Abstract: A polishing head for performing chemical-mechanical polishing on a linear polisher has a dual stage wafer carrier assembly that incorporates a removable subcarrier. When in use, a main pressure chamber exerts a downforce on the subcarrier housing, while a separate secondary pressure chamber residing between the subcarrier housing and the subcarrier exerts a slightly different downforce on the subcarrier. Since the second pressure chamber exerts the downforce pressure directly on the subcarrier, the direct pressure application, as well as a more uniform distribution of pressure ensures for an improvement to the uniformity of pressure distribution. Additionally, the easily removal subcarrier allows for faster and easier removal of the subcarrier for cleaning and maintenance, as well as for changing inserts and improving process repeatability.

Abstract: A method and apparatus for supporting, cleaning and/or drying a polishing pad used for planarizing a microelectronic substrate. In one embodiment, the apparatus can include a cleaning head positioned adjacent a post-operative portion of the polishing pad to clean and/or dry the rear surface of the polishing pad. The cleaning head can include a heat source, a mechanical contact element, and/or orifices that direct fluid and/or gas toward the rear surface. The apparatus can further include a vessel through which the rear surface of the polishing pad passes to clean the rear surface. The apparatus can also include a flow passage in fluid communication with a region between the polishing pad and a support pad upon which the polishing pad rests during planarization. Gas moves through the flow passage toward or away from an interface region between the polishing pad and the support pad to draw the polishing pad toward or away from the support pad.

Abstract: A chemical mechanical polishing apparatus has a first polishing sheet movable in a first linear direction, and a second polishing sheet movable in a second linear direction. The first and second polishing sheets are positioned in a parallel and coplanar arrangement to contact a surface of a substrate during polishing.

Abstract: A polishing head for performing chemical-mechanical polishing on a linear polisher has a dual stage wafer carrier assembly that incorporates a removable subcarrier. When in use, a main pressure chamber exerts a downforce on the subcarrier housing, while a separate secondary pressure chamber residing between the subcarrier housing and the subcarrier exerts a slightly different downforce on the subcarrier. Since the second pressure chamber exerts the downforce pressure directly on the subcarrier, the direct pressure application, as well as a more uniform distribution of pressure ensures for an improvement to the uniformity of pressure distribution. Additionally, the easily removal subcarrier allows for faster and easier removal of the subcarrier for cleaning and maintenance, as well as for changing inserts and improving process repeatability.

Abstract: A temperature compensating unit is coupled to a linearly moving belt of a polisher for adjusting the temperature of the belt, which temperature is measured by a sensor situated proximal to the belt.

Abstract: A belt polishing machine has a moving endless abrasive coated polishing belt that wraps around and travels over a substantial portion of a circumferential surface of a rotatable workpiece for finishing the surface. A drive pulley drives the polishing belt in a continuous path at a desired surface speed over the circumferential surface of the workpiece while the workpiece is being rotated at a desired rotational speed. Guide pulleys direct the polishing belt around and into engagement with a substantial portion of the circumferential surface and may supply tension to the polishing belt during finishing operations. Separate tensioning pulleys may be provided. A coolant feed applies coolant against the polishing belt for separating and carrying away removed material from the belt and cleaning the abrasive for a subsequent pass. A backup shoe may be provided to selectively apply additional pressure through the belt upon portions of the polished surfaces to improve cylindricity.

Abstract: An apparatus for repositioning and forming a power transmission belt. The apparatus has first and second hangers for supporting a plurality of power transmission belts and movable selectively between active and inactive positions. Each of the first and second hangers has a storage portion and a standby portion. At least one shifting mechanism is operable to move a power transmission belt from the storage portion to the standby portion on each of the first and second hangers. A first belt running unit has a first pulley around which a power transmission belt can be placed. The first belt running unit is movable selectively between a processing position and an attaching/detaching position. A second belt running unit has a second pulley around which a power transmission belt can be placed. The second belt running unit is movable selectively between a processing position and an attaching/detaching position.

Abstract: A continuous pad feeding method for chemical-mechanical polishing (CMP) is described, which method is suitable for use in a CMP apparatus. The CMP apparatus includes a first polishing belt having two terminals, which first polishing belt serves as a plurality of polishing pads. A second polishing belt having two terminals is provided on the first polishing belt. One of the terminals of the second polishing belt is adhered to one of the terminals of the first polishing belt.

