Abstract: A method of machining flat parts, includes the use of two permanent magnets which are located opposite to and spaced from one another so as to form a magnetic field with a magnetic flux extending perpendicular to the magnets, placing a flat part in the magnetic field between the magnets so that the magnetic flux extends through the flat part, supplying a magnetic-abrasive powder to the flat part in the magnetic field, and performing a relative movement between at least one of the magnets and the flat part so as to remove a material from a surface of the flat part.

Abstract: Vibrating and oscillating rates can be dynamically changed during polishing to achieve an optimal polishing process. A semiconductor device substrate (34) has a first layer with a first film (12) and a second film (10) that overlies the first film (12), where the first film (12) is harder and underlies the second film (10). In one embodiment, the substrate (34) is placed over a first region (66) of a polishing pad (60). The second film (10) is polished at a first vibrating and oscillating rates over the first region (66). An endpoint signal is received when the first film (12) is reached. The substrate (34) is moved to a second region (62) of the polishing pad (60) that is closer to the edge of the pad and has a higher feature density compared to the first region (66). Polishing is performed at a second vibrating and oscillating rates that are different from the first vibrating and oscillating rates to remove the first film (10).

Abstract: The invention provides a NC unit provided with an ultrasonically oscillating tool, capable of indenting pits at equal pitches and detecting an amount of wastage of a stylus. In the NC unit, a PLL circuit outputs an ultrasonic signal S at a frequency equivalent to the resonant frequency of the ultrasonically oscillating tool and the frequency of the output signal S undergoes changes following up any change in the resonant frequency due to wear and tear of the stylus. Accordingly, the frequency of the output signal S has a value corresponding to the amount of wastage of the stylus. A frequency detection circuit 40 detects the frequency of the output signal S, and delivers data indicating the frequency to a CPU. When applying a process for indenting pits at equal pitches, the CPU changes over a synchronizing/changeover circuit so as to deliver the output signal S from the PLL circuit to an interpolative operation circuit.

Abstract: An ultrasonic vibration composite processing tool is disclosed wherein at least one small-sized processing member is arranged for carrying out processing of a processed material while applying vibration to the processed material, to thereby ensure stable operation of the processing tool to accomplish efficient processing of the processed material even when the processed material is large-sized. A processing structure and a vibration structure are arranged. The processing structure includes a rotatable base having a rotation axis and at least one processing member including a micro-cutting surface. The processing member is arranged on one surface of the base so as to be positioned in a circumferential direction of the base about the rotation axis of the base. The vibration structure functions to vibrate the processing member in directions of the processed material.

Abstract: An ultrasonic vibration composite grinding tool is disclosed wherein a plurality of small-sized grinding wheels are arranged for carrying out grinding of a ground material while applying vibration to the ground material, to thereby ensure stable operation of the grinding tool to accomplish efficient grinding of the ground material even when the ground material is large-sized. A grinding structure and a vibration structure are arranged. The grinding structure includes a rotatable base having a rotation axis and a plurality of grinding wheels formed into the same configuration and each including a micro-cutting surface. The grinding wheels are arranged on one surface of the base in a manner to be spaced from each other at predetermined intervals in a circumferential direction of the base about the rotation axis of the base. The vibration structure functions to vibrate the grinding wheels.

Abstract: A method and apparatus for texturing the air bearing surface (ABS) of a magnetic head of a hard disk drive includes juxtaposing the ABS with an ultrasonically-driven sonitrode having a diamond die end. An alumina slurry is disposed between the sonitrode and ABS at a slight pressure, with the slurry having a grit size of less than one micron. The sonitrode is then vibrated to agitate the slurry and thereby texture the head. If desired, a cavity can be formed in the die, with the cavity being a mirror image of a portion of the head, e.g., the sensing element, that is not intended to be textured.

Abstract: A lower side of a rotatable grindstone spindle is connected directly to a PZT (Piezoelectric element). By changing electric drive supplied to the PZT, reciprocating movement can be applied to the grindstone through the grindstone spindle in addition to rotational movement. As a result, the grinding locus of an abrasive grain of the grindstone on a taper surface of a workpiece becomes a sine wave, and therefore, the grinding locus can be shifted in a direction other than in a peripheral direction. In this way, the removed amount of the taper surface increases, and circularity of the taper surface can be made to equal to 0.3 .mu.m or less.

Abstract: A pad conditioner for a chemical mechanical polishing (CMP) apparatus which is adapted to remove a glazing phenomenon occurring on a polishing pad when wafers are machined using the CMP apparatus. The pad conditioner includes a swing arm pivotally mounted at one end thereof to a desired portion of the upper surface of the chemical mechanical polishing apparatus by a pivot shaft, a rotating oscillator coupled to the other end of the swing arm and adapted to horizontally rotate a conditioning tool mounted thereto while vertically oscillating the conditioning tool, the rotating oscillator including a rotating unit for horizontally rotating the conditioning tool and an oscillation generating unit for vertically oscillating the conditioning tool, and a vertical carrier unit coupled to the other end of the swing arm and adapted to vertically move the rotating oscillator.

