Rocking Patents (Class 451/276)
  • Patent number: 10857570
    Abstract: An upper spin chuck and a lower spin chuck are arranged in a vertical direction. In the lower spin chuck, a substrate holder sucks a center portion of a lower surface of a substrate, so that the substrate is held. In this state, a peripheral portion of the lower surface of the substrate rotated by a spin motor is cleaned by a brush of a first back surface cleaning mechanism. In the upper spin chuck, a plurality of chuck pins abut against an outer peripheral end of the substrate, so that the substrate is held. In this state, a region inward of the peripheral portion of the lower surface of the substrate rotated by the spin motor is cleaned by a brush of a second back surface cleaning mechanism. Receiving and transferring of the substrate are performed by a receiving transferring mechanism between the upper and the lower spin chucks.
    Type: Grant
    Filed: February 11, 2016
    Date of Patent: December 8, 2020
    Assignee: SCREEN Holding Co., Ltd.
    Inventor: Koji Nishiyama
  • Patent number: 10717505
    Abstract: A system and process is provided to deplete or remove moisture from wood coring in boats by piercing 20 a fiberglass outer skin; forming 30 bores or holes 200 in wood coring to form an exposed portion; processing ambient air 35 to create processed air; pumping or displacing 40 processed air into the bores or holes 200; penetrating 50 an exposed portion 80; with a sealant 100; and filling 60 the exposed portion 80 with a sealant 100.
    Type: Grant
    Filed: August 31, 2016
    Date of Patent: July 21, 2020
    Inventors: Scott Richmond, Jon Bartnick
  • Patent number: 7524236
    Abstract: A tool sharpener accessory having a base mounted on a support, a pivoting member pivotally mounted on the base and pivoting in at least a seesaw motion relative to the base, the pivoting ember having an axis of rotation adaptable for extending transverse to the axis of rotation of the grinding stone, and a securing mechanism for securing the tool to the pivoting member.
    Type: Grant
    Filed: February 21, 2007
    Date of Patent: April 28, 2009
    Assignee: WMH Tool Group, Inc.
    Inventors: Barry Martin Schwaiger, John Robert Arne
  • Patent number: 7118466
    Abstract: The scissor sharpening machine includes a honing disc with a curved blade guide and a blade clamp assembly which slides axially along the blade guide. The curvature of the blade guide corresponds to the conventional curvature along the lengths of the blades of a pair of high quality scissors or shears, and assures that they are sharpened properly. The blade clamp assembly includes a series of predetermined stops to set the proper bevel angle during the sharpening process. However, the blade may be rocked about its longitudinal axis to the limit set by the stop, in order to provide a convex curvature to the blade edge if so required. The apparatus may include a cabinet with motor controls and other components, and the blade guide and blade clamp assemblies may be adjusted and repositioned to allow sharpening of either left hand or right hand scissors and shears.
    Type: Grant
    Filed: November 23, 2005
    Date of Patent: October 10, 2006
    Inventor: W. L. Laney
  • Patent number: 6767275
    Abstract: To provide an apparatus that may impart a complicated bend deformation to an object to be machined such as a ceramic bar elongated in one direction or the like, and may reduce the non-uniformity in machining amount of the object to be machined upon the machining work of the object to be machined, specifically a correcting mechanism for deforming the object to be machined together with a jig holding the object to be machined is provided in a machining apparatus. The correcting mechanism includes a base, a plurality of levers provided at first ends with pins, a shaft fixed to the base for rotatably supporting the levers, and a plurality of correcting drive means coupled to second ends of said levers for pivoting the levers to the shaft to thereby pivoting the pins.
    Type: Grant
    Filed: February 22, 2001
    Date of Patent: July 27, 2004
    Assignee: TDK Corporation
    Inventors: Hiroshi Shindou, Masahiro Sasaki, Akio Ogawa, Tetsuo Abe, Masaki Kouzu, Masao Yamaguchi
  • Patent number: 6623336
    Abstract: When electric elements are formed on a ceramic bar or the like, the positional displacement of the respective elements occurs due to a division exposing process or the like. An object of the present invention is to provide a device and a method which unify the non-polished portion of the respective elements by conducting polishing while a complicated deformation or the like is given to the ceramic bar. To achieve this object, the ceramic bar or like is held by using a jig, and a plurality of loads are applied to portions of the jig where the ceramic bar or the like is held, to thereby deform the ceramic bar or the like and polish the element in that state. In this situation the load applied points are disposed so as to avoid the boundaries of the division exposure.
    Type: Grant
    Filed: February 21, 2001
    Date of Patent: September 23, 2003
    Assignee: TDK Corporation
    Inventors: Hiroshi Shindou, Masahiro Sasaki, Akio Ogawa, Tetsuo Abe, Masaki Kouzu, Masao Yamaguchi
  • Patent number: 6565414
    Abstract: In the polishing work for forming a crown shape on a ceramic bar bearing a plurality of conversion units for the magnetic heads, the present invention is to provide a well-controlled satisfactory shape by pressing the ceramic bar, provided with plural grooves perpendicular to the longitudinal direction and on a surface opposed to the polished plane, to a substantially concave polishing plane through an elastic member principally composed of rubber, then measuring the magneto resistivity of an element provided in the conversion unit of the magnetic head, and adjusting the pressure at the crown forming operation by a closed loop control based on the result of such measurement.
