transmission efficiency of ultrasonic vibration as in an integrated type. The ultrasonic vibration cutting tool comprises a ring-shaped projection and a blade essentially composed of diamond and held by the ring-shaped projection both of which are formed on the peripheral surface of a vibration conversion portion provided on a resonator, and the outer diameter of the blade is set larger than the outer diameter of the ring-shaped projection.
    Type: Grant
    Filed: November 28, 2000
    Date of Patent: December 24, 2002
    Assignee: Ultex Corporation
    Inventor: Shigeru Sato
  • Patent number: 6379858
    Abstract: A honing means produces sonic waves that suspend and propel a honing medium against a surface of a substrate. The honing medium impinges on the surface of the substrate and alters the substrate's surface roughness. The substrate and the honing means are positioned relative to each other to ensure substantial surface roughness uniformity.
    Type: Grant
    Filed: August 14, 2000
    Date of Patent: April 30, 2002
    Assignee: Xerox Corporation
    Inventors: Philip G. Perry, Gene W. O'Dell, William G. Herbert, Alexander A. Antonelli
  • Patent number: 6336844
    Abstract: The invention relates to a method and machine for so-called “ultrasonic” peening employing a mist of microbeads inside an active chamber 30c for peening parts 21 on a wheel 19, ie blades on a rotator. The periphery of the wheel 19 is brought simultaneously past the openings of at least three chambers with limited clearances E1 and E2. At least one chamber being active with a peening mist of microbeads and at least two chambers, either side of the active chamber, being passive. The wheel being rotated over the chambers and the microbeads are removed from the passive chambers and in that the active chambers are supplied with microbeads therefrom.
    Type: Grant
    Filed: November 17, 2000
    Date of Patent: January 8, 2002
    Assignee: Snecma Moteurs
    Inventors: Catherine Dominique Béatrice Duquenne, Véronique Christiane Raymonde Giffard, Gérard Michel Roland Gueldry, Claude Marcel Mons
  • Patent number: 6315644
    Abstract: An apparatus of this invention for supplying an abrasive for use in the manufacture of semiconductors comprises a storage tank of the abrasive and a supply line for guiding the abrasive from the storage tank to a nozzle for supplying the abrasive to an object to be polished and said storage tank or supply line is provided with a device for furnishing ultrasonic wave to sonicate the abrasive. A process of this invention for supplying an abrasive for use in the manufacture of semiconductors comprises sonicating the abrasive by ultrasonic wave before supplying it to an object to be polished. The apparatus and process of this invention for supplying an abrasive for use in the manufacture of semiconductors make it possible to supply an abrasive containing a minimized amount of abnormally agglomerated particles to the surface of an object to be polished in the manufacturing step of semiconductors and improve the yield of polished products.
    Type: Grant
    Filed: November 22, 1999
    Date of Patent: November 13, 2001
    Assignee: Tama Chemicals Co., Ltd.
    Inventors: Toshitsura Cho, Akira Iwashiro
  • Patent number: 6270397
    Abstract: The present invention provides a CMP device with a pressure-controlling mechanism comprising a rotating polishing plate, a slurry supplying system for supplying slurry, a rotating carrier that holds and rotates a silicon wafer such that the wafer surface is polished against the rotating polishing plate and the slurry during a CMP process, and a pressure-controlling mechanism capable of exerting different pressures to different locations on the wafer in response to different polishing rates corresponding to each of the specified locations. By utilizing the CMP device according to the present invention, the polishing rate and finish quality at different locations of the silicon wafer will be more uniform, which in turn contributes to an improved wafer planarizing effect.
    Type: Grant
    Filed: January 31, 2000
    Date of Patent: August 7, 2001
    Assignees: Promos Technologies Inc., Mosel Vitelic Inc., Siemens AG
    Inventor: Hsiao Che Wu
  • Patent number: 6250188
    Abstract: An ultrasonic vibration cutting method comprising mounting and fixing a part to be cut on a mounting table, moving down an ultrasonic vibration rotation unit, stopping the downward movement of the ultrasonic vibration rotation unit when the cutting blade of the ultrasonic vibration rotation unit reaches a position for cutting the part, moving the ultrasonic vibration rotation unit linearly for cutting, and turning and vibrating the cutting blade with ultrasonic waves to cut the part.
