Abstract: Wire removal systems and methods for packaging applications. In some embodiments, a method of manufacturing a module can include receiving by an automated wire cutting apparatus a packaging substrate including a die mounted thereon and a defective wire coupled thereto, positioning one or both of a wire cutting instrument of the automated wire cutting apparatus and the packaging substrate relative to the other based on predetermined instructions, and detaching the defective wire from the packaging substrate using the wire cutting instrument.

Abstract: A machine tool and a control apparatus thereof include an amplitude control unit to control the amplitude of reciprocal vibration by a vibration unit. The amplitude control unit is configured to reduce the amplitude of the reciprocal vibration by the vibration unit as a cutting tool is fed in a feeding direction when the cutting tool reaches a predetermined cutting tool work stopping position on a workpiece in the feeding direction (Z-axis direction) to prevent the cutting tool from cutting the workpiece beyond the cutting tool work stopping position.

Abstract: A chemical-mechanical polishing (CMP) system includes a head, a polishing pad, and a magnetic system. The slurry used in the CMP process contains magnetizable abrasives. Application and control of a magnetic field, by the magnetic system, allows precise control over how the magnetizable abrasives in the slurry may be drawn toward the wafer or toward the polishing pad.

Abstract: A device for treating or acting on workpiece surfaces by means of an actuator, such as a cutting or engraving laser or a nozzle for applying oils, paints, adhesives, dyes, or etchants is disclosed. An ultrasonic levitation force field is generated by means of a sonotrode, which is coupled to the actuator into a working unit, such that the movably suspended working unit is supported on the workpiece surface in a hovering manner. The ultrasonic levitation force field allows a highly precise positioning of the working unit relative to the workpiece surface so as to allow a precise treatment or machining of the workpiece surface.

Abstract: According to one embodiment, a substrate processing system includes a measuring unit, a data processing unit, and a processing unit. The measuring unit is configured to measure information relating to a thickness dimension of a substrate. The substrate includes a light emitting unit and a wavelength conversion unit. The wavelength conversion unit includes a phosphor. The data processing unit is configured to determine processing information relating to a thickness direction of the wavelength conversion unit based on the measured information relating to the thickness dimension of the substrate and based on information relating to a characteristic of light emitted from the light emitting unit. The processing unit is configured to perform processing of the wavelength conversion unit based on the determined processing information.

Abstract: A computer numerical control machine tool for grinding two sides of a plane by shifting self-rotation ultrasonic vibration, wherein a pillar (3) is provided on the tool body (1) of the machine tool, a Y axis movement assembly (12) is provided on the platform of the tool body (1), with a lower revolving movement assembly (11), which revolves about a Z coordinate axis, being mounted on the upper surface of the Y axis movement assembly (12), and a lower grinding plate (10) being mounted coaxially above the lower revolving movement assembly (11); an ultrasonic vibration assembly (2) is mounted fixedly on the pillar (3), with a separation plate (8) for clamping a workpiece assembly (9) being provided on the ultrasonic vibration assembly (2); an X axis movement assembly (4) is mounted on the upper part of the pillar (3), a Z axis movement assembly (5) is mounted on the upright face of the X axis movement assembly (4), with an upper revolving movement assembly (6), which revolves about the Z coordinate axis, being p

Abstract: Systems and processes for improved laser machining, such as micro machining, of a workpiece. Systems and processes involve directing at a first surface of the workpiece a laser beam and wherein at least the laser-irradiated region of the first surface of the workpiece is immersed in a liquid, and delivering to the liquid-immersed and laser-irradiated workpiece surface region at least a first ultrasound output from a first ultrasound device. The ultrasound output and the laser beam desirably impact the workpiece first surface substantially simultaneously.

Abstract: A thermally conductive sheet has cut surfaces with low surface roughness and hence shows reduced thermal resistance at the interfaces, and high thermal conductivity in the thickness direction. Thus, the thermally conductive sheet can be interposed between any of various heat sources and a radiation member. The process for producing the thermally conductive sheet includes at least: an extrusion molding step in which a thermally conductive composition containing a polymer, an anisotropic thermally conductive filler, and a filler is extruded with an extruder to thereby mold an extrusion-molded product in which the anisotropic thermally conductive filler has been oriented along the extrusion direction; a curing step in which the extrusion-molded product is cured to obtain a cured object; and a slicing step in which the cured object is sliced into a given thickness with an ultrasonic cutter in the direction perpendicular to the extrusion direction.