Abstract: A method of cleaning a solid surface which is particularly effective for a surface having a complicated structure including slots and holes comprises immersing the solid surface in a cleaning slurry comprising a cleaning liquid and abrasive particles which are soluble in the cleaning liquid, the cleaning liquid comprising a saturated solution so as to greatly reduce the dissolution of the abrasive particles in the cleaning liquid.

Abstract: A shaped article, specifically an artificial tooth, is made of two parts. individually shaped first part 18, specifically the head part or superstructure of the artificial tooth, has a standardized locking portion 26 for engagement with a standardized counter-locking portion 24 provided on a pre-fabricated second part 16, specifically the shaft part of the tooth to be implanted in a patient's jaw. The individually shaped part 18 is manufactured by using a pre-fabricated sonotrode 38 for producing the configuration of the locking portion 26 and one or more individually produced shaping sonotrodes 44 are used for generating the parts of the surface other than the locking portion 26. This permits the individually shaped part to be produced in an economic way yet with high precision of the locking portion.

Abstract: A workpiece to be ground is immersed in a processing solution with abrasive grains suspended therein. The processing solution is contained in an ultrasonic processing tank equipped with an ultrasonic vibrator. Ultrasonic energy is radiated from said ultrasonic vibrator into said processing solution to ground surfaces of the workpiece. The processing solution is drawn from the ultrasonic processing tank, cooled to a temperature lower than a boiling point thereof, deaerated, and then returned to the ultrasonic processing tank.

Abstract: A manual tool for removing material from brittle and/or non-ductile stock includes a housing (1) with a drive unit (2) for a tool bit (3) located within the housing (1). The tool bit is arranged to be rotated by the drive unit (3) about the bit axis. In addition, an electro-acoustic converter (4) for producing ultrasonic vibrations and a vibration amplifier (5) are positioned within the housing for superimposing ultrasonic vibrations on the rotational action of the tool bit during operation on the manual tool.

Abstract: A finishing machine for internal spline tooth surfaces which comprises a holding device for holding a work having the internal spline tooth surfaces, a grinding stone having a plurality of tooth portions for simultaneously processing a plurality of tooth portions in the work, and a vibrating device for vibrating the grinding stone with a high speed in the axial direction of the work.

Abstract: There is provided a chemical-mechanical polishing method and apparatus ensuring excellent polishing rate and flattening characteristics for flattening level different areas on interlayer insulating film generated in the manufacturing process of a semiconductor device. Polishing is performed while ultrasonic wave vibration is being applied to a processing substrate. The ultrasonic wave vibration applying means are mounted on the carrier and platen. Thereby, since polishing is performed while using the ultrasonic wave energy in addition to the conventional chemical-mechanical polishing method, polishing rate can be much improved. Moreover, since the slurry is supplied sufficiently without relation to pattern density and areas of the level different areas, uniform and flat surface not depending on the pattern can be obtained.

Abstract: The invention relates to an apparatus and process for machining a rotating workpiece by means of rotary ultrasonic grinding. The apparatus performs rotary ultrasonic grinding by rotating and vibrating a surface finishing tool in contact with a rotating workpiece. The rotary ultrasonic grinding process is a hybridized method which comprises a combination of conventional ultrasonic machining and diamond grinding. Important parameters in one embodiment of the process include ultrasonic vibration amplitude and frequency, static pressure or force, tool rotation speed, workpiece rotation speed, grit size, grit concentration, abrasive type, and bond type.

Abstract: A method of making a microstructural shaped article from a high hardness substrate workpiece, in which an energy-transmissive shaping member is secured in energy-transmissive relationship to an energy source, and the substrate workpiece is positioned in alignment therewith. A fine grain slurry of solid particles is provided between the energy-transmissive shaping member and the substrate, and the substrate workpiece is milled by the energy-transmissive shaping member in compressive bearing relationship to the substrate through the fine grain slurry of solid particles, for sufficient time to form the desired shape in the substrate workpiece. A reusable, tribologically enhanced die is also described, for use in the method of the invention. The energy source may be an electroacoustic energy source or an electric power energy source. The non-etched microstructural articles of the invention include knives, saws, and other instruments useful for ocular and other surgical applications.

Abstract: An apparatus producing an aperture through a workpiece of brittle material such as ceramic or glass which includes a piezo electric transducer to generate longitudinal vibrations at a frequency within the range 20-40 kHz, and transmit the vibrations to a tip adapted to contact the workpiece. Additionally a motor generates small amplitude movements of the tip at a frequency in the range of 10-100 Hz in a plane transverse to the direction of the longitudinal vibrations.