    Type: Grant
    Filed: January 21, 2000
    Date of Patent: June 26, 2001
    Assignee: Ultex Corporation
    Inventors: Shigeru Sato, Ryoichi Ishii
  • Patent number: 6174224
    Abstract: The invention relates to a workhead for mechanical working of materials. This invention is directed to metal working machines and is adaptable for use in the mechanical working of metals and plastics, involving the use of liquid lubricants and/or coolants. The technical result achieved by implementing the invention comprises an improvement in the efficiency of the cavitation treatment of a liquid lubricant and/or coolant, which secures the dispersion of a solid lubrication in aqueous solutions, an increase in the stability of water-in-oil emulsions, decomposition of a liquid lubricant and/or coolant and a decrease of viscosity, an improvement in corrosion resistance, reduction in a tool wear and, simultaneously, an improvement in the quality of a working surface. The apparatus comprises a housing (1), inside which is fitted a main oscillator (2), to which is connected a tool (4) through the intermediary of an extension piece (3).
    Type: Grant
    Filed: February 24, 1999
    Date of Patent: January 16, 2001
    Inventors: Serguei Iachine, Valeri Tsarev, Viljo Olavi Kilpel{umlaut over (a)}inen, Lilia Lappalainen
  • Patent number: 6146245
    Abstract: A method of machining flat parts, includes the use of two permanent magnets which are located opposite to and spaced from one another so as to form a magnetic field with a magnetic flux extending perpendicular to the magnets, placing a flat part in the magnetic field between the magnets so that the magnetic flux extends through the flat part, supplying a magnetic-abrasive powder to the flat part in the magnetic field, and performing a relative movement between at least one of the magnets and the flat part so as to remove a material from a surface of the flat part.
    Type: Grant
    Filed: May 6, 1999
    Date of Patent: November 14, 2000
    Assignee: Scientific Manufacturing Technologies, Inc.
    Inventors: Gennady Kremen, Leonid Igelshteyn, Savva Feygin
  • Patent number: 6146250
    Abstract: Vibrating and oscillating rates can be dynamically changed during polishing to achieve an optimal polishing process. A semiconductor device substrate (34) has a first layer with a first film (12) and a second film (10) that overlies the first film (12), where the first film (12) is harder and underlies the second film (10). In one embodiment, the substrate (34) is placed over a first region (66) of a polishing pad (60). The second film (10) is polished at a first vibrating and oscillating rates over the first region (66). An endpoint signal is received when the first film (12) is reached. The substrate (34) is moved to a second region (62) of the polishing pad (60) that is closer to the edge of the pad and has a higher feature density compared to the first region (66). Polishing is performed at a second vibrating and oscillating rates that are different from the first vibrating and oscillating rates to remove the first film (10).
    Type: Grant
    Filed: July 15, 1999
    Date of Patent: November 14, 2000
    Assignee: Motorola, Inc.
    Inventors: Rajan Nagabushnam, Subramoney V. Iyer
  • Patent number: 6036578
    Abstract: The invention provides a NC unit provided with an ultrasonically oscillating tool, capable of indenting pits at equal pitches and detecting an amount of wastage of a stylus. In the NC unit, a PLL circuit outputs an ultrasonic signal S at a frequency equivalent to the resonant frequency of the ultrasonically oscillating tool and the frequency of the output signal S undergoes changes following up any change in the resonant frequency due to wear and tear of the stylus. Accordingly, the frequency of the output signal S has a value corresponding to the amount of wastage of the stylus. A frequency detection circuit 40 detects the frequency of the output signal S, and delivers data indicating the frequency to a CPU. When applying a process for indenting pits at equal pitches, the CPU changes over a synchronizing/changeover circuit so as to deliver the output signal S from the PLL circuit to an interpolative operation circuit.
    Type: Grant
    Filed: September 18, 1998
    Date of Patent: March 14, 2000
    Assignee: Ando Electric Co., Ltd.
    Inventor: Shiori Sasaki
  • Patent number: 5993300
    Abstract: An ultrasonic vibration composite processing tool is disclosed wherein at least one small-sized processing member is arranged for carrying out processing of a processed material while applying vibration to the processed material, to thereby ensure stable operation of the processing tool to accomplish efficient processing of the processed material even when the processed material is large-sized. A processing structure and a vibration structure are arranged. The processing structure includes a rotatable base having a rotation axis and at least one processing member including a micro-cutting surface. The processing member is arranged on one surface of the base so as to be positioned in a circumferential direction of the base about the rotation axis of the base. The vibration structure functions to vibrate the processing member in directions of the processed material.
    Type: Grant
    Filed: February 19, 1998
    Date of Patent: November 30, 1999
    Inventor: Hiroshi Hashimoto