Abstract: A method for machining a workpiece to provide a toothed member having a desired tooth pattern. The workpiece is machined to a first depth using a cutting tool, thereby forming a semi-finished tooth pattern, the first depth less than a full depth to which the workpiece is to be machined to provide the desired tooth pattern. Dimensions of the semi-finished tooth pattern are acquired and compared to nominal dimensions. If the acquired dimensions are not within a tolerance of the nominal dimensions, the geometry of the cutting tool is modified for correcting deviations of the acquired dimensions from tolerance and the workpiece further machined by the modified cutting tool. Once the dimensions of the semi-finished tooth pattern are within tolerance, the workpiece is machined to the full depth for providing the desired tooth pattern.

Abstract: An air tool monitoring apparatus includes a housing having a hollow chamber formed therein, and also having an inlet and an outlet formed therein, each of the inlet and an outlet in communication with the chamber. The apparatus also includes first and second sensors for sensing condition indicative of tool usage and wear, a battery disposed in the housing, a generator for recharging the battery, and a microprocessor operatively connected to the housing and including a timer, a memory storage module, and a unique identifier. The apparatus may include a baffle for guiding air past the generator. The apparatus further includes a switch for starting and stopping the timer, and a communication device for sending data from the microprocessor to a data collection device. Methods of using the apparatus, along with systems for monitoring and reporting on usage of multiple air tools equipped with the apparatus, are also described.

Abstract: The present invention relates to a polishing pad which is characterized in that it has a polishing layer of rubber A-type microhardness at least 80° and a cushioning layer of bulk modulus at least 40 MPa and tensile modulus in the range 0.1 MPa to 20 MPa, and to a polishing device which is characterized in that a semiconductor substrate is fixed to the polishing head, and an aforesaid polishing pad is fixed to the polishing platen so that the polishing layer faces the semiconductor substrate, and by rotating the aforesaid polishing head or the polishing platen, or both, the semiconductor substrate is polished.

Abstract: A sizing and finishing machine includes a mechanism for rotating an associated workpiece and a first microfinishing belt for selectively contacting the associated workpiece. The belt has a maximum grit size of 60 microns. A structure is provided for rotatably holding the first microfinishing belt and a housing is provided on which the structure is mounted. A mechanism moves the first housing and hence the first microfinishing belt toward and away from the associated workpiece. The mechanism is timed to the rotation of the associated workpiece to maintain a substantially constant pressure of the first microfinishing belt on the associated workpiece. If desired, a second microfinishing belt mounted separately on a second housing can be provided with the two housings and their respective belts being separately controlled. The force exerted by the microfinishing belt on the associated workpiece is limited to a pressure of less than approximately 25 psi.

Abstract: A grinding machine for grinding a wafer includes a pressure sensing grinding wheel having a disk portion, an annular portion depending from the disk portion that includes a plurality of cavities, a grinding tooth disposed in each cavity, and a pressure sensor disposed in each cavity between the tooth and the disk portion. The pressure sensor provides a signal indicative of the pressure applied by the grinding wheel against the wafer to a controller. Based on the signal received, the controller provides control signals to the drive motor and to a feed rate mechanism to maintain optimum grinding action. A method for grinding a wafer includes the steps of receiving a pressure signal from the grinding wheel and changing the feed rate in response to the pressure signal. The controller can also receive, and use for control purposes, additional inputs indicative of the current draw of a drive motor and of the rotational speed of a spindle shaft attached to the grinding wheel.

Abstract: A grinding machine for grinding eyeglass lenses includes at least one grinding wheel rotatably mounted on a chassis. A carriage is pivoted to the chassis to pivot about an axis parallel to the rotation axis of the grinding wheel. A support spindle is rotatably mounted on the carriage to rotate about an axis also parallel to the rotation axis of the grinding wheel and which is adapted to receive axially the lens to be ground and a template. A feeler in vertical alignment with the template is mounted on the chassis so that it is movable transversely relative to the pivot axis of the carriage. The feeler comprises a rigid pad and a tactile sensor appropriately attached to the rigid pad, at the surface thereof.