Abstract: The invention relates to a polishing device (1) for polishing a metal product (2), in particular a continuously cast slab, billet, or block. The aim of the invention is to achieve a high polishing rate when said metal products are polished. According to the invention, this is achieved in that the polishing device (1) has at least two polishing assemblies (3, 4), each polishing assembly (3, 4) having a mounting (5, 6) for a polishing unit (7, 8). A polishing unit has at least one polishing disk (9, 10) and a driving motor (11, 12) that drives the polishing disk (9, 10). The polishing disks (9, 10)arranged such that the rotational axes (A, B) of said disks run parallel to each other.

Abstract: A system of polishing a concave surface of an external piece for a timepiece, including a securing device including a support that carries the piece, and a grinding device including an abrasive mechanism rotatably mounted along a first axis and configured to polish the piece along a first curvature. The securing device further includes a moving mechanism of the support so that the support imparts a back-and-forth motion along a second axis and a contact surface of the abrasive mechanism is curved to polish the piece along a second curvature in addition to the first curvature. The system can be applied to the field of crystals for a timepiece.

Abstract: Embodiments of the invention comprise a machine adapted for polishing work pieces such as large silicon wafers. A wafer polishing machine in accord with the invention comprises a rotatable platen in a table base, above which is mounted a lid having a head moving assembly with four synchronously rotatable head assemblies. A motor and linkage connected to the head moving assembly imparts reciprocating linear motion to the head assemblies in a selected direction in a plane parallel to an upper surface of the platen. Embodiments of the invention produce a complex relative motion between a surface of a wafer to be polished and the platen. The complex relative motion, resulting from a combination of motions including rotation of the platen, rotation of the head assemblies, and translation of the head moving assembly, improves a uniformity of polish and a rate of polishing compared to wafer polishing machines known in the art.

Abstract: A polishing method, a polishing pad, and a polishing system are described. The polishing pad with a plurality of grooves is provided. The width of each groove is W and the pitch between two adjacent grooves is P. An oscillatory movement distance of a workpiece on the polishing pad is set. The oscillatory movement distance enables any particular point on the workpiece to cross the same number of grooves, when a direction between the particular point and the center of the workpiece is perpendicular to a tangential direction of the grooves. The workpiece is then polished with the oscillatory movement distance, so as to achieve a better polishing uniformity for the surface of the workpiece.

Abstract: A compound chamfering device that manufactures prism-shaped ingot blocks of excellent surface smoothness is disclosed. The four-corner round surfaces and the four sides of a prism-shaped ingot obtained by using a pair of rotary blades of a slicer to perform four-side peeloff of a cylindrical ingot block are chamfered by rough grinding with a pair of cup wheel type rough grinding grindstones. A pair of cup wheel type finishing grinding grindstones are used to chamfering by finishing grinding the four-corner round surfaces and the four sides of the block.

Abstract: A shaping apparatus for shaping a flotation core includes a worktable. At least one support is adjustably mounted on the worktable to be adjustable at least along a z-axis and configured to support the core. At least one engagement mechanism is mounted on the worktable and is displaceable relative to the worktable to engage and retain the core in position on the worktable. A gantry supports a rotary shaping machine so that a tool of the machine rotates in a y-z plane. The worktable and the gantry are displaceable relative to each other along x-, y- and z-axes. A displacement mechanism displaces the worktable and the gantry relative to each other on receipt of suitable control signals.

Abstract: A system and method for producing micro-texture on a slider substrate using chemical & mechanical polishing techniques is described. In certain embodiments of the present invention, this is accomplished by a method comprising formulating an abrasive slurry solution of predetermined acidity (or pH value), treating a chemical mechanical polishing pad with the abrasive slurry, disposing magnetic heads on the chemical mechanical polishing pad and lapping and grinding the magnetic heads for a predetermined period of time. In certain embodiment of the present invention the lapping and grinding of the magnetic heads are accomplished using an apparatus comprising an abrasive slurry solution of predetermined acidity (pH value), a chemical mechanical polishing pad treated with the abrasive slurry solution, wherein the magnetic heads are attached to a fixture capable of disposing the heads on the chemical mechanical polishing pad.