Abstract: Embodiments of the present invention pertain to reducing agglomeration of particles while manufacturing a lapping plate using an oil-based slurry. According to one embodiment, an oil-based slurry with particles of a known size is applied to a lapping plate. The oil-based slurry is ultrasonically mixed while applying the oil-based slurry to the lapping plate in order to reduce agglomeration of the particles.

Abstract: A method of making a bearing includes providing a bearing intermediate, which is unfinished while having an overall shape of a finished bearing product; and repeatedly impacting a surface of the bearing intermediate at one or more ultrasonic frequencies to modify characteristics of the bearing intermediate. The resulting bearing intermediate or finished bearing product includes nano-size grains at or underneath the surface.

Abstract: A polishing apparatus includes: a pure water supply line configured to supply deaerated pure water into the polishing apparatus; a gas dissolving unit coupled to the pure water supply line and configured to dissolve a gas in the deaerated pure water to produce gas-dissolved pure water; a gas-dissolved pure water delivery line coupled to the gas dissolving unit and configured to deliver the gas-dissolved pure water; an ultrasonic cleaning unit coupled to the gas-dissolved pure water delivery line and configured to impart an ultrasonic vibration energy to the gas-dissolved pure water, which has been delivered through the gas-dissolved pure water delivery line, and then eject the gas-dissolved pure water onto an object to be cleaned; and a controller configured to control the gas dissolving unit and the ultrasonic cleaning unit.

Abstract: Curved plastic objects and systems and methods for deburring the same are disclosed. The curved plastic object can be the cap or grill of a headphone or earbud.

Abstract: A surface treatment device includes an enclosure which has an opening through which the leading edge of an aerofoil passes. A sealing element is provided on the enclosure to seal the device to the surfaces of the aerofoil. An abrasive is located within the enclosure and two fluid openings are also provided through which a chemical accelerant can be pumped. In operation the enclosure is oscillated relative to the component so that material is abraded. Whilst the enclosure is oscillated a chemical accelerant is simultaneously pumped through it. The device allows for the local application of a surface treatment on a component.

Abstract: An ultrasonic trimming method is composed of steps, driving a cutter blade having a flat plate shape and supported by an arm at an end of an articulated robot via an ultrasonic oscillator, the cutter blade being driven by the arm while the cutter blade is ultrasonically vibrated; cutting a workpiece secured by a workpiece securing portion; and during, operation for cutting, moving the cutter blade held attached to the articulated robot to the position at where the cutting edge is brought into contact with the grindstone, maintaining the cutter blades attitude such that a plane containing the cutting edge thereof contacts the grindstone, and grinding the cutter blade by pressing the cutter blade against a grinding member by the arm while the cutter blade is ultrasonically vibrated, the grinding member being disposed within a movable range of the cutter blade driven by the articulated robot.

Abstract: An ultrasonic trimming method is composed of steps, driving a cutter blade having a flat plate shape and supported by an arm at an end of an articulated robot via an ultrasonic oscillator, the cutter blade being driven by the arm while the cutter blade is ultrasonically vibrated; cutting a workpiece secured by a workpiece securing portion; and during, operation for cutting, moving the cutter blade held attached to the articulated robot to the position at where the cutting edge is brought into contact with the grindstone, maintaining the cutter blades attitude such that a plane containing the cutting edge thereof contacts the grindstone, and grinding the cutter blade by pressing the cutter blade against a grinding member by the arm while the cutter blade is ultrasonically vibrated, the grinding member being disposed within a movable range of the cutter blade driven by the articulated robot.

Abstract: In the case of a method for chip-removing machining of workpieces (14), in particular for making bores in workpieces (14), wherein a tool (18) is put into rotation (20) relative to the workpiece (14) and the tool (18) is moved relative to the workpiece (14) with a feed motion, the tool (18) executes an oscillating motion in the direction (z) of the feed motion relative to the workpiece (14), a settable oscillation component being imparted to the feed motion through control means.

Abstract: A method of making a hole in a composite material comprising the steps of providing an elongate cutting tool having a cutting portion in the form of a tubular cylinder; and advancing the cutting tool in a direction parallel to a longitudinal axis of the cutting tool whilst rotating the cutting tool about said axis and vibrating the cutting tool along said axis.

