Abstract: A method of grinding a surface of a workpiece that has surface irregularities includes a first grinding step of grinding the surface of the workpiece by a predetermined amount of stock removal while keeping a measuring element of a height gauge out of contact with the surface of the workpiece, thereafter, a height difference measuring step of bringing the measuring element of the height gauge into contact with the surface of the workpiece and measuring a height difference of surface irregularities on the surface of the workpiece with the height gauge, and a second grinding step of, if the measured height difference is larger than a preset range, grinding the surface of the workpiece while keeping the measuring element of the height gauge in contact with the surface of the workpiece until the measured height difference falls within the preset range.
Abstract: A method of cleaning a probe card with probe pins contaminated by testing residue. A cleaning wafer is provided and the uneven surface and the grooves thereon are used to polish surfaces of the probe pins. Two kinds of cleaning operations, which utilize smaller and larger accelerations driving the cleaning wafer, are performed. The cleaning operations utilizing the smaller acceleration are used to polish the surfaces of the probe pins and the cleaning operations utilizing the larger acceleration are used to smooth the uneven surfaces of the probe pins after the former polishing operations. In addition, the cleaning wafer is rotated by various rotation angles to obtain superior cleaning.
Abstract: A positioning jig which is applied to a spray polishing device which sprays a polishing liquid to a material to be polished and polishes the material to be polished, determines a relative position of a material to be polished and a polishing liquid spraying nozzle.
Abstract: A conditioner including abrasive elements for conditioning a polishing pad to be used in abrasive semiconductor substrate treatment processes, such as chemical-mechanical polishing or chemical-mechanical planarization processes. The abrasive elements are formed from a material that may be degraded or dissolved by at least one chemical that will not substantially degrade or dissolve a material of the polishing pad. The abrasive elements of the conditioner may be degraded or dissolved in at least one chemical that will not substantially degrade or dissolve a material of the polishing pad. Any residue or particles of, or from, the abrasive elements that stick to or become embedded in the polishing pad are removed therefrom by exposing the polishing pad to the at least one chemical so as to degrade or dissolve the residue or particles without substantially degrading or dissolving a material of the polishing pad.
Abstract: A grinding wheel and a method for grinding bar blade for the production of spiral gear teeth are described. For economical grinding of such bar blades the grinding wheel has a conical grinding surface (Pp) widening from a small diameter (d1) to a large diameter (d2), a cylindrical grinding surface (Ps) adjoining the conical grinding surface (Pp), and a toroidal grinding surface (G) adjoining the cylindrical grinding surface (Ps). The grinding wheel embodied in this manner enables profile grinding (rough grinding) and subsequent generating grinding (finish grinding) of the surfaces of the bar blade without the necessity of remounting the blade. For practical purposes the grinding wheel rotates about a stationary axis (S), and the bar blade to be ground is guided along the grinding wheel [(12)] at appropriately set angles.