Abstract: A grinding machine, which includes a grinding wheel rotatable by a motor, a first slide movable in X-axis direction, a second slide supported on the first slide and movable in Y-direction, a bracket supported on the second slide and turnable about Y-axis, a tool holder supported on the bracket for holding the workpiece for grinding by the grinding wheel, and a driving mechanism for rotating and reciprocating the tool holder.

Abstract: Apparatus and method for reconditioning the protective coating of a digital disc. The damaged digital disc is automatically moved between workstations by a suction member which grasps the disc at the first workstation and releases the disc at the second workstation. Each of the workstations is defined by worktools which operate on the digital disc. A feed cartridge member stores the damaged discs prior to movement of the discs into the first workstation and a receiving cartridge member stores the reconditioned discs following the final reconditioning operations at the last workstation.

Abstract: The apparatus for lapping a magnetic head slider includes a lapping plate to which a bar of the magnetic head slider makes a contact by a predetermined lapping pressure, a primary oscillating mechanism that makes a primary oscillating of the bar in a radial direction of the lapping plate, and a secondary oscillating mechanism that makes a secondary oscillating of the bar in a direction perpendicular to a direction of the primary oscillating. A coarse lapping of the bar is performed by a combined oscillating of the primary oscillating and the secondary oscillating, and upon completion of the coarse lapping, the apparatus switches to the primary oscillating to finish lapping of the bar.

Abstract: A lapping method includes a step of moving a substantially bar-shaped workpiece in a radial direction of a surface of a rotary lapping plate while simultaneously oscillating the workpiece pivotally about a central point in a longitudinal direction of the workpiece in a plane parallel to the surface of the rotary lapping plate.

Abstract: A lapping method of a magnetic head slider provided with an element-forming surface, an ABS and an MR element formed on the element-forming surface, including a step of setting the magnetic head slider to be lapped on a lapping means, and a step of lapping by the lapping means the ABS of the magnetic head slider with while keeping an angle between the element-forming surface of the magnetic head slider and a lapping direction in a range greater than 0 degrees and equal to or less than 30 degrees.

Abstract: Disclosed herein is a method including the steps of cutting a wafer to prepare a row block having a plurality of head elements arranged in a matrix, bonding a plate member to one side surface of the row block, bonding a row tool to another side surface of the row block bonded to the plate member opposite to the one side surface, and cutting the row block to prepare a row bar bonded to the row tool and having a row of the head elements. A bonding apparatus for realizing the above bonding steps is also disclosed.

Abstract: An apparatus for sharpening objects (2) comprises abrading means (6) arranged for abrading an end portion of said objects (2) and for creating tip means (2a) in said objects (2) and support means (7) connected to rotation driving means (8) and arranged for supporting said abrading means (6), said abrading means (6) being fixed to said support means (7) by magnetic coupling means (15); the projection of the longitudinal axis of each object (2) on a plane containing an active surface (10) is tangent to a circumference the center of which lies on a rotation axis (X) of said abrading means (6); moving means (33) for moving said objects (2) are provided, the moving means (33) being arranged for driving said objects (2) to interact with regions of said active surface (10); in addition, transfer means (5) rotates each object (2) around the longitudinal axis thereof and moves each object (2) along said longitudinal axis towards said abrading means (6).

Abstract: A lapping machine for lapping a row bar includes a lap plate for providing a lapping surface, a row tool having a plurality of bend cells formed by defining a plurality of slits, a pressure mechanism for pressing the row tool toward the lapping surface of the lap plate, and a bend mechanism for bending the bend cells of the row tool toward the lapping surface of the lap plate. The bend mechanism includes an air cylinder unit having a plurality of double-acting air cylinders, a plurality of racks operatively connected to the double-acting air cylinders, respectively, a plurality of drive pinions arranged coaxially and meshing with the racks, respectively, each drive pinion having a lever for driving the corresponding bend cell, a plurality of support pinions arranged coaxially and meshing with the racks, respectively, and a guide mechanism for guiding each rack, the respective drive pinion, and the respective support pinion in substantially the same plane.