Abstract: A vibration device for a super finishing apparatus for super finishing a mechanical object is disclosed. It comprises at least two sliding means (1, 3), each comprising a guide (5, 7) and an element (9, 11) provided with a through hole (13) for receiving the guide (5, 7), allowing a relative movement between the guide (5, 7) and the element (9, 11) provided with the through hole (13), and a movable structure (15) fixed to the at least two sliding means (1, 3). Further, each sliding means (1, 3) presents at least one liquid fluid inlet (19) allowing a liquid fluid to enter the through hole (13) and suspend the guide (5, 7) in relation to an inner surface of the through hole (13). An attachment tool comprising the vibration device is also disclosed.

Abstract: A device for surface blasting, e.g., for ultrasonic shot blasting, components, e.g., gas turbine components, includes at least one vibrator having an oscillating surface, e.g., having at least one ultrasonic sonotrode, the or each oscillating surface of the or each vibrator being adjoined by a machining chamber for receiving a section to be blasted of the component to be machined. The machining chamber is bounded in its cross-section by at least three sides, e.g., by at least two substantially vertical sides and by at least one substantially horizontal side. At least the substantially vertical sides of the machining chamber are formed by oscillating surfaces of in each case one vibrator.

Abstract: An apparatus and method for micro-machining a surface of a workpiece having a complex surface profile including desired profile features and finer undesired profile features to be removed, including shaping a formable polishing tool using either the workpiece itself or a replica of the workpiece to have at least said desired profile features, and using said formable polishing tool to micro-machine said surface to remove said finer undesired profile features while maintaining said desired profile features. The formable polishing tool can be shaped to have at least said desired profile features by pressing the formable polishing tool against either the workpiece itself or the replica of the workpiece when the formable polishing tool is in a formable state, and the formable polishing tool can be used for micro-machining when the formable polishing tool is in a solid state.

Abstract: A handheld instrument for minimizing pain during administration by injection of a liquid, such as, an anesthetic that has a main body, a vibration unit mounted in the main body when initiated to cause the main body to vibrate, and a detachable tip cantilever mounted on the main body to vibrate with it, the tip having a free end characterized by a bifurcation to form two spaced projections defining a space between them, whereby the spaced projections can be placed in proximity to, adjacent to and bracketing a preselected injection site on a human or animal and the tissue at said preselected injection site and vibrated while an injection is given.

Abstract: A superfinishing stone 2 is slid on a rotating subject surface 7 as pressed against the subject surface 7 and is held in contact against the subject surface 7 as vibrated thereon in a different direction from the sliding direction. The superfinishing stone includes plural stone portions 3, 4 divided by a split surface 6 inclined to both the sliding direction and the vibrating direction and mutually independently movable along the split surface 6 and in the pressing direction.

Abstract: A hand-held drilling device, and method for drilling using the device, has a housing, a transducer within the housing, with the transducer effectively operating at ultrasonic frequencies, a rotating motor component within the housing and rigid cutting end-effector rotationally connected to the rotating motor component and vibrationally connected to the transducer. The hand-held drilling device of the present invention operates at a noise level of from about 50 decibels or less.

Abstract: A low-stress polishing device includes a base; a plurality of actuators mounted to the base and spaced from each other in a predetermined interval, each of the actuators having a drive shaft and a buffer spring connected with the drive shaft for providing the drive shaft with a predetermined impulsive pressure, each of the drive shafts having a buffer pad located at a distal end thereof; at least one drive circuit electrically connected with the actuators for control of driving the actuators; a working plate mounted to the buffer pads; and a polishing pad mounted to the working plate. Accordingly, the vibration mode generated by the device provides a dynamic pressure on the wafer surface for destroying the chemical product on the wafer surface and is applicable to polishing of low-dielectric integrated copper structures.