Abstract: Polishing pads used in the manufacturing of microelectronic devices, and apparatuses and methods for making and using such polishing pads. In one aspect of the invention, a polishing pad for planarizing microelectronic-device substrate assemblies has a backing member including a first surface and a second surface, a plurality of pattern elements distributed over the first surface of the backing member, and a hard cover layer over the pattern elements. The pattern elements define a plurality of contour surfaces projecting away from the first surface of the backing member. The cover layer at least substantially conforms to the contour surfaces of the pattern elements to form a plurality of hard nodules projecting away from the first surface of the backing member. The hard nodules define abrasive elements to contact and abrade material from a microelectronic-device substrate assembly. As such, the cover layer defines at least a portion of a planarizing surface of the polishing pad.

Abstract: A method and apparatus for mechanically and/or chemical-mechanically planarizing and cleaning microelectronic substrates. In one embodiment, a processing medium for planarizing and finishing a microelectronic substrate has a planarizing section with a first body composed of a first material and a finishing section with a second body composed of a second material. The first body may have a relatively firm planarizing surface to engage the substrate, and the first body supports abrasive particles at the planarizing surface to remove material from the substrate during a planarizing cycle. The second body may have a relatively soft buffing or finishing surface clean the abrasive particles and other matter from the substrate during a finishing cycle. The planarizing and finishing sections may be fixedly attached to a backing film, or they may be attached to one another along abutting edges with or without the backing film.

Abstract: A technique for utilizing a sensor to monitor fluid pressure from a fluid bearing located under a polishing pad to detect a polishing end point. A sensor is located at the leading edge of a fluid bearing of a linear polisher, which is utilized to perform chemical-mechanical polishing on a semiconductor wafer. The sensor monitors the fluid pressure to detect a change in the fluid pressure during polishing, which change corresponds to a change in the shear force when the polishing transitions from one material layer to the next.

Abstract: An apparatus and a method for shaping a rotationally-symmetrical surface in a material, where the material is rotated about an axis and a rotating element is placed in contact with the rotating material. The rotating element is provided with a symmetrical, coherent shaping edge, or is provided with such an edge at one end, or as an alternative, is a shaping head which travels around a symmetrical, coherent contour. The axis of rotation of the rotating element is then placed at an angle to the axis of rotation of the material and, during shaping, a force is exerted on the rotating element such that the shaping edge or the shaping head is held in contact with the material and such that the lateral position of the shaping edge or the contour around which the rotating element travels in operation remains approximately constant with respect to the material. The shaping edge/contour has an acircular shape and the orientation thereof is kept approximately constant with respect to the material during shaping.

Abstract: Apparatus for removing random scratches formed during the polishing of magnetic recording media, and for disposing on the surface of the media a near-circumferential texture which increases the recording reliability of the media while simultaneously reducing its failure rate. The present invention teaches the application of a low unit load force to a pad and polishing tape combination in contact with a rotating and oscillating disk surface to completely remove the random scratches previously formed by a polishing step. The apparatus facilitates the application of a specially designed, extremely fine alumina slurry composition without producing similar size circumferential scratches at the high surface speeds.

Abstract: A shaft polishing method includes a roughing step in which the length of fresh abrasive tape is pressed against an area, such as a hydraulic seal area, for selected time intervals while the shaft is rotated at a relatively low speed. A roughing step is followed by the finishing step, during which the shaft is rotated at a relatively high speed and the abrasive tape is pressed thereagainst for different time intervals. The resulting shaft area which has been thus polished is free of spiraling tool marks and spiraling marks left by grinding tools, which marks can provide paths through which hydraulic fluid may leak.

Abstract: A chemical mechanical polishing apparatus has a platen, a polishing sheet extending between a first roller and a second roller, and a support sheet extending between a third roller and a fourth roller. A portion of the polishing sheet extends over a surface of the platen to polish a substrate, and a portion of the support sheet extends between the platen and the polishing sheet. The polishing sheet may be a continuous belt or a reel-to-reel tape, and the support sheet may be a continuous belt or reel-to-reel tape.

Abstract: Method for removing random scratches formed during the polishing of magnetic recording media, and for disposing on the surface of the media a near-circumferential texture which increases the recording reliability of the media while simultaneously reducing its failure rate. The present invention teaches the application of a low unit load force to a large surface pad and polishing tape combination while in contact with a rotating disk surface that is also moving in a circumferential direction to completely remove the random scratches previously formed by a polishing step. The scratches are removed with the aid of a specially designed, extremely fine alumina slurry composition which prevent producing similar size circumferential scratches at the high surface speeds. The methodology provides for a smoother disk surface than prior known super-polish/texture methodologies.