Abstract: A workpiece surface processing apparatus capable of processing the surface of a workpiece without being limited as to the shape of the workpiece and further capable of measuring the state of polish of the workpiece with a high precision. The workpiece surface processing apparatus includes three platens 1-1 to 1-3 arranged substantially point symmetrically and being rotated in the same direction by motors 17 to 19, a carrier head 2 holding a wafer W and rotating in an opposite direction to the platens 1-1 to 1-3, a rocking mechanism 3 for making the wafer W rock in a diametrical direction of the platen 1-1 so that the entire surface of the wafer W is polished. A measuring device 4 continuously measures the state of polish of the entire surface of the wafer W.

Abstract: An apparatus for polishing wafers, preferably by chemical mechanical polishing. The apparatus includes a table defining a planar polishing surface adapted to contain a polishing medium and a wafer carrier assembly adapted to hold a wafer against the polishing surface. The wafer carrier assembly includes a wafer carrier and prevents rotation of the wafer carrier with respect to the polishing table even when the wafer carrier is moved in a circular or orbital path on the polishing surface. Polishing is carried out relative movement between the wafer carrier and the polishing surface in any direction within the plane of the polishing surface. The relative movement can be accomplished by moving the wafer carrier, the polishing table, or a combination of movements of the wafer carrier and polishing table.

Abstract: A method and apparatus for machining the surface of a spherical segment, the surface being either convex or concave, by a circular milling cutter mounted on a milling machine and rotatably driven about an axis of rotation. The segment is carried by a fixture journally mounted for pivoting about a pivot axis passing through the spherical center of the surface to be cut, and the axis of rotation also passes through the spherical center. The teeth of the cutter lie in a plane perpendicular to the axis of rotation which is the furthest such plane that intersects the face of the cutter so that only the cutting teeth will contact the spherical surface to be formed. The fixture is pivoted about the pivot axis and the segment moves through and is cut by the rotating teeth to form the spherical surface.

Abstract: Apparatus and method for grinding semiconductor chips and other specimens prior to microscopic examination thereof by supporting a specimen on a specimen mount, fixing the specimen mount to a lower end of a lower arm, connecting an upper end of the lower arm to a swingable arm by a horizontal pivot which permits the lower arm and specimen mount to move upwardly and downwardly relative to the swingable arm, providing a stop to limit downward movement of the specimen mount relative to the swingable arm when the lower arm reaches a zero position, moving the swingable arm downwardly to lower the specimen to engage an underlying rotatable grinding platen to define a zero position, and continuing to move the swingable arm downwardly beyond the zero position by an amount corresponding to the amount of material to be removed from a lower portion of the specimen so that the stop will prevent removal of additional material.

Abstract: A lapping method and device for lapping magnetic heads to provide an air bearing surface with improved surface quality including increased smoothness, reduced rolloff, and reduced recession. The lapping machine includes a lapping plate having a grinding surface, a linear motion mechanism for moving the ABS over the grinding surface in a first, linear direction, and a micro-advance mechanism for controllably advancing the workpiece over the grinding surface in a second direction that is preferably perpendicular. The lapping method comprises affixing the unfinished magnetic head proximate to the lapping plate and depositing an abrasive slurry on the grinding surface. An initial rough lapping stage is performed, including moving the grinding surface so that the workpiece is lapped to a first predetermined target specification.

Abstract: A method of lapping the air bearing surface of a magnetoresistive head which minimizes the likelihood of interelement shorts at the air bearing surface is described. In a final, linear lapping phase, the air bearing surface is lapped back and forth parallel to the longitudinal axis of the head elements in an oscillatory path across a stationary lapping surface. Any scratches or smears of the elements will be along the length of the elements rather than transverse to the elements. Any transverse scratches or smears occurring in earlier lapping phases will be removed during the linear lapping phase.

Abstract: A pulsed-force CMP scheme allows for the down force holding a wafer onto a pad to cycle periodically between minimum and maximum values. When the force is near its minimum value, slurry flows into the space between the wafer and the pad. When the force is near its maximum value, slurry is squeezed out allowing for the abrasive action of the pad surface to erode wafer surface features.