    Type: Grant
    Filed: December 11, 2000
    Date of Patent: May 20, 2003
    Assignee: TDK Corporation
    Inventors: Tetsuo Abe, Akio Ogawa, Tsugihiro Hasebe, Hiroshi Shindou, Osamu Fukuroi
  • Patent number: 5993296
    Abstract: A tool quill for carrying out superfinish polishing of a fuel injector needle tip to insure proper sealing of a fuel injector has a universal joint which allows tilting of a polishing stone during the finishing operation to accommodate slight positioning errors between the stone and needle tip and their axes of rotation. Slight tilting movements occur against an elastic straightening force exerted on the universal joint to insure constant polishing pressure, which in turn insures accurate shaping of the polished tip surface.
    Type: Grant
    Filed: June 30, 1998
    Date of Patent: November 30, 1999
    Assignee: Siemens Automotive Corporation
    Inventor: William June Rogers
  • Patent number: 5762536
    Abstract: A technique for utilizing sensors to monitor the polishing of a semiconductor wafer when a linear polisher is utilized to polish the wafer. The sensors are distributed along the surface or are coupled to openings along the surface to monitor the on-going polishing process. The sensed information from the sensors are processed in order to provide feedback for compensating the fluid dispensing when fluid platens are used and/or the downforce exerted by the wafer carrier.
    Type: Grant
    Filed: February 6, 1997
    Date of Patent: June 9, 1998
    Assignee: Lam Research Corporation
    Inventors: Anil K. Pant, Joseph R. Breivogel, Douglas W. Young, Rahul Jairath, Erik H. Engdahl
  • Patent number: 5644949
    Abstract: A cam having a front surface and a rear surface to reciprocate a double-headed piston of a compressor twice for every rotation of a drive shaft. A positioner is provided on the front and rear surface of the cam to position the cam on a fixture used for grinding of cam surfaces. The cam surfaces are formed by grinding the front and rear surface of the cam into a convex shape with the cam positioned to the fixture by the positioner. The front cam surface and the rear cam surface have identical shapes and their phases are offset by a predetermined angle with respect to one another. The positioner is arranged at the same position on the front and rear surfaces of the cam with respect to the cam shape.
    Type: Grant
    Filed: January 3, 1996
    Date of Patent: July 8, 1997
    Assignee: Kabushiki Kaisha Toyoda Jidoshokki Seisakusho
    Inventors: Kazuo Murakami, Kazuo Awamura, Shinya Saito
  • Patent number: 5591071
    Abstract: A polishing device includes a rotatable first column vertically provided at the lateral side of a surface table. A second column engages the first column so as to be able to be moved up and down by a lifting drive (air cylinder). The second column is provided with an arm, to which a polishing head is fitted. The surface table, first column and polishing head are driven by directly connected or built-in motors M1, M2 and M3.
    Type: Grant
    Filed: October 24, 1994
    Date of Patent: January 7, 1997
    Assignee: Toshiba Kikai Kabushiki Kaisha
    Inventors: Shoichi Shin, Masafumi Tsunada, Yasuhiko Nagakura, Toshio Oishi
  • Patent number: 5443416
    Abstract: Device and method are described that reduce the force needed to release a wafer from a wet polishing surface after polishing. Device comprises attachment, such as a wafer carrier, adapted to be mounted to a polishing apparatus to permit attachment surface, configured to mate with two regions of the wafer, to tilt relative to polishing surface. Means for defining adhesive force between attachment surface and one of the two wafer regions, and means for defining adhesive force between attachment surface and other of the two wafer regions which is different than that defined between attachment surface and the one wafer region so as to cause a non-parallel relationship between the one wafer face and polishing surface, are provided. Unbalanced force, such as a vacuum force communicated to a limited region of the surface of the carrier, causes a non-parallel relationship between wafer and polishing pad and facilitates separation and lifting of wafer from polishing surface.
    Type: Grant
    Filed: September 9, 1993
    Date of Patent: August 22, 1995
    Assignee: Cybeq Systems Incorporated
    Inventors: Konstantine Volodarsky, Jiro Kajiwara, Herbert W. Owens, Jr., Jan H. King
  • Patent number: RE41329
    Abstract: To provide an apparatus that may impart a complicated bend deformation to an object to be machined such as a ceramic bar elongated in one direction or the like, and may reduce the non-uniformity in machining amount of the object to be machined upon the machining work of the object to be machined, specifically a correcting mechanism for deforming the object to be machined together with a jig holding the object to be machined is provided in a machining apparatus. The correcting mechanism includes a base, a plurality of levers provided at first ends with pins, a shaft fixed to the base for rotatably supporting the levers, and a plurality of correcting drive means coupled to second ends of said levers for pivoting the levers to the shaft to thereby pivoting the pins.
    Type: Grant
    Filed: July 27, 2006
    Date of Patent: May 11, 2010
    Assignee: TDK Corporation
    Inventors: Hiroshi Shindou, Masahiro Sasaki, Akio Ogawa, Tetsuo Abe, Masaki Kouzu, Masao Yamaguchi