Abstract: A polishing tool uses a seal cavity containing a fluid that supports polishing pads against an object being polished. The boundaries of the cavity include a support structure, a portion of a polishing material, and a seal between the support structure and the polishing material. The polishing material moves relative to the support structure and seal. A variety of seal configurations can maintain the fluid within the cavity. In one embodiment the seal mechanism is a labyrinth seal including multiple ridges. In one embodiment, the seal mechanism is a face-sealing seal which includes a jacket with a u-shaped cross section with a compressible element positioned within it. The face-sealing seal is in a groove positioned outside of the cavity. Alternatively, the face-sealing seal forms the outer edge of the cavity. In a further embodiment, the seal is an o-ring seal positioned within a double dove-tailed groove.

Abstract: An apparatus for finishing a surface of a camshaft extending along an axis with the surface offset from the axis has a drive for rotating the camshaft about the axis, a support displaceable radially of the axis, and a plurality of pusher heads on the support. The heads are movable independently of each other toward and away from the camshaft relative to the support along respective angularly offset pusher axes extending radially of the camshaft. All the pusher heads are biased along the respective pusher axes toward the camshaft axis with substantially the same force.

Abstract: A polishing system such as a chemical mechanical belt polisher includes a hydrostatic fluid bearing that supports polishing pads and incorporates one or more of the following novel aspects. One aspect uses compliant surfaces surrounding fluid inlets in an array of inlets to extend areas of elevated support pressure around the inlets. Another aspect modulates or reverses fluid flow in the bearing to reduce deviations in the time averaged support pressure and to induce vibrations in the polishing pads to improve polishing performance. Another aspect provides a hydrostatic bearing with a cavity having a lateral extent greater than that of an object being polished. The depth and bottom contour of cavity can be adjusted to provide nearly uniform support pressure across an area that is surrounded by a retaining ring support. Changing fluid pressure to the retaining ring support adjusts the fluid film thickness of the bearing.

Abstract: A device for finishing cylindrical workpieces is described, having an arrangement for rotating the workpiece, two retaining arms, each having a support and a pressure cheek received in it, wherein at least one pressure cheek is floatingly seated on the associated support, and the pressure cheeks at least partially envelop the workpiece, a grinding belt, and belt guidance means guiding the grinding belt in such a way that it at least partially envelops the workpiece and is pressed against the workpiece by the pressure cheeks, as well as an arrangement which puts the retaining arms into a back-and-forth movement parallel with the axis of rotation (A) of the workpiece. Here, either the support or the pressure cheek have a lining of a plastic material, which slightly extends in a T-shape past the lateral walls of the quick-change adapter, and which can at least slightly be compressed elastically.

Abstract: A surface polishing method comprises allowing a holder to hold a flat sheet-like workpiece, placing a pad tape in a location opposite to the holder, the pad tape consisting of a tape substrate and grains bonded to the substrate surface, supplying free grains between the holder and the pad tape, and rotating the holder and/or a mechanism holding the tape, thereby causing the free grains to polish the workpiece. An apparatus for practicing the method comprises a holder capable of holding a flat sheet-like workpiece, a tape holding mechanism located opposite to the surface of the workpiece and carrying a pad tape which consists of a tape substrate and grains bonded to the substrate, a rotary mechanism for rotating the holder and/or the tape holding mechanism, and an abrasive supplying mechanism for supplying free grains between the surface of the workpiece and the pad tape.

Abstract: A polishing system such as a chemical mechanical belt polisher includes a hydrostatic fluid bearing that supports polishing pads and incorporates one or more of the following novel aspects. One aspect uses compliant surfaces surrounding fluid inlets in an array of inlets to extend areas of elevated support pressure around the inlets. Another aspect modulates or reverses fluid flow in the bearing to reduce deviations in the time averaged support pressure and to induce vibrations in the polishing pads to improve polishing performance. Another aspect provides a hydrostatic bearing with a cavity having a lateral extent greater than that of an object being polished. The depth and bottom contour of cavity can be adjusted to provide nearly uniform support pressure across an area that is surrounded by a retaining ring support. Changing fluid pressure to the retaining ring support adjusts the fluid film thickness of the bearing.