Abstract: A carriage 3 is movable in a feed direction A on guideways 1, and carries an ultrasonic machining device 4, 5 loaded with an adjustable force in the feed direction by a first fluid cylinder 7. A cylinder 15 is attached to the carriage, around which is looped 16 a rope 17. One end 18 of the rope is preloaded by spring 20 against a stop 21 which is attached to a frame 2. The other end 22 of the rope is attached to the piston rod 24 of a second cylinder 25. By means of the second cylinder the tool 5 can be lifted or retracted from the workpiece 6 during the machining operation, independently of the position of the carriage. After the tool has been lifted off, the tool touches down gently again on a renewed abrasive layer.

Abstract: A method is disclosed for grinding and polishing a substrate (20). An abrasive slurry (26) is applied to the surface (22) of the substrate (20). A lap (28) is moved across, and in engagement with, the surface of the substrate (20) in the medium of the abrasive slurry (26). Ultrasonic energy is mechanically applied to the surface (24) of the substrate such that half wave resonance occurs substantially at the surface (22) of the substrate (20). In this manner, a thickness of material is removed at an enhanced rate from the surface (22) of the substrate (20).

Abstract: In a device for grinding workpieces, in particular workpieces made of ceramic materials, by means of a grinding wheel (24) or the like, the workpiece (23) is oscillated transversely to the machining direction during grinding. At least one ultrasonic transducer (1), whose ultrasonic energy is used as exciting energy for the workpiece (23), is provided as a device (20) for generating the oscillating movement of the workpiece (23). An ultrasonic resonance space (2,4) for amplitude transformation is provided between the ultrasonic transducer (1) and a sonotrode (5) which transmits the vibration to the workpiece (23).

Abstract: In a process and apparatus for the overall machining of a ceramic tooth restoration and producing of appropriate sonotrode crowns, these sonotrode crowns act on a workpiece one after the other, however from the same direction in space and are activated by the same ultrasonic transmitter. For the production of said sonotrode crowns, a geometrical model corresponding to the ultrasonic machining apparatus is used.

Abstract: A method of machining a complex pattern into the air bearing surface of a magnetic head slider includes the steps of forming a die with a diamond surface which has a pattern which is a reverse image of the desired pattern for the surface of the slider; placing the die with the pattern of the die facing the surface of the slider; placing an abrasive slurry between the die and the surface of the slider; applying a pressure between the die and the surface of the slider; and ultrasonically vibrating the die and the slider reciprocally with respect to one another to cause the abrasive slurry to grind the desired pattern into the surface of the slider.

Abstract: An apparatus for forming input and output electrodes on the outer peripheral surface of a dielectric block coated with an electrically conductive film includes a holder for holding the block, a cutting tool with cutting surfaces, and a compression pump. Mobile tables supporting the holder and the cutting tool are controlled to cause the cutting surfaces to come in contact with a specified area on the outer peripheral surface of the block. Cutting water mixed with abrasive grains is projected by the compression pump onto the specified area, and ultrasonic vibrations generated by a vibration generator and amplified by an amplifier horn are transmitted to the cutter, causing a portion of the conductive film to be removed from a frame-shaped area, leaving an isolated piece of the conductive film separated from the remainder of the film to serve as an electrode.

Abstract: An ultrasonic machining device 10 is attached to a movable carriage 3, and has a borehole 11 to whose free end a differential screw 14 is threaded. To clamp a tool 20, first the device is returned to a neutral position whereat a wrench 25, which is mounted stationarily in a frame 2, engages the differential screw which rests on a shoulder of the wrench with low prestress. The wrench is then rotated until the screw projects a specific amount beyond the end of the device. The tool is then threaded onto the screw until it abuts the device 10, and finally the screw is tightened by a pneumatic cylinder 32.

Abstract: A method for polishing a slight region of the surface of a workpiece utilizes an actuator or actuators having piezoelectric elements. The actuators cause slight movement of a polishing portion disposed at the leading end of a polishing tool in an XY-direction parallel with the surface of the workpiece and/or a Z-direction perpendicular to the surface of the workpiece. A polishing material, including a magnetic fluid and nonmagnetic abrasive grains dispersed in the magnetic fluid, is held magnetically in a space between the polishing portion and the workpiece.

Abstract: An ultrasonic tool (13) is set into rotational movement to increase the performance of material removal. In addition, a magnetostrictive or piezoelectrical transducer (2) is used, which is coupled to a transformer (7) for amplification of the output amplitude. To lessen the constructional length, transducer and transformer are slid into each other in such a way that their constructional lengths at least partly overlap. Apart from that, transducer and transformer form a rotor which is mounted in non-contact bearings. With a device of this kind, optimal running trueness can be attained.

Abstract: It is an object of the present invention to provide a circuit board trimming apparatus and method used, in which apparatus and method a wiring pattern on a printed circuit board is trimmed, and to provide a circuit board trimming apparatus and method, in which apparatus and method a wiring pattern is trimmed efficiently while damage to the circuit board is minimized.A force exerted by a cutter against the circuit board is measured when the wiring pattern is cut by pressing an ultrasonic cutter against the wiring pattern on the circuit board and by moving the circuit board and the cutter relative to each other, a shape of the wiring pattern being determined on the basis of the force thus measured and a cutting process being controlled in accordance with the shape of the wiring pattern.