Abstract: A cutting apparatus includes a blade mount supporting a first ultrasonic transducer for imparting ultrasonic vibrations to a cutting blade. The blade mount includes an annular flange having a grip surface on an outer circumferential side surface thereof for gripping the cutting blade, a first ultrasonic transducer housing portion for housing the first ultrasonic transducer, and a hollow cylindrical mount boss having a fitting hole fitting over the spindle. The annular flange has a plurality of through holes defined therein between the first ultrasonic transducer housing portion and the mount boss. A blade grip flange has a fitting hole fitted over the mount boss, a grip surface on an outer circumferential side surface thereof for gripping the cutting blade, a second ultrasonic transducer housing portion for housing a second ultrasonic transducer, and a plurality of through holes defined therein between the second ultrasonic transducer housing portion and the fitting hole.

Abstract: An apparatus for sharpening one or more razor blades secured within a holder is disclosed. The holder includes a head for retaining the one or more razor blades in a cutting position and a handle affixed to the head. A housing includes a razor slot adapted to receive the head. A sharpening assembly disposed within the housing includes a sharpening member positioned adjacent the razor slot. The sharpening member is adapted to engage the one or more blades in the cutting position. A motor assembly is also disposed within the housing and is adapted to transmit a high frequency vibration to the sharpening assembly.

Abstract: Component (3) is pressed onto a circuit board (4) so that their respective metal interconnects (5), (6) are in close contact with each other, and ultrasonic vibration is applied to the suction nozzle (14) holding the component (3). Friction is thereby generated between metal interconnects (5), (6) whereby the component (3) is bonded on circuit substrate. Suction nozzle (14) for handling components is made of stainless steel and has a working face (14a) provided with a hardened layer (14b), or alternatively, suction nozzle (14) may have a suction head (14c) having a working face (14a) made of cemented carbide. Working face (14a) of suction nozzle (14) is refined by polishing as required during the mounting operation.

Abstract: The tool unit for the ultrasonically assisted rotary machining of a workpiece comprises a converter (23) including at least one electroacoustic transducer (22) for generating and transmitting ultrasonic oscillations, a tool (30) that is coupled to the converter, and a holder (21) in which the converter including the transducer is arranged and which is insertable at least partially in the retainer (11) of a tool spindle (10) and connectable thereto by means of a detachable connection (27).

Abstract: The micro titer plates, especially for micro reaction systems used in biotechnology, each have an array of special microstructures, which typically include micro cups and micro channels with different cross-sections. These microstructures are introduced into a preferably borosilicate glass wafer (18) by ultrasonic machining. Individual rectangular micro titer plates (19?) made from borosilicate glass for biotechnology are produced by cutting the structured glass wafer into individual micro titer plates. Particularly arrays of from 10 to 100 of these microstructures are formed in a 6-inch borosilicate glass wafer, in order to facilitate subsequent cutting of the wafer to economically manufacture a corresponding number of these micro titer plates (19?).

Abstract: Planarizing machines and methods for mechanical and/or chemical-mechanical planarization of micro-device workpieces are disclosed herein. In one embodiment, a method for polishing a workpiece includes determining an estimated frequency of serial defects in a workpiece, pressing the workpiece against a polishing pad and moving the workpiece relative to the pad. The method further includes vibrating the workpiece and/or the pad at a frequency that is greater than the estimated frequency of the serial defects. In one aspect of this embodiment, determining the estimated frequency of serial defects can include: determining a relative velocity between the workpiece and the polishing pad; estimating the length of a mark on the workpiece; estimating the time a particle in a planarizing solution is in contact with the workpiece; and estimating the number of cracks in the workpiece.

Abstract: Material is removed from objects to be marked or machined by applying tools having cutouts arranged in a pattern on the objects, filling the cutouts with abrasive particles, pouring a molten metal over the tools to solidify as a backing, and then ultrasonically vibrating the backing to propel the abrasive particles through the cutouts to transfer the pattern to the objects.

Abstract: An apparatus for polishing a substrate with an optical surface. The apparatus contains a polishing pad and and a device for oscillating the polishing pad while simultaneously contacting it with at least 90 percent of said optical surface.

Abstract: A method for machining a component. The method includes providing a machining apparatus configured to induce vibrations such that a vibration direction of the machining apparatus is substantially aligned with respect to a machining direction of the component, and vibrating the machining apparatus in the vibration direction to machine the component in the machining direction.

Abstract: A method and apparatus for improving uniformity of the rate of removal of material from the surface of a workpiece, such as semiconductor substrate, by polishing. In accordance with the invention, the workpiece is subjected to a vibratory polishing method, and optionally at least one additional polishing motion selected from rotational, oscillating, sweeping, orbital and linear polishing motions. As a result, polished workpieces, such as semiconductor wafers, have reduced surface defects, improved planarity, and are polished more uniformly over a wider area.