Abstract: A wafer polisher head drive includes a head drive housing; a head portion extending from the housing for mounting an unpolished wafer when the head drive housing and head portion are in a horizontal orientation; a pivot mechanism extending from the head drive housing for pivoting the head drive housing and the head portion from the horizontal orientation to a vertical orientation juxtaposed to a transverse vertical portion of a continuous rotating polishing belt; a drive in the housing for moving the head portion and a mounted wafer outwardly from the housing against the transverse vertical portion of the rotating polishing belt; and a drive in the housing for rotating the head portion and the mounted wafer. The head drive housing may be pivoted from the vertical orientation in a sweeping arc extending perpendicularly from the belt transverse vertical portion or in a swinging arc extending parallel from the belt transverse vertical portion.

Abstract: A machine for machining internal surfaces of axisymmetric workpieces with an abrasive strip. The machine includes a roller for pressing the abrasive strip against a surface of the workpiece that is to be machined. The workpiece rotates about an axis, and the roller rotates about an axis parallel to the axis of the workpiece. The machine also includes a pulley positioned on either side of the roller, for guiding the abrasive strip to the roller and holding the abrasive strip in position relative to the roller. The abrasive is driven continuously over the roller during machining, to renew the abrasive where the roller presses the abrasive strip against the surface of the workpiece. The roller and pulleys can be moved oointo, out of, and within a workpiece.

Abstract: This invention relates to a flexible membrane polishing belt against which a substrate, for example a semiconductor wafer, is polished using chemical mechanical polishing principles. A fluidized layer is provided on a surface of a polishing member backing assembly which urges the moving polishing membrane toward the substrate held in a polishing head to be polished. The linear motion of the belt provides uniform polishing across the full width of the belt and provides the opportunity for a chemical mechanical polishing to take place. Several configurations are disclosed. They include belts which are wider than the substrate being polished, belts which cross the substrate being polished, but which provide relative motion between the substrate and the polishing belt, and polishing belt carriers having localized polishing areas which are smaller than the total area of the substrate to be polished.

Abstract: A sizing and finishing machine includes a mechanism for rotating an associated workpiece and a first microfinishing belt for selectively contacting the associated workpiece. The belt has a maximum grit size of 60 microns. A structure is provided for rotatably holding the first microfinishing belt and a housing is provided on which the structure is mounted. A mechanism moves the first housing and hence the first microfinishing belt toward and away from the associated workpiece. The mechanism is timed to the rotation of the associated workpiece to maintain a substantially constant pressure of the first microfinishing belt on the associated workpiece. If desired, a second microfinishing belt mounted separately on a second housing can be provided with the two housings and their respective belts being separately controlled. The force exerted by the microfinishing belt on the associated workpiece is limited to a pressure of less than approximately 25 psi.

Abstract: An in-situ sensor measures polishing pads during chemical mechanical polishing. From the measurements, polishing pads can be identified as worn out or unevenly worn and replaced. Scheduling maintenance according to current measurements, rather than according to statistical predictions, minimizes down time for maintenance and still prevents use of worn out or unevenly worn polishing pads. Alternatively, a tool is reconfigured according to the polishing pad measurements. Reconfiguring the tool can prolong pad life and improve polishing performance. One embodiment of the invention includes a non-contact sensor such as a laser sensor that directs an incident beam at a target area and determines a distance to a reflection point by triangulation of incident and reflected beams. As polishing pads wear, distances to the reflection points increase. Movement of the polishing pads and the sensor during polishing causes the in-situ sensor to measure portions of the polishing pads that are along a zigzag trajectory.

Abstract: A method for polishing or texturing a magnetic disc, comprises bringing a tape traveled in a predetermined direction and made of fibers having a fineness of not more than 0.1 denier, and a slurry containing polishing grains dispersed therein, into contact with a substrate of the magnetic disc. Such method has an extremely low surface roughness (Ra) and an extremely low maximum projection height (Rp) with an excellent high accuracy, thereby efficiently producing a magnetic recording medium which is free from head crash and errors upon reading and writing of information.

Abstract: An apparatus for variably texturing a first surface of a rigid-disk substrate having an annular inner recording head-landing zone and an annular outer data zone surrounding the head-landing zone is characterized by a stepped force-exerting cylindrical stepped roller which forces a movable tape having an abrasive containing slurry on its surface to variably texture the zones of the surface of the substrate. A method of variably texturing a surface of a rigid-disc substrate includes the steps of providing a movable abrasive-containing tape between the stepped cylindrical roller and disk substrate to force the tape against the substrate with greater pressure on a head landing zone than on a data zone.