Abstract: A tool for abrading a workpiece to smooth the surface thereof. The tool has a shank portion and a working portion. The working portion has a smooth and non-abrading surface, with one or more depressions formed therein. Each depression includes an abrading mechanism. The abrading mechanism does not protrude above the smooth surface of the working portion of the tool. During operation, once the workpiece has been smoothed by removal of the raised areas by the abrading mechanism, the smooth surface of the tool engages the workpiece and further abrasion of the workpiece is prevented.

Abstract: The superfinishing apparatus according to the present invention includes a frame 51 for holding the entirety of the apparatus, a cam shaft 52 attached to the frame 51 so as to rotate freely, first and second eccentric cams 53, 54 which are attached to the cam shaft 52 and rotate with a phase difference of 180 degrees therebetween, a first vibrator 55 having a polygonal shape in its section which moves in a sliding manner in accordance with the rotation of the first eccentric cam 53, a second vibrator 57 having a polygonal shape in its section which is disposed so as to oppose to the first vibrator 55 through the cam shaft 52 and moves in a sliding manner in accordance with the rotation of the second eccentric cam 54, air bearings 59, 60 for supporting the first vibrator 55 and the second vibrator 57, and a superfinishing stone 61 attached to the first vibrator 55 or the second vibrator 57.

Abstract: A system and method are disclosed for edge blending hard drive head sliders by oscillating abrasive lapping tape across the edges of multiple sliders simultaneously.

Abstract: A polishing apparatus and a polishing method which can reduce the amount of consumption of the polishing agent and scratches caused on the object to be polished due to an increase of the particle size in the polishing agent. The polishing apparatus has a polishing head which is provided with a polishing agent receiving unit, a holding means for holding an object to be polished in a holding recess, a contact portion which is positioned at the periphery of the holding recess, a feed port for feeding the polishing agent from the polishing agent receiving portion into the closed space, a vibration imparting means for imparting vibration to the polishing agent, and a valve means provided with a valve for opening and closing the feed port.

Abstract: An object such as an electronic device can be favorably lapped by a method composed of preparing a lapping machine having a longitudinal or circular lapping board equipped with a ultrasonic oscillation-applying device which applies elliptical vibration to the lapping board and a supporting means arranged adjacently to the lapping board; placing the object on the lapping board via abrasive grains and further on the supporting means; and activating the ultrasonic oscillation-applying device to apply elliptical vibration to the lapping board whereby the object is caused to rotate on an axis thereof and lapped.

Abstract: A tool for abrading a workpiece to smooth the surface thereof. In one embodiment, the tool is an ultrasonic tip (12) having plural grooves (16) formed in a smooth surface (14) thereof. Each groove (16) includes an abrasive material (24) coating the depression thereof. Rough surface areas of a workpiece projecting into the groove (16) are abraded to thereby result in a smooth workpiece surface. Once the surface roughness of the workpiece has been removed, the smooth areas (14) of the ultrasonic tip (12) are engaged, thereby preventing further abrasion of the workpiece.

Abstract: A linear polisher for polishing a substrate that always provides a fresh abrasive surface for polishing and a method for linear polishing a substrate are described. In the linear polisher, a length of a polishing pad is supported on a pair of rollers which are driven by a motor means for either intermittently or continuously advancing the pad during a polishing process. A vibration generator which is connected to the polishing pad through an adaptor provides lateral, or vibration in a transverse direction of the pad throughout the polishing process. The present invention novel linear polisher enables substantially constant removal rate to be achieved throughout the pad life of a polishing pad without deterioration such as that normally seen in a conventional rotary or linear CMP apparatus. Optionally, a rotatable substrate holder is utilized to further improve the polishing uniformity of the linear polishing apparatus.

Abstract: A polishing apparatus and a polishing method which can reduce the amount of consumption of the polishing agent and scratches caused on the object to be polished due to an increase of the particle size in the polishing agent. The polishing apparatus has a polishing head which is provided with a polishing agent receiving unit, a holding means for holding an object to be polished in a holding recess, a contact portion which is positioned at the periphery of the holding recess, a feed port for feeding the polishing agent from the polishing agent receiving portion into the closed space, a vibration imparting means for imparting vibration to the polishing agent, and a valve means provided with a valve for opening and closing the feed port.