Abstract: A technique for controlling a polishing rate across a substrate surface when performing CMP, in order to obtain uniform polishing of the substrate surface. A support housing which underlies a polishing pad includes a plurality of openings for dispensing a pressurized fluid. The openings are arranged into a pre-configured pattern for dispensing the fluid to the underside of the pad opposite the substrate surface being polished. The openings are configured into a number of groupings, in which a separate channel is used for each grouping so that fluid pressure for each group of openings can be separately and independently controlled.

Abstract: A method of automatically polishing a semiconductor wafer having a substrate and a surface film. A wafer mounting device, which may include a vacuum chuck, holds the semiconductor wafer without requiring that the wafer have a central aperture. The mounting device and wafer are moved with an orbit-within-an-orbit motion while a tape transport mechanism applies an abrasive polishing tape to the surface film of the moving wafer to polish one surface of the wafer to a flatness of less than two microns. The polishing tape passes arcuately around a roller and passes between the roller and the surface film and contacts the surface film in a line running across the width of the tape. The system determines the thickness of the wafer surface film during the polishing process with a real time measurement device such as an effipsometer, or by determining a work-performed factor and calculating an estimated film thickness from the work-performed factor.

Abstract: A collet system for mounting, holding, and rotating a rigid disk is described, the collet system including a collet and an expander, the collet having a base portion and fingers longitudinally extending therefrom, the fingers forming a disk contact ring opposite the base. The disk contact ring is less than the thickness of the disk to allow for full surface texturization of the disk. The disk contact ring is not coplanar with any locus of expansion contact points between the collet fingers and the expander, and is sufficiently distant therefrom such that the outward force exerted on the inner disk surface is determined by a cantilever spring deflection experienced by the fingers. This ensures substantially uniform and repeatable outward forces on the inner surface of the disk regardless of minor surface variations along the locus of expansion contact points.

Abstract: A grinding machine utilizing multiple, parallel, endless, abrasive belts for simultaneously grinding several surfaces on a workpiece, such as cam lobes on a cam shaft. The grinding machine includes a contouring head assembly comprising a plurality of contour feed units, each contour unit including a curved back-up shoe, a back-up shoe holder, an adaptor for mounting the shoe holder, and a ball-spline mechanism is secured to the adaptor for transmitting power from a drive motor to the back-up shoe to press an abrasive belt, associated with the back-up shoe against a workpiece. A locating lip is defined on each adaptor, and a reference pad is established on the contouring head assembly.The adapters are divided into an upper and lower row, and the locating lips are formed oversized. One row of lips is ground to a desired distance from the reference pad, and the other row of lips is then ground relative to the previously ground row of locating lips.

Abstract: An improved chemical mechanical polishing (CMP) device for chemically and mechanically planarizing the surface of a semiconductor wafer includes a flat wafer stage for loading and affixation of the semiconductor wafer so that the surface of a material to be polished, i.e. the surface of the wafer, faces up, and a cylindrical polishing pad formed above the exposed surface of the wafer to be polished which is rotatable at high speed so that the contact point of the wafer and the pad moves linearly. The stage is constructed to support a wafer by a vacuum suction through vacuum holes. The cylindrical polishing pad has a rotating axis for transmitting rotation at the center, thereof, and a double layer polishing pad having different hardness on a peripheral surface of the rotating axis.

Abstract: An apparatus to sand the outer surface of a cylindrical drum shell, the shell defining a first longitudinal axis, and comprising a frame; first structure on the frame to position and rotate the drum about the axis; first structure on the frame, including a belt, for engaging and treating the drum surface during drum rotation; and second structure on the frame to effect pressural engagement of the rotating drum surface with the belt.

Abstract: A platen ring for use with a platen on a linear polisher, in which the platen ring is used to reduce fluctuation of the belt/pad assembly as it encounters the platen. The platen ring is disposed around the platen so that a fluctuation of the belt/pad assembly is dampened before the belt/pad assembly engages the platen. Reduction of the belt/pad fluctuation ensures a reduction in the within-wafer non-uniformity and provides for a more uniform polishing rate across the surface of the wafer.