Abstract: Material is removed from objects to be marked or machined by applying apertured masks having cutouts arranged in a pattern on the objects, applying a liquid mixture of abrasive particles over the masks, and then ultrasonically vibrating the mixture to propel the abrasive particles through the cutouts to transfer the pattern to the objects.

Abstract: A ultrasonic vibration cutting tool which can optimize materials as in a separate type and can improve the transmission efficiency of ultrasonic vibration as in an integrated type. The ultrasonic vibration cutting tool comprises a ring-shaped projection and a blade essentially composed of diamond and held by the ring-shaped projection both of which are formed on the peripheral surface of a vibration conversion portion provided on a resonator, and the outer diameter of the blade is set larger than the outer diameter of the ring-shaped projection.

Abstract: A honing means produces sonic waves that suspend and propel a honing medium against a surface of a substrate. The honing medium impinges on the surface of the substrate and alters the substrate's surface roughness. The substrate and the honing means are positioned relative to each other to ensure substantial surface roughness uniformity.

Abstract: The invention relates to a method and machine for so-called “ultrasonic” peening employing a mist of microbeads inside an active chamber 30c for peening parts 21 on a wheel 19, ie blades on a rotator. The periphery of the wheel 19 is brought simultaneously past the openings of at least three chambers with limited clearances E1 and E2. At least one chamber being active with a peening mist of microbeads and at least two chambers, either side of the active chamber, being passive. The wheel being rotated over the chambers and the microbeads are removed from the passive chambers and in that the active chambers are supplied with microbeads therefrom.

Abstract: An apparatus of this invention for supplying an abrasive for use in the manufacture of semiconductors comprises a storage tank of the abrasive and a supply line for guiding the abrasive from the storage tank to a nozzle for supplying the abrasive to an object to be polished and said storage tank or supply line is provided with a device for furnishing ultrasonic wave to sonicate the abrasive. A process of this invention for supplying an abrasive for use in the manufacture of semiconductors comprises sonicating the abrasive by ultrasonic wave before supplying it to an object to be polished. The apparatus and process of this invention for supplying an abrasive for use in the manufacture of semiconductors make it possible to supply an abrasive containing a minimized amount of abnormally agglomerated particles to the surface of an object to be polished in the manufacturing step of semiconductors and improve the yield of polished products.

Abstract: The present invention provides a CMP device with a pressure-controlling mechanism comprising a rotating polishing plate, a slurry supplying system for supplying slurry, a rotating carrier that holds and rotates a silicon wafer such that the wafer surface is polished against the rotating polishing plate and the slurry during a CMP process, and a pressure-controlling mechanism capable of exerting different pressures to different locations on the wafer in response to different polishing rates corresponding to each of the specified locations. By utilizing the CMP device according to the present invention, the polishing rate and finish quality at different locations of the silicon wafer will be more uniform, which in turn contributes to an improved wafer planarizing effect.

Abstract: An ultrasonic vibration cutting method comprising mounting and fixing a part to be cut on a mounting table, moving down an ultrasonic vibration rotation unit, stopping the downward movement of the ultrasonic vibration rotation unit when the cutting blade of the ultrasonic vibration rotation unit reaches a position for cutting the part, moving the ultrasonic vibration rotation unit linearly for cutting, and turning and vibrating the cutting blade with ultrasonic waves to cut the part.

Abstract: The invention relates to a workhead for mechanical working of materials. This invention is directed to metal working machines and is adaptable for use in the mechanical working of metals and plastics, involving the use of liquid lubricants and/or coolants. The technical result achieved by implementing the invention comprises an improvement in the efficiency of the cavitation treatment of a liquid lubricant and/or coolant, which secures the dispersion of a solid lubrication in aqueous solutions, an increase in the stability of water-in-oil emulsions, decomposition of a liquid lubricant and/or coolant and a decrease of viscosity, an improvement in corrosion resistance, reduction in a tool wear and, simultaneously, an improvement in the quality of a working surface. The apparatus comprises a housing (1), inside which is fitted a main oscillator (2), to which is connected a tool (4) through the intermediary of an extension piece (3).