Abstract: An abrasive tape having an abrasive layer primarily containing abrasive grains and a binder and formed on a flexible substrate and a member to be cleaned are fed in substantially opposite directions with the abrasive layer and a surface of the member kept in contact with each other with the ratio of the feed rate of the member to the feed rate of the abrasive tape kept not higher than 1/1.

Abstract: A grinding machine utilizing multiple, parallel, endless, abrasive belts for simultaneously grinding several surfaces on a workpiece, such as cam lobes on a cam shaft. The grinding machine includes a contouring head assembly comprising a plurality of contour feed units, each contour unit including a curved back-up shoe, a back-up shoe holder, an adaptor for mounting the shoe holder, and a ball-spline mechanism secured to the adaptor for transmitting power from a drive motor to the back-up shoe to press an abrasive belt, associated with the back-up shoe against a workpiece. A locating lip is defined on each adaptor, and a reference pad is established on the contouring head assembly.

Abstract: A wafer polisher and method for the chemical mechanical planarization of semiconductor wafers. The polisher includes a wafer holder for supporting the semiconductor wafer and a linear polishing assembly having a polishing member positioned to engage the surface of the wafer. The polishing member is movable in a linear direction relative to the wafer surface to uniformly polish the surface of the wafer. A pivotal alignment device may be used to pivotally support one of the wafer holder and the polishing member relative to the other of the wafer holder and the polishing member with the surface of the wafer and the polishing member retained in parallel alignment during operation of the polisher. The polisher optionally includes a conditioning station for conditioning the polishing member.

Abstract: A ceramic tile and masonry power saw is disclosed. The saw has an electric motor and drives the circular diamond saw through a drive belt positioned immediately adjacent to the saw to minimize bending moments and stress. A pivoting cutting table has pinch rollers on one side that clamp to the frame of the saw. When the cutting table is pivoted away, there is enough clearance for side removal of the tray used to catch coolant and sawdust, located underneath the cutting table. A bearing housing that supports the spinning shaft on which the saw blade is mounted has a tapered shape that fits into a tapered opening in the cutting head assembly, which assembly overlies the cutting table and positions the saw blade just above the table.

Abstract: Tooling for applying an abrasive belt on a machine for abrasive belt machining of cylindrical bearing surfaces comprises, for each bearing surface to be machined, an arm and three abrasive belt application shoes a first of which is mounted in a top median position on the arm and the other two of which are mounted in a bottom lateral position on two jaws articulated to the arm and coupled together in such manner that they can be clamped together. The arm carries a first shoe having a concave abrasive belt application surface subtending an angle greater than 90.degree. and less than 180.degree. and a gauge with two opposed and horizontally aligned sensors and each jaw carries a second shoe having a concave abrasive belt application surface subtending an angle slightly less than 90.degree. whereby when clamped around the bearing surface to be machined the three shoes together envelope the bearing surface to be machined over an angle of at least 270.degree.

Abstract: The present invention relates to a method of texturing a rigid disk for magnetic media applications, using a coated abrasive article comprising a backing having at least two regions of abrasive coating bonded to one side of the backing. The at least two regions of abrasive coating have different abrasive natures.

Abstract: A system and method for chemically and mechanically polishing a semiconductor wafer having a substrate and a surface film. A wafer mounting device, which may include a vacuum chuck, holds the semiconductor wafer without requiring that the wafer have a central aperture. The mounting device and wafer are moved with an orbit-within-an-orbit motion while a tape transport mechanism applies an abrasive polishing tape to the surface film of the moving wafer to polish one surface of the wafer to a flatness of less than two microns. The system determines the thickness of the wafer surface film during the polishing process with a real time measurement device such as an ellipsometer, or by determining a work-performed factor and calculating an estimated film thickness from the work-performed factor. Finally, the system automatically controls the polishing process to stop polishing the semiconductor wafer when the wafer surface film achieves a predefined planarization.

Abstract: A work drive orienting system for a machine tool, such as a multiple belt grinder, comprises a head stock and a tail stock for supporting the workpiece to be machined, a locator retained by a spider in the head stock chuck, and a proximity sensor located in the loader operatively associated with the machine tool. The workpiece has journals at opposite ends, and spaced eccentric portions, such as cam lobes; also, a locating pin projects axially from one end of the workpiece. The locating pin has a predetermined angular relationship to the spaced eccentric portions of the workpiece.The locating pin must pass alongside the locator, which has a cylindrical body with a projecting tab, before power is supplied to the head stock and/or tail stock to drive same. A proximity sensor, located in the loader, scans an approximately 70.degree. arc on the workpiece, for the presence of eccentric surfaces, such as cam lobes.

Abstract: A semi-conductor wafer polishing machine having a polishing pad assembly and a wafer holder includes a support positioned adjacent the polishing pad assembly. This support has at least one fluid inlet connectable to a source of fluid at a higher pressure, at least one fluid outlet connectable to a fluid drain at a lower pressure, and at least one bearing surface over which fluid flows from the source to the drain. The polishing pad is supported by the fluid over the bearing surface for low-friction movement with respect to the support. Similar fluid bearings can be used in the wafer holder. An array of generally parallel grooves is provided on a belt support surface to reduce hydroplaning of a polishing belt. A turbine drive system rotates a wafer chuck in a wafer holder.

Abstract: Method for texturing a surface of a metallic thin film of a magnetic disk substrate comprising the steps of: (a) frictionally contacting the surface of the metallic thin film with an abrasive article, wherein the abrasive article comprises an abrasive coating including a water-soluble binder and abrasive particles, wherein the abrasive coating is adhesively attached to a flexible foraminous fibrous backing; and (b) abrading the surface of the metallic thin film by moving the metallic thin film and the abrasive article relative to one another with the abrasive coating in contact with an aqueous liquid solution to form scratches in the surface of the metallic thin film, wherein the liquid solution is free of abrasive particles before contact is initiated with the abrasive coating.

Abstract: A polishing pad cluster for polishing a semiconductor wafer having multiple integrated circuit dies includes a pad support and multiple polishing pads. Each pad has a polishing area substantially smaller than the wafer but not substantially smaller than an individual one of the integrated circuit dies. Each polishing pad is mounted to a respective polishing pad mount, which is in turn supported by the support. Each mount includes a respective joint having at least two degrees of freedom to allow the associated polishing pad to articulate with respect to the support to conform to the wafer. Each mount is substantially rigid in a direction perpendicular to the pad toward the pad support, and in some cases the adjacent mounts are completely isolated from one another. A magnet is used to bias the polishing pad against the wafer.

Abstract: A collet system for mounting, holding, and rotating a rigid disk substrate is described, the collet system including a collet and an expander, the collet having a base portion and fingers longitudinally extending therefrom. The inner surface of the disk is clamped by the radially expanding fingers at a location which is not coplanar with any locus of expansion contact points between the collet fingers and the expander. The outward radial force exerted on the inner disk surface is thereby determined by a cantilever spring tension experienced by the fingers, thus producing a highly consistent, repeatable force which is robust against small frictional variations in the environment and against small variations in inner diameters among disks. Inward axial movement of the expander into the collet is abuttably stopped at a predetermined offset for increased robustness, tolerance, and repeatability of results.

Abstract: A device for grinding a cylinder surface is provided, the cylinder being one of at least three substantially parallel, axially offset cylinders. The device includes a central body member and at least three supporting elements, each of the supporting elements being associated with a corresponding one of the cylinders, the supporting elements supporting the central body member relative to the cylinders. One or more belt grinder assemblies are provided, each belt grinder assembly including a belt grinder and a device for mounting the belt grinder on the central body member. Each belt grinder includes a contact wheel, an abrasive belt, extending around the contact wheel, and a device for supporting the contact wheel relative to a one of the cylinders to be ground. The supporting device includes a device for adjusting a position of the contact wheel relative to the one of the cylinders to be ground.

Abstract: A tapered bearing for the drive drum assembly of a belt grinding machine that employs multiple, parallel, abrasive grinding belts, and back-up shoes for pressing the belts against the surfaces on a workpiece to be ground. The drive drum assembly, in cooperation with small pulleys operatively associated with the contouring head, keeps the abrasive belts properly trained. The central shaft of the drive drum assembly, which has a plurality of large pulleys and spacers positioned therealong, is secured between a fixed bearing support and a laterally movable support bracket. A tapered bearing is fastened to one end of the central shaft, and a complementary shaped aperture is defined in a spindle retained in the movable support bracket. When the movable support bracket is shifted inwardly, by the hydraulic circuitry of the grinding machine, the tapered bearing fits snugly into the aperture so that the drive drum assembly is supported in a rigid, sag-free manner.